JP2008193564A - Solid-state image pickup device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state image pickup device in which a solid-state imaging device and a prism are joined, which is suppressed in deterioration in the precision of registration while satisfying optical performance and mechanical performance. <P>SOLUTION: The solid-state image pickup device has a first area in which the joined surface of the solid-state imaging device or the joined surface of the prism has first surface roughness and a second area in which the joined surface has second surface roughness larger than the first surface roughness and has joint structure in which the solid-state imaging device and the prism are joined by an adhesive layer arranged in the second area. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a solid-state imaging device in which a prism and a solid-state imaging element used in an imaging apparatus typified by a television camera, a video camera, and the like including the solid-state imaging element.

  In recent years, a three-plate color camera (hereinafter referred to as a three-plate camera) has been developed and widely used as an imaging apparatus using three solid-state imaging devices. The structure of such a conventional three-panel camera will be described with reference to the drawings.

  FIG. 1 is a schematic cross-sectional view of an imaging block (solid-state imaging device) 10 in a conventional three-plate camera. As shown in FIG. 1, the imaging block 10 includes a color separation prism that separates light incident through an imaging lens (not shown) in a three-plate camera into predetermined color components, a plurality of solid-state imaging devices, And an image sensor substrate on which a solid-state image sensor is mounted.

  As shown in FIG. 1, the color separation prism is composed of three prism members 1r, 1g, and 1b joined together with an adhesive, and is a three-color separation prism 1 that separates incident light into three color components. is there. The prism members 1r and 1b are bonded to each other by an adhesive disposed in the bonding portion 5 having the function of the dichroic mirror, and similarly, the prism members 1r and 1g are bonded to the bonding portion 4 having the function of the dichroic mirror. They are joined together by an agent. In addition, solid imaging elements 2r, 2g, and 2b are individually fixed to the light emission surfaces of the three prism members 1r, 1g, and 1b via an adhesive.

  Here, FIG. 2 shows a partially exploded schematic diagram of the imaging block 10 of FIG. As shown in FIG. 2, for example, the joint surface 11 which is the light receiving side surface of the solid-state imaging device 2r, the element side joint surface 12 of the prism member 1r, the prism side joint surface 13 of the prism member 1r, and the prism side of the prism member 1b. The joining surfaces 14 are each formed with a single surface roughness, and a single adhesive (not shown) is disposed on the entire joining surfaces 11, 12, 13, 14. Each joint surface is joined via. The other joint surfaces are similarly joined via an adhesive.

  As such an adhesive, for example, a UV adhesive (ultraviolet curable adhesive) is used, and the position of each solid-state imaging device 2r, 2g, 2b in a state where the adhesive is applied to each joint surface. After performing the adjustment (6-axis position adjustment), a method is widely used in which the adhesive is cured by irradiating ultraviolet rays and the bonding surfaces are fixed.

  In the imaging block 10 having such a structure, as shown in FIG. 1, the light beam 7 incident on the three-color separation prism 1 is divided into three color components, that is, by the joints 4 and 5 having the function of a dichroic mirror. The light is separated into light beams 6a, 6b, and 6c of the three primary colors, and is received by the respective solid-state imaging devices 2r, 2g, and 2b. The luminous fluxes 6a and 6b among the luminous fluxes separated and reflected by the joints 4 and 5 into the three primary colors are totally reflected again in the respective prism members 1g and 1b, so that they are not inverted images (mirror images). It is received by the solid-state imaging devices 2g and 2b as a light beam that forms an image. The respective light fluxes received by the respective solid-state image pickup devices 2g, 2b, and 2r are processed as image pickup signals by the respective image pickup device substrates 3r, 3g, and 3b, and are color television signals obtained by combining the image pickup signals. Is obtained.

  In such a conventional three-plate camera, it is necessary to accurately superimpose three color subject images. If the overlay accuracy, that is, the registration accuracy is poor, color misregistration and moire false signals are generated, and the image quality is slightly degraded. Accordingly, it is necessary to position each solid-state imaging device 2r, 2g, 2b with high accuracy so that the registration accuracy does not deteriorate.

  In addition, if the solid-state image sensor is used in a high-temperature environment, problems such as image quality degradation and life shortening due to white scratches, and registration accuracy degradation due to creep deformation of the adhesive disposed at the joint will occur. It is necessary to use the image sensor at a predetermined temperature or lower.

  For example, in a conventional imaging device, various heat dissipation structures for efficiently cooling a solid-state image sensor have been proposed (see, for example, Patent Documents 1, 2, and 3), and such a heat dissipation structure is adopted. As a result, the heat generated in each solid-state image sensor can be released through each thermoelectric cooling element or heat radiating member, so that the temperature of the solid-state image sensor is reduced and creep deformation can be reduced.

JP-A-1-295575 JP 2002-247594 A JP 2001-30569 A

  In recent years, in order to position each solid-state imaging device in such a three-plate camera, accuracy of the order of μm is being required. For example, the positioning of each solid-state imaging device 2r, 2g, 2b is required to have an accuracy of several tens of μm because of the depth of focus in the optical axis direction, and is in the order of μm in the subject image plane direction. It is strongly desired to suppress creep deformation.

  Furthermore, with regard to image pickup devices equipped with solid-state image sensors, the ambient temperature of the solid-state image sensor (internal temperature of the device housing) tends to increase more and more with the increase in power consumption due to lightness, shortness, multifunction and high functionality. It is in. Therefore, there is a need for means for suppressing creep deformation of an adhesive that joins a solid-state imaging device or a prism member.

  In the conventional heat dissipating structures of Patent Documents 1, 2, and 3, even though the heat generated in the solid-state image sensor can be removed, no measures are taken with respect to the environmental atmosphere temperature. This has not led to a drastic solution of suppressing the above-mentioned problem, and it is impossible to solve a decrease in registration accuracy due to a positional shift of a joint portion of a prism member and a solid-state image sensor over time.

  In addition, the adhesive used to join the solid-state imaging devices 2r, 2g, and 2b to the prism members 1r, 1g, and 1b and the prism members 1r, 1g, and 1b is bonded between the joining surfaces by the adhesive. Since the light flux needs to pass through the formed adhesive layer, it is necessary to satisfy optical characteristics such as light loss. At the same time, it is necessary to select an adhesive in consideration of the balance of mechanical strength characteristics such as creep.

  However, the UV adhesive generally used as an adhesive has a high temperature creep characteristic (characteristic of creeping when a load is continuously applied in a high temperature environment), and therefore, particularly the ambient temperature of the solid-state imaging devices 2r, 2g, and 2b. When the (device housing internal temperature) becomes high, the load caused by the spring back due to the thermal expansion or thermal contraction of the members fixed to the solid-state imaging devices 2r, 2g, 2b such as the heat radiating member may become a serious problem. is there.

  Accordingly, an object of the present invention is to solve the above-mentioned problem, and in a solid-state imaging device in which a solid-state imaging device and a prism are joined, the registration accuracy is reduced while satisfying optical performance and mechanical performance. An object of the present invention is to provide a solid-state imaging device that can be suppressed.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, in the solid-state imaging device in which the solid-state imaging element and the prism are bonded via the adhesive layer,
A first region in which the joint surface of the solid-state imaging device or the joint surface of the prism has a first surface roughness, and a second region having a second surface roughness larger than the first surface roughness. And a solid-state imaging device, wherein the solid-state imaging element and the prism are joined by the adhesive layer disposed in the second region.

  According to the second aspect of the present invention, the first region is disposed including a passage region of the light beam incident on the solid-state imaging device, and the second region is disposed around the passage region of the light beam. A solid-state imaging device according to the first aspect is provided.

  According to the third aspect of the present invention, the adhesive layer is also disposed in the first region, and the thickness of the adhesive layer in the second region is larger than the thickness of the adhesive layer in the first region. A solid-state imaging device according to the first aspect or the second aspect is provided.

  According to the fourth aspect of the present invention, the adhesive layer formed by an adhesive different from the adhesive forming the adhesive layer disposed in the second region is disposed in the first region. Alternatively, a solid-state imaging device according to the second aspect is provided.

  According to a fifth aspect of the present invention, there is provided the solid-state imaging device according to the fourth aspect, wherein each of the adhesives has different mechanical characteristics or optical characteristics.

According to the sixth aspect of the present invention, the prism has a structure in which a plurality of prism members are joined,
The joint surface of each of the prism members includes a third region having a third surface roughness and a fourth region having a fourth surface roughness larger than the third surface roughness, The solid-state imaging device according to the first aspect, in which each of the prism members is bonded by an adhesive layer disposed in four regions.

  According to the present invention, in the solid-state imaging device in which the solid-state imaging device and the prism are bonded via the adhesive layer, the second surface larger than the first surface roughness is formed on the bonding surface of the solid-state imaging device or the bonding surface of the prism. Since the second region having roughness is disposed, and the structure in which the solid-state imaging device and the prism are joined by the adhesive layer disposed in the second region is employed, the respective regions in the second region are By increasing the volume per unit area between the bonding surfaces as compared with the first region, it is possible to realize strong bonding with the adhesive. In addition, by including in the first region a passage region for a light beam incident on the solid-state imaging device and arranging the second region around the first region, a mechanical bonding strength can be obtained without impairing optical performance. be able to. Further, by selectively disposing an adhesive having different mechanical characteristics or optical characteristics in the first area and the second area, a relative positional deviation between the solid-state imaging device and the prism can be obtained. It is possible to suppress a decrease in registration accuracy due to the above.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

(First embodiment)
FIG. 3 is a schematic perspective view of the imaging block 20 in the three-plate camera which is an example of the solid-state imaging device in which the solid-state imaging device and the prism according to the first embodiment of the present invention are joined. In addition, since the external structure in the assembled state of the imaging block 20 is a structure similar to the imaging block 10 shown in FIG. 1, the same referential mark is attached | subjected to the same structural member and the description is abbreviate | omitted.

  As shown in FIG. 3, the imaging block 20 of the first embodiment includes a solid-state imaging device 2r, each of which is connected to a three-color separation prism 1 in which three prism members 1r, 1g, and 1b are bonded via an adhesive. 2g and 2b have a structure joined via an adhesive. The imaging block 20 shown in FIG. 3 is different from the imaging block 10 in FIG. 1 in the joining structure between members, for example, the joining structure of the prism members 1r, 1g, and 1b and the solid-state imaging devices 2r, 2g, and 2b. It is different as will be described later.

  Further, as shown in FIG. 4, the imaging block 20 employs a heat dissipation structure that effectively dissipates heat generated in the respective solid-state imaging devices 2r, 2g, and 2b. Specifically, as shown in FIG. 4, the three first ends of the foil-like heat radiation sheet 8 formed of a high thermal conductivity material are fixed to the back surfaces of the respective solid-state imaging devices 2r, 2g, and 2b. The second end, which is an end different from the three first ends, is fixed to a lens barrel case (not shown) formed of ABS resin or the like by screwing or the like. The heat in each solid-state imaging device 2r, 2g, 2b is transmitted to the lens barrel case through the heat dissipation sheet 8 so as to go from the first end to the second end, and as a result, each solid-state imaging device 2r. The temperature of 2g, 2b is effectively reduced. In addition, the heat radiating sheet 8 is formed with a thickness of, for example, 0.1 mm or less as a foil shape so as to have high flexibility in the thickness direction, for example, a copper or graphite sheet is used as a high thermal conductive material. The

  The first end portions of the heat radiation sheet 8 are inserted by being bent by about 90 degrees in the thickness direction between the solid-state imaging devices 2r, 2g, and 2b and the imaging device substrates 3r, 3g, and 3b. It is fixed in the state. Such fixing of the first end is performed by the heat radiation sheet 8 inserted between the solid-state image pickup devices 2r, 2g, and 2b and the image pickup device substrates 3r, 3g, and 3b by the solid-state image pickup device and the image pickup device substrate. It is done by being pinched. In such a state, the first end portions of the heat radiation sheet 8 are in contact with the back surfaces of the solid-state imaging devices 2r, 2g, and 2b. In addition, the case where grease etc. are used in order to make the contact property of the thermal radiation sheet 8 and solid-state image sensor 2r, 2g, 2b more favorable may be sufficient.

  Next, the joining structure of the prism members 1r, 1g, and 1b and the solid-state imaging devices 2r, 2g, and 2b in the imaging block 20 of the first embodiment will be described. In this description, FIG. 5 shows a schematic diagram of a state in which the imaging block 20 is partially disassembled.

  First, a joint structure between the joint surface 21 that is the light receiving side surface of the solid-state imaging element 2r and the element side joint surface 22 of the prism member 1r will be described with reference to FIG.

  As shown in FIG. 5, the bonding surface 21 of the solid-state imaging device 2r has a first region 21a having a first surface roughness and a second surface roughness having a second surface roughness larger than the first surface roughness. Two regions 21b are formed. In the bonding surface 21, a substantially central region in the left-right direction in the drawing is a first region 21a, and a second region 21b is arranged so as to be adjacent to each end portion of the first region 21a in the left-right direction in the drawing. .

  In addition, the element-side bonding surface 22 of the prism member 1r bonded to the bonding surface 21 of the solid-state imaging device 2r has a first region 22a having a first surface roughness and a first surface having a second surface roughness. Two regions 22b are formed. In the bonding surface 22, a substantially central region in the left-right direction in the drawing is a first region 22 a, and the second region 22 b is arranged so as to be adjacent to each end portion in the left-right direction in the drawing of the first region 21 a. .

  Further, the first region 21a of the bonding surface 21 and the first region 22a of the bonding surface 22 completely include a region through which the light beam incident on the solid-state imaging device 2r passes (for example, matches the light beam passage region). So that the placement of each is determined. On the other hand, the second region 21b of the joint surface 21 and the second region 22b of the joint surface 22 are disposed outside the light flux passage region. The light flux passage region is a region corresponding to the light receiving surface of the solid-state imaging device 2r. In other words, the light flux passage region is a region through which the light flux that is received by the solid-state imaging device 2r and subjected to photoelectric conversion passes. In FIG. 5, the second area is hatched to distinguish the first area from the second area. Similarly, a patching pattern is also attached to a fourth area described later.

  Here, FIG. 6 shows a partially enlarged schematic cross-sectional view showing a bonding state between the bonding surface 21 of the solid-state imaging element 2r and the bonding surface 22 of the prism member 1r via an adhesive. As shown in FIG. 6, the first regions 21 a and 22 a and the second regions 21 b and 22 b in the respective joint surfaces 21 and 22 are disposed so as to face each other. In addition, since the surface roughness in the second regions 21b and 22b is set to be larger (that is, rougher) than the surface roughness in the first regions 21a and 22a, in the state where the respective bonding surfaces 21 and 22 are arranged to face each other. The spatial volume per unit area between the second regions 21b and 22b is larger than the spatial volume per unit area between the first regions 21a and 22a. As a result, the thickness of the adhesive layer 25 formed by the adhesive disposed between the joining surfaces 21 and 22 is larger between the second regions 21b and 22b than between the first regions 21a and 22a.

  By adopting such a structure, the bonding area and the volume of the adhesive are increased in the second regions 21b and 22b, which are outer peripheral regions that are not involved in the passage of the light beam incident on the solid-state imaging device 2r. The bonding strength of the adhesive to the respective bonding surfaces 21 and 22 can be increased, and the bonding reliability can be ensured. On the other hand, it is possible to improve the reliability of the adhesive layer 25 against creep deformation while maintaining the thickness of the adhesive layer 25 so as to ensure good optical characteristics in the first regions 21a and 22a, which are light flux passage regions. it can. In addition, although the thickness of the adhesive layer 25 between the first regions 21a and 22a can be ensured, for example, by making it equal to the thickness between the conventional prism members, the optical characteristics can be ensured, but between the second regions 21b and 22b. In the case where sufficient bonding strength can be ensured, the thickness between the first regions 21a and 22a can be made thinner than before to further improve the optical characteristics.

  Such a joining structure between the solid-state imaging device 2r and the prism member 1r is similarly employed in the joining structure between the other solid-state imaging devices 2g and 2b and the prism members 1g and 1b. Furthermore, the present invention can also be applied to a joint structure between prism members 1r, 1g, and 1b.

  Concretely, the joining structure of the prism side joining surface 23 of the prism member 1r and the prism side joining surface 24 of the prism member 1b will be described with reference to FIG. As shown in FIG. 5, the joint surface 23 of the prism member 1r has a third region (not shown) having a third surface roughness and a fourth surface roughness larger than the third surface roughness. A fourth region (not shown) is formed. In the bonding surface 23, the fourth region is disposed so as to be adjacent to the respective opposite end portions of the third region.

  Further, the joint surface 24 of the prism member 1b is arranged so as to be adjacent to the third region 24a having the third surface roughness and the respective opposite ends of the third region 24a, and the fourth region 24a. And a fourth region 24b having a surface roughness of 5 mm. Further, the arrangement of the third region of the bonding surface 23 and the third region 24a of the bonding surface 24 is determined so as to completely include the light flux passage region, and the fourth region of the bonding surface 23, The fourth region 24b of the joint surface 24 is disposed outside the light flux passage region. In addition, the arrangement of the respective areas is determined so that the third areas and the fourth areas are arranged to face each other in a state where the bonding surfaces 23 and 24 are arranged to face each other. The bonding of the prism members 1r and 1b is performed by forming an adhesive layer with an adhesive between the formed regions. A similar joint structure is employed for the joint structure between the other prism members 1r, 1g, and 1b.

  By adopting such a structure also in the joining structure of each prism member 1r, 1g, 1b, it is possible to increase the bonding strength by the adhesive in the fourth region and ensure the bonding reliability. In addition, it is possible to improve the reliability of the adhesive layer against creep deformation while improving the optical characteristics in the third region.

  Here, it is preferable that the first surface roughness is set to a surface roughness equal to or less than the optical surface roughness that can ensure the optical characteristics necessary for passing the light flux. Such optical surface roughness Ra is, for example, Ra = 0.01 to 0.05 μm. Such optical surface roughness is set as a condition necessary for transmitting visible light having a wavelength of 0.38 to 0.78 μm without interference. Therefore, the second surface roughness is a surface roughness larger than the optical surface roughness, and the surface thereof is based on the size of the space per unit area necessary for sufficiently securing the mechanical strength. Roughness is determined. The third surface roughness is also preferably set to be equal to or less than the optical surface roughness Ra. The third surface roughness may be the same as or different from the first surface roughness.

  Moreover, in each joining surface 21, 22, 23, 24, the area | region where surface roughness differs in the joining surface should just be set, for example, the 1st surface roughness of the joining surface 21, and joining The first surface roughness of the surface 22 may be different, or the fourth surface roughness of the bonding surface 23 may be different from the fourth surface roughness of the bonding surface 24.

  Further, in the above description, a case has been described in which regions having different surface roughness are provided on both joint surfaces to be joined to each other. However, the first embodiment is limited only to such a case. is not. Instead of such a case, for example, a case where a region having a different surface roughness is set only on one of the joining surfaces may be used. For example, even when the joining surface 21 of the solid-state imaging device 2r has a single surface roughness and the first region and the second region having different surface roughnesses are set on the joining surface 22 of the prism member 1r. Good.

  According to the imaging block 20 of the first embodiment, the mechanical strength such as a drop impact is secured by changing the thickness setting of the adhesive layer between the passage area of the light flux and the outside of the passage area on the joint surface of each member. In addition, it is possible to realize a joint structure that can suppress creep deformation while improving optical characteristics.

(Second Embodiment)
In addition, this invention is not limited to the said embodiment, It can implement with another various aspect. For example, the solid-state imaging device according to the second embodiment of the present invention has a bonding structure in which bonding is performed using adhesives having different characteristics for each region having different surface roughness on the bonding surface. Concretely, it demonstrates using FIG. 7 which shows the schematic cross section which expanded partially the junction structure of the junction surface 21 of the solid-state image sensor 2r, and the junction surface 22 of the prism member 1r. Note that the bonding structure of the second embodiment is the same as that of the first embodiment in that the surface roughness is different for each region, and therefore the same reference numerals are used for the same structural members and the description thereof is omitted. To do.

  As shown in FIG. 7, an adhesive having good optical characteristics (for example, an adhesive having excellent image quality performance) is formed between the first region 21 a of the joint surface 21 and the first region 22 a of the joint surface 22. An adhesive layer 26 is disposed. For example, the adhesive layer 26 is formed of an acrylic adhesive that is advantageous for optical properties (transparency, bubbles and gas residue). On the other hand, between the 2nd area | region 21b of the joint surface 21, and the 2nd area | region 22b of the joint surface 22, it forms with the adhesive (for example, adhesive agent excellent in drop impact resistance) with a favorable mechanical characteristic. An adhesive layer 27 is disposed. For example, the adhesive layer 27 is formed of an epoxy adhesive.

  As described above, the optical characteristics and mechanical characteristics of the adhesive layers 26 and 27 arranged in the light flux passage area and the outside of the light passage area are made different, thereby improving the optical characteristics of the adhesive layer 26 in the light flux passage area. In addition, the mechanical characteristics of the adhesive layer 27 outside the light flux passage region can be further improved, the reliability of the bonding structure in the first embodiment can be further improved, and the reduction in registration accuracy can be suppressed. It is valid.

  In addition, since the surface roughness of the first regions 21a, 22a and the second regions 21b, 22b is different in the joint surfaces 21, 22, the distinction between different types of adhesives becomes clear. Workability can be made easy.

  In each of the above-described embodiments, the case where the bonding surface is configured as a flat surface has been described. However, instead of such a case, for example, the first region and the second region are different planes. It may be a case where the joint surface is configured as a combination of a plurality of planes so as to be arranged in the above.

  In each of the above embodiments, the case where the adhesive layer is disposed between the first regions and between the second regions has been described. However, instead of such a case, the adhesive layer is disposed between the second regions. In the case where the joining satisfying the mechanical strength of both members can be realized by the adhesive layer, a structure in which the adhesive layer is not disposed between the first regions that are the light flux passage regions should be adopted. You can also. Thus, if there is no adhesive layer between the first regions, creep deformation between the first regions can be prevented from occurring.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

  Although the present invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. Such changes and modifications are to be understood as included within the scope of the present invention as long as they do not depart from the scope of the present invention.

Schematic configuration diagram of imaging block in a conventional three-plate color camera A schematic perspective view showing a state in which a conventional imaging block is partially disassembled 1 is a schematic perspective view of an imaging block according to a first embodiment of the present invention. Schematic perspective view of the imaging block of FIG. 3 with a heat dissipation structure The model perspective view which shows the state which decomposed | disassembled the imaging block of FIG. 3 partially The model expanded sectional view of the junction part in the image pick-up block of the said 1st Embodiment. The model expanded sectional view of the junction part in the imaging block of 2nd Embodiment of this invention.

Explanation of symbols

1 Three-color separation prism 1r Prism member (red)
1g Prism member (green)
1b Prism member (blue)
2r solid-state image sensor (for red)
2g solid-state image sensor (for green)
2b Solid-state image sensor (for blue)
3r Image sensor substrate (for red)
3g Image sensor substrate (for green)
3b Image sensor substrate (for blue)
4 Junction 5 Junction 6a Primary color luminous flux (for red)
6b Primary color luminous flux (for green)
6c Primary color luminous flux (for blue)
7 Light flux 8 Heat radiation sheet 10, 20 Imaging block 11, 21 Joint surface 21 a First region 21 b Second region 12, 22 Element side joint surface 13, 23 Prism side joint surface 14, 24 Prism side joint surface 25, 26, 27 Adhesion layer

Claims (6)

In a solid-state imaging device in which a solid-state imaging element and a prism are bonded via an adhesive layer,
A first region in which the joint surface of the solid-state imaging device or the joint surface of the prism has a first surface roughness, and a second region having a second surface roughness larger than the first surface roughness. And a solid-state imaging device, wherein the solid-state imaging element and the prism are joined by the adhesive layer disposed in the second region.   2. The solid-state imaging according to claim 1, wherein the first region is disposed including a passage region of a light beam incident on the solid-state imaging element, and the second region is disposed around the passage region of the light beam. device.   The solid-state imaging according to claim 1, wherein the adhesive layer is also disposed in the first region, and the thickness of the adhesive layer in the second region is larger than the thickness of the adhesive layer in the first region. device.   3. The solid-state imaging device according to claim 1, wherein an adhesive layer formed of an adhesive different from the adhesive forming the adhesive layer disposed in the second region is disposed in the first region.   The solid-state imaging device according to claim 4, wherein each of the adhesives has different mechanical characteristics or optical characteristics. The prism has a structure in which a plurality of prism members are joined,
The joint surface of each of the prism members includes a third region having a third surface roughness and a fourth region having a fourth surface roughness larger than the third surface roughness, The solid-state imaging device according to claim 1, wherein each of the prism members is bonded by an adhesive layer arranged in four regions.

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