JP6241315B2 - Electronic device and electronic communication device - Google Patents

Description

  The present invention relates to an electronic device and an electronic communication device, and more particularly to an electronic device and an electronic communication device including a plurality of electronic circuit boards including a signal processing circuit.

  In various electronic devices, it is very difficult to dissipate heat in a low-profile housing with a height of about 1U (44.5 [mm]) to 2U (88.9 [mm]) by natural air cooling. A forced air cooling method using a heat sink or a natural air cooling method using a heat pipe or the like is employed. FIG. 7A shows an example of a natural air cooling method.

In FIG. 7A, reference numeral 101 denotes an electronic device that stores an electronic circuit board. The electronic device 101 includes a plug-in type electronic circuit board 103 that is detachably stored in a lower part of the casing 102. Reference numerals 104 and 105 denote columns (cabinet rack mounts) each having a U-shaped cross section for holding the electronic device 101 on the outside.
Through the cabinet rack mounts 104 and 105, the electronic device 101 is incorporated in the electronic device apparatus 100 as a main body of the electronic device apparatus 100.

  FIG. 7B illustrates an example of the electronic device 201 in which the electronic circuit boards (203A and 203B) are arranged horizontally and in two layers in the housing 202.

  Then, as shown in FIGS. 7A and 7B, the electronic circuit board 103 or 203A and 203B are horizontally arranged, so that a sufficient mounting area on the circuit board can be secured. There is an advantage that the overall height of the electronic device can be reduced. Here, reference numerals 103a, 103a,... Indicate heat dissipation circuit components.

  On the other hand, when the device height is 3U (133.5 [mm]) or more, for example, as shown in FIG. 8A, a plurality of electronic circuits equipped with a heat dissipation circuit component 103a in the housing 302 of the electronic device 301 are provided. A method of vertically arranging the substrates 303A, 303B, 303C,... (Vertical arrangement method) is employed.

  According to this vertical arrangement method, the mounting area can be sufficiently secured with a plurality of circuit boards 303A, 303B, 303C,..., And further heated by the circuit boards 303A, 303B, 303C,. There is an advantage that the movement of the air to the upper part of the apparatus is accelerated. In FIG. 8A, an arrow A indicates a ventilation path.

  That is, in the substrate vertical arrangement method shown in FIG. 8A, the ventilation path A rises straight from the bottom to the top along the substrates 303A, 303B, 303C,. Compared to the above, natural air cooling is easier, and in many cases, this substrate vertical arrangement method is adopted.

  And in this kind of natural air cooling system, among the various electronic components equipped on each electronic circuit board 103, 203A, 203B, 303A, 303B, 303C,... Ascending current is generated due to the temperature rise by being heated by the heat generated by the component 103a, and the heat is continuously discharged from the upper part of the casing together with the rising air to the outside of the apparatus by the convection generated by the rising air. Yes.

  Therefore, in order to prevent the exhaust heat of other devices housed in the same cabinet from being taken in from the air intakes depending on the environmental requirements of the device installation, Is generally set on the front side and the exhaust side is set on the back side, so that the direction of convection is generally determined.

  FIG. 8B shows a case of an electronic device 401 using a heat pipe or the like as another related technique related to the heat dissipation technique. In the example of FIG. 8B, the heat of the heat radiation circuit component 103a on the electronic circuit board 403 provided in the housing 402 is transferred to the heat radiator (heat radiation fin) via the power transmission member 404A and the heat pipe 404B. ) It is configured to transfer heat up to 405. For this reason, in the example of FIG. 8B, the heat dissipating circuit component 103a and the heat dissipating device 405 on the electronic circuit board 403 are always coupled by the heat pipe 404, whereby heat generated in the heat dissipating circuit component 103a portion. Heat dissipation to the outside is performed. In the figure, arrow A indicates the heat transfer direction.

  Furthermore, Patent Documents 1 to 4 listed below are known as publicly known documents related to the heat dissipation structure for the electronic circuit boards 103, 203A, 303A and the like.

Among these, Patent Document 1 discloses technical content equivalent to the description content of FIG. 8A (technique for mounting an electronic circuit board in a housing), and at the same time, a housing containing the substrate is disclosed. A technique for stacking a plurality of layers is disclosed.
Further, Patent Document 2 discloses a technique for stacking a plurality of cabinets (housings) in which the electronic circuit board is built, without particularly limiting the installation direction of the electronic circuit board.

In addition, in Patent Documents 3 and 4, in addition to the technique equivalent to Patent Document 1, a technique for stacking rack guides for setting a ventilation direction between the casings and the casing and the rack guides are integrated. Technology is disclosed.
Further, each of the above-mentioned patent documents discloses a technique for setting a ventilation path from the lower side to the upper side for each of the stacked cases and for the entire cabinet storing these cases.

Japanese Patent Application Laid-Open No. 64-577797 JP-A-64-72597 JP 2004-235303 A Japanese Utility Model Publication No. 62-158895

  First, in the example of the electronic apparatus 101 (natural air-cooled and low-profile type) equipped horizontally with the electronic circuit board 103 disclosed in FIG. 7A, as shown in FIG. Due to the heat generated by the heat dissipating circuit component 103a, the air around the component rises in temperature, and ascending airflow is generated. The air is lowered again, and heat is radiated by so-called convection in which the air circulates from the outer periphery of the electronic circuit board toward the central heat generating portion. In FIG. 9A, an arrow B indicates an air circulation path.

  On the other hand, in the example of the electronic device 201 in which the electronic circuit boards 203A and 203B disclosed in FIG. 7B are horizontally arranged in two stages, each electronic circuit board 203A and 203B is a motherboard as shown in FIG. 9B. 210 is plug-in connected. In FIG. 9B, reference numerals 205 and 206 denote connection plugs.

  For this reason, the upper electronic circuit board 203B functions in the same manner as in FIG. 7A described above, and heat is released to the outside. However, the lower electronic circuit board 203A is the presence of the upper electronic circuit board 203A. This causes a disadvantage that heat release to the outside is hindered.

  That is, the heat generated in the heat dissipating circuit component 103a of the lower electronic circuit board 203A is greatly suppressed due to the fact that the upper electronic circuit board 203B includes the heat dissipating circuit component 103a. In addition, the configuration condition of the plug-in connection structure with respect to the motherboard 210 also overlaps, so that the heat release from the heat radiation circuit component 103a mounted on the lower electronic circuit board 203A is confined in the upper space of the electronic circuit board 203A. It is difficult to dissipate heat outside the housing through the body 202 (see FIG. 9B).

  In other words, when the electronic circuit board is accommodated in a plurality of stages as shown in FIG. 9B, the heat dissipation of the lower electronic circuit board (for example, 203A) is particularly high. Since it is hindered by the substrate (for example, 203B), it is difficult to dissipate heat from the top of the housing 202 to the outside of the housing 202.

In the plug-in connection structure shown in FIG. 9B, plug-in cards (electronic circuit boards) 203A and 203B are inserted and removed from the front surface 202A of the apparatus, and the mother board to which the plug-in card is connected inside the apparatus. 210 is installed in advance. As shown in the figure, the mother board 210 is installed in a direction perpendicular to the plug-in cards 203A and 203B to be inserted and removed in the horizontal direction, and is installed in parallel with the apparatus back surface 202B.
For this reason, particularly when the rear surface 202B of the apparatus is used as an exhaust surface (surface provided with an exhaust port), the presence of the mother board 210 in the related technology of FIG.

  Furthermore, the heat dissipation technique of the method of FIG. 8B in which the heat on the substrate side is transferred to the radiator (radiation fin) 405 via a heat pipe or the like is the radiation circuit component 103 a on the electronic circuit board 403 and the radiator 405. Is a heat dissipation structure that is unsuitable for an electronic device having a plug-in connection structure in which an electronic circuit board is inserted into and removed from the casing because the heat pipe 404 is always coupled.

  On the other hand, each of the heat dissipation techniques disclosed in each of the above-mentioned patent documents 4 to 4 has attempted to solve the problem in the case where the electronic circuit board is arranged vertically or in the entire housing housing the electronic circuit board. The contents are not related to the above inconveniences caused when the electronic circuit board is horizontally arranged.

(Object of invention)
The present invention improves the inconveniences of the related art, and in particular, even when a plurality of electronic circuit boards are stacked at a predetermined interval, the lower electronic circuit board can smoothly dissipate heat. An object of the present invention is to provide an electronic device and an electronic communication device with improved durability.

In order to achieve the above object, an electronic apparatus according to the present invention includes a plurality of electronic circuit boards for signal processing, and an apparatus main body (housing) in which each electronic circuit board is built horizontally and divided into a plurality of stages. And an electronic device comprising a lower intake port and an upper exhaust port respectively provided on a front plate and a back plate of the device main body, and a mother board for connecting each electronic circuit board with a connector,
Each electronic circuit board is equipped with a connector for each electronic circuit board on the motherboard installed on the back plate side in advance while being detachably equipped from the front side of the apparatus main body,
A ventilation area is provided on both sides of each connector, and a ventilation area corresponding to the upper exhaust port is provided at the top of the motherboard.

  In order to achieve the above object, an electronic communication device according to the present invention incorporates a signal processing circuit for signal communication into each electronic circuit board included in the electronic device and incorporates the signal processing circuit. The configuration is such that the electronic device is equipped as a signal processing unit of the communication device main body.

  Since the present invention is configured as described above, according to this, the electronic circuit board installed in the lower stage is continuously air-cooled together with the electronic circuit board on the upper stage side. Even when the electronic circuit boards (small circuit boards) are stacked at a predetermined interval, the lower electronic circuit board can be smoothly radiated, and the heat resistance and durability of the entire apparatus can be improved. An excellent electronic device and electronic communication device can be provided.

1 is a partially exploded schematic perspective view showing an embodiment of an electronic device according to the present invention. It is explanatory drawing which shows the outline | summary (basic content) of the ascending air flow and intake / exhaust in a housing | casing with the electronic device in FIG. It is the front view seen from the M direction in the electronic device in FIG. 1 in a state where the front plate is removed. FIG. 4 is a sectional view taken along line IV-IV in FIG. 3. It is sectional drawing along the VV line of FIG. FIG. 6A is a diagram illustrating a part of the air flow (convection state) on the electronic circuit board in FIG. 3, and FIG. 6A is a diagram illustrating the ventilation flow when the air heated on the lower electronic circuit board is directed upward. FIG. 6B is an explanatory diagram showing the flow of air on the electronic circuit board in each layer and the overall air flow in the housing. FIG. 7A is an explanatory diagram showing an example of a case where a one-stage electronic circuit board of an electronic device equipped in the electronic communication device is detachably accommodated, and FIG. B) is an explanatory view showing an example of an electronic device when two-stage electronic circuit boards are stacked and stored. FIG. 8A is a diagram illustrating an air cooling structure of an electronic circuit board provided in another electronic device in the related field, and FIG. 8A is an explanatory diagram illustrating an example of a system (vertical layout system) in which a plurality of electronic circuit boards are vertically disposed. FIG. 8B is an explanatory diagram showing an example in which the heat dissipation portion of the electronic circuit board is connected to the heat dissipation fin via the heat pipe. FIGS. 9A and 9B are diagrams showing the rising airflow and convection generated around the heat dissipation circuit component on the electronic circuit board and the state of heat dissipation to the outside. FIG. It is explanatory drawing which shows an air cooling structure.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
First, the general outline of the present invention will be described, and then the specific contents will be described.

[Outline of Embodiment]
The present invention relates to an electronic device 1 installed in a cabinet rack mount type electronic communication apparatus, and is stacked in a plurality of stages (two stages of a lower stage and a middle stage in the present embodiment) in a stacked state within a casing 2 of the apparatus, for example, FIG. As shown to (B), it is related with the thermal radiation structure in the case of thermally radiating the electronic circuit board 3 (3A, 3B) horizontally plug-in-connected by a natural air cooling system.
And it mainly improves the inconvenience in the related field shown in FIG. 7A, and is applied to a low-profile housing 2 having a height of about 1U (44.45mm) to 2U (88.9mm). Is for.

Further, in the heat radiation structure of the electronic device 1 according to the present embodiment using the natural air cooling method, as shown in FIG. 6B, after the outside air is sucked from the intake ports K1 and K2 of the housing 2, it goes to the exhaust port H1. The front intake plate K1 and K2 are provided in the lower part of the front plate 2A of the apparatus and the exhaust port H1 is provided in the upper part of the rear plate 2B of the apparatus. Realized rear exhaust.
Further, the mother board 4 for connecting the electronic circuit boards 3A and 3B by connectors is arranged on the back plate 2B side.

Here, a ventilation path of the air flow that realizes the above contents is shown below.
First, the upward air flow generated by the heat generation of the electronic circuit boards 3A and 3B causes the air to flow toward the negative pressure generated around the heat dissipation circuit component (heat generation component) 103a. As described above, the intake ports K1 and K2 are provided. As a result, the air compressed in the upper part of the apparatus by the rising air current is pushed out toward the exhaust port H1 installed in the upper part of the back side of the apparatus and discharged toward the outside.

In addition, since the electronic circuit boards 3A and 3B are horizontally installed in a plurality of stages (two stages) and a pass area (venting area) for allowing the upward air flow to pass through is appropriately provided between the motherboard 4 and the electronic circuit board in the lower layer The heat dissipation of the substrate 3A reaches the upper part in the device housing 2. FIG. 6A shows a case where the upper-layer electronic circuit board 3B is composed of four small circuit boards 3B ₁ , 3B ₂ , 3B ₃ , 3B ₄ .

  Furthermore, the motherboard 4 can be connected to a plug-in card (electronic circuit board) without obstructing the movement of the exhaust heat by opening a part of the upper part through which the exhaust heat passes. At the same time, a connector having a width smaller than the width of each electronic circuit board is pre-selected and equipped for the connector to be provided for the connection of the connector, thereby setting the pass area (venting area) in the connector portion. Air permeability from below is secured.

In this case, the connector of the electronic circuit board 3B is an electronic circuit board (small circuit boards 3B ₁ , 3B ₂ , 3B) divided in the present embodiment or divided on the same surface according to the form of the electronic circuit board 3B. ₃ and 3B ₄ ), and a plurality of them are equipped and used. When the electronic circuit board 3B is constituted by a single piece, a single connector may be used for connection to the mother board 4.

[Specific contents]
Next, this embodiment will be described more specifically.
1 to 6, the electronic device 1 according to the present embodiment includes a plurality of signal processing electronic circuit boards 3A and 3B arranged in two stages as described above, and the electronic circuit boards 3A and 3B. And the lower intake ports K1, K2 provided on the front plate 2A and the back plate 2B of the housing (device main body) 2 as described above, respectively. An upper exhaust port H1 and a mother board 4 for connecting the electronic circuit boards 3A and 3B by connectors are provided.

  Among these, the upper exhaust port H1 provided in the upper part of the back plate 2B is configured with a plurality of ventilation holes formed in a horizontal row in the upper part of the back as shown in FIGS. As a result, the exhaust from each of the electronic circuit boards 3A and 3B is performed uniformly without being biased toward the specific region.

  The lower intake ports K1 and K2 described above are also configured with a plurality of vent holes formed in a horizontal row at the lower part of the front surface, similarly to the upper exhaust port H1. In this case, the entire intake opening area of each of the lower intake ports K1 and K2 is set to be larger than the entire exhaust opening area of the upper exhaust port H1 described above.

As a result, even if the temperature inside the casing advances and the heated air inside is rapidly exhausted as the rising air flow increases, the intake of the cooling air from the lower intake ports K1 and K2 can sufficiently follow. Yes.
In this embodiment, the lower air inlets K1 and K2 of the front plate 2A are divided into two portions corresponding to the electronic circuit boards 3A and 3B at each stage, but are provided at one place on the lower stage side. It may be.

  Here, the positional relationship between the lower intake ports K1 and K2 and the upper exhaust port H1 and the basic form of the passage path of the intake air passing through the housing 2 are shown in the state of the rising airflow on the heat dissipation circuit component 103a. Including FIG.

  Also, the lower intake ports K1 and K2 that have risen are configured with a plurality of small ventilation holes that are each formed in a horizontal row in the same manner as the upper exhaust port H1 described above. The entire opening area of each lower intake port K1, K2 is set larger than the entire opening area of the upper exhaust port H1 described above.

  In FIG. 2, in order to clarify the passage path of air for air cooling, one lower intake port K is used instead of the lower intake ports K1 and K2, and one electronic circuit board is used instead of the electronic circuit boards 3A and 3B. The case where 3 was equipped was illustrated.

Further, in FIG. 2, reference numeral F <b> 1 indicates a negative pressure region generated on the heat dissipation circuit component 103 a due to the rising airflow on the heat dissipation circuit component 103 a. Reference numeral F2 denotes a negative pressure region generated in the upper exhaust port H1 due to the rising airflow discharged from the upper exhaust port H1 to the outside.
The two negative pressure regions F1 and F2 allow the heated air in the housing 2 to be accelerated in the aeration direction so that natural diffusion from the upper exhaust port H1 to the outside is quickly performed. .

Of the electronic circuit boards 3A and 3B, in the present embodiment, as described above, the lower electronic circuit board 3A is composed of one circuit board, and the upper electronic circuit board 3B is on the same plane. And four small-width circuit boards 3B ₁ , 3B ₂ , 3B ₃ , 3B ₄ that can be individually inserted into and removed from the connector on the mother board 4 side (see FIG. 3 and FIG. 3). 5).

For this reason, the connector 5B for the electronic circuit board 3B described above includes four connectors 5B ₁ , 5B ₂ , 5B ₃ , 5B ₄ corresponding to the narrow circuit boards 3B _{1 to} 3B ₄ in this embodiment, These are arranged at corresponding positions on the mother board 4 side.
In addition, the connector 5A for the electronic circuit board 3A described above actually includes two connectors 5A ₁ and 5A ₂ , which are arranged at corresponding positions (connector connection) between the motherboard 4 and the connector 5A. .

Further, on both sides of each of the connectors 5A ₁ , 5A ₂ , 5B ₁ , 5B ₂ , 5B ₃ , 5B ₄ , there are provided ventilation regions that communicate from below to above. Further, in the present embodiment, a ventilation region 4K corresponding to the upper exhaust port H1 is provided in the upper part of the mother board 4.

  The upper ventilation region 4K of the mother board 4 is set to an appropriate size by forming the height of the mother board 4 lower than the height of the ceiling of the casing 2 described above in this embodiment. It is also possible to make the height of the mother board 4 equal to the height of the ceiling of the housing 2 and provide a vent hole equivalent to the exhaust port H1 in the upper end portion of the mother board 4 so as to serve as the upper vent region 4K.

For this reason, in this embodiment, the air sucked from the lower inlets K1 and K2 of the front plate 2A cools the electronic circuit boards 3A and 3B (3B _{1 to} 3B ₄ ) installed horizontally and is heated and exhausted. Move towards mouth H1. Then, the air on the upper side of the electronic circuit board 3B (3B ₁ to 3B ₄₎ as it is to the upward, and the air on the lower side of the electronic circuit board 3A each of the upper connector _{(5B 1, 5B 2, 5B} 3 , 5B ₄ ) ascending along the mother board 4 from the gaps on both sides or between the narrow circuit boards 3B _{1 to} 3B ₄ as shown in FIG. It merges, passes through the ventilation region 4K at the top of the motherboard 4, and is discharged to the outside from the upper exhaust port H1 of the back plate 2B.

Accordingly, the electronic circuit board 3B (3B _{1 to} 3B ₄ ) disposed in the upper stage is air-cooled as well as the entire electronic circuit board 3A disposed in the lower stage. The heat resistance and durability of the entire apparatus are improved.
Although the case 2 described above exemplifies the case where the electronic circuit board is housed and held in two stages, it may be configured to be equipped in three or more stages.

Further, in the present embodiment, the connectors 5A ₁ , 5A ₂ , 5B _{1 to} 5B ₄ described above are selected in advance as connectors having a width smaller than the width of the corresponding electronic circuit boards 3A, 3B _{1 to} 3B _4. Equipped. Thus, as described above, the updraft is heated on the lower side of the electronic circuit board 3A, along both sides of the gap of the connector to the motherboard 4, and mutual of the upper narrow circuit board 3B ₁ to 3B ₄ Thus, the air is smoothly vented upward, whereby natural air cooling inside is performed.

Here, as a plug-in card (electronic circuit board) equipped in the low-profile electronic device 1 described above, in relation to the operation function of the electronic communication device actually installed, system monitoring control and line signal A circuit having a main card (electronic circuit board 3A) that performs switching and a plurality of line cards (small circuit boards 3B _{1 to} 3B ₄ ) that serve as interface for line signals is equipped. .
In this case, the line cards (small circuit boards 3B _{1 to} 3B ₄ ) are configured as individual cards for each signal transmission speed and type, and the interface can be changed by replacing the line cards.

  For this reason, in this embodiment, it is possible to provide flexible services to consumers by driving the system freely by accommodating more line card slots in advance.

In addition, in order to provide the electronic device 1 with a plurality of line card slots, each card is held between the line cards (small circuit boards 3B _{1 to} 3B ₄ ), and a connector is connected to the mother board 4. A substrate guide mechanism for execution is provided. The same applies to the main card (electronic circuit board 3A).
This will be specifically described below.

[Substrate guide mechanism and electronic circuit board]
In FIG. 1, the housing 2 includes a pair of plate-like outer upright slot guides disposed inside and facing each other on the left and right side plates of the housing 2 at a predetermined distance S _1. 11 and 12 are provided.

The outer upright slot guides 11 and 12 are configured to hold part or all of the electronic circuit boards disposed between the outer upright slot guides 11 and 12. Specifically, in the present embodiment, the lower electronic circuit board 3A is held at both ends by the outer upright slot guides 11 and 12 as will be described later, and is the middle electronic circuit board 3B. Of the four narrow circuit boards 3B ₁ and 3B ₄ , _one side of the narrow circuit boards 3B ₁ and 3B ₄ located on the outer upright slot guides 11 and 12 side becomes the outer upright slot guides 11 and 12 as will be described later. It is supposed to be retained.

  Although not adopted in the present embodiment, as a modification, for example, the electronic circuit board 3B is formed as a single piece in the same manner as the lower electronic circuit board 3A, and inner upright slot guides 21 to 26 described later are unnecessary. Also good.

  Further, each of the outer upright slot guides 11 and 12 is arranged such that the front end surface on the back side faces the mother board 4 described above, and the air circulation space (venting area) P between the mother board 4 and the outside. (Refer to FIG. 4 and FIG. 5).

Further, both ends of the electronic circuit board 3A are respectively held in the lower area on the opposite surface side of the outer upright slot guides 11 and 12, and the electronic circuit board 3A reciprocates toward the motherboard 4 on the back side. Guide members 11A and 12A having U-shaped cross sections for guiding the movement are provided (see FIG. 4).
The outer upright slot guides 11 and 12 and the guide members 11A and 12A constitute a lower side substrate guide mechanism.

  Further, a connector receiving portion for connecting the electronic circuit board 3A inserted along the guide members 11A and 12A to the mother board 4 at a height position equivalent to the installation position of the guide members 11A and 12A. 13a and 14a are equipped. Further, connector engaging portions 13b and 14b for connecting the connectors to the connector receiving portions 13a and 14a are respectively provided on the electronic circuit board 3A described above (see FIG. 4).

The 13a, 14a, and 13b, 14b constitute two sets of connectors 5A ₁ and 5A ₂ for connecting the electronic circuit board 3A to the mother board 4 at two locations.

  Here, the connector receiving portion 13a and the connector engaging portion 13b may be originally provided to be opposed to each other in a concentrated manner, but in the present embodiment, the above-described ventilation space (venting region) P portion is uniform. In order to maintain the air permeability, it is configured to be installed in two places with a predetermined interval.

  As a result, the electronic circuit board 3A is detachably engaged with the mother board 4 while holding the predetermined ventilation space P between the electronic circuit board 3A and the mother board 4 located on the back plate 2B side in the housing 2. Thus, the air permeability in the vertical direction in the mother board 4 region is ensured and necessary information is exchanged.

On the electronic circuit board 3A, there are three sets of plate-like members which are located between the outer upright slot guides 11 and 12 described above and are arranged in parallel to the outer upright slot guides 11 and 12 and constitute a pair. The inner upright slot guides 21, 22, 23, 24, 25, and 26 are implanted.
Each inner upright slot guides 21 to 26 functions in cooperation with the outer upright slot guides 11 and 12 described above, narrow circuit board 3B ₁ to the 3B ₄ individually are arranged in the upper part of the electronic circuit board 3A holds (See FIG. 3).

  Here, the inner upright slot guides 21 to 26 and the outer upright slot guides 11 and 12 are set to have the same height position on the upper end surface thereof and the height of the ceiling surface inside the casing 2 (device main body). Thus, a ventilation space TK is set between the upper end thereof and the ceiling surface of the housing 2 (see FIG. 4).

Further, the inner upright slot guides 21 and 22 described above have a separation distance S ₁ equivalent to the separation distance S ₁ between the outer upright slot guides 11 and 12 and the side plate of the housing 2. It is arrange | positioned facing. The same applies to the other inner upright slot guides 23, 24 and 25, 26 (see FIG. 3).

The three sets of inner upright slot guides 21, 22, 23, 24, 25, and 26 have a space in the opposing surface specified through the separation distance S ₁ , respectively, and the lower electronic circuit board 3 A described above. It constitutes a heat dissipation passage for In this case, FIG. 6A shows a partial movement state of the heated updraft generated on the electronic circuit board 3A.
In FIG. 6A, the outer upright slot guides 11 and 12 and the inner upright slot guides 21 to 26 are not shown.

The three sets of inner upright slot guides 21, 22, 23, 24, 25, and 26, as shown in FIG. It has a function of holding the _four small circuit boards 3B _{1 to} 3B ₄ disposed on the same surface on the upper surface side of 3A individually and detachably.

Specifically, the three sets of inner slot guides 21,22,23,24,25,26 is the middle portion of its external face, each narrow circuit board 3B ₁ to 3B ₄ the four mentioned above Guide members 21B, 22B, 23B, 24B, 25B, and 26B having a U-shaped cross-section for individually and reversibly moving toward the mother board 4 are provided.

  Correspondingly, the guide members 11B and 12B having a U-shaped cross section are formed on the same surface as the guide members 21B to 26B on the upper side of the opposed surface side of the outer upright slot guides 11 and 12 described above. Equipped.

Thus, narrow circuit board 3B ₁ described above is held by the guide member 11B and 21B, also narrow circuit board 3B ₂ is held by the guide member 22B and 23B, further narrow circuit board 3B ₃ is held by the guide member 24B and 25B Furthermore, the narrow circuit board 3B ₄ is held by the guide members 26B and 12B, and at the same time, the narrow circuit boards 3B _{1 to} 3B ₄ are individually allowed to reciprocate toward the mother board 4 described above. The state is set (see FIGS. 3 and 4).

  The inner upright slot guides 21 to 26 described above and the guide members 21B to 26B installed therein, the outer upright slot guides 11 and 12 described above, and the guide members 11B and 12B installed therein are provided. The upper side substrate guide mechanism is configured.

Further, a narrow circuit inserted individually along the guide members 11B, 21B to 26B, 12B on the side of the mother board 4 at a height position equivalent to the installation position of the guide members 11B, 21B to 26B, 12B. Connector receiving portions 31a, 32a, 33a, 34a for connecting the boards 3B _{1 to} 3B ₄ to the connectors are provided.
The connector engaging portion 31b for engaging individually the respective connector receiving portion 31a to 34a, 32 b, 33b, 34b is, the narrow circuit board 3B ₁ to 3B ₄ that corresponding previously described, are equipped respectively (See FIGS. 3 and 4).

The connectors 5B ₁ , 5B ₂ , 5B ₃ , and 5B ₄ described above are configured by combinations of the connector receiving portions 31a to 34a and the corresponding connector engaging portions 31b to 34b.

Here, each of the connector receiving portions 31a to 34a and the corresponding connector engaging portion 31b to 34b in this, is used those of the corresponding said width smaller than the width of the narrow circuit board 3B ₁ to 3B ₄ Yes.

Thus, the narrow circuit board 3B ₁ to 3B ₄ is internally between at the back side of the motherboard 4, releasably engage individually on the motherboard 4 while maintaining a predetermined ventilation space (vent region) P Thus, the air permeability in the vertical direction in the mother board 4 region is ensured, and necessary information can be exchanged with the mother board 4 side.
(See Figure 4)

  Further, the inner upright slot guides 21 to 26 and the outer upright slot guides 11 and 12 are uniformly locked with the inner upright slot guides 21 to 26 and the outer upright slot guides 11 and 12 and between the opposing surfaces. End locking members 41 and 42 for setting the distance to be constant.

  Specifically, the end locking members 41 and 42 are formed by a common plate-like cross member made of a narrow plate member, and the inner upright slot guide is in a state where the contact portions partially cross each other. 21 to 26 and the outer upright slot guides 11 and 12 are provided on the front side and the back side.

Further, in the present embodiment, the end locking members 41 and 42 are equipped such that both left and right end portions thereof are in contact with the left and right side walls in the casing 2 described above. The positions between the end portions including the upper end portions of 21 to 26, 12 are fixed, and the distance between the opposing guide members is fixed at this point, so that the electronic circuit board 3A and the narrow circuit board 3B _{1 to} The individual insertion and separation of 3B ₄ and the connector connection with the mother board 4 described above can be smoothly executed, and the maintainability and durability of the entire apparatus are ensured.

The end locking members 41 and 42 may be disposed on the end face portions of the front plate 2A or the back plate 2B of the inner upright slot guides 21 to 26 and the outer upright slot guides 11 and 12. In this case, each end locking member 41, 42 may be configured to be screwed to the front plate 2 </ b> A or both side portions of the housing 2.
Moreover, about this edge part locking member 41 and 42, although the case where it arrange | positioned in two places was illustrated in this embodiment, it may be one place. The end locking members 41 and 42 may be fixedly mounted on the ceiling portion of the inner surface of the housing 2.

[Heat dissipation operation]
Next, the natural air cooling operation of the entire apparatus with respect to the electronic circuit boards 3A and 3B built in the electronic apparatus 1 in the above embodiment will be described with reference to FIGS.

First, when the temperature of each heat radiation circuit component 103a mounted on the electronic circuit board 3A and the small circuit board 3B (3B _{1 to} 3B ₄ ) is increased when the entire apparatus is set to an operating state, the upper portion of each heat radiation circuit component 103a is increased. ambient air is heated, for example, increased as indicated by the arrow a ₀ in FIG. 2, the radiator circuit negative pressure region F ₁ to the upper part 103a is generated.

The negative pressure region F ₁ is formed on the upper narrow circuit boards 3B _{1 to} 3B _{4 and} between the inner slot guides 21 and 22 described above (between 23 and 24 and between 25 and 26). ), and even on an electronic circuit board 3A of the narrow circuit lower surface side of the substrate 3B ₁ to 3B _4, similarly it occurs.

Next, when the negative pressure region F ₁ is generated from the inside of the negative pressure in the sucked air inlet provided on the front surface of the housing 2 and K (K1, K2), the outside air is drawn as arrow A ₁ (See FIGS. 2 and 6B).
Subsequently, by inhalation of ambient air, the narrow circuit board 3B ₁ to 3B ₄ parts of the upper side, heated air rises in the rising air is pushed out from the exhaust port H1 to the outside is accelerated.

  On the other hand, a part on the lower electronic circuit board 3A, for example, between the inner slot guides 21 and 22 described above (between 23 and 24 and between 25 and 26) is heated in this part. The air rises as it is toward the ceiling in the housing by the outside air sucked in under negative pressure.

The lower side another part on the electronic circuit board 3A (i.e., narrow lower side region of the circuit board 3B ₁ to 3B ₄ the upper side) heated air, like housing back by the outside air sucked by the negative pressure pushed to the motherboard 4 side of the side, top to rapidly move a rise through the vent region airflow on both sides of the connector portion, with the updraft of narrow circuit board 3B ₁ to 3B ₄ parts of the upper side, accelerated by the exhaust port H1 Is pushed out from the outside.

At the same time, in the spatial domain of the exhaust port H1, the release and transfer of the heated air, negative pressure region F ₂ is generated around the heating air of the ceiling portion of the housing 2, the suction force of the negative pressure region F ₂ Is further accelerated to suck the heated air inside and discharge it from the exhaust port H1 to the outside.

Hereinafter, runs this state is continuously, whereby the interior of the heated air is continuously discharged to the outside without remaining in the housing, during which slight circuit board 3B ₁ to 3B ₄ of the upper side is natural cooling At the same time, the entire lower electronic circuit board 3A is continuously and naturally air-cooled.

Here, in the above-described embodiment, the heat dissipation structure intended for the electronic circuit board incorporated in the electronic device 1 and the heat dissipation circuit component 103a on the substrate has been described for the assumed electronic device 1 as a whole. You may comprise this so that it may apply to other electronic devices including a communication apparatus.
For example, a signal processing circuit for information communication is incorporated in each electronic circuit board 3A and the small circuit boards 3B _{1 to} 3B ₄ provided in the electronic apparatus 1, and the electronic apparatus incorporating the signal processing circuit is electronically communicated. You may make it equip as a signal processing part of an apparatus.

  Here, with respect to the inner slot guides 21 to 26, a vent hole is formed in the lower region near the lower electronic circuit board 3A to take in the heated rising air from the electronic circuit board 3A and send it upward. May be. This is convenient because the lower electronic circuit board 3A can be air-cooled more effectively.

  Further, in the present embodiment, the mother board 4 and the upright slot guides 11 and 12 described above are configured to be fixed to the casing 2 via L-shaped members, but are directly fixed to the bottom of the casing 2 by other fixing methods. You may comprise. Further, the inner slot guides 21 to 26 are configured to be fixed on the electronic circuit board 3A by the engaging means using the long holes provided in the lower electronic circuit board 3A described above. You may comprise so that it may fix on 3 A of electronic circuit boards.

[Effect of the embodiment]
In the present embodiment, since the electronic device 1 is configured and functions as described above, according to this, the air taken in from the lower inlets K1 and K2 of the front plate 2A of the housing 2 is a plurality of horizontally installed electronic devices. after cooling the circuit board 3A and the marginal circuit board 3B ₁ to 3B ₄ radiating circuit components 103a together, air from the electronic circuit board of the heated air rises immediately (especially lower side to the motherboard from the gap on both sides connector portion The upper and lower airflows merge in the ventilation area TK at the top of the motherboard, pass through the ventilation area TK, and are discharged to the outside from the upper exhaust port H1 of the back plate 2B.
As a result, the entire electronic circuit board 3A laminated on the lower side is also continuously air-cooled. In particular, even when a plurality of narrow circuit boards are laminated on the upper stage at a predetermined interval, the lower electronic circuit board 3A The substrate 3A can smoothly dissipate heat, and an excellent electronic device and electronic communication device that can improve the heat resistance and durability of the entire device can be obtained.

About the embodiment mentioned above, if the summary of the novel technical content is put together, it will become as the following additional remarks.
In addition, about this supplementary note, this invention is not limited to this.

(Appendix 1)
Provided on a plurality of electronic circuit boards for signal processing, an apparatus main body (housing) in which each electronic circuit board is incorporated horizontally and divided into a plurality of stages, and a front plate and a back plate of the apparatus main body. An electronic device comprising a lower intake port and an upper exhaust port, and a mother board for connecting the electronic circuit boards by connectors,
Each electronic circuit board is equipped with a connector for each electronic circuit board on the motherboard installed on the back plate side in advance while being detachably equipped from the front side of the apparatus main body,
2. An electronic apparatus comprising: a lower-stage ventilation area provided on both sides of each connector; and an exhaust ventilation area corresponding to the upper exhaust port provided at an upper portion of the motherboard.

(Appendix 2)
In the electronic device according to attachment 1,
The apparatus main body has a structure that holds each electronic circuit board in at least two stages at a predetermined interval,
The electronic device is characterized in that a connector for connecting each electronic circuit board to the motherboard is preliminarily equipped with a connector whose width is smaller than the width of each electronic circuit board.

(Appendix 3)
In the electronic device according to attachment 1 or 2,
The apparatus main body includes a pair of outer upright slot guides provided facing each side plate on the left and right sides of the apparatus main body at a predetermined interval.
Each of the outer upright slot guides is configured to hold at least each of the electronic circuit boards disposed between the outer upright slot guides.

(Appendix 4)
In the electronic device according to attachment 3,
The opposing surface side of each outer upright slot guide is equipped with a guide member that holds each electronic circuit board and guides the electronic circuit board toward the mother board when the electronic circuit board is inserted. Electronic device characterized.

(Appendix 5)
In the electronic device according to attachment 3,
Of each electronic circuit board equipped in a plurality of stages, an upper electronic circuit board is composed of a plurality of narrow electronic circuit boards arranged on the same plane,
A plurality of inner upright slot guides that hold the individual narrow electronic circuit boards individually and that form air passages that are set between the respective narrow electronic circuit boards and that extend upward from the lower stage side are provided with the electronic circuit on the lower stage side. An electronic device characterized by being installed on a substrate.

(Appendix 6)
In the electronic device according to attachment 5,
On the facing surface side of the inner upright slot guide that faces each other through the respective narrow electronic circuit boards, and on the facing surface side of the outer upright slot guide and the inner upright slot guide that face each other through the respective narrow electronic circuit boards,
An electronic apparatus comprising a guide member that holds each of the narrow electronic circuit boards and guides each of the narrow electronic circuit boards toward the mother board when the respective narrow electronic circuit boards are inserted.

(Appendix 7)
In the electronic device according to attachment 5 or 6,
The electronic device according to claim 1, wherein a height position of each upper end surface of the outer upright slot guide and the inner upright slot guide is set to a position lower than a height position of a ceiling surface of the device main body.

(Appendix 8)
In the electronic device according to appendix 5, 6 or 7,
An electronic device comprising the inner upright slot guide and the outer upright slot guide equipped with end locking members that uniformly lock the slot guides and set a constant distance between the opposing surfaces.

(Appendix 9)
In addition to incorporating a signal processing circuit for signal communication with the outside into each electronic circuit board provided in the electronic device according to any one of appendices 1 to 8,
An electronic communication apparatus comprising the electronic apparatus incorporating the signal processing circuit as a signal processing unit of a communication device main body.

  In the electronic apparatus 1 according to the present invention, the electronic circuit boards 3A and 3B installed in a plurality of stages are heated by the heat dissipation circuit component 103a, and in particular, other circuit elements on the lower electronic circuit board 3A are thermally destroyed. It is avoided by effectively air-cooling in advance using a natural air-cooling method, and since power consumption for that is zero, it is suitable for various electronic devices equipped with heat dissipation circuit components. , Its versatility is high.

1 Electronic device 2 Housing (device body)
2A Front plate 2B Rear plate 3, 3A, 3B, Electronic circuit board 3B _{1 to} 3B ₄ Narrow circuit board 4 Motherboard 5A, 5A ₁ , 5A ₂ , 5B, 5B _{1 to} 5B ₄ Connector 11, 12 Outside upright slot guide 11 B, 12B, 21B to 26B Guide members 21, 22, 23, 24, 25, 26 Inner upright slot guides 41, 42 End locking members 103a Radiation circuit parts H1 Upper exhaust ports K, K1, K2 Lower intake ports P Lower vent Area (space for ventilation)
TK Exhaust ventilation area (ventilation space)

Claims (9)

A plurality of electronic circuit boards for signal processing, an apparatus main body in which each electronic circuit board is incorporated horizontally and divided into a plurality of stages, and lower intake ports provided respectively on the front plate and the back plate of the apparatus main body And an upper exhaust port, and an electronic device comprising a mother board for connecting the electronic circuit boards with connectors,
Each electronic circuit board is equipped with a connector for each electronic circuit board on the motherboard installed on the back plate side in advance while being detachably equipped from the front side of the apparatus main body,
2. An electronic apparatus comprising: a lower-stage ventilation area provided on both sides of each connector; and an exhaust ventilation area corresponding to the upper exhaust port provided at an upper portion of the motherboard. The electronic device according to claim 1,
The apparatus main body has a structure that holds each electronic circuit board in at least two stages at a predetermined interval,
The electronic device is characterized in that a connector for connecting each electronic circuit board to the motherboard is preliminarily equipped with a connector whose width is smaller than the width of each electronic circuit board. The electronic device according to claim 1 or 2,
The apparatus main body includes a pair of outer upright slot guides provided facing each side plate on the left and right sides of the apparatus main body at a predetermined interval.
Each of the outer upright slot guides is configured to hold at least each of the electronic circuit boards disposed between the outer upright slot guides. The electronic device according to claim 3.
The opposing surface side of each outer upright slot guide is equipped with a guide member that holds each electronic circuit board and guides the electronic circuit board toward the mother board when the electronic circuit board is inserted. Electronic device characterized. The electronic device according to claim 3.
Of each electronic circuit board equipped in a plurality of stages, an upper electronic circuit board is composed of a plurality of narrow electronic circuit boards arranged on the same plane,
A plurality of inner upright slot guides that hold the individual narrow electronic circuit boards individually and that form air passages that are set between the respective narrow electronic circuit boards and that extend upward from the lower stage side are provided with the electronic circuit on the lower stage side. An electronic device characterized by being installed on a substrate. The electronic device according to claim 5.
On the facing surface side of the inner upright slot guide that faces each other through the respective narrow electronic circuit boards, and on the facing surface side of the outer upright slot guide and the inner upright slot guide that face each other through the respective narrow electronic circuit boards,
An electronic apparatus comprising a guide member that holds each of the narrow electronic circuit boards and guides each of the narrow electronic circuit boards toward the mother board when the respective narrow electronic circuit boards are inserted. The electronic device according to claim 5 or 6,
The electronic device according to claim 1, wherein a height position of each upper end surface of the outer upright slot guide and the inner upright slot guide is set to a position lower than a height position of a ceiling surface of the device main body. The electronic device according to claim 5, 6 or 7,
An electronic device comprising the inner upright slot guide and the outer upright slot guide equipped with end locking members that uniformly lock the slot guides and set a constant distance between the opposing surfaces. A signal processing circuit for signal communication with the outside is incorporated in each electronic circuit board provided in the electronic device according to any one of claims 1 to 8,
An electronic communication apparatus comprising the electronic apparatus incorporating the signal processing circuit as a signal processing unit of a communication device main body.

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