JP2008166551A - Component recognition device, surface mounting equipment and component testing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make the lower portion of the suction nozzle in a component recognition device thin without causing degradation in performance by reducing the size of an optical system or a lens thereby narrowing the field-of-view of a lower surface imaging means or darkening the brightness of the lens in the component recognition device performing image recognition by sequentially imaging the suction state of an electronic component by the suction nozzle when a head unit is transporting the electronic component sucked to the suction nozzle from a component feeding section to a target position. <P>SOLUTION: The component recognition device comprises a first optical path changing section 8c, a second optical path changing section 8d, a lower surface imaging means 8f, and an illumination means 8e wherein the illumination means 8e irradiates illumination light in the direction of an electronic component 2 sucked to a suction nozzle 6a through the first optical path changing section 8c and the second optical path changing section 8d. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a component recognition device that recognizes an image of a suction state of an electronic component by a suction nozzle, and a surface mounter and a component testing device that include such a component recognition device.

  In general, a surface mounting machine or a component testing apparatus for electronic components is configured to suck and convey electronic components to a target position by a suction nozzle mounted on a movable head unit. 2. Description of the Related Art Conventionally, as a machine or a component test device, a component recognition device that recognizes an image of a suction state of an electronic component by a suction nozzle is mounted on a head unit.

  Such a surface mounter or component testing apparatus is generally configured such that a component recognition device is integrally provided with a bottom surface imaging means, an illumination means, and an optical path changing means such as a mirror, and is relatively movable with respect to the head unit. When the scan unit moves substantially in parallel along the suction nozzle row, the lower surface image pickup unit provided in the scan unit via the optical path changing unit moves the lower surface of the electronic component. It is configured to take an image.

  For example, in Patent Document 1, a first optical path changing unit that changes the direction of light downward from the suction nozzle to a direction from the lower side of the suction nozzle to the side, and further changes the direction of the light toward the side. Component recognition in a mounting machine comprising a second optical path changing unit, and provided with illumination means below the first optical path changing unit and configured to image the lower surface of the electronic component sucked by the suction nozzle by the lower surface imaging unit Device technology is disclosed.

Such a component recognition apparatus is an advantageous mechanism for shortening the mounting time because the component recognition can be performed simultaneously with the XY movement from the component suction position to the mounting position.
JP-A-8-32299

  However, in the technology of the component recognition apparatus in the conventional mounting machine, it is necessary to provide illumination means and optical path changing means such as a mirror below the suction nozzle, and it is necessary to increase the position of the head unit. For this reason, there is a problem that the entire component mounting apparatus is increased in size.

  In order to solve this problem, if the optical system and the lens are made small to make the portion between the optical system below the suction nozzle and the illumination means thinner, the field of view of the lower surface imaging means becomes narrower, There has been a problem in that the performance deteriorates such as the brightness becoming dark.

  The present invention has been made in view of the above problems, and it is possible to reduce the optical system and the lens so as to narrow the field of view of the lower surface image pickup means and to reduce the brightness of the lens without causing performance deterioration. It is an object of the present invention to provide a component recognition device, a surface mounter, and a component testing apparatus that can reduce the height of the head unit by making the portion below the suction nozzle thin so as to reduce the height of the head unit.

  A component recognition apparatus according to the present invention for solving the above problems is provided in a movable head unit having a suction nozzle capable of sucking an electronic component, and the electronic component having the head unit sucked by the suction nozzle is supplied to a component supply unit. A component recognition device that recognizes an image by picking up an electronic component suction state at a suction nozzle while transporting from the suction nozzle to a target position, and is positioned below the suction nozzle and downward from the suction nozzle during imaging. A first optical path changing unit that changes the direction of the light that travels from the lower side of the suction nozzle to the side, a second optical path changing unit that further changes the direction of the light going to the side, and the second optical path changing unit A lower surface imaging means that images the lower surface of the electronic component that is disposed in the direction of the light changed by the suction and sucked by the suction nozzle via the first optical path changing unit and the second optical path changing unit, and the first optical path changing unit. Parts and a component recognizing device is characterized in that an illumination means for irradiating illumination light toward the electronic component sucked by the suction nozzle through the second optical path changing unit.

  According to the component recognition apparatus of the present invention, the illumination unit irradiates illumination light in the direction of the electronic component sucked by the suction nozzle via the first optical path changing unit and the second optical path changing unit. There is no need to provide it below the suction nozzle. As a result, the thickness of the component recognition device including the illumination means and the optical system without causing performance degradation such as reducing the optical system and the lens to narrow the field of view of the lower surface imaging means or darkening the brightness of the lens. Can be made thinner. Further, the height of the head unit can be reduced to make the entire apparatus compact, and the space of the apparatus can be saved.

  Here, the illuminating means is provided substantially on an extension line of light traveling from the first optical path changing unit to the second optical path changing unit, and from the back of the optical path changing surface of the second optical path changing unit toward the first optical path changing unit. Illuminating light is irradiated, and the optical path changing surface of the second optical path changing unit is formed as a semi-transparent surface that can transmit the light of the illumination means provided behind the optical path changing surface to the front of the optical path changing surface. The illumination means is configured to illuminate the lower surface of the electronic component sucked by the suction nozzle with the illumination light that passes through the optical path changing surface of the second optical path changing unit and is reflected by the first optical path changing unit. It is preferable.

  In this way, the optical path changing surface of the second optical path changing unit is formed as a semi-transparent surface, and the electronic component sucked by the suction nozzle with the illumination light from the illumination means provided behind the optical path changing surface Since the lower surface is configured to illuminate, it is possible to make the component recognition apparatus more compact by consolidating the illumination means behind the optical path changing surface.

  Here, the first optical path changing unit changes the direction of light directed downward from the suction nozzle by about 90 degrees to a substantially horizontal side, and the second optical path changing unit is a direction of light from the first optical path changing unit. Is preferably further changed by about 90 degrees.

  In this way, since the first optical path changing unit and the second optical path changing unit change the direction of light by about 90 degrees, an optical path change with an appropriate angle and a field of view with an appropriate size can be obtained.

  Moreover, it is preferable that the optical path changing surface of the second optical path changing unit is constituted by a half mirror as a semi-transparent surface.

  In this way, since the optical path changing surface of the second optical path changing unit is composed of an inexpensive half mirror, the cost of the optical system can be reduced.

  Alternatively, it is preferable that the optical path changing surface of the second optical path changing unit is constituted by a reflecting prism as a semi-transparent surface.

  In this case, since the optical path changing surface of the second optical path changing unit is configured by the reflecting prism, the reflective material is distorted or peeled off as compared with the case where the optical path changing surface is configured by the half mirror. It can be used for a long time.

  Moreover, it is preferable to provide a slit that is provided between the suction nozzle and the first optical path changing unit and limits a range through which light passes.

  In this way, since the slit for limiting the range through which the light passes is provided between the suction nozzle and the first optical path changing unit, excess reflected light from outside the range to be imaged is transmitted to the lower surface imaging means. A clear image without flare can be obtained without being incident.

  Further, the head unit includes a plurality of suction nozzles arranged in a row, and the first optical path changing unit, the second optical path changing unit, the lower surface imaging unit, and the illumination unit move substantially in parallel with the suction nozzle row. It is provided integrally with the scan unit provided, and the scanning unit moves along the suction nozzle row, so that the illumination means provided in the scan unit is used for the electronic parts sucked by the respective suction nozzles. It is preferable that the lower surface imaging means provided in the scan unit is configured to image the lower surface of the illuminated electronic component while illuminating the lower surface.

  In this case, the first optical path changing unit, the second optical path changing unit, the lower surface imaging unit, and the illumination unit are integrally provided in the scan unit, and the scan unit is substantially parallel to the suction nozzle row. Since it can move, it is possible to realize a thin and space-saving component recognition device that can image a plurality of suction nozzles in a row.

  In addition, a surface mounting machine according to the present invention for solving the above problem includes a movable head unit having a suction nozzle capable of sucking an electronic component, and sucks the electronic component from the component supply unit by the suction nozzle, An electronic component picked up by the suction nozzle is image-recognized and the state of suction of the electronic component with respect to the suction nozzle is recognized, and then the electronic component is mounted on a substrate. A surface mounting machine comprising the above-described component recognition device as means for recognizing the suction state.

  According to the surface mounting machine of the present invention, since the above-described component recognition device is provided as a means for recognizing the suction state of the electronic component by the suction nozzle, the entire surface mounting machine is reduced by reducing the height of the head unit. It becomes compact and space saving of the surface mounter can be achieved.

  In addition, a component testing apparatus according to the present invention for solving the above problem includes a movable head unit having a suction nozzle capable of sucking an electronic component, and sucks the electronic component from the component supply unit by the suction nozzle, A component testing device that images the electronic component sucked by the suction nozzle and recognizes the state of suction of the electronic component with respect to the suction nozzle, and then transfers the electronic component to an inspection unit and performs various inspections. A component testing apparatus comprising the above-described component recognition device as means for recognizing an image of the suction state of an electronic component by a suction nozzle.

  According to the component testing apparatus of the present invention, the above-described component recognition device is provided as means for recognizing the state of electronic component suction by the suction nozzle. This makes it possible to reduce the space of the component testing apparatus.

  As described above, according to the present invention, it is not necessary to provide the illumination unit below the suction nozzle. Therefore, the optical system and the lens are reduced to narrow the field of view of the lower surface imaging unit, or the brightness of the lens is reduced. Therefore, the thickness of the component recognition device including the illumination means and the optical system of the component recognition device can be reduced without causing performance degradation. As a result, the height of the head unit can be reduced to make the entire surface mounter and component testing apparatus compact, and space saving of the surface mounter and component testing apparatus can be achieved.

  Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing a schematic configuration of a surface mounter 1 according to an embodiment of the present invention, and FIG. 2 is a side view showing a schematic configuration of the surface mounter 1. FIG. 3 is a side view showing the configuration of the component recognition device 8 according to the embodiment of the present invention, and FIG. 4 is a front view showing the configuration of the component recognition device 8. FIG. 5 is a plan view showing the configuration of the component recognition device 8.

  As shown in FIG. 1 and FIG. 2, a surface mounter 1 according to an embodiment of the present invention is an apparatus for mounting an electronic component 2 on a substrate 3, and is disposed on a base 1a to mount the substrate 3 on the substrate 1a. Substrate transporting means 4 for transporting, component supply parts 5 arranged on both sides of the substrate transporting means 4 for supplying a plurality of electronic components 2, and suction capable of sucking electronic components 2 from the component supply parts 5 The head unit 7 that carries the mounting head 6 having the nozzle 6 a and can move between the component supply unit 5 and the substrate 3, and the suction state of the electronic component 2 sucked by the suction nozzle 6 a of the mounting head 6 are shown. A component recognition device 8 (FIG. 3) is provided as image recognition means.

  The substrate transport means 4 has a pair of conveyors 4a and 4a for transporting the substrate 3 from the right side to the left side in FIG. 1 on the base 1a, and the substrate 3 carried by the conveyors 4a and 4a is a predetermined one. Is temporarily stopped at the mounting work position (the position of the board 3 shown in the figure), and the electronic component 2 is mounted on the board 3 here.

  The component supply unit 5 includes a number of tape feeders 5 a arranged on both sides of the board conveying means 4. Although not shown in detail, the tape feeder 5a has reels on which tapes each holding and holding small chip electronic components 2 such as ICs, transistors, capacitors, etc. are wound at predetermined intervals. The electronic component 2 is intermittently drawn from the reel and picked up by the suction nozzle 6a of the head unit 7.

  The substrate transport means 4 has a pair of conveyors 4a and 4a for transporting the substrate 3 on the base 1a, and the substrate 3 carried by the conveyors 4a and 4a has a predetermined mounting work position (see FIG. And the electronic component 2 is mounted on the substrate 3 here.

  The head unit 7 sucks and holds the electronic component 2 from the tape feeder 5a by the suction nozzle 6a and transports it to the substrate 3. In this embodiment, the head unit 7 includes the suction nozzle 6a. Six mounting heads 6 are provided in a row at equal intervals in the X-axis direction (transport direction of the substrate transport means 4).

  The suction nozzle 6a is connected to a negative pressure generator (not shown) to generate a negative pressure state at the nozzle tip, and the negative pressure suction force can detachably hold the electronic component 2 by suction. It is configured.

  Further, the suction nozzle 6a can be moved up and down (moved in the Z-axis direction) with respect to the head unit 7 by a nozzle lifting / lowering driving means (not shown) and rotated around the nozzle center axis by a nozzle rotating driving means (not shown). (Rotation around the R axis) is possible.

  Here, the nozzle raising / lowering drive means lifts and lowers the suction nozzle 6a between a lowered position when suctioning or mounting and an elevated position when carrying or imaging, and the nozzle rotation driving means The posture of the electronic component 2 is adjusted by rotating the nozzle 6a as necessary. These nozzle lifting and lowering driving means and nozzle rotation driving means are each constituted by a servo motor and a predetermined power transmission mechanism.

  The head unit 7 transports the plurality of electronic components 2 sucked by the suction nozzles 6 a between the component supply unit 5 and the substrate 3 and mounts them on the substrate 3. Therefore, the head unit 7 can move in the X-axis direction and the Y-axis direction (direction orthogonal to the X-axis direction) over a predetermined range of the base 1a.

  That is, the head unit 7 is supported so as to be movable along the X axis with respect to the mounting head support member 7a extending in the X axis direction. Further, both ends of the mounting head support member 7 a are supported by a fixed rail 9 in the Y-axis direction, and are movable along the fixed rail 9 in the Y-axis direction. The head unit 7 is driven by the X-axis servomotor 11 in the X-axis direction via the ball screw 12, and the mounting head support member 7 a is driven by the Y-axis servomotor 13 via the ball screw 14 in the Y-axis direction. Driven to.

  The component recognition device 8 sequentially images the suction state of the electronic component 2 in the suction nozzle 6a while the head unit 7 is transporting the electronic component 2 sucked by the suction nozzle 6a from the component supply unit 5 to the target position. 3 is a device provided in the head unit 7 for image recognition, and as shown in FIGS. 3 to 5, a scan unit 8a and a lower surface image capturing unit 8b provided integrally with the scan unit 8a, A first optical path changing unit 8c, a second optical path changing unit 8d, an illuminating unit 8e, and a lower surface imaging unit 8f that captures an image of the lower surface of the electronic component 2 captured by the lower surface image capturing unit 8b. The optical path changing unit 8c and the second optical path changing unit 8d are supported by the support member 8m of the scan unit 8a.

  In addition, the component recognition device 8 includes a side imaging unit 8g and a side illumination unit 8h integrally in the scan unit 8a.

  The scan unit 8a is a member provided by a servo motor (not shown) provided in the head unit 7 so as to be able to move substantially in parallel with the row of suction nozzles 6a via a ball screw 8j. By moving along the row of nozzles 6a, the illumination means 8e provided in the scan unit 8a illuminates the lower surface of the electronic component 2 adsorbed by the respective adsorption nozzles 6a, and the lower surface provided in the scan unit 8a. The imaging means 8f is configured to image the lower surface of the illuminated electronic component 2.

  The lower surface image capturing unit 8b is a portion that can capture an image of the lower surface of the electronic component 2 sucked by the suction nozzle 6a by passing under the suction nozzle 6a when the scan unit 8a moves. In the present embodiment, the lower surface image capturing unit 8b includes a first optical path changing unit 8c. Between the first optical path changing unit 8c and the suction nozzle 6a, disturbance light is applied to the lower surface imaging unit 8f. A vertically long rectangular slit (not shown) is provided to limit the light passage range so as to avoid incident light.

  The first optical path changing unit 8c is located below the suction nozzle 6a at the time of imaging, and changes the direction of light directed downward from the suction nozzle 6a by about 90 degrees to the substantially horizontal side, so that the side from the bottom of the suction nozzle 6a Change in the direction toward the direction. In the present embodiment, the first optical path changing unit 8c is configured by a reflecting prism.

  The second optical path changing unit 8d is an optical device that changes the direction of the light from the first optical path changing unit 8c by about 90 degrees and further changes the direction of the light directed to the side. Consists of mirrors. Therefore, the optical path changing surface 8g functions as a semi-transparent surface for light from behind the optical path changing surface 8g, and the light of the illumination means 8e provided behind the optical path changing surface 8g is transmitted in front of the optical path changing surface 8g. Can be transmitted through.

  The upper surface 8p of the support member 8m that supports the first optical path changing unit 8c and the second optical path changing unit 8d is positioned below the upper surface 8q of the first optical path changing unit 8c and the upper surface 8s of the second optical path changing unit 8d. It is configured to be.

  The illuminating means 8e illuminates the lower surface of the electronic component 2 by irradiating illumination light in the direction of the electronic component 2 sucked by the suction nozzle 6a via the first optical path changing unit 8c and the second optical path changing unit 8d. A plurality of light emitting diodes are employed as the illumination means 8e. In the present embodiment, the illuminating means 8e is provided on a substantially extended line of light traveling from the first optical path changing unit 8c to the second optical path changing unit 8d, and is provided from the back of the optical path changing surface 8g of the second optical path changing unit 8d. The illumination light is irradiated in the direction of the one optical path changing unit 8c. As described above, the illumination unit 8e illuminates the lower surface of the electronic component 2 sucked by the suction nozzle 6a with the illumination light that passes through the optical path changing surface 8g of the second optical path changing unit 8d and is reflected by the first optical path changing unit 8c. Is configured to do.

  The lower surface imaging means 8f picks up the lower surface of the electronic component 2 that is attracted by the suction nozzle 6a and illuminated by the illumination means 8e via the first optical path changing unit 8c and the second optical path changing unit 8d. For example, a CCD line sensor camera. The lower surface imaging means 8f is arranged in the scan unit 8a with the imaging direction set sideways so as to face the direction of the light whose optical path has been changed by the second optical path changing unit 8d.

  The side image pickup unit 8g is a camera configured to image the electronic component 2 from the side at a position lateral to the bottom surface image pickup unit 8f. The side image pickup unit 8g is configured by a CCD line sensor camera, for example, similarly to the bottom image pickup unit 8f. Yes.

  The lower end portion 8r of the side image capturing unit 8n of the side imaging unit 8g is located below the upper surface 8q of the first optical path changing unit 8c and the upper surface 8s of the second optical path changing unit 8d.

  The side illumination means 8h is a device that illuminates the side surface of the electronic component 2, and employs a plurality of light emitting diodes, and the plurality of light emitting diodes have a concave shape so as to avoid interference with the large electronic component 2a. It is arranged on the end side of the formed scan unit 8a.

  The lower surface image pickup means 8f and the side image pickup means 8g are arranged so that when the electronic component 2 is sucked by the suction nozzle 6a in each component supply section 5, the suction nozzle is moved while being transferred from each component supply section 5 to the substrate 3. The electronic component 2 of 6a is imaged, and the captured image (the reflection image of the lower surface of the electronic component 2 and the transmission image of the side surface of the electronic component 2) is an image processing device 23 provided in the control device 20 (FIG. 6). Is subjected to image processing.

  Next, the control device 20 of the surface mounter 1 will be described with reference to FIG. FIG. 6 is a block diagram illustrating a schematic configuration of the control device 20 of the surface mounter 1.

  As shown in FIG. 6, the control device 20 includes a main control unit 21, an axis control unit 22, an illumination control unit 23, a camera control unit 24, and an image processing unit 25 as functional configurations.

  The main control unit 21 controls the operation of the mounting machine in an integrated manner. The main control unit 21 is a well-known CPU for executing logical operations, a ROM for storing various programs for controlling the CPU in advance, and various operations during operation of the apparatus. It is composed of a RAM for temporarily storing data. The main control unit 21 controls each device such as the board transport unit 4, the component supply unit 5, the mounting head 6, the head unit 7, and the component recognition device 8 in accordance with a program stored in advance.

  The axis control unit 22 controls driving of various servo motors 31 such as the X-axis servo motor 11, the Y-axis servo motor 13, and the servo motor of the scan unit 8a while exchanging control signals with the main control unit 21. Each servo motor 31 is provided with an encoder 32, whereby the movement position of each part is detected and fed back to the axis control unit 22 as a control signal.

  The illumination control unit 23 controls the illumination unit 8e of the lower surface imaging unit 8f in accordance with the imaging of the electronic component 2 by the lower surface imaging unit 8f while exchanging control signals with the main control unit 21.

  The camera control unit 24 controls the lower surface imaging unit 8 f of the component recognition device 8 while exchanging control signals with the main control unit 21.

  The image processing unit 25 performs predetermined processing on the image signal output from the lower surface imaging unit 8 f to generate image data suitable for component recognition and outputs the image data to the main control unit 21. Then, the main control unit 21 performs an operation such as calculating an amount of adsorption deviation (adsorption error) based on the image data output from the image processing unit 25.

  Next, with reference to FIGS. 1-6, the effect | action of the surface mounter 1 which concerns on embodiment of this invention is demonstrated.

  In the surface mounter 1 according to the embodiment of the present invention, the control device 20 comprehensively controls the operation of each part of the mounter.

  First, as shown in FIG. 1, the pair of conveyors 4a, 4a of the board transport means 4 carries the board 3 onto a predetermined mounting work position (position of the board 3 shown in the figure) on the base 1a. Here, the substrate 3 is temporarily stopped.

  Further, the head unit 7 moves from the component supply unit 5 to the substrate 3 with the suction nozzle 6 a sucking and holding the electronic component 2 supplied from the component supply unit 5, and mounts the electronic component 2 on the substrate 3. .

  At this time, while the head unit 7 is transporting the electronic component 2 sucked by the suction nozzle 6a from the component supply unit 5 to the target position, the scan unit 8a of the component recognition device 8 moves along the suction nozzle 6a row. The lower surface image pickup means 8f and the side image pickup means 8g sequentially pick up the electronic component 2 at the suction nozzle 6a and recognize the image.

  The procedure for imaging by the lower surface imaging means 8f is as follows.

  That is, when the illumination means 8e controlled by the illumination control unit 23 irradiates illumination light in the direction from the back of the optical path changing surface 8g of the second optical path changing unit 8d to the first optical path changing unit 8c, the illumination light is second The lower surface of the electronic component 2 that passes through the optical path changing surface 8g of the optical path changing unit 8d, is reflected by the first optical path changing unit 8c, and is sucked by the suction nozzle 6a is illuminated.

  At this time, the slit of the lower surface image capturing unit 8b limits the range through which light passes and limits the illumination light from the illumination unit 8e to the imaging range.

  At the time of imaging, the first optical path changing unit 8c located below the suction nozzle 6a changes the direction of light downward from the suction nozzle 6a by about 90 degrees to the substantially horizontal side, and from below the suction nozzle 6a. The direction is changed to the direction toward the side, and the second optical path changing unit 8d further changes the direction of the light from the first optical path changing unit 8c by about 90 degrees to further change the direction of the light toward the side. Then, the lower surface imaging means 8 f provided in the scan unit 8 a and controlled by the camera control unit 24 receives this light and images the lower surface of the electronic component 2.

  As described above, the lower surface imaging unit 8f displays a reflected image of the lower surface of the electronic component 2 that is sucked by the suction nozzle 6a and illuminated by the lighting unit 8e via the first optical path changing unit 8c and the second optical path changing unit 8d. It is configured to take an image.

  Further, the side imaging unit 8g is configured to capture a transmission image from the side of the electronic component 2 at a side position of the lower surface imaging unit 8f.

  The captured image (the reflected image of the lower surface of the electronic component 2 and the transmitted image of the side surface of the electronic component 2) is subjected to image processing by the image processing unit 25 (FIG. 3) provided in the control device 20. Then, image data suitable for component recognition is generated. Then, the main control unit 21 performs an operation such as calculating an amount of adsorption deviation (adsorption error) based on the image data output from the image processing unit 25.

  As described above, according to the surface mounter 1 according to the embodiment of the present invention, the illumination unit is configured to transmit the electronic component sucked by the suction nozzle via the first optical path changing unit and the second optical path changing unit. Since the illumination light is irradiated in the direction, there is no need to provide the illumination means 8e below the suction nozzle 6a. As a result, the component recognition apparatus including the illumination unit 8e and the optical system without causing performance deterioration such as reducing the optical system and the lens to narrow the field of view of the lower surface imaging unit 8f or reducing the brightness of the lens. The thickness of 8 can be reduced. Further, the height of the head unit 7 can be lowered to make the entire apparatus compact, and the space of the apparatus can be saved.

  Further, the optical path changing surface 8g of the second optical path changing portion 8d is formed as a semi-transparent surface, and the electronic component sucked by the suction nozzle 6a with the illumination light from the illumination means 8e provided behind the optical path changing surface 8g. 2 is configured to illuminate the lower surface of 2, the illumination means 8e can be concentrated behind the optical path changing surface 8g to make the component recognition device 8 more compact.

  In particular, in the present embodiment, the first optical path changing unit 8c, the second optical path changing unit 8d, the lower surface imaging unit 8f, and the illumination unit 8e are integrally provided in the scan unit 8a, and the scan unit 8a is sucked. Since the nozzle 6a can move substantially in parallel with the row of nozzles 6a, it is possible to realize a thin and space-saving component recognition device 8 capable of imaging the plurality of suction nozzles 6a in a row.

  Further, since the first optical path changing unit 8c and the second optical path changing unit 8d change the light direction by about 90 degrees, an optical path change with an appropriate angle and a field of view with an appropriate size can be obtained.

  Furthermore, in this embodiment, since the optical path changing surface 8g of the second optical path changing unit 8d is configured by an inexpensive half mirror, the cost of the optical system can be reduced.

  In addition, since a slit 8f is provided between the suction nozzle 6a and the first optical path changing unit 8c to limit the range through which light passes, excess reflected light from outside the range to be imaged is applied to the lower surface imaging unit 8f. A clear image without flare can be obtained without being incident.

  The above-described embodiment is merely a preferred specific example of the present invention, and the present invention is not limited to the above-described embodiment.

  For example, the configurations of the substrate transport unit 4, the component supply unit 5, the mounting head 6, the X-axis Y-axis drive mechanism of the head unit 7, and the like do not limit the present invention, and various design changes are possible. .

  Further, the first optical path changing unit 8c and the second optical path changing unit 8d are not necessarily limited to those that change the light direction to about 90 degrees substantially horizontally. At the time of imaging, various optical paths can be changed as long as they are located below the suction nozzle 6a and change the direction of light downward from the suction nozzle 6a to the direction from the bottom to the side of the suction nozzle 6a. It is.

  Further, the first optical path changing unit 8c is not necessarily limited to the one constituted by the reflecting prism. It is possible to configure using a reflecting mirror.

  Further, the second optical path changing unit 8d is not limited to one constituted by a half mirror. As long as the light of the illumination means 8e provided behind the optical path changing surface can be transmitted in front of the optical path changing surface, a reflecting prism configured so that the optical path changing surface 8g becomes a semi-transparent surface is also used. It can be adopted. As described above, if the optical path changing surface 8g of the second optical path changing unit 8d is configured by a reflecting prism, the reflective material may be distorted or peeled off as compared with the case where the optical path changing surface 8g is configured by a half mirror. And can be used for a long time.

  Similarly, the illumination means 8e and the side illumination means 8h are not limited to light emitting diodes. Other conventional illumination means can be employed.

  Moreover, the illumination means 8e does not necessarily have to irradiate illumination light in the direction from the back of the optical path changing surface 8g of the second optical path changing unit 8d to the first optical path changing unit 8c as illustrated. For example, it is also possible to employ a device that is arranged around the lens of the lower surface imaging means 8f and that irradiates illumination light in the direction of the electronic component sucked by the suction nozzle via the first optical path changing unit and the second optical path changing unit. .

  Even in this case, it is not necessary to provide the illumination means below the suction nozzle, so that the optical system and the lens are made smaller to narrow the field of view of the lower surface imaging means and the performance of the lens is reduced. In addition, the thickness of the component recognition device including the illumination unit and the optical system can be reduced. As a result, the height of the head unit can be reduced to make the entire device compact, and the space of the device can be saved.

  Further, the lower surface imaging unit 8f and the side imaging unit 8g are not limited to the CCD camera, and various cameras can be employed.

  Also, the imaging direction is not necessarily limited to the orientation shown in the figure. The design can be changed in various directions according to the relationship with surrounding devices.

  Moreover, the suction nozzle 6a of the head unit 7 does not need to be plural. Moreover, the component recognition apparatus 8 is not necessarily limited to the thing provided with the movable scan unit 8a. It is also possible to take an image with the component recognition device 8 fixed to the head unit 7 for one suction nozzle 6a.

  Furthermore, the component recognition apparatus according to the present invention is not limited to that applied to a surface mounter that mounts the electronic component 2 on the substrate 3. A movable head unit having a suction nozzle capable of sucking an electronic component is provided, and the electronic component is sucked from the component supply unit by the suction nozzle, and the electronic component picked up by the suction nozzle is imaged and the electronic component for the suction nozzle It can also be applied to a component testing apparatus that performs various types of inspection by transferring this electronic component to an inspection means after image recognition of the suction state.

  According to such a component testing apparatus, since the above-described component recognition device is provided as means for recognizing the suction state of the electronic component by the suction nozzle, the height of the head unit is reduced to reduce the overall component testing device. This makes it possible to reduce the space of the component testing apparatus.

  In addition, it goes without saying that various design changes are possible within the scope of the claims of the present invention.

1 is a plan view showing a schematic configuration of a surface mounter according to an embodiment of the present invention. It is a side view which shows the structure of the outline of a surface mounter. It is a side view which shows the structure of the components recognition apparatus which concerns on embodiment of this invention. It is a front view which shows the structure of a components recognition apparatus. It is a top view which shows the structure of a components recognition apparatus. It is a block diagram which shows the structure of the outline of the control apparatus of a surface mounter.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Surface mounter 2 Electronic component 5 Component supply part 6a Suction nozzle 7 Head unit 8 Component recognition apparatus 8a Scan unit 8c 1st optical path change part 8d 2nd optical path change part 8e Illumination means 8f Bottom surface imaging means 8g Optical path change surface

Claims (9)

The electronic component in the suction nozzle is provided in a movable head unit having a suction nozzle capable of sucking the electronic component, while the head unit transports the electronic component sucked by the suction nozzle from the component supply unit to the target position. A component recognition device that recognizes an image by picking up the suction state of
A first optical path changing unit that is located below the suction nozzle and changes the direction of light downward from the suction nozzle to the direction from the bottom of the suction nozzle to the side during imaging.
A second optical path changing unit that further changes the direction of light directed to the side,
A lower surface imaging unit that images the lower surface of the electronic component that is arranged in the direction of the light changed by the second optical path changing unit and is sucked by the suction nozzle via the first optical path changing unit and the second optical path changing unit;
Illuminating means for irradiating illumination light in the direction of the electronic component sucked by the suction nozzle via the first optical path changing unit and the second optical path changing unit;
A component recognition apparatus comprising: The illuminating means is provided substantially on an extension line of light traveling from the first optical path changing unit to the second optical path changing unit, and emits illumination light from behind the optical path changing surface of the second optical path changing unit toward the first optical path changing unit. Irradiating,
The optical path changing surface of the second optical path changing unit is formed as a semi-transparent surface that can transmit the light of the illumination means provided behind the optical path changing surface to the front of the optical path changing surface,
The illumination means is configured to illuminate the lower surface of the electronic component sucked by the suction nozzle with illumination light that passes through the optical path changing surface of the second optical path changing unit and is reflected by the first optical path changing unit. The component recognition apparatus according to claim 1, characterized in that: The first optical path changing unit changes the direction of light downward from the suction nozzle to approximately horizontal side by about 90 degrees,
The component recognition apparatus according to claim 1, wherein the second optical path changing unit further changes the direction of light from the first optical path changing unit by about 90 degrees.   4. The component recognition apparatus according to claim 2, wherein the optical path changing surface of the second optical path changing unit includes a half mirror as a semi-transparent surface. 5.   4. The component recognition apparatus according to claim 2, wherein the optical path changing surface of the second optical path changing unit is configured by a reflecting prism as a semi-transparent surface. 5.   The component recognition according to claim 1, further comprising a slit that is provided between the suction nozzle and the first optical path changing unit and limits a range through which light passes. apparatus. The head unit includes a plurality of suction nozzles arranged in a row, and the first optical path changing unit, the second optical path changing unit, the lower surface imaging unit, and the illuminating unit are provided to be movable in parallel with the suction nozzle row. Provided integrally with the scanning unit,
As the scan unit moves along the suction nozzle row, the illumination means provided in the scan unit illuminates the lower surface of the electronic component sucked by each suction nozzle, and the lower surface provided in the scan unit. The component recognition apparatus according to claim 1, wherein the imaging unit is configured to image a lower surface of the illuminated electronic component. A movable head unit having a suction nozzle capable of sucking an electronic component is provided, and the electronic component is sucked from the component supply unit by the suction nozzle, and the electronic component picked up by the suction nozzle is imaged and the electronic component for the suction nozzle This is a surface mounter that mounts this electronic component on a substrate after image recognition of the adsorption state of
A surface mounting machine comprising the component recognition device according to claim 1 as means for recognizing an image of a suction state of an electronic component by a suction nozzle. A movable head unit having a suction nozzle capable of sucking an electronic component is provided, and the electronic component is sucked from the component supply unit by the suction nozzle, and the electronic component picked up by the suction nozzle is imaged and the electronic component for the suction nozzle A component testing apparatus for performing various types of inspection by transferring the electronic component to an inspection means after image recognition of the suction state of
A component testing apparatus comprising the component recognition device according to claim 1 as means for recognizing an image of a suction state of an electronic component by a suction nozzle.

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