JP2008136169A5 - - Google Patents

Download PDF

Info

Publication number
JP2008136169A5
JP2008136169A5 JP2007213358A JP2007213358A JP2008136169A5 JP 2008136169 A5 JP2008136169 A5 JP 2008136169A5 JP 2007213358 A JP2007213358 A JP 2007213358A JP 2007213358 A JP2007213358 A JP 2007213358A JP 2008136169 A5 JP2008136169 A5 JP 2008136169A5
Authority
JP
Japan
Prior art keywords
piezoelectric
piezoelectric vibrator
sheet substrate
resin mold
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007213358A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008136169A (ja
JP5157315B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007213358A priority Critical patent/JP5157315B2/ja
Priority claimed from JP2007213358A external-priority patent/JP5157315B2/ja
Publication of JP2008136169A publication Critical patent/JP2008136169A/ja
Publication of JP2008136169A5 publication Critical patent/JP2008136169A5/ja
Application granted granted Critical
Publication of JP5157315B2 publication Critical patent/JP5157315B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007213358A 2006-10-24 2007-08-20 圧電デバイスの製造方法、圧電デバイスおよび電子機器 Expired - Fee Related JP5157315B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007213358A JP5157315B2 (ja) 2006-10-24 2007-08-20 圧電デバイスの製造方法、圧電デバイスおよび電子機器

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006288359 2006-10-24
JP2006288359 2006-10-24
JP2007213358A JP5157315B2 (ja) 2006-10-24 2007-08-20 圧電デバイスの製造方法、圧電デバイスおよび電子機器

Publications (3)

Publication Number Publication Date
JP2008136169A JP2008136169A (ja) 2008-06-12
JP2008136169A5 true JP2008136169A5 (cg-RX-API-DMAC10.html) 2010-09-02
JP5157315B2 JP5157315B2 (ja) 2013-03-06

Family

ID=39560656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007213358A Expired - Fee Related JP5157315B2 (ja) 2006-10-24 2007-08-20 圧電デバイスの製造方法、圧電デバイスおよび電子機器

Country Status (1)

Country Link
JP (1) JP5157315B2 (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5262530B2 (ja) 2008-09-30 2013-08-14 セイコーエプソン株式会社 電子デバイス及び電子デバイスの製造方法
WO2016098628A1 (ja) * 2014-12-17 2016-06-23 株式会社 村田製作所 積層セラミック電子部品およびその製造方法
JP6417970B2 (ja) * 2015-01-28 2018-11-07 ミツミ電機株式会社 モジュール及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004297348A (ja) * 2003-03-26 2004-10-21 Seiko Epson Corp 圧電発振器の製造方法
JP2004363839A (ja) * 2003-06-04 2004-12-24 Toyo Commun Equip Co Ltd 圧電振動子とこれを用いた圧電発振器
JP2005347881A (ja) * 2004-05-31 2005-12-15 Kyocera Kinseki Corp 圧電発振器の製造方法
JP4512185B2 (ja) * 2004-06-30 2010-07-28 京セラキンセキ株式会社 圧電発振器の製造方法、及びそのシート型基板
JP2006042278A (ja) * 2004-07-30 2006-02-09 Kyocera Kinseki Corp 圧電発振器及びその製造方法
JP4376153B2 (ja) * 2004-08-31 2009-12-02 京セラキンセキ株式会社 圧電発振器の製造方法
JP2006129303A (ja) * 2004-10-29 2006-05-18 Kyocera Kinseki Corp 圧電発振器の製造方法
JP2006279872A (ja) * 2005-03-30 2006-10-12 Kyocera Kinseki Corp 圧電振動子及びその製造方法並びにその圧電振動子を用いた圧電発振器の製造方法

Similar Documents

Publication Publication Date Title
JP2018207524A5 (cg-RX-API-DMAC10.html)
JP2005033755A5 (cg-RX-API-DMAC10.html)
JP2012024564A5 (cg-RX-API-DMAC10.html)
JP2008236741A5 (cg-RX-API-DMAC10.html)
JP2016046418A5 (cg-RX-API-DMAC10.html)
EP2432017A3 (en) Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same
JP2011119502A5 (cg-RX-API-DMAC10.html)
JP2015097733A5 (cg-RX-API-DMAC10.html)
JP2009252859A5 (cg-RX-API-DMAC10.html)
KR20110061103A (ko) 전자부품 제조장치 및 전자부품 제조방법
JP2016096292A5 (cg-RX-API-DMAC10.html)
JP2011222596A5 (cg-RX-API-DMAC10.html)
JP2009529244A5 (cg-RX-API-DMAC10.html)
JP2019051645A5 (cg-RX-API-DMAC10.html)
JP2008136169A5 (cg-RX-API-DMAC10.html)
JP2013243221A5 (cg-RX-API-DMAC10.html)
US8556155B2 (en) Solder ball mounting tool
JP2016525965A5 (cg-RX-API-DMAC10.html)
EP1473775A3 (en) Method for producing solid-state imaging device
CN202651112U (zh) 一种半导体器件以及一种层叠
JP5771865B2 (ja) モールド金型
JP2009231815A5 (cg-RX-API-DMAC10.html)
US7208346B2 (en) Methods of forming interposers on surfaces of dies of a wafer
CN113195401B (zh) 用于制造具有阻尼器结构的微机械设备的方法
JP2008229656A (ja) プレス成形治具およびプレス被成形物の製造方法