JP2008177454A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a substrate under rotation from largely shifting from a desired support position in a substrate processing apparatus and method in which the substrate is rotated while holding the substrate on a rotating member by pressing the substrate to supporting members, which protrude from the rotating member, with a gas supplied to the upper surface of the substrate. <P>SOLUTION: In a substrate processing apparatus, a substrate W is held at a predetermined position on a spin base 13 by pressing the substrate to supporting pins FF1 to FF6, and SS1 to SS6 with nitrogen gas supplied to the substrate surface. The substrate W rotates with the spin base 13 while the substrate W is held on the spin base 13. A plurality of guide members 25 are arranged radially on the spin base 13 centered around the rotary center A0 at a circumferential side the spin base 13 with respect to the supporting pins FF1 to FF6, and SS1 to SS6. Accordingly, even if the substrate W, which is driven for rotation, shifts from the support position toward a radial direction, the guide members 25 touch the substrate edge to regulate the shift toward the radial direction of the substrate W. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a semiconductor wafer, a glass substrate for photomask, a glass substrate for liquid crystal display, a glass substrate for plasma display, a substrate for FED (Field Emission Display), a substrate for optical disk, a substrate for magnetic disk, a substrate for magneto-optical disk, etc. The present invention relates to a substrate processing apparatus and a substrate processing method for performing predetermined processing such as cleaning processing on a substrate.

  As this type of substrate processing apparatus, there is a substrate processing apparatus that supports a substrate such as a semiconductor wafer on a disk-shaped rotating member that is rotatably provided and performs a predetermined process such as a cleaning process while rotating the substrate. For example, in the substrate processing apparatus described in Patent Document 1, at least three or more support members project upward from the periphery of the spin base (rotating member). These support members abut on the lower surface of the substrate to support the substrate apart from the spin base. In addition, a blocking member is disposed above the substrate, and a gas is supplied to a space formed between the blocking member and the upper surface of the substrate so that the substrate is pressed by the support member and held on the spin base. Is done. When the spin base is rotated, the substrate pressed by the support member rotates together with the spin base while being supported by the support member by a frictional force generated between the support member and the substrate. In this apparatus, by rotating while holding the substrate on the spin base in this way, problems caused by the holding member that holds the substrate in contact with the end surface of the substrate are prevented.

JP 2006-32891 A (FIG. 1)

  In the above-described conventional apparatus, the substrate is pressed against the supporting member protruding from the rotating member by the gas supplied to the upper surface of the substrate and held on the rotating member. Then, the substrate is rotated by rotating the rotating member while holding the substrate as described above. Thus, in the conventional apparatus, the holding force of the substrate is increased by increasing the frictional force between the support member and the substrate by pressing the gas from the upper surface side of the substrate. However, the stress balance in each part of the substrate is lost, and the substrate may move greatly in the radial direction during the rotation due to the centrifugal force generated during the rotation of the substrate. If the substrate is greatly deviated from the desired support position as described above, there are cases where the substrate cannot be unloaded by various problems, for example, by a transport mechanism such as a substrate transport robot. Further, when the amount of movement of the substrate is further increased, the substrate may be damaged.

  The present invention has been made in view of the above problems, and a substrate that rotates while holding the substrate on the rotating member by pressing the substrate against the supporting member protruding on the rotating member by the gas supplied to the upper surface of the substrate In a processing apparatus and a substrate processing method, an object is to prevent a rotating substrate from moving significantly from a desired support position.

  A substrate processing apparatus according to the present invention is a substrate processing apparatus that performs a predetermined process on a substrate while rotating the substrate in a substantially horizontal posture, and is provided rotatably about a vertical axis in order to achieve the above object. A rotating member, a rotating means for rotating the rotating member, and a protrusion projecting upward at the peripheral edge of the rotating member, contacting the lower surface of the substrate and supporting the substrate in a substantially horizontal posture and in a horizontal direction. A plurality of support members supported at positions, a pressing mechanism for pressing the substrate against the support members by supplying gas to the upper surface of the substrate and holding the rotating member, and the substrate rotated by the rotating means from the support position And a guide mechanism that restricts movement of the substrate in the radial direction by coming into contact with the end surface of the substrate when shifted in the direction.

  Further, in order to achieve the above object, the substrate processing method according to the present invention makes the substrate substantially horizontal by bringing a plurality of support members protruding upward from the peripheral edge of the rotating member into contact with the lower surface of the substrate. A holding step in which the substrate is pressed against the support member by supplying gas to the upper surface of the substrate while being supported at a predetermined support position in the horizontal direction and held by the rotation member; and the substrate held by the rotation member A rotation step for rotating the substrate around a vertical axis. In the rotation step, the guide mechanism abuts against the end surface of the substrate when the substrate to be rotated is displaced in the radial direction from the support position, thereby restricting the movement of the substrate in the radial direction. It is characterized by doing.

  According to the invention thus configured (substrate processing apparatus and substrate processing method), the substrate is pressed against the support member at a predetermined support position by the gas from the upper surface side of the substrate and is held on the rotating member. Then, the rotating member rotates while the substrate is held in this way, thereby rotating the substrate. At this time, even when the rotationally driven substrate is displaced in the radial direction from the support position, the guide mechanism abuts against the end surface of the substrate and restricts the movement of the substrate in the radial direction. Therefore, it is possible to prevent the rotating substrate from moving significantly from a desired support position.

  Here, in the substrate processing apparatus having three or more support members, and each support member having a support portion that contacts the lower surface of the substrate and supports the substrate in a substantially horizontal posture, the guide mechanism is a member of the support member. 3 or more of the first guides provided corresponding to at least three of the first guides, and each of the first guides is attached to the tip of the support member on the peripheral side of the substrate with respect to the support portion. The distance between the end surface of the first guide and the first guide can be set relatively small. For this reason, even when the rotationally driven substrate is displaced in the radial direction from the support position, the movement of the substrate can be regulated before the force acting on the substrate in the displacement direction of the substrate is increased. As a result, the physical strength of the guide (first guide) necessary for restricting the movement of the substrate can be reduced, and the guide can be made smaller.

  In addition, the substrate processing has a blocking member that is disposed oppositely while the pressing mechanism is close to the upper surface of the substrate, and supplies the gas to a space sandwiched between the blocking member and the upper surface of the substrate to press the substrate against the support member. In the apparatus, the tip position of each first guide in the vertical axis direction is preferably configured to be lower than the height position of the upper surface of the substrate supported by the support portion. According to this configuration, the blocking member and the substrate can be sufficiently brought close to each other while avoiding contact between the blocking member and the substrate.

  Moreover, you may comprise a guide mechanism so that it may have two or more 2nd guides provided in the rotation member by the peripheral side of the rotation member with respect to the several support member. Thus, by providing the second guide separately from the support member, it is possible to improve the processing performance of the apparatus while reducing the size of the support member. That is, since there is no guide in the vicinity of the substrate, it is possible to prevent problems when the guide is in the vicinity of the substrate, for example, turbulence of the air current around the substrate, rebound of the processing liquid, and the like. In addition, since the guide (second guide) is provided separately from the support member, the size of the guide can be set relatively freely, and the physical strength of the guide can be easily increased. Further, it is not necessary to remove the support member when attaching or exchanging the guide (second guide), while it is not necessary to remove the guide when attaching or exchanging the support member. For this reason, it is possible to simplify the attachment and replacement work of these guides and support members, and to greatly reduce the time required for these work.

  In addition, an inclined surface is formed at the tip of each second guide so as to face the upper center of rotation of the rotating member, and the inclined surface rotates the substrate when the peripheral edge of the substrate descends from above the inclined surface. You may comprise so that a board | substrate may be dropped toward a support member, guiding it to the rotation center side of a member. According to this configuration, when the peripheral portion of the substrate descends from above on the inclined surface, the substrate is dropped toward the support member while being guided by the inclined surface toward the rotation center of the rotating member. For this reason, for example, even when a substrate position shift occurs when the substrate is transferred by a transfer mechanism such as a substrate transfer robot, the substrate position shift is prevented when the substrate is placed on the support member. The substrate can be dropped onto the support member while being corrected by the second guide.

  Further, three or more second guides are movable guides provided on the rotary member so as to be horizontally movable toward the rotation center of the rotation member, and the plurality of movable guides are radially arranged around the rotation center of the rotation member. In the disposed substrate processing apparatus, a guide driving mechanism that horizontally moves the movable guide and a regulation that regulates the radial movement of the substrate by controlling the guide driving mechanism while the rotation of the rotating member is stopped. Guide drive control means for moving the plurality of movable guides while interlocking with each other from the position toward the rotation center of the rotation member so as to match the center of the substrate with the rotation center of the rotation member may be provided. . According to this configuration, even when the center of the substrate supported on the support member is radially displaced from the rotation center of the rotation member, the plurality of movable guides can be used while the rotation of the rotation member is stopped. Are moved toward the rotation center of the rotating member from the restriction position that restricts the radial movement of the substrate while interlocking with each other, whereby the center of the substrate can be made coincident with the rotation center of the rotating member.

  According to the present invention, even when the rotationally driven substrate is displaced in the radial direction from the support position, the guide mechanism abuts on the end surface of the substrate and restricts the radial movement of the substrate. It is possible to prevent the substrate from largely moving from the desired support position.

<First Embodiment>
FIG. 1 is a diagram showing a first embodiment of a substrate processing apparatus according to the present invention. FIG. 2 is a block diagram showing a main control configuration of the substrate processing apparatus of FIG. This substrate processing apparatus combines a peripheral portion TR of a surface Wf of a substantially circular substrate W such as a semiconductor wafer and an end surface EF of the substrate W connected to the surface peripheral portion TR (hereinafter, referred to as “surface peripheral portion of substrate and end surface of substrate”). This is an apparatus that etches away a thin film such as a metal layer or a photoresist layer from an “end of the substrate”. Specifically, the substrate end is subjected to a chemical treatment with a chemical solution and a rinse treatment with a rinse solution to etch away the thin film from the substrate end, and the chemical solution and the rinse liquid are supplied to the substrate back surface Wb to supply the entire back surface Wb. Is a device for cleaning. Hereinafter, the chemical solution and the rinse solution are collectively referred to as “treatment solution”. In this embodiment, the substrate surface Wf refers to a pattern formation surface on which a device pattern is formed.

  In this substrate processing apparatus, the processing liquid is directed toward the central portion of the lower surface (back surface Wb) of the spin chuck 1 that rotates while holding the substrate W in a substantially horizontal posture with the substrate surface Wf facing upward. The lower surface processing nozzle 15 to supply, the peripheral processing nozzle 3 which supplies a processing liquid to the surface peripheral part TR of the board | substrate W, and the interruption | blocking member 5 arranged facing the surface Wf of the board | substrate W are provided.

  The spin chuck 1 has a hollow rotating column 11 connected to a rotating shaft of a chuck rotating mechanism 12 including a motor, and can be rotated around a rotation center A0 around a vertical axis by driving the chuck rotating mechanism 12. . A spin base 13 is integrally connected to an upper end portion of the rotary support 11 by a fastening component such as a screw. Therefore, the spin base 13 rotates about the vertical axis by driving the chuck rotating mechanism 12 in accordance with an operation command from the control unit 4 that controls the entire apparatus. Thus, in this embodiment, the chuck rotating mechanism 12 corresponds to the “rotating means” of the present invention, and the spin base 13 corresponds to the “rotating member” of the present invention.

  A processing liquid supply pipe 14 is inserted into the hollow rotating column 11, and a lower surface processing nozzle 15 is coupled to the upper end thereof. The treatment liquid supply pipe 14 is connected to a chemical liquid supply unit 16 and a rinse liquid supply unit 17, and a chemical liquid or a rinse liquid such as DIW (deionized water) is selectively supplied. As the chemical solution, a chemical solution suitable for etching a thin film (unnecessary material), for example, hydrofluoric acid, hydrochloric acid / hydrogen peroxide (hydrochloric acid + hydrogen peroxide solution), or the like is used. Further, a gap between the inner wall surface of the rotary support 11 and the outer wall surface of the processing liquid supply pipe 14 forms a cylindrical gas supply path 19. The gas supply path 19 is connected to the gas supply unit 18 and can supply nitrogen gas to a space formed between the substrate back surface Wb and the facing surface of the spin base 13. In this embodiment, nitrogen gas is supplied from the gas supply unit 18, but air or other inert gas may be discharged.

  FIG. 3 is a plan view of the spin base as viewed from above. An opening is provided at the center of the spin base 13. A plurality of (in this embodiment, twelve) support pins F1 to F6 and S1 to S6 are provided in the vicinity of the peripheral edge of the spin base 13 so as to be movable up and down as “support members” of the present invention. These support pins F1 to F6 and S1 to S6 project radially upward from the spin base 13 around the rotation center A0. Each of the support pins F1 to F6 and S1 to S6 is in contact with the back surface Wb of the substrate, so that the substrate W is in a substantially horizontal posture with a predetermined distance from the spin base 13 and is supported in the horizontal direction. Support is possible at the position PS. Among these, the six support pins F1 to F6 arranged every other along the circumferential direction constitute a first support pin group, and these support the substrate W in conjunction with each other or from the substrate back surface Wb. Operate to release the support at a distance. On the other hand, the remaining six support pins S1 to S6 constitute a second support pin group, and these operate in conjunction with each other to support the substrate W or move away from the substrate back surface Wb to release the support. . In order to horizontally support the substrate W, each support pin group may have at least three support pins, but each support pin group should have six support pins. Thus, the substrate W can be stably supported.

  4 and 5 are cross-sectional views (a cross section taken along the line A-A 'in FIG. 9) for explaining a configuration related to the spin chuck 1. FIG. FIG. 4 shows a state where the support pin is raised, and FIG. 5 shows a state where the support pin is lowered. FIG. 6 is a plan view for explaining the configuration of the motion transmission mechanism provided in the spin base. 4 and 5 show only the state in which the support pins F1 to F6 move up and down in conjunction with each other, the support pins S1 to S6 can also move up and down in conjunction with the support pins F1 to F6. .

  The spin chuck 1 includes a first motion transmission mechanism FT1 for moving up and down the support pins F1 to F6 and a second motion transmission mechanism FT2 for moving up and down the support pins S1 to S6. Is provided. As shown in FIG. 6A, the first motion transmission mechanism FT1 includes six upper and lower arms 71 for operating the support pins F1 to F6, and a first for moving the upper and lower arms 71 up and down in conjunction with each other. 1 upper and lower rings 72 are provided. Each of the upper and lower arms 71 is connected to the first upper and lower rings 72 by fastening parts such as screws so as to extend radially in the radial direction at equal angular (60 °) intervals around the rotation center A0. Support pins F <b> 1 to F <b> 6 are erected at the tip of the upper and lower arms 71. Similarly, as shown in FIG. 6B, the second motion transmission mechanism FT2 moves up and down the six vertical arms 73 for operating the support pins S1 to S6 and the upper and lower arms 73 in conjunction with each other. And a second upper and lower ring 74 for the purpose. Each of the upper and lower arms 73 is connected to the second upper and lower rings 74 by fastening parts such as screws so as to extend radially in the radial direction at equal angular (60 °) intervals around the rotation center A0. Support pins S <b> 1 to S <b> 6 are erected at the tip of the upper and lower arms 73.

  The first vertical ring 72 and the second vertical ring 74 are substantially annular members arranged concentrically with the rotation center A0 of the spin base 13, and the second vertical ring 74 is an opening provided in the center thereof. By enlarging the part 74a, the opening 74a surrounds a part of the first upper and lower ring 72 and is disposed above the first upper and lower ring 72 (FIGS. 4 and 5). These first and second upper and lower rings 72, 74 can be moved up and down along the rotation axis of the spin base 13, and the support pins F <b> 1 to F <b> 6 are integrally moved by moving the first upper and lower rings 72 up and down. The support pins S <b> 1 to S <b> 6 can be raised and lowered integrally by raising and lowering the second upper and lower rings 74.

  The spin base 13 is configured by fixing an upper plate 131 and a lower plate 132 with bolts, and support pins F1 to F6 and support pins S1 to S6 are arranged on the periphery of the upper plate 131 so as to be movable up and down. For this purpose, a through hole 131a is formed. An accommodation space for accommodating the first and second motion transmission mechanisms FT1, FT2 is formed between the upper plate 131 and the lower plate 132. A through-hole 133 that penetrates the spin base 13 is formed at the center of the upper plate 131 and the lower plate 132. The treatment liquid supply pipe 14 is disposed so as to pass through the through-hole 133 and further through the rotary support 11 of the spin chuck 1. A lower surface processing nozzle 15 facing the center of the lower surface of the substrate W held on the spin chuck 1 is fixed to the upper end of the processing liquid supply pipe 14.

  FIG. 7 is a plan view of the spin base 13 as viewed from the back. The first and second upper and lower rings 72 and 74 are engaged with first and second interlocking rings 75 and 76 for raising and lowering the first and second upper and lower rings 72 and 74, respectively. The first and second interlocking rings 75 and 76 are annular members disposed concentrically with respect to the rotation center A0, and the second interlocking ring 76 is disposed outside the first interlocking ring 75. . The first and second interlocking rings 75 and 76 are formed to extend in the vertical direction with respect to the lower plate 132 through through holes 134 and 135 formed in the lower plate 132 of the spin base 13, respectively. The ends engage with the first and second upper and lower rings 72 and 74. These first and second interlocking rings 75 and 76 can be raised and lowered along the rotation axis of the spin base 13, and are supported via the first upper and lower rings 72 by raising and lowering the first interlocking ring 75. The pins F <b> 1 to F <b> 6 can be raised and lowered, and the support pins S <b> 1 to S <b> 6 can be raised and lowered via the second upper and lower rings 74 by raising and lowering the second interlocking ring 76.

  Next, the configuration of the support pins will be described with reference to FIG. 8 is a cross-sectional view taken along line B-B ′ of FIG. 3. In addition, since all of the support pins F1 to F6 and S1 to S6 have the same configuration, the configuration of one support pin F1 will be described here. As shown in FIG. 8A, the support pin F1 is in contact with the movable main body member 101 erected on the upper and lower arms 71 and the rear peripheral edge portion of the substrate W provided on the movable main body member 101. A head member 102 configured to be able to support W, a bellows 103 fitted on the upper plate 131 of the spin base 13 so as to surround the movable main body member 101, and a head member mounted on the upper surface of the bellows 103. And a ring member 105 configured to be able to mount 102.

  A screw hole 101a into which the head member 102 can be mounted is formed at the top of the movable main body member 101, and the head member 102 is erected on the movable main body member 101 by fitting the head member 102 into the screw hole 101a. . The head member 102 is a screw-shaped member, and the upper screw head (screw thread) is configured to be able to support the substrate W by contacting the substrate back surface Wb as a support portion 102a, and the lower screw portion is movable. The main body member 101 is configured to be screwable with the screw hole 101a. The upper end portion 103a of the bellows 103 protects the movable main body member 101 by engaging with the movable main body member 101 so as to cover the top of the movable main body member 101 (peripheral portion of the screw hole 101a), and also has a through hole 131a. Thus, the processing liquid is prevented from entering the inside of the spin base 13. The bellows 103 is made of, for example, PTFE (polytetrafluoroethylene), and protects the movable main body member 101 made of stainless steel (SUS), aluminum, or the like when the substrate W is processed with a chemical solution or the like. In addition, a seal member 201 is disposed between the upper plate 131 of the spin base 13 and the end member of the bellows 103 to block the internal space of the spin base 13 from the external atmosphere.

  The ring member 105 is an annular member that is opened in accordance with the diameter of the screw portion of the head member 102, and is placed on the upper end portion 103 a of the bellows 103, and the head member 102 is attached to the screw hole 101 a of the movable main body member 101. It is fixed by being screwed in. A seal member 104 is disposed between the screw portion of the head member 102 and the ring member 105 to prevent the processing liquid from entering the screw hole 101 a of the movable main body member 101 from between the head member 102 and the ring member 105. is doing. The head member 102 and the ring member 105 are preferably formed of PCTFE (polychlorotrifluoroethylene) in consideration of chemical resistance. On the other hand, when it is not necessary to consider chemical resistance, it may be formed of a rubber material.

  The ring member 105 is finished so as to be able to contact the substrate end surface EF. In other words, the ring member 105 has a guide part 105a (corresponding to the “first guide” of the present invention) on the peripheral side of the substrate W with respect to the support part 102a, and the substrate W has a diameter from the support position PS by the guide part 105a. When shifted in the direction, it is possible to restrict the radial movement of the substrate W by contacting the substrate end surface EF. Further, by providing such a guide portion 105a at the tip of each of the support pins F1 to F6 and S1 to S6, no matter how the substrate W supported by the support portion 102a moves in the radial direction, the substrate end face It is possible to prevent the EF from coming into contact with the guide part 105a and jumping out of the substrate W outward in the radial direction. Thus, in this embodiment, the ring member 105 functions as the “guide mechanism” of the present invention.

  The guide portion 105a is provided so as to be opposed to the end surface EF of the substrate W supported by the support portion 102a and to be separated from the substrate end surface EF by a predetermined gap (FIG. 8B). Specifically, the guides are such that the diameter of a virtual circle VC (see FIG. 3) drawn by connecting the guide portions 105a of the support pins F1 to F6 and S1 to S6 is slightly larger than the diameter of the substrate W. A portion 105a is provided. Therefore, in order to support the substrate W at the support position PS by the support pins F1 to F6 and S1 to S6, the substrate W is disposed inside the virtual circle VC in the radial direction (horizontal direction). In this embodiment, the distance L between the end surface EF of the substrate W supported at the support position PS and the guide part 105a is set to about 0.5 mm.

  Further, the tip position of the guide part 105a in the vertical axis direction is set to be lower than the height position WT of the upper surface of the substrate W supported by the support part 102a. As a result, even when the blocking member 5 is disposed while facing the upper surface (front surface Wf) of the substrate W, the blocking member 5 and the substrate W are avoided while avoiding contact between the blocking member 5 and the guide portion 105a. Can be sufficiently close to each other.

  Below the support pin F1, a spring case 203 is disposed on the lower plate 132 of the spin base 13 and accommodates the compression coil spring 202 in the direction of expansion and contraction along the vertical direction. As a result, the support pin F1 is biased upward via the upper and lower arms 71. As a result, the support pin F1 of the support pin F1 comes into contact with the lower surface of the substrate W as shown in FIG. It is positioned at the contact position PA. The height of the support pin F1 is determined by engaging the stopper 204 fixedly disposed inside the spin base 13 with the flange portion 101b at the lower end of the movable body member 101. The On the other hand, as shown in FIG. 5, when the support pin F <b> 1 is lowered as described later, the upper end surface 203 a of the spring case 203 serves as a stopper, and the lower end of the upper and lower arms 71 is the lower end of the spring case 203. The lower limit position of the support pin F1 is defined by engaging the upper end surface 203a.

  Returning to FIG. 4 and FIG. The rotating column 11 is integrated with the motor drive shaft of the chuck rotating mechanism 12 and is provided through the chuck rotating mechanism 12. A casing 21 is disposed so as to surround the chuck rotating mechanism 12, and the casing 21 is further surrounded by a cylindrical cover member 22. The upper end of the cover member 22 extends to the vicinity of the lower surface of the spin base 13, and a seal mechanism 23 is disposed on the inner surface near the upper end. The seal mechanism 23 is in sliding contact with a seal member 24 fixed to the lower surface of the spin base 13, and thereby, a mechanism portion that is shielded from the external atmosphere is provided between the seal mechanism 23 and the rotary column 11. A storage space MS is formed.

  FIG. 9 is a plan view for explaining the configuration of a drive mechanism for driving the support pins. A substantially annular gear case 61 surrounding the rotary column 11 is attached to the upper lid portion 21a of the casing 21 in the mechanism portion accommodating space MS. On the gear case 61, as shown in the plan view of FIG. 9, the first motor M <b> 1 and the second motor M <b> 2 are fixed at positions symmetrical to the rotary column 11. As shown in FIGS. 4 and 5, bearings 62 and 63 are press-fitted inside the gear case 61 on the inner peripheral side and the outer peripheral side of the inner wall surface, respectively. The bearings 62 and 63 are arranged coaxially with respect to the rotary column 11. A ring-shaped first gear 64 that surrounds the rotating column 11 is fixed to the rotating side ring of the inner bearing 62, and a ring-shaped first gear 64 that surrounds the rotating column 11 is fixed to the rotating side ring of the outer bearing 63. Two gears 65 are fixed. Therefore, in the gear case 61, the first gear 64 and the second gear 65 can be rotated coaxially with respect to the rotary column 11, and the second gear 65 is located outside the first gear 64. The first gear 64 has gear teeth on the outer peripheral side, and the second gear 65 has gear teeth on the inner peripheral side.

  The pinion 66 fixed to the drive shaft of the first motor M1 enters between the first gear 64 and the second gear 65 and meshes with the first gear 64 disposed inside. Similarly, as shown in FIG. 9, the pinion 67 fixed to the drive shaft of the second motor M2 is located between the first gear 64 and the second gear 65, and is disposed outside. The gear 65 is engaged. On the gear case 61, a pair of first ball screw mechanisms 81 are further arranged at positions where the motors M <b> 1 and M <b> 2 are avoided at positions facing the rotation column 11 (that is, the sides of the rotation column 11). . Further, on the gear case 61, a position where the motors M <b> 1 and M <b> 2 and the first ball screw mechanism 81 are avoided is positioned so that the other pair of second ball screw mechanisms 82 face each other with the rotating column 11 interposed therebetween (that is, , On the side of the rotating column 11).

  As shown in FIGS. 4 and 5, the first ball screw mechanism 81 includes a screw shaft 83 disposed in parallel with the rotary column 11 and a ball nut 84 that is screwed onto the screw shaft 83. Yes. The screw shaft 83 is attached to the upper lid portion of the gear case 61 via a bearing portion 85, and the lower end thereof extends into the gear case 61. A gear 86 is fixed to the lower end of the screw shaft 83. The gear 86 enters between the first gear 64 and the second gear 65 and meshes with the first gear 64 disposed on the inner side. .

  On the other hand, a first non-rotating side movable member 88 is attached to the ball nut 84. The first non-rotating side movable member 88 is an annular member that surrounds the rotating column 11, and the non-rotating side ring 77 f of the first bearing 77 provided on the inner peripheral surface of the first non-rotating side movable member 88 so as to surround the rotating column 11. Is fixed. The rotation side ring 77r of the first bearing 77 is disposed on the inner side with respect to the rotation column 11 than the non-rotation side ring 77f. The rotation-side ring 77r is fixed to the outer peripheral surface side of the annular first rotation-side movable member 89 that surrounds the rotation column 11. The first rotation-side movable member 89 is engaged with a guide rail 90 provided so as to protrude from the outer peripheral surface of the rotary column 11. The guide rail 90 is formed along a direction parallel to the rotating column 11, whereby the first rotation side movable member 89 is guided and moved in the direction along the rotating column 11, and rotates. It is coupled to the column 11.

  When the first motor M <b> 1 is driven to rotate the pinion 66, this rotation is transmitted to the first gear 64. As a result, the gear 86 meshing with the first gear 64 rotates, and the screw shaft 83 of the first ball screw mechanism 81 rotates. As a result, the ball nut 84 and the first non-rotating side movable member 88 coupled thereto are moved up and down along the rotating column 11. Since the first rotation-side movable member 89 that rotates together with the rotary column 11 is coupled to the first non-rotation-side movable member 88 via the first bearing 77, Even when the rotary column 11 is rotating, the elevator column is moved up and down along the guide rail 90.

  Another ring-shaped second non-rotating side movable member 91 is disposed outside the ring-shaped first non-rotating side movable member 88 that is moved up and down by the first ball screw mechanism 81. The second ball screw mechanism 82 has the same configuration as the first ball screw mechanism 81, but the gear provided at the lower end of the screw shaft is the first gear 64 and the second gear in the gear case 61. The second gear 65 meshes with the second gear 65 from the inside. Accordingly, when the pinion 67 that is also meshed with the second gear 65 is driven by the second motor M2, the ball nut (not shown) of the second ball screw mechanism 82 is moved up and down. This ball nut is coupled to the second non-rotating side movable member 91.

  A non-rotating side ring 78f of a second bearing 78 provided so as to surround the rotating column 11 is fixed to the outer peripheral surface of the second non-rotating side movable member 91. The rotation-side ring 78r of the second bearing 78 is fixed to the inner peripheral surface of a ring-shaped second rotation-side movable member 92 that surrounds the rotation column 11. On the upper surface of the second rotation side movable member 92, two rotation transmission pins 93 are inserted in the vertical direction along the rotation column 11, and are inserted at substantially symmetric positions around the rotation column 11 with the rotation column 11 interposed therebetween ( FIG. 7). The rotation transmission pin 93 is fixed to the spin base 13 so as to penetrate the upper plate 131 and the lower plate 132 of the spin base 13, and the lower end of the rotation transmission pin 93 allows the second rotation side movable member 92 to move up and down for the second rotation. The side movable member 92 is engaged. When the second non-rotating side movable member 91 moves up and down together with the ball nut of the second ball screw mechanism 82, the second rotating side movable member 92 coupled via the second bearing 78 also moves up and down at the same time. Since the second rotation side movable member 92 is coupled to the spin base 13 through the rotation transmission pin 93 in a state where it can be moved up and down, the second rotation side movable member 92 is rotated together with the spin base 13 (that is, together with the rotating support column 11). However, the driving force from the second ball screw mechanism 82 can be obtained and the elevator can be moved up and down.

  The first rotation-side movable member 89 is provided with four vertical drive pins 891 extending upward in the vertical direction and engaging with the first interlocking ring 75. Specifically, as shown in FIG. 7, the first interlocking ring 75 is formed with notches 751 that can be engaged with the upper and lower drive pins 891 corresponding to the upper and lower drive pins 891. Vertical drive pins 891 are inserted into the portion 751. Then, as shown in FIG. 5, when the first rotation side movable member 89 is lowered, the shoulder 891a of the vertical drive pin 891 is engaged with the first interlocking ring 75, that is, four vertical drive pins. 891 lowers the first interlocking ring 75 so as to lower the first interlocking ring 75 downward. Thus, the first upper and lower rings 72 engaged with the first interlocking ring 75 and the upper and lower arms connected to the first upper and lower rings 72 against the urging force of the compression coil spring 202 arranged below the upper and lower arms 71. The support pins F <b> 1 to F <b> 6 erected on each of the upper and lower arms 71 can be lowered by lowering 71 integrally.

  Further, the lowering operation of the support pins S1 to S6 is substantially the same as the lowering operation of the support pins F1 to F6. That is, the second interlocking ring 76 has insertion holes 761 that can be engaged with the vertical drive pins corresponding to the vertical drive pins (not shown) of the second rotation side movable member 92, respectively. Vertical drive pins are inserted into the respective insertion holes 761. And when the 2nd rotation side movable member 92 descends, an up-and-down drive pin engages with the 2nd interlocking ring 76, and the 2nd interlocking ring 76 is lowered. Thereby, the upper and lower arms connected to the second upper and lower rings 74 and 74 engaged with the second interlocking ring 76 against the urging force of the compression coil spring 202 disposed below the upper and lower arms 73. The support pins S <b> 1 to S <b> 6 erected on each of the upper and lower arms 73 can be lowered by integrally lowering 73.

  Therefore, by rotating the first and second motors M1 and M2 in accordance with the operation command of the control unit 4, the first support pin group including the support pins F1 to F6 and the second support pin including the support pins S1 to S6. It is possible to raise and lower the support pin group simultaneously or independently. Accordingly, the substrate W can be supported in the following three types. In other words, in a state where the first and second motors M1 and M2 are not driven, all the support pins F1 to F6 and S1 to S6 are positioned at the contact position PA, and the substrate W is moved to the first support pin group and the first support pin group. It can be supported by a group of two support pins. Further, by driving the first motor M1, the support pins F1 to F6 are lowered to separate the support pins F1 to F6 from the lower surface of the substrate W, and the substrate W can be supported only by the support pins S1 to S6. . On the other hand, by driving the second motor M2, the support pins S1 to S6 are lowered to separate the support pins S1 to S6 from the lower surface of the substrate W, and the substrate W is supported only by the support pins F1 to F6. Can do.

  Returning to FIG. 1, the description will be continued. Above the spin chuck 1, a disc-shaped blocking member 5 is horizontally disposed so as to face the spin base 13. The blocking member 5 is attached to a lower end portion of a rotation support shaft 51 arranged coaxially with the rotary support 11 of the spin chuck 1 so as to be integrally rotatable. A blocking member rotating mechanism 52 is connected to the rotation support shaft 51, and the blocking member 5 is rotated about the vertical axis by driving a motor of the blocking member rotating mechanism 52 in accordance with an operation command from the control unit 4. Let The control unit 4 controls the motor of the blocking member rotating mechanism 52 to synchronize with the motor of the chuck rotating mechanism 12, thereby rotating the blocking member 5 at the same rotational direction and the same rotational speed as the spin chuck 1. it can.

  Further, the blocking member 5 is connected to the blocking member elevating mechanism 53, and operates the lifting drive actuator (for example, an air cylinder) of the blocking member elevating mechanism 53 to oppose the blocking member 5 close to the spin base 13. Or can be separated. Specifically, the control unit 4 operates the blocking member raising / lowering mechanism 53 to raise the blocking member 5 to a separated position above the spin chuck 1 when the substrate W is loaded into and unloaded from the substrate processing apparatus. Let On the other hand, the substrate W is cleaned with respect to the substrate at a substrate processing position (a height position of the substrate W supported by the support pins positioned at the contact position PA) spaced apart from the spin base 13 by a predetermined distance. When performing the processing, the blocking member 5 is lowered to a predetermined facing position (position shown in FIG. 1) set very close to the surface Wf of the substrate W held by the spin chuck 1. As a result, the lower surface (opposing surface 501) of the blocking member 5 and the substrate surface Wf are spaced apart from each other in a close proximity.

  The central opening of the blocking member 5 and the hollow portion of the rotation support shaft 51 form a gas supply path 54. The gas supply path 54 is connected to the gas supply unit 18, and can supply nitrogen gas to the gap space SP sandwiched between the upper surface (surface Wf) of the substrate W and the facing surface 501 of the blocking member 5.

  FIG. 10 is a bottom view of the blocking member. The blocking member 5 has a lower surface (bottom surface) which is a facing surface 501 facing the upper surface (front surface Wf) of the substrate W substantially in parallel, and the planar size thereof is formed to be equal to or larger than the diameter of the substrate W. ing. For this reason, when the blocking member 5 is disposed at the opposing position, it is possible to cover the entire surface of the substrate W and block the atmosphere on the substrate surface Wf from the external atmosphere. Further, a nozzle insertion hole 502 having a substantially cylindrical inner space penetrating the blocking member 5 in the vertical direction (vertical axis direction) is formed in the peripheral portion of the blocking member 5 so that the peripheral processing nozzle 3 can be inserted. It has become. Since the nozzle insertion hole 502 is formed at a position facing the surface peripheral portion TR of the substrate W held by the spin chuck 1, the peripheral processing nozzle 3 is inserted into the nozzle insertion hole 502 so that the peripheral processing nozzle 3 is inserted. It can arrange | position facing the surface peripheral part TR.

  Further, a plurality of gas outlets 503 are opened on the facing surface 501. The plurality of gas ejection ports 503 are formed at equiangular intervals along a circumference centering on the rotation center A0 at a position facing the non-treatment region NTR at the center of the surface of the substrate W held by the spin chuck 1. Yes. These gas outlets 503 communicate with the gas circulation space 505 inside the blocking member 5, and when nitrogen gas is supplied to the gas circulation space 505, the nitrogen gas passes through the gas outlet 503 and the gap space SP. To be supplied. Then, nitrogen gas is supplied to the gap space SP to increase the internal pressure of the gap space SP and to the support pins (support pins F1 to F6 and / or support pins S1 to S6) that abut the substrate W on the lower surface thereof. Can be pressed. As a result, the substrate W pressed by the support pins is supported by the support pins by the frictional force generated between the lower surface of the substrate W and the support pins as the chuck rotating mechanism 12 rotates the spin base 13. Rotate with. The supplied nitrogen gas flows through the gap space SP from the vicinity of the center of the substrate W to the outside in the radial direction. Thus, in this embodiment, the blocking member 5 and the gas supply unit 18 function as the “pressing mechanism” of the present invention.

  Returning to FIG. 1, the description will be continued. The peripheral processing nozzle 3 is attached to one end of a nozzle arm 31 extending in the horizontal direction. The other end of the nozzle arm 31 is connected to the nozzle moving mechanism 33. The nozzle moving mechanism 33 can swing the peripheral processing nozzle 3 in the horizontal direction and swing the peripheral processing nozzle 3 up and down in the horizontal direction. For this reason, the nozzle moving mechanism 33 is driven in accordance with an operation command from the control unit 4, whereby the peripheral processing nozzle 3 is inserted into the nozzle insertion hole 502 of the blocking member 5 and chemical liquid or DIW is applied to the surface peripheral portion TR. It can be moved to a supply position P1 (a position indicated by a solid line in FIG. 1) and a standby position P2 (a position indicated by a broken line in FIG. 1) away from the substrate W.

  The peripheral edge processing nozzle 3 is connected to the chemical liquid supply unit 16 and the rinsing liquid supply unit 17, and the chemical liquid or the rinsing liquid is supplied from the chemical liquid supply unit 16 or the rinsing liquid supply unit 17 in accordance with the operation command from the control unit 4. 3 is selectively supplied. For this reason, when a chemical solution is supplied from the peripheral processing nozzle 3 to the surface peripheral portion TR of the substrate W that is rotationally driven, the chemical solution flows toward the outer side in the radial direction of the substrate W, and the substrate end surface EF connected to the surface peripheral portion TR. Is discharged out of the board. As a result, the substrate end surface EF and the surface region (surface peripheral portion TR) having a certain width inward from the end surface EF, that is, the substrate end portion are etched, and the thin film formed on the substrate end portion is removed from the substrate W. The Further, when the rinse liquid is supplied from the peripheral processing nozzle 3 to the surface peripheral portion TR of the substrate W that is rotationally driven, the rinse liquid flows toward the outer side in the radial direction of the substrate W, and the substrate end surface connected to the surface peripheral portion TR. It is discharged out of the substrate through the EF. Therefore, the chemical component remaining at the edge of the substrate can be washed away and removed from the substrate W.

  Further, a gas introduction port 504 is opened on the inner wall of the nozzle insertion hole 502 of the blocking member 5, and nitrogen gas can be supplied from the gas introduction port 504 to the internal space of the nozzle insertion hole 502. . The gas inlet 504 communicates with the gas supply unit 18 through a gas circulation space 505 formed inside the blocking member 5. Therefore, when nitrogen gas is pumped from the gas supply unit 18 in response to an operation command from the control unit 4, nitrogen gas is supplied to the internal space of the nozzle insertion hole 502, and the peripheral processing nozzle 3 is moved to the standby position P2. When the peripheral processing nozzle 3 is not inserted into the nozzle insertion hole 502, nitrogen gas is ejected from both the upper and lower openings of the nozzle insertion hole 502. For this reason, even when the nozzle is not inserted into the nozzle insertion hole 502, the treatment liquid is prevented from adhering to the inner wall of the nozzle insertion hole 502.

  Next, the operation of the substrate processing apparatus configured as described above will be described with reference to FIG. FIG. 11 is a flowchart showing the operation of the substrate processing apparatus of FIG. In this apparatus, when an unprocessed substrate W is carried into the apparatus, the control unit 4 controls each part of the apparatus to execute a bevel etching process, a back surface cleaning process, and a drying process on the substrate W. Here, for example, a thin film may be formed on the substrate surface Wf. Therefore, in this embodiment, the substrate W is carried into the apparatus by a transport mechanism such as a substrate transport robot with the substrate surface Wf facing upward (step S1). Note that the blocking member 5 is located at a separated position to prevent interference with the substrate W.

  When the unprocessed substrate W is placed on the support pins F1 to F6 and S1 to S6 at the predetermined support position PS, the control unit 4 discharges nitrogen gas from the gas outlet 503 of the blocking member 5 located at the separated position. At the same time, nitrogen gas is discharged from the gas supply path 54 (step S2). Next, the blocking member 5 is rotated to adjust the position of the blocking member 5 with respect to the rotation direction so that the nozzle insertion hole 502 is at a predetermined position (step S3). Specifically, when the peripheral processing nozzle 3 is moved to the supply position P1, the blocking member 5 is rotated so as to be inserted into the nozzle insertion hole 502. Thereafter, the blocking member 5 is lowered to the facing position and is disposed close to the substrate surface Wf (step S4). Here, since the tip position of the guide portion 105a of each support pin in the vertical axis direction is lower than the height position WT of the upper surface of the substrate W, it is possible to bring the blocking member 5 and the substrate W sufficiently close to each other. it can. As a result, the internal pressure of the gap space SP is increased, and the substrate W is pressed by the support pins F1 to F6 and S1 to S6 that are in contact with the lower surface (back surface Wb) and held by the spin base 13. Further, the substrate surface Wf is covered with the lower surface 501 of the blocking member 5, and is reliably blocked from the external atmosphere around the substrate. As described above, the substrate W may be supported by all the support pins F1 to F6 and S1 to S6, or may be supported only by the first support pin group including the support pins F1 to F6, or may be supported. You may support only by the 2nd support pin group which consists of pins S1-S6.

  Next, the control unit 4 rotates the substrate W while the blocking member 5 is stopped (step S5). At this time, the substrate W pressed by the support pins F1 to F6 and S1 to S6 is held by the spin base 13 by the frictional force generated between the support pins F1 to F6 and S1 to S6 and the substrate back surface Wb. 13 and rotate. The substrate W is in a state where movement in the radial direction is restricted by the guide portion 105a. For this reason, even when the substrate W is displaced in the radial direction from the support position PS, the substrate end surface EF abuts on the guide portion 105a, and the substrate W is prevented from protruding outward in the radial direction.

  Subsequently, the peripheral edge processing nozzle 3 is positioned from the standby position P2 to the supply position P1 (step S6), and a bevel etching process (etching process + rinsing process) is performed (step S7). Specifically, the peripheral edge processing nozzle 3 is moved to a position above the nozzle insertion hole 502 of the blocking member 5 along the horizontal direction, and then lowered and inserted into the nozzle insertion hole 502. Then, the chemical solution is pumped from the chemical solution supply unit 16 to the peripheral processing nozzle 3, and the chemical solution is discharged from the peripheral processing nozzle 3 toward the surface peripheral portion TR of the rotating substrate W. As a result, the chemical solution supplied to the surface peripheral portion TR flows toward the outside in the radial direction of the substrate W, and is discharged out of the substrate through the substrate end surface EF. As a result, the substrate end is etched, and unnecessary substances are removed from the entire end of the substrate. When the etching process on the surface peripheral portion TR is completed, the rinsing liquid is pumped to the peripheral processing nozzle 3 instead of the chemical solution, and the rinsing liquid is supplied to the surface peripheral portion TR. Thereby, the chemical | medical solution adhering to a board | substrate edge part is washed away with a rinse liquid. Thus, when the bevel etching process is completed, the control unit 4 stops the pumping of the rinse liquid to the peripheral processing nozzle 3 and positions the peripheral processing nozzle 3 at the standby position P2 (step S8).

  Subsequently, the blocking member 5 is rotated in the same direction at substantially the same rotational speed as that of the spin base 13 (step S9). Thereafter, the processing liquid is supplied from the lower surface processing nozzle 15 to the back surface Wb of the rotating substrate W, and the back surface cleaning process is performed on the substrate back surface Wb (step S10). Specifically, the chemical liquid and the rinsing liquid are sequentially supplied from the lower surface processing nozzle 15 toward the center of the substrate back surface Wb, whereby the entire back surface and the substrate end surface EF connected to the back surface Wb are cleaned. Here, during the cleaning process, the support pins F1 to F6, S1 to S6 are separated from the substrate back surface Wb at least once, and the contact portions of the support pins F1 to F6, S1 to S6 and the substrate back surface Wb are also processed. The part can be cleaned by wrapping in the liquid. For example, during the cleaning process, the first support from the state where the substrate W is supported by both the first support pin group including the support pins F1 to F6 and the second support pin group including the support pins S1 to S6. The state is switched to a state in which the substrate W is supported only by the pin group, and the processing liquid is introduced into the contact portion between the substrate W and the second support pin group. Then, after shifting to a state in which the substrate W is supported by both the support pin groups, the substrate W is switched to a state in which the substrate W is supported only by the second support pin group, and the contact between the substrate W and the first support pin group is changed. Allow the processing solution to wrap around the part. As a result, it is possible to perform the cleaning process on the entire back surface by causing the processing liquid to wrap around all of the contact portions between the substrate W and the support pins F1 to F6 and S1 to S6.

  When the back surface cleaning process is completed, the substrate W and the blocking member 5 are rotated at high speed. Thereby, drying of the substrate W is executed (step S11). At this time, since the centrifugal force acting on the substrate W increases due to the increase in the rotation speed, the possibility that the substrate W moves in the radial direction is further increased. However, since the guide part 105a reliably restricts the movement of the substrate W in the radial direction, it is possible to prevent the substrate W from being damaged. Further, when the substrate W is dried, the nitrogen gas is supplied from the gas supply path 19 together with the supply of the nitrogen gas to the substrate surface Wf, and the nitrogen gas is supplied to the front and back surfaces of the substrate W, thereby drying the substrate W. Processing is facilitated.

  When the drying process of the substrate W is completed, the rotation of the blocking member 5 is stopped and the rotation of the substrate W is stopped (step S12). And after the interruption | blocking member 5 is raised (step S13), supply of the nitrogen gas from the gas supply path 54 and the gas jet nozzle 503 is stopped (step S14). As a result, the pressing and holding of the substrate W to the support pins F1 to F6 and S1 to S6 is released. Thereafter, the processed substrate W is unloaded from the apparatus (step S15).

  As described above, according to this embodiment, even when the substrate W to be rotationally driven is deviated from the predetermined support position PS in the radial direction, the guide portion 105a comes into contact with the substrate end surface EF and the substrate W Regulate radial movement. Therefore, it is possible to prevent the rotating substrate W from moving significantly from a desired support position.

  In addition, according to this embodiment, since the guide part 105a is attached to the tip of the support pins F1 to F6 and S1 to S6 on the peripheral edge side of the substrate with respect to the support part 102a, the substrate end surface EF and the guide part 105a It is possible to set the distance between them relatively small. Therefore, even when the rotationally driven substrate W is displaced in the radial direction from the support position PS, the movement of the substrate W is restricted before the force acting on the substrate W in the displacement direction of the substrate W increases. Can do. As a result, the physical strength of the guide (guide part 105a) necessary for restricting the movement of the substrate W can be reduced, and the guide can be made smaller.

Second Embodiment
FIG. 12 is a plan view of a spin base installed in a substrate processing apparatus according to a second embodiment of the present invention as viewed from above. FIG. 13 is a cross-sectional view taken along the line CC ′ of FIG. The substrate processing apparatus according to the second embodiment is greatly different from the first embodiment in that a guide for restricting the radial movement of the substrate W is provided separately from the support pins. Other configurations and operations are basically the same as those in the first embodiment, and therefore, differences will be mainly described here.

  In this embodiment, the guides for restricting the radial movement of the substrate W at the tip portions of the support pins FF1 to FF6 constituting the first support pin group and SS1 to SS6 constituting the second support pin group. There is no site. That is, the ring member 106 interposed between the bellows 103 and the head member 102 does not have a portion facing the end surface EF of the substrate W supported by the support portion 102a.

  On the other hand, in order to restrict the movement of the substrate W in the radial direction, a plurality (three in this embodiment) of guide members 25 are provided as support pins FF1 to FF6, SS1 to SS6 as “second guides” of the present invention. On the other hand, the spin base 13 is provided on the peripheral side of the spin base 13. As shown in FIG. 12, the three guide members 25 project upward from the spin base 13 at equal angular intervals radially about the rotation center A0. The guide member 25 is formed in a columnar shape extending in the vertical axis direction, and a lower screw portion is configured to be screwable with a screw hole 131b formed in an upper surface peripheral portion of the spin base 13 (upper plate 131). . Therefore, the guide member 25 can be fixed to the spin base 13 by screwing the guide member 25 into the spin base 13. The tip position of the guide member 25 fixed to the spin base 13 is set to be higher in the vertical axis direction than the tip position of the support portion 102a of the support pins FF1 to FF6 and SS1 to SS6 positioned at the contact position PA. Has been. With this configuration, when the substrate W is displaced in the radial direction from the support position PS, the guide member 25 can be brought into contact with the substrate end surface EF to restrict the movement of the substrate W in the radial direction. Thus, in this embodiment, the guide member 25 functions as the “guide mechanism” of the present invention.

  According to this embodiment, since the guide member 25 is provided separately from the support pins FF1 to FF6 and SS1 to SS6, it is possible to improve the processing performance of the apparatus while reducing the size of the support pins. Specifically, since there is no guide in the vicinity of the substrate W, it is possible to prevent problems when the guide is in the vicinity of the substrate W, for example, turbulence of airflow around the substrate, bounce of the processing liquid, and the like. it can.

  Further, according to this embodiment, the following problem occurs when the member (ring member 105) having the guide portion 105a is fixed using the head member 102 having the support portion 102a as in the first embodiment. Can be solved. That is, when the ring member 105 is fixed using the head member 102, the head member 102 is removed when the position of the guide portion 105a in the vertical axis direction and the radial direction is adjusted or the ring member 105 is replaced. There is a need. For this reason, it is necessary to adjust the height position of the support portion 102a in the vertical axis direction, the lower limit position of the blocking member 5 in the vertical axis direction, and the like. (i)).

  Further, when the guide part 105a is provided at the tip of the support pin, the distance between the support part 102a and the guide part 105a becomes very short. For this reason, when the substrate W is displaced when the substrate W is transported by a transport mechanism such as a substrate transport robot, the substrate W may be placed on the guide portion 105a. May be damaged. Therefore, when the support part 102a and the guide part 105a are provided at the tip of the support pin, it is necessary to slow the transport speed in order to increase the transport accuracy of the substrate W, which is one of the factors that reduce the throughput of the apparatus. (Problem (ii)). Therefore, the support pins are provided while the guide part 105a is separated from the support part 102a so that the distance L (FIG. 8B) between the end surface EF of the substrate W supported at the support position PS and the guide part 105a is increased. It is also conceivable to provide it at the front end portion. However, in this case, when the rotationally driven substrate W is displaced in the radial direction from the support position PS, the force acting on the substrate W in the displacement direction of the substrate W increases, and the guide portion 105a falls down. New problems will occur.

  Further, it may be necessary to detect the radial movement of the substrate W to be rotationally driven (positional deviation from the support position PS). However, if the distance L between the substrate end surface EF and the guide is small, the support is performed. It becomes difficult to detect a positional deviation from the position PS. Specifically, for example, as shown in FIG. 14, the position shift of the substrate W can be detected by detecting the position of the end surface of the substrate W using a sensor 41 arranged on the periphery of the substrate W. The sensor 41 detects the distance from the sensor 41 to the substrate end surface EF by detecting the end surface position of the substrate W supported on the spin base 13. Since the relative distance between the sensor 41 and the rotation center A0 of the spin base 13 is constant, when the center W0 of the substrate W is eccentric from the rotation center A0, the distance from the sensor 41 to the substrate end surface EF is the substrate distance. It fluctuates with the rotation of W. For this reason, the sensor 41 detects the distance to the substrate end surface EF while rotating the substrate W, whereby the amount of eccentricity of the substrate W (the distance between the rotation center A0 of the spin base 13 and the center W0 of the substrate W) is determined. Can be measured. Therefore, by measuring the amount of eccentricity of the substrate W, it is possible to detect whether or not the substrate W is displaced from the support position PS and the amount of displacement. However, if the distance L between the substrate end surface EF and the guide is small, it is difficult to determine whether the detection result detected by the sensor 41 is due to the positional deviation of the substrate W or due to an error due to the measurement accuracy of the sensor. (Problem (iii)).

  On the other hand, according to this embodiment, since the guide member 25 is provided separately from the support pin, the following advantageous effects can be obtained. That is, for the above problem (i), it is not necessary to remove the head member 102 having the support portion 102a when the guide member 25 is attached to the spin base 13 and the replacement work is performed, while the head member 102 is attached and replaced. There is no need to remove the guide member 25 when performing the work. That is, when the guide member 25 is attached to the spin base 13 and the replacement work is performed, it is not necessary to adjust the tip position of the head member 102 (supporting part 102a) in the vertical axis direction at all. When performing the replacement work, only the head member 102 needs to be adjusted regardless of the guide member 25. For this reason, it is possible to simplify the attaching and exchanging operations of the guide member 25 and the head member 102, and to greatly reduce the time required for these operations.

  Further, for the above problem (ii), the guide member 25 is provided separately from the support pins FF1 to FF6 and SS1 to SS6 and is arranged away from the support portion 102a, so that the substrate transfer robot or the like can be transferred. When the substrate W is transported by the mechanism and placed on the support pins FF1 to FF6, SS1 to SS6 (support part 102a), it is reliably avoided that the substrate W is erroneously placed on the guide member 25. Can do. As a result, it is possible to increase an allowable amount of misalignment during transport of the substrate W, and to increase the transport speed of the substrate W. For this reason, the throughput of the apparatus can be improved. Further, by providing the guide member 25 separately from the support pins FF1 to FF6 and SS1 to SS6, the size of the guide can be set relatively freely. For example, the diameter of the guide member is increased to increase the guide size. It becomes easy to increase the physical strength. Therefore, by forming the guide member 25 so as to have a physical strength sufficient to restrict the movement of the substrate W in the radial direction, it is possible to prevent problems such as the collapse of the guide.

  Furthermore, with respect to the problem (iii), the guide member 25 is disposed at a position separated from the end surface EF of the substrate W supported by the support pins FF1 to FF6, SS1 to SS6. The distance L between the guide member 25 and the guide member 25 can be made relatively large. For this reason, when the substrate W to be rotated is displaced from the support position PS, it is easy to detect the displacement by the sensor 41. That is, since the distance L between the substrate end surface EF and the guide can be made relatively large, the detection result detected by the sensor 41 is caused by a positional deviation of the substrate W or an error caused by the measurement accuracy of the sensor 41. Therefore, it is easy to detect the positional deviation of the substrate W.

<Third Embodiment>
FIG. 15 is a cross-sectional view of an essential part of a spin chuck equipped in a substrate processing apparatus according to a third embodiment of the present invention. The substrate processing apparatus according to the third embodiment is greatly different from the second embodiment in that the shape of the guide member and the manner of fixing to the spin base 13 are different. Since other configurations and operations are basically the same as those of the second embodiment, the differences will be mainly described here.

  In this embodiment, the guide member 26 (corresponding to the “second guide” of the present invention) has an L-shaped cross-section, and the rising base 261 extending in the vertical axis direction and the rising base 261 to the spin base 13. And a base portion 262 extending in the horizontal direction toward the peripheral edge side. The rising portion 261 is finished so that the surface facing the rotation center A0 can come into contact with the substrate end surface EF, and the movement of the substrate W in the radial direction can be restricted. Further, the lower surface of the base portion 262 is finished so as to be in contact with the peripheral portion of the upper surface of the spin base 13 (upper plate 131). A through hole 262 a that penetrates in the vertical axis direction is formed in the base portion 262, while a screw hole 131 c is formed in the peripheral edge of the upper surface of the spin base 13. The guide member 26 can be fixed to the spin base 13 by screwing the screw 27 with the screw hole 131c through the through hole 262a.

  According to this embodiment, since the guide member 26 is provided separately from the support pin, the same effect as the second embodiment can be obtained. Further, since the guide member 26 is fixed to the spin base 13 by screwing with the screw 27, workability at the time of mounting the guide member can be improved. Furthermore, by forming the through hole 262a provided in the base portion 262 into a long hole shape extending in the radial direction, the guide member 26 can be moved freely in the radial direction, and the position of the distance from the guide member to the substrate end surface EF is achieved. Adjustment can be performed easily.

<Fourth embodiment>
FIG. 16 is a cross-sectional view of an essential part of a spin chuck equipped in a substrate processing apparatus according to a fourth embodiment of the present invention. The substrate processing apparatus according to the fourth embodiment is greatly different from the third embodiment in that the shape of the guide member is different. Since other configurations and operations are basically the same as those of the third embodiment, the differences will be mainly described here.

  In this embodiment, similarly to the third embodiment, the surface of the rising portion 261 facing the rotation center A0 is finished so as to be in contact with the substrate end surface EF, and the movement of the substrate W in the radial direction can be restricted. ing. An inclined surface 261a is formed at the tip of the rising portion 261 so as to face the upper side of the rotation center A0. When the peripheral edge of the substrate W descends from above on the inclined surface 261a, the substrate W is directed toward the support pins FF1 to FF6 and SS1 to SS6 while being guided to the rotation center A0 side of the spin base 13 by the inclined surface 261a. Dropped. For this reason, even when the substrate W is displaced when the substrate W is transferred by a transfer mechanism such as a substrate transfer robot, the substrate W is placed on the support pins FF1 to FF6 and SS1 to SS6. In addition, the substrate W can be dropped into the support pins FF1 to FF6 and SS1 to SS6 while correcting the positional deviation of the substrate W by the guide member 26.

<Fifth Embodiment>
FIG. 17 is a cross-sectional view of a main part of a spin chuck provided in a substrate processing apparatus according to a fifth embodiment of the present invention. The substrate processing apparatus according to the fifth embodiment is greatly different from the third embodiment in that the guide member is configured to be movable with respect to the spin base 13. Since other configurations and operations are basically the same as those of the third embodiment, the differences will be mainly described here.

  In this embodiment, three guide members 26A arranged radially around the rotation center A0 of the spin base 13 are provided on the spin base 13 as a "movable guide" of the present invention so as to be horizontally movable toward the rotation center A0. ing. Specifically, a guide groove 131d extending in the radial direction (horizontal direction) is formed on the peripheral edge of the upper surface of the spin base 13 (upper plate 131) corresponding to each guide member 26A, and along the guide groove 131d. Guide members 26A are provided so as to be horizontally movable. A guide drive mechanism 28 is connected to the guide member 26A, and the guide drive mechanism 28 is operated in accordance with an operation command from the control unit 4 so that the guide members 26A advance and retreat in the radial direction while interlocking with each other. It is configured. The control unit 4 controls the guide driving mechanism 28 while the rotation of the spin base 13 is stopped, so that the rotation of the spin base 13 from the regulation position (solid line position in FIG. 17) that regulates the radial movement of the substrate W is performed. Each guide member 26A is moved toward the center A0 while being interlocked with each other, so that the center of the substrate W can coincide with the rotation center A0 of the spin base 13. Thus, in this embodiment, the control unit 4 functions as the “guide drive control means” of the present invention.

  As described above, according to this embodiment, even when the center of the substrate W supported on the support pins FF1 to FF6, SS1 to SS6 is displaced in the radial direction from the rotation center A0 of the spin base 13. While the rotation of the spin base 13 is stopped, each guide member 26A moves toward the rotation center A0 of the spin base 13 from the regulation position that regulates the radial movement of the substrate W while interlocking with each other. The center of the substrate W can be made coincident with the rotation center A0 of the spin base 13.

<Others>
The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the first embodiment, the guide portions 105a are provided on the support pins F1 to F6 and S1 to S6. However, the guide portions 105a are not necessarily provided on the support pins F1 to F6 and S1 to S6. What is necessary is just to provide corresponding to at least 3 or more of the support pins which contact and support Wb. For example, when the substrate W is supported by the first support pin group including the support pins F1 to F6, the guide portions 105a are provided in at least three of the six support pins F1 to F6 arranged radially. That's fine. Further, when the substrate W is supported by the second support pin group including the support pins S1 to S6, the guide portions 105a are provided in at least three of the six support pins S1 to S6 arranged radially. Just do it.

  In the second to fourth embodiments, the three guide members 25 and 26 are provided radially on the spin base 13 around the rotation center A0. However, the number and arrangement of the guide members 25 and 26 are as follows. Is optional. For example, four or more guide members may be provided on the spin base 13. Also, two guides may be provided on the spin base 13 to restrict the movement of the substrate W in the radial direction. In this case, for example, as shown in FIG. 18, a guide member 25 and a guide wall 29 (corresponding to the “second guide” of the present invention) formed in an arc shape in plan view along the substrate end surface. What is necessary is just to provide in the spin base 13 on both sides of the rotation center A0.

  In the fifth embodiment, all (three) guide members 26A are movable guides provided on the spin base 13 so as to be horizontally movable toward the rotation center A0. However, the present invention is not limited to this. For example, four or more guide members may be provided on the spin base 13 and at least three guide members arranged radially may be used as the movable guide.

  The present invention relates to a semiconductor wafer, a glass substrate for photomask, a glass substrate for liquid crystal display, a glass substrate for plasma display, a substrate for FED (Field Emission Display), a substrate for optical disk, a substrate for magnetic disk, a substrate for magneto-optical disk, etc. The present invention can be applied to a substrate processing apparatus that performs predetermined processing on the substrate while rotating in a substantially horizontal posture.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows 1st Embodiment of the substrate processing apparatus concerning this invention. It is a block diagram which shows the main control structures of the substrate processing apparatus of FIG. It is the top view which looked at the spin base from the upper part. It is sectional drawing for demonstrating the structure relevant to a spin chuck, Comprising: It is a figure which shows the state which the support pin raised. It is sectional drawing for demonstrating the structure relevant to a spin chuck, Comprising: It is a figure which shows the state which the support pin fell. It is a top view for demonstrating the structure of the motion transmission mechanism with which the spin base was equipped. It is a top view when a spin base is seen from the back. FIG. 4 is a sectional view taken along line B-B ′ in FIG. 3. It is a top view for demonstrating the structure of the drive mechanism for driving a support pin. It is a bottom view of a blocking member. It is a flowchart which shows operation | movement of the substrate processing apparatus of FIG. It is the top view which looked at the spin base with which the substrate processing apparatus concerning 2nd Embodiment of this invention was equipped from upper direction. FIG. 13 is a sectional view taken along line C-C ′ of FIG. 12. It is a schematic diagram which shows the structure for detecting the position shift of a board | substrate. It is principal part sectional drawing of the spin chuck with which the substrate processing apparatus concerning 3rd Embodiment of this invention was equipped. It is principal part sectional drawing of the spin chuck with which the substrate processing apparatus concerning 4th Embodiment of this invention was equipped. It is principal part sectional drawing of the spin chuck with which the substrate processing apparatus concerning 5th Embodiment of this invention was equipped. It is the top view which looked at the spin base with which the substrate processing apparatus concerning the modification of this invention was equipped from the upper direction.

Explanation of symbols

4. Control unit (guide drive control means)
5 ... Blocking member (pressing mechanism)
12 ... Chuck rotating mechanism (rotating means)
13 ... Spin base (rotating member)
18 ... Gas supply unit (pressing mechanism)
25, 26 ... guide member (second guide)
26A ... Guide member (second guide, movable guide)
28 ... Guide drive mechanism 29 ... Guide wall (second guide)
102a ... support part 105 ... ring member (guide mechanism)
105a ... Guide part (first guide)
261a ... inclined surfaces F1 to F6, S1 to S6 ... support pins (support members)
FF1 to FF6, SS1 to SS6 ... Support pin (support member)
SP: Gap space (space between the blocking member and the upper surface of the substrate)
WT ... Height position of the upper surface of the substrate (supported by the support site) W ... Substrate

Claims (7)

In a substrate processing apparatus for performing predetermined processing on the substrate while rotating the substrate in a substantially horizontal posture,
A rotating member provided rotatably around a vertical axis;
Rotating means for rotating the rotating member;
A plurality of support members that protrude upward from the peripheral edge of the rotating member, abut against the lower surface of the substrate, and support the substrate in a substantially horizontal posture and at a predetermined support position in the horizontal direction;
A pressing mechanism for pressing the substrate against the support member by supplying gas to the upper surface of the substrate and holding the rotating member;
A guide mechanism that abuts against an end surface of the substrate when the substrate that is rotationally driven by the rotating means is displaced in a radial direction from the support position, and that regulates the radial movement of the substrate. Substrate processing apparatus. The substrate processing apparatus according to claim 1, wherein three or more support members are provided, and each support member has a support portion that contacts the lower surface of the substrate and supports the substrate in a substantially horizontal posture.
The guide mechanism includes three or more first guides provided corresponding to at least three of the support members, and each first guide is located on the peripheral side of the substrate with respect to the support portion. The substrate processing apparatus attached to the front-end | tip part of a supporting member. The pressing mechanism has a blocking member disposed opposite to and close to the upper surface of the substrate, and supplies the gas to a space sandwiched between the blocking member and the upper surface of the substrate, whereby the substrate is used as the support member. The substrate processing apparatus according to claim 2, wherein the substrate processing apparatus is pressed.
The substrate processing apparatus, wherein a tip position of each first guide in the vertical axis direction is lower than a height position of an upper surface of the substrate supported by the support portion.   The substrate processing apparatus according to claim 1, wherein the guide mechanism includes a plurality of second guides provided on the rotating member on a peripheral side of the rotating member with respect to the plurality of support members.   An inclined surface is formed at the tip of each second guide so as to face the upper center of rotation of the rotating member, and the inclined surface is formed on the substrate when the peripheral edge of the substrate descends from above the inclined surface. The substrate processing apparatus according to claim 4, wherein the substrate is dropped toward the support member while guiding the substrate toward the rotation center of the rotation member. Three or more second guides are movable guides provided on the rotary member so as to be horizontally movable toward the rotation center of the rotation member, and the plurality of movable guides are arranged around the rotation center of the rotation member. The substrate processing apparatus according to claim 4, wherein the substrate processing apparatus is arranged radially.
A guide drive mechanism for horizontally moving the movable guide;
While the rotation of the rotating member is stopped, by controlling the guide driving mechanism, the plurality of movable guides are moved from a restricting position that restricts the radial movement of the substrate toward the rotation center of the rotating member. A substrate processing apparatus, further comprising: a guide drive control unit configured to move the substrates while interlocking with each other so that the center of the substrate coincides with the rotation center of the rotating member. A plurality of support members projecting upward from the peripheral edge of the rotating member are brought into contact with the lower surface of the substrate to support the substrate in a substantially horizontal posture and at a predetermined support position in the horizontal direction. A holding step of pressing the substrate against the support member by supplying gas to the upper surface of the substrate and holding the rotating member;
A rotating step of rotating the substrate held by the rotating member around a vertical axis,
In the rotating step, when the substrate to be rotated is displaced in the radial direction from the support position, the guide mechanism comes into contact with the end surface of the substrate and restricts the radial movement of the substrate. Processing method.

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