JP2008176154A - Rf-id tag label mounted with reinforcing plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an RF-ID tag label having full face printing optimization in a flash fixing laser beam printer, as well as, high physical reliability. <P>SOLUTION: The back side of a label base material 1 is coated with an ionizing radiation curable resin 5; thereafter, utilizing a molding copper plate, each IC chip part insertion recessed part 2 for an RF-ID tag of an IC chip mounting inlet for an RF-ID tag is formed; the recessed part 2 which is subsequently irradiated with an ionizing radiation for curing, thereafter; a reinforcing plate 8 is inserted into each IC chip part insertion recessed part for RF-1D tag; then, a thermofusion type adhesive material is applied, then, and pasting is performed in such a manner that each IC chip part for an RF-ID tag of an IC chip mounting inlet for an RF-ID tag is inserted into each IC chip part insertion recessed part for an RF-ID tag; and thereafter, the back side of the IC chip mounting inlet for an RF-ID tag is pasted with a release paper after the application of the thermofusion-type adhesive material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to an RF-ID tag label equipped with a reinforcing plate that has high physical reliability and can be printed on the entire surface with a flash fixing laser beam printer.

The RF-ID (Radio Frequency-IDentification) system is a system that enables automatic recognition in location management of people and distribution / distribution management of articles using electromagnetic waves. Practical use has started in some areas such as distribution.
Under such circumstances, various problems have been pointed out in the RF-ID tag system using electromagnetic waves.
In the RF-ID tag label, the thickness of the IC chip mounting portion for the RF-ID tag becomes thicker than the thickness of other portions, so that the printing method of the printer capable of printing the entire surface of the RF-ID tag label is limited. That is.
For this reason, Patent Document 1 introduces an RF-ID tag label printing system using an ink jet printer.
In the ink jet printer system, since the ink jet printer head can print without being in close contact with the RF-ID tag label, it is good even if the thickness of the IC chip mounting portion for the RF-ID tag is thicker than the thickness of other portions. A printing result is obtained.
JP 2005-186578 A

However, the inkjet printer system has a problem that the printing speed is slow.
Laser beam printers can print faster than inkjet printers.
However, in the RF-ID tag label, if the thickness of the IC chip mounting portion for the RF-ID tag is thicker than the thickness of the other portion, the IC for the RF-ID tag becomes thicker than the thickness of the other portion. The toner of the laser beam printer is attached only to the chip mounting portion, which causes printing defects in the laser beam printer.
For this reason, in the present invention, the thickness imbalance due to the RF-ID tag IC chip mounting portion in the RF-ID tag label is eliminated, and the printing is suitable for the flash fixing laser beam printer capable of printing at higher speed than the ink jet printer system. It is an object to provide an RF-ID tag label.
Further, the IC chip for RF-ID tag mounted on the RF-ID tag label may be broken by external pressure or the like.
For example, when physical distribution management is performed by attaching an RF-ID tag label to the outside of an individual packaging box, the IC chip for the RF-ID tag mounted on the RF-ID tag label is destroyed by the external pressure during transportation. Sometimes.
For this reason, it is also an object to provide an RF-ID tag label that boasts high physical reliability.

In order to solve the above-mentioned problems, the present invention is to apply an ionizing radiation curable resin to the back surface of a label base material, and then use a molding plate cylinder for an RF-ID tag IC-chip mounting inlet for an RF-ID tag. After forming the IC chip insertion recess, curing by irradiating with ionizing radiation, inserting a reinforcing plate in the IC chip insertion insertion back part for RF-ID tag, applying hot melt adhesive, and for RF-ID tag IC chip mounting for RF-ID tag after bonding so that the IC chip portion for RF-ID tag of the IC chip mounting inlet is inserted into the IC chip portion insertion recess for RF-ID tag formed on the back surface of the label substrate portion Applicable to full surface printing with a flash-fixing laser beam printer capable of high-speed printing based on the principle that a hot-melt adhesive is applied to the back of the inlet and then bonded to release paper to form an RF-ID tag label. By providing the reinforcing plate mounted RF-ID tag label boasts high physical reliability that is obtained by eliminating the problem.
Since the flash fixing laser beam printer performs toner fixing with a flash, it does not apply a load to the RF-ID tag IC chip mounted on the reinforcing plate-equipped RF-ID tag label as compared with the heat roll fixing laser beam printer. It is an ideal laser beam printer for high-speed printing of reinforcing plate-mounted RF-ID tag labels.
Therefore, the inventor of the present invention has developed an RF-ID tag label equipped with a reinforcing plate that has high physical reliability and is suitable for whole surface printing with a flash fixing laser beam printer.

According to a first aspect of the present invention, there is an IC chip portion insertion recess for an RF-ID tag made of ionizing radiation curable resin on the back surface of a label base material, and a reinforcing plate is provided in the IC chip portion insertion recess for the RF-ID tag. The RF-ID tag IC chip mounting inlet, the RF-ID tag IC chip portion of the RF-ID tag IC chip mounting inlet is disposed at a position to be inserted into the RF-ID tag IC chip portion insertion recess, An RF-ID tag label with a reinforcing plate, characterized in that it has an adhesive on the back surface of an IC chip mounting inlet for an RF-ID tag, and further can be printed on the entire surface with release paper.

In the second aspect of the invention, the ionizing radiation curable resin is applied to the back surface of the label substrate, and then the IC chip portion insertion recess for the RF-ID tag is formed using the molding plate cylinder, and then the ionizing radiation is used. After the curing process of the ionizing radiation curable resin, the reinforcing plate is inserted into the IC chip portion insertion recess for the RF-ID tag, the adhesive material is applied, and the IC chip mounting inlet for the RF-ID tag. After the RF-ID tag IC chip part is inserted into the RF-ID tag IC chip part insertion recess and the bonding process, an adhesive material is applied to the back surface of the RF-ID tag IC chip mounting inlet, A reinforcing plate-mounted RF-ID tag label characterized in that it can be printed on the entire surface by being bonded to a release paper.

The present invention forms an IC chip portion insertion recess for an RF-ID tag of an IC chip mounting inlet for an RF-ID tag using a molding plate after applying an ionizing radiation curable resin on the back surface of the label base material Then, after irradiating with ionizing radiation and curing, after inserting a reinforcing plate into the IC chip portion insertion recess for RF-ID tag, applying a hot-melt adhesive material, RF-ID of the IC chip mounting inlet for RF-ID tag After bonding so that the IC chip part for tag is inserted into the IC chip part insertion concave part for RF-ID tag formed on the back surface of the label base material part, the hot melt adhesive is attached to the back surface of the IC chip mounting inlet for RF-ID tag After applying the material, it is bonded to release paper to form an RF-ID tag label, thereby eliminating the thickness imbalance due to the RF-ID tag IC chip mounting portion in the RF-ID tag label.
Therefore, the RF-ID tag label equipped with the reinforcing plate of the present invention can perform high-speed printing, and the high-speed printing of the RF-ID tag label is suitable for full surface printing with a flash fixing laser beam printer. -There is an effect that the cost of issuing ID tag labels can be kept low.
This effect makes it possible to use the flash-fixing laser beam printer of the current specification as it is for the RF-ID tag label.
Moreover, in this invention, since the reinforcement board is inserted in a series of manufacturing processes, there exists an effect which can suppress manufacturing cost low.
Furthermore, since the reinforcing plate can prevent destruction of the IC chip for the RF-ID tag even during operation of the RF-ID tag, it is possible to supply the RF-ID tag label equipped with the reinforcing plate boasting high physical reliability. There is.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an explanatory diagram of forming an IC chip insertion recess for an RF-ID tag according to the present invention.
FIG. 2 is an explanatory diagram of labeling according to the present invention.

[Overview]
An outline of an embodiment of the present invention will be described.
The present invention forms an IC chip portion insertion recess for an RF-ID tag of an IC chip mounting inlet for an RF-ID tag using a molding plate cylinder after applying an ionizing radiation curable resin to the back surface of the label substrate. Then, after curing by irradiating with ionizing radiation, after inserting a reinforcing plate into the insertion part of the IC chip part for RF-ID tag, applying a hot-melt adhesive material and pasting it with release paper to complete the label base part Let
Further, the RF-ID tag IC chip portion of the RF-ID tag IC chip mounting inlet formed continuously while peeling the release paper of the label base portion is formed on the back surface of the label base portion. After bonding so as to be inserted into the IC tag portion insertion recess for ID tag, after applying a hot-melt adhesive material on the back surface of the IC chip mounting inlet for RF-ID tag, it is bonded to release paper and attached from the label substrate surface. A folding sewing machine and a label-like punching process are performed to complete a reinforcing plate-mounted RF-ID tag label boasting high physical reliability for a flash fixing laser beam printer.

[Label substrate]
As the label substrate 1, a wide variety of paper substrates and plastic films can be used.
In addition, when the flash fixing laser beam printer corresponding to a known continuous business form printing machine or the like for printing with a flash fixing laser beam printer requires a marginal punch or the like on both sides, a marginal punching process was performed on both sides. Later, it is rolled up continuously.
For printing with a flash fixing laser beam printer, a paper substrate such as fine paper or coated paper is particularly preferable.
As the plastic film, the following single films or composite films thereof are used. Polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, Polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like.
In the case of a plastic film, it is necessary to improve the toner fixing property of the flash fixing laser beam printer by coating a mat material such as titanium oxide at least on the surface to be printed by the flash fixing laser beam printer.

[RF-ID tag IC chip insertion recess formation and reinforcement plate insertion]
The formation of the RF-ID tag IC chip insertion recess 2 on the back surface of the label substrate 1 will be described with reference to FIG.
The continuous label base material 1 is mounted on the supply roll 3 so that the back surface of the label base material 1 is the front. After that, an uncured product of ionizing radiation curable resin 5 is applied to the back surface of the label substrate 1 by a coating device 4 having a T-die nozzle, and then passed through a molding plate 6 to form an RF-ID tag IC. After the chip insertion recess 2 is formed, ionizing radiation 7 is irradiated and cured.
The forming plate cylinder 6 may be heated appropriately.
Further, after the IC chip insertion recess 2 for the RF-ID tag of the label substrate 1 is formed, the reinforcing plate 8 is inserted by the reinforcing plate insertion device 9, and then the hot melt acrylic is applied by the coating device 4a having a T-die nozzle. After applying the system adhesive material 10, the label base material portion 13 is completed by being bonded to a release paper 11 having a known continuous shape and marginal punched on both sides and wound up by a winding roll 12.
Although illustration is omitted, the marginal punch hole of the label substrate 1 and the marginal punch hole of the release paper 11 are collated so as to overlap each other.
Also, the coating width of the coating device 4a having a T-die nozzle is such that when the flash fixing laser beam printer requires marginal punches on both sides, the double-sided marginal punches processed into the label substrate 1 at the maximum. It becomes the width inside.

The liquid composition as the uncured product of the composition of the ionizing radiation curable resin 5 employs a coating method in the coating apparatus 4 having a T-die nozzle on the label substrate 1, but various known methods, for example, , Roll coating, curtain flow coating, gravure reverse coating, kiss coating and the like are also possible.

As the molding plate cylinder 6, a known cylindrical intaglio plate, gravure plate, and emboss plate may be basically used with the same material, the same structure, and the same manufacturing method.
As a material of the plate of the forming plate cylinder 6, a metal such as iron or copper is usually used.
Moreover, as a forming method for forming a desired convex portion for obtaining the IC chip insertion concave portion 2 for the RF-ID tag on the surface of the molding plate cylinder 6, for example, known etching may be used.
In addition, the surface of the forming plate cylinder 6 is a mirror-finished surface that has been subjected to polishing or chrome plating so as to adjust the fine irregularities of the surface.
The rotational drive of the forming plate cylinder 6 may be performed using the same mechanism and method as those of a normal transport gravure printing machine, rotary embossing machine, and the like.

[Ionizing radiation curable resin]
As the ionizing radiation curable resin 5 used for forming the IC chip insertion recess 2 for the RF-ID tag, a known ionizing radiation curable resin may be used depending on the application.
As such an ionizing radiation curable resin 5, a prepolymer having a polymerizable unsaturated bond such as a (meth) acryloyl group or a (meth) acryloyloxy group or a cationic polymerizable functional group such as an epoxy group in the molecule. , A monomer, a polymer, or a polythiol compound, and a composition in which only one kind or two or more kinds thereof are appropriately mixed is used.
The composition is liquid when uncured.

Examples of the prepolymer having a polymerizable unsaturated bond in the molecule include unsaturated polyesters such as a condensation product of unsaturated dicarboxylic acid and polyhydric alcohol, polyester (meth) acrylate, urethane (meth) acrylate, epoxy ( There are (meth) acrylates such as meth) acrylate and melamine (meth) acrylate [In the present specification, (meth) acrylate is used in the meaning of acrylate or methacrylate. The same shall apply hereinafter. Examples of the monomer having a polymerizable unsaturated bond in the molecule include styrene monomers such as styrene and α-methylstyrene, methyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and (meth) acrylic. Monofunctional (meth) acrylic acid esters such as methoxyethyl acid, butoxyethyl (meth) acrylate, ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate , Diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, etc. Crylate esters, (meth) acrylic acid-2- (N, N-diethylamino) ethyl, (meth) acrylic acid-2- (N, N-dimethylamino) ethyl, (meth) acrylic acid-2- (N , N-dibenzylamino) ethyl substituted unsaturated amino alcohol esters such as (meth) acrylamide, polycarboxylic acid compounds having two or more mercapto groups in the molecule, such as trimethylol Examples include propane trithioglycolate, trimethylolpropane trithiopropylate, pentaerythritol tetrathioglycol and the like.

Examples of prepolymers having a cationically polymerizable functional group in the molecule include bisphenol type epoxy resins, novolac type epoxy resins, aliphatic type epoxy resins, alicyclic epoxy resins and other epoxy resins, aliphatic vinyl ethers, aromatic type Examples include vinyl ether resins such as vinyl ether, urethane vinyl ether and ester vinyl ether, prepolymers such as cyclic ether resins and spiro compounds.

The above compounds are used alone or in combination of two or more as required. In order to impart ordinary coating suitability to the composition of the ionizing radiation curable resin 5, the prepolymer or oligomer is added in an amount of 5% by weight or more. The monomer and / or polythiol is preferably 95% by weight or less.
In order to adjust the physical properties such as curing shrinkage, flexibility of the cured product, surface hardness, etc., the following ionizing radiation non-curable resin is used for at least one of the prepolymer, oligomer and monomer. About 1 to 70% by weight can be mixed and used.
As the ionizing radiation non-curable resin, thermoplastic resins such as urethane resins, cellulose resins, polyester resins, acrylic resins, butyral resins, vinyl chloride resins, and vinyl acetate resins can be used.

In particular, when curing with ultraviolet rays, a photopolymerization initiator is added to the composition of the ionizing radiation curable resin 5.
Examples of the compound having a radically polymerizable unsaturated bond in the molecule include acetophenones, benzophenones, Michler benzoylbenzoate, α-amyloxime ester, tetramethylmeurum monosulfide, thioxanthones and the like. Examples of the compound having a cationically polymerizable functional group in the molecule include aromatic diazonium salts, aromatic sulfonium salts, aromatic iodonium salts, metallocene compounds, benzoin sulfonic acid esters, diallyl iodosyl salts and the like.
Alternatively, if necessary, n-butylamine, triethylamine, tri-n-butylphosphine, or the like can be further mixed and used as a photosensitizer.

Here, the ionizing radiation 7 means an electromagnetic wave or charged particle beam having energy capable of polymerizing and crosslinking molecules, and includes ultraviolet rays, visible rays, X-rays, electron beams, α rays, etc. Usually, ultraviolet rays or electron beams are used.
As the ultraviolet light source, a light source such as an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a carbon arc lamp, a black light, a metal halide lamp or the like is used.
As the electron beam source, various electron beam accelerators such as a cockcroft Walton type, a bandegraft type, a resonant transformer type, an insulated core transformer type, a linear type, a dynamitron type, a high frequency type, etc. are used, preferably 100 to 1000 keV, preferably Irradiates electrons with energy of 100 to 300 keV.

[Reinforcing plate and reinforcing plate insertion process]
As the reinforcing plate 8, a stainless steel plate such as SUS304 having a thickness of 0.1 mm or less and having a size that can cover the IC chip for the RF-ID tag is adopted.
In this embodiment, the reinforcing plate insertion device 9 is inserted into the RF-ID tag IC chip insertion recess 2 using a die bonder.
The reinforcing plate 8 is a reinforcing plate that uses a die bonder after first attaching a known semiconductor dicing tape to a stainless steel thin plate, processing it into small pieces of a predetermined size by a known photo-etching process, and fixing it to a wafer ring. The reinforcing plate 8 is inserted into the RF-ID tag IC chip insertion recess 2 by the insertion device 9.

[Adhesive]
As the adhesive material, various types such as a solvent type, a polymerization type, an ultraviolet curable type, an emulsion type, and a heat melting type can be used.
Various materials such as natural rubber, nitrile rubber, epoxy resin, vinyl acetate emulsion, acrylic, acrylate copolymer, polyvinyl alcohol, and phenol resin are used as the resin composition of the adhesive. it can.
In this embodiment, the hot-melt acrylic pressure-sensitive adhesive material 10 that does not require a drying process is used.

[RF-ID tag IC chip mounting inlet]
As an example, the RF-ID tag IC chip mounting inlet 14 is a known stud for bonding pads on a wafer of an RF-ID tag IC chip mounted with a non-volatile memory such as a known EEPROM (Electronically Erasable and Programmable Read Only Memory). After forming a bump, after die cutting by a known method, an antenna connection pad of a continuous antenna sheet in which an antenna made of aluminum or the like is formed on one side of a known transparent polyester sheet or the like with a known anisotropic conductive material or the like After mounting.
In the present embodiment, the RF-ID tag IC chip wafer was back-wrapped by a known method to reduce the thickness.
Furthermore, considering the printing with a flash fixing laser beam printer, the antenna sheet employs a continuous antenna sheet that is multifaceted in the left-right direction.
Therefore, the IC chip mounting inlet 14 for the RF-ID tag has a continuous shape that is multifaceted also in the left-right direction.

In addition, an RF-ID tag system comprising an RF-ID tag reader / writer and an RF-ID tag label, which is a subject of the present invention, is a VHF (Very High Frequency) band (for example, 13.56 Mz), a UHF band (Ultra-High). A known RF-ID tag system such as a Frequency band or a microwave band (for example, 2.45 Gz) is a target.

[RF-ID tag IC chip insertion recess depth]
The depth of the IC chip insertion recess 2 for the RF-ID tag is set such that the thickness of the reinforcing plate 8 is equal to the thickness of the hot-melt acrylic adhesive material 10 and the IC chip inlet 14 for the RF-ID tag is the RF-ID tag IC. Most preferably, the thickness is equal to the sum of the thicknesses of the chip mounting portions.

[Labeling]
In FIG. 2, labeling will be described.
For labeling, a collator 15 which is a known continuous business form collator is used. The collator 15 is mounted on the collator supply roll 16 so that the back surface of the label base member 13 is the front.
After that, in the collator 15, after the release paper 11 is peeled from the label base portion 13, the RF-ID tag IC chip mounting inlet 14 that is continuous and multifaceted in the left-right direction is used. With the IC chip mounting surface facing down, the IC chip portion for RF-ID tag 17 is affixed while being inserted into the IC chip insertion recess 2 for RF-ID tag label of the label base portion 13.
After that, on the back surface of the IC chip mounting inlet 14 for the RF-ID tag, after applying the hot-melt type acrylic adhesive material 10 by the coating device 18 having the T-die nozzle for collator mounted on the collator 15, In addition, a known release paper 11 that has been subjected to marginal punch processing on both sides and a marginal punch are laminated and bonded together.
Although illustration is omitted, in the processing portion of the collator 15, the surface of the label base material portion is exposed to the surface with a turn bar, and a folding sewing machine and a labeling punching process are performed from the surface of the label base material portion 13.
Further, when the paper feed unit of the flash fixing laser beam printer requests a fold-shaped business form, it is schematically illustrated in FIG. 2, but the collator 15 folds it with a fold sewing machine and outputs it. Thus, the reinforcing plate-mounted RF-ID tag label form 19 is completed.

[Printing with flash fixing laser beam printer]
Printing with a flash fixing laser beam printer is performed by setting a reinforcing plate-mounted RF-ID tag label form 19 in a paper feeding unit.
Since the RF-ID tag label form 19 with the reinforcing plate is not thick only at the IC chip mounting portion for the RF-ID tag, there is no defective fixing of the toner at the toner fixing portion in the flash fixing laser beam printer, and the entire surface is good. A printing result was obtained.
Further, in the toner fixing portion in the flash fixing laser beam printer, since the load is not applied only to the IC chip mounting portion 17 for the RF-ID tag and the reinforcing plate is also inserted, the IC for the RF-ID tag is inserted. The chip was not destroyed, and no malfunction of the RF-ID tag label occurred after printing with a flash fixing laser beam printer.

[Modification]
The implementation of the present invention is not limited to the matters described in the embodiments.
Specifically, first, the material surface, in the above embodiment, after applying an ionizing radiation curable resin to the back surface of the label substrate, mounting the IC chip for RF-ID tag using a molding plate cylinder After forming the IC chip part insertion recess for the RF-ID tag of the inlet, after curing by irradiating with ionizing radiation, after applying the hot melt acrylic adhesive material, and pasting it with the release paper, the label base part is completed explained.
However, the present invention is not limited to the ionizing radiation curable resin, and the RF-ID of the IC chip mounting inlet for the RF-ID tag using the molding plate after the hot melt resin is applied by an extrusion coater. After forming the concave part which becomes the hollow part into which the IC chip part for tag enters, after applying the hot-melt type acrylic adhesive material, it may be bonded to release paper to complete the label base part.

In addition, the present invention can be made into an inexpensive metal label.
Specifically, the IC chip portion for the RF-ID tag of the IC chip mounting inlet formed continuously was formed on the back surface of the label base portion while peeling the release paper of the label base portion. After bonding so as to be inserted into the IC chip portion insertion recess for the RF-ID tag, after applying a hot-melt acrylic adhesive containing soft magnetic metal powder, it is inexpensive if it is completed by bonding with release paper A metal-compatible RF-ID tag label is completed.
That is, the electromagnetic wave from the reader / writer for the RF-ID tag passes through a hot-melt acrylic adhesive containing soft magnetic metal powder such as applied ferrite, so that the metal product with the label attached thereto By suppressing the generation of eddy currents on the surface, it becomes an inexpensive metal-compatible RF-ID tag label.

In terms of form, it is possible to develop not only labels but also cards.
In other words, the development of the present invention in the form of a card is based on the application of an ionizing radiation curable resin to the back surface of a card substrate such as white, and then using a molding plate cylinder, the RF-ID tag IC chip mounting inlet RF- After forming the IC tag portion insertion recess for the ID tag, after curing by irradiating with ionizing radiation, a hot-melt acrylic adhesive material is applied, and then bonded to release paper to complete the label substrate portion.
Further, the IC chip portion for RF-ID tag of the IC chip mounting inlet for RF-ID tag formed continuously on the same material base material as the card base material such as white while peeling the release paper of the label base portion. If you finish the credit card size and paste it so that it is inserted into the IC chip part insertion recess for the RF-ID tag formed on the back of the card base part, an inexpensive RF-ID tag chip mounting card is completed To do.

Further, it is possible to develop not only cards but also rewrite cards.
That is, the development of the rewritable card according to the present invention is to apply an ionizing radiation curable resin to the back surface of a rewritable film substrate coated with a rewritable material such as a heat-sensitive rewritable material on the surface, and then use a molding plate cylinder to make RF -After the IC chip mounting inlet recess of the ID tag IC chip mounting inlet is formed, after irradiation with an ionizing radiation curable resin and curing, a hot melt acrylic adhesive is applied, and then attached to a release paper Together, the label base material is completed.
Further, the RF-ID tag IC chip part of the RF-ID tag IC chip mounting inlet formed in the same material continuous form as the white rewrite film base material while peeling the release paper of the rewritable film base part is provided. An RF-ID tag chip-mounted rewrite card can be obtained by applying a finishing process to the credit card size after bonding so as to be inserted into the RF-ID tag IC chip portion insertion recess formed on the back surface of the rewrite film base. Complete.

Furthermore, although it is a processed surface, in the said Example, after apply | coating ionizing radiation curable resin to the back surface of a label base material, RF-ID of IC-chip mounting inlet for RF-ID tags using a molding plate cylinder is used. After forming the IC chip part insertion concave part for tags, after irradiating with ionizing radiation and curing, applying a hot-melt type acrylic adhesive material, it is bonded to release paper to complete the label base part.
After that, using a collator, while peeling the release paper, applying the IC chip mounting inlet for the RF-ID tag and then applying the hot-melt acrylic adhesive again, it was explained that the release paper was pasted.
This is a consideration from the viewpoint of the yield of the expensive IC chip mounting inlet for the RF-ID tag, but may be an integrated process.
That is, after applying the ionizing radiation curable resin on the back surface of the label base material, after forming the RF-ID tag IC chip portion insertion recess of the RF-ID tag IC chip mounting inlet using the molding plate cylinder, After curing by irradiation with ionizing radiation, after applying the hot melt acrylic adhesive, applying the IC chip mounting inlet for the RF-ID tag, applying the hot melt acrylic adhesive, and pasting it with the release paper But it doesn't matter.

RF-ID tag IC chip insertion recess formation explanatory diagram Labeling explanation diagram

Explanation of symbols

DESCRIPTION OF SYMBOLS 1: Label base material 2: IC chip insertion recessed part 3 for RF-ID tag 3: Supply roll 4: Coating apparatus 4a which has T-die type nozzle: Coating apparatus which has T-die type nozzle for hot-melt type acrylic adhesive materials 5: Ionizing radiation curable resin 6: Molding plate cylinder 7: Ionizing radiation 8: Reinforcing plate 9: Reinforcing plate insertion device 10: Hot melt acrylic adhesive 11: Release paper 12: Winding roll 13: Label substrate Part 14: IC chip mounting inlet for RF-ID tag 15: Collator 16: Collator supply roll 17: IC chip mounting part for RF-ID tag 18: Coating device having a T-die nozzle for collator 19: RF with reinforcing plate -ID tag label form

Claims (2)

An IC chip part insertion recess for an RF-ID tag made of ionizing radiation curable resin is provided on the back surface of the label base material. The IC chip part insertion recess for the RF-ID tag has a reinforcing plate and further has an adhesive. The RF-ID tag IC chip mounting inlet is disposed at a position where the RF-ID tag IC chip mounting portion is inserted into the RF-ID tag IC chip mounting insertion recess, and the RF-ID tag IC chip mounting inlet. An RF-ID tag label equipped with a reinforcing plate, which has an adhesive on the back surface of the sheet and can be printed on the entire surface with release paper. After applying the ionizing radiation curable resin on the back surface of the label substrate, forming the IC chip part insertion recess for the RF-ID tag using the molding plate cylinder, and then irradiating the ionizing radiation to the ionizing radiation curable After the resin curing step, after inserting the reinforcing plate into the RF-ID tag IC chip portion insertion recess, after applying the adhesive material, the RF-ID tag IC chip mounting inlet of the RF-ID tag IC chip mounting inlet Is inserted into the RF-ID tag IC chip portion insertion recess and after the bonding process, and then the adhesive material is applied to the back surface of the RF-ID tag IC chip mounting inlet and then bonded to the release paper. An RF-ID tag label equipped with a reinforcing plate, which can be printed on the entire surface.

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