JP2008182137A - Manufacturing method for substrate, and manufacturing method for semiconductor package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate, along with a manufacturing method of a semiconductor package that uses the same substrate, capable of effectively utilizing a terminal electrode that is arranged in the mounting region of a semiconductor element. <P>SOLUTION: In the manufacturing method of a substrate equipped with terminal electrodes 11 that are independent of each other, a lead frame base material 2 comprising through holes 1 independent of each other are formed. The terminal electrode is formed by filling the through hole with a conductive paste 7; a lead-out wiring 12, which is led out of the terminal electrode formed in the mounting region of the semiconductor element to a non-mounting region of the semiconductor element, is formed. After that, a semiconductor element 13 is mounted and wire-bonding work is performed, which is sealed with a mold resin 15. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a substrate manufacturing method and a semiconductor package manufacturing method. Specifically, the manufacture of a substrate intended to make effective use of the terminal electrodes arranged in the semiconductor element mounting region by drawing the lead wiring from the terminal electrodes arranged in the semiconductor element mounting region to the non-semiconductor element mounting region. The present invention relates to a method and a method for manufacturing a semiconductor package using such a substrate.

  2. Description of the Related Art Conventionally, a semiconductor package uses a lead frame 103 as shown in FIG. 3 in which a desired pattern is formed by punching or etching a metal plate with a precision press and has a die pad 101 and a plurality of leads 102 for fixing a semiconductor element. After fixing the semiconductor element on the die pad of the lead frame and wire bonding the semiconductor element and the tip of the lead (terminal electrode), the inside of the lead including the semiconductor element and the bonding wire is sealed with an insulating resin. It is manufactured by cutting and removing unnecessary lead frame portions and cutting leads protruding from the package (see, for example, Patent Document 1).

  Here, in recent years, there has been a demand for multiple rows of terminal electrodes. As shown in FIG. 4, an auxiliary lead 104 is formed between the leads, and the distal end portion 105 of the auxiliary lead functions as a terminal electrode. As a result, a multi-row terminal electrode has been realized.

However, in this multi-row method of terminal electrodes, it is necessary to widen the interval between the leads in order to form auxiliary leads between the leads, and it is difficult to meet the demand for miniaturization of the semiconductor package. . In the method of forming auxiliary leads to increase the number of terminal electrodes, two lines are the limit due to technical problems.
Furthermore, it is very difficult to form the auxiliary leads, and there is a disadvantage that the assembly cost increases.

  In view of these points, as shown in FIG. 5, a semiconductor package 107 is arranged on a plurality of mutually independent terminal electrodes 106 as a semiconductor package capable of easily increasing the number of terminal electrodes. And a terminal electrode are connected by a bonding wire 108, and a semiconductor package in which a semiconductor element and a terminal electrode are sealed with a resin material 109 has been proposed (for example, see Patent Document 2).

JP 2002-280493 A JP 2004-266195 A

  However, in the semiconductor package described above, it is difficult to wire bond the terminal electrode disposed in the region where the semiconductor element is mounted and the semiconductor element, and the terminal electrode disposed in the region where the semiconductor element is mounted is used for signals. It cannot be used as a terminal. Therefore, useless terminal electrodes exist, which is one of the factors that hinder downsizing of the semiconductor package.

  The present invention has been devised in view of the above points, and is a method for manufacturing a substrate capable of effectively using terminal electrodes arranged in a semiconductor element mounting region, and manufacturing a semiconductor package using such a substrate. It is intended to provide a method.

  In order to achieve the above object, a substrate according to the present invention includes a step of forming an insulating substrate having a plurality of mutually independent through holes in a method of manufacturing a substrate comprising a plurality of mutually independent terminal electrodes, Forming a terminal electrode by filling the hole with a conductive material, and forming a lead-out wiring led out from the terminal electrode formed in the semiconductor element mounting region to the non-semiconductor element mounting region.

Here, the terminal electrode is formed by filling the through hole with a conductive material, and the lead-out wiring led out from the terminal electrode formed in the mounting region of the semiconductor element to the non-mounting region of the semiconductor element is formed. The terminal electrode formed in the element mounting region can be electrically connected to the semiconductor element, and the terminal electrode formed in the semiconductor element mounting region can be used as a signal terminal.
Further, since the terminal electrode is formed by forming an insulating substrate having a plurality of mutually independent through holes and filling the through holes with a conductive material, the terminal electrodes can be formed very easily. That is, a method of arranging individually manufactured terminal electrodes or forming a terminal electrode by using a method such as etching or machining of a conductor layer can be considered, but in comparison with these methods, penetration of an insulating substrate is possible. A method of forming a terminal electrode by filling a hole with a conductive material is extremely easy.

  According to another aspect of the present invention, there is provided a method of manufacturing a substrate having a plurality of mutually independent terminal electrodes, the step of forming an insulating substrate having a plurality of mutually independent through holes, and an opening corresponding to the through hole. A mask body formed with a lead-out opening from the opening formed in the region corresponding to the mounting region of the semiconductor element to the region corresponding to the non-mounting region of the semiconductor element is formed on the insulating substrate. A step of arranging on one side, and a step of filling the through hole, the opening, and the drawer opening with a conductive material.

  Here, the lead-out wiring led out from the terminal electrode and the terminal electrode formed in the semiconductor element mounting region to the non-mounting region of the semiconductor element is formed by filling the through hole, the opening and the lead-out opening with a conductive material. In addition, the terminal electrode formed in the semiconductor element mounting region can be electrically connected to the semiconductor element, and the terminal electrode formed in the semiconductor element mounting region can be used as a signal terminal.

  In addition, the substrate according to the present invention has a plurality of mutually independent through holes in a method for manufacturing a substrate having a plurality of mutually independent terminal electrodes, and the non-semiconductor elements from the through holes located in the mounting region of the semiconductor elements. A step of forming an insulating substrate having a lead-out opening that is led out to the mounting region; and a step of filling the through-hole and the lead-out opening with a conductive material.

  Here, by filling the through hole and the lead opening with a conductive material, it is possible to form a lead wire that is led out from the terminal electrode and the terminal electrode formed in the semiconductor element mounting region to the non-semiconductor element mounting region. The terminal electrode formed in the semiconductor element mounting region can be electrically connected to the semiconductor element, and the terminal electrode formed in the semiconductor element mounting region can be used as a signal terminal.

  In order to achieve the above object, a semiconductor package manufacturing method according to the present invention includes a substrate having a plurality of independent terminal electrodes, and a semiconductor element mounted on the substrate and connected to the terminal electrodes. And a method of manufacturing a semiconductor package comprising a sealing resin for sealing the semiconductor element, a step of forming an insulating substrate having a plurality of mutually independent through holes, and filling the through holes with a conductive material. Forming a terminal electrode, forming a lead-out wiring led out from the terminal electrode formed in the semiconductor element mounting region to the non-mounting region of the semiconductor element, mounting the semiconductor element, and resin the semiconductor element Sealing.

  Here, the terminal electrode is formed by filling the through hole with a conductive material, and the lead-out wiring led out from the terminal electrode formed in the mounting region of the semiconductor element to the non-mounting region of the semiconductor element is formed. The terminal electrode formed in the element mounting region can be electrically connected to the semiconductor element, and the terminal electrode formed in the semiconductor element mounting region can be used as a signal terminal.

  In addition, a method for manufacturing a semiconductor package according to the present invention includes a substrate having a plurality of independent terminal electrodes, a semiconductor element mounted on the substrate and connected to the terminal electrode, and sealing the semiconductor element In a method for manufacturing a semiconductor package comprising a sealing resin, a step of forming an insulating substrate having a plurality of mutually independent through holes, an opening is formed in a region corresponding to the formation region of the through holes, and the semiconductor A step of disposing a mask body on one side of the insulating substrate in which a lead-out opening is formed from the opening formed in a region corresponding to an element mounting region to a region corresponding to a non-mounting region of a semiconductor element; Filling the through hole, the opening, and the opening with a conductive material, mounting a semiconductor element, and sealing the semiconductor element with resin Provided.

  Here, the lead-out wiring led out from the terminal electrode and the terminal electrode formed in the semiconductor element mounting region to the non-mounting region of the semiconductor element is formed by filling the through hole, the opening and the lead-out opening with a conductive material. In addition, the terminal electrode formed in the semiconductor element mounting region can be electrically connected to the semiconductor element, and the terminal electrode formed in the semiconductor element mounting region can be used as a signal terminal.

  In addition, a method for manufacturing a semiconductor package according to the present invention includes a substrate having a plurality of independent terminal electrodes, a semiconductor element mounted on the substrate and connected to the terminal electrode, and sealing the semiconductor element In a method of manufacturing a semiconductor package including a sealing resin, a plurality of mutually independent through holes are formed, and a lead-out opening is formed to lead out from a through hole located in a semiconductor element mounting region to a non-semiconductor element mounting region A step of forming an insulating substrate, a step of filling the through hole and the lead-out opening with a conductive material, a step of mounting a semiconductor element, and a step of resin-sealing the semiconductor element.

  Here, by filling the through hole and the lead opening with a conductive material, it is possible to form a lead wire that is led out from the terminal electrode and the terminal electrode formed in the semiconductor element mounting region to the non-semiconductor element mounting region. The terminal electrode formed in the semiconductor element mounting region can be electrically connected to the semiconductor element, and the terminal electrode formed in the semiconductor element mounting region can be used as a signal terminal.

  In the semiconductor package obtained by the substrate obtained by the above-described substrate production method of the present invention and the semiconductor package production method, the terminal electrode formed in the semiconductor element mounting region can be effectively used, and the wasteful terminal electrode As a result, the semiconductor package can be miniaturized and the terminal electrode can be formed very easily.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings to facilitate understanding of the present invention.

FIG. 1 is a schematic diagram for explaining an example of a semiconductor package manufacturing method to which the present invention is applied.
In an example of a semiconductor package manufacturing method to which the present invention is applied, first, a lead frame base material 2 made of an epoxy resin having through holes 1 regularly arranged at predetermined intervals is formed using a general-purpose transfer molding technique. (See FIG. 1 (a)). The lead frame base material is an example of an insulating substrate.

  Next, as shown in FIG. 1B, the lead frame base material is sandwiched between the metal mask 5 and the metal jig 6. Subsequently, a conductive paste 7 such as a silver paste is placed on the metal mask, and printing is performed with a squeegee. Here, an opening 8 corresponding to the through hole of the lead frame base material is formed in the metal mask, and from the opening formed in the region corresponding to the semiconductor element mounting region to the non-mounting region of the semiconductor element. A drawer opening 9 is formed in the corresponding region. The metal jig has a bottomed recess 10 corresponding to the through hole of the lead frame base material.

Here, in this example, the case where a metal jig having a bottomed recess is used is described as an example, but the metal jig does not necessarily have a recess, A flat metal jig may be used.
However, by using a metal jig having a recess, the end of the terminal electrode connected to the external substrate can be protruded from the lead frame material. Therefore, it is better to use a metal jig having a recess. preferable.

  Next, the conductive paste is cured by heating the lead frame base material and the metal jig in an oven or the like with the metal mask removed. Subsequently, by peeling off the metal jig, the terminal electrodes 11 regularly arranged at a predetermined interval are formed, and the lead electrodes drawn out from the terminal electrodes formed in the semiconductor element mounting region to the non-mounting region of the semiconductor element are drawn. A wiring 12 is formed (see FIG. 1C).

  Thereafter, the semiconductor element 13 is mounted, and the semiconductor element and the terminal electrode are electrically connected by the bonding wire 14 made of a fine gold wire, and the semiconductor element and the lead wiring are electrically connected by the bonding wire 14 made of the gold fine wire. Wire bonding work is performed (see FIG. 1D). Then, a semiconductor package can be obtained by sealing a semiconductor element, a bonding wire, and a terminal electrode with the mold resin 15 using a general purpose transfer mold technique (refer FIG.1 (e)).

FIG. 2 is a schematic view for explaining another example of a method for manufacturing a semiconductor package to which the present invention is applied.
It is a schematic diagram for demonstrating another example of the manufacturing method of the semiconductor package to which this invention is applied.
In another example of a semiconductor package manufacturing method to which the present invention is applied, first, through holes arranged regularly at predetermined intervals using a machining technique (for example, punching) on an insulator made of a flat epoxy resin. 1 and a lead frame base material 2 having a lead-out recess 20 that is led out from a through hole formed in the semiconductor element mounting region to a non-semiconductor element mounting region (see FIG. 2A). The lead frame base material is an example of an insulating substrate.

  Next, as shown in FIG. 2B, the metal jig 6 is disposed on the lower side of the lead frame, and a conductive paste 7 such as a silver paste is placed on the lead frame base material, and printing is performed with a squeegee. Here, in the metal jig, a bottomed concave portion 10 corresponding to the formation region of the through hole of the lead frame base material is formed.

  Next, the conductive paste is cured by heating the lead frame base material and the metal jig in an oven or the like. Subsequently, by peeling off the metal jig, the terminal electrodes regularly arranged at a predetermined interval are formed, and the lead wiring drawn from the terminal electrode formed in the semiconductor element mounting region to the non-mounting region of the semiconductor element (See FIG. 2C).

  Thereafter, the semiconductor element 13 is mounted, and a wire bonding operation for electrically connecting the semiconductor element and the terminal electrode by a bonding wire 14 made of a thin gold wire is performed (see FIG. 2D). Then, a semiconductor package can be obtained by sealing a semiconductor element, a bonding wire, and a terminal electrode with the mold resin 15 using a general purpose transfer mold technique (refer FIG.2 (e)).

  In the above-described semiconductor package manufacturing method to which the present invention is applied, a semiconductor package in which a single semiconductor element is mounted in the semiconductor package has been described as an example. However, the present invention is not limited to such a semiconductor package. The package is not limited to a semiconductor package in which two semiconductor elements are mounted on a lead frame base material, or a semiconductor element is further mounted on the semiconductor element mounted on the lead frame base material via an insulating film. A semiconductor package in which a plurality of semiconductor elements are mounted in a semiconductor package, such as such a semiconductor package, may be manufactured.

  In the semiconductor package obtained by the semiconductor package manufacturing method to which the present invention is applied, a lead-out wiring led out from the terminal electrode formed in the semiconductor element mounting region to the non-semiconductor element mounting region is formed. When the lead-out wiring is electrically connected by the bonding wire, the terminal electrode formed in the semiconductor element mounting region can also be used as a signal terminal. The semiconductor package can be reduced in size by effectively using the terminal electrodes formed in the semiconductor element mounting region, that is, by eliminating useless terminal electrodes.

  Further, in the method of manufacturing a semiconductor package to which the present invention is applied, the conductive paste is cured by placing the conductive paste on a metal mask having openings and lead-out openings and printing with a squeegee. Terminal electrodes and lead wires can be formed, and the terminal electrodes and lead wires can be formed very easily.

  Further, in the semiconductor package obtained by the semiconductor package manufacturing method to which the present invention is applied, the external substrate connection end portion of the terminal electrode indicated by the symbol A in the figure is projected from the lead frame base material, The standoff indicated by the symbol B in the figure, which is the distance between the terminal electrode and the external substrate connection end, can be increased. Therefore, when the semiconductor package is mounted on the external substrate, the lift of the semiconductor package due to foreign matters attached to the external substrate can be reduced, and the tempering failure of the terminal electrode can be suppressed.

  In addition, by connecting the external substrate connection end of the terminal electrode beyond the lead frame base material, when the semiconductor package is mounted on a mounting substrate using solder etc., the connectivity between the terminal electrode and solder etc. due to the anchor effect This improves the connection reliability of the semiconductor package.

  In an example of a method for manufacturing a semiconductor package to which the present invention is applied, the conductive paste is printed by a squeegee through a metal mask in which an opening and a lead-out opening are formed. In another example of the semiconductor package manufacturing method, the conductive paste is printed by a squeegee without using a metal mask, and the semiconductor package obtained by the example of the semiconductor package manufacturing method to which the present invention is applied includes a terminal electrode and a semiconductor package. The lead-out wiring protrudes upward from the lead frame base material, whereas the semiconductor package obtained by another example of the semiconductor package manufacturing method to which the present invention is applied has the terminal electrode and lead-out wiring as the lead frame. It does not protrude upward from the material. Therefore, it is considered that the semiconductor package obtained by another example of the semiconductor package manufacturing method to which the present invention is applied is superior in terms of mounting semiconductor elements.

On the other hand, in an example of a semiconductor package manufacturing method to which the present invention is applied, a lead frame base material in which a through hole is formed is used, whereas in another example of a semiconductor package manufacturing method to which the present invention is applied, A lead frame base material in which a through hole and a lead-out opening are formed is used, and an example of a semiconductor package manufacturing method to which the present invention is applied is excellent in that the formation process of the lead frame base material is easy. it is conceivable that.
In the example of the semiconductor package manufacturing method to which the present invention is applied, it is necessary to use a metal mask in which a lead opening is formed. Compared with the case in which the lead opening is formed in the lead frame base material, the metal mask is used. It is generally considered that it is easy to form a drawer opening.

It is a schematic diagram for demonstrating an example of the manufacturing method of the semiconductor package to which this invention is applied. It is a schematic diagram for demonstrating another example of the manufacturing method of the semiconductor package to which this invention is applied. It is a schematic diagram (1) for demonstrating the conventional lead frame. It is a schematic diagram (2) for demonstrating the conventional lead frame. It is typical sectional drawing for demonstrating the conventional semiconductor package.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Through-hole 2 Lead frame base material 5 Metal mask 6 Metal jig 7 Conductive paste 8 Opening part 9 Draw-out opening part 10 Recess 11 Terminal electrode 12 Lead-out wiring 13 Semiconductor element 14 Bonding wire 15 Mold resin 20 Draw-out recessed part

Claims (9)

In a method of manufacturing a substrate comprising a plurality of mutually independent terminal electrodes,
Forming an insulating substrate having a plurality of mutually independent through holes;
Forming a terminal electrode by filling the through hole with a conductive material, and forming a lead-out wiring led out to the non-mounting region of the semiconductor element from the terminal electrode formed in the mounting region of the semiconductor element. A method for manufacturing a substrate, characterized in that: The method for manufacturing a substrate according to claim 1, wherein the terminal electrode is formed such that an end connected to an external substrate protrudes from the insulating substrate. In a method of manufacturing a substrate comprising a plurality of mutually independent terminal electrodes,
Forming an insulating substrate having a plurality of mutually independent through holes;
An opening is formed in a region corresponding to the through hole, and a lead-out opening is formed from the opening formed in the region corresponding to the semiconductor element mounting region to a region corresponding to the non-mounting region of the semiconductor element. Placing the mask body on one side of the insulating substrate;
And a step of filling the through hole, the opening, and the drawer opening with a conductive material. The method for manufacturing a substrate according to claim 3, further comprising a step of disposing a support body having a bottomed recess formed in a region corresponding to the through hole on the other side of the insulating substrate. In a method of manufacturing a substrate comprising a plurality of mutually independent terminal electrodes,
Forming an insulating substrate having a plurality of mutually independent through-holes and having a lead-out opening that is led out from the through-hole located in the semiconductor element mounting region to the non-mounting region of the semiconductor element;
And a step of filling the through-hole and the lead-out opening with a conductive material. The method for manufacturing a substrate according to claim 5, comprising a step of disposing a support body having a bottomed recess formed in a region corresponding to the through hole. In a method for manufacturing a semiconductor package comprising a substrate having a plurality of mutually independent terminal electrodes, a semiconductor element mounted on the substrate and connected to the terminal electrode, and a sealing resin for sealing the semiconductor element,
Forming an insulating substrate having a plurality of mutually independent through holes;
Forming a terminal electrode by filling the through-hole with a conductive material, and forming a lead-out wiring led out to the non-mounting region of the semiconductor element from the terminal electrode formed in the mounting region of the semiconductor element;
Mounting a semiconductor element;
And a step of resin-sealing the semiconductor element. A method of manufacturing a semiconductor package. In a method for manufacturing a semiconductor package comprising a substrate having a plurality of mutually independent terminal electrodes, a semiconductor element mounted on the substrate and connected to the terminal electrode, and a sealing resin for sealing the semiconductor element,
Forming an insulating substrate having a plurality of mutually independent through holes;
An opening is formed in a region corresponding to the formation region of the through hole, and a lead-out opening is drawn out from the opening formed in the region corresponding to the mounting region of the semiconductor element to a region corresponding to the non-mounting region of the semiconductor element Placing the mask body with the portion formed on one side of the insulating substrate;
Filling the through hole, the opening, and the drawer opening with a conductive material;
Mounting a semiconductor element;
And a step of resin-sealing the semiconductor element. A method of manufacturing a semiconductor package. In a method for manufacturing a semiconductor package comprising a substrate having a plurality of mutually independent terminal electrodes, a semiconductor element mounted on the substrate and connected to the terminal electrode, and a sealing resin for sealing the semiconductor element,
Forming an insulating substrate having a plurality of mutually independent through-holes and having a lead-out opening that is led out from the through-hole located in the semiconductor element mounting region to the non-mounting region of the semiconductor element;
Filling the through hole and the opening with a conductive material;
Mounting a semiconductor element;
And a step of resin-sealing the semiconductor element. A method of manufacturing a semiconductor package.

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