JP2008130800A - Substrate processing system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing system provided with a substrate heat-treating unit which can receive a sufficient number of substrates by reducing the distance between its shelves and does not need to be divided. <P>SOLUTION: A carrying stage 8 is moved to a position opposite to supporting shelves 51 for objects to be carried. In such a state, air is supplied to the top of the supporting shelves 51 so that substrates W can slide on the supporting shelves 51. Also, air is supplied to the top of the carrying stage 8 for levitating the substrates W and the substrates W are slidably supported. Subsequently, pick-up hands 11 hold one end of each of the substrates W supported on the carrying stage 8, bring the substrate W onto the supporting shelves 51 and transfer them from the carrying stage 8 to the supporting shelves 51. By this construction, the supporting shelves 51 can be formed in a lattice-like arrangement. A sufficient strength of the supporting shelves 51 can be obtained while their thickness and their warpage is reduced by forming them into a lattice-like arrangement. In this way, the distance between the supporting shelves 51 is minimized and the height of a substrate baking furnace 1 can be reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for performing predetermined processing on a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a glass substrate for plasma display, a substrate for an optical disk (hereinafter simply referred to as “substrate”). About. More specifically, the present invention relates to a substrate processing apparatus including a heat treatment unit that performs a heat treatment on a substrate and a substrate transfer device that carries a substrate in and out of the heat treatment unit.

  As described in Patent Document 1, a baking furnace that performs a baking process by heating a substrate stores the substrate in a multi-stage state, and heats the inside to a predetermined baking temperature to fire the substrate. A configuration is common. Note that heating refers to raising the temperature of the substrate, and firing refers to heating or oxidative decomposition of the organic material as a result. Further, the purpose of heating has wide applications such as CVD (Chemical Vapor Deposition) and annealing, but here, explanation will be made taking firing as an example.

JP 2006-84109 A

  Considering the baking time and the processing tact per substrate, it is desirable that a predetermined number or more of substrates can be stored in the baking furnace at a time in order to efficiently perform the baking process on the substrate. For example, if the firing time is 30 minutes and the processing tact is 1 minute, considering the temperature rise time and the conveyance time, in order to realize an efficient firing process, at least about 38 substrates are formed at a time. A stowable firing furnace is required. If the firing time is longer than this, a firing furnace capable of storing more substrates is required.

  On the other hand, the height of the firing furnace has an allowable limit. The first value that defines the allowable limit is the height to the ceiling of the clean room in which the firing furnace is installed, and the height of the firing furnace is not allowed to exceed this. The second value is a limit value of the transportable height. A firing furnace with a height exceeding this cannot be transported unless it is divided. When transporting divided firing furnaces, the divided firing furnaces must be connected on-site, resulting in a burden on delivery, extra costs (excess material costs, design costs, connection costs) , An increase in the number of transported packages, costs required for on-site connection work, etc.). Moreover, if the sealing performance is not ensured, there is a risk that it may develop into a major problem such as a process problem or contamination of the clean room environment.

  That is, the firing furnace is required to store a predetermined number or more of substrates therein while suppressing the height. For this purpose, it is necessary to make the pitch between the shelves supporting the substrate in the firing furnace (hereinafter referred to as “rack pitch”) as small as possible.

  One of the factors that prevent the rack pitch from being reduced is the thickness and bending of the transport fork provided in the transport device that carries the substrate in and out of the firing furnace. As shown in the cross-sectional view of FIG. 20A, in the conventional substrate baking furnace 910, one end of the support member 911 that supports the substrate is fixedly disposed on the inner and rear surfaces of the substrate storage portion. The substrate W is supported in a cantilever state. In addition, a support member 912 that supports the substrate W in an auxiliary manner may be further provided on the side surface of the substrate storage unit. When the substrate W supported on the support member 911 is taken out, the transfer device 920 inserts the transfer fork 921 into the furnace, lifts the substrate W on the support member 911 from below, and places the substrate W on the transfer fork 921. In this state, the transport fork 921 is withdrawn from the furnace. Conversely, when the substrate W supported by the transfer fork 921 is carried into the furnace, the transfer device 920 moves the transfer fork 921 supporting the substrate W into the furnace as shown in the longitudinal sectional view of FIG. The transport fork 921 is lowered on the support member 911 and the substrate W is placed on the support member 911. In view of the fact that the transport fork of the transport apparatus for carrying in and out of the substrate is inserted into the furnace in this manner, as shown in FIG. Thus, the rack pitch d must be set large.

  Another factor that prevents the rack pitch from being reduced is the thickness and deflection of the support member 911 itself in the furnace. The support member 911 has to support the substrate W in a cantilever state in the furnace because the transport fork 911 is inserted into the furnace. For this reason, the support member 911 inevitably bends. The cause of this bending is the weight of the supporting member 911, the weight of the substrate W to be placed, the rigidity of the supporting member 911 being lowered due to the temperature rise in the furnace, and the like, especially the supporting member exposed to a high temperature like a firing furnace. In 911, the influence of the bending becomes remarkable. That is, at the position of FIG. 20B, the transport fork 921 and the substrate W placed on the lower support member 911 interfere with each other. Therefore, it is necessary to increase the rack pitch d to a position where no interference occurs.

  In recent years when the size of the substrate is increasing, the bending generated in the transport fork and the supporting member in the furnace has become more conspicuous. It was impossible to make it below a certain level (for example, about 100 mm with a substrate of 2.2 m × 2.4 m size). This makes it impossible to realize a firing furnace that can store, for example, 38 substrates at a time without dividing them within a predetermined height limit. In addition, when performing a baking process with a long baking time, a plurality of baking furnaces are required, leading to an increase in cost, an increase in footprint, and the like.

  The present invention has been made in view of the above problems, and reduces the rack pitch, and thus includes a substrate heat treatment section that has a sufficient number of storable sheets and does not need to be divided within a predetermined height limit. The object is to provide a device.

  The invention according to claim 1 is a substrate processing apparatus comprising a heat treatment unit that performs heat treatment on a substrate and a substrate transfer device that carries the substrate in and out of the heat treatment unit, wherein the heat treatment unit stores a plurality of substrates. A substrate storage unit, a plurality of support shelves formed in the substrate storage unit in multiple stages, each of which is formed on the upper surface of each of the plurality of support shelves and supports the substrate slidably. A first support means capable of supporting the substrate, and a heat treatment means for performing a predetermined heat treatment on the substrate supported by the plurality of support shelves, wherein the substrate transport device supports the substrate, and the transport stage. Moving means to move to a position opposite to one of the plurality of support shelves, and second support means formed on the upper surface of the transfer stage and capable of slidably supporting the substrate. Advancing / retreating means for moving the substrate back and forth between a first sliding position slidably supported by the first supporting means and a second sliding position slidably supported by the second supporting means; .

  According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the first support means supplies a gas ejected upward from below to each upper surface of the plurality of support shelves. And a first levitating support means for slidably supporting the substrate at a position levitating upward from the upper surface of each of the plurality of support shelves by a predetermined distance.

  A third aspect of the present invention is the substrate processing apparatus according to the second aspect, wherein the first levitating support means includes a gas heating means for heating the gas supplied to the upper surfaces of the plurality of support shelves.

  According to a fourth aspect of the present invention, in the substrate processing apparatus according to the second or third aspect, the first levitation support means includes a convex portion formed on an upper surface of each of the plurality of support shelves, and the convex portion A support surface for supporting the substrate is formed on the upper surface of the substrate, and the gas outlet is formed on the support surface.

  According to a fifth aspect of the present invention, in the substrate processing apparatus according to any one of the second to fourth aspects, the supply of the gas by the first levitation support means is stopped and the substrate is placed on each upper surface of the plurality of support shelves. By mounting, the support state of the substrate supported by each of the plurality of support shelves is switched from a state in which the substrate is slidably supported to a state in which the substrate is fixedly supported.

  The invention according to claim 6 is the substrate processing apparatus according to any one of claims 1 to 4, wherein the substrate is supported by pushing up and supporting the substrate at a position a predetermined distance above the upper surface of each of the plurality of support shelves. A state in which the support state of the substrate supported by each of the plurality of support shelves is slidably supported by the push-up support means supporting the substrate slidably supported by the first support means. Switch to a fixed and supported state.

  According to a seventh aspect of the present invention, in the substrate processing apparatus according to the sixth aspect, the push-up support means includes a plurality of support pins that push up and support the back surface of the substrate with dots.

  According to an eighth aspect of the present invention, in the substrate processing apparatus according to any one of the first to seventh aspects, the substrate position regulating means for regulating a horizontal position of the substrate slidably supported by the first supporting means. Prepare.

  According to a ninth aspect of the present invention, in the substrate processing apparatus according to any one of the first to eighth aspects, the second support means supplies a gas ejected upward from below to the upper surface of the transfer stage. And a second levitating support means for slidably supporting the substrate at a position levitating upward a predetermined distance from the upper surface of the transfer stage.

  A tenth aspect of the present invention is the substrate processing apparatus according to the ninth aspect, wherein the supply of the gas by the second levitation support means is stopped and the substrate is placed on the upper surface of the transfer stage, whereby the transfer stage The support state of the substrate supported by the switch is switched from a slidably supported state to a fixedly supported state.

  According to an eleventh aspect of the present invention, in the substrate processing apparatus according to the first aspect, the first support means is arranged on each upper surface of the plurality of support shelves, and each upper surface of the plurality of support shelves and the support. A rolling support unit that slidably supports the substrate while rolling between the back surface of the substrate supported by the shelf;

  According to a twelfth aspect of the present invention, in the substrate processing apparatus according to the eleventh aspect, a gas ejected from below to above is supplied to each of the upper surfaces of the plurality of support shelves so that the rolling support portion is Rolling portion levitation support means for supporting at a position where the plurality of support shelves levitate upward by a predetermined distance from the respective upper surfaces.

  A thirteenth aspect of the present invention is the substrate processing apparatus according to any one of the first to twelfth aspects, wherein each of the plurality of support shelves is horizontally supported with its both ends fixedly disposed on both side surfaces of the substrate storage portion. A member.

  According to a fourteenth aspect of the present invention, in the substrate processing apparatus of the thirteenth aspect, the horizontal support member has a columnar shape, each of the plurality of support shelves has a columnar shape, and one end thereof is an inner back surface of the substrate storage portion. Each of the plurality of support shelves is formed in a lattice shape by integrating the plurality of horizontal members and the plurality of orthogonal horizontal support members.

  According to a fifteenth aspect of the present invention, in the substrate processing apparatus according to the thirteenth aspect, the horizontal support member has a flat plate shape, and two opposing sides of the horizontal member are fixedly disposed on both side surfaces of the substrate storage portion. Yes.

  According to the first aspect of the present invention, since the first support means and the second support means support the substrate slidably, the substrate can be moved forward and backward between the support shelf and the transfer stage with a small force. It becomes possible. Therefore, it is not necessary to insert a transfer fork or the like into the substrate heating furnace when carrying the substrate in and out of the support shelf. As a result, it is possible to reduce the pitch between the support shelves, and thus to realize a substrate processing apparatus including a heat treatment unit that has a sufficient storable number and does not need to be divided within a predetermined height limit. It becomes possible.

  In particular, according to the second aspect of the present invention, the gas is supplied to the upper surface of the support shelf and the substrate is lifted upward by a predetermined distance from the upper surface of the support shelf, so that friction is generated between the substrate and the support shelf. do not do. As a result, the substrate can be moved back and forth with very little force.

  In particular, according to the invention described in claim 3, since the gas supplied to the upper surface of the support shelf is heated, the gas distribution does not affect the temperature distribution in the substrate storage portion, and the substrate is appropriately heat-treated. be able to.

  In particular, according to the fourth aspect of the present invention, the gas ejection port is formed on the support surface formed on the upper surface of the convex portion formed on the upper surface of the support shelf. That is, the gas discharge position can be set higher than the upper surface of the support shelf by the height of the convex portion. This eliminates the need to set the floating position of the substrate high in advance so that the supported substrate does not bend and come into contact with the surface of the support shelf, thereby reducing the amount of gas to be discharged. it can.

  In particular, according to the fifth aspect of the present invention, since the gas supply is stopped while it is not necessary to support it slidably, the amount of gas to be discharged can be reduced. Further, by fixing and supporting the substrate, it is possible to stably perform the heat treatment on the substrate.

  In particular, according to the sixth and seventh aspects of the invention, the substrate is pushed up and supported at a position above the upper surface of the support shelf by a predetermined distance, so that the substrate does not contact the support shelf. This eliminates the non-uniformity of the temperature distribution of the substrate that occurs between the portion that contacts the support shelf and the portion that does not contact, and makes it possible to perform a uniform heat treatment on the substrate.

  In particular, according to the eighth aspect of the invention, the horizontal position of the slidably supported substrate can be regulated, so that the substrate can be moved forward and backward stably and accurately. In addition, it is possible to prevent a situation in which the substrate causes a side slip and contacts the inner wall surface of the substrate storage unit.

  In particular, according to the ninth aspect of the present invention, gas is supplied to the upper surface of the transfer stage and the substrate is lifted upward by a predetermined distance from the upper surface of the transfer stage, so that friction is generated between the substrate and the transfer stage. do not do. As a result, the substrate can be moved back and forth with very little force.

  In particular, according to the invention described in claim 10, since the supply of gas is stopped while it is not necessary to support it slidably, the amount of gas to be discharged can be reduced. Further, by fixing and supporting the substrate, the substrate can be stably transported.

  In particular, according to the invention described in claim 11, since the rolling support portion slidably supports the substrate while rolling between the upper surface of the support shelf and the back surface of the substrate, the substrate is supported between the substrate and the support shelf. The friction can be reduced. As a result, the substrate can be moved back and forth with very little force.

  In particular, according to the twelfth aspect of the present invention, gas is supplied to the upper surface of the support shelf, and the rolling support portion is supported at a position levitated upward by a predetermined distance from the upper surface of the support shelf. Therefore, the rolling support portion does not come into contact with the support shelf while rolling, and generation of particles due to contact can be prevented.

  In particular, according to the invention described in claim 13, since the support shelf includes the horizontal support members that are fixedly arranged on both side surfaces of the substrate storage portion, both ends of the support shelf support the substrate in a cantilever state as in the prior art. High strength can be obtained as compared with the support member. Therefore, the thickness of the support shelves can be reduced, and consequently the pitch between the support shelves can be reduced.

  In particular, according to the invention described in claim 14, since the support shelves are formed in a lattice shape, high strength can be obtained even when compared to the support shelves constituted by support members stretched in only one direction. Can do.

  In particular, according to the invention described in claim 15, since the support shelf is formed in a flat plate shape, high strength can be obtained compared to a support shelf constituted by a support member stretched in only one direction. Can do.

[First Embodiment]
<I. Constitution>
The configuration of the substrate processing apparatus 100 according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic plan view of a substrate processing apparatus 100 according to the present invention. In the following, an XYZ orthogonal coordinate system is appropriately attached in the figure. In this coordinate system, the Z-axis direction is the vertical direction, and the X and Y axes define a horizontal plane. The substrate processing apparatus 100 includes at least one substrate firing furnace 1 and at least one substrate transport apparatus 2 that carries a substrate in and out of the substrate firing furnace 1. Moreover, the control part 3 is provided. The substrate baking furnace 1 performs a baking process on the substrate. The substrate transfer device 2 takes out the substrates stored in the cassette C one by one and loads them into the substrate baking furnace 1. Also, the substrate transfer apparatus 2 unloads the substrates that have been baked in the substrate baking furnace 1 one by one. Store in.

<1. Substrate firing furnace>
<overall structure>
The configuration of the substrate baking furnace 1 will be described with reference to FIG. FIG. 2 is a schematic perspective view of the appearance of the substrate baking furnace 1. The substrate baking furnace 1 includes a box-shaped furnace body 3 having an opening, and a louver-type shutter 4 that closes the opening of the furnace body 3.

  The furnace body 3 is a housing that constitutes the main body of the substrate firing furnace 1 and is molded using a heat insulating material. The furnace body 3 houses a substrate storage 5 therein. The substrate storage unit 5 will be described later. Further, a heating gas supply system 6 for heating the substrate stored in the substrate storage unit 5 is provided.

  The shutter 4 includes an overall position restricting member 41 and a plurality of louvers 42 a, 42 b, 42 c stacked on the overall position restricting member 41 in the vertical direction. A lifting mechanism (not shown) is attached to the overall position regulating member 41 and can be moved up and down (arrow AR41). By raising and lowering the overall position regulating member 41, the plurality of louvers 42a, 42b, and 42c stacked thereon can also be raised and lowered integrally. In addition, each of the louvers 42a, 42b, and 42c is provided with an elevating mechanism (not shown), and can be moved up and down (arrow AR42). For example, by moving the louver 42b up and down, the louver 42a stacked on the louver 42b can be lifted and lowered together. That is, by moving the louver 42b upward, an opening can be formed between the louver 42c and the louver 42b. In other words, by controlling the louvers 42a, 42b, 42c and the overall position regulating member 41 to move up and down, it is possible to form an opening facing an arbitrary stage in a multistage structure of the substrate storage unit 5 described later. Further, by appropriately setting the moving distance of the louvers 42a, 42b, and 42c, the vertical length of the formed opening is preferably set to an appropriate value (preferably for the pickup hand 11 and the substrate described later to pass through). The minimum required value).

<Heating gas supply system 6>
The heated gas supply system 6 will be described with reference to FIG. The heated gas supply system 6 supplies heated gas (air) to the internal space (hereinafter referred to as “firing space V”) of the substrate storage unit 5. The heated gas supply system 6 includes a pipe 61, a heater 62, a fan 63, and a heat resistant HEPA filter 64.

  The heater 62 heats the gas in the pipe 61. That is, the gas heated by the heater 62 is supplied to the firing space V, whereby the substrate stored in the substrate storage unit 5 is heated. For example, in the case of 300 degree firing, the heater 62 adjusts the temperature of the gas in the pipe 61 to about 320 degrees.

  The fan 63 circulates the air flow in the pipe 61 and the substrate storage unit 5 along the arrows AR6a to AR6d. That is, an air flow in the direction of the arrow AR6c is formed in the firing space V, whereby the inside of the firing space V is uniformly maintained at a predetermined firing temperature without temperature unevenness. In addition, especially the side wall is shape | molded by the punching metal among the walls which comprise the main body of the board | substrate storage part 5, and does not prevent the circulation of airflow. Further, the positions of the heater 62 and the fan 63 may be opposite to the positions shown in FIG.

  The heat resistant HEPA filter 64 removes dust and the like in the gas flowing into the substrate storage unit 5. As a result, clean gas is supplied into the substrate housing 5.

<Substrate storage part 5>
The configuration of the substrate storage unit 5 will be described with reference to FIG. FIG. 3A is a cross-sectional view of the substrate storage unit 5, and FIG. 3B is a vertical cross-sectional view of the substrate storage unit 5. The substrate storage unit 5 is formed in multiple stages at a predetermined rack pitch d1, and includes a plurality of support shelves 51 that support the substrate from below.

<A. Support shelf 51>
As shown in FIG. 3B, the support shelf 51 is stretched horizontally in the substrate storage unit 5. That is, the upper surface of the support shelf 51 forms a horizontal plane, so that the substrate storage unit 5 can store a plurality of substrates that are horizontally supported by the support shelf 51 in multiple stages.

  As shown to Fig.3 (a), the support shelf 51 is formed in the grid | lattice form. More specifically, the first columnar horizontal member 52 and the second columnar horizontal member 53 are integrated to form the support shelf 51. One end of the first columnar horizontal member 52 is fixedly disposed on the inner back surface F5c of the substrate storage portion 5, and is stretched in the first horizontal direction (Y direction). That is, the first columnar support member 52 supports the substrate in a cantilever manner. Further, the second columnar horizontal member 53 is fixedly disposed on both side surfaces F5a and F5b of the substrate storage portion 5 at both ends, and is stretched in the second horizontal direction (X direction). That is, the second columnar horizontal member 53 supports the substrate with both ends. The columnar horizontal members 52 and 53 are made of, for example, stainless steel (SUS).

  Air levitation means 7 is formed on the upper surface of the support shelf 51 as first support means for slidably supporting the substrate. The air levitation means 7 supplies a gas (air) ejected upward from below to the upper surface of the support shelf 51 to float the substrate upward by a predetermined distance from the upper surface of the support shelf 51 (hereinafter referred to as “air levitation means 7”). In FIG. 10, it is slidably supported at a “first floating position T1” (refer to FIG. 10B). Note that the predetermined distance is a distance defined by the pressure of the blown air, for example, about 2 mm.

<B. Air levitation means 7>
The air levitation means 7 will be described in more detail with reference to FIGS. 3 and 4. However, FIG. 4 is an enlarged cross-sectional view near the upper surface of the support shelf 51. The air levitation means 7 includes a plurality of air discharge ports 71, pads 72, and a levitation air supply system 73.

  The air discharge port 71 is a hole formed in the upper surface of the support shelf 51 and penetrates through a hollow structure (air line AL) formed in the support shelf 51. Air supplied from an air supply system 73 for levitation, which will be described later, to the air line AL in the support shelf 51 is ejected from below to above through the air discharge port 71.

  The pad 72 is a plate-like member attached to a predetermined location on the upper surface of the support shelf 51 (that is, a location where the air discharge port 71 is formed), and has a predetermined thickness d2 as shown in FIG. ing. By attaching the pad 72 to the upper surface of the support shelf 51, a convex portion having a predetermined height d2 is formed on the upper surface of the support shelf 51. A horizontal surface is formed on the upper surface of the pad 72 and can support the substrate. That is, in the portion where the pad 72 is attached, a support surface capable of supporting the substrate is formed at a position separated from the surface of the support shelf 51 by a predetermined distance d2. The air discharge port 71 is formed through the pad 72. The pad 72 is made of, for example, Teflon (registered trademark), PEEK, or vespel.

  Note that a convex structure may be formed on the upper surface of the pad 72 as shown in FIG. However, in this case, it is desirable that the air discharge port 71 is disposed in the tip end surface of the convex structure formed on the upper surface of the pad 72 (that is, the support surface of the substrate).

  In addition, for stable substrate movement, the total area of the plurality of pads 72 attached to each support shelf 51 is preferably about 1/3 of the substrate area. The distance between adjacent pads 72 is preferably about 40 mm at the maximum. Further, the pad 72 is preferably formed of a non-metallic member. If the pad 72 is formed of a non-metallic member, when the substrate is placed on the support shelf 51, the back surface of the substrate contacts the pad 72 formed of non-metal instead of the upper surface of the support shelf 51. It is possible to prevent a situation where the lower surface of the garment is scratched.

  Refer to FIG. 3 again. The floating air supply system 73 supplies air used for floating the substrate. More specifically, a part of the heated air that circulates in the pipe 61 included in the heated gas supply system 6 is extracted from the pipe 61 (arrow AR7), and is supplied to the air line AL formed in the support shelf 51. Supply. The levitation air supply system 73 includes a pipe 731, a solenoid valve 732, and a booster fan 733.

  One end of the pipe 731 is connected to each of the plurality of support shelves 51 provided in the substrate storage unit 5 (more specifically, the air line AL formed in each support shelf 51). The other end of the pipe 731 is connected to the pipe 731 of the heated gas supply system 6. A solenoid valve 732 that controls supply and stop of air to each of the plurality of support shelves 51 is interposed in the pipe 731. Each solenoid valve 732 is connected to the control unit 3. As shown in FIG. 3 (b), the pipe 731 joins the pipe connected to the air line AL in the support shelf 51 at the other stage on the downstream side of the solenoid valve 732 when viewed from the connection end with the air line AL. To do. The control unit 3 controls the plurality of solenoid valves 731 separately and independently to control the supply and stop of air to each support shelf 51.

  A booster fan (or blower) 733 is inserted in the pipe 731 further downstream of the solenoid valve 732. The booster fan 733 pressurizes and controls the air in the pipe 731. The booster fan 733 is connected to the control unit 3. The control unit 3 controls the booster fan 733 to supply air having a predetermined pressure to the air line AL of the support shelf 51.

<2. Substrate transfer device 2>
<overall structure>
Next, the configuration of the substrate transfer apparatus 2 will be described with reference to FIGS. FIG. 5 is a schematic perspective view of the substrate transfer apparatus 2. The substrate transfer apparatus 2 includes a transfer stage 8 and a stage drive unit 9.

<Stage drive unit 9>
The stage drive unit 9 moves the transport stage 8 to a position opposite to an arbitrary support shelf 51 among the plurality of support shelves 51 provided in the substrate storage unit 5. The stage drive unit 9 includes a first base unit 91, a second base unit 92, a main body unit 93, and a column 94, and rotates about the X direction, the Y direction, the Z direction, and the central axis 94A. The transfer stage 8 is moved in each direction.

  The first base portion 91 incorporates an X-axis direction drive mechanism (not shown), and as shown in FIG. 1, a first guide rail laid along the arrangement direction (X direction in the drawing) of the plurality of substrate firing furnaces 1. Guided by 91L can advance and retreat (AR91). The X-axis direction drive mechanism is connected to the control unit 3, and the control unit 3 controls the X-axis direction drive mechanism to advance and retract the first base unit 91 along the first guide rail 91L. As a result, the transfer stage 8 can be moved to a position facing each of the plurality of substrate baking furnaces 1. Moreover, it becomes possible to move to the position which opposes each of the some cassette C arrange | positioned so that the substrate baking furnace 1 may be opposed.

  The second base portion 92 incorporates a Y-axis direction drive mechanism (not shown), and as shown in FIG. 1, along the direction (Y direction in the drawing) perpendicular to the first guide rail 91L on the first base portion 91. It is guided by the laid second guide rail 92L and can advance and retreat (AR52). The Y-axis direction drive mechanism is connected to the control unit 3, and the control unit 3 controls the Y-axis direction drive mechanism to advance the second base unit 92 along the second guide rail 92L. As a result, the transfer stage 8 can be moved to a position close to the opening of the substrate baking furnace 1 (imaginary line position in FIG. 1). Further, the cassette C can be moved to a position close to the opening of the cassette C.

  The main body portion 93 is attached to the upper portion of the second base portion 92. A column 94 having a cylindrical outer shape is attached to the main body 93. The column 94 incorporates a lifting mechanism and a rotating mechanism (not shown), and can be moved up and down (AR 93) and can be rotated around a central axis 94A of the column 94 (AR 94). The elevating mechanism is connected to the control unit 3, and the control unit 3 controls the elevating mechanism to raise and lower the column 94. As a result, the transfer stage 8 can be accessed in any stage of the support shelves 51 provided in a multistage state in the substrate baking furnace 1. In addition, it is possible to access an arbitrary stage among the substrate mounting shelves (not shown) provided in the cassette C in a multi-stage state. The rotation mechanism is also connected to the control unit 3, and the control unit 3 controls the rotation mechanism to rotate the column 94 around the central axis 94A. As a result, the front end side F of the transfer stage 8 can be opposed to both the support shelf 51 and the substrate placement shelf of the cassette C.

<Transport stage 8>
Next, the transfer stage 8 will be described with reference to FIGS. FIG. 6 is a plan view of the transfer stage 8. The transfer stage 8 is a stage that supports the substrate from below. On the upper surface of the transfer stage 8, air levitation means 10 as a second support means for slidably supporting the substrate and a pickup hand 11 for moving the substrate forward and backward are provided.

<A. Air levitation means 10>
The air levitation means 10 supplies a gas (air) ejected upward from below to the upper surface of the transfer stage 8 and floats upward by a predetermined distance from the upper surface of the transfer stage 8 (hereinafter “ It is slidably supported at “second floating position T2” (refer to FIG. 8B). The air levitation means 10 includes a plurality of air discharge ports 101, a pad 102, a levitation air supply system 103, and a discharge port negative pressure system 104.

  The air discharge port 101 is a plurality of holes formed on the upper surface of the transfer stage 8 and penetrates through a hollow structure (air line (not shown)) formed inside the transfer stage 8. Air supplied from an air supply system 103 for levitation, which will be described later, to the air line in the transfer stage 8 is ejected from below to above through the air discharge port 101.

  The pad 102 is a plate-like member attached to the formation position of the air discharge port 101 on the upper surface of the transfer stage 8, and the configuration thereof is the same as the pad 72 described above.

  The floating air supply system 103 supplies air used for floating the substrate. The levitation air supply system 103 includes a pipe 131, a solenoid valve 132, and a booster fan 133.

  One end of the pipe 131 is connected to an air line formed inside the transfer stage 8. Further, the other end of the pipe 131 is open to the atmosphere so as to take in outside air. A solenoid valve 132 that controls supply and stop of air to the transfer stage 8 is inserted in the pipe 131. The solenoid valve 132 is connected to the control unit 3, and the control unit 3 controls the solenoid valve 132 to control the supply and stop of air to the air line AL of the transport stage 8.

  The pipe 131 is connected to a booster fan 133 that pressurizes and controls the air in the pipe 131. The booster fan 133 is connected to the control unit 3, and the control unit 3 controls the booster fan 133 to supply air of a predetermined pressure to the air line AL of the transfer stage 8.

  The discharge port negative pressure system 104 applies a negative pressure to the air discharge port 101. The discharge port negative pressure system 104 includes a pipe 141, a solenoid valve 142, and a vacuum pump 143. One end of the pipe 141 is connected to the pipe 131 of the levitation air supply system 103, the solenoid valve 142 is inserted, and the other end is connected to the vacuum pump 143. The solenoid valve 142 is connected to the control unit 3. The control unit 3 controls the opening and closing of the solenoid valve 142 at a predetermined timing, thereby generating a suction force at the air discharge port 101 by negatively applying pressure to the air discharge port 101.

<B. Pickup Hand 11>
The pick-up hand 11 moves the substrate forward and backward between a first levitation position T1 slidably supported by the air levitation means 7 and a second levitation position T2 slidably supported by the air levitation means 10. The pickup hand 11 includes a hand 111, an expansion / contraction drive mechanism (not shown), and a suction part negative pressure system 112.

  One end of the hand 111 is fixed to a side of the upper surface of the transport stage 8 facing the front end side F, and the hand 111 is entirely inside a hand storage groove H that is recessed along a direction orthogonal to the front end side F. It is stored. However, the hand storage groove H is formed with a width and depth capable of storing the hand 111. Further, the air discharge port 101 is not formed in the hand storage groove H.

  The hand 111 has a structure that can be expanded and contracted along a direction (AR111) orthogonal to the front end side F, and is connected to an expansion and contraction drive mechanism on the fixed end side. The telescopic drive mechanism is connected to the control unit 3. The control unit 3 controls the expansion / contraction driving mechanism to expand / contract the pickup hand 11 at a predetermined timing.

  Further, a suction portion 113 that sucks and holds the back surface of the substrate is formed at the free end portion of the hand 111.

  The suction part negative pressure system 112 applies a negative pressure to the suction part 113. The suction part negative pressure system 112 includes a pipe 1121, a solenoid valve 1121, and a vacuum pump 1123. However, the vacuum pump 1123 can be shared with the vacuum pump 143 provided in the discharge port negative pressure system 104. One end of the pipe 1121 is connected to a hollow structure (air line (not shown)) formed so as to penetrate the suction portion 113 in the hand 111. The other end is connected to a vacuum pump 1123 through a solenoid valve 1121. The solenoid valve 1121 is connected to the control unit 3. The control unit 3 controls the opening and closing of the solenoid valve 1122 at a predetermined timing, thereby generating a suction force in the suction unit 113 by negatively pressure the suction unit 113.

  Here, the expansion / contraction mode of the pickup hand 11 will be described more specifically. As described above, the hand 111 has a structure that can be expanded and contracted along the direction (AR111) orthogonal to the tip side F. That is, as the hand 111 expands and contracts, the suction unit 113 moves between the first position P1 (virtual line position in FIG. 6) and the second position P2 (solid line position in FIG. 6). Here, the first position P1 is the front end of the substrate at the first floating position T1 (positioned on the opening side of the substrate baking furnace 1) in a state where the support shelf 51 to be transported and the transport stage 8 face each other. This is a position where the suction portion 113 can reach the back surface of the end portion (see FIG. 10A). Further, the second position P2 is a position where the suction portion 113 can reach the back surface of the rear end portion (end portion located on the opposite side of the front end side F) at the second floating position T2 (FIG. 8 ( a)).

  For example, by applying a negative pressure while the suction unit 113 is positioned at the first position P1, the back surface of the substrate at the first floating position T1 can be vacuum-sucked and held by the hand 111. Furthermore, the substrate can be pulled from the first floating position T1 to the second floating position T2 by moving the suction portion 113 to the second position P2 while maintaining the negative pressure state (see FIG. 10).

  Further, by applying a negative pressure while the suction portion 113 is positioned at the second position P2, the back surface of the substrate at the second floating position T2 can be vacuum-sucked and held by the hand 111. Furthermore, the substrate can be pushed out from the second floating position T2 to the first floating position T1 by moving the suction portion 113 to the first position P1 while maintaining the negative pressure state (see FIG. 8).

<II. Processing action>
A substrate baking operation performed in the substrate processing apparatus 100 will be described. In the baking process for the substrate, the unprocessed substrate is carried into the substrate baking furnace 1 heated to a predetermined baking temperature, and when the baking process for the substrate is completed after a predetermined time, the processed substrate is transferred to the substrate baking furnace. It is performed by carrying out from 1. More specifically, the control unit 3 drives and controls the heater 62 and the fan 63 to supply a gas whose temperature is adjusted to a predetermined temperature to the baking space V, so that the baking space V has a predetermined baking processing temperature ( For example, the temperature is raised to 300 ° C. When the firing space V reaches a predetermined firing temperature, the substrate transfer device 2 starts to carry in the substrate. That is, unprocessed substrates are taken out from the cassette C one by one and loaded into the substrate baking furnace 1. Further, the processed substrates that have been subjected to the baking process are carried out one by one from the substrate baking furnace 1 and stored in the cassette C.

<Loading into substrate firing furnace 1>
With reference to FIG. 7 and FIG. 8, the operation when the unprocessed substrate is carried into the substrate baking furnace 1 will be described in detail. FIG. 7 is a diagram showing the flow of the operation. FIG. 8 is a diagram for explaining the operation.

  First, the substrate transfer apparatus 2 takes out the unprocessed substrate W from the cassette C, and places the removed unprocessed substrate W on the upper surface of the transfer stage 8 (step S1).

  Subsequently, the control unit 3 opens the solenoid valve 142 of the discharge port negative pressure system 104 to apply a negative pressure in the air discharge port 101 formed on the upper surface of the transfer stage 8, so that the unprocessed substrate W is placed on the upper surface of the transfer stage 8. Adsorption is held (step S2).

  Subsequently, the control unit 3 controls the drive mechanism of the stage drive unit 9 while the unprocessed substrate W is sucked and held on the upper surface of the transfer stage 8, so that the transfer stage 8 includes a plurality of transfer stages 8 included in the substrate storage unit 5. The support shelf 51 moves to a position facing the support shelf 51 (transport target support shelf 51) on which the unprocessed substrate W is to be placed (step S3). More specifically, the position facing the transport target support shelf 51 is a position where the front end side F of the transport stage 8 is close to the front end side of the transport target support shelf 51 as shown in FIG. This is a position where the upper surface of the transfer stage 8 is at a height that is substantially horizontal with the upper surface of the transfer support rack 51.

  Subsequently, the control unit 3 controls the air levitation means 7 provided as the first support means to switch to a state in which the unprocessed substrate W can be slidably supported (step S4). More specifically, a predetermined solenoid valve 732 of the levitation air supply system 73 (that is, the solenoid valve 732 inserted in the pipe 731 connected to the air line AL in the conveyance target support shelf 51) is opened, A part of the air circulating in the pipe 61 is supplied to the air line AL of the conveyance target support shelf 51 at a predetermined pressure. However, the air flowing through the pipe 61 is maintained at a predetermined temperature (for example, 320 degrees). The air supplied from the floating air supply system 73 to the air line AL in the conveyance target support shelf 51 is ejected from the lower side to the upper side through the air discharge port 71.

  Subsequently, the control unit 3 controls the air levitation means 10 provided as the second support means to switch from the state in which the unprocessed substrate W is fixed and supported to the state in which it is slidably supported (step S5). More specifically, first, the solenoid valve 142 of the discharge port negative pressure system 104 is closed to release the unprocessed substrate W from the sucked and held state. Subsequently, the solenoid valve 132 of the levitation air supply system 103 is opened to supply air to the air line in the transfer stage 8. The air supplied to the air line from the levitation air supply system 103 is ejected from below to above through the air discharge port 101. As a result, the unprocessed substrate W fixed and supported on the upper surface of the transfer stage 8 is slidably supported at the second floating position T2. This process may be performed in parallel with the process of step S4.

  Subsequently, the control unit 3 controls the expansion / contraction driving mechanism of the pickup hand 11 and the suction unit negative pressure system 112 to push the unprocessed substrate W at the second floating position T2 to the first floating position T1 (step S6). . More specifically, this operation is performed as follows. First, the solenoid valve 1122 of the suction unit negative pressure system 112 is opened to negatively press the suction unit 113, and the rear end portion of the unprocessed substrate W at the second floating position T2 is sucked and held. Subsequently, the telescopic drive mechanism is controlled to extend the hand 111, and the suction portion 113 is moved from the second position P2 to the first position P1. Air is supplied to the upper surface of the support shelf 51, and the moved unprocessed substrate W is slidably supported at the first floating position T1.

  Subsequently, after the control unit 3 closes the solenoid valve 1122 of the suction unit negative pressure system 112 to release the unprocessed substrate W sucked by the suction unit 113 from the suction state, the hand 111 is reduced by controlling the expansion / contraction drive mechanism. Thus, the suction unit 113 is moved from the first position P1 to the second position P2 (step S7).

  Subsequently, the control unit 3 controls the air floating means 7 to switch from the state in which the unprocessed substrate W is slidably supported to the state in which it is fixedly supported (step S8). More specifically, the solenoid valve 732 of the levitation air supply system 73 is closed, and the supply of air to the upper surface of the support shelf 51 is stopped. As a result, the unprocessed substrate W that has floated to the first floating position T1 is placed on the upper surface of the support shelf 51 and is fixedly supported. In addition, it is good also as a structure which provides the piping system in which the inside of the air discharge port 71 can be made negative pressure, and sucks and hold | maintains the unprocessed board | substrate W on the upper surface of the support shelf 51 here.

  With the above processing, the operation of carrying the untreated substrate in the cassette C into the substrate baking furnace 1 is completed.

<Unloading from the substrate firing furnace 1>
With reference to FIGS. 9 and 10, the operation when the processed substrate that has been subjected to the baking process is carried out of the substrate baking furnace 1 will be described in detail. FIG. 9 is a diagram showing the flow of the operation. FIG. 10 is a diagram for explaining the operation.

  First, the control unit 3 controls the drive mechanism of the stage drive unit 9, and the holding shelf on which the processed substrate W to be carried out of the plurality of support shelves 51 provided in the substrate storage unit 5 is supported. It moves to a position facing 51 (conveyance target support shelf 51) (step S11).

  Subsequently, the control unit 3 controls the air levitation means 10 provided as the second support means to switch to a state in which the processed substrate W can be slidably supported (step S12). More specifically, the solenoid valve 132 of the levitation air supply system 103 is opened to supply air to the air line of the transfer stage 8. The air supplied from the floating air supply system 103 to the air line in the transfer stage 8 is ejected from below to above through the air discharge port 101.

  Subsequently, the control unit 3 controls the air levitation means 7 provided as the first support means to switch from the state in which the processed substrate W is fixedly supported to the state in which it is slidably supported (step S13). More specifically, the solenoid valve 32 of the levitation air supply system 73 (that is, the solenoid valve 732 inserted in the pipe 731 connected to the air line AL in the conveyance target support shelf 51) is opened, and the conveyance target Air is supplied to the air line AL of the support shelf 51. The air supplied from the levitation air supply system 73 to the air line AL is ejected from the lower side to the upper side through the air discharge port 71. Thus, the processed substrate W fixedly supported by being placed on the upper surface of the support shelf 51 is slidably supported at the first floating position T1. This process may be performed in parallel with the process of step S12.

  Subsequently, the control unit 3 controls the expansion / contraction driving mechanism of the pickup hand 11 and the suction unit negative pressure system 112 to pull the processed substrate W at the first floating position T1 to the second floating position T2 (step S14). . More specifically, this operation is performed as follows. First, the telescopic drive mechanism is controlled to extend the hand 111, and the suction portion 113 is moved from the second position P2 to the first position P1. When the suction unit 113 reaches the first position P1, the solenoid valve 1122 of the suction unit negative pressure system 112 is subsequently opened to negatively press the suction unit 113 so that the tip of the processed substrate W at the first floating position T1 is moved. Hold by adsorption. Subsequently, the telescopic drive mechanism is controlled again to reduce the hand 111, and the suction portion 113 is moved from the first position P1 to the second position P2. Air is supplied to the upper surface of the transfer stage 8, and the moved processed substrate W is slidably supported at the second floating position T2. Note that the front end of the processed substrate W may be sucked and held by the suction portion 113 of the pickup hand 11 before it is slidably supported by the air levitation means 7 (that is, before the processing of step S13). In this way, the position of the substrate that has floated can be regulated by sucking and holding the processed substrate W by the pickup hand 11 before it floats.

  Subsequently, the control unit 3 controls the air levitation means 10 to switch from the state in which the processed substrate W is slidably supported to the state in which it is fixedly supported (step S15). More specifically, the solenoid valve 132 of the levitation air supply system 103 is closed to stop the supply of air to the upper surface of the transfer stage 8. As a result, the processed substrate W floating at the second floating position T2 is placed on the upper surface of the transport stage 8 and is fixedly supported. Subsequently, the solenoid valve 142 of the discharge port negative pressure system 104 is opened to apply a negative pressure to the air discharge port 101, and the processed substrate W is sucked and held on the upper surface of the transfer stage 8.

  Subsequently, the control unit 3 controls the drive mechanism of the stage driving unit 9 while the processed substrate W is sucked and held on the upper surface of the transfer stage 8 to the position of the cassette C where the processed substrate W is to be stored. The transport stage 8 is moved, and the processed substrate W is stored in the cassette C (step S16).

  With the above processing, the operation of carrying out the processed substrate after the baking processing from the substrate baking furnace 1 and storing it in the cassette C is completed.

  The operation (step S1 and step S16) when the substrate transport apparatus 2 carries in / out the substrate W with respect to the cassette C may be configured in the same manner as the substrate W carry-in / out operation with respect to the substrate baking furnace 1. In this case, the substrate mounting surface in the cassette C may be configured similarly to the support shelf 51.

<III. effect>
According to this embodiment, the air levitation means 7 provided as the first support means and the air levitation means 10 provided as the second support means support the substrate slidably (that is, in a state where friction is reduced). Therefore, the substrate can be moved back and forth between the support shelf 51 and the transfer stage 8 with a small force. Therefore, it is not necessary to insert a transport fork or the like into the substrate baking furnace 1 when carrying the substrate in and out of the support target support shelf 51. As a result, the rack pitch d1 of the support shelves 51 can be reduced (specifically, reduced to about 45 mm), so that it is necessary to have a sufficient number of storable sheets and to divide within a predetermined height limit. It is possible to realize the substrate processing apparatus 100 including the substrate baking furnace 1 without any material. As a result, it is possible to avoid problems such as addition of extra expenses necessary to obtain a splittable configuration and difficulty in ensuring sealing performance. In addition, even if the number of stored sheets increases and the baking time becomes longer, it is not necessary to have multiple sets of substrate baking furnaces, so the footprint of the substrate baking furnace can be reduced, and an increase in footprint is avoided. it can.

  In addition, according to this embodiment, the air levitation means 7 supplies gas to the upper surface of the support shelf 51 to float the substrate to the first levitation position T1, so that the substrate slidably supported and the support shelf 51 There is no friction between them. As a result, the substrate can be moved back and forth with very little force.

  Further, according to this embodiment, the levitation air supply system 73 provided in the air levitation means 7 collects a part of the heated air circulating in the pipe 61 provided in the heated gas supply system 6 from the pipe 61. Then, the air is supplied to the air line AL formed in the support shelf 51. That is, since the heated gas is supplied to the upper surface of the support shelf 51, the gas discharged from the support shelf 51 does not affect the temperature distribution in the firing space V. Therefore, the heat treatment for the substrate can be appropriately performed.

  Further, according to this embodiment, the pad 72 having a predetermined thickness d is attached to the upper surface of the support shelf 51, and the air discharge port 71 is formed so as to penetrate the pad 72. Normally, in a state where air is supplied from the air discharge port 71, the substrate is bent at a portion between the air discharge ports 71 adjacent to each other. In order to completely lift the substrate without coming into contact with the surface of the support shelf 51, the floating position of the substrate must be set to a position higher by the amount of deflection in consideration of this deflection. For this purpose, it is necessary to increase the amount of air to be supplied or increase the number of locations where the air discharge ports 71 are formed. However, in this embodiment, the pad 72 is attached to the place where the air discharge port 71 is formed, so that the gas discharge position is higher by the thickness d of the pad 72. Therefore, even if the substrate is deflected by the thickness d, the substrate does not contact the surface of the support shelf 51. That is, since it is not necessary to raise the floating position of the substrate excessively, it is possible to completely lift the substrate with a small amount of air. In addition, since the balance between the substrate weight and the airflow is formed between the upper surface of the pad 72 and the lower surface of the substrate, the substrate can be stably supported.

  Further, according to this embodiment, the control unit 3 slidably supports the support state of the substrate supported by the support shelf 51 and the transport stage 8 at a predetermined timing in a series of substrate carry-in / out operations. Since the state is switched to a state in which it is placed on the upper surface of the support shelf 51 and fixedly supported (see step S8 in FIG. 7 and step S15 in FIG. 9), the amount of gas to be discharged can be reduced. Further, by fixing and supporting the substrate with respect to the support shelf 51, it is possible to stably perform the baking process on the substrate. Further, by fixing and supporting the transfer stage 8, the substrate can be stably transferred.

  In particular, according to this embodiment, the support shelf 51 includes the second columnar horizontal members 53 that are fixedly disposed on both side surfaces F5a and F5b of the substrate storage unit 5 and support the substrate with both ends. Compared with the conventional support member that supports the substrate in a cantilever state, a higher strength can be obtained. Therefore, it is possible to reduce the thickness of the support shelf 51, and consequently, it is possible to reduce the rack pitch d1. The support shelf 51 further includes a first columnar horizontal member 52 that is fixedly disposed at one end on the inner back surface S20c of the substrate storage unit 5 and supports the substrate in a cantilevered manner. Since the two columnar horizontal members 53 are integrally formed in a lattice shape, high strength can be obtained even when compared with a support shelf constituted by a support member stretched in only one direction. it can. Moreover, since it forms in a grid | lattice form, without circulating the airflow in the baking space V, the inside of the baking space V can be uniformly maintained at a predetermined baking temperature without temperature unevenness.

[Second Embodiment]
<I. Constitution>
A configuration of the substrate processing apparatus according to the second embodiment of the present invention will be described. In the following, points that differ from the first embodiment will be described, and descriptions of points that are not different will be omitted. Moreover, when showing the same component, the reference numerals used in the description of the first embodiment are used.

  Similar to the substrate processing apparatus 100 according to the first embodiment, the substrate processing apparatus according to this embodiment includes at least one substrate baking furnace and at least one substrate transfer apparatus 2 that carries a substrate in and out of the substrate baking furnace. I have more. As with the substrate baking furnace 1 according to the first embodiment, the substrate baking furnace according to this embodiment includes a furnace body 3 that houses the substrate storage portion 5a, a shutter 4 that closes the opening of the furnace body 3, and And a heated gas supply system 6 for heating the substrate stored in the substrate storage portion 5a.

<Substrate storage part 5a>
The configuration of the substrate storage unit 5a according to this embodiment will be described with reference to FIGS. FIG. 11A is a transverse sectional view of the substrate storage portion 5a, and FIG. 11B is a longitudinal sectional view of the substrate storage portion 5a. FIG. 12 is an enlarged cross-sectional view near the support shelf 51. The substrate storage unit 5a is formed in multiple stages at a predetermined rack pitch d3, and supports a plurality of support shelves 51 each supporting a substrate from below and a substrate supported on each of the plurality of support shelves 51 by pushing up from below. Push-up support means 54. The structure of the support shelf 51 is the same as that of the first embodiment. On the upper surface of the support shelf 51, air levitation means 7 that slidably supports the substrate is formed.

<Push-up support means 54>
The push-up support means 54 pushes the substrate up to a position above the upper surface of the support shelf 51 by a predetermined distance (hereinafter referred to as “push-up position K1”). The push-up position K1 is preferably higher than the first floating position T1, and in particular, the upper surface of the support shelf 51 (more precisely, the upper surface of the pad 72 formed on the support shelf 51) and the support. It is desirable to be near the middle of the lower surface of the support shelf 51 that is one level higher than the shelf 51. Because, by placing the substrate supported to be pushed up in the vicinity of the middle of the support shelf 51 adjacent vertically, the substrate can be directly exposed to the air flow of the heating air formed in the firing space V. This is because the firing process can be performed efficiently.

  The push-up support means 54 includes a plurality of push-up support shelves 542 fixed to the support column 541 and a support shelf drive mechanism (not shown) that drives the push-up support shelves 542 in the horizontal direction.

  Each of the plurality of push-up support shelves 542 is paired with each of the support shelves 51 formed in multiple stages inside the substrate storage portion 5b as shown in FIG. Is also located on the lower side. Further, as shown in FIG. 11A, the push-up support shelf 542 is formed in a lattice shape. More specifically, the first columnar member 5421 and the second columnar member 5422 are integrally formed to form a push-up support shelf 542. However, the lattices of the push-up support shelves 543 are arranged so as to alternate with the lattices of the support shelves 51. Both ends of the second columnar member 5422 are fixedly disposed on the support column 541 and stretched in the second horizontal direction (X direction). The first columnar member 5421 is fixed to the support column 541 by being fixed to the second columnar member. The columnar members 5421 and 5422 are made of, for example, stainless steel (SUS).

  As shown in FIG. 12, the bottom of the support shelf 51 has a width larger than the width of the second columnar member 5422 at a location where the lattice of the push-up support shelf 542 and the lattice of the support shelf 51 overlap each other. The recess D1 may be formed. If such a recess D1 is formed, the second columnar member 5422 of the push-up support shelf 542 is nested in the support shelf 51 when the push-up support shelf 542 is moved to an upper position L1 described later. be able to. Therefore, it is possible to efficiently use the space in the substrate storage unit 50, and the interval (rack pitch) d3 between the support shelves 51 can be reduced.

  A plurality of support pins 543 are suspended from the upper surface of the push-up support shelf 542. The support pins 543 push up and support the back surface of the substrate with dots.

  The push-up support shelf 542 is connected to the support shelf drive mechanism and can be moved up and down in the vertical direction (Z direction). The support shelf drive mechanism is connected to the control unit 3, and the control unit 3 controls the support shelf drive mechanism to move the push-up support shelf 542 up and down relative to the support shelf 51.

  When the push-up support shelf 542 moves up and down between the upper position L1 and the lower position L2 shown in FIG. 12, the tip of the support pin 543 moves between the push-up position L11 and the retracted position L21. However, it is desirable to set the retract position L21 at a position lower than the upper surface position of the pad 72, and at least set the position so as not to contact the back surface of the substrate W at the first floating position T1. The push-up position L11 is a position for supporting the substrate W at the push-up position K1.

<II. Processing action>
A substrate baking operation performed by the substrate processing apparatus according to the second embodiment will be described. In the following, points that differ from the first embodiment will be described, and descriptions of points that are not different will be omitted.

<Loading into substrate firing furnace 1>
Also in this embodiment, the operation when the unprocessed substrate is carried into the substrate baking furnace 1 is performed according to the flow shown in FIG.

  However, in this embodiment, the operation (step S8 in FIG. 7) for switching from the state in which the unprocessed substrate W on the support shelf 51 is slidably supported to the state in which it is fixedly supported is performed as follows. First, the control unit 3 controls the support shelf driving mechanism to move the push-up support shelf 542 from the lower position L2 to the upper position L1, thereby moving the tip of the support pin 543 from the retracted position L21 to the push-up position L11. Let Then, the substrate W is switched from a state in which it is slidably supported at the first floating position T1 to a state in which it is supported by the support pins 543 at the push-up position K1. Subsequently, the control unit 3 closes the solenoid valve 732 of the levitation air supply system 73 and stops the supply of air to the upper surface of the support shelf 51.

<Unloading from the substrate firing furnace 1>
Moreover, the operation | movement at the time of carrying out the processed board | substrate which the baking process was completed from the inside of the substrate baking furnace 1 is performed according to the flow shown in FIG.

  However, in this embodiment, the operation (step S13 in FIG. 9) for switching from the state in which the processed substrate W on the support shelf 51 is fixed and supported to the state in which it is slidably supported is performed as follows. First, the control unit 3 opens the solenoid valve 732 of the levitation air supply system 73 (that is, the solenoid valve 732 inserted in the pipe 731 connected to the air line AL in the conveyance target support shelf 51), and the support shelf The supply of air to the upper surface of 51 is started. Subsequently, the control unit 3 controls the support shelf driving mechanism to move the push-up support shelf 542 from the upper position L1 to the lower position L2, thereby moving the tip of the support pin 543 from the push-up position L11 to the retracted position L21. Move. Then, the substrate W is switched from the state supported by the support pins 543 at the push-up position K1 to the state supported slidably at the first floating position T1.

<III. effect>
According to this embodiment, the push-up support means 54 pushes up and supports the substrate to the push-up position K1, so that the substrate does not contact the support shelf 51 during the baking process. When the baking process is performed in a state where the substrate is in contact with the support shelf 51, there is a difference in how the temperature rises between the portion of the substrate that is in contact with the surface of the support shelf 51 and the portion that is not in contact with the surface. (In general, the temperature of the portion that does not contact the support shelf 51 is slower), and this difference causes unevenness in the firing process. According to the configuration of this embodiment, since the baking process is performed on the substrate without contacting the support shelf 51, the substrate can be uniformly fired. Note that once the temperature is raised, the temperature distribution does not occur depending on whether or not it contacts the surface of the support shelf 51.

[Third Embodiment]
<I. Constitution>
The structure of the substrate processing apparatus according to the third embodiment of the present invention will be described. In the following, points that differ from the first embodiment will be described, and descriptions of points that are not different will be omitted. Moreover, when showing the same component, the reference numerals used in the description of the first embodiment are used.

  Similar to the substrate processing apparatus 100 according to the first embodiment, the substrate processing apparatus according to this embodiment includes at least one substrate baking furnace and at least one substrate transfer apparatus 2 that carries a substrate in and out of the substrate baking furnace. I have more. As with the substrate baking furnace 1 according to the first embodiment, the substrate baking furnace according to this embodiment includes a furnace body 3 that houses the substrate storage unit 5, a shutter 4 that closes the opening of the furnace body 3, and And a heated gas supply system 6 for heating the substrate stored in the substrate storage unit 5.

  The substrate storage unit 5 is formed in multiple stages at a predetermined rack pitch, and includes a plurality of support shelves 51b that support the substrate from below. The air levitation means 7 is formed on the upper surface of the support shelf 51 according to the first embodiment as the first support means for slidably supporting the substrate, but on the upper surface of the support shelf 51b according to this embodiment. The rolling support means 7b is formed as the first support means. Note that this rolling support means 7b may be employed as the second support means.

<Rolling support means 7b>
The rolling support means 7b will be described with reference to FIG. FIG. 13 is an enlarged cross-sectional view of the vicinity of the upper surface of the support shelf 51b. The rolling support means 7b includes a rolling support member 71b and a rolling support member floating means 72b.

  The rolling support member 71b is disposed on the upper surface of each of the plurality of support shelves 51b, and can slide the substrate while rolling between the upper surface of the support shelf 51b and the back surface of the substrate supported by the support shelf 51b. It is a member to support, and is disposed in a recess D2 formed on the upper surface of the support shelf 51b.

  In particular, in this embodiment, the rolling support member 71b slidably supports the substrate while rolling at a position that floats upward by a predetermined distance from the bottom surface of the recess D2. The rolling support member 71b may be a spherical member as shown in FIG. 13 (a) or a roller-shaped member (bearing member) as shown in FIG. 13 (b). Good. Further, the rolling support member 71b is preferably formed of, for example, Teflon (registered trademark), PEEK, or Vespel so as to be able to absorb the impact and friction that the substrate exerts on the upper surface of the support shelf 51b.

  The rolling support member floating means 72b supports the rolling support member 71b by supplying gas (air) ejected from below to above between the upper surface of the support shelf 51b and the rolling support member 71b. The shelf 51b is supported at a position levitated upward by a predetermined distance from the upper surface of the shelf 51b (more specifically, the bottom surface of the recess D2). The rolling support member levitation means 72b includes a plurality of air discharge ports 721b and a levitation air supply system (not shown).

  The air discharge port 721b is a hole formed on the upper surface of the support shelf 51b and the bottom surface portion of the recess D2, and penetrates the hollow structure (air line ALb) formed inside the support shelf 51b. Air supplied to the air line ALb in the support shelf 51b from the levitation air supply system passes through the air discharge port 721b between the bottom surface of the recess D2 and the rolling support member 71b disposed in the recess D2. It is ejected from below to above.

  The levitation air supply system supplies air used for levitation of the rolling support member levitation means 72b. The specific configuration is the same as that of the levitating air supply system 73 described in the first embodiment.

<II. Processing operation>
A substrate baking operation performed by the substrate processing apparatus according to the third embodiment will be described. In the following, points that differ from the first embodiment will be described, and descriptions of points that are not different will be omitted.

  Also in this embodiment, the operation when the unprocessed substrate is carried into the substrate baking furnace 1 is performed according to the flow shown in FIG. Moreover, the operation | movement at the time of carrying out the processed board | substrate which the baking process was completed from the inside of the substrate baking furnace 1 is performed according to the flow shown in FIG.

  However, in this embodiment, the operation of switching the unprocessed substrate W and the processed substrate W to a state in which the unprocessed substrate W and the processed substrate W can be slidably supported (step S4 in FIG. 7 and step S13 in FIG. 9) is performed as follows. First, the control unit 3 uses a predetermined solenoid valve of the floating air supply system of the rolling support member floating means 72b (that is, a solenoid valve inserted in a pipe connected to the air line ALb in the conveyance target support shelf 51b ( (Not shown)) is opened, and a part of the air circulating in the pipe 61 is supplied to the air line ALb of the conveyance target support shelf 51b with a predetermined pressure. The air supplied from the air supply system for levitation to the air line ALb in the conveyance target support shelf 51 is ejected upward from below through the air discharge port 321b, and the rolling support member 71b disposed in the recess D2 is provided. It is supported at a position that floats upward by a predetermined distance from the bottom surface of the recess D2.

  That is, when this processing is performed in step S4 in the processing operation of carrying the unprocessed substrate W into the substrate baking furnace 1, the unprocessed substrate W pushed out to the upper surface of the support shelf 51b in the subsequent step S6 is in the floating position. It is slidably supported by the rolling support member 71b that rolls.

  Further, when this processing is performed in step S13 in the processing operation of carrying out the processed substrate W from the substrate baking furnace 1, the unprocessed substrate that is fixedly supported by being placed on the upper surface of the support shelf 51. W is slidably supported by a rolling support member 71b that rolls at the floating position.

  Further, if the depth of the recess D2 is made larger than the height of the rolling support member 71b, the supply of air from the floating air supply system is stopped and the rolling support member 71b is placed on the bottom surface of the recess D2. By doing so, it becomes possible to place the substrate W supported slidably on the upper surface of the support shelf 51b and to support it in a fixed manner.

<III. Effect>
According to this embodiment, the rolling support member 71b slidably supports the substrate while rolling between the upper surface of the support shelf 51b and the back surface of the substrate, so that friction is generated between the substrate and the support shelf 51b. Can be reduced. As a result, the substrate can be moved back and forth with very little force.

  Further, the rolling support member floating means 72b supplies gas between the upper surface of the support shelf 51b and the rolling support member 71b, and the rolling support member 71b floats upward from the upper surface of the support shelf 51 by a predetermined distance. Since the rolling support member 71b rolls with respect to the upper surface of the support shelf 51v, it is difficult to generate particles even when the rolling support member 71b rolls on the upper surface of the support shelf 51v, and the firing space V can be kept clean.

[First Modification]
<Constitution>
In the first embodiment, the solenoid valve 732 of the levitation air supply system 73 is closed at a predetermined timing, the supply of air to the upper surface of the support shelf 51 is stopped, and the levitation floats to the first levitation position T1. The substrate is placed on the upper surface of the support shelf 51 to switch from the state in which the substrate is slidably supported to the state in which the substrate is fixedly supported. The substrate may be slidably supported by continuing to supply air to the upper surface.

  In this modification, since the baking process is performed with the substrate slidably supported, a member for regulating the position of the slidably supported substrate ("fourth and fifth modifications"). It is desirable to provide a “position regulating unit” described later.

<effect>
According to this modification, the substrate continues to float to the first flying position T1 while the baking process is performed on the substrate supported by the support shelf 51. That is, the substrate does not contact the surface of the support shelf 51 even during the baking process. Therefore, the substrate can be uniformly fired while preventing the occurrence of firing unevenness.

[Second Modification]
<Constitution>
In the first embodiment described above, the support shelves 51 are formed in a lattice shape, but the support shelves may be formed of a flat plate member. The configuration of the support shelf 51c in this case will be described with reference to FIG. FIG. 14 is a cross-sectional view of a substrate storage portion 5c according to this modification.

  The support shelf 51c according to this modification includes a flat plate-like member 511c. The plate-like member 511c has two opposing sides K1 and K2 fixedly disposed on both side surfaces F5a and F5b of the substrate storage unit 5. For example, both end portions of the sides K1 and K2 may be fixedly disposed on both end portions of the side surfaces F5a and F5b (for example, pillars of the substrate storage unit 5), or fixedly disposed on the side surfaces F5a and F5b over the entire sides K1 and K2. May be. In addition, the other structure of the support shelf 5c is the same as that of the support shelf 5 which concerns on said embodiment.

<effect>
According to this modification, since the support shelf 51c is formed in a flat plate shape, it is possible to obtain higher strength than a support shelf configured by a support member stretched only in one direction. Therefore, the thickness of the support shelf 5c can be reduced, and the rack pitch can be reduced.

[Third Modification]
<Constitution>
In the second embodiment, the configuration including the push-up support means 54 has been described. In the second embodiment, the push-up support means 54 is configured to support the back surface of the substrate at a plurality of points with a plurality of support pins 543, but may be configured to support the back surface of the substrate with a line instead of a point. Good.

<Substrate storage part 5d>
The configuration of the substrate storage unit 5d according to this modification will be described with reference to FIGS. FIG. 15A is a cross-sectional view of the substrate storage portion 5d, and FIG. 15B is a vertical cross-sectional view of the substrate storage portion 5d. FIG. 16 is an enlarged cross-sectional view of the vicinity of the support shelf 51d. The substrate storage unit 5d is formed in multiple stages at a predetermined rack pitch d4, and supports a plurality of support shelves 51d that respectively support the substrate from below and a substrate supported on each of the plurality of support shelves 51d by pushing up from below. Push-up support means 54d. The configuration of the support shelf 51d may be the same as that of the first embodiment, or a flat plate member (see the second modification) may be employed as shown in FIG. In addition, air levitation means 7 is formed on the upper surface of the support shelf 51d to slidably support the substrate.

<Pushing up support means 54d>
The push-up support unit 54d pushes up and supports the substrate up to a position (first push-up position K1) that is a predetermined distance above the upper surface of the support shelf 51d, like the push-up support unit 54 according to the second embodiment. The push-up support means 54d includes a plurality of push-up support shelves 542d fixed to the support column 541d, and a support shelf drive mechanism (not shown) that drives the push-up support shelf 542d in the horizontal direction.

  Each of the plurality of push-up support shelves 542d is paired with each of the support shelves 51d formed in multiple stages inside the substrate storage unit 5, as shown in FIG. Is also located on the upper side.

  As shown in FIG. 15A, the push-up support shelf 542b is formed of a support frame 5421d and a horizontal member 5422d. That is, the push-up support shelf 542d supports the substrate by the respective upper end surfaces of the horizontal member 5422d.

  Both ends of the support frame 5421d are fixed to the support columns 541d. Both ends of the horizontal member 5422d are fixed to the support frame 5421d, and are stretched in a predetermined direction (more specifically, a direction perpendicular to the advancing / retreating direction of the substrate (X direction)). However, the horizontal member 5422d is stretched across the position where the pad 72 is formed alternately so that the horizontal member 5422d and the pad 72 do not interfere with each other. Further, the thickness (length in the height direction) of the horizontal member 5422d is formed smaller than the thickness of the pad 72 attached to the support shelf 51d.

  The push-up support shelf 542d is connected to the support shelf drive mechanism and can be moved up and down in the vertical direction (Z direction). The configuration of the support shelf drive mechanism is the same as that of the support shelf drive mechanism according to the second embodiment.

  When the push-up support shelf 542d moves up and down between the upper position L1 and the lower position L2 shown in FIG. 16, the upper end surface of the horizontal member 5422d moves between the push-up position L11 and the retracted position L21. However, as described above, the thickness of the horizontal member 5422d is set smaller than the thickness of the pad 72, and the retracted position L21 is lower than the upper surface position of the pad 72. The push-up position L11 is a position for supporting the substrate W at the push-up position K1.

  In this modified example, the control unit 3 controls the support shelf driving mechanism to move the push-up support shelf 542d from the lower position L2 to the upper position L1, thereby pushing up the upper end surface of the horizontal member 5422d from the retracted position L21. Move to position L11. Then, the substrate W is switched from the state of being slidably supported at the first flying position T1 to the state of being supported by the upper end surface of the horizontal member 5422d at the push-up position K1.

<effect>
According to this modification, the push-up support means 54d pushes up and supports the substrate to the push-up position K1, so that the substrate does not come into contact with the support shelf 51d during the baking process, so that the substrate can be fired uniformly. .

[Fourth Modification]
In each of the above embodiments, when the substrate transport device 2 carries the substrate in and out of the substrate baking furnace 1, the first support means supports the substrate slidably. In this modification, a position regulating roller 10e is provided as a configuration (position regulating unit) that regulates the horizontal position of the substrate that is slidably supported. A configuration similar to this may also be provided in the transfer stage 8.

  A configuration of the substrate storage unit 5e included in the substrate processing apparatus according to this modification will be described with reference to FIGS. FIG. 17 is a plan view of a substrate storage unit 5e according to this modification. 18A is a plan view of the position regulating roller 10e, and FIG. 18B is a side view of the position regulating roller 10e. The substrate storage unit 5e is formed in multiple stages at a predetermined rack pitch, and includes a plurality of support shelves 51e that support the substrate from below. The structure of the support shelf 51e is the same as that of the first embodiment, and the air levitation means 7 for slidably supporting the substrate is formed on the upper surface thereof.

<Position restriction roller>
<Constitution>
The position regulating roller 10e regulates the horizontal position (more specifically, the position in the X direction and the Y direction) of the substrate located at the first flying position T1. The position restricting roller 10e includes a position restricting roller 10eA that restricts the position of the substrate in the + X direction, a position restricting roller 10eB that restricts the position in the -X direction, and a position restricting roller that restricts the position in the -Y direction. 10eC, and each position regulating roller 10e is fixed to the inner surface F5a, the inner surface F5b, and the inner back surface F5c of the substrate storage portion 5e by a predetermined number. A plurality of support shelves 51e provided in the substrate storage portion 5e as a set of at least one (eight in FIG. 17) position restriction rollers 10e provided on the same horizontal plane in the inner wall surfaces F5a, b, c. The position of the substrate supported by each of the two is regulated. However, the number of the position regulating rollers 10e (that is, the position regulating rollers 10e that regulate the position of one substrate) provided on the same horizontal plane may be any number. Further, it is not always necessary to provide all of the position regulating rollers 10eA, 10eB, and 10eC. However, it is desirable to provide a roller that regulates the position in the airflow direction formed in the substrate storage portion 5e. That is, it is desirable to provide the position regulating roller 10e at least on the inner wall surface (inner wall surface F5b in FIG. 17) on the downstream side of the airflow.

  The position regulating roller 10e includes a roller portion 11e, a roller support member 12e, and a spring 13e.

  The roller portion 11e is a cylindrical roller, and is supported by the roller support member 12e so that the roller shaft 111e is vertical. The roller portion 11e is formed of Teflon (registered trademark), PEEK, Vespel, or the like.

  The roller support member 12e supports the roller shaft 111a. The roller support member 12e is disposed so as to be rotatable in a horizontal posture with respect to the support shaft 121e.

  The spring 13e restricts the roller portion 11e to a standard position separated by a predetermined distance D from the inner wall surface (inner wall surface F5b in FIG. 18) on which the position restriction roller 10e is fixed. For example, when the substrate W comes into contact with the side surface of the roller portion 11e and the roller portion 11e is pressed in a direction approaching the inner wall surface F5b (arrow AR1e), the spring 13e moves the roller portion 11e to the standard position by the elastic force. Push back (arrow AR2e).

<Position control>
Next, a mode in which the position regulating roller 10e regulates the position of the substrate W will be specifically described. In a state in which the substrate W is slidably supported by the first support means, the substrate W is usually the inner wall surfaces F5a, b, c of the substrate storage portion 5e and the position regulating roller as shown in FIG. It should be supported without touching any of 10e. However, in the substrate storage portion 5e, a heated air flow is formed in the predetermined direction (arrow AR6c) by the heated gas supply system 6, and the substrate W slidably supported by the first support means is this air flow. There is a possibility of skidding. In addition, even when the support shelf 51e is inclined, the substrate W may slide along the inclination.

  In this modified example, when the substrate W approaches one of the inner wall surfaces F5a, b, c, for example, by flowing in an air stream, the substrate W is placed on the roller portion 11e of the position regulating roller 10e provided on the inner wall surface. The side faces will come into contact.

  When the roller portion 11e is pressed in the direction approaching the inner wall surface by the substrate W that has slid, the spring 13e pushes the roller portion 11e pressed by the elastic force back to the standard position. As a result, the side-sliding substrate W is pushed back in the opposite direction, and its position is regulated.

<effect>
According to this modification, the position regulating roller 10e regulates the position of the substrate that is slidably supported, so that the substrate can be moved forward and backward stably and accurately. Further, it is possible to prevent a situation in which the substrate slides or the like and comes into contact with the inner wall surfaces F5a, b, c of the substrate storage portion 5e.

[Fifth Modification]
In the fourth modified example, the position regulating roller 10e is provided as the position regulating unit. However, in this modified example, the position regulating chuck 20f is provided as the position regulating unit.

  The configuration of the substrate storage 5f included in the substrate processing apparatus according to this modification will be described with reference to FIG. FIG. 19A is a plan view of the substrate storage portion 5f, and FIG. 19B is a side view of the adsorption tube 21f. The substrate storage unit 5f is formed in multiple stages at a predetermined rack pitch, and includes a plurality of support shelves 51f that support the substrate from below. The structure of the support shelf 51f is the same as that of the first embodiment, and the air levitation means 7 for slidably supporting the substrate is formed on the upper surface thereof.

<Position restriction chuck>
<Constitution>
The position regulating chuck 20f includes an adsorption tube 21f and an adsorption tube negative pressure system 22f.

  The suction tube 21f regulates the position of the substrate in the horizontal direction (more specifically, the position in the X direction and the Y direction) by sucking and holding the substrate located at the first floating position T1. A predetermined number of the adsorption tubes 21f are fixed to the inner back surface F5c of the substrate storage portion 5f, and at least one (three in FIG. 19) adsorption tubes 21f provided on the same horizontal plane in the inner back surface F5c form a set. Thus, the position of the substrate supported on each of the plurality of support shelves 51f provided in the substrate storage portion 5f is regulated. However, any number of adsorption tubes 21f (that is, adsorption tubes 21f that regulate the position of one substrate) provided on the same horizontal plane may be used. The adsorption tube 21f is formed of a metal or a heat resistant resin.

  The suction tube 21f is formed in an L shape, and one end thereof is fixed to the inner back surface F5c of the substrate storage portion 5f. In addition, a suction portion 211f that sucks and holds the back surface of the substrate is formed at the free end. The fixed position of the fixed end of the suction tube 21f is adjusted so that the position of the suction part 211f is substantially the same height as the back surface of the substrate W located at the first floating position T1.

  A bellows shape is formed in a part of the L-shaped portion of the suction tube 21f that extends in the horizontal direction, and the suction portion 211f is substantially the same height as the back surface of the substrate W located at the first floating position T1. The position (first suction position A1) is a standard position (natural position), and the standard position and a position (second suction) that are substantially the same as the back surface of the substrate W placed on the support shelf 51f. It can move freely between position A2).

  An O-ring assembly groove is formed in the suction portion 211f, and an O-ring 212f is assembled in the groove.

  The suction pipe negative pressure system 22f applies a negative pressure to the suction portion 211f. The suction pipe negative pressure system 22f includes a pipe 221f, a solenoid valve 222f, and a vacuum pump 223f. One end of the pipe 221f is connected to a hollow structure (air line (not shown)) formed through the suction pipe 21f to the suction portion 211f. The other end is connected to the vacuum pump 223f via a solenoid valve 222f. The solenoid valve 222 f is connected to the control unit 3. The control unit 3 controls the opening and closing of the solenoid valve 222f at a predetermined timing, thereby negatively applying pressure to the adsorption unit 211f and causing the adsorption unit 211f to generate a suction force. As shown in FIG. 19 (a), on the downstream side of the solenoid valve 222f as viewed from the connection end with the air line, the pipe 221f is an air line in the adsorption pipe 21f provided for the support shelf 51f at the other stage. Merge with the pipe connected to. The control unit 3 controls the plurality of solenoid valves 222f separately and independently performs negative pressure control on the adsorption pipe 21f provided for each support shelf 51f. The solenoid valve 222f is formed by, for example, a three-way valve, and can break through the atmosphere via a filter.

<Position control>
Next, a mode in which the position regulating chuck 20f regulates the position of the substrate W will be specifically described.

  As described in the first embodiment, in the processing operation when the unprocessed substrate W is carried into the substrate baking furnace 1, the control unit 3 controls the pickup hand 11 to perform the second operation on the transport stage 8. The unprocessed substrate W at the levitation position T2 is pushed out to the first levitation position T1 on the support shelf 51 (step S6 in FIG. 7), and then the pickup hand 11 is further controlled and the unprocessed substrate adsorbed by the adsorption unit 113 After releasing the substrate W from the suction state, the hand 111 is reduced and the suction portion 113 is moved from the first position P1 to the second position P2 (step S7 in FIG. 9). Here, as described in the fourth modified example, when the suction unit 113 of the pickup hand 11 is released from the suction state, the unprocessed substrate W becomes a flow of heated air formed in the substrate storage unit 5. There is a possibility that the substrate W slides and skids.

  In this modification, when the unprocessed substrate W is pushed out to the first floating position T1 in step S6, the control unit 3 opens the solenoid valve 221f of the suction pipe negative pressure system 22f to negatively pressure the suction unit 211f, The rear end portion of the unprocessed substrate W at the first floating position T1 is sucked and held. That is, the position is regulated by sucking and holding the rear end portion of the substrate W.

  When it is confirmed that the position regulating chuck 20f has sucked and held the unprocessed substrate W, the control unit 3 controls the pickup hand 11 to release the negative pressure of the suction unit 113.

  Then, when the process of step S8 is executed and the unprocessed substrate W is switched to the state in which it is placed on the support shelf 51f and fixedly supported, the control unit 3 switches the solenoid valve of the suction pipe negative pressure system 22f. 221 is closed and the negative pressure of the adsorption part 211f is released.

  The same operation is performed when the processed substrate W is carried out of the substrate baking furnace 1. That is, in step S13, when the processed substrate W is switched from the fixed and supported state to the slidably supported state, the control unit 3 opens the solenoid valve 221f of the suction pipe negative pressure system 22f and sucks it. Negative pressure is applied to the portion 211f, and the rear end portion of the processed substrate W at the first floating position T1 is sucked and held. Alternatively, the rear end portion of the processed substrate W previously placed on the support shelf 51f may be sucked and held, and thereafter, the processed substrate W may be switched to a state where the processed substrate W is supported by the slip analog.

  Then, when the process of step S14 is executed and it is confirmed that the suction unit 113 of the pickup hand 11 sucks and holds the processed substrate W, the control unit 3 turns on the solenoid valve 221 of the suction pipe negative pressure system 22f. Close and release the negative pressure of the adsorbing portion 211f.

<effect>
According to this modification, while the suction part 113 of the pickup hand 11 does not suck and hold the substrate, the position regulating chuck 20f sucks and holds the substrate and regulates its position. It is possible to move forward and backward. In addition, it is possible to prevent a situation in which the substrate causes a side slip or the like and comes into contact with the inner wall surfaces F5a, b, and c of the substrate storage portion 5f.

[Other variations]
In each of the above embodiments, the substrate processing apparatus 1 including the substrate baking furnace 1 has been described. However, the configuration of the substrate baking furnace 1 described above may be applied to a cooling rack. In the case of application to a cooling rack, the above-described heater 62 (FIG. 3) may be replaced with a radiator or a cooler. In this case, the substrate is heated separately by a hot plate or the like and then carried into the cooling rack by the substrate carrying device 2.

1 is a schematic plan view of a substrate processing apparatus according to a first embodiment of the present invention. It is a schematic perspective view of the external appearance of a substrate baking furnace. It is the cross-sectional view and longitudinal cross-sectional view of a substrate baking furnace. It is an expanded sectional view near the upper surface of a support shelf. It is a schematic perspective view of a board | substrate conveyance apparatus. It is a top view of a conveyance stage. It is a figure which shows the flow of operation | movement at the time of a board | substrate conveyance apparatus carrying in an unprocessed board | substrate in a substrate baking furnace. It is a figure for demonstrating the operation | movement at the time of carrying a non-processed substrate in a substrate baking furnace by a substrate conveying apparatus. It is a figure which shows the flow of operation | movement at the time of a board | substrate conveyance apparatus carrying out a processed board | substrate from the inside of a substrate baking furnace. It is a figure for demonstrating the operation | movement at the time of a board | substrate conveyance apparatus carrying out a processed board | substrate from the inside of a substrate baking furnace. It is the cross-sectional view and longitudinal cross-sectional view of the board | substrate storage part which concern on 2nd Embodiment. It is an expanded sectional view near the support shelf concerning a 2nd embodiment. It is an expanded sectional view near the upper surface of the support shelf concerning a 3rd embodiment. It is a cross-sectional view of the board | substrate storage part which concerns on a 2nd modification. It is the cross-sectional view and longitudinal cross-sectional view of the board | substrate storage part which concern on a 3rd modification. It is an expanded sectional view of the support shelf vicinity which concerns on a 3rd modification. It is a top view of the board | substrate storage part which concerns on a 4th modification. It is the top view and side view of a position control roller which concern on a 4th modification. It is the side view of the plane of the board | substrate storage part which concerns on a 5th modification, and an adsorption tube. It is a figure explaining the aspect of carrying in / out of the board | substrate with respect to the conventional board | substrate baking furnace.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate baking furnace 2 Substrate transport apparatus 5 Substrate storage part 6 Heated gas supply system 7 Air floating means 7b Rolling support means 8 Transport stage 9 Stage drive part 10 Air floating means 10e Position restriction roller 11 Pickup hand 20f Position restriction chuck 51 Support Shelf 52 First columnar horizontal member 53 Second columnar horizontal member 54 Push-up support means 62 Heater 71 Air discharge port 71b Rolling support member 72 Pad 72b Rolling support member floating means 73 Lifting air supply system 100 Substrate processing apparatus 143 Vacuum pump 1123 Vacuum pump AL Air line

Claims (15)

A substrate processing apparatus comprising: a heat treatment unit that performs heat treatment on a substrate; and a substrate transfer device that carries the substrate in and out of the heat treatment unit,
The heat treatment part is
A board storage section for storing a plurality of boards;
A plurality of support shelves formed in multiple stages in the substrate storage unit, each supporting a substrate from below,
First support means formed on the upper surface of each of the plurality of support shelves and capable of slidably supporting the substrate;
Heat treatment means for performing a predetermined heat treatment on the substrate supported by the plurality of support shelves;
With
The substrate transfer device is
A transfer stage for supporting the substrate;
Moving means for moving the transfer stage to a position opposite to any of the plurality of support shelves;
A second support means formed on the upper surface of the transfer stage and capable of slidably supporting the substrate;
Advancing / retreating means for moving the substrate back and forth between a first sliding position slidably supported by the first supporting means and a second sliding position slidably supported by the second supporting means;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The first support means comprises:
A gas ejected from the lower side to the upper side is supplied to the upper surface of each of the plurality of support shelves, and the substrate is slidable at a position where the substrate floats upward by a predetermined distance from the upper surface of each of the plurality of support shelves. First levitation support means for supporting the
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 2,
The first levitating support means is
Gas heating means for heating the gas supplied to the upper surfaces of the plurality of support shelves,
A substrate processing apparatus comprising: In the substrate processing apparatus of Claim 2 or 3,
The first levitating support means is
Convex portions formed on the upper surfaces of the plurality of support shelves,
With
A substrate processing apparatus, wherein a support surface for supporting a substrate is formed on an upper surface of the convex portion, and the gas outlet is formed on the support surface. The substrate processing apparatus according to any one of claims 2 to 4,
By stopping the supply of the gas by the first levitation support means and placing the substrate on the upper surface of each of the plurality of support shelves, the support state of the substrates supported on each of the plurality of support shelves, A substrate processing apparatus, wherein the substrate processing apparatus is switched from a slidably supported state to a fixedly supported state. In the substrate processing apparatus according to claim 1,
Push-up support means for pushing up and supporting the substrate at a position above the upper surface of each of the plurality of support shelves by a predetermined distance;
With
By supporting the substrate supported slidably by the first support means on the push-up support means, the support state of the substrate supported on each of the plurality of support shelves is fixed from the state of slidably supported. And switching to a supported state. The substrate processing apparatus according to claim 6,
The push-up support means comprises:
A plurality of support pins for supporting the back surface of the substrate by pushing it up with dots,
A substrate processing apparatus comprising: In the substrate processing apparatus according to claim 1,
A substrate position regulating means for regulating a horizontal position of the substrate slidably supported by the first support means;
A substrate processing apparatus comprising: In the substrate processing apparatus according to claim 1,
The second support means comprises:
Second levitation support means for slidably supporting the substrate at a position where the substrate is levitated upward by a predetermined distance from the upper surface of the transfer stage by supplying a gas ejected upward from below to the upper surface of the transfer stage ,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 9,
The supply state of the substrate supported by the transfer stage is fixed from the slidably supported state by stopping the supply of the gas by the second levitation support means and placing the substrate on the upper surface of the transfer stage. And switching to a supported state. The substrate processing apparatus according to claim 1,
The first support means comprises:
A roll is disposed on the upper surface of each of the plurality of support shelves, and slidably supports the substrate while rolling between the upper surfaces of the plurality of support shelves and the back surface of the substrate supported by the support shelf. Dynamic support,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 11, wherein
A gas ejected from the lower side to the upper side is supplied to the upper surface of each of the plurality of support shelves, and the rolling support part is floated upward by a predetermined distance from the upper surface of each of the plurality of support shelves. Rolling part floating support means for supporting the position,
A substrate processing apparatus comprising: The substrate processing apparatus according to any one of claims 1 to 12,
Each of the plurality of support shelves
Horizontal support members whose both ends are fixedly arranged on both side surfaces of the substrate storage unit,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 13,
The horizontal support member is columnar;
Each of the plurality of support shelves
An orthogonal horizontal member that is columnar and has one end fixedly disposed on the inner back surface of the substrate storage unit,
With
In each of the plurality of support shelves, the plurality of horizontal members and the plurality of orthogonal horizontal support members are integrally formed in a lattice shape. The substrate processing apparatus according to claim 13,
The horizontal support member is flat;
2. A substrate processing apparatus, wherein two opposing sides of the horizontal member are fixedly arranged on both side surfaces of the substrate storage portion.

Images