JP2008198870A - Housing for accommodating electronic components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress more effectively the propagation of vibrations from a reactor. <P>SOLUTION: A housing 50 for accommodating electronic components comprises a case 52 for accommodating a reactor 10, and a cover 54 for covering an opening of the case 52, and fixes the cover 54 and a fixing member 70 that is disposed on the top of the cover 54, wherein an inclusion resin 56 for enclosing the reactor 10 is filled into the case 52. A support member 60 provided on an inner bottom surface 58b secures and supports a predetermined space between the inner bottom surface 58b and the reactor 10. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component housing case having a case for housing an electronic component such as a reactor and filled with a resin for enclosing the electronic component in the case.

  For the purpose of improving the cooling performance of mechanical components such as reactors and improving the mechanical strength, the electronic components are housed in a case, and a resin is poured between the electronic component and the case to enclose it. Yes. The case is usually contacted and fixed directly to a heat radiating member such as a heat sink or via a metal heat radiating cover, etc., and efficiently dissipates heat from the electronic component.

  In addition, from the viewpoint of ease of manufacture, stable support, and the like, electronic components such as a reactor are often fixed and fixed on the upper side of a fixing member as shown in Patent Documents 1 and 2, for example. However, for example, in a moving body such as a hybrid vehicle or an electric vehicle, the mounting space for electronic components is limited, and it is necessary to mount various members in such a limited space, so that electronic components such as reactors are fixed. In many cases, it is arranged below the member (for example, Patent Document 3).

  FIG. 3 shows an example of the electronic component housing case disposed below the fixing member. The reactor 110 shown in FIG. 3 is bolted to a boss 116 provided inside the heat transfer surface 114 above the case 112 to prevent the reactor 110 from dropping off. The heat transfer surface 114 above the case 112 is fastened to a heat sink (not shown) later. An opening 118 is provided in the heat transfer surface 114, and the resin 120 having fluidity is filled into the case 112 from the opening 118.

  The reactor stores electromagnetic energy by causing a current to flow through a coil wound around the core, but vibration may occur due to magnetostriction of the core at that time. In particular, in the electronic component housing case in which the core 122 is bolted as shown in FIG. 3, vibration suppression is still a problem depending on the conditions such as the arrangement location.

JP 2004-95570 A JP 2005-150517 A JP 2004-193322 A

  The present invention is more effective in propagation of vibrations derived from the reactor accommodated in the housing without impairing heat dissipation, particularly in an electronic component housing housing fixed to the lower side of a fixing member such as a heat sink. An object of the present invention is to provide an electronic component housing that can be prevented or suppressed.

  The configuration of the present invention is as follows.

  (1) An electronic component housing that includes a case that has an opening in the upper portion and accommodates a reactor, and a cover that covers the opening of the case, and fixes the cover and a fixing member disposed on the upper portion of the cover The case is filled with an encapsulating resin that encloses the reactor, and a support member is provided on the inner bottom surface of the case to support a predetermined space between the inner bottom surface and the reactor. Provided electronic component housing.

  (2) The electronic component housing case according to (1), wherein the cover is a metal heat dissipation cover, and the fixing member is a heat sink.

  (3) In the electronic component housing case described in (1) or (2) above, at least a part of the case is formed of a resin material that absorbs a volume change of the encapsulating resin. .

  (4) In the electronic component housing case according to any one of (1) to (3), the encapsulating resin has a resin reservoir portion penetrating the cover and has a predetermined height in the resin reservoir portion. An electronic component housing that is filled and cured.

  (5) In the electronic component housing case described in any one of (1) to (4), the supporting member is a protrusion formed of a heat-resistant polymer material. body.

  According to the present invention, propagation of reactor vibration is more effectively prevented or suppressed.

  Hereinafter, it explains in detail using a drawing.

  FIG. 1 is a cross-sectional view schematically showing the configuration of an electronic component housing 50 in the embodiment of the present invention. In addition, the dimension ratio between each member in drawing does not necessarily correspond to the actual dimension ratio between each member.

  In FIG. 1, an electronic component housing 50 includes a case 52 and a cover 54, and defines the shape of the appearance. The case 52 is a box-shaped member having an opening at the top, and the cover 54 is a member that covers the opening of the case 52. The reactor 10 is accommodated inside the case 52, and both terminals (not shown) of the coil 48 are pulled out of the case 52 or the cover 54 by appropriate means. On the other hand, the cover 54 is fixed to a fixing member 70 disposed in the upper part.

  In the present embodiment, the cover 54 is preferably made of a metal material such as aluminum or copper that has high heat dissipation. Further, the thickness of the cover 54 is not particularly limited, and can be appropriately set according to the material to be used. For example, the thickness can be about 8 mm to 10 mm. After the electronic component housing 50 is manufactured, the cover 54 is used by being fixed to the fixing member 70 disposed on the upper part thereof. The fixing member 70 made of an appropriate material that does not hinder heat radiation from at least the electronic component housing 50 is preferably a heat sink that contributes to heat radiation from the electronic component housing 50, particularly from the cover 54. More specifically, the outer surface 54a of the cover 54 and the fixing member (heat sink) 70 are brought into contact with each other and fixed, thereby facilitating heat exchange between the members and improving the heat dissipation of the electronic component housing 50. Is possible. If necessary, it is also preferable to provide a refrigerant flow path 72 through which a refrigerant such as cooling water is circulated to further improve the heat dissipation efficiency. At this time, the higher the contact area between the cover 54 and the fixing member (heat sink) 70, the better the heat dissipation. Is preferred.

  In the embodiment of the present invention, the encapsulating resin 56 is generally made of resin materials having desired insulation and heat resistance, such as epoxy resin, phenol resin, and urethane resin. The encapsulating resin 56 using such a resin material preferably has a predetermined hardness or rigidity at least at room temperature, for example, 25 ° C. or less, in order to stably maintain the reactor 10, but when filled in the case 52, the reactor 10 For example, by appropriate heating at about 60 ° C. to 80 ° C., etc., it is filled with appropriate fluidity so that the details in the case 52 including the vicinity of the surface of the case 52 are sufficiently distributed.

  In order to effectively dissipate heat through the cover 54, it is preferable that the encapsulating resin 56 is reliably in contact with the inner surface 54 b of the cover 54. If there is a gap between the layer of the encapsulating resin 56 and the inner surface 54b of the cover 54, or if the resin is cured in a state where air bubbles are present in the encapsulating resin 56, the heat dissipation is reduced, which is not preferable. For this reason, the encapsulating resin 56 material having appropriate fluidity is gently filled up to a predetermined height (depth) of the case 52, and after removing bubbles in the encapsulating resin 56 material as necessary, the cover 54 is removed. It is preferable to harden so that it may contact the inner surface 54b. The filling of the encapsulating resin 56 may be atmospheric injection performed under normal atmospheric pressure, or so-called vacuum injection in a state where the pressure is reduced to a predetermined absolute pressure. In order to fill the reactor 10 in detail, such as a gap in the vicinity of the coil 48, in particular, it is preferable to perform vacuum injection.

  In FIG. 1, the cover 54 is provided with an opening penetrating in the surface direction, that is, a resin reservoir 62. By filling the encapsulating resin 56 material to a predetermined height in the resin reservoir 62, the encapsulating resin 56 can be reliably brought into contact with the inner surface 54b of the cover 54, and a predetermined amount from the encapsulating resin 56 through the cover 54 can be obtained. It is possible to ensure the heat dissipation. That is, by providing the cover 54 with the resin reservoir 62, it is possible to absorb an error in the filling amount that occurs when filling the encapsulating resin 56 material. It is also possible to use at least one of the resin reservoirs 62 when filling the encapsulating resin 56 material.

  In the present embodiment, the shape of the resin reservoir 62 is not particularly limited. However, in order to absorb the filling amount error, for example, a bowl shape, a cone shape, a funnel shape, or the like on the case 52 side. More preferably, the volume is smaller than the volume on the heat sink 70 side. Further, the size and number of the resin reservoirs 62 can be set as appropriate. From the viewpoint of heat dissipation, for example, the resin reservoirs 62 are arranged so as to maintain at least a void ratio of 80% or more with respect to the cover 54. It is preferable to form.

  In FIG. 1, the case 52 is formed in a box shape having an opening in the upper portion, thereby preventing the reactor 10 from dropping or dropping out of the electronic component housing 50, and encapsulating resin for enclosing the reactor 10. 56 has a structure which can be filled. Further, in order to effectively dissipate the heat generated by the electronic components such as the reactor 10 to the outside, it is possible to use a metal material with high heat dissipation, such as copper or aluminum, in particular from the viewpoint of weight reduction. An aluminum case 52 is preferably used. Further, the thickness of the case 52 is not particularly limited, and can be appropriately set according to the material to be used. For example, the thickness can be about 8 mm to 10 mm. Moreover, as shown in FIG. 1, it is also possible to change the thickness of the bottom part 58 with the coil part of the reactor 10, and the part which does not have a coil, for example.

  As described above, the encapsulating resin 56 is in close contact with the cover 54 and the case 52 and filled so as to seal a gap formed by these members. The case 52 can follow a volume change such as expansion and contraction of the encapsulating resin 56 to some extent by providing a certain degree of flexibility by setting the thickness and shape thereof. However, if the case 52 made of a metal material continues to receive stress accompanying the volume change of the encapsulating resin 56 over a long period of time, it may eventually become a cause of deterioration in a part thereof. Further, the encapsulating resin 56 itself may be deteriorated due to shrinkage bias due to thermal stress. This tendency is particularly remarkable in an environment where the shrinkage of the encapsulating resin 56 is repeated. Therefore, by forming at least a part of the case 52 from a resin material and absorbing the volume change of the encapsulating resin 56, stress associated with the volume change of the encapsulating resin 56 is alleviated and deterioration of the case 52 is prevented. Or it becomes possible to suppress. Here, the “configuration capable of absorbing the volume change of the encapsulating resin 56” may be a configuration that can be deformed according to the volume change of the encapsulating resin 56, that is, the case 52 may be deformed in appearance. Although 52 does not deform in appearance, it may absorb the volume change of the encapsulating resin 56 and relieve stress.

  In the present embodiment, the resin material that can be applied to at least a part of the case 52 is a material that does not melt at least in the operating temperature region of the electronic component housing 50 and has a desired flexibility or flexible resin. It is possible to use suitably the resin material which has. Such a resin material is not particularly limited, and examples thereof include a urethane resin, an epoxy resin, and a silicone resin. Further, in the case 52, a place where such a resin material is suitably disposed is a place that is easily subjected to stress accompanying a change in volume of the encapsulating resin 56, and the configuration of the electronic component housing 50 and the physique of the reactor 10. For example, it is suitable for a portion where the volume change of the encapsulating resin 56 is large, that is, a portion where the distance between the reactor 10 and the case 52 is wide. In another embodiment, the resin material can be applied to the entire side surface of the case 52, and as another embodiment, the resin material is applied to the entire case 52 including the bottom surface.

  On the other hand, in FIG. 1, a support member 60 is provided on the inner bottom surface 58 b of the case 52. The support member 60 supports the reactor 10, positions the reactor 10 in the case 52, particularly in the vertical direction (height direction), and secures a predetermined distance between the inner bottom surface 58 b and the reactor 10. It plays a role.

  By supporting the reactor 10 with the support member 60, it is not necessary to fix the reactor 10 by fastening with a bolt as shown in FIG. 3, for example. For this reason, as shown in FIG. 1, the vibration of the reactor 10 is virtually impossible to propagate through the fixing member 70 such as a heat sink. Furthermore, by reducing the contact area between the reactor 10 and the support member 60, it is possible to more effectively prevent or suppress the propagation of vibration from the support member 60 through the case 52.

  In the present embodiment, the support member 60 may be integrally formed with the inner bottom surface 58b of the case 52, and as another embodiment, a predetermined shape of the inner bottom surface 58b of the case 52 that has been molded in advance. The support member 60 previously molded into a predetermined shape may be adhered to the place with an appropriate adhesive or the like, and the formation method is not limited at all.

  In the present embodiment, the shape of the support member 60 can be a protrusion that contacts the core 46 as shown in FIG. 1, for example, but the wraparound of the encapsulating resin 56 throughout the case 52 is hindered. Any shape can be used as long as it can be filled without any problem. The specific shape may be any shape such as a hemispherical shape, a cone shape, a rib shape, or a column shape. In addition, the contact area with the core 46 in one support member 60 is preferably as small as possible, and the total contact area with the core 46 as the entire support member 60 is preferably as small as possible. It is also possible to design appropriately according to the strength of the support member 60 and the like. Further, the number of the support members 60 can be at least a plurality, for example, four, six, etc., but is not limited to these as long as the reactor 10 can be supported. It is also possible to use 3 or 5 pieces.

  In the present embodiment, the support member 60 uses a metal material such as aluminum or copper, and may be integrally formed with the case 52 as described above, but may be formed of a heat-resistant polymer material. What has been achieved is preferred. As used herein, “a polymer material having heat resistance” means that the reactor 10 can be reliably supported at least at the filling temperature of the encapsulating resin 56 and the electronic component housing 50 including the reactor 10 is heated. The thing which can fully support the reactor 10 is pointed out. For this reason, it can be selected as appropriate depending on, for example, the material of the encapsulating resin 56 and the weight of the reactor 10. Specific examples include polyester-based thermoplastic elastomers such as Hytrel (registered trademark), rubber materials such as ethylene-propylene-diene rubber (EPDM), and silicone rubber. Any material can be used as long as it can support 10. By using such a heat-resistant polymer material having a damping effect peculiar to the polymer material as the support member 60, transmission of vibration from the reactor 10 is further suppressed, which is preferable. is there.

  After the reactor 10 is positioned by the support member 60 provided on the inner bottom surface 58 b of the case 52, the cover 54 covers the opening of the case 52 and is closed. The cover 54 and the case 52 may be fixed by fastening, and can be performed by a known appropriate method such as welding, adhesion, or heat welding.

  An electronic component housing 50 shown in FIG. 1 includes a reactor 10 in which a coil 48 is wound around a core 46. The reactor 10 can accumulate electromagnetic energy by flowing an AC signal through the coil. Therefore, the DC energy of the secondary battery can be changed to AC electromagnetic energy, and this electromagnetic energy can be stored in the reactor 10. The stored electromagnetic energy is stored as high voltage electric energy in the high voltage side capacitor, and is converted into a high voltage AC signal by the inverter circuit.

  FIG. 2 shows an example of a schematic configuration of the reactor 10 accommodated in the electronic component housing 50. In FIG. 2, the reactor 10 includes an annular core 46 formed by connecting a plurality of core materials via spacers, and coils 48a and 48b.

  In FIG. 2, the core 46 includes an arc-shaped or substantially U-shaped core material (hereinafter referred to as U-core material) 12 and 32, and a columnar or substantially I-shaped core material (hereinafter referred to as I-core material) 14. , 34, and spacers 16, 22, 36, 42 are sandwiched. On the other hand, the coils 48a, 48b are wound around the core 46 or coil bobbins 20, 21, which are provided integrally or separately from the core 46 as needed. In FIG. 2, the structures of the coil bobbins 20 and 21 and the coils 48a and 48b provided on the outer periphery of the core 46 are particularly shown in cross section in order to show in detail the structure of the bonding portion between the core material and the spacer and the vicinity thereof. Only the outline of is shown.

  Generally, a reactor used in a vehicle such as a hybrid vehicle can have a structure in which a magnetic gap having a predetermined width is provided between a plurality of core members so as not to reduce inductance. Specifically, as shown in FIG. 2, spacers such as ceramics, 16, 22, 36, and 42 are sandwiched in the gap portions between the core materials 12, 12, 32, and 34, and the adjacent core materials and spacers are sandwiched between them. Are bonded or bonded using an adhesive or the like, and an integrated core 46 can be used.

  As the core material of the reactor 10 shown in FIG. 2, 12, 14, 32, 34, a laminated steel plate made of a plurality of electromagnetic steel plates or a soft magnetic powder whose surface is insulated is mixed with a binder as required, and then predetermined. It is possible to use a powder magnetic core or the like produced by pressure molding at a pressure of, and further sintering or heat treatment if necessary.

  On the other hand, metal materials such as aluminum and copper are preferably used as the coils 48a and 48b. Moreover, when winding a coil after producing a core, it is preferable to make it the thickness or cross-sectional shape which can be wound around a coil bobbin according to the material of the coil to be used. Moreover, when inserting the coil shape | molded previously by the winding shape in a core material or a core conjugate | zygote, in order to suppress damage to a core material or a coil bobbin, the coil material which has flexibility is used suitably.

  By passing a current through the coils 48a and 48b shown in FIG. 2, the magnetic flux flows in an annular shape using the annular core as a magnetic path. The winding directions of 48a and 48b are determined so that the direction of the magnetic flux flowing through the annular core is the same by the current flowing through them. In addition, although the reactor by which the coil was wound by the annular | circular shaped core shown in FIG. 2 was demonstrated as the reactor 10 accommodated in the electronic component accommodating housing | casing 50 shown in FIG. 1, it is not limited to this. The reactor may have other shapes as long as it is a reactor that can generate vibration during operation.

  In FIG. 1, when the reactor 10 is housed in the case 52, the core 46 and / or the coil 48 (coils 48 a and 48 b shown in FIG. 2) do not contact the side surface of the case 52, and the case 52 It is desirable to prevent the core 46 and / or the coil 48 from contacting the inner bottom surface 58b. This is because it is assumed that the horizontal vibration or vertical vibration of the reactor 10 propagates to the case 52 when contacted.

  As described above, according to the electronic component housing in the embodiment of the present invention, the propagation of vibrations derived from the reactor housed inside is more effectively prevented or suppressed without impairing heat dissipation. It becomes possible.

  INDUSTRIAL APPLICABILITY The present invention can be used in an electronic component housing that houses a reactor that has a coil and a core and that can generate vibrations when current is passed through the coil.

It is a figure which shows the outline of a structure of the electronic component housing | casing in embodiment of this invention. It is a figure which shows the outline of a structure of the reactor applicable to the electronic component housing | casing shown in FIG. It is a figure which shows the outline of a structure of the conventional electronic component accommodating housing | casing.

Explanation of symbols

  10 reactor, 12, 32 U core material, 14, 34 I core material, 16, 22, 36, 42 spacer, 20, 21 coil bobbin, 46 core, 48, 48a, 48b coil, 50 electronic component housing, 52 case 54 cover, 54a outer surface, 54b inner surface, 56 encapsulating resin, 58 bottom, 58b inner bottom surface, 60 support member, 62 resin reservoir, 70 fixing member (heat sink).

Claims (5)

A case having an opening at the top and containing a reactor;
A cover covering the opening of the case;
With
An electronic component housing case for fixing the cover and a fixing member disposed on an upper portion of the cover,
The case is filled with an encapsulating resin that encloses the reactor,
An electronic component housing case, wherein a support member is provided on the inner bottom surface of the case to support the case with a predetermined distance between the inner bottom surface and the reactor. The electronic component housing according to claim 1,
The cover is a metal heat dissipation cover,
The electronic component housing case, wherein the fixing member is a heat sink. The electronic component housing according to claim 1 or 2,
At least a part of the case is formed of a resin material that absorbs the volume change of the encapsulating resin. In the electronic component housing case according to any one of claims 1 to 3,
A resin reservoir penetrating the cover;
An electronic component housing case, wherein the encapsulating resin is filled to a predetermined height in the resin reservoir and cured. In the electronic component housing case according to any one of claims 1 to 4,
The electronic component housing case, wherein the supporting member is a protrusion formed of a polymer material having heat resistance.

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