JP2008161913A - Sn-Au ALLOY SOLDER PASTE HAVING REDUCED PRODUCTION OF VOID - Google Patents
Sn-Au ALLOY SOLDER PASTE HAVING REDUCED PRODUCTION OF VOID Download PDFInfo
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- 229910018731 Sn—Au Inorganic materials 0.000 title claims abstract description 98
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 97
- 239000000956 alloy Substances 0.000 title claims abstract description 97
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 89
- 239000011800 void material Substances 0.000 title claims description 19
- 239000000203 mixture Substances 0.000 claims abstract description 48
- 230000004907 flux Effects 0.000 claims abstract description 41
- 239000000843 powder Substances 0.000 claims abstract description 40
- 239000012535 impurity Substances 0.000 claims abstract description 20
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 abstract description 3
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- 238000002844 melting Methods 0.000 description 16
- 230000008018 melting Effects 0.000 description 16
- 239000002184 metal Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000007789 gas Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 11
- 239000006023 eutectic alloy Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 238000007747 plating Methods 0.000 description 7
- 229910015363 Au—Sn Inorganic materials 0.000 description 6
- 238000010907 mechanical stirring Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 229910001020 Au alloy Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009689 gas atomisation Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
この発明は、ボイド発生の少ないＳｎ−Ａｕ合金はんだペーストに関するものである。 The present invention relates to an Sn—Au alloy solder paste that generates less voids.
一般に、ＧａＡｓ光素子、ＧａＡｓ高周波素子、熱伝素子などの半導体素子と基板との接合、微細かつ高気密性が要求されるＳＡＷフィルター、水晶発振子などのパッケージ封止などにはＡｕ−Ｓｎ合金はんだペーストが使用されている。このＡｕ−Ｓｎ合金はんだペーストに含まれるＡｕ−Ｓｎ合金粉末は、Ｓｎ：２０質量％を含有し、残りがＡｕおよび不可避不純物からなる組成を有するＡｕ−Ｓｎ共晶合金粉末であることが知られており、このＡｕ−Ｓｎ共晶合金粉末は、通常、ガスアトマイズして得られることも知られている。このＳｎ：２０質量％を含有し、残りがＡｕおよび不可避不純物からなる組成を有するＡｕ−Ｓｎ共晶合金は、共晶点が２８０℃であって、高融点用途としてよく用いられている。 In general, an Au-Sn alloy is used for bonding a semiconductor element such as a GaAs optical element, a GaAs high frequency element, and a heat transfer element to a substrate, a SAW filter that requires fine and high airtightness, a package sealing for a crystal oscillator, and the like. Solder paste is used. It is known that the Au—Sn alloy powder contained in this Au—Sn alloy solder paste is an Au—Sn eutectic alloy powder containing Sn: 20% by mass, and the remainder having a composition composed of Au and inevitable impurities. It is also known that this Au—Sn eutectic alloy powder is usually obtained by gas atomization. The Au—Sn eutectic alloy containing 20% by mass of Sn and having the remainder composed of Au and inevitable impurities has a eutectic point of 280 ° C. and is often used for high melting point applications.
一方で、より低融点のはんだを必要とする用途もあり、近年、Ａｕ：１０質量％を含有し、残部がＳｎおよび不可避不純物からなる組成を有するＳｎ−Ａｕ共晶合金が注目され始めている。このＡｕ：１０質量％を含有し、残部がＳｎおよび不可避不純物からなる組成を有するＳｎ−Ａｕ共晶合金からなるはんだは、Ａｕ含有量が少ないために価格が安く、さらにその共晶点が２１０℃であって、Ｓｎ：２０質量％を含有し、残りがＡｕおよび不可避不純物からなる組成を有するＳｎ−Ａｕ共晶合金よりも融点が７０℃も低く、高分子樹脂などの有機系材料からなるパッケージを用いた素子の接合や封止にはその耐熱性を考慮してこの低温のＡｕ：１０質量％を含有し、残部がＳｎおよび不可避不純物からなる組成を有するＳｎ−Ａｕ共晶合金からなるはんだを用いることが最適であるとされている。そしてこのＡｕ：１０質量％を含有し、残部がＳｎおよび不可避不純物からなる組成を有するＳｎ−Ａｕ共晶合金からなるはんだを使用して接合する方法として、
（イ）Ａｕめっき層とＳｎめっき層を接合してリフロー処理することにより接合する方法、
（ロ）Ａｕ粉末、Ｓｎ粉末およびフラックスの混合体からなるペーストを塗布した後リフロー処理することにより接合する方法、
（ハ）Ａｕ：１０〜４０質量％を含有し、残部がＳｎおよび不可避不純物からなる組成を有するＳｎ−Ａｕ共晶合金粉末とフラックスの混合体からなるペーストを塗布した後リフロー処理することにより接合する方法、などがあることが知られている（特許文献１参照）。
(A) A method of joining by reflow treatment by joining the Au plating layer and the Sn plating layer,
(B) A method of joining by applying a paste made of a mixture of Au powder, Sn powder and flux, followed by reflow treatment,
(C) Bonding by applying a reflow treatment after applying a paste made of a mixture of Sn—Au eutectic alloy powder and flux containing Au: 10 to 40% by mass with the balance being Sn and inevitable impurities. It is known that there is a method to do so (see Patent Document 1).
しかし、前記Ａｕ：１０質量％を含有し、残りがＳｎおよび不可避不純物からなる組成のＳｎ−Ａｕ共晶合金粉末からなるＳｎ−Ａｕ合金はんだ粉末とフラックスとの混合体からなるＳｎ−Ａｕ合金はんだペーストは、これをリフロー処理して得られた接合部にボイドが残留し、この接合部に残留した多くのボイドがクラックの起点となることから信頼性のあるＳｎ−Ａｕ合金はんだ接合部が得られないという欠点があった。したがって、なお一層ボイド発生の少ないＳｎ−Ａｕ合金はんだペーストが求められていた。 However, Sn: Au alloy solder comprising a mixture of Sn—Au alloy solder powder comprising Sn—Au eutectic alloy powder having a composition comprising Au and the remainder consisting of Sn and inevitable impurities and a flux. In the paste, voids remain in the joint obtained by reflowing the paste, and many voids remaining in the joint serve as starting points of cracks, so that a reliable Sn—Au alloy solder joint is obtained. There was a disadvantage that it was not possible. Therefore, an Sn—Au alloy solder paste with less void generation has been demanded.
そこで、本発明者らは、ボイド発生の一層少ないＳｎ−Ａｕ合金はんだペーストを得るべく研究を行った。その結果、
（イ）Ａｕ含有量が５〜１５質量％を含有し、さらにＢｉ：０．１〜１０質量％、Ｉｎ：０．１〜１０質量％およびＳｂ：０．１〜１０質量％の内のいずれか一種を含有し、残りがＳｎおよび不可避不純物からなる成分組成を有するＳｎ−Ａｕ合金はんだ粉末と一般のフラックスとを配合し混合して得られたＳｎ−Ａｕ合金はんだペーストを使用してリフロー処理することにより得られた接合部にはボイドの発生が一層少なくなる、
（ロ）前記（イ）記載のＳｎ−Ａｕ合金はんだ粉末に配合するフラックスは、一般のフラックスであってよいが、ノンハロゲンフラックスまたは低残渣フラックスであることが一層好ましく、その配合量は５〜２５質量％の範囲内にあれば良く、この範囲は通常知られている範囲である、などの研究結果が得られたのである。
Therefore, the present inventors have studied to obtain a Sn—Au alloy solder paste with less void generation. as a result,
(I) Au content is 5 to 15% by mass, Bi: 0.1 to 10% by mass, In: 0.1 to 10% by mass, and Sb: 0.1 to 10% by mass Reflow treatment using Sn—Au alloy solder paste obtained by blending and mixing Sn—Au alloy solder powder having a component composition consisting of Sn and inevitable impurities and a general flux. In the joint obtained by doing so, the occurrence of voids is further reduced,
(B) The flux to be blended with the Sn—Au alloy solder powder described in (a) above may be a general flux, but is more preferably a non-halogen flux or a low residue flux, and the blending amount is 5 to 25. As long as it is within the range of mass%, this result is a generally known range, and the research results were obtained.
この発明は、かかる研究結果にもとづいてなされたものであって、
（１）Ａｕ：５〜１５質量％、Ｂｉ：０．１〜１０質量％を含有し、残りがＳｎおよび不可避不純物からなる成分組成を有するＳｎ−Ａｕ合金はんだ粉末とフラックスとの混合体からなるボイド発生の少ないＳｎ−Ａｕ合金はんだペースト、
（２）前記（１）記載の混合体は、フラックス：５〜２５質量％含有し、残部が前記（１）記載のＳｎ−Ａｕ合金はんだ粉末からなる配合組成を有する混合体であるボイド発生の少ないＳｎ−Ａｕ合金はんだペースト、
（３）Ａｕ：５〜１５質量％、Ｉｎ：０．１〜１０質量％を含有し、残りがＳｎおよび不可避不純物からなる成分組成を有するＳｎ−Ａｕ合金はんだ粉末とフラックスとの混合体からなるボイド発生の少ないＳｎ−Ａｕ合金はんだペースト、
（４）前記（３）記載の混合体は、フラックス：５〜２５質量％含有し、残部が前記（３）記載のＳｎ−Ａｕ合金はんだ粉末からなる配合組成を有する混合体であるボイド発生の少ないＳｎ−Ａｕ合金はんだペースト、
（５）Ａｕ：５〜１５質量％、Ｓｂ：０．１〜１０質量％を含有し、残りがＳｎおよび不可避不純物からなる成分組成を有するＳｎ−Ａｕ合金はんだ粉末とフラックスとの混合体からなるボイド発生の少ないＳｎ−Ａｕ合金はんだペースト、
（６）前記（５）記載の混合体は、フラックス：５〜２５質量％含有し、残部が前記（５）記載のＳｎ−Ａｕ合金はんだ粉末からなる配合組成を有する混合体であるボイド発生の少ないＳｎ−Ａｕ合金はんだペースト、
（７）前記（１）、（２）、（３）、（４）、（５）または（６）記載のフラックスは、ノンハロゲンフラックスまたは低残渣フラックスであるボイド発生の少ないＳｎ−Ａｕ合金はんだペースト、に特徴を有するものである。
This invention was made based on the results of such research,
(1) Au: 5 to 15% by mass, Bi: 0.1 to 10% by mass, and the remainder is composed of a mixture of Sn—Au alloy solder powder having a component composition composed of Sn and inevitable impurities and a flux. Sn-Au alloy solder paste with less void generation,
(2) The mixture described in (1) above contains flux: 5 to 25% by mass, and the remainder is a mixture having a blend composition composed of the Sn—Au alloy solder powder described in (1). Less Sn-Au alloy solder paste,
(3) Au: 5 to 15% by mass, In: 0.1 to 10% by mass, and the remainder is composed of a mixture of Sn—Au alloy solder powder having a component composition composed of Sn and inevitable impurities and a flux. Sn-Au alloy solder paste with less void generation,
(4) The mixture described in (3) above contains flux: 5 to 25% by mass, and the remainder is a mixture having a blend composition composed of the Sn—Au alloy solder powder described in (3). Less Sn-Au alloy solder paste,
(5) Au: 5 to 15% by mass, Sb: 0.1 to 10% by mass, and the balance is composed of a mixture of Sn—Au alloy solder powder having a component composition composed of Sn and inevitable impurities and a flux. Sn-Au alloy solder paste with less void generation,
(6) The mixture described in (5) above contains flux: 5 to 25% by mass, and the remainder is a mixture having a blend composition comprising the Sn—Au alloy solder powder described in (5) above. Less Sn-Au alloy solder paste,
(7) The flux described in (1), (2), (3), (4), (5) or (6) is a non-halogen flux or a low residual flux Sn-Au alloy solder paste with little void generation , Has characteristics.
この発明のボイド発生の少ないＳｎ−Ａｕ合金はんだは下記の方法で作製する。まず、Ａｕ：５〜１５質量％、Ｂｉ：０．１〜１０質量％を含有し、残りがＳｎおよび不可避不純物からなる成分組成を有するＳｎ−Ａｕ合金、Ａｕ：５〜１５質量％、Ｉｎ：０．１〜１０質量％を含有し、残りがＳｎおよび不可避不純物からなる成分組成を有するＳｎ−Ａｕ合金、Ａｕ：５〜１５質量％、Ｓｂ：０．１〜１０質量％を含有し、残りがＳｎおよび不可避不純物からなる成分組成を有するＳｎ−Ａｕ合金をそれぞれ溶解し、得られた溶湯を温度：６００℃〜１０００℃に保持し、機械撹拌しながらまたは機械撹拌したのちこの撹拌された溶湯を圧力：３００〜８００ｋＰａで加圧しながら噴射圧力：５０００〜８０００ｋＰａの圧力で直径：１〜２ｍｍを有する小径ノズルからノズルギャップ：０．３ｍｍ以下で不活性ガスを噴射して製造する。 The Sn—Au alloy solder with less void generation according to the present invention is manufactured by the following method. First, an Sn: Au alloy containing Au: 5 to 15% by mass, Bi: 0.1 to 10% by mass, and the remainder composed of Sn and inevitable impurities, Au: 5 to 15% by mass, In: Sn—Au alloy having a composition of 0.1 to 10% by mass, the remainder comprising Sn and inevitable impurities, Au: 5 to 15% by mass, Sb: 0.1 to 10% by mass, and the rest Sn—Au alloy having a component composition consisting of Sn and inevitable impurities is melted, and the obtained molten metal is maintained at a temperature of 600 ° C. to 1000 ° C. and stirred or after mechanical stirring. The pressure is 300 to 800 kPa, while the injection pressure is 5000 to 8000 kPa and the diameter is 1 to 2 mm, and the nozzle gap is 0.3 mm or less from the small diameter nozzle. Shines is prepared.
前記撹拌は機械撹拌であることが好ましく、機械撹拌の内でもプロペラ撹拌が一層好ましい。前記機械撹拌に電磁撹拌のような電気的撹拌を併用してもよく、機械撹拌に電磁撹拌を併用することもできる。前記機械撹拌の回転速度は特に限定されるものではないが、６０〜１００ｒ．ｐ．ｍで３〜１０分間プロペラ撹拌することが好ましい。このようにして得られたＳｎ−Ａｕ合金粉末を分級して粒度調整したのち一般のロジン、活性剤、溶剤および増粘剤からなるフラックス、ノンハロゲンフラックスまたは低残渣フラックスと混合してＳｎ−Ａｕ合金はんだペーストを作製する。このときＳｎ−Ａｕ合金はんだ粉末に配合するフラックスの量は、５〜２５質量％の範囲内にあり、この配合量は一般に知られている量である。 The stirring is preferably mechanical stirring, and propeller stirring is more preferable among mechanical stirring. Electric stirring such as electromagnetic stirring may be used in combination with the mechanical stirring, and electromagnetic stirring may be used in combination with mechanical stirring. The rotational speed of the mechanical stirring is not particularly limited, but is 60 to 100 r. p. It is preferable to stir the propeller at m for 3 to 10 minutes. The Sn—Au alloy powder thus obtained is classified to adjust the particle size, and then mixed with a flux composed of a general rosin, an activator, a solvent and a thickener, a non-halogen flux or a low residue flux, and then Sn—Au alloy. Make a solder paste. At this time, the amount of the flux to be blended with the Sn—Au alloy solder powder is in the range of 5 to 25 mass%, and this blending amount is a generally known amount.
次に、この発明のボイド発生の少ないＳｎ−Ａｕ合金はんだペーストに含まれるＳｎ−Ａｕ合金はんだ粉末の成分組成の限定理由を説明する。 Next, the reason for limiting the component composition of the Sn—Au alloy solder powder contained in the Sn—Au alloy solder paste with less void generation according to the present invention will be described.
Ｓｎ：
Ｓｎは、５質量％未満含有してもまた１５質量％を越えて含有しても合金の液相線温度が著しく上昇し、搭載する素子をリフロー処理して接合する際の溶融温度が素子の耐熱限界温度を越え、さらに溶融合金の表面張力が上昇することから濡れ性が悪くなるので好ましくない。したがって、この発明のＳｎ−Ａｕ合金はんだペーストに含まれるＳｎ−Ａｕ合金はんだ粉末に含まれるＳｎは５〜１５質量％に定めた。
Sn:
Even if Sn is contained in an amount of less than 5% by mass or more than 15% by mass, the liquidus temperature of the alloy is remarkably increased, and the melting temperature at the time of joining by reflowing the mounted element is the element temperature. This is not preferable because the wettability is deteriorated because the surface tension of the molten alloy is further increased because the heat resistance limit temperature is exceeded. Therefore, Sn contained in the Sn—Au alloy solder powder contained in the Sn—Au alloy solder paste of the present invention was set to 5 to 15 mass%.
Ｂｉ：
Ｂｉは、Ｓｎ−Ａｕ合金の表面張力を一層低めるために添加するが、その含有量が０．１質量％未満では所望の効果が得られず、一方、１０質量％を越えて含有すると、Ｓｎ−Ａｕ合金の融点を上昇させてしまうので好ましくない。したがって、Ｂｉの含有量を０．１〜１０質量％に定めた。一層好ましい範囲は１．０〜５．０質量％である。
Bi:
Bi is added to further reduce the surface tension of the Sn—Au alloy. However, if the content is less than 0.1% by mass, the desired effect cannot be obtained. On the other hand, if the content exceeds 10% by mass, Sn is added. -It is not preferable because the melting point of the Au alloy is raised. Therefore, the Bi content is set to 0.1 to 10% by mass. A more preferable range is 1.0 to 5.0% by mass.
Ｉｎ：
Ｉｎは、Ｓｎ−Ａｕ合金の表面張力を一層低めるために添加するが、その含有量が０．１質量％未満では所望の効果が得られず、一方、１０質量％を越えて含有すると、Ｓｎ−Ａｕ合金の融点を上昇させてしまうので好ましくない。したがって、Ｉｎの含有量を０．１〜１０質量％に定めた。一層好ましい範囲は０．５〜３質量％である。
In:
In is added in order to further reduce the surface tension of the Sn—Au alloy. However, if the content is less than 0.1% by mass, a desired effect cannot be obtained, while if it exceeds 10% by mass, Sn is added. -It is not preferable because the melting point of the Au alloy is raised. Therefore, the content of In is set to 0.1 to 10% by mass. A more preferable range is 0.5 to 3% by mass.
Ｓｂ：
Ｓｂは、Ｓｎ−Ａｕ合金の表面張力を一層低めるために添加するが、その含有量が０．１質量％未満では所望の効果が得られず、一方、１０質量％を越えて含有すると、Ｓｎ−Ａｕ合金の融点を上昇させてしまうので好ましくない。したがって、Ｂｉの含有量を０．１〜１０質量％に定めた。一層好ましい範囲は０．１〜１．０質量％である。
Sb:
Sb is added to further reduce the surface tension of the Sn—Au alloy. However, when the content is less than 0.1% by mass, the desired effect cannot be obtained. On the other hand, when the content exceeds 10% by mass, Sn is added. -It is not preferable because the melting point of the Au alloy is raised. Therefore, the Bi content is set to 0.1 to 10% by mass. A more preferable range is 0.1 to 1.0% by mass.
この発明のＳｎ−Ａｕ合金はんだペーストはボイドの発生が一層少ないことから、従来のＳｎ−Ａｕ合金はんだペーストに比べて接合部の信頼性が優れており、半導体装置の不良品発生率も減少してコストを低減することができ、産業上優れた効果をもたらすものである。 Since the Sn—Au alloy solder paste of the present invention generates less voids, the reliability of the joint is superior to that of the conventional Sn—Au alloy solder paste, and the defect rate of defective semiconductor devices is also reduced. Thus, the cost can be reduced and an excellent industrial effect can be obtained.
実施例１
高周波溶解炉により溶解して得られたＳｎ−Ａｕ合金を溶湯を温度：８００℃に保持しながら、回転数：８００回転で３時間プロペラを回転させて溶湯を機械撹拌したのち、溶湯に圧力：５００ｋＰａをかけ、高周波溶解炉の底部に設けられたノズルから溶湯を落下させ、同時にノズルの周囲にノズルギャップ：０．２ｍｍとなるように設けられた直径：１．５ｍｍのガスノズルから落下する溶湯に向かってＡｒガスを噴射圧力：６０００ｋＰａで噴射させることによりガスアトマイズ粉末を作製し、このガスアトマイズ粉末を風力分級装置を用いて分級することにより平均粒径：１０μｍを有し表１に示される成分組成を有するＳｎ−Ａｕ合金はんだ粉末Ａ〜Ｋを作製した。
Example 1
The Sn—Au alloy obtained by melting in a high-frequency melting furnace was mechanically stirred for 3 hours by rotating the propeller at a rotational speed of 800 rpm while maintaining the molten metal at a temperature of 800 ° C., and then pressure on the molten metal: 500 kPa is applied, the molten metal is dropped from the nozzle provided at the bottom of the high-frequency melting furnace, and at the same time, the molten metal is dropped from the gas nozzle having a diameter of 1.5 mm provided so that the nozzle gap is 0.2 mm around the nozzle. A gas atomized powder was produced by injecting Ar gas at an injection pressure of 6000 kPa, and this gas atomized powder was classified using an air classifier, so that the component composition shown in Table 1 having an average particle size of 10 μm was obtained. Sn-Au alloy solder powders AK were prepared.
これら表１のＳｎ−Ａｕ合金はんだ粉末Ａ〜Ｋに一般のフラックスであるＲＭＡフラックス（三菱マテリアル株式会社製）を表２に示されるフラックス比率となるように混合して本発明Ｓｎ−Ａｕ合金はんだペースト１〜９、比較Ｓｎ−Ａｕ合金はんだペースト１〜２および従来Ｓｎ−Ａｕ合金はんだペースト１を作製した。 The Sn-Au alloy solder powders A to K in Table 1 are mixed with RMA flux (manufactured by Mitsubishi Materials Corporation), which is a general flux, so as to have the flux ratio shown in Table 2, and the Sn-Au alloy solder of the present invention. Pastes 1 to 9, comparative Sn—Au alloy solder pastes 1 to 2 and conventional Sn—Au alloy solder paste 1 were prepared.
一方、無酸素銅板の表面に厚さ：５μｍのＮｉめっきを施したのち、厚さ：１．０μｍのＡｕめっきを施し、めっきＣｕ基板を作製し用意した。このめっきＣｕ基板上に、ニードル内径：２５０μｍを有するディスペンス装置を用いて本発明Ｓｎ−Ａｕ合金はんだペースト１〜９、比較Ｓｎ−Ａｕ合金はんだペースト１〜２および従来Ｓｎ−Ａｕ合金はんだペースト１を塗布し、この塗布したペーストの上に、９００μｍ角の搭載素子に見たてたダミーチップ（Ｓｉ基板にＮｉメッキ／Auメッキ処理を施したもの)をマウンタを用いて搭載し、窒素ガス吹き付けのホットプレートにて１５０℃に６０秒間保持し、引き続いて２６５℃に３０秒間保持するリフロー処理した。
このとき発生した種々のサイズのボイドの総面積を透過Ｘ線装置および画像処理ソフトを用いて算出し、ダミーチップの接合面の面積に対するボイドの総面積をボイド率として求め、それらの測定結果を表２に示した。
On the other hand, the surface of the oxygen-free copper plate was subjected to Ni plating with a thickness of 5 μm, and then subjected to Au plating with a thickness of 1.0 μm to prepare and prepare a plated Cu substrate. On this plated Cu substrate, the present invention Sn—Au alloy solder pastes 1 to 9, comparative Sn—Au alloy solder pastes 1 to 2 and the conventional Sn—Au alloy solder paste 1 are used using a dispensing device having a needle inner diameter of 250 μm. Apply a dummy chip (Ni substrate / Ni plating applied to Si substrate) as seen on a 900 μm square mounting element on this applied paste using a mounter, and blow nitrogen gas Reflow treatment was performed by holding at 150 ° C. for 60 seconds on a hot plate, and subsequently holding at 265 ° C. for 30 seconds.
The total area of voids of various sizes generated at this time was calculated using a transmission X-ray apparatus and image processing software, and the total area of voids with respect to the area of the bonding surface of the dummy chip was obtained as the void ratio. It is shown in Table 2.
表１〜２に示される結果から、本発明Ｓｎ−Ａｕ合金はんだ１〜９は従来Ｓｎ−Ａｕ合金はんだ１に比べてボイド率が少ないことから、本発明Ｓｎ−Ａｕ合金はんだ１〜９は従来Ｓｎ−Ａｕ合金はんだ１に比べてボイドの発生が少ないことが分かる。しかし、この発明の範囲から外れた比較Ｓｎ−Ａｕ合金はんだ１〜２はボイドの発生がやや多くなることがわかる。 From the results shown in Tables 1 and 2, the Sn-Au alloy solders 1 to 9 of the present invention have a lower void ratio than the conventional Sn-Au alloy solder 1, so that the Sn-Au alloy solders 1 to 9 of the present invention are conventional. It can be seen that the generation of voids is less than that of the Sn—Au alloy solder 1. However, it can be seen that the comparative Sn—Au alloy solders 1 and 2 deviating from the scope of the present invention have slightly increased voids.
実施例２
高周波溶解炉により溶解して得られたＳｎ−Ａｕ合金を溶湯を温度：８００℃に保持しながら、回転数：８００回転で３時間プロペラを回転させて溶湯を機械撹拌したのち、溶湯に圧力：５００ｋＰａをかけ、高周波溶解炉の底部に設けられたノズルから溶湯を落下させ、同時にノズルの周囲にノズルギャップ：０．２ｍｍとなるように設けられた直径：１．５ｍｍのガスノズルから落下する溶湯に向かってＡｒガスを噴射圧力：６０００ｋＰａで噴射させることによりガスアトマイズ粉末を作製し、このガスアトマイズ粉末を風力分級装置を用いて分級することにより平均粒径：１０μｍを有し表３に示される成分組成のＳｎ−Ａｕ合金はんだ粉末ａ〜ｋを作製した。
Example 2
The Sn—Au alloy obtained by melting in a high-frequency melting furnace was mechanically stirred for 3 hours by rotating the propeller at a rotational speed of 800 rpm while maintaining the molten metal at a temperature of 800 ° C., and then pressure on the molten metal: 500 kPa is applied, the molten metal is dropped from the nozzle provided at the bottom of the high-frequency melting furnace, and at the same time, the molten metal is dropped from the gas nozzle having a diameter of 1.5 mm provided so that the nozzle gap is 0.2 mm around the nozzle. A gas atomized powder was prepared by injecting Ar gas at an injection pressure of 6000 kPa, and the gas atomized powder was classified using an air classifier. Sn-Au alloy solder powders a to k were prepared.
これら表３のＳｎ−Ａｕ合金はんだ粉末ａ〜ｋに一般のフラックスであるＲＭＡフラックス（三菱マテリアル株式会社製）を表４に示されるフラックス比率となるように混合して本発明Ｓｎ−Ａｕ合金はんだペースト１０〜１８および比較Ｓｎ−Ａｕ合金はんだペースト３〜４を作製した。 The Sn-Au alloy solder powders a to k in Table 3 are mixed with RMA flux (manufactured by Mitsubishi Materials Corporation) as a general flux so as to have the flux ratio shown in Table 4, and the Sn-Au alloy solder of the present invention. Pastes 10 to 18 and comparative Sn—Au alloy solder pastes 3 to 4 were prepared.
実施例１で用意しためっきＣｕ基板上に、ニードル内径：２５０μｍを有するディスペンス装置を用いて本発明Ｓｎ−Ａｕ合金はんだペースト１０〜１８および比較Ｓｎ−Ａｕ合金はんだペースト３〜４を塗布し、この塗布したペーストの上に、９００μｍ角の搭載素子に見たてたダミーチップ（Ｓｉ基板にＮｉメッキ／Auメッキ処理を施したもの)をマウンタを用いて搭載し、窒素ガス吹き付けのホットプレートにて１５０℃に６０秒間保持し、引き続いて２６５℃に３０秒間保持するリフロー処理した。
このとき発生した種々のサイズのボイドの総面積を透過Ｘ線装置および画像処理ソフトを用いて算出し、ダミーチップの接合面の面積に対するボイドの総面積をボイド率として求め、それらの測定結果を表４に示した。
The Sn-Au alloy solder paste 10-18 of the present invention and the comparative Sn-Au alloy solder pastes 3-4 were applied on the plated Cu substrate prepared in Example 1 using a dispensing apparatus having a needle inner diameter: 250 μm. On the applied paste, mount a dummy chip (Ni substrate / Au plating treatment on a Si substrate) seen as a 900 μm square mounting element using a mounter, and use a hot plate sprayed with nitrogen gas Reflow treatment was performed at 150 ° C. for 60 seconds, and subsequently at 265 ° C. for 30 seconds.
The total area of voids of various sizes generated at this time was calculated using a transmission X-ray apparatus and image processing software, and the total area of voids with respect to the area of the bonding surface of the dummy chip was obtained as the void ratio. It is shown in Table 4.
表３〜４に示される結果から、本発明Ｓｎ−Ａｕ合金はんだ１０〜１８は、実施例１で作製した従来Ｓｎ−Ａｕ合金はんだ１に比べてボイド率が少ないことから、本発明Ｓｎ−Ａｕ合金はんだ１０〜１８は従来Ｓｎ−Ａｕ合金はんだ１に比べてボイドの発生が少ないことが分かる。しかし、この発明の範囲から外れた比較Ｓｎ−Ａｕ合金はんだ３〜４はボイドの発生が多くなり、好ましくないことがわかる。 From the results shown in Tables 3 to 4, the Sn—Au alloy solders 10 to 18 of the present invention have a lower void ratio than the conventional Sn—Au alloy solder 1 manufactured in Example 1, and thus the Sn—Au of the present invention. It can be seen that the alloy solders 10 to 18 generate less voids than the conventional Sn—Au alloy solder 1. However, it can be seen that the comparative Sn—Au alloy solders 3 to 4 which are out of the scope of the present invention are not preferable because the generation of voids increases.
実施例３
高周波溶解炉により溶解して得られたＳｎ−Ａｕ合金を溶湯を温度：８００℃に保持しながら、回転数：８００回転で３時間プロペラを回転させて溶湯を機械撹拌したのち、溶湯に圧力：５００ｋＰａをかけ、高周波溶解炉の底部に設けられたノズルから溶湯を落下させ、同時にノズルの周囲にノズルギャップ：０．２ｍｍとなるように設けられた直径：１．５ｍｍのガスノズルから落下する溶湯に向かってＡｒガスを噴射圧力：６０００ｋＰａで噴射させることによりガスアトマイズ粉末を作製し、このガスアトマイズ粉末を風力分級装置を用いて分級することにより平均粒径：１０μｍを有し表５に示される成分組成を有するＳｎ−Ａｕ合金はんだ粉末イ〜ルを作製した。
Example 3
The Sn—Au alloy obtained by melting in a high-frequency melting furnace was mechanically stirred for 3 hours by rotating the propeller at a rotational speed of 800 rpm while maintaining the molten metal at a temperature of 800 ° C., and then pressure on the molten metal: 500 kPa is applied, the molten metal is dropped from the nozzle provided at the bottom of the high-frequency melting furnace, and at the same time, the molten metal is dropped from the gas nozzle having a diameter of 1.5 mm provided so that the nozzle gap is 0.2 mm around the nozzle. A gas atomized powder was prepared by injecting Ar gas at an injection pressure of 6000 kPa, and the gas atomized powder was classified using an air classifier to have an average particle size of 10 μm and the component composition shown in Table 5 A Sn—Au alloy solder powder Yl was prepared.
これらＳｎ−Ａｕ合金はんだ粉末イ〜ルに一般のフラックスであるＲＭＡフラックス（三菱マテリアル株式会社製）を表６に示されるフラックス比率となるように混合して本発明Ｓｎ−Ａｕ合金はんだペースト１９〜２７および比較Ｓｎ−Ａｕ合金はんだペースト５〜６を作製した。 These Sn-Au alloy solder powders are mixed with RMA flux (manufactured by Mitsubishi Materials Co., Ltd.), which is a general flux, so that the flux ratio shown in Table 6 is obtained. 27 and comparative Sn—Au alloy solder pastes 5 to 6 were produced.
実施例１で用意しためっきＣｕ基板上に、ニードル内径：２５０μｍを有するディスペンス装置を用いて本発明Ｓｎ−Ａｕ合金はんだペースト１９〜２７および比較Ｓｎ−Ａｕ合金はんだペースト５〜６を塗布し、この塗布したペーストの上に、９００μｍ角の搭載素子に見たてたダミーチップ（Ｓｉ基板にＮｉメッキ／Auメッキ処理を施したもの)をマウンタを用いて搭載し、窒素ガス吹き付けのホットプレートにて１５０℃に６０秒間保持し、引き続いて２６５℃に３０秒間保持するリフロー処理した。
このとき発生した種々のサイズのボイドの総面積を透過Ｘ線装置および画像処理ソフトを用いて算出し、ダミーチップの接合面の面積に対するボイドの総面積をボイド率として求め、それらの測定結果を表６に示した。
On the plated Cu substrate prepared in Example 1, the Sn—Au alloy solder pastes 19 to 27 of the present invention and the comparative Sn—Au alloy solder pastes 5 to 6 were applied using a dispensing apparatus having a needle inner diameter of 250 μm. On the applied paste, mount a dummy chip (Ni substrate / Au plating treatment on a Si substrate) seen as a 900 μm square mounting element using a mounter, and use a hot plate sprayed with nitrogen gas Reflow treatment was performed at 150 ° C. for 60 seconds, and subsequently at 265 ° C. for 30 seconds.
The total area of voids of various sizes generated at this time was calculated using a transmission X-ray apparatus and image processing software, and the total area of voids with respect to the area of the bonding surface of the dummy chip was obtained as the void ratio. Table 6 shows.
表５〜６に示される結果から、本発明Ｓｎ−Ａｕ合金はんだ１９〜２７は、実施例１で作製した従来Ｓｎ−Ａｕ合金はんだ１に比べてボイド率が少ないことから、本発明Ｓｎ−Ａｕ合金はんだ１９〜２７は従来Ｓｎ−Ａｕ合金はんだ１に比べてボイドの発生が少ないことが分かる。しかし、この発明の範囲から外れた比較Ｓｎ−Ａｕ合金はんだ５〜６はボイドの発生がやや多くなることがわかる。 From the results shown in Tables 5 to 6, since the Sn-Au alloy solders 19 to 27 of the present invention have a lower void ratio than the conventional Sn-Au alloy solder 1 manufactured in Example 1, the present Sn-Au alloy It can be seen that the alloy solders 19 to 27 generate less voids than the conventional Sn—Au alloy solder 1. However, it can be seen that the comparative Sn—Au alloy solders 5 to 6 which are out of the scope of the present invention generate a little amount of voids.
Claims (7)
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| WO2024157542A1 (en) * | 2023-01-25 | 2024-08-02 | 株式会社日立パワーデバイス | Electronic component and method for producing electronic component |
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