JP2008156151A - Severing blade unit, apparatus equipped with it for manufacturing liquid crystal display panel and method for manufacturing liquid crystal display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To securely sever at a specified position a pair of glass substrates which are bonded face to face in putting a sealing material between them. <P>SOLUTION: The severing blade unit 5 includes a disk-shaped cutter wheel 1 and a shaft 4 for rotatably bearing the cutter wheel 1, which is for severing a CF mother substrate 12 by rotating the cutter wheel 1 along the surface of the CF mother substrate 12 in pressing the outer periphery R1 of the cutter wheel 1 to the surface of the CF mother substrate 12 where a TFT array mother substrate 11 and the CF mother substrate 12 are bonded via a sealing material 13. A pair of pressing rollers 2 are installed at the shaft 4 so as to be rotatable in holding the cutter wheel 1 between them and each pressing roller 2 is structured to abut the outer periphery R2 on the surface of the CF mother substrate 12 when the outer periphery R1 of the cutter wheel 1 is pressed to the surface of the CF mother substrate 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cutting blade unit, a liquid crystal display panel manufacturing apparatus including the cutting blade unit, and a liquid crystal display panel manufacturing method, and more particularly to a technique for cutting a glass substrate constituting a thin liquid crystal display panel.

  The liquid crystal display panel is disposed, for example, so as to face a TFT array substrate on which a thin film transistor (hereinafter referred to as “TFT”) is formed, and a color filter (hereinafter referred to as “CF”). And the like, and a liquid crystal layer provided between the two substrates. Here, since the TFT array substrate and the CF substrate are generally produced by forming various thin films on the glass substrate, the glass substrate is made to have a predetermined size in the manufacturing process of the liquid crystal display panel. The dividing process of dividing is an indispensable process.

  In the dividing step, for example, a scribe method in which a linear scribe line is formed on the surface of a glass substrate and then the glass substrate is divided on both sides along the scribe line has been widely used.

For example, in Patent Document 1, in a state where the glass substrate is sucked and held on the suction surfaces of the first stage and the second stage, the stage moving mechanism causes the first stage and the second stage to approach or separate from each other, A substrate cutting apparatus configured to scan a scribe line forming unit along a direction orthogonal to the moving direction of the stage is disclosed. And according to this board | substrate cutting device, without being influenced by the flatness of each adsorption | suction surface of a 1st stage and a 2nd stage, a linear scribe line is formed on the glass substrate along the scanning direction of a scribe line formation means. It is described that it can be formed and the glass substrate can be reliably cut along the scribe line.
JP 2006-199553 A

  By the way, the liquid crystal display panel is mounted on various mobile devices such as mobile phones. In recent years, in such a liquid crystal display panel for mobile use, in order to reduce the weight of the panel body, a glass substrate constituting the panel body is used. Thinning is required. However, when the glass substrate is thinned, there is a possibility that the following separation failure may occur in the dividing step of dividing the bonded TFT array substrate and CF substrate (hereinafter referred to as “bonded body”). .

  FIG. 5 is a schematic cross-sectional view showing the state of the bonded body 115 when a scribe line is formed on the bonded body 115 using the conventional cutting device 120.

  This cutting device 120 includes, for example, a disc-shaped cutter wheel 101 whose outer peripheral edge is formed of sintered diamond, a shaft 104 for rotatably supporting the cutter wheel 101, and both ends of the shaft 104. A cutting blade unit 115 including a cutter holder 103 for receiving a bearing and accommodating the upper side of the cutter wheel 101 is provided. The bonding body 115 is formed by, for example, bonding a TFT array mother substrate 111 having a thickness of about 0.4 mm and a CF mother substrate 112 having a thickness of about 0.2 mm via a frame-shaped sealing material 113 for each cell unit. It is configured by combining them. And in order to cut | disconnect the CF mother board | substrate 112 for every cell unit, when forming a scribe line on the surface of the CF mother board | substrate 112 using the cutting device 120, for example, the cutting edge of the cutter wheel 101 is bonded. The CF mother substrate 112 is bent as shown in FIG. Then, the compressive stress due to the cutting edge of the cutter wheel 101 is not stably applied to the surface of the CF mother substrate 112, so that the scribe line is not formed at a predetermined position and it is difficult to cut the CF mother substrate 112 at a predetermined position. As a result, a division failure occurs.

  The present invention has been made in view of such a point, and an object of the present invention is to reliably divide a pair of glass substrates bonded to each other through a sealing material at a predetermined position. .

  In order to achieve the above object, according to the present invention, when the cutting blade rolls along the surface of the glass substrate, the surfaces on both sides of the cutting blade in the glass substrate are pressed.

  Specifically, the cutting blade unit according to the present invention includes a disk-shaped cutting blade and a support shaft for rotatably supporting the cutting blade, and is bonded to each other via a sealing material. A cutting blade for cutting the one glass substrate by rolling the cutting blade along the surface of the one glass substrate while pressing the outer periphery of the cutting blade against one surface of the pair of glass substrates The support shaft is provided with a pair of disk-like contact bodies rotatably on the parting blade, and each contact body has an outer peripheral part of the parting blade on the one of the one side. When pressed against the surface of the glass substrate, the outer peripheral portion is configured to come into contact with the surface of the one glass substrate.

  According to said structure, when the outer peripheral part of a cutting blade is pressed on the surface of one glass substrate in a pair of glass substrate bonded so that it may mutually oppose through a sealing material, it cuts along a support shaft. Since the outer peripheral portion of each contact body provided on both sides of the blade contacts the surface of one glass substrate and presses the glass surface, the portion where the outer peripheral portion of the cutting blade in the pair of glass substrates is pressed, And in the part where the outer peripheral part of each contact body is in contact, the distance from the surface of the other glass substrate to the surface of one glass substrate is aligned between the parts where the outer peripheral part of each contact body contacts. become. Therefore, the compressive stress by the outer peripheral part (blade edge) of a parting blade is stably added with respect to the surface of one glass substrate. As a result, a scribe line is formed on the surface of one glass substrate or a crack is formed on one glass substrate at a predetermined position. Therefore, a pair of glass substrates bonded so as to face each other through a sealing material is arranged at a predetermined position. It becomes possible to divide reliably.

  In addition, the liquid crystal display panel manufacturing apparatus according to the present invention includes a dividing stage for placing a pair of glass substrates bonded so as to face each other via a sealing material, and a dividing arranged above the dividing stage. A manufacturing apparatus for manufacturing a liquid crystal display panel by cutting an upper glass substrate of a pair of glass substrates placed on the cutting stage by the cutting blade unit, the cutting blade unit comprising: a blade unit; A disc-shaped cutting blade and a support shaft for rotatably supporting the cutting blade, and press the outer peripheral portion of the cutting blade against the surface of the upper glass substrate placed on the cutting stage. However, it is configured to sever the upper glass substrate by rolling the parting blade along the surface of the upper glass substrate. The abutting body is rotatably provided across the cutting blade, and each of the abutting bodies is configured such that when the outer peripheral portion of the cutting blade is pressed against the surface of the upper glass substrate, the outer peripheral portion is the upper side. It is comprised so that it may contact | abut on the surface of this glass substrate.

  According to said structure, it is the cutting blade which comprises a cutting blade unit on the surface of the upper glass substrate in a pair of glass substrate which was mounted on the cutting stage and bonded together through the sealing material. When the outer peripheral part is pressed, the outer peripheral part of each contact body provided on both sides of the cutting blade along the support shaft of the cutting blade unit contacts the surface of the upper glass substrate and presses the glass surface. Therefore, in the part where the outer peripheral part of the cutting blade in the pair of glass substrates is pressed and the part where the outer peripheral part of each contact body is in contact, the upper side from the surface of the lower (parting stage side) glass substrate. The distance to the surface of the glass substrate is uniform between the portions where the outer peripheral portions of the respective contact bodies abut. Therefore, the compressive stress by the outer peripheral part (blade edge) of the cutting blade is stably applied to the surface of the upper glass substrate. As a result, a scribe line is formed on the surface of the upper glass substrate or a crack is formed on the upper glass substrate at a predetermined position, so that the pair of glass substrates bonded to face each other through the sealing material is positioned at the predetermined position. It becomes possible to divide reliably.

  Furthermore, the method for manufacturing a liquid crystal display panel according to the present invention includes placing a pair of glass substrates that are bonded together so as to face each other via a sealing material, and placing the pair of glass substrates on the dividing stage. By rolling the cutting blade along the surface of the upper glass substrate while pressing the outer peripheral portion of the disk-shaped cutting blade against the surface of the upper glass substrate in the pair of glass substrates, A method of manufacturing a liquid crystal display panel comprising a dividing step of dividing the glass substrate, wherein the dividing blade rolls while pressing the surfaces on both sides of the cutting blade in the upper glass substrate. It is characterized by making it.

  According to the above method, the cutting blade in the dividing step is placed on the surface of the upper glass substrate in the pair of glass substrates that are placed on the dividing stage in the placing step and bonded to each other via the sealing material. When pressing the outer peripheral part of the cutting blade that constitutes the unit, the surface on both sides of the cutting blade in the upper glass substrate is pressed, so the outer peripheral part of the cutting blade in the pair of glass substrates is pressed, And in the pressed part of the both sides of the cutting blade, the distance from the surface of the glass substrate on the lower side (the cutting stage side) to the surface of the upper glass substrate is uniform. Therefore, the compressive stress by the outer peripheral part (blade edge) of the cutting blade is stably applied to the surface of the upper glass substrate. As a result, a scribe line is formed on the surface of the upper glass substrate or a crack is formed on the upper glass substrate at a predetermined position, so that the pair of glass substrates bonded to face each other through the sealing material is positioned at the predetermined position. It becomes possible to divide reliably.

  In the dividing step, the upper glass substrate may be divided along the scribe line after the scribe line is formed on the surface of the upper glass substrate by pressing and rolling the dividing blade.

  According to the above method, by forming a scribe line on the surface of the upper glass substrate in the pair of glass substrates placed on the cutting stage, the upper glass substrate will be divided in two stages, The effects of the present invention are specifically demonstrated.

  In the dividing step, the upper glass substrate may be divided by pressing and rolling the dividing blade to form a crack reaching the back surface from the front surface to the upper glass substrate.

  According to said method, in forming the crack which reaches a back surface in the surface of the upper glass substrate in a pair of glass substrate mounted on the cutting | disconnection stage, in cutting the upper glass substrate in one step. Thus, the effects of the present invention are specifically demonstrated.

  According to the present invention, when the cutting blade rolls along the surface of the glass substrate, the surfaces on both sides of the cutting blade in the glass substrate are pressed, so that they face each other via the sealing material. A pair of bonded glass substrates can be reliably cut at a predetermined position.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.

Embodiment 1 of the Invention
1 to 4 show Embodiment 1 of a cutting blade unit according to the present invention, a liquid crystal display panel manufacturing apparatus including the same, and a method for manufacturing a liquid crystal display panel. Specifically, FIG. 1 is a cross-sectional view of a liquid crystal display panel manufacturing apparatus 20 including the cutting blade unit 5 of the present embodiment, and FIG. 2 is a perspective view of the liquid crystal display panel manufacturing apparatus 20.

  As shown in FIGS. 1 and 2, the liquid crystal display panel manufacturing apparatus 20 includes a cutting stage 10 for placing the bonded body 15, and a cutting unit 5 that is movably disposed above the cutting stage 10. ing.

  As shown in FIG. 1, the cutting unit 5 includes a cutter wheel 1 provided as a disk-shaped cutting blade, a rod-like shaft 4 provided as a support shaft for rotatably supporting the cutter wheel 1, A pair of pressing rollers 2 each provided as a disc-shaped contact body and rotatably supported by the shaft 4 so as to sandwich the cutter wheel 1, and both ends of the shaft 4 are supported while the cutter wheel 1 and each pressing roller 2 and a cutter holder 3 provided so as to accommodate the upper side of 2.

  The cutter wheel 1 is made of a cemented carbide such as tungsten carbide, for example, having a diameter of 2.0 mm, a thickness of 0.65 mm, and a cutting edge of 150 degrees, and the side surface protrudes in a tapered shape toward the center in the thickness direction. Is configured in a hexagonal shape. Further, diamond may be sintered on the outer peripheral portion (blade edge) of the cutter wheel 1.

  Each pressing roller 2 is configured in a disk shape with a diameter of 2.0 mm and a thickness of 0.5 mm, for example, of PE (polyethylene, PolyEthylene) resin. In addition, the space | interval of the cutter wheel 1 and each press roller 2 is about 0.5 mm, for example.

  The cutter holder 3 and the shaft 4 are made of a cemented carbide such as tungsten carbide, for example.

  The dividing stage 10 is made of, for example, stainless steel or ceramic, and has a large number of suction holes 10 connected to a vacuum pump via a vacuum exhaust system pipe on the surface thereof.

  The bonding body 15 is configured, for example, by bonding the TFT array mother substrate 11 and the CF mother substrate 12 (a pair of glass substrates) via a frame-shaped sealing material 13 for each cell unit.

  The TFT array mother substrate 11 includes, for example, a plurality of gate lines (not shown) provided on a mother glass substrate having a thickness of 0.2 mm to 0.4 mm so as to extend in parallel with each cell unit, A plurality of source lines (not shown) provided so as to extend in parallel to each other in a direction orthogonal to each gate line, and a plurality of TFTs (not shown) provided respectively at the intersections of each gate line and each source line A plurality of pixel electrodes (not shown) provided corresponding to each TFT, and an alignment film (not shown) provided so as to cover each pixel electrode are provided.

  The TFT includes a gate electrode that protrudes to the side of the gate line, a gate insulating film provided to cover the gate electrode, and an island shape on the gate insulating film at a position corresponding to the gate electrode. And a source electrode and a drain electrode provided so as to face each other on the semiconductor layer. Here, the source electrode is a portion protruding to the side of the source line. The drain electrode is electrically connected to the pixel electrode.

  The CF mother substrate 12 is provided, for example, on a mother glass substrate having a thickness of 0.1 mm to 0.15 mm in correspondence with each pixel electrode on the TFT array mother substrate 11 for each cell unit. A plurality of colored layers (not shown) colored in red, green or blue, a black matrix (not shown) provided in a lattice shape between the colored layers, and a common electrode provided on each colored layer (Not shown) and an alignment film (not shown) provided so as to cover the common electrode.

  In addition, the liquid crystal display panel manufacturing apparatus 20 has a CF mother substrate of the bonded body 15 that is adsorbed and placed on the upper surface of the dividing stage 10 by moving the dividing unit 5 on the dividing stage 10 as shown in FIG. The cutter wheel 1 and each pressing roller 2 roll along the surface of the CF mother board 12 in a state where the outer peripheral portion (blade edge) R1 of the cutter wheel 1 and the outer peripheral portion R2 of each pressing roller 2 are in contact with the surface of 12. The scribe line L is formed by moving. At this time, in the liquid crystal display panel manufacturing apparatus 20, as shown in FIG. 3, the outer peripheral portion R1 of the cutter wheel 1 of the bonded body 15 and the outer peripheral portion R2 of each pressing roller 2 were brought into contact with each other. In this portion, the distance from the surface of the TFT array mother substrate 11 to the surface of the CF mother substrate 12 is uniform between the portions where the outer peripheral portions R2 of the respective pressing rollers 2 are in contact with each other. Thus, the compressive stress due to the cutting edge of the outer peripheral portion R1 of the cutter wheel 1 can be applied stably (substantially perpendicularly), and the scribe line L can be formed at a predetermined position on the surface of the CF mother substrate 12. Here, FIG. 3 is a sectional view showing a usage state of the liquid crystal display panel manufacturing apparatus 20 corresponding to FIG.

  Next, with reference to FIGS. 1-4, an example is given and demonstrated about the manufacturing method of a liquid crystal display panel. Here, FIG. 4 is a cross-sectional view of the liquid crystal display panel P manufactured by the manufacturing method of the present embodiment. In addition, the manufacturing method of the liquid crystal display panel of this embodiment includes a TFT array mother substrate manufacturing process, a CF mother board manufacturing process, a bonding process, an etching process, a placing process, a dividing process, a liquid crystal injecting process, and a sealing process. .

<TFT array mother substrate manufacturing process>
First, a metal film such as aluminum is formed on the entire glass substrate having a thickness of about 0.7 mm by a sputtering method to a thickness of about 1500 mm, and then patterned by photolithography to form gate lines and gate electrodes. To do.

  Subsequently, a silicon nitride film or the like is formed to a thickness of about 4000 mm on the entire substrate on which the gate line and the gate electrode are formed by a CVD (Chemical Vapor Deposition) method to form a gate insulating film.

  Further, an intrinsic amorphous silicon film and an n + amorphous silicon film doped with phosphorus are continuously formed on the entire substrate on which the gate insulating film is formed by a CVD method at a thickness of about 1500 mm and 400 mm, respectively. Thereafter, patterning in an island shape on the gate electrode by photolithography is performed to form a semiconductor layer composed of an intrinsic amorphous silicon layer and an n + amorphous silicon layer.

  Then, a metal film such as titanium is formed on the entire substrate on which the semiconductor layer is formed by a sputtering method with a thickness of about 1500 mm, and then patterned by photolithography to form a source line, a source electrode, and a drain electrode. To do.

  Subsequently, by etching the n + amorphous silicon layer of the semiconductor layer using the source electrode and the drain electrode as a mask, the channel portion is patterned to form a TFT.

  Furthermore, an organic insulating film such as a photosensitive acrylic resin is formed with a thickness of about 3 μm on the entire substrate on which the TFT is formed by using a spin coating method, and then a contact hole is formed on the drain electrode by photolithography. A protective insulating film is formed by patterning.

  Then, an ITO (Indium Tin Oxide) film having a thickness of about 1000 mm is formed on the entire substrate on the protective insulating film by a sputtering method, and then patterned by photolithography to form a pixel electrode.

  Finally, a polyimide resin is applied with a thickness of about 500 mm on the entire substrate on which the pixel electrodes are formed by a printing method, and then a rubbing process is performed to form an alignment film.

  As described above, a TFT array mother substrate can be produced.

<CF motherboard fabrication process>
First, for example, a chromium thin film with a thickness of about 1000 mm is formed on the entire glass substrate having a thickness of about 0.7 mm by sputtering, and then patterned by photolithography to form a black matrix.

  Subsequently, for example, a photosensitive resist material colored in red, green, or blue is applied to each of the black matrix lattices in a thickness of about 1 to 3 μm, and then selected by patterning by photolithography. A colored layer of color is formed. Further, the same process is repeated for the other two colors to form colored layers of the other two colors.

  Further, a common electrode is formed on each colored layer by sputtering, for example, by forming an ITO film with a thickness of about 1000 mm.

  Finally, a polyimide resin is applied to the entire substrate on which the common electrode is formed with a thickness of about 500 mm by a printing method, and then a rubbing process is performed to form an alignment film.

  As described above, a CF mother substrate can be manufactured.

<Lamination process>
First, for example, by applying a thermosetting epoxy resin or the like in a frame shape having a liquid crystal inlet for each cell unit to the CF mother substrate produced in the CF mother substrate production step by a screen printing method. The sealing material 13 is formed.

  Subsequently, spacers made of, for example, plastic beads having a diameter of about 3 μm are sprayed inside each sealing material 13 of the CF mother substrate on which the sealing material 13 is formed.

  Further, after bonding the CF mother substrate on which the spacers are dispersed and the TFT array mother substrate manufactured in the TFT array mother substrate manufacturing step, the sealing material 13 is cured by heating, and the TFT array mother substrate and A bonded body is produced by bonding the CF mother substrate.

<Etching process>
The TFT array mother substrate 11 has a thickness of 0.2 mm to 0.2 mm by immersing the bonded body produced in the bonding step in an etching solution and etching the outer surface of each glass substrate constituting the TFT array mother substrate and the CF mother substrate. A bonded body 15 in which the CF mother substrate 12 is thinned to 0.4 mm and 0.1 mm to 0.15 mm, respectively, is produced.

<Installation process>
After placing the bonded body 15 produced in the etching process on the cutting stage 10 of the liquid crystal display panel manufacturing apparatus 20 so that the CF mother substrate 12 is on the upper side, a vacuum pump connected to the suction hole 10h is provided. By operating, the bonding body 15 is adsorbed on the surface of the dividing stage 10.

<Division process>
First, as shown in FIG. 2, the outer peripheral portion R1 of the cutter wheel 1 and the pressing rollers 2 on both sides of the CF mother substrate 12 of the bonded body 15 placed on the dividing stage 10 in the placing step described above. While pressing the outer peripheral portion R2, the cutting blade unit 5 is moved so that the cutter wheel 1 and each pressing roller 2 roll along the surface of the CF mother substrate 12, thereby scribing on the surface of the CF mother substrate 12. Line L is formed.

  Subsequently, after the bonding body 15 on the cutting stage 10 is reversed so that the bonding body 15 is placed so that the TFT array mother substrate 11 is on the upper side, the cutting blade unit 5 is moved in the same manner as described above. Thus, a scribe line L is formed on the surface of the TFT array mother substrate 11.

  Furthermore, the bonding body 15 in which the scribe line L is formed is divided along the scribe line L using a break machine.

  In addition, in the dividing process of this embodiment, although it repeats until the bonding body 15 is divided | segmented into each cell unit, a cutting is interrupted in the strip-shaped state by which the several cell unit was arranged continuously, and strip-shaped bonding is carried out. After performing the liquid crystal injecting step and the sealing step, which will be described later, for the combined body, the strip-shaped bonded body may be divided into cell units.

<Liquid crystal injection process>
A liquid crystal material is injected from the liquid crystal injection port of the sealing material 13 into the bonded body 15 divided in the above-described dividing step by a decompression method.

<Sealing process>
By applying UV light after applying a UV curable resin with a brush or the like so as to close the liquid crystal injection port of the sealing material on the end face of the bonded body 15 into which the liquid crystal material has been injected in the liquid crystal injection step, The liquid crystal material 14 is sealed to form the liquid crystal layer 14.

  As described above, as shown in FIG. 4, the TFT array substrate 11a and the CF substrate 12a arranged to face each other, the liquid crystal layer 14 provided between the substrates 11a and 12a, the substrates 11a and The liquid crystal display panel P provided with the sealing material 13 provided so as to surround the liquid crystal layer 14 between 12a can be manufactured.

  As described above, according to the cutting blade unit 5, the liquid crystal display panel manufacturing apparatus 20, and the liquid crystal display panel P manufacturing method of the present embodiment, they are placed on the cutting stage 10 and face each other via the sealing material 13. When the outer peripheral portion R1 of the cutter wheel 1 constituting the cutting blade unit 5 is pressed against the surface of the CF mother substrate 12 in the TFT array mother substrate 11 and the CF mother substrate 12 that are bonded together, the cutting blade unit 5 Since the outer peripheral portion R2 of each pressing roller 2 provided on both sides of the cutter wheel 1 along the shaft 4 contacts the surface of the CF mother substrate 12 and presses the glass surface thereof, the TFT array mother substrate 11 and the CF mother substrate In the portion where the outer peripheral portion R1 of the cutter wheel 1 is pressed against the substrate 12 and the portion where the outer peripheral portion R2 of each pressing roller 2 is in contact, T Distance from the surface of the T array mother substrate 11 to the surface of the CF mother substrate 12, the outer peripheral portion R2 of the pressing roller 2 so that the aligned between the abutting portions. Therefore, the compressive stress by the outer peripheral part (blade edge) R1 of the cutter wheel 1 is stably applied to the surface of the CF mother substrate 12. As a result, the scribe line L1 is formed at a predetermined position on the surface of the CF mother substrate 12, so that the TFT array mother substrate 11 and the CF mother substrate 12 bonded so as to face each other through the sealant 13 are placed at a predetermined position. It can be surely divided.

  Moreover, in this embodiment, although the division | segmentation by rotary blades, such as a cutter wheel, was illustrated, this invention is applicable also to the division | segmentation by a fixed blade.

  Furthermore, in the present embodiment, the method of dividing the TFT array mother substrate 11 and the CF mother substrate 12 for each cell unit has been exemplified. However, the present invention divides and removes excess portions around the TFT array substrate and the CF substrate. It can also be applied to.

  Moreover, in this embodiment, although the liquid crystal display panel manufacturing apparatus 20 which moves the cutting blade unit 5 with respect to the fixed cutting stage 10 was illustrated, it is an apparatus structure which moves a cutting stage with respect to the fixed cutting unit. There may be.

  Furthermore, although the manufacturing method of the liquid crystal display panel is illustrated in the present embodiment, the present invention can also be applied to other display panels manufactured by bonding a pair of glass substrates at a predetermined interval.

  As described above, the present invention can be surely divided into a thin glass substrate, and thus is useful for a liquid crystal display panel for mobile use.

It is sectional drawing of the liquid crystal display panel manufacturing apparatus 20 provided with the parting blade unit 5 which concerns on Embodiment 1. FIG. 3 is a perspective view of a liquid crystal display panel manufacturing apparatus 20. FIG. 4 is a cross-sectional view showing a usage state of the liquid crystal display panel manufacturing apparatus 20. FIG. 4 is a cross-sectional view of a liquid crystal display panel P manufactured by the liquid crystal display panel manufacturing apparatus 20. FIG. It is a cross-sectional schematic diagram which shows the state of the bonding body 115 at the time of forming a scribe line with respect to the bonding body 115 using the conventional parting apparatus 120. FIG.

Explanation of symbols

L Scribe line P Liquid crystal display panel R1, R2 Outer peripheral part 1 Cutter wheel (parting blade)
2 Press roller (contact body)
4 Shaft (support shaft)
5 Dividing blade unit 10 Dividing stage 11 TFT array mother substrate (the other of a pair of glass substrates)
11a TFT array substrate (the other of a pair of glass substrates)
12 CF mother substrate (one of a pair of glass substrates)
12a CF substrate (one of a pair of glass substrates)
13 Seal material 20 Liquid crystal display panel manufacturing equipment

Claims (5)

A disc-shaped parting blade,
A support shaft for rotatably supporting the cutting blade,
The cutting blade is rolled along the surface of the one glass substrate while pressing the outer peripheral portion of the cutting blade against one surface of the pair of glass substrates bonded to face each other through a sealing material. A cutting blade unit for cutting the one glass substrate,
Each of the support shafts is provided with a pair of disk-like contact bodies so as to be rotatable with the dividing blade interposed therebetween,
Each said contact body is comprised so that an outer peripheral part may contact | abut the surface of said one glass substrate, when the outer peripheral part of the said cutting blade is pressed on the surface of said one glass substrate. A cutting blade unit. A cutting stage for placing a pair of glass substrates bonded together so as to face each other via a sealing material;
A cutting blade unit disposed above the cutting stage,
A manufacturing apparatus for manufacturing a liquid crystal display panel by cutting the upper glass substrate in the pair of glass substrates placed on the cutting stage by the cutting blade unit,
The cutting blade unit includes a disk-shaped cutting blade and a support shaft for rotatably supporting the cutting blade, and the cutting blade unit is provided on a surface of the upper glass substrate placed on the cutting stage. It is configured to sever the upper glass substrate by rolling the parting blade along the surface of the upper glass substrate while pressing the outer periphery.
Each of the support shafts is provided with a pair of disk-like contact bodies so as to be rotatable with the dividing blade interposed therebetween,
Each said contact body is comprised so that an outer peripheral part may contact | abut the surface of the said upper glass substrate, when the outer peripheral part of the said cutting blade is pressed on the surface of the said upper glass substrate. Liquid crystal display panel manufacturing equipment. A placing step of placing a pair of glass substrates bonded to face each other via a sealing material on a cutting stage;
While pressing the outer periphery of the disk-shaped parting blade against the surface of the upper glass substrate in the pair of glass substrates placed in the placing step, the parting blade is moved along the surface of the upper glass substrate. A liquid crystal display panel manufacturing method comprising a dividing step of dividing the upper glass substrate by moving,
In the dividing step, the dividing blade is rolled while pressing the surfaces on both sides of the dividing blade in the upper glass substrate. In the manufacturing method of the liquid crystal display panel described in Claim 3,
In the cutting step, the scribe line is formed on the surface of the upper glass substrate by pressing and rolling the cutting blade, and then the upper glass substrate is cut along the scribe line. A manufacturing method of a liquid crystal display panel. In the manufacturing method of the liquid crystal display panel described in Claim 3,
In the dividing step, a crack reaching the back surface from the front surface is formed on the upper glass substrate by pressing and rolling the cutting blade, and the upper glass substrate is divided. Panel manufacturing method.

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