JP2008163362A - Plated member and faucet fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plated member on which a plating film capable of preventing the dirt caused by water such as water stain and having excellent antifouling property persistence is formed. <P>SOLUTION: The plated member is formed by co-precipitating hydrophilic particles on the surface of the plating film. The surface of the plating film has 0.1-0.2 μm arithmetic average roughness (Ra), 0.5-1.2 μm ten point average roughness (Rz) and 11-33 μm average roughness (m) between projecting parts and recessed parts. Aggregate of the hydrophilic particles is dispersedly formed on the surface of the plated member and the surface of the aggregate has 80-120 nm arithmetic average roughness (Ra) and 100-150 nm square average roughness. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a plating member and faucet fitting that prevent water-related dirt adhesion such as scale.

  Plating is capable of forming a large-area film, has a high film-forming speed, and can handle complex shapes. Since it has excellent corrosion resistance and can change appearance such as gloss, semi-gloss and matte depending on the conditions, it is used for various members for the purpose of imparting wear resistance, corrosion resistance and decoration.

  However, if the plating surface is not cleaned, it gradually becomes dirty, and the attached stain becomes a stain that is firmly fixed with time and difficult to remove. For this reason, plating that also serves as a decorative purpose requires regular care in order to maintain the beauty. Especially in the kitchen, bathroom, bathroom, etc., dirt such as scale is the main cause of dirt, and frequent cleaning is required to maintain the initial appearance, requiring labor. .

The term “dirt” as used herein refers to silica and calcium compounds derived from water components, proteins, sebum, mold, microorganisms, and soap residue (metal soap). Among them, silica and calcium compounds are stubborn dirt components that are difficult to remove with detergents, and are easily generated and adhered to water containing silicic acid and calcium ions, such as groundwater and rivers, as well as tap water.
When water containing silicic acid or calcium ions adheres to the plating surface as water droplets, these components are concentrated with drying and finally become scale. By repeating this cycle, scale builds up and the adhesion becomes stronger with time.

It is effective not to form water droplets as one method for preventing various stains including the above-mentioned scale. As a method for preventing the formation of water droplets, it is conceivable to make the plating surface a water repellent surface or a hydrophilic surface. As a method for making the plating surface a water-repellent surface, a method of dispersing water-repellent particles such as PTFE (polytetrafluoroethylene) in the plating film has been proposed (for example, see Patent Document 1).
On the other hand, as a method of making the plating surface hydrophilic, a method of dispersing photocatalytic hydrophilic particles such as TiO2 in the plating film has been proposed (for example, see Patent Document 2).

However, the conventional antifouling plating described above has the following problems.
On the surface of the water-repellent plating in which water-repellent particles such as PTFE are dispersed, the water-repellent performance is easily lowered even with minute dirt. Particularly in a bathroom or a washable washable surface, the water-repellent particles have a negative charge, so that a positively charged rinse tends to adhere, and the water-repellent performance is quickly deteriorated. In addition, since the water contact angle obtained on the surface of the water-repellent plated surface is limited to about 130 °, it is inevitable that water droplets remain on a surface with a small inclination or a flat portion. Furthermore, after plating with dispersed water-repellent particles, a heat treatment is required as a subsequent step, which increases the manufacturing cost of the plated member.
On the other hand, the hydrophilic plating surface in which hydrophilic particles having photocatalytic action such as TiO ₂ are dispersed has poor ultraviolet rays for exerting photocatalytic performance indoors. There was room for improvement in terms of maintaining dirtiness.

JP 2002-317298 A Japanese Patent Laid-Open No. 11-158694

  The present invention has been made to solve the above-mentioned problems, and the object of the present invention is to prevent plating caused by water such as scales and to form a plating film having excellent antifouling properties with excellent durability. It is to provide a member.

  The present invention has been made based on the above problems, and the present invention is a plating member in which hydrophilic fine particles are dispersed in a plating film, and a part of the hydrophilic fine particles protrudes from the surface of the plating film, and the hydrophilic fine particles The plated member is characterized in that an aggregate is formed and the aggregate of hydrophilic fine particles is dispersedly arranged on the surface of the plating film.

  According to the present invention, the surface of the aggregate of hydrophilic fine particles has fine irregularities formed between the fine particles together with imparting hydrophilicity of the hydrophilic fine particles, and the fine irregularities have water retention. It contributes to stretch the water droplets adhering between the adjacent aggregates, works to increase the contact area of the water droplets, and fine irregularities formed by the fine particles existing between the aggregates are between the aggregates. Water repellency of the plating film surface that promotes the action of stretching water droplets attached to the surface, provides effective hydrophilicity, prevents adhesion of water scale due to moisture concentration, and does not contain hydrophilic regions and hydrophilic fine particles By forming the water-repellent region, it is presumed that the scale can be easily removed.

  In addition, since the hydrophilic fine particles are interspersed between the aggregates of the hydrophilic fine particles, the water droplets can play a bridging role to the adjacent aggregates, and the water droplets stretch between the hydrophilic fine particle aggregates. Can be effectively performed.

  The present invention is also a plating member in which hydrophilic fine particles are dispersed on the surface of the plating film, wherein the surface of the plating member has an arithmetic average roughness (Ra) of 0.1 to 0.2 μm, a ten-point average roughness (Rz). ), 0.5 to 1.2 μm, the average roughness between irregularities (Sm) is 11 to 33 μm, and the hydrophilic fine particle aggregate is dispersedly formed on the surface of the plating member. The arithmetic average roughness (Ra) of the surface is 80 to 120 nm and the root mean square roughness (Rq) is 100 to 150 nm. In addition, the surface of the plating member has hydrophilic fine particles between aggregates of the hydrophilic fine particles. The plating member is characterized in that the surface of the member formed by the hydrophilic fine particles has an arithmetic average roughness (Ra) of 70 to 130 nm and a root mean square roughness (Rq) of 90 to 160 nm.

  According to the present invention, the plating film surface has an arithmetic average roughness (Ra) of 0.1 to 0.2 μm, a ten-point average roughness (Rz) of 0.5 to 1.2 μm, and an average roughness between irregularities ( Sm) is in the range of 11 to 33 μm, and the arithmetic mean roughness (Ra) of the surface of the aggregate of hydrophilic fine particles is set to 80 to 120 nm, and the root mean square roughness (Rq) is set to 100 to 150 nm. In this case, a so-called fractal structure is formed in which relatively large unevenness in the entire visual field and unevenness in a small visual field in a specific region constituted by an aggregate of fine particles exist. Since this fractal structure improves water retention, good hydrophilicity can be exhibited.

  As a preferred embodiment of the present invention, the aggregate of hydrophilic fine particles is a fine particle having a particle size distribution of 0.02 to 10 μm, and the diameter of the aggregate is 4 to 35 μm. When the adjacent distance is 10 to 90 μm, the aggregate has nano-order irregularities and maintains water retention microscopically, while the aggregates close together with the fine particles distributed between the aggregates. It contributes to stretch the attached water droplets, works to increase the contact area of the water droplets, provides effective hydrophilicity, prevents adhesion of water scale due to moisture condensation, and also prevents hydrophilic regions and hydrophilic fine particles from It is presumed that scale can be easily removed by forming a water-repellent water-repellent region on the surface of the plating film that does not exist.

  As a preferred embodiment of the present invention, scale adhesion can be prevented by using a faucet fitting with the plating film according to the present invention. The cleaning load can be reduced. Some faucet fittings have a flat surface, and it is easy to create a situation in which water droplets are likely to remain. Can be prevented.

  ADVANTAGE OF THE INVENTION According to this invention, the plating member which prevented the stain | pollution | contamination due to water, such as scale, and was excellent in antifouling property can be provided.

  In the present invention, composite plating in which hydrophilic fine particles are dispersed in the plating film is used. However, the metal serving as the metal matrix of the composite plating film is not particularly limited as long as it can be plated. For example, chromium, nickel , Copper, zinc, iron, and alloys thereof. In the case where decorativeness is required such as a faucet fitting, chromium having high hardness and good gloss is frequently used as at least the outermost surface matrix.

  The metal that becomes the metal matrix is dissolved in the plating solution, ionized, provided as a salt that can exist, and added to the plating solution. Such salts include chromic anhydride, nickel sulfate, nickel chloride, nickel sulfamate, copper sulfate, zinc chloride, zinc sulfate, iron (II) chloride, iron (II) sulfate, iron (II) borofluoride, Examples thereof include iron (II) sulfamate.

  In the present invention, as the hydrophilic fine particles dispersed in the metal matrix of the composite plating film, the stronger the ionic bond, the stronger the affinity with water and the more hydrophilic, the ionic bond Can be suitably used. For example, metal oxides such as TiO2, SiO2, ZrO2, Al2O3, and MgO can be suitably used. The particles have an average particle diameter of 0.02 to 10 μm, and more desirably, by having a two-stage particle size distribution on the small diameter side and the large diameter side, the surface roughness of the aggregate of hydrophilic fine particles described later is made finer. It becomes possible to make it uneven, and effective hydrophilicity can be imparted. In particular, inorganic particles having a minute diameter of about several tens of nm are liable to cause secondary aggregation and form colonies. Therefore, it is desirable to add fine particles having a particle diameter within the range.

  Furthermore, the use of hydrophilic fine particles having an isoelectric point of 7 or more can dramatically improve the antifouling property and the cleaning and removing property of dirt. The surface charge of hydrophilic fine particles changes in water. However, in the case of fine particles having an isoelectric point of 7 or more, the surface charge is positive in neutral water having a pH of 7, such as tap water or well water. That is, if fine particles with an isoelectric point of 7 or more are dispersed on the plating surface, the charge on the plating surface can be increased to the plus side, and silica, calcium compounds and rinses that are the same plus charge scale components adhere to the plating surface. Make it difficult. As a result, it is possible to prevent rinsing adhesion that reduces the wettability of the surface, so that the wettability of the plating surface can be maintained for a long period of time, and adhesion of dirt can be prevented for a long period of time.

  Further, even when rinse or the like adheres to the plating surface, since the surface and the deposit are positive, the adhesion force to the surface is very weak and can be easily removed by simple cleaning. By using the surface charge of the hydrophilic fine particles and controlling the charge on the plating surface according to the target stain, it is possible to maintain the anti-stain property for a long period of time and to provide excellent stain cleaning and removal properties. Is possible.

Further, in order to form the fractal structure, for example, a matte base plating layer may be applied in advance to the member to be plated. The surface roughness (Ra) of the matte plating is preferably 0.05 to 0.3 μm.
By providing the base plating layer in this manner, the hydrophilic fine particles can easily form an aggregate of hydrophilic fine particles so as to aggregate around the convex portions of the large uneven portions of the base plating layer.

The plating bath used for the antifouling composite plating of the present invention is not particularly limited, but a plating film having antifouling properties can be easily formed by using a Ni or Ni alloy plating bath.
In the plating method for incorporating the hydrophilic fine particles into the plating film, the surface charge of the hydrophilic fine particles greatly affects the amount of hydrophilic fine particles dispersed in the plating film. That is, the plating is formed on the cathode. At this time, if the surface electrification of the hydrophilic fine particles is positive, the hydrophilic fine particles are adsorbed on the cathode and taken into the plating film simultaneously with the formation of the plating film. At this time, the greater the surface electrification, the greater the number of particles attracted to the cathode, resulting in an increase in the amount of hydrophilic fine particles that can be dispersed on the plating surface. As a result, if the pH of the plating bath is selected according to the isoelectric point of the hydrophilic fine particles, the surface electrification of the hydrophilic fine particles in the plating bath can be changed. The amount can be controlled.

Ni plating baths include matte Ni bath, Watt bath, sulfamic acid Ni bath, sulfuric acid Ni bath, chlorinated Ni bath, electroless Ni bath, etc. Furthermore, there are Ni alloy plating baths with these as basic baths. It is. If these Ni plating and Ni alloy plating are used, the pH of the plating bath can be changed from acidic to alkaline depending on the type of the plating bath.
By selecting a Ni or Ni alloy plating bath that matches the isoelectric point of the hydrophilic fine particles to be used, the amount of hydrophilic fine particles dispersed and co-deposited can be controlled, and the target amount of hydrophilic fine particles was dispersed. It is possible to easily form a plating film.

When antifouling plating is formed using the Ni or Ni alloy plating bath, it contains 0.5 to 2.2 mol / L of Ni ions as the main component and 5 to 500 g / L of hydrophilic fine particles. By using the plated bath, it is possible to obtain a plating film having a target dispersion amount of hydrophilic fine particles.
Even if the amount of hydrophilic fine particles added to the plating bath is less than 5 g / L, it is possible to form a plating film in which hydrophilic fine particles are dispersed on the plating surface, but the electrodeposition rate of Ni plating is extremely slowed down. Productivity is significantly reduced due to the need. Therefore, the amount of hydrophilic fine particles added to the plating bath is preferably 5 g / L or more. Moreover, since the amount of the hydrophilic fine particles taken into the plating film reaches a saturated state at 500 g / L or more, the dispersion amount of the hydrophilic fine particles taken into the plating film is not improved even if mixed more than 500 g / L.

In the case of electrolytic Ni or electrolytic Ni alloy plating, it is possible to incorporate more hydrophilic fine particles when the current density is lower.
When the current density is less than ² mA / cm ² , the Ni electrodeposition rate becomes extremely slow, and it takes time to form a film, so that the productivity is remarkably lowered. Therefore, the current density is desirably ² mA / cm ² or more. On the other hand, when the current density exceeds 60 mA / cm ² , the electrodeposition rate of Ni increases, and a thick plating film can be obtained in a short time, but there is no time for the hydrophilic fine particles to be taken into the plating film. It is difficult to obtain a plating film having a target amount of dispersed hydrophilic fine particles.

Ni and Ni alloy plating can usually have various appearances depending on the purpose, such as matte, semi-gloss, and gloss, using additives. However, when an additive is used, the additive component is taken into the plating film, resulting in a problem that the corrosion resistance is greatly reduced.
The appearance of the antifouling plating film in which the hydrophilic fine particles of the present invention are dispersed is matte, but the appearance should be controlled from matte to semi-glossy depending on the particle size of the hydrophilic fine particles, the amount of dispersion, and the type of plating bath. Is possible. That is, the appearance of the antifouling plating becomes closer to semi-gloss as the particle size of the hydrophilic fine particles to be added is reduced or the amount of hydrophilic fine particles dispersed is reduced, and the particle size of the hydrophilic fine particles to be added is increased. As the amount of hydrophilic fine particles dispersed increases, the surface becomes dull. Therefore, there is no need for an additive such as a satin forming agent, and the use can be stopped when the corrosion resistance is further increased.

Further, as shown in FIG. 1, on the first plating film B1 in which hydrophilic inorganic particles C on the base material A are dispersed on the surface, there is further provided a highly water repellent film having a thickness that does not prevent the surface exposure of the inorganic particles. When the dip plating film B2 is applied, the antifouling property can be further improved.
That is, if a plating film with high water repellency is applied to the surface, the plating surface is microscopically composed of a water-repellent part and a hydrophilic part of hydrophilic fine particles. In such a structure, both the hydrophilic deposit and the water-repellent deposit cannot be fixed to the water-repellent portion and the hydrophilic portion of the plating surface, so that a plating film having high antifouling properties can be formed. At this time, if the plating thickness applied to the uppermost surface is 1/2 or less of the average particle diameter of the dispersed hydrophilic fine particles, the hydrophilic fine particles can be sufficiently exposed on the uppermost plating surface.
Cr plating is effective as the plating applied to the uppermost surface. Cr plating is excellent in corrosion resistance and film hardness, is a plating widely used for machine parts and decorative products, and exhibits a water-repellent tendency, and is therefore effective as the top plating.

  The plating solution used in the method for producing the composite plating film may have a normal composition as the plating solution, except that it includes at least the metal salt serving as the metal matrix and hydrophilic fine particles.

In order to effectively impart hydrophilicity to the plating film surface formed as described above, the plating film surface has an arithmetic average roughness (Ra) of 0.1 to 0.2 μm and a ten-point average roughness (Rz). Is 0.5 to 1.2 μm, the average roughness between irregularities (Sm) is in the range of 11 to 33 μm, and the arithmetic average roughness (Ra) of the surface of the aggregate of hydrophilic fine particles is 80 to 120 nm, the root mean square roughness (Rq) of 100 to 150 nm. In addition, on the surface of the plated member, hydrophilic fine particles are dispersed and formed between aggregates of the hydrophilic fine particles, and the arithmetic average roughness of the member surface formed by the hydrophilic fine particles It is desirable that (Ra) is 70 to 130 nm and root mean square roughness (Rq) is 90 to 160 nm. The plated member surface thus formed has a so-called fractal structure in which there are relatively large unevenness in the entire visual field and unevenness in a small visual field of a specific region composed of an aggregate of hydrophilic fine particles. Since the water retention property is improved, good hydrophilicity can be exhibited.
If it is smaller than the lower limit of the above numerical value, the water retention will be lowered and the hydrophilicity will be lowered, and if it is larger than the upper limit, water will stay in the irregularities, so that the scale will adhere to the part and it will be difficult to remove the scale. .

In order to effectively impart hydrophilicity to the surface of the plating film formed as described above, the aggregate of hydrophilic fine particles is hydrophilic fine particles having a particle size distribution of 0.02 to 12 μm, and the aggregate The diameter of the body is 4 to 35 μm, the adjacent distance between each aggregate is 10 to 90 μm, and the aggregate has nano-order irregularities, while maintaining microscopic water retention, while between adjacent aggregates It is presumed that it contributes to stretch the attached water droplets, works to increase the contact angle of the water droplets, provides effective hydrophilicity, and prevents the adhesion of scales. In addition, the arithmetic average roughness (Ra) of the surface on which the hydrophilic fine particles are dispersed and formed between the aggregates is set to 70 to 130 nm, and the root mean square roughness (Rq) is set to 90 to 160 nm. It contributes to stretch the water droplets adhering between the neighboring fine particles together with the hydrophilic fine particles, works to increase the contact angle of the water droplets, imparts effective hydrophilicity, and scales due to moisture condensation It is presumed that the formation of water-repellent water-repellent regions on the surface of the plating film in which the hydrophilic region and the hydrophilic fine particles do not exist can be easily removed.
Here, the diameter (D) of the aggregate is obtained by adding the major axis (D ₁ ) and minor axis (D ₂ ) of the aggregate and dividing by two (D = (D ₁ + D ₂ ) / 2) did.

Preparation of plating solution The plating bath composition is 0.3 to 2.2 mol / L of sulfuric acid, Ni 0 to 0.5 mol / L of chloride, 0.3 to 1 mol / L of boric acid, pH 4.0 with Ni carbonate and 10% sulfuric acid aqueous solution. Alternatively, an electric Ni plating bath having a bath temperature of 50 ° C. was prepared to 4.5, which was used as a basic plating bath. In the electric Ni plating bath, the amounts of Ni sulfate and Ni chloride were adjusted so that the total Ni ion in the plating bath was 0.5 to 2.2 mol / L. The basic plating bath was mixed with 250 g / L of ZrO2 fine particles having an average particle size of 0.02 to 10 [mu] m as hydrophilic fine particles to obtain the plating baths of Examples 1 and 2.

Formation of composite plating film (1) Base plating In performing composite plating, matte-tone nickel plating was performed as the base plating. A metal copper plate (50 × 50 × 0.3 mm) was used as the electrode material for forming the nickel plating film, and a matte nickel plating plate (cathode) having a plating thickness of 7 μm was prepared using a Watt bath. When forming the nickel plating film, the current density was 40 mA / cm @ 2, the bath temperature was 60 DEG C., and a nickel plate (50 mm.times.501.times.1 mm) was used as the counter electrode, and plating was performed while stirring with a stirrer. The surface roughness (Ra) of the base plating was 0.15 μm.
(2) Composite plating (formation of first plating film)
Using the above plating solution and a matt nickel plate, a composite plating film was formed at a current density of ^{2 to} 60 mA / cm ² and a bath temperature of 50 ° C. In the obtained plating film, aggregates of fine particles were observed in both Example 1 and Example 2. Note that a Ni plate was used as a counter electrode when performing composite plating, and stirring was performed with a stirrer.
(3) Post-treatment (second plating film formation)
After performing the above composite plating, the second plating film was formed by plating in a Sargent bath containing 120 to 260 g / l of chromic anhydride and 1/100 g / l of sulfuric acid to chromic anhydride. Chrome plating was applied.

Comparative Example 1
Comparative Example 1 was obtained by forming a composite plating film on a bright nickel plating plate (50 × 50 × 0.3 mm) under the same conditions using the plating solution of Example 1. In the obtained plating film, fine particles were uniformly dispersed, and aggregates of fine particles were not observed.
Comparative Example 2
Comparison of bright chrome plated plates (50 x 50 x 0.3 mm) formed by plating in a Sargent bath containing 120 to 260 g / l of chromic anhydride and 1/100 g / l of sulfuric acid to chromic anhydride Example 2 was adopted.
Comparative Example 3
On a velor nickel-plated plate (with a surfactant added in excess of the cloud point in the state of use, co-deposited the emulsified suspension to give a velvety appearance) (50 x 50 x 0.3 mm) Comparison of matte chrome plated plates (50 x 50 x 0.3 mm) formed by plating in a Sargent bath containing 120-260 g / l of chromic anhydride and 1/100 g / l of sulfuric acid relative to chromic anhydride Example 3 was used.

Evaluation of plating film Surface state (1) Roughness of entire visual field (large unevenness): unevenness of plating film surface of reference numeral 1 shown in FIG. 3 The obtained plating film was observed by a scanning electron microscope (SEM). A photograph is shown in FIG. Moreover, the roughness of the whole visual field of the plating surface was measured with the laser microscope. For the obtained roughness parameters, Ra (arithmetic average roughness), Rz (ten-point average roughness), and Sm (average roughness between irregularities) were compared.
(2) Roughness constituted by fine particles (small irregularities): Concavities and convexities of aggregates of hydrophilic fine particles with reference numeral 2 shown in FIG. 3 With respect to the obtained plating film, the hydrophilicity on the plating surface by atomic force microscope (AFM) The roughness of the fine particles was measured, and Ra (arithmetic mean roughness) and Rq (root mean square roughness) were compared.
(3) Distribution state of surface hydrophilic fine particles About the obtained plating film, observe the distribution state of hydrophilic fine particles on the plating surface with a scanning electron microscope (SEM), and measure the following items using image analysis software. went.
Each measurement dimension will be described with reference to FIGS. In the SEM photograph of FIG. 1, the white dots indicate fine particles that have co-deposited on the surface of the plating film, and the other portions indicate the metal plating surface constituting the plating matrix. FIG. It is the figure seen from the upper surface which represented a part typically, and FIG. 3 is the figure which represented typically the figure corresponded in the AA line cross section of FIG.
The circle marks in FIG. 2 and the triangle marks in FIG. 3 indicate fine particles that have co-deposited on the plating surface, and the other portions indicate the metal plating surface constituting the plating matrix. Further, reference numeral 3 in FIG. 3 indicates hydrophilic fine particles dispersed alone among the aggregates.
Each measurement dimension is defined as follows.
(a) The average center distance between adjacent particles forming an aggregate of hydrophilic fine particles
(b) Average particle diameter of particles forming an aggregate of hydrophilic fine particles
(c) Average diameter as aggregate of hydrophilic fine particles
(d) Average center-to-center distance between aggregates of adjacent particles
(e) Average center-to-center distance between adjacent particles that do not form an aggregate of hydrophilic fine particles
(f) Average particle diameter of particles that do not form an aggregate of hydrophilic fine particles (4) Area ratio of hydrophilic fine particles The obtained plating film was analyzed for hydrophilic fine particles on the plating surface by a scanning electron microscope (SEM). The distribution state was observed, and the area ratio of the hydrophilic fine particles in the 1.2 mm × 1.2 mm square of the sample surface was measured using image analysis software.

Performance test (1) Scale adhesion prevention property The obtained plating film was evaluated for scale stain adhesion prevention property as follows. The test piece obtained as described above was installed at the position of the faucet fitting in the bathroom in actual use for one month under the condition of no cleaning, and the results of evaluating the degree of prevention of water stain adhesion are shown in Table 1. The evaluation criteria were as follows.
Evaluation criteria Water scale is inconspicuous. : ◎
Scale is hardly noticeable. : ○
Some scale is noticeable. : △
Water scale is noticeable. : ×
(2) Scale removal property About the obtained plating film, the stain removal removal property was evaluated using the washerability tester after the scale stain adhesion prevention evaluation. Using a soft dishwashing sponge sufficiently containing distilled water as the slider, the pressing load was evaluated as 100 g / cm2 equivalent to the force applied when a person cleans, and the number of sliding times as 20 times. The results are shown in Table 1. The evaluation criteria were as follows.
Evaluation Criteria After cleaning and removal, dirt was removed and the initial surface was recovered. : ◎
Although there was some dirt, it recovered to almost the initial state. : ○
Although scale remains, it is clear that dirt can be removed more than normal plating. : △
Scaling can not be removed so much and it is not much different from normal plating. : ×

  From the results shown in Table 1, it can be seen that the presence of fine particle aggregates works effectively for both dirt prevention and cleaning of scale.

The cross-sectional schematic diagram which shows the structure of the plating member which is embodiment of this invention. FIG. 2 is a diagram schematically representing the state of hydrophilic fine particles from the upper surface of FIG. It is the figure which expressed typically the DD sectional view of FIG.

Explanation of symbols

A ... Base material
B1 ... First plating film
B2 ... Second plating film
C: hydrophilic fine particles 1 ... irregularities on the surface of the plating film 2 ... irregularities of aggregates of hydrophilic fine particles
3… Hydrophilic fine particles existing between aggregates

Claims (5)

  A plating member in which hydrophilic fine particles are dispersed in a plating film, and a part of the hydrophilic fine particles protrudes from the surface of the plating film. The hydrophilic fine particles form an aggregate, and the aggregate of the hydrophilic fine particles is A plating member characterized by being distributed on the surface of a plating film.   The plated member according to claim 1, wherein hydrophilic fine particles are interspersed between aggregates of the hydrophilic fine particles.   Hydrophilic fine particles are dispersed in the plating film, and a part of the hydrophilic fine particles protrudes from the surface of the plating film, and the plating member surface has an arithmetic average roughness (Ra) of 0.1 to 0.2 μm, The ten-point average roughness (Rz) is 0.5 to 1.2 μm, the average roughness between irregularities (Sm) is 11 to 33 μm, and the aggregates of the hydrophilic fine particles are dispersedly formed on the surface of the plated member. The surface of the aggregate has an arithmetic average roughness (Ra) of 80 to 120 nm and a root mean square roughness (Rq) of 100 to 150 nm. In addition, the surface of the plated member has an aggregate of the hydrophilic fine particles. Hydrophilic fine particles are dispersed between them, and the arithmetic mean roughness (Ra) of the surface of the member formed by the hydrophilic fine particles is 70 to 130 nm, and the root mean square roughness (Rq) is 90 to 160 nm. Plating member.   The aggregate of hydrophilic fine particles is a fine particle having a particle size distribution of 0.02 to 10 μm, the diameter of the aggregate is 4 to 35 μm, and the adjacent distance between the aggregates is 10 to 90 μm. Furthermore, the hydrophilic fine particles between the aggregates are fine particles having a particle size distribution of 0.1 to 10 μm, and the adjacent distance between the fine particles is 0.5 to 10 μm. 4. The plating member according to any one of items 3 to 3.   A faucet fitting characterized by using the plated coating according to any one of claims 1 to 4 on a faucet fitting surface.