JP2008171850A - Power supply board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a power supply board in which power apparatus components and control element components contained in the power supply board housing can be cooled while sustaining temperature rise balance properly with circulation air flow formed in the power supply board housing by a cooling fan for cooling the power apparatus components, i.e. the heat generating components contained in the power supply board housing, forcibly. <P>SOLUTION: The power supply board comprises a duct 7 arranged in the power supply board housing 1, a plurality of power apparatus components 4 and 5 arranged in the inside region 15 of the duct 7, cooling fans 2 provided in correspondence with respective power apparatus components 4 and 5, control element components 3 arranged in the power supply board housing 1 in the outside region 16 of the duct 7, and a liquid cooled heat exchanger 8 provided in the duct 7 and cooling air flow 17 circulating the inside region 15 and the outside region 16 of the duct 7 at the outlet from the inside region 15 of the duct 7 by means of the cooling fan 2 in the power supply board housing 1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a structure for forcibly air-cooling a heat generating device in a power supply panel of a machine tool, particularly a machine tool such as an electric discharge machine or a laser processing machine, by air flow, and efficiently cooling a heat generating component in the power supply panel It relates to the method.

There are various installation conditions for components installed in the power panel of laser processing machines, such as those that generate high heat, those that generate a small amount of heat but have a low heat-resistant temperature, and those that cannot increase the distance between components. It is necessary to satisfy all these conditions when designing.
For example, according to Patent Document 1, a power supply component such as a transformer, which is a heat generating component, is installed directly in a duct through which cooling air flows, or indirectly through fins, etc. It is cooling.

JP-A-9-213532 (first page, FIG. 1)

  In such a cooling structure, many heat generating parts are installed in the cooling duct, and many cooling fins are installed on the wall surface of the cooling duct. There is a problem that the entire power supply panel becomes large, such as an increase in length. In order to increase the cooling efficiency, it is necessary to increase the air flow velocity in the duct. For this reason, if a throttle or the like is added to the duct, the pressure loss increases. To cope with this, an expensive large cooling fan is required. This is accompanied by issues such as the need for

  The present invention has been made to solve the above-described problems, and is formed inside a power panel housing by a cooling fan that forcibly cools power equipment components housed in the power panel housing. It is an object of the present invention to obtain a power supply panel that can cool a power device component and a control element component housed in a power supply panel casing while maintaining a proper balance of temperature rise.

  In the power panel according to the present invention, a duct disposed inside the power panel casing, a plurality of power device parts disposed in an inner region of the duct, and a corresponding one of the power device parts. A cooling fan provided; a control element component disposed in an outer region of the duct and within the power panel housing; and the cooling fan in the power panel housing inside the duct. The duct is provided with a liquid-cooled heat exchanger that cools the air flow circulating between the region and the outer region of the duct at the outlet from the inner region of the duct.

  According to the present invention, the electric power housed in the power board housing by the circulating air flow formed inside the power board housing by the cooling fan for forcibly cooling the power equipment components housed in the power board housing. It is possible to obtain a power supply panel that can cool the device parts and the control element parts while maintaining a proper balance of temperature rise.

Embodiment 1 FIG.
A first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a side view showing a configuration of a power supply panel in the first embodiment.

In FIG. 1, a power supply panel including a power supply panel casing 1 hermetically sealed is used as a power supply device for a machine tool such as an electric discharge machine or a laser processing machine. Inside the power supply cabinet 1 are power equipment components such as a transformer 4 and a reactor 5 connected to a constant voltage direct current unit, a switching unit and a rectifier, and a large number of electronic devices for controlling these power equipment components. Control element components such as a power supply circuit control board 3 on which circuit elements are mounted are accommodated.
The duct 7 disposed inside the power panel housing 1 is provided by extending a rectangular tubular wall surface 7a vertically from the bottom plate 11 toward the top plate 10 at the center of the horizontal surface of the power panel housing 1. The upper portion has a truncated pyramid-shaped enlarged portion wall surface 7b formed in a divergent shape toward the upper side.
The transformer 4 is installed on the bottom plate 11 below the inner region 15 in the duct 7, and a plurality of reactors 5 are disposed on the upper portion of the inner region 15 in the duct 7, that is, inside the enlarged portion wall surface 7 b in the duct 7. Is located above the transformer 4 so as to leave a space above and below the central portion.
A water-cooled heat exchanger 8 is provided at the upper end surface of the duct 7 to cool the air flow passing through the upper end surface of the duct 7 by heat exchange with a liquid cooling medium such as cooling water at the outlet of the duct 7. A predetermined space is secured between the upper surface of the water-cooled heat exchanger 8 and the top plate 10 of the power panel housing 1, and cooling toward the wall surfaces 1 a and 1 b of the power panel housing 1 along the top plate 10. A circulation path for the working air flow is formed.
The power supply circuit control board 3 is disposed in the board rack unit 6 provided in the outer region 16 of the duct 7 so as to be located on both the left and right sides of the inside of the power supply panel housing 1 in the figure on the side of the duct 7.
The transformer 4 and the plurality of reactors 5 are forcibly cooled by the individual cooling fans 2 attached to the cylindrical wall surface 7a and the enlarged portion wall surface 7b of the duct 7, respectively.

The cooling fan 2 that forcibly cools the transformer 4 and the reactor 5 as power equipment components that generate heat is generated when the transformer 4 and the reactor 5 are forcibly cooled. After the air flow from the outer region 16 of the duct 7 toward the inner region 15 is generated and the transformer 4 and the reactor 5 are forcibly cooled, the air flows from the inner region 15 of the duct 7 through the water-cooled heat exchanger 8 along the top plate 10. A circulating air flow is formed which reaches the wall surfaces 1a and 1b of the power supply cabinet 1 and returns to the cooling fan 2 through the board rack unit 6 in which the power circuit control board 3 provided in the outer region 16 of the duct 7 is disposed. To do.
By this circulating air flow, the transformer 4 and the reactor 5 are forcibly cooled, and a relatively weak cooling action is given to the power supply circuit control board 3 arranged in the board rack unit 6.

Among the heat generating components housed in the power panel 1, high heat generating components such as inverter-related elements are directly connected to a water cooling jacket installed in the board rack unit 6 that is an assembly of the power circuit control boards 3. Since it is cooled, there is no major problem in terms of temperature.
On the other hand, since the transformer 4 and the reactor 5 cannot be directly water-cooled, a strong forced air-cooling system using the cooling fan 2 must be taken.
Further, weak heating elements installed on the power supply circuit control board 3 in the board rack unit 6 or parts having a sufficiently high heat-resistant temperature are weak, though not directly forced air-cooled by the cooling fan 2. Cooling is needed.

As a method for satisfying these overall requirements with a small number of cooling fans 2, in the first embodiment shown in FIG. 1, a duct 7 for installing a water-cooled heat exchanger 8 is provided in the power panel housing 1, and The transformer 4 and the reactor 5 that require strong forced air cooling are installed in the duct 7, and the cooling air from the cooling fan 2 installed on the wall surfaces 7 a and 7 b of the duct 7 is directly applied to the transformer 4 and the reactor 5 at 1: 1. So that you can win.
The air that has been deprived of heat in the duct 7 and heated to a high temperature is cooled through the water-cooled heat exchanger 8 at the exhaust end of the duct 7 and then discharged into the power supply cabinet 1 as a low-temperature air flow. The

In FIG. 1, a duct 7 having a transformer 4 and the like is provided in the center of the power panel housing 1, and is exhausted from the top end to the left and right along the top plate 10 of the power panel housing 1. Then, after proceeding to the vicinity of the wall surfaces 1a and 1b at the left and right ends of the power supply panel housing 1, it descends and passes through each board rack unit 6 and then passes to the cooling fan 2 installed on the wall surfaces 7a and 7b of the duct 7. Refluxed.
Since the cooling fan 2 is relatively lower and the exhaust of the duct 7 is discharged upward, the cooling air flow in the power panel housing 1 is circulated evenly in the power panel housing 1. .

  As a means for preventing the hot air from the transformer 4 from hitting the reactor 5 located above the transformer 4 as shown in FIG. The hot air from 4 passes through the inside of the duct 7 without touching the reactor 5, and the reactor 5 can be directly exposed to the cold air from the outside of the duct 7.

By such a cooling air circulation system, even with the minimum number of cooling fans 2, it is possible to properly cool all components from components that require strong cooling to components that may be weakly cooled. .
It should be noted that even in the case of the weak heat generating component group in the power supply circuit control board 3 installed inside the board rack unit 6, the part that needs to be actively cooled is positioned near the suction port of the cooling fan 2. More appropriate cooling can be performed.

  In the first embodiment according to the present invention, the minimum small cooling fan 2 is assigned 1: 1 to parts that require a large cooling efficiency, and the above-described cooling fan 2 is used for a part group that requires a small cooling efficiency. The purpose is to keep the temperature rise balance of the components in the whole panel appropriately with a small number of cooling fans 2 such as cooling using a circulating flow in the panel.

  In the cooling system according to the first embodiment of the present invention, the transformer 4 and the reactor 5 which are high heat-generating parts are installed in the cooling air duct 7 and the cooling fan 2 is installed on the wall surfaces 7 a and 7 b of the duct 7. The transformer 4 and the reactor 5 are directly exposed to the outside air of the duct 7 in a 1: 1 relationship. The air flow deprived of heat from the transformer 4 and the reactor 5 is cooled through the water-cooled heat exchanger 8 installed on the end face of the duct 7 and then discharged into the power panel housing 1 to be discharged into the power panel housing. 1 is circulated through the circuit board 1 and passes through the board rack unit 6, which is an assembly of the power supply circuit control boards 3, and is then returned to the cooling fans 3 provided on the wall surfaces 7 a and 7 b of the duct 7. Is.

In the first embodiment according to the present invention, the cooling fan 2 is installed in a 1: 1 relationship with the high heat generating component including the transformer 4 and the reactor 5, so that the maximum flow velocity obtained from the cooling fan 2 is blown onto the surface of the high heat generating component. be able to. Therefore, since the surface heat transfer coefficient of the high heat-generating component including the transformer 4 and the reactor 5 can be maximized and can be cooled in a state where the temperature of the cooling air does not increase, a remarkable cooling effect that has not been obtained conventionally can be obtained. it can.
Further, the exhaust from the water-cooled heat exchanger 8 is discharged to the upper part of the power panel housing 1, and the cooling fan 2 is disposed from the lower part of the power panel panel 1 to be discharged from the water-cooled heat exchanger 8. The air flow thus circulated in the power supply panel casing 1 as a whole, but since the board rack unit 6 which is an aggregate of the power circuit control boards 3 is installed in the middle of the circulation path, the cooling air flow is changed to the board rack unit 6. After cooling the small heat-generating component consisting of the power supply circuit control board 3 in the meantime, it is returned to the cooling fan 2. That is, the present invention provides a cooling structure that enables cooling of a small heat generating component composed of the power supply circuit control board 3 with only the cooling fan 2 dedicated to the high heat generating component.

(1A) According to Embodiment 1 of the present invention, a plurality of ducts 7 including a duct 7 disposed inside the power panel housing 1 and a transformer 4 and a reactor 5 disposed in the inner region 15 of the duct 7 are provided. A cooling fan 2 provided corresponding to each of the power equipment parts and the power equipment parts including the transformer 4 and the reactor 5, and the outside region 16 of the duct 7 is provided inside the power supply cabinet 1. The control element component including the power supply circuit control board 3 disposed, and the cooling fan 2 provided in the duct 7 allows the inner region 15 of the duct 7 and the outer region 16 of the duct 7 to be connected to the power panel casing. 1 is provided with a liquid-cooled heat exchanger comprising a water-cooled heat exchanger 8 for cooling an air flow circulating in the interior of the duct 7 at the outlet from the inner region 15 of the duct 7 to the outer region 16 of the duct 5. Therefore, it is formed inside the power panel housing 1 by the cooling fan 2 that forcibly cools the power equipment components including the transformer 4 and the reactor 5, which are heat generating components that are housed in the power panel housing 1, and generate predetermined heat. The temperature rise balance of the power device component composed of the transformer 4 and the reactor 5 and the control element component composed of the power supply circuit control board 3 housed in the power supply panel casing 1 by the circulating air flow 17 appropriately cooled at the respective locations. A power panel that can be kept properly cooled can be obtained.
That is, a power supply circuit control board in which a constant voltage DC unit, a switching unit, a transformer 4, a reactor 5, a rectifier, and the like are housed in a dustproof hermetically sealed power supply cabinet 1 and a large number of electronic circuit elements are mounted. In a power supply / control unit of a machine tool such as an electric discharge machine or a laser processing machine in which is stored, a duct 7 that includes a water-cooled heat exchanger 8 is provided in the power panel housing 1 and a strong power is provided in the duct 7. The transformer 4 and the reactor 5 that require forced air cooling are installed so that the wind from the cooling fan 2 installed on the wall of the duct 7 directly hits the transformer 4 and the reactor 5 in a 1: 1 relationship. Then, the air that has taken away heat in the duct 7 and has been heated to high temperature is cooled through the water-cooled heat exchanger 8 at the exhaust end of the duct 7, and then becomes a low-temperature air flow in the power supply cabinet 1. Released. In addition, a duct 7 having a transformer 4 and the like installed in the center of the power supply panel casing 1 is exhausted to the left and right along the top plate 10 of the power supply panel casing 1 from the uppermost end. Then, after going to the left and right ends of the power panel housing 1, it descends, passes through each board rack unit 6, and then returns to the cooling fan 2 installed on the wall surfaces 7 a and 7 b of the duct 7. The power board cooling method is as follows, and has the following specific effects.
Even with the minimum number of cooling fans 3, it is possible to properly cool all components from components that require strong cooling to components that may be weakly cooled. Since the coolest air at the outlet of the water-cooled heat exchanger 8 flows through the board rack unit 6 and sequentially into the transformer 4 and the reactor 5 where the temperature finally increases, there is a temperature difference between the components and the air temperature. There is a merit that the structure which becomes large on average, that is, the air circulation with high temperature efficiency can be performed.

(1B) According to Embodiment 1 of the present invention, in the configuration in the item (1A), an enlarged wall surface 7b having a frustoconical shape is provided on the upper part of the duct 7 extending vertically, The upper part is configured to be widened toward the end, the power device parts including the plurality of transformers 4 and the reactors 5 are vertically arranged, and the power device part including the reactors 5 positioned above is configured to be widened to the end of the duct 7 A cooling fan that forcibly cools power equipment components including the transformer 4 and the reactor 5 that are heat-generating components housed in the power supply panel casing 1 because they are arranged closer to the wall surface of the head-conical enlarged portion wall surface 7b. The transformer 4 and the reactor 5 housed in the power panel housing 1 by the circulating air flow 17 formed inside the power panel housing 1 by 2 and appropriately cooled at a predetermined location. The power device parts and the control element parts made up of the power supply circuit control board 3 can be cooled while maintaining a proper balance of temperature rise, and heat is taken away from the power equipment parts in the lower part of the duct 7 to reach a high temperature. Therefore, it is difficult for the air flow to directly hit the upper power equipment component, and it is possible to obtain a power supply panel that can enhance the cooling effect of the power equipment component disposed above.
That is, the shape of the duct 7 in which the highly heat-generating parts are accommodated is widened, the parts located below are arranged near the center, and the parts located above are arranged near the wall surface 7b of the duct 7. The present invention relates to a cooling method for the power supply panel, and has the following specific effects.
It is difficult for the air flow that has been heated from the components in the lower portion of the duct 7 to be directly heated to the upper components, so that the cooling effect of the components disposed above can be enhanced.

Embodiment 2. FIG.
A second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a side view showing the configuration of the power panel in the second embodiment.
In the second embodiment, the configuration other than the specific configuration described here has the same configuration contents as the configuration described in the first embodiment and has the same effect. In the drawings, the same reference numerals indicate the same or corresponding parts.

  In FIG. 2, the upper surface of the duct 7 provided with the water-cooled heat exchanger 8 communicates with the end surface of the duct 7 and between the top panel 10 of the power panel housing 1 and along the top panel 10, the wall surface 1 a. , 1b is provided with an exhaust duct 9 forming a cooling air passage.

  The circulating air flow discharged from the duct 7 and cooled by the water-cooled heat exchanger 8 passes through the cooling air passage formed by the exhaust duct 9 extending along the top plate 10 of the power panel housing 1 to the top plate 10. It flows toward the side wall surfaces 1a and 1b and circulates downward from the vicinity of the wall surfaces 1a and 1b.

  In the second embodiment, as shown in FIG. 2, an exhaust duct 9 communicating with the duct 7 is used as a power source as a means for reliably guiding the cooling air exiting the water-cooled heat exchanger 8 to the end of the power panel housing 1. By extending to the vicinity of the wall surfaces 1 a and 1 b at the left and right ends of the panel housing 1 in the figure, it is possible to avoid a short circuit phenomenon of the cooling air flow inside the power panel housing 1 and prevent air from flowing into the board rack unit 6. There are benefits that can be prevented.

(2A) According to the second embodiment of the present invention, in the configuration according to the above-described (1A) or (1B) of the first embodiment, the liquid-cooled heat exchanger including the water-cooled heat exchanger 8 is used. Since an extended duct composed of an exhaust duct 9 for guiding the cooled circulating air flow 17 along the top plate 10 of the power supply panel casing 1 to the vicinity of the wall surfaces 1a and 1b of the power supply panel casing 1 is provided. A cooling fan 2 that forcibly cools power equipment components including a transformer 4 and a reactor 5, which are heat generating components that generate high heat, housed in the housing 1, is formed inside the power supply cabinet 1 and is appropriately formed at predetermined locations. The temperature rise balance of the power device component comprising the transformer 4 and the reactor 5 and the control element component comprising the power supply circuit control board 3 housed in the power panel housing 1 by the cooled circulating air flow 17 is provided. It is possible to properly keep cooling to prevent undesirable recirculation of the circulating air stream 17, the entire interior of the power distribution panel housing 1 can be obtained power panel where a proper cooling.
That is, the exhaust duct 7 of the water-cooled heat exchanger 8 is connected to the end of the power panel housing 1 so that the circulating air flow cooled by the water-cooled heat exchanger 8 is reliably conveyed to the end of the power panel housing 1. The power supply panel cooling system is characterized by being provided up to the vicinity of the wall surfaces 1a and 1b, and the following specific effects can be achieved.
Since the cooling air flow discharged from the water-cooled heat exchanger 8 can be prevented from flowing back to the cooling fan 2 attached to the duct 7 in a short circuit, the power supply cabinet 1 including the board rack unit 6 and the like. It becomes possible to cool the whole properly.

Embodiment 3 FIG.
A third embodiment of the present invention will be described with reference to FIG. FIG. 3 is a side view showing the configuration of the power panel in the third embodiment.
In the third embodiment, the configuration other than the specific configuration described here has the same configuration contents as the configuration in the first embodiment or the second embodiment described above and exhibits the same operation. is there. In the drawings, the same reference numerals indicate the same or corresponding parts.

  In FIG. 3, the periphery of the substrate rack unit 6 is prevented so that the cooling circulation air flow 17 discharged from the extension duct 9 and flowing downward from the vicinity of the wall surfaces 1 a and 1 b of the power supply cabinet 1 does not pass around the substrate rack unit 6. A partition plate 12 that closes the door is provided.

  The cooling circulating air flow 17 discharged from the extension duct 9 passes through the inside of the board rack unit 6 from the vicinity of the wall surfaces 1 a and 1 b of the power supply panel housing 1 without passing through the periphery of the board rack unit 6. The power supply circuit control board 3 provided in the board rack unit 6 can be reliably cooled.

  In the third embodiment, when the space around the board rack unit 6 is large, as shown in FIG. 3, the cooling air from the end of the power supply cabinet 1 does not pass around the board rack unit 6. Since a larger amount of cooling air passes through the board rack unit 6 by inserting a partition plate 12 that closes the periphery of the board rack unit 6, the heat generating device installed inside the board rack unit 6 Cooling efficiency can be increased.

(3A) According to the third embodiment of the present invention, the circulating air flow cooled by the liquid-cooled heat exchanger composed of the water-cooled heat exchanger 8 in the configuration in the above-mentioned item (2A) in the second embodiment Since the partition member made up of the partition plate 12 for guiding 17 to the control element parts made up of the power supply circuit control board 3 is provided, the transformer 4 and the reactor, which are the heat-generating parts that generate high heat and are housed in the power panel housing 1 A transformer 4 housed in the power panel housing 1 by a circulating air flow 17 formed inside the power panel housing 1 by a cooling fan 2 that forcibly cools power device parts 5 and cooled appropriately at a predetermined location. And a power supply panel that can cool the power device component composed of the reactor 5 and the control element component composed of the power circuit control board 3 while maintaining a proper balance of temperature rise. That.
That is, the partition plate 12 for partitioning the useless space is installed so that the useless cooling air does not flow in the space around the substrate rack unit 6 in the cross section of the flow path of the cooling air in the substrate rack unit 6 portion of the power supply cabinet 1. The present invention relates to a cooling method for a power supply panel, and can provide the following specific effects.
The cooling air flow discharged from the water-cooled heat exchanger 8 flows without waste, and the cooling effect inside the substrate rack unit 6 can be enhanced.

Embodiment 4 FIG.
A fourth embodiment of the present invention will be described with reference to FIG. FIG. 4 is a side view showing the configuration of the power panel in the fourth embodiment.
In the fourth embodiment, the configuration other than the specific configuration described here has the same configuration contents as those in any of the first to third embodiments described above, and has the same function. It plays. In the drawings, the same reference numerals indicate the same or corresponding parts.

  In FIG. 4, it is provided in the upper part of the duct 7 provided with the water-cooled heat exchanger 8 and communicates with the upper end face of the duct 7 along the top plate 10 between the top plate 10 of the power panel housing 1. An opening 13 is provided in a part of the exhaust duct 9 that forms a cooling air passage that circulates the cooling air flow 17 toward the wall surfaces 1a and 1b. The opening 13 is opposed to the opening 13 and generates high heat downstream. The resulting heat generating component 14 is installed.

  A part of the cooling air flow 17 cooled from the upper end face of the duct 7 by the water-cooled heat exchanger 8 provided at the upper part of the duct 7 and directed to the wall surfaces 1 a and 1 b along the top plate 10 generates high heat from the opening 13. The heat is shunted toward the generated heat generating component 14 and sprayed on the heat generating component 14 generating high heat to cool the heat generating component 14 directly and efficiently.

  In the fourth embodiment, the heat generating part generates high heat generation similar to power equipment parts such as the transformer 4 and the reactor 5, but the parts that cannot be stored in the space in the duct 7, or the transformer 4 and the reactor 5, etc. If there is a part that cannot be stored in the duct 7 due to its positional relationship with other equipment, it is downstream from the water-cooled heat exchanger 8 that communicates with the duct 7. By providing an opening 13 in a part of the exhaust duct 9 and opening a heat generating component 14 that generates high heat there, the cooling air flow 17 is directly applied to the heat generating component 14 that generates high heat. Can produce a powerful cooling effect.

(4A) According to the fourth embodiment of the present invention, in the configuration of the (2A) item of the second embodiment or the (3A) item of the third embodiment, the liquid cooling comprising the water-cooled heat exchanger 8 The circulation air flow 17 cooled by the heat exchanger is directed to an extension duct composed of an exhaust duct 9 that guides the circulating air flow 17 along the top plate 10 of the power supply panel casing 1 to the vicinity of the wall surfaces 1a and 1b of the power supply panel casing 1. Since the opening 13 through which a part of the circulating air flow 17 flows out is provided, and the heat generating component 14 that generates high heat generation is disposed opposite to the opening 13, the heat generating component housed in the power supply cabinet 1 is used. The power supply cabinet 1 is formed in the power supply cabinet 1 by a cooling fan 2 that forcibly cools power equipment components including a transformer 4 and a reactor 5 and is cooled appropriately at a predetermined location. Housed transformer 4 A power supply device that can cool the power device component made up of the reactor 5 and the control device component made up of the power supply circuit control board 3 while maintaining a proper temperature rise balance, and can efficiently cool the heat generating component 14 that cannot be stored in the duct 7. A board can be obtained.
That is, the present invention relates to a cooling method for a power supply panel, characterized in that an opening 13 is provided in a part of an exhaust duct 9 from the water-cooled heat exchanger 8 and a heat generating component 14 is arranged there. It is possible to achieve a specific effect.
Since the cooling air flow from the water-cooled heat exchanger 8 can be directly applied to the heat generating component 14, the heat generating component 14 that generates high heat can be efficiently cooled even when it cannot be stored in the duct 7.

Embodiment 5. FIG.
A fifth embodiment of the present invention will be described with reference to FIG. FIG. 5 is a side view showing the configuration of the power supply panel in the fifth embodiment.
In the fifth embodiment, the configuration other than the specific configuration described here has the same configuration contents as those in any of the first to fourth embodiments described above, and has the same function. It plays. In the drawings, the same reference numerals indicate the same or corresponding parts.

  In FIG. 5, a substrate rack unit 6 is installed inside the power supply cabinet 1 only on the left side of the figure in the side of the duct 7 inside the power supply cabinet 1.

The circulating air flow for cooling that circulates from the upper end surface of the duct 7 through the water-cooled heat exchanger 8 and that is discharged from the extension duct 9 that extends along the top plate 10 to the left side of the duct 7 1 passes through the inside of the board rack unit 6 installed on the left side of the duct 7 from the vicinity of the wall surface 1a to the cooling fan 2, and the power supply circuit control board 3 provided in the board rack unit 6 is reliably cooled.
The circulating air flow for cooling, which flows from the upper end face of the duct 7 through the water-cooled heat exchanger 8 and is discharged to the right side of the duct 7, is cooled by the duct 7 from the vicinity of the wall surface 1 b of the power supply cabinet 1. Is recirculated to the fan 2.

  In the first to fourth embodiments, the case where the board rack units 6 are provided on the left and right sides on the side of the duct 7 inside the power supply cabinet 1 is shown, but in this fifth embodiment, as shown in FIG. The rack unit 6 is configured to be located on one side of the duct 7 side, and in this case as well, the same effects as in the first to fourth embodiments can be obtained.

(5A) According to the fifth embodiment of the present invention, the items (1A) and (1B) of the first embodiment, the (2A) term of the second embodiment, the (3A) of the third embodiment ) And the configuration in any one of the above-described (4A) items of the fourth embodiment, the board rack unit 6 on which the control element parts including the power supply circuit control board 3 are installed is provided only on one of the left side and the right side of the duct 7 in the drawing. Since it is provided, it is formed inside the power panel housing 1 by a cooling fan 2 that forcibly cools power equipment components including the transformer 4 and the reactor 5 which are heat generating components housed in the power panel housing 1. A power equipment component consisting of a transformer 4 and a reactor 5 housed in a duct 7 disposed inside the power panel housing 1 by a properly cooled circulating air flow 17 and the left side of the duct 7 in the figure. Others can be obtained power panel that can be cooled while maintaining proper temperature rise each balance control element part and consisting of a substrate rack unit 6 disposed a power supply circuit control board 3 provided on only one of the right side.

It is a side view which shows the structure of the power supply panel in Embodiment 1 by this invention. It is a side view which shows the structure of the power supply panel in Embodiment 2 by this invention. It is a side view which shows the structure of the power supply panel in Embodiment 3 by this invention. It is a side view which shows the structure of the power supply panel in Embodiment 4 by this invention. It is a side view which shows the structure of the power supply panel in Embodiment 5 by this invention.

Explanation of symbols

  1 Power board housing, 2 cooling fan, 3 power circuit control board, 4 transformer, 5 reactor, 6 board rack, 7 duct, 8 water-cooled heat exchanger, 9 exhaust duct, 10 top plate, 11 bottom plate, 12 partition Plate, 13 opening, 14 exothermic part.

Claims (5)

  A duct disposed inside the power panel housing, a plurality of power device components disposed in an inner region of the duct, and a cooling fan provided corresponding to each of the power device components, A control element part disposed inside the power supply panel casing in an outer area of the duct, and an inner area of the duct and an outer area of the duct by the cooling fan inside the power supply panel casing A power panel having a liquid-cooled heat exchanger for cooling an air flow circulating in the duct at an outlet from an inner region of the duct.   The upper part of the duct extending vertically is configured to be widened toward the end, a plurality of the power equipment parts are arranged vertically, and the power equipment part located above is disposed near the wall surface configured to be widened to the end of the duct. The power supply panel according to claim 1.   2. An extension duct for guiding the circulating air flow cooled by the liquid-cooled heat exchanger along the top plate of the power panel housing to the vicinity of the wall surface of the power panel housing is provided. Or the power supply panel of Claim 2.   4. The power panel according to claim 3, further comprising a partition member for guiding the circulating air flow cooled by the liquid-cooled heat exchanger to the control element component.   The extension duct is provided with an opening through which a part of the circulating air flow flows out to the outside of the extension duct, and a heat generating component is disposed outside the extension duct and in the vicinity of the opening. The power board according to claim 3 or claim 4.

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