JP2008198920A - Circuit jointing method, circuit component laminated body, and memory card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve reliability of jointing of a circuit component to a base substrate. <P>SOLUTION: In a circuit component laminated body, a spacer dummy via and a substrate dummy via are arranged in a position near a spacer electrode on the side of base substrate 2 of the laminated module 3 and passed through from the opposite side of the base substrate 2 to the side of the base substrate 2 continuously. In the electrical jointing of the laminated module 3 to the base substrate 2, heat from a heat tool is conducted efficiently through the dummy via to the nearby portion of the spacer electrode on the side of the base substrate 2 of the laminated module 3. As a result, ACF on a base substrate electrode 211 can be heated efficiently, and the laminated module 3 can be jointed firmly, thus, improving the connection reliability of the laminated module 3 to the base substrate 2. The jointing of the spacer 32 to the base substrate 2, and the jointing of two or more spacers 32 and two or more circuit modules are performed in parallel, and thereby fabrication of the circuit component laminated body is simplified. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a circuit joining method for joining circuit components on a base substrate, a circuit component laminate, and a memory card including the circuit component laminate.

  Conventionally, a memory card with a built-in memory chip is used as one of recording media for recording information. Since such a memory card is excellent in portability, such as a portable information terminal or a mobile phone. Widely used as a recording medium for portable electronic devices. The capacity of these portable electronic devices is increasing year by year from the viewpoint of improving portability, and accordingly, the capacity of memory cards is required to be increased.

On the other hand, since the shape, size, thickness, etc. of a memory card are usually determined by standards, it is necessary to increase the capacity without increasing the size of the memory card when increasing the capacity of the memory card There is. Patent Document 1 discloses a technique for thinning an electronic circuit module by laminating a plurality of film substrates each having a bare chip mounted thereon on a mother substrate to form the electronic circuit module.
International Publication No. 2006/095703 Pamphlet

  By the way, in the manufacture of the electronic circuit module of Patent Document 1, after the process of laminating and bonding a plurality of film substrates each having a bare chip mounted thereon one by one, the plurality of film substrates in the laminated state are mother substrates. To be joined. For this reason, when the number of film substrates increases, the time required for laminating the film substrates increases, and there is a limit to improvement in productivity.

  In the manufacture of an electronic circuit module, the bonding between two film substrates is performed by melting and solidifying the solder layer on the surface of the metal ball disposed between the electrodes of the two opposing film substrates. Is called. When performing such joining with heating, a heat tool or the like is usually brought into contact with the main surface opposite to the bonding surface of one film substrate (that is, the main surface facing the other film substrate). Thus, heating the electrodes on the bonding surface is performed. However, if the circuit component such as the substrate that the heat tool comes into contact with is thick, if the heat conducted from the heat tool to the electrode is insufficient, the circuit component cannot be firmly bonded, and the quality of the bonding deteriorates. There is a fear.

  The present invention has been made in view of the above-mentioned problems, and has as its main purpose to improve the reliability of bonding of circuit components to a base substrate, and to simplify the bonding of circuit components having a laminated structure. Also aimed.

  The invention according to claim 1 is a circuit joining method for joining a circuit component on a base substrate, and a) the circuit component is placed on the base substrate while the component electrode of the circuit component is opposed to the substrate electrode of the base substrate. And b) by contacting a heating portion formed of metal penetrating the circuit component in the vicinity of the component electrode and electrically separated from the wiring of the circuit component with the heating portion. And heating the vicinity of the component electrode through the heat conducting portion to electrically join the component electrode and the substrate electrode.

  Invention of Claim 2 is the circuit joining method of Claim 1, Comprising: An anisotropic conductive resin or nonelectroconductive resin is given to the said component electrode or the said board | substrate electrode before the said a) process. A step of applying, and in the step b), the circuit component is pressed toward the base substrate.

  A third aspect of the present invention is the circuit joining method according to the first aspect, wherein the circuit component is mounted on the base substrate in the step a), and the step a). And a second circuit component mounted on the first circuit component, wherein the first circuit component is a part of the heat conductive portion and passes through the first circuit component. And the second circuit component has a second heat conduction portion that is a part of the heat conduction portion and penetrates the second circuit component, and in the step b), the first heat conduction portion and The second heat conduction part is thermally connected to heat the part electrode vicinity through the first heat conduction part and the second heat conduction part, and further, by heat from the second heat conduction part The first circuit component and the second circuit component are joined.

  A fourth aspect of the present invention is the circuit joining method according to the third aspect, wherein the first circuit component has a first intermediate electrode facing the second circuit component in the vicinity of the first thermal conduction portion. And the second circuit component has a second intermediate electrode facing the first circuit component in the vicinity of the second heat conducting portion, and in the step b), the second circuit component is interposed via the second heat conducting portion. By heating the vicinity of the first intermediate electrode and the second intermediate electrode, the first intermediate electrode and the second intermediate electrode are electrically joined.

  The invention according to claim 5 is the circuit joining method according to claim 4, wherein an anisotropic conductive resin or non-conductive resin is applied to the component electrode or the substrate electrode before the step a). And a step of applying an anisotropic conductive resin or a non-conductive resin to the first intermediate electrode or the second intermediate electrode, and in the step b), the second circuit component is While being pressed toward the first circuit component, the first circuit component is pressed toward the base substrate.

  The invention according to claim 6 is the circuit joining method according to claim 5, wherein an anisotropic conductive resin or non-conductive resin is applied to the first intermediate electrode or the second intermediate electrode. In addition, the anisotropic conductive resin or the non-conductive resin is also applied to the end of the first heat conductive part or the second heat conductive part.

  A seventh aspect of the present invention is the circuit joining method according to any one of the third to sixth aspects, wherein a semiconductor chip is mounted on both sides of a component substrate before the step a), and the second circuit. The method further includes a step of obtaining a component, wherein the first circuit component is a spacer that is disposed between the base substrate and the component substrate and supports the second circuit component.

  The invention according to claim 8 is the circuit bonding method according to claim 7, wherein the semiconductor chip is a memory device.

  The invention according to claim 9 is the circuit joining method according to claim 7 or 8, wherein in the first circuit component, the first heat conducting portion penetrates the first circuit component and the component. Surrounding the through wiring that electrically connects the electrode and the first intermediate electrode.

  The invention according to claim 10 is a circuit component laminate, and includes a base substrate having substrate electrodes, a first circuit component bonded on the base substrate, and a first circuit component bonded on the first circuit component. Two circuit components, wherein the first circuit component is a first component body, a component electrode electrically connected to the substrate electrode of the base substrate, and the second circuit component of the first component body. A first intermediate electrode provided on the opposing surface, a first wiring penetrating the first component body and having one end connected to the component electrode and the other end connected to the first intermediate electrode; A first heat conducting portion formed of a metal penetrating the first component main body in the vicinity of the component electrode and electrically separated from the first wiring; and the second circuit component is a second component Electrically connected to the main body and the first intermediate electrode of the first circuit component A second intermediate electrode connected to the second intermediate electrode; a second wiring connected to the second intermediate electrode; and a metal penetrating the second component body in the vicinity of the second intermediate electrode. And a second heat conduction part thermally connected to the first heat conduction part.

  The invention according to claim 11 is the circuit component laminate according to claim 10, wherein the first circuit component is bonded to the base substrate via an anisotropic conductive resin or a non-conductive resin. The second circuit component is bonded to the first circuit component via an anisotropic conductive resin or a non-conductive resin.

  A twelfth aspect of the present invention is the circuit component laminate according to the tenth or eleventh aspect, wherein the second circuit component includes a component substrate and semiconductor chips mounted on both surfaces of the component substrate. The first circuit component is a spacer that is disposed between the base substrate and the component substrate and supports the second circuit component.

  The invention described in claim 13 is the circuit component laminate according to claim 12, wherein the semiconductor chip is a memory device.

  The invention according to claim 14 is the circuit component laminate according to claim 12 or 13, wherein in the first circuit component, the first heat conducting portion surrounds the periphery of the first wiring.

  The invention according to claim 15 is a memory card, wherein the circuit component laminate according to any one of claims 10 to 14, the first circuit component and the circuit board on the base substrate of the circuit component laminate A cover portion covering the second circuit component.

  In the present invention, it is possible to improve the reliability of bonding of circuit components to the base substrate. According to the third to fourteenth aspects of the present invention, it is possible to simplify the joining of circuit components having a laminated structure. In the invention of claim 6, the first heat conducting part and the second heat conducting part can be thermally and reliably joined.

  FIG. 1 is a plan view showing a configuration of a memory card 1 according to an embodiment of the present invention. FIG. 2 is a longitudinal cross-sectional view of the memory card 1 cut at the position AA shown in FIG. In FIG. 1, in order to facilitate understanding of the internal structure of the memory card 1, only the outline of the cover portion 5 is indicated by a broken line.

  In the present embodiment, the memory card 1 is an SD memory card (Secure Digital memory card). Preferably, the length and width of the memory card 1 (that is, the horizontal and vertical sizes in FIG. 1) and the thickness (that is, the vertical size in FIG. 2) are 32 mm, respectively. 24 mm and 2.1 mm. In the following description, for convenience, the upper side and the lower side in FIG. 2 will be described as the upper side and the lower side of the memory card 1, respectively.

  As shown in FIGS. 1 and 2, the memory card 1 has a substantially rectangular circuit board 2 with one corner cut out, a laminated structure in which a plurality of circuit components are laminated, and an upper surface of the circuit board 2. A laminated module 3 joined on the circuit board 2 and electrically connected to the circuit board 2; a fine chip component 4 such as a resistor mounted on the upper surface 21 of the circuit board 2 using solder; and an upper surface of the circuit board 2 On the 21 side, a resin cover portion 5 that covers the laminated module 3 and the chip component 4 is provided. Since the circuit board 2 serves as a base board to which the components of the memory card 1 are bonded, it is referred to as “base board 2” in the following description.

  FIG. A is a longitudinal sectional view showing the base substrate 2 and the laminated module 3 of the memory card 1 in an enlarged manner. In the following description, the base substrate 2 and the laminated module 3 are collectively referred to as a circuit component laminate. FIG. In A, for the sake of illustration, the thickness of the circuit component laminate is drawn larger than the actual thickness. In addition, in order to facilitate understanding of the drawing, the flexible circuit board 31 and the spacer 32 described later are shown without parallel oblique lines (the same applies to FIGS. 3.B and 7).

  The base substrate 2 is made of glass epoxy, and FIG. As shown in A, the base substrate electrode 211 to which the laminated module 3 is bonded is provided on the upper surface 21, and a plurality of external electrodes 221 for connection with external electronic devices are provided on the lower surface 22. The external electrode 221 is electrically connected to a wiring provided on the upper surface 21 through a via (not shown) communicating from the lower surface 22 of the base substrate 2 to the upper surface 21.

  The laminated module 3 includes four flexible circuit boards 31 and four spacers 32 that are alternately laminated on the base substrate 2, and a plurality of modules mounted on the upper surface 311 and the lower surface 312 of each of the four flexible circuit boards 31. The semiconductor chip 33 is provided. The four spacers 32 are respectively connected to the base substrate 2 and FIG. Between the lowermost flexible circuit board 31 in A and between the four flexible circuit boards 31, FIGS. As shown to A, it arrange | positions in the approximate center of the longitudinal direction (namely, left-right direction in FIG. 3.A) of the flexible circuit board 31. FIG.

  Further, the semiconductor chips 33 are arranged on both sides of the spacer 32 in the longitudinal direction on the main surfaces on both sides of each flexible circuit board 31. In other words, the spacer 32 is disposed between two semiconductor chips 33 mounted on the same main surface of the flexible circuit board 31. Each semiconductor chip 33 is electrically connected to the base substrate 2 via wiring formed on each of the flexible circuit board 31 and the spacer 32.

  FIG. A semiconductor chip 33 shown in A is a memory device that stores information, and is mounted on a flexible circuit board 31 via a non-conductive resin 34. The flexible circuit board 31 includes an anisotropic conductive resin 35. Via the spacer 32. In addition, FIG. The lowermost spacer 32 in A is bonded onto the base substrate 2 via an anisotropic conductive resin 35.

  An anisotropic conductive resin is an insulating resin material in which fine conductive metal particles are dispersed inside. An anisotropic conductive resin is bonded between electrodes in bonding via an anisotropic conductive resin. By heating and pressurizing with the resin sandwiched, both electrodes are electrically and thermally connected via the metal particles, and are physically joined by a cured and contracted resin material. Also, in joining via a non-conductive resin, the bump and the electrode are brought into contact with each other by heating while pressing the bump opposite to the electrode across the non-conductive resin applied on the electrode. Physical joining is performed by electrically connecting and curing and shrinking the non-conductive resin.

  FIG. B is shown in FIG. FIG. 4 is an enlarged view showing the vicinity of the lowermost spacer 32 in A, and FIG. 4 is a bottom view showing the lowermost spacer 32. FIG. In B, illustration of the semiconductor chip 33 on the flexible circuit board 31 is omitted for convenience of illustration. FIG. As shown in FIG. 4B and FIG. 4, the lowermost spacer 32 is electrically connected to the base body 2 and the lowermost flexible circuit board 31 through the spacer main body 323 formed of glass epoxy and the spacer main body 323. A plurality of spacer vias 324 which are through-wirings connected to are provided. In the present embodiment, the spacer via 324 is formed of copper (Cu). In FIG. 4, for convenience of illustration, the number of spacer vias 324 and spacer dummy vias 325 to be described later is drawn smaller than the actual number, and parallel diagonal lines are added to the spacer dummy vias 325 for easy understanding of the drawing. (The same applies to the substrate via 314 and the substrate dummy via 315 in FIG. 5).

  As shown in FIG. 4, a plurality of spacer electrodes joined to the base substrate electrode 211 (see FIG. 3A) of the base substrate 2 and electrically connected to the wiring of the base substrate 2 are formed on the lower surface 322 of the spacer 32. 3241 is provided. One end of each spacer via 324 is shown in FIG. As shown to A, it is connected to the spacer electrode 3241 and is electrically connected to the base substrate 2 through the base substrate electrode 211. Similarly, a plurality of spacer electrodes 3241 connected to the other end of the spacer via 324 are provided on the upper surface 321 of the spacer 32 (that is, the surface facing the lowermost flexible circuit board 31). Is connected to the spacer electrode 3241 and is electrically connected to the lowermost flexible circuit board 31.

  The spacer 32 is also provided penetrating from the vicinity of the spacer electrode portion 3241 on the upper surface 321 side of the spacer main body 323 to the vicinity of the spacer electrode 3241 on the lower surface 322 side (that is, penetrating the spacer main body 323 in the vicinity of the spacer electrode 3241). A plurality of spacer dummy vias 325 formed of a metal such as copper are provided.

  Each spacer dummy via 325 is electrically separated from the spacer via 324 (that is, electrically disconnected), and any of the circuit component stacks (that is, the base substrate 2 and the stacked module 3). Therefore, no signal is transmitted using the spacer dummy via 325 in the memory card 1 (see FIGS. 1 and 2). As shown in FIG. 4, in the spacer 32, a plurality of spacer dummy vias 325 are provided surrounding the plurality of spacer vias 324.

  FIG. Three spacers 32 from the upper side in A are provided with a spacer main body 323, a spacer via 324, and a spacer dummy via 325 in the same manner as the lowermost spacer 32. In the three spacers 32, the spacer vias 324 are electrically connected to the flexible circuit boards 31 arranged on both the upper and lower sides via the spacer electrodes 3241.

  FIG. It is a bottom view which shows a part of lowermost flexible circuit board 31 in A. FIG. FIG. 5 shows the vicinity of the joint between the flexible circuit board 31 and the spacer 32 (see FIG. 3.A), and a part of the semiconductor chip 33 is also drawn. FIG. As shown in FIG. 5B and FIG. 5, the flexible circuit board 31 penetrates through the board body 313 formed of polyimide and the board body 313 and electrically connects the upper and lower spacers 32 via the first board electrode 3141. A plurality of substrate vias 314 that are through wirings are provided. In the present embodiment, the substrate via 314 is also formed of a metal such as copper, like the spacer via 324 (see FIG. 4).

  FIG. As shown in FIG. 5B and FIG. 5, the lower surface 312 of the flexible circuit board 31 is provided with a plurality of first substrate electrodes 3141 that are joined and electrically connected to the spacer electrode 3241 on the upper surface 321 of the spacer 32. . One end of each substrate via 314 is shown in FIG. As shown in B, it is connected to the first substrate electrode 3141 and electrically connected to the lower spacer 32 via the spacer electrode 3241. Similarly, a plurality of first substrate electrodes 3141 connected to the other end of the substrate via 314 are provided on the upper surface 311 of the flexible circuit board 31, and the first substrate electrode 3141 and the spacer electrode 3241 are interposed therebetween. The flexible circuit board 31 is electrically connected to the upper spacer 32.

  As shown in FIG. 5, surface wiring 316 extending from the first substrate electrode 3141 to the semiconductor chip 33 along the lower surface 312 is provided on the lower surface 312 of the flexible circuit board 31 and connected to the surface wiring 316. FIG. The chip electrode portion 332 of the semiconductor chip 33 is bonded onto the second substrate electrode 3161 shown in FIG. In the present embodiment, the chip electrode portion 332 has ball bumps (so-called stud bumps), and the semiconductor chip 33 is mounted on the flexible circuit board 31 by flip chip mounting. A similar surface wiring 316 is also provided on the upper surface 311 of the flexible circuit board 31.

  FIG. As shown in B, the flexible circuit board 31 is also provided penetrating from the vicinity of the first substrate electrode 3141 on the upper surface 311 side of the substrate body 313 to the vicinity of the first substrate electrode 3141 on the lower surface 312 side (that is, the first A plurality of substrate dummy vias 315 formed of a metal such as copper (through the substrate body 313 in the vicinity of one substrate electrode 3141) are provided. Each substrate dummy via 315 is electrically separated from the substrate via 314 and the surface wiring 316 (see FIG. 5), and is not connected to any electrical wiring of the circuit component laminate (that is, the base substrate 2 and the laminated module 3). Since they are electrically separated, no signal is transmitted in the memory card 1 using the substrate dummy via 315.

  As shown in FIG. 5, in the flexible circuit board 31, a plurality of substrate dummy vias 315 and a dummy via junction portion 3151 to which the substrate dummy vias 315 are connected avoid a surface wiring 316 extending from the plurality of substrate vias 314 to the semiconductor chip 33. The plurality of substrate vias 314 are provided so as to surround the periphery of the plurality of substrate vias 314 (that is, among the wirings provided in the flexible circuit board 31, the periphery of the through wiring penetrating the substrate body 313). The plurality of substrate dummy vias 315 are shown in FIG. As shown to B, it is thermally connected with the spacer dummy via 325 of the spacer 32 of the upper and lower sides via the dummy via junction parts 3151 and 3251 formed with metal. In the stacked module 3, the dummy via junctions 3151 and 3251 can be regarded as the end portions of the substrate dummy via 315 and the spacer dummy via 325, respectively.

  FIG. The three flexible circuit boards 31 from the upper side in A are provided with a substrate body 313, a substrate via 314, a surface wiring 316, and a substrate dummy via 315, similarly to the lowermost flexible circuit board 31. In the uppermost flexible circuit board 31, the first substrate electrode 3141 and the dummy via junction 3151 are not provided on the upper surface 311 because the spacer 32 is not bonded to the upper side.

  The thickness of each flexible circuit board 31 is about 25 μm, and the thickness of the chip body 331 of each semiconductor chip 33 is about 50 μm. Further, the height in the vertical direction of the chip electrode portion 332 of the semiconductor chip 33 is about 30 μm. FIG. The height in the vertical direction of the lowermost spacer 32 in A is about 105 μm, and the height of the other three spacers 32 is about 185 μm.

  In the laminated module 3, the spacer 32 is adjacent to a part of one flexible circuit board 31 (hereinafter referred to as “circuit module”) on which a plurality of semiconductor chips 33 are mounted, and above the circuit module. It faces a part of the flexible circuit board 31 of another circuit module. The flexible circuit board 31 of one circuit module is separated from the flexible circuit board 31 of the other circuit module by a predetermined distance with respect to the stacking direction (that is, the vertical direction in FIG. 3.A) by the spacer 32. The flexible circuit board 31 is supported. The lowermost spacer 32 faces a part of each of the base substrate 2 and the flexible circuit board 31 of the lowermost circuit module, and the lowermost flexible circuit board 31 is arranged in the stacking direction by the spacer 32. The base substrate 2 is supported with a predetermined distance from the base substrate 2.

  Further, the substrate dummy vias 315 (see FIG. 3.B) of the four flexible circuit boards 31 and the spacer dummy vias 325 (see FIG. 3.B) of the four spacers 32 are provided on the upper surface of the uppermost flexible circuit board 31. 311 to the lower surface 322 of the lowermost spacer 32 are continuous via dummy via junctions 3151 and 3251 (see FIG. 3.B) and are thermally connected.

  Here, when the laminated module 3 is regarded as a circuit component to be bonded onto the base substrate 2, the substrate dummy via 315, the spacer dummy via 325, and the dummy via bonding portions 3151 and 3251 are component electrodes of the circuit component (that is, the lowermost spacer). In the vicinity of the spacer electrode 3241) on the lower surface 322 side of 32, the circuit component is continuously provided from the side opposite to the base substrate 2 to the base substrate 2 side. In the following description, the substrate dummy via 315, the spacer dummy via 325, and the dummy via junctions 3151 and 3251 are collectively referred to simply as “dummy vias”.

  Next, a method for manufacturing a circuit component laminate (that is, the base substrate 2 and the laminate module 3) will be described. FIG. 6 is a view showing a flow of manufacturing the circuit component laminate, and FIG. 7 is a longitudinal sectional view showing the circuit component laminate in the manufacturing process.

  When a circuit component laminate is manufactured, first, the upper surface 311 and the lower surface 312 (see FIG. 3.A) of the four flexible circuit boards 31 are non-conductive in regions where a plurality of semiconductor chips 33 are mounted. A resin film (NCF (Non Conductive Film)) is attached. Then, two circuit chips 33 are sequentially flip-chip mounted on the upper surface 311 and the lower surface 312 of each flexible circuit board 31 via the NCF to form four circuit modules (step S11).

  Subsequently, an anisotropic conductive resin film (ACF (Anisotropic Conductive Adhesive Film)) is attached on the base substrate electrode 211 of the base substrate 2 (that is, an anisotropic conductive resin is applied). Specifically, after the ACF heated to about 80 ° C. is temporarily pressure-bonded onto the base substrate electrode 211 (see FIG. 3.B), the protective film covers the main surface of the ACF opposite to the base substrate electrode 211. Is peeled off. When the ACF is attached, one spacer 32 is mounted on the upper surface 21 of the base substrate 2 with the spacer electrode 3241 on the lower surface 322 side (see FIG. 3B) facing the base substrate electrode 211 with the ACF interposed therebetween. The The ACF may be affixed on the spacer electrode 3241 on the lower surface 322 side of the spacer 32.

  Next, ACF is affixed on the spacer electrode 3241 on the upper surface 321 side of the spacer 32. The ACF is also affixed (that is, given) on the dummy via junction 3251 on the upper surface 321 side of the spacer 32. Then, one circuit module (that is, the flexible circuit board 31) is arranged with the first substrate electrode 3141 (see FIG. 3B) on the lower surface 312 side of the flexible circuit board 31 facing the spacer electrode 3241 of the spacer 32 via the ACF. The semiconductor chip 33) is mounted on the spacer 32. At this time, the dummy via junction 3151 on the lower surface 312 side of the flexible circuit board 31 faces the dummy via junction 3251 of the spacer 32 via the ACF. The ACF may be affixed on the first substrate electrode 3141 and the dummy via junction 3151 on the lower surface 312 side of the flexible circuit board 31.

  Similarly, the mounting of the spacer 32 and the circuit module performed through the ACF is repeated, and the four spacers 32 and the four circuit modules (that is, the flexible circuit board 31 having the semiconductor chip 33 mounted on both surfaces) are shown in FIG. As shown in FIG. 7, it is laminated on the base substrate 2 (step S12).

  As described above, when the four spacers 32 and the four circuit modules are mounted on the base substrate 2 while being alternately stacked, the heat tool 9 serving as a heating unit is mounted on the upper surface 311 of the flexible circuit board 31 of the uppermost circuit module. Is abutted. The heat tool 9 is in contact with the region between the two semiconductor chips 33 on the upper surface 311 of the uppermost flexible circuit board 31 and covers the entire spacer 32 in plan view.

  Then, when a downward load is applied by the preheated heat tool 9, each ACF is crushed, and FIG. As shown to B, the 1st board | substrate electrode 3141 and the spacer electrode 3241 of the flexible circuit board 31 and the spacer electrode 3241 and the base board electrode 211 are electrically connected through the metal grain in ACF. Further, the dummy via junction 3151 connected to the substrate dummy via 315 and the dummy via junction 3251 connected to the spacer dummy via 325 are thermally connected via the metal grains in the ACF. Then, the heat from the heat tool 9 is conducted to the base substrate 2 side through the plurality of flexible circuit boards 31 and the spacers 32, and the ACF on the first substrate electrode 3141, the spacer electrode 3241 and the base substrate electrode 211 is reduced to about Heat to 180 ° C.

  At this time, the heat from the heat tool 9 is mainly a metal dummy via having a higher thermal conductivity than the substrate main body 313 and the spacer main body 323 (that is, the substrate dummy via 315, the spacer dummy via 325, and the dummy via junction 3151). 3251) is conducted to the vicinity of the first substrate electrode 3141, the spacer electrode 3241 and the base substrate electrode 211, whereby each ACF is efficiently heated. That is, the dummy via is a heat conducting portion that efficiently conducts heat from the heat tool 9 in the stacking direction, and the substrate dummy via 315 of the flexible circuit board 31 and the spacer dummy via 325 of the spacer 32 are each a heat conducting portion. It has become a part of.

  As described above, when the plurality of circuit modules and the spacers 32 are pressed toward the base substrate 2 in a state where the ACF is heated, each ACF is thermally cured, and each of the four circuit modules becomes an anisotropic conductive resin. The upper three spacers 32 are respectively connected to the lower spacer 32 via the anisotropic conductive resin 35 in parallel with the bonding to the spacer 32 of the circuit module. It is electrically joined on the flexible circuit board 31 of the circuit module. Further, in parallel with the joining of the circuit module and the spacer 32, the lowermost spacer 32 is electrically joined onto the base substrate 2 via the anisotropic conductive resin 35 (step S13). In other words, by heating and pressing with the heat tool 9, formation of the laminated module 3 by joining with heating (that is, by thermocompression bonding), and electrical joining to the base substrate 2 of the laminated module 3 by joining with heating ( That is, physical joining and electrical connection) are performed in parallel.

  Here, when the laminated module 3 is regarded as a “circuit component”, in the manufacture of the circuit component laminate (that is, the base substrate 2 and the laminated module 3), the lower surface 322 side of the lowermost spacer 32 that is the component electrode of the circuit component. With the spacer electrode 3241 facing the base substrate electrode 211 of the base substrate 2, the circuit component is pressed against the base substrate 2 by the heat tool 9 abutted on the opposite side of the circuit component to the base substrate 2. And heated. The heat from the heat tool 9 is mainly conducted in the stacking direction by dummy vias penetrating the circuit components, so that the circuit components are bonded onto the base substrate 2 via the anisotropic conductive resin 35 by bonding with heating. Electrically joined to the

  Further, paying attention to the spacer 32 and the circuit module in the lowermost layer, when the spacer 32 and the circuit module are respectively regarded as “first circuit component” and “second circuit component”, the spacer electrode 3241 on the upper surface 321 side of the spacer 32, and The first substrate electrode 3141 on the lower surface 312 side of the flexible circuit board 31 (that is, the component circuit board of the second circuit component) has a first intermediate electrode and a second intermediate electrode positioned between the first circuit component and the second circuit component. It can be said to be an electrode. In addition, the spacer dummy via 325 and the substrate dummy via 315 are regarded as a first heat conducting unit and a second heat conducting unit. In the first circuit component, the first intermediate electrode opposes the second circuit component in the vicinity of the first heat conduction portion, and in the second circuit component, the second intermediate electrode is in the vicinity of the second heat conduction portion in the first circuit component. opposite.

  When the circuit component is electrically bonded to the base substrate 2, the first heat conducting portion of the first circuit component and the second heat conducting portion of the second circuit component are thermally connected, and the first heat The vicinity of the component electrode (that is, the spacer electrode 3241) is heated through the conductive portion and the second heat conductive portion. Furthermore, the first intermediate electrode and the vicinity of the second intermediate electrode are heated via the second heat conducting unit, whereby the first intermediate electrode and the second intermediate electrode are electrically joined. In other words, the first circuit component and the second circuit component are joined by the heat from the second heat conducting unit.

  As described above, in the circuit component laminate of the memory card 1 (ie, the base substrate 2 and the laminate module 3), the dummy vias formed of metal serve as the component electrodes on the base substrate 2 side (ie, the lowermost spacer). 32 is a spacer electrode 3241 on the lower surface 322 side, and is provided continuously through the laminated module 3 in the vicinity of an electrode facing the base substrate electrode 211). In the electrical joining of the laminated module 3 to the base substrate 2, heat from the heat tool 9 is efficiently conducted to the vicinity of the base substrate 2 side of the laminated module 3 and the vicinity of the base substrate electrode 211 through the dummy via. The As a result, the ACF on the base substrate electrode 211 can be efficiently heated to firmly bond the laminated module 3 to the base substrate 2, thereby improving the reliability of electrical bonding of the laminated module 3 to the base substrate 2. be able to.

  In the manufacture of the circuit component laminate, the electrical bonding of the lowermost spacer 32 to the base substrate 2 and the electrical bonding of the plurality of spacers 32 stacked on the base substrate 2 to the plurality of circuit modules are performed by a heat tool. 9 is performed in parallel by a single press by 9. At this time, heat from the heat tool 9 is efficiently conducted in the stacking direction via the dummy vias, and the plurality of ACFs positioned between the plurality of circuit modules and the plurality of spacers 32 and the base substrate electrode 211 The ACF is efficiently heated.

  Accordingly, the ACF having a small distance from the heat tool 9 in the stacking direction (for example, the ACF between the uppermost circuit module and the spacer 32) is not heated excessively (that is, heated at an appropriate temperature). However, an ACF having a relatively large distance to the heat tool 9 (for example, an ACF between the lowermost spacer 32 and the base substrate 2) can be sufficiently heated at an appropriate temperature. In other words, the temperature difference near each electrode due to the difference in the stacking direction distance from the heat tool 9 can be reduced. As a result, the bonding of the lowermost spacer 32 to the base substrate 2 and the bonding of the plurality of spacers 32 and the plurality of circuit modules stacked on the base substrate 2 are performed in parallel while maintaining high bonding reliability. The manufacture of the circuit component laminate (that is, the joining of the laminated module 3 having a laminated structure to the base substrate 2) can be simplified.

  By the way, in a memory card such as an SD memory card, the shape, size, thickness, and the like are usually determined by the standard. Therefore, when increasing the capacity of the memory card, the memory card is not enlarged. It is necessary to increase the capacity. In addition, it is necessary to simplify the manufacturing process in order to reduce the cost for manufacturing the memory card.

  In the circuit component laminate according to the present embodiment, as described above, the circuit component laminate is made large by laminating the flexible circuit boards 31 (that is, circuit modules) each having a plurality of semiconductor chips 33 mounted thereon. It is possible to increase the capacity without increasing the size, and to simplify the manufacture of the circuit component laminate by joining the base substrate 2, the spacer 32, and the circuit module in parallel. Therefore, it can be said that the circuit component laminate according to the present embodiment is suitable for a memory card that is required to have a large capacity and a simplified manufacturing process.

  In the manufacture of the circuit component laminate, the bonding of the spacer 32 to the base substrate 2 and the bonding of the spacer 32 and the circuit module are performed via the anisotropic conductive resin 35, so that the accuracy and reliability are high. Bonding can be performed easily.

  In the circuit component laminate, the spacer 32 is provided between the plurality of circuit modules laminated on the base substrate 2, so that the stacking direction between the base substrate 2 and the flexible circuit board 31 of the lowermost circuit module is increased. The distance and the distance in the stacking direction between the flexible circuit boards 31 of the two adjacent circuit modules can be easily determined, and the formation of the stacked structure of the plurality of circuit modules on the base board 2 can be simplified. it can.

  Further, it is possible to prevent one circuit module from coming into contact with the base substrate 2 and another circuit module. Therefore, the structure of the circuit component laminate is particularly suitable when the semiconductor chip 33 that is required to prevent unnecessary contact with other components is mounted on the flexible circuit board 31, and furthermore, the semiconductor chip 33. Can be said to be more suitable when mounted on the main surfaces on both sides of the flexible circuit board 31.

  In the memory card 1, the substrate via 314 and the spacer via 324 used for transmitting and receiving information are surrounded by the substrate dummy via 315 and the spacer dummy via 325 made of metal in the stacked module 3 of the circuit component stack. . As a result, the substrate dummy via 315 and the spacer dummy via 325 serve as an electromagnetic shield for the substrate via 314 and the spacer via 324, so that the influence of electromagnetic waves on the substrate via 314 and the spacer via 324 can be reduced. As a result, the electromagnetic wave resistance of the memory card 1 can be improved.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to the said embodiment, A various change is possible.

  For example, the substrate dummy via 315 and the dummy via junction 3151 may be integrally formed, and the spacer dummy via 325 and the dummy via junction 3251 may be integrally formed. Further, the dummy via junction 3151 does not necessarily have to be joined to the dummy via junction 3251, and may be thermally connected by the dummy via junctions 3151 and 3251 coming into contact with each other.

  In the circuit module laminate module 3, the semiconductor chips 33 do not necessarily have to be mounted on the main surfaces on both sides of each flexible circuit board 31. For example, the semiconductor chip is only formed on one main surface of each flexible circuit board 31. 33 may be mounted. Alternatively, the flexible circuit board 31 having the semiconductor chip 33 mounted on both main surfaces and the flexible circuit board 31 having the semiconductor chip 33 mounted only on one main surface may be stacked on the base substrate 2.

  In the stacked module 3, the number of semiconductor chips 33 mounted on one main surface of each flexible circuit board 31 is not limited to two, and three or more semiconductor chips 33 are included in one main circuit of each flexible circuit board 31. It may be mounted on the surface. In addition, when the memory card including the circuit component laminate is further smaller than the memory card 1 of the above embodiment (for example, when it is a miniSD memory card or a microSD memory card), one of the flexible circuit boards 31 Only one semiconductor chip 33 may be mounted on the main surface.

  The semiconductor chip 33 mounted on the flexible circuit board 31 is not necessarily a memory device, and may be a control device that controls the memory device, or may be a memory controller combined device. The semiconductor chip may not be a semiconductor chip as a whole as long as it is a chip using a semiconductor.

  Mounting of the semiconductor chip 33 on the flexible circuit board 31 is not necessarily performed using NCF. For example, non-conductive resin paste (NCP (Non Conductive Paste)), ACF or anisotropic conductive resin paste ( ACP (Anisotropic Conductive Adhesive Paste)) may be used.

  The electrical joining of the spacer 32 to the base substrate 2 and the electrical joining of the flexible circuit board 31 and the spacer 32 are not necessarily performed using ACF. For example, ACP, NCF, or NCP is used. It may be done. Even in this case, high-accuracy and high-reliability bonding can be easily performed as in the case of bonding using ACF. In addition, the electrodes of the flexible circuit board 31 and the spacer 32 may be solder bumps, and the bonding may be performed without using a resin material such as ACF.

  In the laminated module 3, instead of the flexible circuit board 31, for example, a rigid board formed of glass epoxy or the like may be laminated on the base board 2 as a circuit board. Further, the plurality of spacers 32 may be omitted, and a plurality of circuit boards may be directly stacked on the base substrate 2.

  In the circuit component laminate, a plurality of flexible circuit boards 31 are not necessarily laminated on the base substrate 2. For example, one spacer 32 is bonded on the base substrate 2, and one circuit module is formed on the spacer 32. The circuit component laminate may be formed by bonding (that is, the flexible circuit board 31 on which the semiconductor chip 33 is mounted). Also in this case, by applying the bonding method according to the above embodiment, the bonding process can be simplified while improving the reliability of bonding. In addition, one circuit component is electrically joined on the base substrate 2, and in parallel with the joining, another component that is electrically separated from the circuit component (disconnected) is placed on the circuit component. It may be joined.

  The circuit component bonding method according to the above embodiment can be applied even when the circuit component bonded to the base substrate 2 does not have a laminated structure. For example, when a circuit component such as a relatively thick electronic component is bonded on the base substrate 2, the circuit component is formed of metal that is continuously provided through the circuit component in the vicinity of the component electrode on the base substrate 2 side of the circuit component. By efficiently conducting the heat from the heat tool 9 to the vicinity of the component electrode through the dummy via (that is, the heat conducting portion), the circuit component can be firmly joined to the base substrate 2 by joining with heating. As a result, the reliability of bonding of circuit components to the base substrate 2 can be improved.

  The memory card 1 according to the above embodiment may be used as a card type recording medium other than the SD card. Further, the circuit component laminate may be used for electronic products other than the memory card. In this case, another semiconductor chip such as a microprocessor may be mounted on the flexible circuit board. Furthermore, the circuit component bonding method according to the above embodiment may be used when various other circuit components are electrically bonded to the base substrate in addition to the spacer, the flexible circuit board, or the electronic component. .

  INDUSTRIAL APPLICABILITY The present invention can be used when various circuit components are electrically joined on a base substrate, and a circuit component laminate in which circuit components are joined on a base substrate, and the circuit component laminate, It can be used for a memory card provided.

Top view of memory card Memory card longitudinal section Longitudinal cross section showing an enlarged circuit component stack Longitudinal sectional view showing a part of the circuit component laminate Bottom view of spacer Bottom view of flexible circuit board Diagram showing the flow of manufacturing circuit component laminates Longitudinal sectional view showing a circuit component laminate in production

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Memory card 2 Base substrate 3 Laminated module 5 Cover part 9 Heat tool 31 Flexible circuit board 32 Spacer 33 Semiconductor chip 35 Anisotropic conductive resin 211 Base substrate electrode 311 Upper surface 312 Lower surface 313 Substrate body 314 Substrate via 315 Substrate dummy via 316 Surface Wiring 323 Spacer body 324 Spacer via 325 Spacer dummy via 3141 First substrate electrode 3151, 3251 Dummy via junction 3241 Spacer electrode S11-S13 Step

Claims (15)

A circuit joining method for joining circuit components on a base substrate,
a) mounting the circuit component on the base substrate with the component electrode of the circuit component facing the substrate electrode of the base substrate;
b) The heat conducting portion is formed by contacting a heat conducting portion formed of metal penetrating the circuit component in the vicinity of the component electrode and electrically separated from the wiring of the circuit component to the heating portion. Heating the vicinity of the component electrode via the electrical connection of the component electrode and the substrate electrode;
A circuit joining method comprising: The circuit joining method according to claim 1,
Before the step a), further comprising a step of applying an anisotropic conductive resin or a non-conductive resin to the component electrode or the substrate electrode;
In the step b), the circuit component is pressed toward the base substrate. The circuit joining method according to claim 1,
The circuit component is
A first circuit component mounted on the base substrate in the step a);
A second circuit component mounted on the first circuit component in the step a);
With
The first circuit component is a part of the heat conduction part and has a first heat conduction part penetrating the first circuit part, and the second circuit component is a part of the heat conduction part. And having a second heat conducting portion penetrating the second circuit component,
In the step b), the first heat conduction part and the second heat conduction part are thermally connected, and the vicinity of the component electrode is heated via the first heat conduction part and the second heat conduction part. Furthermore, the circuit joining method is characterized in that the first circuit component and the second circuit component are joined by heat from the second heat conducting unit. The circuit joining method according to claim 3,
The first circuit component has a first intermediate electrode facing the second circuit component in the vicinity of the first heat conducting portion, and the second circuit component is in the vicinity of the second heat conducting portion in the first circuit. A second intermediate electrode facing the component;
In the step b), the first intermediate electrode and the vicinity of the second intermediate electrode are heated via the second heat conducting portion, whereby the first intermediate electrode and the second intermediate electrode are electrically connected to each other. A circuit joining method characterized by being joined. The circuit joining method according to claim 4,
Before step a)
Applying an anisotropic conductive resin or a non-conductive resin to the component electrode or the substrate electrode;
Applying an anisotropic conductive resin or a non-conductive resin to the first intermediate electrode or the second intermediate electrode;
Further comprising
In the step b), the second circuit component is pressed toward the first circuit component and the first circuit component is pressed toward the base substrate. The circuit joining method according to claim 5,
When the anisotropic conductive resin or the non-conductive resin is applied to the first intermediate electrode or the second intermediate electrode, the different end portion of the first heat conduction part or the second heat conduction part is also provided with the difference. A circuit joining method comprising applying an isotropic conductive resin or the non-conductive resin. A circuit joining method according to any one of claims 3 to 6,
Before the step a), the method further comprises a step of obtaining the second circuit component by mounting a semiconductor chip on both surfaces of the component substrate,
The circuit joining method, wherein the first circuit component is a spacer that is disposed between the base substrate and the component substrate and supports the second circuit component. The circuit joining method according to claim 7,
A circuit bonding method, wherein the semiconductor chip is a memory device. The circuit joining method according to claim 7 or 8,
In the first circuit component, the first heat conducting part surrounds a periphery of a through wiring that penetrates the first circuit component and electrically connects the component electrode and the first intermediate electrode. Circuit joining method. A circuit component laminate,
A base substrate having a substrate electrode;
A first circuit component bonded on the base substrate;
A second circuit component joined on the first circuit component;
With
The first circuit component is
A first component body;
A component electrode electrically connected to the substrate electrode of the base substrate;
A first intermediate electrode provided on a surface of the first component body facing the second circuit component;
A first wiring penetrating the first component body and having one end connected to the component electrode and the other end connected to the first intermediate electrode;
A first heat conducting portion formed of metal penetrating the first component main body in the vicinity of the component electrode and electrically separated from the first wiring;
With
The second circuit component is
A second component body;
A second intermediate electrode electrically connected to the first intermediate electrode of the first circuit component;
A second wiring connected to the second intermediate electrode;
Second heat conduction formed of metal penetrating the second component main body in the vicinity of the second intermediate electrode, electrically separated from the second wiring and thermally connected to the first heat conduction unit. And
A circuit component laminate comprising: The circuit component laminate according to claim 10,
The first circuit component is bonded to the base substrate via an anisotropic conductive resin or a non-conductive resin;
The circuit component laminate, wherein the second circuit component is bonded to the first circuit component via an anisotropic conductive resin or a nonconductive resin. The circuit component laminate according to claim 10 or 11,
The second circuit component is
Component boards,
A semiconductor chip mounted on both sides of the component substrate;
With
The circuit component laminate, wherein the first circuit component is a spacer that is disposed between the base substrate and the component substrate and supports the second circuit component. The circuit component laminate according to claim 12,
A circuit component laminate, wherein the semiconductor chip is a memory device. The circuit component laminate according to claim 12 or 13,
The circuit component laminate according to the first circuit component, wherein the first heat conducting portion surrounds the periphery of the first wiring. A memory card,
The circuit component laminate according to any one of claims 10 to 14,
A cover for covering the first circuit component and the second circuit component on the base substrate of the circuit component laminate;
A memory card comprising: