JP2008182049A - Repair device of electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a repair device of an electronic part like a BGA in which a terminal is in a concealed state upon mounting, wherein the terminal on the electronic part side upon remounting, is positioned to the terminal on the printed board side with a high accuracy. <P>SOLUTION: The repair device 1 of the electronic part comprises an X-ray photographing means 14 which captures each see-through image of a printed board 17 retained by an XY table 12 and a remounting electronic part 21 retained by an electronic part retainer 13. Based on a part side terminal group image and a board side terminal group image created for each of a part side terminal 23 and a board side terminal 26 from photographing data by this X-ray photographing means, the part side terminal group and board side terminal group are positioned with a high accuracy, and they are soldered in a positioning state with a high accuracy to remount the electronic part. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a repair device used for repairing an electronic component in which an electronic component such as a connection failure or failure is removed from the printed circuit board and the electronic component of the same type as the removed one is mounted, and particularly when mounted on the printed circuit board. The present invention relates to a repair device suitable for repairing a type of electronic component in which a terminal is hidden.

  In recent years, the mounting density of printed circuit boards has been increasing. Along with this, many expensive electronic components such as LSI (Large Scale Integrated Circuit) are mounted, and the unit price of the printed circuit board is also increasing. For this reason, the importance of repair technology for mounted electronic components is increasing. Electronic component repair is the process of removing the electronic component to be repaired from the printed circuit board and re-mounting the same type of electronic component. If a failure such as a connection failure or circuit failure occurs in the mounted electronic component, Performed when a soldering failure occurs when mounting an electronic component for which it is difficult to correct a connection failure, or when an abnormality is found during product inspection of a printed circuit board on which the electronic component is mounted. (For example, Patent Document 1).

  As electronic parts to be repaired, there are electronic parts called BGA (Ball Grid Array) and electronic parts called CSP (Chip Size Package). The BGA is packaged in a BGA package system, and a large number of ball-shaped terminals (component-side terminals) made of solder called bumps or solder balls are arranged on the outer surface of the package, for example, in a lattice pattern. The terminals form a component side terminal group. On the other hand, a CSP is an electronic component packaged with a size approximately equal to that of a built-in semiconductor chip, and a terminal structure in the package is generally a BGA package type.

  The mounting of these BGAs and CSPs (hereinafter collectively referred to as BGAs) on a printed circuit board corresponds to the board-side terminals in the board-side terminal group formed on the printed circuit board so as to correspond to the BGA component-side terminal group. This is done by joining each component side terminal of the BGA by soldering.

  The mounting of the BGA on the printed circuit board has a problem caused by the component side terminal group and the board side terminal group being hidden by the BGA when the BGA is mounted on the printed circuit board.

  For example, one of the problems is that the terminal alignment state cannot be directly confirmed. When mounting the BGA on the printed circuit board, prior to soldering the terminals, the BGA is positioned at the mounting position of the printed circuit board and each terminal on the BGA side (component side terminal) and each terminal on the printed circuit board (board side terminal) ). Conventionally, this alignment is performed by an optical camera or a human eye. Specifically, the positioning mark is formed on the mounting surface of the printed circuit board by printing the outline of the electronic component to be mounted by silk printing or the like, and the outer shape of the BGA is imaged by the optical camera on this positioning mark. Positioning is performed by using or visually observing. In such an alignment method, since the terminal is hidden by the BGA, the alignment state of the terminal cannot be directly confirmed. For this reason, the terminal alignment accuracy may be insufficient. In other words, since the positioning mark is formed by silk printing or the like, the accuracy may not be sufficient. In such a case, the electronic component side terminal and the printed circuit board side terminal will be misaligned. However, this cannot be detected, and as a result, the terminal alignment accuracy becomes insufficient. If the terminal alignment accuracy is insufficient, the possibility of defective soldering increases.

  There is also a problem of compatibility with soldering defects. That is, when a soldering failure occurs, the correction cannot be performed, and the printed circuit board must be repaired or discarded. Furthermore, there is a problem that it is difficult to inspect the soldered state of the terminals after mounting.

  As one of the technologies to cope with the problem caused by the terminal being hidden, there is a technology for acquiring an image of a joint portion with an X-ray fluoroscopic camera and inspecting a soldering state based on the image. Known (for example, Patent Document 2).

JP 11-29929 A JP 2005-353712 A

  In repairing an electronic component such as a BGA, local thermal stress is applied to the printed circuit board, thereby deteriorating the printed circuit board. Therefore, when the repair is repeated, the deterioration progresses, and finally, an expensive printed board must be discarded. For these reasons, it is desired to reduce the number of repairs as much as possible, and in reality, the number of repairs possible is limited to about one. In other words, re-mounting at the time of repair strongly demands high-precision mounting that does not cause the occurrence of soldering defects.

  However, in an electronic component such as a BGA in which the terminal is hidden, as described above, if the conventional optical camera or human visual method is used, the terminal alignment state can be directly confirmed. Since this is not possible, it is difficult to avoid the case where the terminal alignment accuracy becomes insufficient, and it is not possible to meet the above high-precision mounting requirements.

  The present invention has been made in the background as described above, and the problem is that the electronic component-side terminal and the printed circuit board at the time of re-mounting the repair of the electronic component in which the terminal such as BGA is hidden is printed. It is an object of the present invention to provide an electronic component repair apparatus that can perform highly accurate repair without causing poor soldering or poor connection by performing alignment of board-side terminals with high accuracy.

  In the present invention, in order to solve the above-mentioned problem, an electronic component having a component-side terminal group in which a plurality of component-side terminals are arranged is removed as a repair target, so that the repair-target electronic component in the component-side terminal group A re-mounted electronic component, which is a new electronic component of the same type as the electronic component to be repaired, is placed on the printed circuit board in which the board-side terminal group of the board-side terminals in the arrangement corresponding to the terminal arrangement is left. In an electronic component repair device used for mounting by bonding a component-side terminal in a side terminal group to a board-side terminal in the board-side terminal group, a first holding means for holding the printed circuit board, the remounted electronic Second holding means for holding the component in a state of being opposed to the printed circuit board held by the first holding means, and before the parts are held by the first and second holding means Perspective imaging means for performing fluoroscopic imaging of a printed circuit board and the remounted electronic component, and generating images of the board side terminal group on the printed circuit board and the component side terminal group on the remounted electronic component from imaging data by the fluoroscopic imaging means Terminal group image generation means, and a printed circuit board held by the first holding means or a re-mounting electronic component held by the second holding means by moving one of the re-mounting electronic components relative to the other. The board-side terminal group image and the component-side terminal group generated by the terminal group image generation means for controlling the position of the component-side terminal group and the board-side terminal group in the opposed state of the component and the printed board. An alignment control unit configured to perform image-based alignment, and the first holding unit holds a holding plate in a state in which the alignment is performed by the control of the alignment control unit. The retention in cement substrate or the second holding means to perform the forward movement in the re-mount electronic component is characterized in that it is so as to form the joint.

  Further, in the present invention, in order to solve the above-described problem, an electronic component having a component-side terminal group in which a plurality of component-side terminals are arranged is removed as a repair target, so that the component-side terminal group of the repair-targeted electronic component is removed. A re-mounted electronic component that is a new electronic component of the same type as the electronic component to be repaired is printed on the printed circuit board in which the board-side terminal group of the board-side terminals in the arrangement corresponding to the terminal arrangement in FIG. In a repair device for an electronic component used for mounting by bonding a component-side terminal in a component-side terminal group to a substrate-side terminal in the board-side terminal group, a fluoroscopic image of the printed circuit board or the remounted electronic component is acquired. A component-side terminal group image that is generated for each of the component-side terminal group and the board-side terminal group from imaging data obtained by the fluoroscopic imaging unit. And based on the substrate side terminal group image performs alignment for said substrate-side terminals and the component side terminal group is characterized in that it is to form the joint in a state in which none of the alignment.

  In this way, the board-side terminal group image and the component-side terminal group image are acquired from the photographing data obtained by the fluoroscopic photographing means, and the component-side terminal group and the board-side terminal group are aligned based on these terminal group images. As a result, high-accuracy alignment is possible, thereby enabling highly reliable repair without causing soldering failure or connection failure.

  The fluoroscopic imaging means in the electronic component repair device as described above includes X-ray irradiation means for irradiating the printed circuit board and the electronic component with X-rays, and the printed circuit board and the electronic device irradiated with the X-ray irradiation means. An X-ray detection means for detecting X-rays transmitted through the electronic component can be included. By adopting a configuration in which fluoroscopic imaging is performed with X-rays in this way, a clearer terminal group image can be obtained, and the component side terminal group and the board side terminal group can be more accurately aligned. it can.

  For the electronic device repair device as described above, a bonding state image generation unit that generates an image of a bonding state of the re-mounted electronic component to the printed circuit board at the time of the bonding mounting from the shooting data by the shooting unit, and the It can be set as the structure further equipped with the joining state adjustment means which adjusts the joining state to the said printed circuit board of the said remounting electronic component based on the joining state image produced | generated by the joining state image generation means. By doing in this way, the function of a fluoroscopic imaging means can be utilized more effectively and the reliability of repair can be improved more.

  The electronic component repair apparatus as described above may further include a mounting completion determination unit that determines completion of bonding and mounting of the remounted electronic component to the printed circuit board based on the bonding state image. . By doing in this way, the function of a fluoroscopic imaging means can be utilized still more effectively, and the reliability of repair can be improved further.

  According to the present invention as described above, the electronic component side terminal and the printed circuit board side terminal can be aligned with high accuracy when the electronic component is repaired in a state where the terminal such as the BGA is hidden. This makes it possible to perform a repair with high reliability without causing soldering failure or connection failure.

  Hereinafter, modes for carrying out the present invention will be described. FIG. 1 schematically shows the configuration of an electronic component repair device according to the first embodiment. An electronic component repair device 1 according to this embodiment includes a repair work unit 2, a control unit 3, and a display unit 4.

  The repair work unit 2 includes an XY table 12, an electronic component holder 13, an X-ray imaging unit 14, an electronic component heating nozzle 15, and an inside of a cover body 11 formed in a box shape with a material having a high X-ray blocking property. The preheating heater 16 is provided.

  The XY table 12 is a first holding unit that holds the printed circuit board 17 and includes a table unit 18 that has a horizontal state as a basic state. As schematically shown in FIG. 2, the table unit 18 can move forward and backward and rotate in each of the X, Y, and Z directions. The printed circuit board 17 can be freely moved three-dimensionally by these operations. It can be moved. Further, the warpage prevention member 19 is attached to the lower surface of the table portion 18 so that the occurrence of warpage can be suppressed. That is, the warpage prevention member 19 can suppress warpage that is to occur in the printed circuit board 17 by local heating as will be described later.

  The electronic component holder 13 is a second holding means for holding the electronic component 21, and can be moved forward and backward as shown in FIG. ing. The electronic component holder 13 holds the electronic component 21 in a state of facing the printed circuit board 17 held by the XY table 12 when the electronic component 21 is mounted (remounted) on the printed circuit board 17 as described later. Then, when necessary, the electronic component 21 functions to advance (lower) and press the printed circuit board 17 when necessary, and when the electronic component 21 is removed from the printed circuit board 17 as will be described later. It also functions to pull away from the printed circuit board 17 by holding (removing) the electronic component 21.

  Here, the electronic component 21 is, for example, a BGA, and a large number of component-side terminals 23 formed of ball-shaped solder are provided on the outer surface of the package in a lattice arrangement as in the example of FIG. A large number of component-side terminals 23 form a component-side terminal group 24. Further, a board side terminal group 25 (FIG. 3B) corresponding to the component side terminal group 24 is formed on the printed circuit board 17. The board-side terminal group 25 is formed by arranging the board-side terminals 26 made of solder so as to correspond to the arrangement of the component-side terminals 23. In FIG. 1 and FIG. 3, the solder paste 27 is applied to each board-side terminal 26 prior to mounting the electronic component 21.

  The X-ray imaging unit 14 is a fluoroscopic imaging unit, and includes an X-ray irradiator 28 that is an X-ray irradiation unit and an X-ray camera 29 that is an X-ray detection unit. The X-ray irradiator 28 irradiates the printed circuit board 17 and the electronic component 21 with X-rays 30, and the X-ray camera 29 receives the X-ray 30 transmitted through the printed circuit board 17 and the electronic component 21. Is output.

  The electronic component heating nozzle 15 is an electronic component heating means, and hot air supplied from a hot air generation source (not shown) when the electronic component 21 is mounted on the printed circuit board 17 or when the electronic component 21 is removed from the printed circuit board 17. Is blown onto the electronic component 21 to heat the whole, thereby melting the solder of the component-side terminal 23 and the board-side terminal 26.

  The preheating heater 16 is a preheating means, and preheats the printed circuit board 17 when the electronic component 21 is mounted on the printed circuit board 17 or when the electronic component 21 is removed from the printed circuit board 17. In this preliminary heating, the printed circuit board 17 is heated as a whole in order to prevent the printed circuit board 17 from being warped by local heating of the printed circuit board 17 due to the heating of the electronic component 21 by the electronic component heating nozzle 15. The heating is performed in such a range that the substrate side terminal 26 is not melted.

  The control unit 3 includes a terminal group image generation unit 31, an alignment control unit 32, a bonding state image generation unit 33, a bonding state adjustment unit 34, a mounting completion determination unit 35, an XY table control unit 36, and an electronic component holder control unit 37. The heating control means 38 and the X-ray irradiation control means 39 are provided, and the repair work in the repair work unit 2 is controlled.

  The terminal group image generation unit 31 generates a terminal group image from the imaging data output from the X-ray camera 29. The terminal group image generated by the terminal group image generation means 31 includes a component side terminal group image 41a (FIG. 4A) which is an image of the component side terminal group 24 and a board side which is an image of the board side terminal group 25. There is a terminal group image 41b ((b) of FIG. 4). The terminal group images 41a and 41b are generated by performing predetermined processing on the photographic data and extracting the terminal image 42 (component side terminal image 42a and board side terminal image 42b) from the photographic data. An example of the terminal group image generation processing is shown in FIG. The processing of this example includes imaging data acquisition processing (step 101), binarization processing (step 102), expansion / contraction processing (step 103), labeling processing (step 104), template matching processing (step 105), and a terminal. Each process of the image extraction process (step 106) is included. Since these processes are well known in the field of image processing, the details thereof will be omitted.

  The alignment control means 32 controls the alignment of the board-side terminal group 25 of the printed board 17 with the operation of the XY table 12 with respect to the component-side terminal group 24 of the electronic component 21 held by the electronic component holder 13. I do. In the alignment control, alignment control data is generated and sent to the XY table control means 36. Specifically, as shown in FIG. 6, first, the centroid 43a and the centroid 43b are obtained for each component-side terminal image 42a in the component-side terminal group image 41a and each board-side terminal image 42b in the board-side terminal group image 41b. . Then, as shown in FIG. 7, the movement vector (movement direction and movement amount) of the printed circuit board 17 necessary for aligning the center of gravity 43a and the center of gravity 43b is obtained. This processing is performed for all the terminal images 42 (component-side terminal image 42a, board-side terminal image 42b) or some selected on an appropriate standard. Since the alignment control data is generated by such processing, the alignment control data is sent to the XY table control means 36 as an alignment control command. Then, the XY table control means 36 operates the XY table 12 in accordance with a known servo control direction based on the alignment control command, and thereby high-precision alignment of the board-side terminal group 25 with respect to the component-side terminal group 24 is performed. The

  Here, in this embodiment, for generating the alignment control data, the center of gravity obtained for each of the component-side terminal image 42a and the board-side terminal image 42b is used as the alignment index. It is not always necessary to use a method. For example, a method of using the center of gravity of each of the component-side terminal group 24 and the board-side terminal group 25 as an alignment index, or a technique of using an outline obtained for each of the component-side terminal group 24 and the board-side terminal group 25 as an alignment index. Also good. However, the terminal-based center-of-gravity method also enables inspection of the component-side terminal 23 and the board-side terminal 26. That is, in the terminal-by-terminal centroid method, by performing centroid alignment individually for all the terminal images 42, for example, an average movement vector can be obtained for each centroid alignment. When the average movement vector is obtained, a deviation between the average movement vector and each movement vector is obtained and compared with a predetermined threshold value, thereby causing a position defect or a size defect of the component side terminal 23 or the board side terminal 26. Thus, it is possible to detect defects that are related to mounting defects. By performing such an inspection prior to mounting, useless repair mounting can be avoided in advance, and in this respect, the terminal-by-terminal centroid method is highly effective.

  The joining state image generation unit 33 generates a joining state image that is an image of a joining state after the start of the joining process for repair mounting, specifically, a soldering state, from the photographing data of the X-ray camera 29. The bonding state image is an image of the bonding process terminal group 45 formed by the bonding process terminals 44 being formed by fusion bonding of the component side terminals 23 and the board side terminals 26 when the example shown in FIG. 8 is described. It is generated from the 29 shooting data by the same processing as in the case of the terminal group image described above.

  The joining state adjusting unit 34 determines the joining state based on the joining state image provided from the joining state image generating unit 33, and generates joining state adjustment control data according to the result. The generated joining state adjustment control data is sent to the XY table control unit 36 and the electronic component holder control unit 37 as a joining state adjustment control command. Then, the XY table control unit 36 and the electronic component holder control unit 37 operate the drive mechanism 22 of the XY table 12 and the electronic component holder 13 by well-known servo control based on the joining state adjustment control command. By adjusting the positional relationship and the opposing angle relationship between the component 21 and the printed circuit board 17, it is possible to effectively prevent the occurrence of defective soldering or solder bridges.

  FIG. 8 to FIG. 11 show examples of the joining state images partially enlarged and exaggerated. FIG. 8 is a bonding state image in a state where the possibility that a solder bridge is generated is high. The joining state adjusting means 34 always obtains data for each joining process terminal 44 for the joining process image 44 with respect to the spacing w between joining process terminals 44 and the size s of the joining process terminal 44, and the obtained spacing data and size data. Is compared with a predetermined bridge interval threshold or bridge size threshold. When the interval w becomes equal to or smaller than the bridge interval threshold or the size s becomes equal to or larger than the bridge size threshold, the joining state adjusting unit 34 determines that the solder bridge is generated and avoids the occurrence of solder bridge in this state. The XY table 12 and the electronic component holder control means for generating the bonding state adjustment control data for the operation of the drive mechanism 22 of the XY table 12 and the electronic component holder 13 necessary for the operation. Send to 37.

  FIG. 9 is a bonding state image in a state where there is a high possibility that solder unbonding, which is a state where the solder of the component side terminal 23 and the board side terminal 26 is not sufficiently bonded, is generated. Also in this case, when the joining state adjusting unit 34 performs the same processing as in the above-described bridge occurrence state, and the interval w is equal to or greater than the unjoined interval threshold, or the size s is equal to or less than the unjoined size threshold, joining is performed. The state adjustment means 34 determines that the solder is not joined, and in this state, the joining state adjustment for the operation of the drive mechanism 22 of the XY table 12 and the electronic component holder 13 necessary to avoid the occurrence of solder unjoining. Control data is generated and sent to the XY table control means 36 and the electronic component holder control means 37 as a joining state adjustment control command.

  FIG. 10 is a bonding state image in a state where there is a high possibility that a solder bridge is generated due to the inclination of the electronic component 21 as shown in FIG. Also in this case, when the joining state adjusting unit 34 performs the same process as in the bridge occurrence state of FIG. 8 and the interval w becomes less than the bridge interval threshold or the size s becomes more than the bridge size threshold, the joined state The adjusting means 34 determines that the solder bridge has been generated, and the bonding state adjustment control data regarding the operation of the drive mechanism 22 of the XY table 12 and the electronic component holder 13 necessary to avoid the occurrence of the solder bridge in this state. It is generated and sent to the XY table control means 36 and the electronic component holder control means 37 as a joining state adjustment control command.

  FIG. 11 is a bonding state image in a state where there is a high possibility that solder unbonding occurs due to the inclination of the electronic component 21 as illustrated in FIG. Also in this case, when the joining state adjusting means 34 performs the same processing as in the bridge occurrence state of FIG. 8 and the interval w is greater than or equal to the unjoined interval threshold or the size s is less than or equal to the unjoined size threshold, The joining state adjusting means 34 determines that the solder is not joined, and in this state, the joining state regarding the operation of the drive mechanism 22 of the XY table 12 and the electronic component holder 13 necessary to avoid the occurrence of solder unjoined. Adjustment control data is generated and sent to the XY table control means 36 and the electronic component holder control means 37 as a joining state adjustment control command.

  The mounting completion determination unit 35 determines the completion of bonding and mounting of the electronic component 21 to the printed circuit board 17 based on the bonding state image provided from the bonding state image generation unit 33. When mounting is started from, for example, the state of the component-side terminal 23 in the terminal group image shown in FIG. 12A and the melt-bonding of the component-side terminal 23 and the board-side terminal 26 proceeds, as shown in FIG. It becomes a simple bonding state image. The mounting completion determination unit 35 always detects the interval w and the size s for this bonding state image in the same manner as the bonding state adjustment unit 34, and the size s of the bonding process terminal 44 as shown in FIG. However, it is determined that the mounting is completed on the condition that all of the bonding process terminals 44 are, for example, equal to or greater than the mounting completion threshold, and the solder bridge state or the solder unbonded state as described above does not appear.

  The XY table control unit 36 controls the operation of the XY table 12 in response to the alignment control command from the alignment control unit 32 and the bonding state adjustment control command from the bonding state adjustment unit 34 as described above. The XY table control means 36 can also control the operation of the XY table 12 in response to manual input.

  The electronic component holder control means 37 receives the joining state adjustment control command from the joining state adjustment means 34 as described above, and controls the operation of the electronic component holder 13 by the drive mechanism 22. The electronic component holder control means 37 can also control the operation of the electronic component holder 13 in response to manual input.

  The heating control means 38 controls the electronic component heating nozzle 15 and the preheater heater 16 based on a preset heating schedule, thereby removing the electronic component 21 from the printed circuit board 17 and printing the electronic component 21 on the printed circuit board. 17 realizes an optimum heating state for mounting on the board.

  The X-ray irradiation control means 39 controls the X-ray irradiator 28 so as to irradiate the X-ray 30 in accordance with the imaging timing of the electronic component 21 and the printed circuit board 17 required as the repair work progresses.

  The display unit 4 is used for displaying a terminal group image, a bonding state image, and the like. A manual operation by an operator can be performed by referring to a terminal group image, a bonding state image, or the like displayed on the display unit 4.

  Below, the repair operation | work done with the above repair apparatuses 1 is demonstrated. First, an operation for removing the electronic component to be repaired from the printed circuit board will be described. The state in FIG. 1 is a state in which the electronic component holder 13 holds the electronic component 21 removed from the printed circuit board 17. Before reaching this state, the printed circuit board 17 is preheated by the preheater 16 with the electronic component 21 being mounted on the printed circuit board 17 first. Then, the electronic component 21 mounted on the printed circuit board 17 is heated by the electronic component heating nozzle 15 to melt the solder of the board-side terminal 26 of the printed circuit board 17 and the component-side terminal 23 of the electronic component 21 that are bonded to each other. . At this time, the printed circuit board 17 is subjected to local heating and tends to warp, but the warpage is suppressed by the warp prevention member 19. When the solder has sufficiently melted, the electronic component holder 13 is lowered to hold the electronic component 21, and then the electronic component holder 13 is raised to separate the electronic component 21 from the printed circuit board 17. When the separation is completed, necessary post-processing such as removing the solder of the board-side terminal group remaining on the printed board 17 is performed, and the removal is completed.

  Next, electronic component remounting work will be described. The state in FIG. 1 is a state in which the electronic component holder 13 holds the electronic component 21 for remounting after the removal of the electronic component to be repaired as described above. In this state, that is, in a state where the electronic component 21 held by the electronic component holder 13 and the printed circuit board 17 held by the XY table 12 face each other, the X-ray irradiator 28 is irradiated with the X-ray 30 to acquire a terminal group image. . The processing is performed as described above, and the component side terminal group image 41a and the board side terminal group image 41b as in the example of FIG. 4 are acquired.

  When the terminal group image is obtained, the component side terminal 23 and the board side terminal 26 are aligned based on the terminal group image. For the terminal alignment, as described above, the alignment control means 32 generates alignment control command data based on the terminal group image and sends it to the XY table control means 36 as an alignment control command. The XY table control unit 36 operates the XY table 12.

  Here, the data (movement vector data) obtained in the process of generating the alignment control command data can be used for the inspection of the component side terminal 23 and the board side terminal 26 as described above. Therefore, prior to the above-described terminal alignment, the electronic component 21 and the printed circuit board 17 may be inspected for defects in the component-side terminal 23 and the board-side terminal 26. When performing such an inspection, if the component-side terminal 23 is defective, the electronic component 21 is replaced. If the substrate-side terminal 26 is defective, the repair work for the printed circuit board 17 is finished. .

  When the terminal alignment is completed, the electronic component 21 is mounted. Prior to that, the alignment accuracy may be confirmed. The confirmation of the alignment accuracy can be performed based on the terminal group image obtained by acquiring the terminal group image after the terminal alignment is completed.

  In the mounting process of the electronic component 21, after pre-heating the printed circuit board 17, the electronic component 21 is heated by the electronic component heating nozzle 15, and then the electronic component 21 is lowered by the electronic component holder 13 and pressed against the printed circuit board 17. . As described above, the heat treatment is performed such that the electronic component 21 is entirely heated by blowing hot air from the electronic component heating nozzle 15, and the solder of each component-side terminal 23 in the component-side terminal group 24 is uniform. In a predetermined solder melting state that melts automatically.

  Such a heat treatment can be carried out so as to obtain a predetermined solder melting state by setting a heating time by the electronic component heating nozzle 15, for example, but preferably, a solder melting state image is obtained, and based on that, a solder melting state image is obtained. Proceed while judging the molten state. In this case, the acquisition of the solder melting state image and the determination of the solder melting state based thereon can be performed as a process according to the acquisition of the bonding state image described above and the determination of the bonding state based thereon.

  When the electronic component 21 is pressed against the printed circuit board 17 as described above and the bonding between the component side terminal 23 and the board side terminal 26 starts to proceed, the bonding state as described above is adjusted. Finally, the mounting completion determination as described above is performed. When it is determined that the mounting is completed, the repair work for the electronic component 21 is completed.

  As described above, the component-side terminal group image 41a and the board-side terminal group image 41b are acquired from the imaging data obtained by the X-ray imaging means 14, and the component-side terminal group 24 and the board-side terminal group 25 are obtained based on these terminal group images. As a result of this positioning, highly accurate positioning is possible, thereby enabling highly reliable repair without causing soldering failure or connection failure.

  FIG. 13 shows the configuration of the repair work unit of the repair device according to the second embodiment. The repair work unit 50 in the present embodiment is basically the same as the repair work unit 2 in the repair device 1 of the first embodiment. The difference is that the X-ray imaging means 14 can be rotated with respect to the electronic component 21 held by the electronic component holder 13 and the printed circuit board 17 held by the XY table 12. By doing in this way, the electronic component 21 and the printed circuit board 17 can be image | photographed from various angles, and determination of a joining state etc. can be performed with a higher precision. About this other structure, since it is the same as the repair operation | work part 2 in 1st Embodiment, the code | symbol same as FIG. 1 is attached | subjected and the above description is used about them.

  As mentioned above, although the form for implementing this invention was demonstrated, these are only typical examples, This invention can be implemented with various forms in the range which does not deviate from the meaning. For example, in the above embodiment, the terminal group image generation unit 31 is provided independently. However, instead of this, a terminal group image generation function may be incorporated in the alignment control unit 32. This also applies to the joining state image generating unit 33 and the joining state adjusting unit 34. Further, for example, in the above-described embodiment, the mounting completion determination unit 35 is provided independently. However, instead of this, the bonding state adjustment unit 34 may include a mounting completion determination function.

It is a figure which shows typically the structure of the repair apparatus of the electronic component by 1st Embodiment. It is a figure which shows the operation | movement content of an XY table and an electronic component holder. It is a figure which shows the example of a component side terminal group and a board | substrate side terminal group. It is a figure which shows the example of a component side terminal group image and a board | substrate side terminal group image. It is a figure which shows the flow of a process about an example of a terminal group image generation process. It is a figure which imageizes and shows the process which calculates | requires a gravity center about a component side terminal image and a board | substrate side terminal image. It is a figure which image-forms and shows the alignment process of the gravity center of a component side terminal image and a board | substrate side terminal image. It is a figure which shows the example of the joining state image in the state where the possibility that a solder bridge will generate | occur | produce is high. It is a figure which shows the example of the joining state image in the state where the possibility that solder | pewter non-joining will generate | occur | produce is high. It is a figure which shows the example of the joining state image in the state which has high possibility that a solder bridge will generate | occur | produce because there is inclination in an electronic component. It is a figure which shows the other example of the joining state image in the state in which the possibility that solder | pewter non-joining will generate | occur | produce with the inclination of an electronic component is high. It is a figure explaining mounting completion determination. It is a figure which shows typically the structure of the repair operation | work part in the repair apparatus of the electronic component by 2nd Embodiment.

Explanation of symbols

1 Repair device 12 XY table (first holding means)
13 Electronic component holder (second holding means)
14 X-ray imaging means (perspective imaging means)
17 Printed circuit board 21 Electronic component 23 Component side terminal 24 Component side terminal group 25 Board side terminal group 26 Board side terminal 28 X-ray irradiator (X-ray irradiation means)
29 X-ray camera (X-ray detection means)
30 X-ray 31 Terminal Group Image Generating Unit 32 Positioning Control Unit 33 Bonding State Image Generating Unit 34 Bonding State Adjusting Unit 35 Mounting Completion Determining Unit 41a Component Side Terminal Group Image 41b Board Side Terminal Group Image

Claims (5)

By removing an electronic component having a component-side terminal group in which a plurality of component-side terminals are arranged as a repair target, the board-side terminals of the array corresponding to the terminal arrangement in the component-side terminal group of the repair-target electronic component A re-mounted electronic component that is a new electronic component of the same type as the electronic component to be repaired is printed on the printed circuit board on which the board-side terminal group remains, and the board side of the component-side terminal in the component-side terminal group of the re-mounted electronic component In the repair device for electronic components used for mounting by bonding to the board side terminal in the terminal group,
First holding means for holding the printed circuit board;
Second holding means for holding the remounted electronic component in a state of being opposed to the printed circuit board held by the first holding means;
Fluoroscopic imaging means for performing fluoroscopic imaging of the printed circuit board and the re-mounted electronic component held by the first and second holding means;
A terminal group image generation means for generating images of the board side terminal group on the printed circuit board and a component side terminal group on the re-mounted electronic component from image data obtained by the fluoroscopic imaging means; and the first holding means The re-mounted electronic component and the component-side terminal group in the opposed state of the printed circuit board by moving one of the re-mounted electronic components held on the printed board or the second holding means relative to the other, Positioning control means for performing control when making the alignment for the board side terminal group based on the board side terminal group image and the component side terminal group image generated by the terminal group image generation means,
In the state in which the alignment is performed by the control by the alignment control unit, the printed circuit board held by the first holding unit or the re-mounted electronic component held by the second holding unit is caused to move forward to perform the joining. An electronic component repair device characterized by comprising:   The fluoroscopic imaging unit detects X-rays irradiated by the X-rays toward the printed circuit board and the electronic component, and X-rays irradiated by the X-ray irradiation unit and transmitted through the printed circuit board and the electronic component. The apparatus for repairing an electronic component according to claim 1, further comprising an X-ray detection unit that performs the operation.   In the bonding state image generated by the bonding state image generation unit, the bonding state image generation unit that generates an image of the bonding state of the remounted electronic component to the printed circuit board at the time of the bonding mounting from the photographing data by the photographing unit. The electronic component repair device according to claim 1, further comprising: a bonding state adjusting unit that adjusts a bonding state of the re-mounted electronic component to the printed circuit board.   The electronic component repair device according to claim 3, further comprising a mounting completion determination unit that determines completion of bonding mounting of the remounted electronic component to the printed circuit board based on the bonding state image. . By removing an electronic component having a component-side terminal group in which a plurality of component-side terminals are arranged as a repair target, the board-side terminals of the array corresponding to the terminal arrangement in the component-side terminal group of the repair-target electronic component A re-mounted electronic component that is a new electronic component of the same type as the electronic component to be repaired is printed on the printed circuit board on which the board-side terminal group remains, and the board side of the component-side terminal in the component-side terminal group of the re-mounted electronic component In the repair device for electronic components used for mounting by bonding to the board side terminal in the terminal group,
A component-side terminal group image generated for each of the component-side terminal group and the substrate-side terminal group from imaging data obtained by the fluoroscopic imaging unit, comprising a fluoroscopic imaging unit that acquires a fluoroscopic image of the printed circuit board and the remounted electronic component And the board side terminal group image, the electronic component is configured to perform alignment with respect to the component side terminal group and the board side terminal group, and to perform the bonding in the aligned state. Repair device.

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