JP2008129385A5 - - Google Patents

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Publication number
JP2008129385A5
JP2008129385A5 JP2006315288A JP2006315288A JP2008129385A5 JP 2008129385 A5 JP2008129385 A5 JP 2008129385A5 JP 2006315288 A JP2006315288 A JP 2006315288A JP 2006315288 A JP2006315288 A JP 2006315288A JP 2008129385 A5 JP2008129385 A5 JP 2008129385A5
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JP
Japan
Prior art keywords
optical
optical fiber
wiring board
groove
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006315288A
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Japanese (ja)
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JP2008129385A (en
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Publication date
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Priority to JP2006315288A priority Critical patent/JP2008129385A/en
Priority claimed from JP2006315288A external-priority patent/JP2008129385A/en
Publication of JP2008129385A publication Critical patent/JP2008129385A/en
Publication of JP2008129385A5 publication Critical patent/JP2008129385A5/ja
Pending legal-status Critical Current

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Claims (8)

配線パターンを備えた配線基板と、
前記配線基板の上に設けられ、銅層、又はニッケル層の上に金層が形成された積層金属膜からなる金属層から形成されて、表面側に光ファイバを配置するための溝を備えた光ファイバ搭載部とを有することを特徴とする光部品搭載用基板。
A wiring board with a wiring pattern;
Provided on the wiring board, formed from a metal layer made of a laminated metal film in which a gold layer is formed on a copper layer or a nickel layer, and provided with a groove for arranging an optical fiber on the surface side An optical component mounting substrate comprising an optical fiber mounting portion.
前記溝は、V溝、半円状溝、又は矩形状溝であることを特徴とする請求項1に記載の光部品搭載用基板。   2. The optical component mounting substrate according to claim 1, wherein the groove is a V-shaped groove, a semicircular groove, or a rectangular groove. 前記配線パターンは前記配線基板の両面側にn層(nは1以上の整数)で形成されており、前記配線基板の両面側の前記配線パターンは、前記配線基板に設けられたスルーホール導電層によって相互接続されていることを特徴とする請求項1に記載の光部品搭載用基板。   The wiring pattern is formed of n layers (n is an integer of 1 or more) on both sides of the wiring board, and the wiring pattern on both sides of the wiring board is a through-hole conductive layer provided on the wiring board. The optical component mounting board according to claim 1, wherein the optical component mounting boards are interconnected by each other. 配線パターンを備えた配線基板と、
前記配線基板の上に設けられ、銅層、又はニッケル層の上に金層が形成された積層金属膜からなる金属層から形成されて、表面側に光ファイバを配置するための溝を備えた光ファイバ搭載部と、
前記光ファイバ搭載部の前記溝に配置された前記光ファイバと、
前記配線基板上の前記配線パターンに接続されて実装され、前記光ファイバに光結合された光半導体素子とを有することを特徴とする光モジュール。
A wiring board with a wiring pattern;
Provided on the wiring board, formed from a metal layer made of a laminated metal film in which a gold layer is formed on a copper layer or a nickel layer, and provided with a groove for arranging an optical fiber on the surface side An optical fiber mounting section;
The optical fiber disposed in the groove of the optical fiber mounting portion;
An optical module comprising: an optical semiconductor element connected to and mounted on the wiring pattern on the wiring board and optically coupled to the optical fiber.
前記光ファイバと前記光半導体素子との光経路の間に設けられた光導波路をさらに有し、
前記光導波路の一端側が前記光ファイバに光結合され、他端側が前記光半導体素子に光結合されていることを特徴とする請求項4に記載の光モジュール。
An optical waveguide provided between the optical paths of the optical fiber and the optical semiconductor element;
The optical module according to claim 4, wherein one end side of the optical waveguide is optically coupled to the optical fiber, and the other end side is optically coupled to the optical semiconductor element.
前記光ファイバは、はんだによって前記光ファイバ搭載部の前記溝に固定されていることを特徴とする請求項4又は5に記載の光モジュール。   The optical module according to claim 4, wherein the optical fiber is fixed to the groove of the optical fiber mounting portion with solder. 前記光導波路はコア部がクラッド層で囲まれた構造を有し、前記光導波路と前記光ファイバとが水平方向に並んで配置され、前記光導波路の前記コア部の一端と前記光ファイバの一端とが対向して光結合されていることを特徴とする請求項5に記載の光モジュール。   The optical waveguide has a structure in which a core portion is surrounded by a cladding layer, the optical waveguide and the optical fiber are arranged in a horizontal direction, and one end of the core portion of the optical waveguide and one end of the optical fiber 6. The optical module according to claim 5, wherein and are optically coupled to face each other. 前記光導波路の前記光半導体素子側の一端には、光路を90°変換する光路変換部が設けられており、前記光半導体素子は前記光変換部の上方に発光部又は受光部が配置されて実装されていることを特徴とする請求項5に記載の光モジュール。   One end of the optical waveguide on the optical semiconductor element side is provided with an optical path conversion unit that converts an optical path by 90 °, and the optical semiconductor element has a light emitting unit or a light receiving unit disposed above the light conversion unit. The optical module according to claim 5, wherein the optical module is mounted.
JP2006315288A 2006-11-22 2006-11-22 Optical component mounting substrate and optical module Pending JP2008129385A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006315288A JP2008129385A (en) 2006-11-22 2006-11-22 Optical component mounting substrate and optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006315288A JP2008129385A (en) 2006-11-22 2006-11-22 Optical component mounting substrate and optical module

Publications (2)

Publication Number Publication Date
JP2008129385A JP2008129385A (en) 2008-06-05
JP2008129385A5 true JP2008129385A5 (en) 2009-09-17

Family

ID=39555240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006315288A Pending JP2008129385A (en) 2006-11-22 2006-11-22 Optical component mounting substrate and optical module

Country Status (1)

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JP (1) JP2008129385A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5029343B2 (en) * 2007-12-18 2012-09-19 凸版印刷株式会社 Optical substrate manufacturing method
JP5647485B2 (en) * 2010-10-25 2014-12-24 パナソニックIpマネジメント株式会社 Optical module
JP5654316B2 (en) * 2010-10-29 2015-01-14 パナソニックIpマネジメント株式会社 Optical module
JP5376617B2 (en) 2011-09-13 2013-12-25 日立金属株式会社 Photoelectric conversion module
JP2013140292A (en) * 2012-01-06 2013-07-18 Sumitomo Electric Ind Ltd Optical receiver module
CN104101961B (en) * 2013-04-12 2018-12-11 常州市华一通讯科技有限公司 Optical communication apparatus
JP7352328B2 (en) * 2019-07-24 2023-09-28 京セラ株式会社 Wiring board and electronic component mounting structure using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10308565A (en) * 1997-05-02 1998-11-17 Shinko Electric Ind Co Ltd Wiring board
JP3405402B2 (en) * 1999-06-23 2003-05-12 日本電気株式会社 Parallel transmission type optical module and method of manufacturing the same
JP2001221934A (en) * 2000-02-09 2001-08-17 Matsushita Electric Ind Co Ltd Optical communication module
JP2004146621A (en) * 2002-10-25 2004-05-20 Aica Kogyo Co Ltd Photoelectric printed board and its manufacturing method
JP2004177521A (en) * 2002-11-25 2004-06-24 Fujitsu Ltd Optical and electrical combined circuit board
JP2005164424A (en) * 2003-12-03 2005-06-23 Tamagawa Seiki Co Ltd Optical fiber gyroscope and optical fiber fixing method in light source module
JP2006184754A (en) * 2004-12-28 2006-07-13 Sony Corp Optical waveguide, optical fiber module, optical fiber mounting fixture, and optical fiber mounting method

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