JP2008186844A - Electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus in which highly efficient cooling is realized by improving heat radiation performance, in addition to the need of miniaturization with a simple structure. <P>SOLUTION: The electronic apparatus is configured with a mother board 11, having a substrate connection connector 111 and a vent port formed thereon, is disposed between the front and the rear of an apparatus casing 10; heat sinks 20, 18 are separately provided on both surfaces of a unit substrate 12 attached on the mother board 11, and the heat sink 20 of the unit substrate 12 is housed in a duct member 21; a passage is formed with which air is taken from one end of the duct member 21, positioned on the front of the apparatus casing 10 and the air is forcibly guided to the vent port of the mother board 11 via the heat sink 20 and the air is discharged; and a passage is formed, with which air is taken from the outside from an inlet port of the lower part of the duct member 21 on the front of the apparatus casing 10, and the air is discharged from an exhaust port of the upper part of the duct member 21 of the front of the casing apparatus 10 through the heat sink 18. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic device in which a mother board and a unit substrate such as a communication device installed in a base station are accommodated.

  In general, electronic devices have a so-called board mounting housing structure in which a motherboard is accommodated in a device housing, and a plurality of VME standard unit substrates are connected to the motherboard in an orthogonal manner, for example. There is. In general, a plurality of such electronic devices are used while being stacked on a rack.

  By the way, such an electronic device is required to be cooled by mounting various electronic components, which are heating elements, on a plurality of unit substrates arranged and arranged orthogonal to the motherboard. . Therefore, an intake port is provided on the lower side of the front surface of the rack, and an exhaust port is provided on the upper surface side of the rack and the upper side of the rear surface. The exhaust port of the rack is provided with an exhaust fan. By using this exhaust fan, air from the outside is guided into the equipment casing from the intake port, and the unit board is forcibly exhausted from the exhaust port. A cooling structure that cools the electronic components mounted on is adopted.

  In addition, if the amount of heat generated is increased due to high output of electronic components mounted on the unit board, etc., and it is required to increase the amount of exhaust heat, for example, an air inlet is provided on the lower side of the front for each device housing. Thus, a method has been adopted in which an exhaust port is provided on the upper side of the back surface, and the heat is exhausted independently, thereby increasing the amount of exhaust heat.

  However, the above method has a problem that the device housing becomes large because it is necessary to provide an air circulation space in the device housing itself. This causes a disadvantage that the mounting density on the rack is lowered.

Therefore, in such an electronic device, an air inlet and an exhaust port are provided on the front side and the back side of the device casing, and a through hole for ventilation is provided in a motherboard housed in the device casing. A hole having a heat dissipation structure in which an exhaust port communicates via a duct including an exhaust fan has been proposed (see, for example, Patent Document 1). As a result, an exhaust path, which is an air circulation space in which the exhaust port and the through hole of the motherboard communicate with each other through the duct, is configured in the equipment casing, and the heat of the unit substrate is transferred to the equipment casing through the exhaust path. It is possible to efficiently dissipate heat outside the housing.
JP-A-10-107470

  However, in the above-mentioned electronic device, in order to further promote the heat dissipation efficiency, the heat sink is enlarged to increase the heat dissipation area, and the motherboard has a large through hole so that a sufficient air circulation space is provided. Satisfying the demand for higher output of electronic components because it is difficult to form a large through hole for ventilation on the motherboard in terms of strength and space because it has to be increased in thermal capacity. Having the problem of not being able to.

  The present invention has been made in view of the above circumstances, and has achieved a highly efficient cooling by satisfying the demand for downsizing with a simple configuration and improving the heat dissipation efficiency. The purpose is to provide.

  According to the present invention, a plurality of first air inlets are provided on the front surface, and at least one first air outlet is provided on the rear surface, and disposed on the lower side and the upper side of the plurality of first air inlets on the front surface. And a plurality of board connections, which are accommodated between the device housing provided with the second air inlet and the air outlet and the plurality of first air inlets and air outlets in the device housing. A mother board provided with a plurality of ventilation holes facing the first air intake port in parallel with the connector and the board connection connector; and a heating element mounted on at least one surface; A plurality of unit boards accommodated in the device housing provided with a connection connector to be attached to and detached from the connection connector, a shield case provided on the plurality of unit boards so as to cover the heating elements, and A plurality of first heat sinks that are thermally coupled to the other surfaces of the unit substrates, and a first heat sink that is thermally coupled to the shield case on one surface of the plurality of unit substrates, respectively. A second heat sink through which air guided from the intake port to the second exhaust port is passed, and air is taken from the first intake port and guided to the first heat sink to pass through the ventilation port of the motherboard And the electronic device was comprised with the forced ventilation means which guides air to the said 1st exhaust port.

  According to the above configuration, air is forcibly taken into the first air inlet of the device casing from the outside by the forced air blowing means, and the air is guided between the first heat sinks of the unit substrate and The air is guided to the ventilation port, passes through the ventilation port, and is exhausted from the first exhaust port of the device casing. At the same time, outside air is taken into the second air intake port, the air passes between the second heat sinks of the unit substrate and is exhausted from the second exhaust port, and the unit substrate is routed through two paths. Heat is dissipated.

  Therefore, it is possible to improve the heat dissipation area of the unit board without increasing the size, and the heat of the unit board can be efficiently increased simply by providing a small-diameter vent hole on the motherboard that can ensure the desired strength. Well, since it is possible to exhaust heat outside the equipment casing, it is possible to realize highly efficient heat dissipation while realizing miniaturization.

  As described above, according to the present invention, an electronic device that achieves high-efficiency cooling can be provided with a simple configuration, satisfying the demand for downsizing, and improving heat dissipation efficiency. be able to.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1 and 2 show an electronic apparatus according to an embodiment of the present invention. FIG. 1 shows a state in which, for example, a VME standard unit board 12 is mounted on a mother board 11 arranged in an apparatus housing 10. FIG. 2 shows the state from the front side.

  The device casing 10 is formed, for example, in a box shape with a metal material, and, for example, two exhaust ports 101 constituting a first exhaust port are provided on the back surface thereof with a predetermined interval. A cooling fan 13 constituting forced air blowing means is attached to the exhaust port 101, and the air sucked by the cooling fan 13 is exhausted outside the device housing 10. The exhaust port 101 is not limited to the configuration provided at the two positions on the back surface of the device housing 10, and may be configured as one location.

  In addition, the motherboard 11 is accommodated and disposed in the middle portion of the device housing 10 so as to separate the front surface and the rear surface provided with the exhaust port 101. For example, as shown in FIG. 3, the motherboard 11 is provided with two sets of board connection connectors 111 arranged in two rows at a predetermined interval, and each board connection connector 111 has a rectangular hole structure, for example. A vent 112 is provided.

  For example, a front panel 14 is attached to the front surface of the device casing 10, and an opening 141 is provided in the front panel 14 so as to oppose the board connection connector 111 and the ventilation port 112 of the motherboard 11. As a result, two unit substrates 12 are detachably mounted in the device casing 10 from the opening 141 of the front panel 14 via a guide mechanism (not shown).

  On the one surface of the unit substrate 12, an electronic component 15 that is a heating element is mounted. A connection connector 121 is provided at the tip of the unit substrate 12 so as to be connectable to the substrate connection connector 111 of the mother board 11 (see FIGS. 4 to 6).

  The unit substrate 12 is accommodated in, for example, a shield case 16, and a lid 17 is attached to the opening side of the shield case 16 to be electromagnetically shielded. Here, the electronic component 15 on one side of the unit substrate 12 is electromagnetically shielded by the shield case 16 and the lid 17.

  On the lid 17, a heat sink 18 as a second heat sink is thermally coupled and attached. For example, the heat sink 18 is arranged to form an air passage in the direction of the arrow X from the lower side to the upper side of the device housing 18 (see FIG. 2). For example, the lid 17 is thermally coupled to the electronic component 15 of the unit substrate 12 via a heat transmission path, for example, a heat path material 19 such as a metal material.

  For example, the heat sink 18 may be formed integrally with the lid 17 so as to also serve as the lid.

  A heat sink 20 as a first heat sink is disposed on the other surface of the unit substrate 12 so as to be opposed to the ventilation port 112 of the motherboard 11 and thermally coupled thereto. The heat sink 20 is housed and arranged in a duct member 21 that constitutes a forced air blowing means so as to form an air passage in the arrow Y direction from the front surface to the back surface direction of the device housing 10 (see FIG. 1), for example. The duct member 21 is configured such that one end of the duct member 21 is positioned in the opening 141 of the front panel 14 in a state where the connection connector 121 of the unit board 12 is attached to the board connection connector 111 of the mother board 11 and constitutes a first air inlet. The other end portion is inserted into the ventilation port 112 of the motherboard 11 and arranged.

  The heat sinks 18 and 20 can be configured using fins having various shapes such as a straight shape and a pin shape.

  The unit board 12 is provided with a blank panel 22 on the front side thereof so as to cover the shield case 16 and the heat sink 18. For example, ejector portions 23 are provided at both upper and lower ends of the blank panel 22, and the unit substrate 12 is removed from the device housing 10 by operating the ejector portion 23.

  Here, on the front surface of the equipment housing 10, among the openings formed by the front panel 14 and the blank panel 22, the lower side and the upper side of the duct member 21 are the second air inlet and the air inlet. 24 and the exhaust port 25, so-called natural convection causes external air to be taken in at the intake port 24, and the air is exhausted from the exhaust port 25 through the heat sink 18.

  In the above-described configuration, a plurality of, for example, three, as shown in FIG. 7, the device housing 10 in which the mother board 11 and the two unit substrates 12 are accommodated are arranged on the rack 26 in a stacked manner. For use (however, only one is shown in FIG. 7 for convenience of illustration). The device casing 10 is selectively driven and controlled for use, and in conjunction with the driving, heat is generated from the electronic components 15 of the unit substrate 12, and the heat is applied to the heat sinks 18 and 20 on both sides. Be transported.

  At the same time, the cooling fan 13 is driven and external air is taken in from one end of the duct member 21. Then, the air taken in from one end of the duct member 21 passes through the heat sink 20 and takes heat transported from the unit substrate 12 and is discharged to the back side of the mother board 11 through the other end of the duct member 21. The air is exhausted from the exhaust port 101 of the device housing 10 to the outside through the cooling fan 13.

  At the same time, external air flows from the lower intake port 24 of the duct member 21 in the opening 141 of the front panel 14 of the device housing 10, and the internal air in the device housing 10 is exhausted from the upper exhaust port 25. Natural convection occurs. The air taken in through the air inlet 24 on the lower side of the duct member 21 takes away the heat transferred through the shield case 16 through the space between the heat sinks 18 of the unit substrate 12, and the upper side of the duct member 21. Is exhausted out of the device housing 10 through the exhaust port 25.

  Here, the unit substrate 12 in the device casing 10 is separated from the heatsinks 20 and 18 disposed on both sides of the heat generated by the driving of the unit substrates 12 and is transferred to the heatsink. The heat is exhausted and cooled by the flow.

  As described above, the electronic device includes the motherboard 11 in which the board connection connector 111 and the ventilation port 112 are formed between the front surface of the device housing 10 and the back surface on which the exhaust port 101 is provided. The heat sinks 20 and 18 are separately provided on both surfaces of the unit board 12 to be mounted, and one heat sink 20 of the unit board 12 is accommodated in the duct member 21, and one end of the duct member 21 positioned on the front surface of the device housing 10. The air is taken in through the heat sink 20 and forcibly guided to the ventilation port 112 of the motherboard 11 through the heat sink 20 to form a path for exhausting air from the exhaust port 101 on the back surface of the device housing 10, and the front surface of the device housing 10. The external duct is taken in from the air inlet 24 on the lower side of the duct member 21 and the duct member on the front surface of the equipment housing 10 is passed through the heat sink 18. It was composed of one of an upper side of the exhaust port 25 so as to form a path for exhausting.

  According to this, it is possible to improve the heat radiation area of the unit substrate 12 without increasing the size, and it is also possible to provide a small-sized air vent that can ensure a desired strength for the mother board 11. Since the heat of the unit substrate 12 can be efficiently exhausted to the outside of the device housing 10, it is possible to realize highly efficient heat dissipation while maintaining the miniaturization. It is possible to easily improve the performance of the electronic component 15 to be mounted on the device.

  In the above-described embodiment, the air inlet 24 and the air outlet 25 are arranged on the lower side and the upper side of the duct member 21 on the front surface of the device housing 10, and external air is taken in from the air inlet 24 to heat sink. Although the case where a natural convection path for exhausting air from the exhaust port 25 via 18 has been described, the present invention is not limited to this, and the air is forcibly circulated using a cooling fan (not shown). It is also possible.

  Moreover, in the said embodiment, the lower side and the upper side of the said duct member 21 were comprised as the inlet port 24 and the exhaust port 25 among the opening 141 formed with the front panel 14 and the blank panel 22 of the apparatus housing | casing 10. Although the case has been described, the present invention is not limited thereto. For example, as shown in FIG. 8, the intake window 30 and the exhaust are also provided on the lower side and the upper side of the intake port 24 and the exhaust port 25 on the front surface of the device housing 10. You may comprise so that the window 31 may be provided.

  Furthermore, in the above-described embodiment, the case where the two unit substrates 12 are detachably attached to the mother board 11 has been described. However, the present invention is not limited to this number and can be configured.

  Therefore, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention at the stage of implementation. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

  For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect described in the effect of the invention can be obtained. In such a case, a configuration in which this configuration requirement is deleted can be extracted as an invention.

It is the figure which showed the state which looked at the state which attached the unit board | substrate to the motherboard accommodated and arrange | positioned in the apparatus housing | casing in order to demonstrate the electronic device which concerns on one embodiment of this invention. It is the figure which showed the state which looked at the state which attached the unit board | substrate to the motherboard of FIG. 1 from the front side. FIG. 2 is a diagram showing a schematic configuration of the mother board of FIG. 1. It is the figure which showed the state which looked at the unit board | substrate of FIG. 1 from the front side. It is the figure which showed the state which looked at the motherboard and unit board | substrate of FIG. 1 from the upper surface side. It is the figure which showed the state which looked at the motherboard and unit board | substrate of FIG. 1 from the side surface side. It is the figure which showed the state which has arrange | positioned the apparatus housing | casing of FIG. It is the figure which showed the principal part of the electronic device which concerns on other embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Equipment housing, 101 ... Exhaust port, 11 ... Mother board, 111 ... Board connection connector, 112 ... Ventilation port, 12 ... Unit board, 121 ... Connection connector, 13 ... Cooling fan, 14 ... Front panel, 141 ... Opening, DESCRIPTION OF SYMBOLS 15 ... Electronic component, 16 ... Shield case, 17 ... Cover body, 18 ... Heat sink, 19 ... Heat path material, 20 ... Heat sink, 21 ... Duct member, 22 ... Blank panel, 23 ... Ejector part, 24 ... Intake port, 25 ... Exhaust port, 26 ... rack, 30 ... intake window, 31 ... exhaust window.

Claims (7)

A plurality of first intake ports are provided on the front surface, and at least one first exhaust port is provided on the back surface, and a second is disposed on the lower and upper sides of the plurality of first intake ports on the front surface. A device housing provided with an air inlet and an air outlet;
The device housing is disposed between the plurality of first air intake ports and the air exhaust ports, and faces the first air intake port in combination with the plurality of substrate connection connectors and the substrate connection connector. A motherboard provided with a plurality of ventilation openings,
A plurality of unit boards housed and disposed in the device housing, wherein a heating element is mounted on at least one surface, and a connection connector to be attached to and detached from the board connection connector of the motherboard is provided at a tip portion;
Shield cases provided to cover the heating elements on the plurality of unit boards,
A first heat sink thermally coupled to the other surface of each of the plurality of unit substrates,
A second heat sink provided on one surface of each of the plurality of unit boards and thermally coupled to the shield case, through which air guided from the second intake port to the second exhaust port passes;
Forced air blowing means that takes in air from the first air inlet, guides it to the first heat sink, and guides air to the first air outlet through the vent of the motherboard;
An electronic apparatus comprising:   The forced air blowing means includes a duct member that houses the first heat sink, communicates the first air inlet and the ventilation port of the motherboard, and takes air from the first air inlet through the duct member. 2. The electronic device according to claim 1, wherein the electronic device is formed by a cooling fan that forcibly leads to the first exhaust port through a ventilation port of a motherboard.   3. The electronic device according to claim 1, wherein a plurality of pairs of the second air inlet and the air outlet are arranged with a plurality of first air inlets on a front surface of the device housing interposed therebetween, respectively.   The electronic device according to claim 1, wherein the second heat sink also serves as a lid of the shield case.   5. The electronic device according to claim 1, further comprising a second cooling fan that forcibly guides air from the second intake port to the second exhaust port. 6.   6. The electronic apparatus according to claim 1, wherein the second heat sink is thermally coupled to a heating element of the unit substrate via a heat transmission path.   The electronic device according to claim 1, wherein a plurality of the device casings are separated and stacked on a rack.

Images