JP2008159323A - Contact switching device - Google Patents

Contact switching device Download PDF

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Publication number
JP2008159323A
JP2008159323A JP2006344860A JP2006344860A JP2008159323A JP 2008159323 A JP2008159323 A JP 2008159323A JP 2006344860 A JP2006344860 A JP 2006344860A JP 2006344860 A JP2006344860 A JP 2006344860A JP 2008159323 A JP2008159323 A JP 2008159323A
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Prior art keywords
conductive fluid
storage chamber
main body
injection port
injecting
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JP2006344860A
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Japanese (ja)
Inventor
Koji Yokoyama
浩司 横山
Riichi Uotome
利一 魚留
Shoichi Kobayashi
昌一 小林
Katsumi Kakimoto
勝己 垣本
Hideki Ueda
英喜 上田
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Priority to JP2006344860A priority Critical patent/JP2008159323A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact switching device capable of preventing adhesion of a surplus conductive fluid, in the surrounding of an injection port. <P>SOLUTION: The contact switching device is provided with the body part 1 which has a housing chamber 1d in which a conductive fluid L is stored and a pair of contacts are installed and an injection groove part 20 which is connected to the housing chamber 1d on one-end side and has an injection port 2f for injecting the conductive fluid L into the housing chamber 1d on the other-end side; a closing plate 4 for closing the injection port 2f, and an actuator 7 which is a driving means for moving the conductive fluid L stored in the housing chamber 1d and switches the conduction state between the pair of contacts 5a, 6a. A depression part 9 depressed in thickness direction of the substrate 2 is formed so as to surround the surrounding of the injection port 2f and a prescribed spacing is provided between the injection port 2f and the depression part 9. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、接点開閉装置に関する。   The present invention relates to a contact switching device.

従来から、圧電素子の駆動によって液体金属を動かすことで接点を開閉する接点開閉装置(液体金属スイッチ)が提供されており、例えば特許文献1に開示されているようなものがある。この接点開閉装置は、複数のコンタクトを外部に露出した状態で有する圧電基板層と、前記コンタクトと接続される複数の圧電素子及び各圧電素子間を分離する不活性の駆動流体を有する駆動装置流体槽層と、圧電素子によって押圧される薄膜層と、回路基板に接続される複数のスイッチ・コンタクト及び各スイッチ・コンタクト間を接続する液体金属及びスイッチング流体を有する液体金属チャネル層と、スイッチ・コンタクトと接続される回路を有する回路基板層とから成る。該接点開閉装置の動作を以下に説明する。圧電基板層の一対のコンタクト間に電圧を印加すると、該一対のコンタクトに接続された圧電素子が伸長し、該圧電素子の伸長に伴って薄膜層が押圧される。薄膜層が押圧されることによって液体金属チャネル層のスイッチング流体の圧力が上昇し、スイッチング流体の圧力の上昇によって液体金属によるスイッチ・コンタクト間の接続が切断され、而して回路基板層の回路上の接点を開放するようになっている。この接点開閉装置では、接点開閉装置の組立時に駆動流体を注入口から駆動装置流体槽層に注入し、その後注入口を封止することで駆動流体を駆動装置流体槽層に充填している。
特開2004−319477号公報
Conventionally, a contact opening / closing device (liquid metal switch) that opens and closes a contact by moving a liquid metal by driving a piezoelectric element has been provided, for example, as disclosed in Patent Document 1. This contact switching device includes a piezoelectric substrate layer having a plurality of contacts exposed to the outside, a plurality of piezoelectric elements connected to the contacts, and a driving device fluid having an inert driving fluid separating each piezoelectric element A tank layer, a thin film layer pressed by a piezoelectric element, a plurality of switch contacts connected to a circuit board, a liquid metal channel layer having a liquid metal and a switching fluid connecting each switch contact, and a switch contact And a circuit board layer having a circuit connected thereto. The operation of the contact switching device will be described below. When a voltage is applied between the pair of contacts of the piezoelectric substrate layer, the piezoelectric element connected to the pair of contacts expands, and the thin film layer is pressed as the piezoelectric element expands. When the thin film layer is pressed, the pressure of the switching fluid in the liquid metal channel layer rises, and the increase in the pressure of the switching fluid breaks the connection between the switch contacts by the liquid metal, and thus on the circuit board layer circuit. The contact of is open. In this contact switching device, when the contact switching device is assembled, the driving fluid is injected into the driving device fluid tank layer from the inlet, and then the driving fluid is filled in the driving device fluid tank layer by sealing the inlet.
JP 2004-319477 A

ところで、上記のような接点開閉装置の他に、導電性流体が収納されるとともに一対の接点が露設される収納室を有する本体部と、本体部を部分的に変形させることで導電性流体を移動させ、一対の接点間の導通状態を切り換えるアクチュエータとを備えた接点開閉装置が知られている。しかしながら、このような接点開閉装置において、上記従来例の駆動流体の注入と同様に、導電性流体を注入口から収納室に注入した後に注入口を封止すると、注入口の周囲に余分な導電性流体が付着することで注入口の封止が困難になるという問題があった。   By the way, in addition to the contact switching device as described above, a conductive fluid is stored, and a main body having a storage chamber in which a pair of contacts are exposed, and a conductive fluid by partially deforming the main body. There is known a contact opening / closing device provided with an actuator that moves the switch and switches the conduction state between the pair of contacts. However, in such a contact switching device, as in the case of the driving fluid injection in the conventional example, if the injection port is sealed after the conductive fluid is injected from the injection port into the storage chamber, excess conductive material is formed around the injection port. There has been a problem that it becomes difficult to seal the injection port due to adhesion of the ionic fluid.

本発明は、上記の点に鑑みて為されたもので、注入口の周囲に余分な導電性流体が付着するのを防ぐことのできる接点開閉装置を提供することを目的とする。   The present invention has been made in view of the above points, and an object of the present invention is to provide a contact switching device that can prevent an excessive conductive fluid from adhering around the inlet.

請求項1の発明は、上記目的を達成するために、導電性流体が収納される収納室及び一端側で収納室と連結するとともに他端側に導電性流体を収納室内に注入するための注入口が設けられた注入用溝部を有する本体部と、少なくとも一部を収納室内に臨ませた状態で設けられる一乃至複数の接点と、本体部の厚み方向における収納室の壁部を変形させて導電性流体を移動させることによって接点の間を導電性流体を介して導通又は開放させる駆動手段とを備え、導電性流体を注入口から注入した後の余分な導電性流体を本体部外部に流出させるための流出手段を設けたことを特徴とする。   In order to achieve the above object, the invention according to claim 1 is a storage chamber for storing the conductive fluid and a note for injecting the conductive fluid into the storage chamber at the other end while being connected to the storage chamber at one end. A main body having an inlet groove provided with an inlet, one or more contacts provided with at least a portion facing the storage chamber, and a wall of the storage chamber in the thickness direction of the main body being deformed. Drive means for conducting or opening between the contacts via the conductive fluid by moving the conductive fluid, and the excess conductive fluid after the conductive fluid is injected from the injection port flows out of the main body It is characterized in that an outflow means is provided.

請求項2の発明は、請求項1の発明において、流出手段は、本体部外面において注入口周縁に設けられて本体部の厚み方向に窪んだ一乃至複数の窪み部から成ることを特徴とする。   The invention of claim 2 is characterized in that, in the invention of claim 1, the outflow means comprises one or a plurality of indentations provided on the outer periphery of the main body at the periphery of the inlet and recessed in the thickness direction of the main body. .

請求項3の発明は、請求項2の発明において、窪み部は、その底部が本体部の収納室に貫通することを特徴とする。   The invention of claim 3 is characterized in that, in the invention of claim 2, the bottom of the hollow portion penetrates into the storage chamber of the main body.

請求項4の発明は、請求項1の発明において、流出手段は、本体部外面において注入口周縁に突設された段部から成ることを特徴とする。   According to a fourth aspect of the present invention, in the first aspect of the present invention, the outflow means comprises a stepped portion projecting from the periphery of the inlet on the outer surface of the main body.

請求項5の発明は、請求項1の発明において、流出手段は、注入用溝部内壁の少なくとも一部分に形成された撥水性を有する撥水材料の被膜から成ることを特徴とする。   The invention of claim 5 is characterized in that, in the invention of claim 1, the outflow means comprises a coating of water-repellent material having water repellency formed on at least a part of the inner wall of the injecting groove.

請求項6の発明は、請求項1の発明において、流出手段は、注入用溝部内壁の少なくとも一部分に設けられた微細な凹凸を有した粗面から成ることを特徴とする。   The invention of claim 6 is characterized in that, in the invention of claim 1, the outflow means comprises a rough surface having fine irregularities provided on at least a part of the inner wall of the groove for injection.

請求項7の発明は、請求項5又は6の発明において、注入用溝部は、注入口に連通し且つその開口面積が収納室に向かうにつれて小さくなる第一の傾斜部と、第一の傾斜部の収納室側の開口部と連通し且つその開口面積が収納室に向かうにつれて大きくなる第二の傾斜部とから成ることを特徴とする。   According to a seventh aspect of the present invention, in the fifth or sixth aspect of the present invention, the injecting groove portion communicates with the injecting port, and the first inclined portion becomes smaller as the opening area thereof goes toward the storage chamber. It is characterized by comprising a second inclined portion which communicates with the opening on the storage chamber side and whose opening area increases toward the storage chamber.

請求項1の発明によれば、導電性流体を注入口から注入した後の余分な導電性流体を本体部外部に流出させることができ、したがって余分な導電性流体を容易に除去することができ、注入口を閉塞する作業を容易に行うことができる。   According to the first aspect of the present invention, excess conductive fluid after injecting the conductive fluid from the inlet can be discharged to the outside of the main body, so that the excess conductive fluid can be easily removed. The operation of closing the inlet can be easily performed.

請求項2の発明によれば、本体部外面において本体部の厚み方向に窪んだ窪み部を注入口周縁に設けたので、余分な導電性流体を窪み部に溜めることで注入口の周囲に付着するのを防ぐことができ、したがって余分な導電性流体を容易に除去することができ、注入口を閉塞する作業を容易に行うことができる。   According to the second aspect of the present invention, since the recess portion that is recessed in the thickness direction of the main body portion is provided on the outer peripheral surface of the main body portion, the excess conductive fluid adheres to the periphery of the injection port by accumulating in the recess portion. Therefore, excess conductive fluid can be easily removed, and the operation of closing the inlet can be easily performed.

請求項3の発明によれば、窪み部の底部が本体部の収納室に貫通するので、窪み部からも導電性流体を収納室に注入することができ、したがって余分な導電性流体が注入口の周囲に付着するのを防ぐとともに導電性流体を収納室に容易に注入することができる。   According to the invention of claim 3, since the bottom portion of the recess portion penetrates into the storage chamber of the main body portion, the conductive fluid can be injected also from the recess portion into the storage chamber. In addition, the conductive fluid can be easily injected into the storage chamber.

請求項4の発明によれば、本体部外面において注入口周縁に段部を突設したので、注入口周縁と段部とが成す角の部位に導電性流体が付着し難くなり、したがって余分な導電性流体を容易に除去することができ、注入口を閉塞する作業を容易に行うことができる。   According to the invention of claim 4, since the step portion is provided on the outer peripheral surface of the main body portion at the periphery of the injection port, the conductive fluid hardly adheres to the corner portion formed by the periphery of the injection port and the step portion. The conductive fluid can be easily removed, and the work of closing the inlet can be easily performed.

請求項5の発明によれば、注入用溝部内壁に撥水性を有する撥水材料の被膜を形成したので、導電性流体が注入用溝部内壁に付着し難くなり、したがって余分な導電性流体を容易に除去することができ、注入口を閉塞する作業を容易に行うことができる。   According to the fifth aspect of the present invention, since the coating of the water repellent material having water repellency is formed on the inner wall of the injecting groove, it becomes difficult for the conductive fluid to adhere to the inner wall of the injecting groove, so that the excess conductive fluid is easily removed. Therefore, the work of closing the inlet can be easily performed.

請求項6の発明によれば、注入用溝部内壁に微細な凹凸を有した粗面を設けたので、導電性流体が注入用溝部内壁に付着し難くなり、したがって余分な導電性流体を容易に除去することができ、注入口を閉塞する作業を容易に行うことができる。   According to the invention of claim 6, since the rough surface having fine irregularities is provided on the inner wall of the injecting groove, it becomes difficult for the conductive fluid to adhere to the inner wall of the injecting groove, so that the excess conductive fluid can be easily removed. It can be removed, and the work of closing the inlet can be easily performed.

請求項7の発明によれば、注入用溝部を注入口に連通し且つその開口面積が収納室に向かうにつれて小さくなる第一の傾斜部と、第一の傾斜部の収納室側の開口部と連通し且つその開口面積が収納室に向かうにつれて大きくなる第二の傾斜部とから構成したので、第一の傾斜部に上記流出防止手段を適用して余分な導電性流体が注入口の周囲に付着するのを防ぐとともに、収納室から注入口に向かうにつれて開口面積が小さくなる第二の傾斜部によって導電性流体が収納室から注入口を通って外部に流出するのを防ぐことができる。   According to the seventh aspect of the present invention, the first inclined portion that communicates the injecting groove with the inlet and whose opening area decreases toward the storage chamber, and the opening on the storage chamber side of the first inclined portion, Since the second inclined portion that communicates and the opening area becomes larger toward the storage chamber, the outflow prevention means is applied to the first inclined portion so that excess conductive fluid is placed around the inlet. In addition to preventing adhesion, it is possible to prevent the conductive fluid from flowing out from the storage chamber through the injection port to the outside by the second inclined portion whose opening area becomes smaller from the storage chamber toward the injection port.

以下、本発明の接点開閉装置の各実施形態について図面を用いて説明する。但し、以下の説明では図1(c)における上下を上下方向と定める。   Hereinafter, each embodiment of the contact switching apparatus of the present invention will be described with reference to the drawings. However, in the following description, the vertical direction in FIG.

(実施形態1)
本実施形態は、図1(a),(b)に示すように、導電性流体Lが収納されるとともに一対の接点5a,6aが露設される収納室1d及び一端側で収納室1dと連結するとともに他端側に導電性流体Lを収納室1d内に注入するための注入口2fが設けられた注入用溝部20を有する本体部1と、注入口2fを閉塞する閉塞板4と、収納室1d内に収納された導電性流体Lを移動させ、一対の接点5a,6a間の導通状態を切り換える駆動手段であるアクチュエータ7とを備える。尚、本実施形態では、導電性流体Lとして常温常圧(25℃、1気圧)で液体の金属(例えば、水銀)を用いている。
(Embodiment 1)
In this embodiment, as shown in FIGS. 1A and 1B, a storage chamber 1d in which a conductive fluid L is stored and a pair of contact points 5a and 6a are exposed, and a storage chamber 1d on one end side, A main body 1 having an injection groove 20 provided with an injection port 2f for connecting and injecting the conductive fluid L into the storage chamber 1d at the other end, and a closing plate 4 for closing the injection port 2f; An actuator 7 is provided as a driving means for moving the conductive fluid L stored in the storage chamber 1d and switching the conduction state between the pair of contacts 5a and 6a. In the present embodiment, a liquid metal (for example, mercury) at normal temperature and normal pressure (25 ° C., 1 atm) is used as the conductive fluid L.

本体部1は、図1(c)〜(e)に示すように、基板2と絶縁基板3とを用いて構成される。基板2は、例えば単結晶のシリコン基板から成り、図1(c)に示すように、その前面には略矩形状の凹部2aが設けられている。この基板2の後面において凹部2aに対応する部位には、導電性流体Lを収納する空洞部1a用の凹所2bが設けられており、図1(b)に示すように、この凹所2bは略菱形に形成されている。また、基板2において凹部2aの底壁部は薄膜状のダイアフラム部2cとなっており、該ダイアフラム部2cの略中央部には、前方へ突出する角錘台形の突部2dが一体に突設されている(図1(c)参照)。   As shown in FIGS. 1C to 1E, the main body 1 is configured using a substrate 2 and an insulating substrate 3. The substrate 2 is made of, for example, a single crystal silicon substrate, and as shown in FIG. 1 (c), a substantially rectangular recess 2a is provided on the front surface thereof. A recess 2b for the cavity 1a for storing the conductive fluid L is provided on the rear surface of the substrate 2 corresponding to the recess 2a. As shown in FIG. Is formed in a substantially diamond shape. Further, in the substrate 2, the bottom wall portion of the recess 2a is a thin-film diaphragm portion 2c, and a truncated pyramid-shaped projection 2d protruding forward is integrally formed at a substantially central portion of the diaphragm portion 2c. (See FIG. 1C).

基板2の後面において凹所2bの一端側(図1(b)における右端側)には、空洞部1a内に導電性流体Lを注入するための通路となる第1チャンネル1b用の第1溝部2eが形成されている。第1溝部2eは、略矩形状に形成されるとともに、基板2の厚み方向に貫設される略角錐台形状の注入用溝部20の下端部と連通している。また、注入用溝部20の上端部は、基板2前面の略正方形状の注入口2fと連通している(図1(c)参照)。注入口2fは、注入用溝部20を介して第1チャンネル1b内に導電性流体Lを注入するために設けられており、導電性流体Lを注入した後に略矩形状のガラス板から成る閉塞板4によって閉塞される(図1(a)参照)。また、基板2の前面には、図1(c)に示すように、基板2の厚み方向に窪んだ窪み部9が注入口2fの周囲を囲むように形成されており、注入口2fと窪み部9との間には所定の間隔が空けられている。   On the rear surface of the substrate 2, on the one end side of the recess 2b (the right end side in FIG. 1B), the first groove portion for the first channel 1b serving as a passage for injecting the conductive fluid L into the cavity portion 1a. 2e is formed. The first groove portion 2 e is formed in a substantially rectangular shape and communicates with the lower end portion of the substantially truncated pyramid-shaped injection groove portion 20 penetrating in the thickness direction of the substrate 2. Further, the upper end of the injection groove 20 communicates with a substantially square injection port 2f on the front surface of the substrate 2 (see FIG. 1C). The injection port 2f is provided for injecting the conductive fluid L into the first channel 1b through the injection groove 20, and is a blocking plate made of a substantially rectangular glass plate after the conductive fluid L is injected. 4 (see FIG. 1A). Further, as shown in FIG. 1C, a recess 9 that is recessed in the thickness direction of the substrate 2 is formed on the front surface of the substrate 2 so as to surround the periphery of the injection port 2f. A predetermined interval is provided between the unit 9 and the unit 9.

一方、基板2の後面において凹所2bの他端側(図1(b)における左端側)には、導電性流体Lが移動する流路となる第2チャンネル1c用の略コ字状の第2溝部2gが形成されている。   On the other hand, on the other end side of the recess 2b on the rear surface of the substrate 2 (the left end side in FIG. 1B), a substantially U-shaped first channel for the second channel 1c serving as a flow path through which the conductive fluid L moves. Two groove portions 2g are formed.

尚、上記の凹部2a、凹所2b、突部2d、各溝部2e,2g、注入用溝部20及び窪み部9は、ICP(Inductively Coupled Plasma)エッチング等の半導体製造プロセスを利用して基板2に形成してあるが、上記のような半導体製造プロセスは周知であるので、ここでは詳細な説明を省略する。また、基板2の代わりに、基板2と同様の形状に形成された絶縁性を有する樹脂基板等を用いるようにしても構わない。   The concave portion 2a, the concave portion 2b, the projecting portion 2d, the groove portions 2e and 2g, the injecting groove portion 20 and the hollow portion 9 are formed on the substrate 2 using a semiconductor manufacturing process such as ICP (Inductively Coupled Plasma) etching. Although formed, the semiconductor manufacturing process as described above is well known, and thus detailed description thereof is omitted here. Further, instead of the substrate 2, an insulating resin substrate formed in the same shape as the substrate 2 may be used.

絶縁基板3は、例えば基板2と略同一の外形寸法を有する透明なガラス基板から成り、基板2の後面に陽極接合等によって接合される。尚、絶縁基板3として、ガラス基板のほかに絶縁性を有する樹脂基板を用いるようにしても構わない。   The insulating substrate 3 is made of, for example, a transparent glass substrate having substantially the same outer dimensions as the substrate 2 and is bonded to the rear surface of the substrate 2 by anodic bonding or the like. In addition to the glass substrate, an insulating resin substrate may be used as the insulating substrate 3.

このように絶縁基板3を基板2の後面に接合することにより、凹所2b及び第1溝部2e並びに第2溝部2gの後面開口がそれぞれ閉塞される。そして、絶縁基板3により後面開口が閉塞された凹所2bが、導電性流体Lを収納する空洞部1aとして、絶縁基板3により後面開口が閉塞された第1溝部2eが、導電性流体Lを空洞部1aに注入するための第1チャンネル1bとして、絶縁基板3により後面開口が閉塞された第2溝部2gが、導電性流体Lの流路となる第2チャンネル1cとしてそれぞれ用いられ、これら空洞部1aと第1チャンネル1b及び第2チャンネル1cとによって導電性流体Lが移動自在に収納される収納室1dが構成される。   By thus bonding the insulating substrate 3 to the rear surface of the substrate 2, the rear surface openings of the recess 2b, the first groove portion 2e, and the second groove portion 2g are respectively closed. Then, the recess 2b whose rear opening is closed by the insulating substrate 3 serves as a cavity 1a for accommodating the conductive fluid L, and the first groove 2e whose rear opening is closed by the insulating substrate 3 serves as the conductive fluid L. As the first channel 1b for injecting into the cavity 1a, the second groove 2g whose rear opening is closed by the insulating substrate 3 is used as the second channel 1c serving as the flow path of the conductive fluid L, respectively. A storage chamber 1d in which the conductive fluid L is movably stored is constituted by the portion 1a, the first channel 1b, and the second channel 1c.

一方、絶縁基板3において、基板2の第2溝部2gに対向する部位、即ち、第2チャンネル1cの底面部となる部位には、貫設孔(スルーホール)3aが4つ貫設されている(図1(b),(d)参照)。これら4つの貫設孔3aのそれぞれの内周面及び前面開口には、ともに導電性金属材料を用いためっき層から成る接点5a,6aが交互に形成されており、これにより絶縁基板3を基板2に接合した際には、各一対の接点5a,6aが第2チャンネル1c内に露設されることになる。尚、各接点5a,6a用の導電性金属材料としては、導電性流体Lに対する濡れ性が良いもの(例えば、半田)を用いることが好ましい。   On the other hand, in the insulating substrate 3, four through holes 3 a are formed through a portion of the substrate 2 that faces the second groove 2 g, that is, a portion that becomes the bottom surface of the second channel 1 c. (See FIGS. 1B and 1D). Contact points 5a and 6a made of a plating layer using a conductive metal material are alternately formed on the inner peripheral surface and the front opening of each of the four through holes 3a. When joined to 2, each pair of contacts 5a, 6a is exposed in the second channel 1c. As the conductive metal material for each contact 5a, 6a, it is preferable to use a material (for example, solder) that has good wettability with respect to the conductive fluid L.

また、絶縁基板3の後面には、銅等の導電性金属材料を用いた一対の電極パッド5b,6bがそれぞれ形成されており、電極パッド5bは配線パターン5cによって一対の接点5aに、電極パッド6bは配線パターン6cによって一対の接点6aにそれぞれ接続されている。   A pair of electrode pads 5b and 6b using a conductive metal material such as copper are formed on the rear surface of the insulating substrate 3, and the electrode pad 5b is connected to the pair of contacts 5a by the wiring pattern 5c. 6b is connected to a pair of contacts 6a by a wiring pattern 6c.

ところで、接点5aは上述したように2つ設けられているが、導電性流体Lが収納室1dに注入された後には、何れか1つのみが残されて他方の接点5aが電極パッド5bから電気的に切断される。この点は接点6aにおいても同様であり、これにより導電性流体Lの注入量のばらつきに対応できるようにしている。例えば、導電性流体Lの注入量が少なく導電性流体Lが何れの接点5a,6aとも接触していない場合と、導電性流体Lの注入量が多く導電性流体Lが接点5aとのみ接触している場合とでは、接点開閉の動作が異なってしまうため、前者の場合には、第2チャンネル1cの奥側となる他端側(図1(b)における右側)の接点5a,6aがそれぞれ電極パッド5b,6bから切断され、後者の場合には、第2チャンネル1cの手前側となる一端側(図1(b)における左側)の接点5aが電極パッド5bから切断されるとともに、第2チャンネル1cの奥側の接点6aが電極パッド6bから切断される。このようにすることで、導電性流体Lの注入量のばらつきに依らず安定した開閉性能を発揮することができる。   By the way, although the two contacts 5a are provided as described above, after the conductive fluid L is injected into the storage chamber 1d, only one of them is left and the other contact 5a is connected to the electrode pad 5b. Electrically disconnected. This also applies to the contact point 6a, and this makes it possible to cope with variations in the injection amount of the conductive fluid L. For example, when the amount of the conductive fluid L injected is small and the conductive fluid L is not in contact with any of the contacts 5a and 6a, the amount of the conductive fluid L injected is large and the conductive fluid L contacts only the contact 5a. In the former case, the contacts 5a, 6a on the other end side (the right side in FIG. 1 (b)), which is the back side of the second channel 1c, are different from each other. The electrode 5b is cut from the electrode pads 5b and 6b. In the latter case, the contact 5a on one end side (the left side in FIG. 1B) on the front side of the second channel 1c is cut from the electrode pad 5b and the second The contact 6a on the back side of the channel 1c is cut from the electrode pad 6b. By doing in this way, the stable opening / closing performance can be exhibited irrespective of the variation in the injection amount of the conductive fluid L.

アクチュエータ7は、例えば扁平な棒状に形成された圧電振動子から成り、先端部を凹部2aと対向させると同時に突部2dの先端に当接させる形で基板2の前面に接合された片持ち梁構造を有している。而して、アクチュエータ7の厚み方向に電圧を印加すれば、固定されていないアクチュエータ7の先端部がダイアフラム部2cに近づく方向に撓んで突部2dを押圧し、これにより基板2のダイアフラム部2cが凹所2b側へ変形する(撓む)ことになる。そして、電圧の印加を停止すれば、アクチュエータ7が突部2を押圧しなくなり、これによりダイアフラム部2cが元の状態に復帰することになる。   The actuator 7 is made of, for example, a piezoelectric vibrator formed in a flat rod shape, and is a cantilever joined to the front surface of the substrate 2 in such a manner that the tip portion is opposed to the recess 2a and at the same time is brought into contact with the tip of the projection 2d. It has a structure. Thus, when a voltage is applied in the thickness direction of the actuator 7, the tip of the unfixed actuator 7 bends in a direction approaching the diaphragm portion 2 c and presses the protrusion 2 d, thereby the diaphragm portion 2 c of the substrate 2. Will be deformed (flexed) toward the recess 2b. When the application of the voltage is stopped, the actuator 7 does not press the protrusion 2 and the diaphragm portion 2c is restored to the original state.

次に、本実施形態の動作について説明する。まず、電圧が印加されていない状態では、アクチュエータ7が動作しないためにダイアフラム部2cが変形していない。この時、収納室1dに収納されている導電性流体Lは何れの接点5a,6aとも接触しておらず、接点5a,6a間は絶縁(開成)されている(オフ状態)。   Next, the operation of this embodiment will be described. First, in a state where no voltage is applied, the actuator 7 does not operate, so that the diaphragm portion 2c is not deformed. At this time, the conductive fluid L stored in the storage chamber 1d is not in contact with any of the contacts 5a and 6a, and the contacts 5a and 6a are insulated (opened) (off state).

このオフ状態から電圧を印加してアクチュエータ7を駆動すると、アクチュエータ7の先端部が突部2dを押圧し、これによりダイアフラム部2cが後方に押し下げられる。ダイアフラム部2cが押し下げられると、空洞部1aの容積が減少し、これにより空洞部1a内に収納されている導電性流体Lが第2チャンネル1c側へ移動させられ、一対の接点5a,6aが導電性流体Lによって短絡(閉成)される(オン状態)。   When a voltage is applied from this OFF state to drive the actuator 7, the tip of the actuator 7 presses the protrusion 2d, and thereby the diaphragm 2c is pushed backward. When the diaphragm portion 2c is pushed down, the volume of the cavity portion 1a is reduced, whereby the conductive fluid L accommodated in the cavity portion 1a is moved to the second channel 1c side, and the pair of contacts 5a and 6a are moved. Short-circuited (closed) by the conductive fluid L (ON state).

そして、このオン状態から電圧の印加を停止すれば、アクチュエータ7によって変形させられていたダイアフラム部2cが元の状態に復帰する。これに伴って空洞部1aの容積が元に戻るため、第2チャンネル1c側に移動していた導電性流体Lが空洞部1a側に戻り、一対の接点5a,6aが開成される(オフ状態)。   When the application of voltage is stopped from this on state, the diaphragm portion 2c deformed by the actuator 7 returns to the original state. Along with this, the volume of the cavity 1a returns to the original, so that the conductive fluid L that has moved to the second channel 1c side returns to the cavity 1a side, and the pair of contacts 5a and 6a are opened (OFF state). ).

以下、導電性流体Lを収納室1dに注入する方法について図2を用いて説明する。まず、導電性流体Lが蓄えられた流体槽8aを有する真空チャンバ8内に本体部1を配置し、真空チャンバ8内を真空ポンプ(図示せず)を用いて真空引きすることで、真空チャンバ8内及び本体部1の収納室1d内を所定の真空度まで減圧する(図2(a)参照)次に、本体部1を流体槽8aに浸し(図2(b)参照)、真空チャンバ8内の圧力を上昇させると、真空チャンバ8内の圧力が収納室1d内の圧力よりも大きくなるために、流体槽8aに蓄えられた導電性流体Lが注入口2fから注入用溝部20を通って収納室1d内に浸入する(図2(c)参照)。そして、収納室1dに所定の導電性流体Lが注入されるまで真空チャンバ8内の圧力を上昇させた後に(図2(d)参照)、本体部1を流体槽8aから取り出し、閉塞板4を基板2の前面に接合して注入口2fを閉塞することで、導電性流体Lの収納室1dへの注入工程が終了する。尚、流体槽8aに本体部1を浸す際に、凹部2aにも導電性流体Lが浸入するが、凹部2aに溜まった導電性流体Lは注入口2fを閉塞板4で閉塞した後に除去するため、ここでは凹部2aに溜まる導電性流体Lの図示を省略している。   Hereinafter, a method of injecting the conductive fluid L into the storage chamber 1d will be described with reference to FIG. First, the main body portion 1 is disposed in a vacuum chamber 8 having a fluid tank 8a in which the conductive fluid L is stored, and the vacuum chamber 8 is evacuated using a vacuum pump (not shown), whereby a vacuum chamber is obtained. 8 and the storage chamber 1d of the main body 1 are depressurized to a predetermined degree of vacuum (see FIG. 2A). Next, the main body 1 is immersed in the fluid tank 8a (see FIG. 2B), and a vacuum chamber is obtained. When the pressure in the chamber 8 is increased, the pressure in the vacuum chamber 8 becomes larger than the pressure in the storage chamber 1d. Therefore, the conductive fluid L stored in the fluid tank 8a passes through the inlet 20f through the inlet groove 20f. It passes through and enters the storage chamber 1d (see FIG. 2C). Then, after increasing the pressure in the vacuum chamber 8 until a predetermined conductive fluid L is injected into the storage chamber 1d (see FIG. 2D), the main body 1 is taken out from the fluid tank 8a, and the blocking plate 4 Is bonded to the front surface of the substrate 2 to close the injection port 2f, whereby the step of injecting the conductive fluid L into the storage chamber 1d is completed. When the main body 1 is immersed in the fluid tank 8a, the conductive fluid L also enters the recess 2a. However, the conductive fluid L accumulated in the recess 2a is removed after the inlet 2f is closed by the closing plate 4. Therefore, illustration of the conductive fluid L that accumulates in the recess 2a is omitted here.

ここで、仮に注入口2fの周囲に窪み部9を設けなかったとすると、図3(a)に示すように、注入口2fの周縁を覆うように余分な導電性流体Lが付着してしまい、導電性流体Lが邪魔となって注入口2fを閉塞板4で閉塞する作業が困難となる。これに対して、本実施形態では窪み部9を設けているので、図3(b)に示すように、窪み部9と注入口2fとの間で導電性流体Lが繋がらないために注入口2fの周縁で余分な導電性流体Lが付着するのを防ぐことができる。このため、窪み部9に溜った導電性流体Lを除去するだけで余分な導電性流体Lを容易に除去することができ、したがって注入口2fを閉塞板4で閉塞する作業を容易に行うことができる。   Here, if the recess 9 is not provided around the injection port 2f, as shown in FIG. 3A, the excess conductive fluid L adheres to cover the periphery of the injection port 2f. The conductive fluid L becomes an obstacle, and the operation of closing the inlet 2f with the closing plate 4 becomes difficult. On the other hand, since the hollow portion 9 is provided in this embodiment, the conductive fluid L is not connected between the hollow portion 9 and the inlet 2f as shown in FIG. It is possible to prevent extra conductive fluid L from adhering to the periphery of 2f. For this reason, it is possible to easily remove the excess conductive fluid L simply by removing the conductive fluid L accumulated in the recess 9, and therefore, the operation of closing the inlet 2 f with the closing plate 4 is easily performed. Can do.

(実施形態2)
以下、本発明の実施形態2について図面を用いて説明する。但し、本実施形態は基本的な構成が実施形態1と共通であるので、共通の部位には同一の符号を付して説明を省略する。本実施形態は、図4に示すように、実施形態1の注入口2fの代わりに基板2の厚み方向に窪んだ複数(図示では9つ)の窪み部9が設けられていることに特徴がある。窪み部9は、注入口2fの開口部よりも小さい略矩形状の開口を有し、各窪み部9の底部は収納室1dに貫通するように形成されている。また、各窪み部9は、互いに所定の間隔を空けて設けられている。
(Embodiment 2)
Embodiment 2 of the present invention will be described below with reference to the drawings. However, since the basic configuration of this embodiment is the same as that of the first embodiment, common portions are denoted by the same reference numerals and description thereof is omitted. As shown in FIG. 4, the present embodiment is characterized in that a plurality (9 in the drawing) of recessed portions 9 that are recessed in the thickness direction of the substrate 2 are provided instead of the injection port 2 f of Embodiment 1. is there. The depression 9 has a substantially rectangular opening smaller than the opening of the injection port 2f, and the bottom of each depression 9 is formed so as to penetrate the storage chamber 1d. Moreover, each hollow part 9 is provided at predetermined intervals mutually.

而して、実施形態1の注入口2fと同様に窪み部9の開口から導電性流体Lを収納室1dへ注入することができる。ここで、各窪み部9の開口面積の総和は実施形態1の注入口2fの開口面積よりも大きいために、実施形態1と比べて導電性流体Lを収納室1d内に容易に注入することができる。また、各窪み部9は所定の間隔を空けて形成されているので、各窪み部9の開口間で導電性流体Lが繋がらないために窪み部9の開口周縁で余分な導電性流体Lを付着するのを防ぐことができ、したがって注入口2fを閉塞板4で閉塞する作業を容易に行うことができる。   Thus, the conductive fluid L can be injected into the storage chamber 1d from the opening of the recess 9 in the same manner as the injection port 2f of the first embodiment. Here, since the sum total of the opening areas of the recesses 9 is larger than the opening area of the injection port 2f of the first embodiment, the conductive fluid L can be easily injected into the storage chamber 1d as compared with the first embodiment. Can do. Moreover, since each hollow part 9 is formed at predetermined intervals, the conductive fluid L is not connected between the openings of the respective hollow parts 9, so that the excess conductive fluid L is formed around the opening periphery of the hollow part 9. Adhesion can be prevented, and therefore the operation of closing the inlet 2f with the closing plate 4 can be easily performed.

(実施形態3)
以下、本発明の実施形態3について図面を用いて説明する。但し、本実施形態は基本的な構成が実施形態1と共通であるので、共通の部位には同一の符号を付して説明を省略する。本実施形態は、図5(a)に示すように、基板2の前面において上方へと突出する段部10が注入口2fの周縁に一体に形成されていることに特徴がある。段部10は、注入口2fの図5(a)における上側及び左側に形成されており、段部10と基板2の注入口2f周縁との成す角度が略直角となっている(図5(b)参照)。
(Embodiment 3)
Hereinafter, Embodiment 3 of the present invention will be described with reference to the drawings. However, since the basic configuration of this embodiment is the same as that of the first embodiment, common portions are denoted by the same reference numerals and description thereof is omitted. As shown in FIG. 5A, the present embodiment is characterized in that a step portion 10 protruding upward on the front surface of the substrate 2 is integrally formed on the periphery of the injection port 2f. The step portion 10 is formed on the upper and left sides of the injection port 2f in FIG. 5A, and the angle formed between the step portion 10 and the periphery of the injection port 2f of the substrate 2 is substantially a right angle (FIG. 5 ( b)).

而して、導電性流体Lを収納室1d内に注入する際に、図5(b)に示すように、基板2の注入口2f周縁と段部10とが成す角の部位に導電性流体Lが付着し難くなる。したがって、余分な導電性流体Lを容易に除去することができ、注入口2fを閉塞板4で閉塞する作業を容易に行うことができる。   Thus, when the conductive fluid L is injected into the storage chamber 1d, as shown in FIG. 5B, the conductive fluid L is formed at a corner portion formed by the peripheral edge of the inlet 2f of the substrate 2 and the step portion 10. L becomes difficult to adhere. Therefore, excess conductive fluid L can be easily removed, and the operation of closing the inlet 2f with the closing plate 4 can be easily performed.

(実施形態4)
以下、本発明の実施形態4について図面を用いて説明する。但し、本実施形態は基本的な構成が実施形態1と共通であるので、共通の部位には同一の符号を付して説明を省略する。本実施形態は、注入用溝部20に特徴があり、図6に示すように、注入口2fに連通し且つその開口面積が収納室1dに向かうにつれて小さくなる第一の傾斜部20aと、第一の傾斜部20aの収納室1d側の開口部と連通し且つその開口面積が収納室1dに向かうにつれて大きくなる第二の傾斜部20bとから成る。第一の傾斜部20aの表面は、例えばフッ素樹脂等の撥水性を有する材料から成る被膜が形成されており、該表面に導電性流体Lが付着するのを防いでいる。
(Embodiment 4)
Embodiment 4 of the present invention will be described below with reference to the drawings. However, since the basic configuration of this embodiment is the same as that of the first embodiment, common portions are denoted by the same reference numerals and description thereof is omitted. The present embodiment is characterized by the injecting groove portion 20, and as shown in FIG. 6, the first inclined portion 20a that communicates with the injecting port 2f and whose opening area decreases toward the storage chamber 1d, The second inclined portion 20b communicates with the opening on the storage chamber 1d side of the inclined portion 20a and increases in opening area toward the storage chamber 1d. A film made of a material having water repellency such as a fluororesin is formed on the surface of the first inclined portion 20a to prevent the conductive fluid L from adhering to the surface.

而して、導電性流体Lを収納室1d内に注入する際に、注入用溝部20の第一の傾斜部20aに導電性流体Lが付着するのを防ぐことで、余分な導電性流体Lを容易に除去することができ、したがって注入口2fを閉塞板4で閉塞する作業を容易に行うことができる。また、第二の傾斜部20bが収納室1dから注入口2fに向かうにつれてその開口面積が狭くなるように形成されているので、導電性流体Lが収納室1dから注入口2fを通って本体部1の外部に逆流するのを防ぐことができる。   Thus, when the conductive fluid L is injected into the storage chamber 1d, the excess conductive fluid L is prevented by preventing the conductive fluid L from adhering to the first inclined portion 20a of the injection groove 20. Therefore, the operation of closing the inlet 2f with the closing plate 4 can be easily performed. Further, since the opening area of the second inclined portion 20b becomes narrower as it goes from the storage chamber 1d to the injection port 2f, the conductive fluid L passes through the injection port 2f from the storage chamber 1d. Backflow to the outside of 1 can be prevented.

尚、第一の傾斜部20aは、導電性流体Lが付着するのを防ぐことのできる構成であればよく、上記のように撥水性を有する材料で被膜を形成する代わりに、例えばサンドブラスト処理によって微細な凹凸を形成することで第一の傾斜部20aの表面を粗面化してもよい。   In addition, the 1st inclination part 20a should just be the structure which can prevent the electroconductive fluid L adhering. Instead of forming a film with the material which has water repellency as mentioned above, for example by sandblasting process The surface of the first inclined portion 20a may be roughened by forming fine irregularities.

本発明の実施形態1の接点開閉装置を示す図で、(a)は概略前面図で、(b)は概略後面図で、(c)はA−A’線断面矢視図で、(d)はB−B’線断面矢視図で、(e)はC−C’線断面矢視図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the contact switching device of Embodiment 1 of this invention, (a) is a schematic front view, (b) is a schematic rear view, (c) is a sectional view on the AA 'line, (d ) Is a cross-sectional view taken along line BB ′, and (e) is a cross-sectional view taken along line CC ′. 同上の導電性流体の注入方法を示す図で、(a)は本体部を導電性流体に浸す前を示す図で、(b)は本体部を導電性流体に浸した直後を示す図で、(c)はチャンバ内の圧力を上昇させた場合を示す図で、(d)はチャンバ内の圧力を所定の値まで上昇させた場合を示す図である。It is a figure which shows the injection | pouring method of a conductive fluid same as the above, (a) is a figure which shows before immersing a main-body part in a conductive fluid, (b) is a figure which shows immediately after immersing a main-body part in a conductive fluid, (C) is a figure which shows the case where the pressure in a chamber is raised, (d) is a figure which shows the case where the pressure in a chamber is raised to a predetermined value. 同上の窪み部の説明図で、(a)は窪み部を設けない場合を示す図で、(b)は窪み部を設けた場合を示す図である。It is explanatory drawing of a hollow part same as the above, (a) is a figure which shows the case where a hollow part is not provided, (b) is a figure which shows the case where a hollow part is provided. 本発明の実施形態2の接点開閉装置を示す基板の概略前面図である。It is a schematic front view of the board | substrate which shows the contact switching apparatus of Embodiment 2 of this invention. 本発明の実施形態3の接点開閉装置を示す図で、(a)は基板の概略前面図で、(b)は本体部断面の一部拡大図である。It is a figure which shows the contact switching apparatus of Embodiment 3 of this invention, (a) is a schematic front view of a board | substrate, (b) is a partially expanded view of a main-body part cross section. 本発明の実施形態4の接点開閉装置を示す概略断面図である。It is a schematic sectional drawing which shows the contact switching apparatus of Embodiment 4 of this invention.

符号の説明Explanation of symbols

1 本体部
1d 収納室
2c ダイアフラム部(壁部)
2f 注入口
20 注入用溝部
5a,6a 接点
7 アクチュエータ(駆動手段)
9 窪み部(流出防止手段)
L 導電性流体
DESCRIPTION OF SYMBOLS 1 Main body part 1d Storage chamber 2c Diaphragm part (wall part)
2f Inlet 20 Injection groove 5a, 6a Contact 7 Actuator (drive means)
9 hollow (outflow prevention means)
L Conductive fluid

Claims (7)

導電性流体が収納される収納室及び一端側で収納室と連結するとともに他端側に導電性流体を収納室内に注入するための注入口が設けられた注入用溝部を有する本体部と、少なくとも一部を収納室内に臨ませた状態で設けられる一乃至複数の接点と、本体部の厚み方向における収納室の壁部を変形させて導電性流体を移動させることによって接点の間を導電性流体を介して導通又は開放させる駆動手段とを備え、導電性流体を注入口から注入した後の余分な導電性流体を本体部外部に流出させるための流出手段を設けたことを特徴とする接点開閉装置。   A main body having a storage chamber in which a conductive fluid is stored, an injection groove provided with an inlet for connecting the storage fluid to the storage chamber on one end side and injecting the conductive fluid into the storage chamber on the other end; Conductive fluid between one or a plurality of contacts provided with a part facing the storage chamber and the contacts by moving the conductive fluid by deforming the wall of the storage chamber in the thickness direction of the main body. And a drive means for conducting or opening through the contact, and provided with an outflow means for allowing excess conductive fluid to flow out of the main body after injecting the conductive fluid from the injection port. apparatus. 前記流出手段は、本体部外面において注入口周縁に設けられて本体部の厚み方向に窪んだ一乃至複数の窪み部から成ることを特徴とする請求項1記載の接点開閉装置。   2. The contact switching device according to claim 1, wherein the outflow means comprises one or a plurality of indentations provided on the periphery of the injection port on the outer surface of the main body and recessed in the thickness direction of the main body. 前記窪み部は、その底部が本体部の収納室に貫通することを特徴とする請求項2記載の接点開閉装置。   The contact opening / closing device according to claim 2, wherein a bottom portion of the hollow portion penetrates into a storage chamber of the main body portion. 前記流出手段は、本体部外面において注入口周縁に突設された段部から成ることを特徴とする請求項1記載の接点開閉装置。   2. The contact switching apparatus according to claim 1, wherein the outflow means comprises a stepped portion provided on the outer peripheral surface of the main body so as to protrude from the periphery of the injection port. 前記流出手段は、注入用溝部内壁の少なくとも一部分に形成された撥水性を有する撥水材料の被膜から成ることを特徴とする請求項1記載の接点開閉装置。   2. The contact switching device according to claim 1, wherein the outflow means is formed of a water-repellent water-repellent material film formed on at least a part of the inner wall of the injecting groove. 前記流出手段は、注入用溝部内壁の少なくとも一部分に設けられた微細な凹凸を有した粗面から成ることを特徴とする請求項1記載の接点開閉装置。   2. The contact switching apparatus according to claim 1, wherein the outflow means is formed of a rough surface having fine irregularities provided on at least a part of the inner wall of the injecting groove. 前記注入用溝部は、注入口に連通し且つその開口面積が収納室に向かうにつれて小さくなる第一の傾斜部と、第一の傾斜部の収納室側の開口部と連通し且つその開口面積が収納室に向かうにつれて大きくなる第二の傾斜部とから成ることを特徴とする請求項5又は6記載の接点開閉装置。
The injecting groove communicates with the inlet and decreases in opening area toward the storage chamber, and communicates with the opening on the storage chamber side of the first inclined portion and has an opening area. 7. The contact switching device according to claim 5, further comprising a second inclined portion that becomes larger toward the storage chamber.
JP2006344860A 2006-12-21 2006-12-21 Contact switching device Withdrawn JP2008159323A (en)

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