JP2008126484A - Inkjet head module and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inkjet head module combining a plurality of inkjet heads so as to satisfy simply a required precision, and its manufacturing method. <P>SOLUTION: The inkjet head module includes a sheet of nozzle plate 25 having a plurality of nozzle hole groups consisting of one or more nozzle holes 23, a plurality of inkjet heads 10 respectively having ink outlet groups consisting of one or more ink outlets 40, and a frame 20 having a head storing region 24 for storing a plurality of the inkjet heads 10 and fixed to the nozzle plate 25. A plurality of the inkjet heads 10 is bonded to the nozzle plate 25 so that respective ink outlet groups individually overlap on either one of a plurality of nozzle hole groups to communicate with each other. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an inkjet head module and a method for manufacturing the same.

  The ink jet printer includes an ink jet head, and prints an image on a medium such as paper by ejecting a fine droplet of ink from a minute nozzle hole provided in the ink jet head in accordance with print data. Recently, by incorporating this ink-jet head into a production apparatus, production of a wiring pattern, a color filter, and the like has been actively performed.

  One of the ink jet head systems is a piezoelectric system. Piezoelectric ink jet heads can be classified into a type that ejects ink in a direction perpendicular to the thickness direction of the substrate of the ink jet head and a type that ejects ink in the thickness direction of the substrate. The former is classified as a side shooter type inkjet head, and the latter is classified as a top shooter type inkjet head.

  First, FIG. 22 and FIG. 23 show a first example of the structure of a conventional side shooter type ink jet head. 22 is a front view of the piezoelectric inkjet head, and FIG. 23 is a diagram for showing the internal configuration of the piezoelectric inkjet head, and is a cross-sectional view taken along the line XXIII-XXIII in FIG.

  A plurality of nozzle holes 107 through which ink droplets are ejected in the inkjet head 201 are arranged in the nozzle plate 106. An ink chamber 104 is provided corresponding to each nozzle hole 107. As shown in FIG. 23, the ink chamber 104 is surrounded by a piezoelectric substrate 101, a cover member 102, and a nozzle plate 106, and an electrode 108 is formed on the inner wall of the ink chamber 104. A conductive material 112 is filled at the rear end of the ink chamber 104 so as to be electrically connected to the electrode 108, and an external connection terminal 109 is connected to the conductive material 112. A common ink chamber 103 constituted by a cover member 102 is provided at the rear portion, that is, the upstream side of the ink chamber 104. The common ink chamber 103 communicates with all of the plurality of ink chambers 104 as shown in FIG. Ink is first supplied to the common ink chamber 103 from the right end in FIG. 23 and then flows from the common ink chamber 103 into each ink chamber 104.

  When a voltage corresponding to print data is applied to the electrode 108 through the external connection terminal 109 and the conductive material 112, the wall portion of the ink chamber 104 is deformed so as to protrude inward, and the ink in the ink chamber 104 is pressurized. . As a result, the ink in the ink chamber 104 is ejected from the nozzle hole 107.

  Ink supply to the ink chamber 104 is performed by applying a voltage to the electrode 108 opposite to that applied when the ink chamber is pressurized. That is, when a voltage opposite to that applied when the ink chamber is pressurized is applied, the wall portion of the ink chamber 104 is deformed so as to protrude outward, and the inside of the ink chamber 104 becomes negative pressure. As a result, ink flows from the common ink chamber 103 into the ink chamber 104.

  FIG. 24 shows a second example of the structure of a conventional side shooter type ink jet head. In the ink jet head 202, the drawing direction of the external connection terminal 109 is parallel to the groove direction of the ink chamber 104.

  Next, an example of the structure of a top shooter type inkjet head is shown in FIGS. 26 is a cross-sectional view taken along the line XXVI-XXVI in FIG. In the inkjet head 301, a plurality of ink chambers 104 are formed on the upper surface of the piezoelectric substrate 101 polarized in the substrate thickness direction by groove processing by dicing. A shallow groove 105 is provided at one end (the right end in FIG. 26) in the longitudinal direction of the groove of the ink chamber 104 to draw out the electrode. Electrodes 108 are formed on the inner walls of the ink chamber 104 and the shallow groove portion 105. The longitudinal direction of the ink chamber 104 is the left-right direction in FIG. 26, but the common ink chambers 103 a and 103 b for supplying ink to each ink chamber 104 are formed so as to be orthogonal to the longitudinal direction of the ink chamber 104. ing. In other words, the common ink chambers 103 a and 103 b extend in the front direction in FIG. 26 so as to cross the plurality of ink chambers 104. An electrode protective film (not shown) is formed with a thickness of 10 μm or less so as to cover the electrodes 108 formed on the inner walls of the ink chamber 104 and the shallow groove portion 105. An external substrate 109 z having terminals arranged so as to correspond to the respective shallow groove portions 105 is connected to the shallow groove portions 105. A nozzle plate 106 having nozzle holes 107 is bonded to the piezoelectric substrate 101 so as to cover the ink chamber 104, the shallow groove portion 105, and a part of the external substrate 109z.

  In the inkjet head 301, ink is ejected from the nozzle holes 107 through the common ink chambers 103 a and 103 b through the ink chamber 104. When a voltage corresponding to the print data is applied to the external substrate 109z, the corresponding ink chamber 104 is deformed so as to protrude inward, and the ink in the ink chamber 104 is pressurized. As a result, the ink in the ink chamber 104 is ejected from the nozzle hole 107. Such an area contributing to ink ejection is referred to as an active area, and is indicated by A1 and A2 in FIG. Such a piezoelectric method has a feature that gradation printing is easy because the pressure amount of ink and the amount of ejected ink droplets can be controlled by adjusting the voltage and controlling the deformation of the piezoelectric body.

  Compared to the side shooter type inkjet head 201, the top shooter type inkjet head 301 has two regions A1 and A2 that contribute to the ejection of ink. This is advantageous in terms of power.

  In recent years, in order to increase the printing speed, the number of nozzles tends to increase in the field of inkjet heads. When such an inkjet head is incorporated into a production apparatus and a wiring pattern, a color filter, or the like is produced, a plurality of inkjet heads are arranged side by side so that the nozzle holes of the inkjet head are arranged at a constant pitch with high density. The method is adopted.

A method of arranging a plurality of inkjet heads side by side is described in, for example, Japanese Patent Application Laid-Open No. 2002-264322 (Patent Document 1). In the method described in Patent Document 1, a plurality of inkjet heads (referred to as “ink head modules” in Patent Document 1) are arranged on the holding member. The holding member used here is made of a material having high rigidity such as ceramic, aluminum, and stainless steel, and is processed so that both sides have high parallelism. The inkjet heads are alternately arranged on the front and back of the holding member, and are held in a zigzag shape when viewed from the side. The pitches in the sub-scanning direction between the ink discharge ports at the extreme ends of the adjacent inkjet heads are adjusted and attached so as to be the same pitch as the pitch d of the ink discharge ports in one inkjet head. The nozzle plate is composed of a single plate-like member, and has nozzle rows arranged so as to have the same pitch d and number as the rows of ink discharge ports of the inkjet head. The nozzle plate is attached with its position adjusted so as to cover the entire inkjet head.
JP 2002-264322 A

The prior art described above has the following problems.
The first problem relates to heat generation and power consumption. When incorporating an inkjet head into a production device, the number of nozzles per inkjet head tends to increase in order to increase the printing speed, and when a plurality of inkjet heads are mounted on one holding member. There is also a tendency for the number of to be mounted. Thereby, the total length of the nozzle row of the inkjet head is increased. Therefore, when driving such an ink jet head, there is a problem that heat generation and power consumption are remarkably increased. For this problem, a top shooter type ink jet head with a low discharge voltage is considered promising.

  The second problem is that it is difficult to position the plurality of inkjet heads with respect to the holding member with high accuracy so that the pitch of the ink discharge ports is equal at any location with respect to one nozzle plate. That is.

  The case where the inkjet head 201 is arrange | positioned with respect to the holding member 110 as shown in FIG. As shown in FIG. 27, coordinate axes in three directions of X, Y, and Z and rotation axes α, β, and γ that define rotation around each of these three axes are defined. The X axis is the nozzle hole arrangement direction. The Z axis is the ink ejection direction.

  In disposing the inkjet head 201 with respect to the holding member 110, the three axes Y, α, and γ are uniquely regulated by the holding member 110. However, the three axes X, Z, and β are each highly accurate. The position of the inkjet head 201 needs to be adjusted and fixed.

  The deviation about the X axis will be described with reference to FIG. The deviation with respect to the X-axis relates to the relative position between the nozzle hole 107 of the nozzle plate 125 and the ink discharge port 111 of the inkjet head 201 in the direction parallel to the main surface of the nozzle plate, that is, the direction indicated by the arrow 91. . When an error of a certain degree or more occurs in the X-axis direction, the nozzle hole 107 of the nozzle plate 125 and the ink discharge port 111 of the inkjet head 201 do not coincide with each other. If the value P set as the pitch of the nozzle holes 107 in the nozzle plate 125 is, for example, 141 μm, and the ratio between the width Q of the ink chamber itself and the partition wall thickness R in the inkjet head 201 is 1: 1, the ink chamber Its own width Q is about 70 μm. On the other hand, the nozzle hole 107 provided in the nozzle plate 125 is processed so as to be gradually narrowed in a tapered shape in the normal ink ejection direction (left side in FIG. 28), and the taper angle is about 12 °. When the thickness of the nozzle plate is 50 μm and the ink outlet diameter S of the nozzle hole 107 is 25 μm, the ink inlet diameter T of the nozzle hole 107 is about 46 μm, and (70−46) / 2 = 12. , Nozzle pasting accuracy is ± 12 μm. The displacement of the relative position between the nozzle plate 125 and the inkjet head 201 needs to be 12 μm or less.

  The deviation with respect to the Z-axis is a relative position of each inkjet head with respect to the nozzle plate in a direction perpendicular to the main surface of the nozzle plate, that is, a so-called “protrusion” of each inkjet head. The nozzle plate and the inkjet head are generally fixed using an adhesive, and the thickness of the adhesive is controlled to be 10 μm or less. Accordingly, the nozzle plate and the inkjet head cannot be bonded unless the relative positional variation in the Z-axis direction is suppressed to 10 μm or less.

  The deviation about the β axis affects both the relative position of the nozzle hole of the nozzle plate and the ink discharge port of the inkjet head in the direction parallel to the main surface of the nozzle plate, and the protrusion of each inkjet head with respect to the nozzle plate. .

  Therefore, it is necessary to position the three axes X, Z, and β with high accuracy of about 10 μm or less. As the inkjet head 201 increases with respect to the holding member 110, the number of operations for adjusting the relative position increases, and it becomes difficult to maintain accuracy. Further, if the above-mentioned accuracy is not satisfied, it is difficult to bond the nozzle plate.

  Therefore, an object of the present invention is to provide an ink jet head module in which a plurality of ink jet heads are combined so as to easily satisfy a desired accuracy, and a method for manufacturing the same.

  In order to achieve the above object, an inkjet head module according to the present invention includes a single nozzle plate having a plurality of nozzle hole groups each including one or more nozzle holes, and a plurality of ink outlet groups each including one or more ink outlets. And a frame having a head housing area for housing the plurality of ink jet heads and fixed to the nozzle plate. The plurality of ink jet heads are bonded to the nozzle plate such that each ink outlet group individually overlaps and communicates with one of the plurality of nozzle hole groups.

  According to the present invention, since the frame body is fixed to the nozzle plate and the ink jet head is bonded to the nozzle plate, the frame body can be easily manufactured and desired accuracy can be satisfied easily. In addition, since the head accommodation area provided in the frame can be utilized as an ink flow path, an ink supply system to a plurality of inkjet heads can be realized with a simple structure.

(Embodiment 1)
(Constitution)
With reference to FIGS. 1-5, the inkjet head module in Embodiment 1 based on this invention is demonstrated. As shown in FIG. 1, the inkjet head module 100 according to the present embodiment includes a plurality of inkjet heads mounted on a single nozzle plate 25, and nozzles so that portions of the plurality of inkjet heads fit within the frame body 20. The frame body 20 is attached to the plate 25. FIG. 2 shows a cross-sectional view taken along the line II-II in FIG. FIG. 3 shows a state where the nozzle plate 25 is removed from the inkjet head module 100 shown in FIG. 1 in order to make the internal structure easy to understand. Further, in order to explain the structure, FIG. 4 shows a state where all of the plurality of inkjet heads 10 are removed from the state of FIG. A single appearance of the inkjet head 10 is shown in FIG.

  As shown in FIG. 1, the inkjet head module 100 includes a single nozzle plate 25 having a plurality of nozzle hole groups 43 including one or more nozzle holes 23. Further, the ink jet head module 100 includes a plurality of ink jet heads 10 and a frame body 20 bonded and fixed to the nozzle plate 25 under the nozzle plate 25 as shown in FIGS. As shown in FIG. 4, the frame 20 has a head accommodating region 24 that accommodates the plurality of inkjet heads 10. As shown in FIG. 5, the inkjet head 10 has an ink outlet group 80 including one or more ink outlets 40. The plurality of inkjet heads 10 are arranged so that each ink outlet group 80 (see FIG. 5) individually overlaps and communicates with one of the plurality of nozzle hole groups 43 (see FIG. 1) (see FIG. 2). It is adhered to 25.

  As shown in FIGS. 3 and 4, the head accommodation region 24 is an oval recess formed in the frame 20 by counterboring. Therefore, although both ends are semicircular, the ink supply port 41a is opened at the bottom of the semicircular portion at one end, and the ink discharge port 41b is opened at the bottom of the semicircular portion at the other end. is doing. An ink supply pipe 21a extends downward from the ink supply port 41a. An ink discharge pipe 21b extends downward from the ink discharge port 41b.

(Action / Effect)
According to the ink jet head module in the present embodiment, the frame body is fixed to the nozzle plate, and the ink jet head is bonded to the nozzle plate. Can be satisfied. In addition, since the head accommodation area provided in the frame can be utilized as an ink flow path, an ink supply system to a plurality of inkjet heads can be realized with a simple structure. In the ink jet head module according to the present embodiment, since the plurality of ink jet heads are positioned by the frame body, the nozzle plate has a low rigidity film when the surface of the nozzle plate is cleaned by a wiper blade (not shown). Even if it is in the shape, it is difficult for the wiper blade to leave a wiping residue, and the nozzle plate surface can be cleaned well.

  In the above-described configuration, the frame body 20 preferably has a common ink chamber for temporarily storing ink to be supplied to the plurality of inkjet heads 10 in the head accommodating region 24. The “common ink chamber” referred to here is a margin portion 7h, 7i, 7j that is a portion of the internal space of the head accommodating region 24 that becomes a margin when seen in a plan view when the plurality of inkjet heads 10 are arranged. , 7k, 7m, 7n (see FIG. 3) and transverse communication portions 7a, 7b, 7c, 7d (see FIG. 2) which are spaces extending across the plurality of channel grooves of each inkjet head 10. It is a concept that refers to a combination of both. By having such a common ink chamber inside the head accommodating area 24, it is possible to share ink among a plurality of inkjet heads 10, and as a result, ink is evenly distributed to each inkjet head 10 without excess or deficiency. This is preferable.

  More preferably, the frame 20 has an ink supply port 41 a for receiving ink from the outside and an ink discharge port 41 b for discharging ink separately from the nozzle holes 23. With such a configuration, it becomes easy to supply new ink to the plurality of inkjet heads 10 and discharge excess ink. According to this configuration, even when air enters the ink jet head module, it is possible to push out the air together with the ink from the ink discharge port 41b that is not the nozzle hole 23, and the air discharge becomes easy. Furthermore, in the case where an ink having a property such that a part of the constituent material of the ink precipitates or the dispersion state changes due to the ink staying inside the ink jet head module, the ink jet according to the present embodiment is used. In the head module, the ink can be circulated so as to prevent stagnation using the ink supply port 41a and the ink discharge port 41b, so that a highly reliable inkjet head module can be obtained.

(Embodiment 2)
(Production method)
With reference to FIGS. 6-14, the manufacturing method of the inkjet head module in Embodiment 2 based on this invention is demonstrated. The inkjet head module manufacturing method includes a step of preparing a single nozzle plate having a plurality of nozzle hole groups each including one or more nozzle holes, and an ink outlet group including one or more ink outlets with respect to the nozzle plate. Mounting a plurality of inkjet heads each having a plurality of inkjet heads such that each of the ink outlet groups of the plurality of inkjet heads individually overlaps and communicates with any of the plurality of nozzle hole groups.

(Process for preparing inkjet head)
First, a stage before these processes, that is, a process of manufacturing a plurality of inkjet heads will be described. As shown in FIG. 6, the piezoelectric substrate 1 is processed. The piezoelectric substrate 1 is a substrate having a thickness of 1.02 mm obtained by bonding two piezoelectric substrates having a thickness of 0.22 mm and a thickness of 0.8 mm having different polarization directions. A plurality of ink chambers 4 are processed on the piezoelectric substrate 1.

  When the front side of the piezoelectric substrate 1 in FIG. 6 is the front end and the back side is the rear end, the intermediate portion of the piezoelectric substrate 1 is processed at a sufficient depth as the ink chamber 4, and in the vicinity of both front and rear ends of the piezoelectric substrate 1. The ink chamber 4 is connected to the shallow groove portion 5. The shallow groove portions 5 are opened as they are on the front and rear end faces of the piezoelectric substrate 1. Groove machining including such a change in depth can be performed by a machining method using vertical movement of the dicing blade 30, that is, so-called chopper machining. In the chopper processing, the dicing blade 30 moves as indicated by an arrow in FIG. At the joint between the ink chamber 4 and the shallow groove portion 5, there is a portion where the bottom surface of the groove has a curved surface, that is, a so-called round shape, and this curved surface is a transfer of the outer shape of the dicing blade 30. The depth of the ink chamber 4 is about 250 μm, and the depth of the shallow groove portion 5 is 25 μm. By setting the width of the ink chamber 4 to 80 μm and the pitch to 169.3 μm, the inkjet head is planned to be configured with a nozzle density of 150 dpi (dot per inch). The shallow groove portion 5 is a portion where an internal terminal for later connection to the external connection terminal is formed. The terminal width of the internal terminal corresponds to the groove width of the ink chamber 4. In order to increase the terminal width of the internal terminal, the groove of the dicing blade 30 is shifted in the groove width direction only in the section of the shallow groove portion 5 to perform the groove processing a plurality of times, so that only the shallow groove portion 5 is grooved compared to the ink chamber 4. It is also possible to increase the width. As described above, if the groove width of the shallow groove portion 5 is increased to increase the terminal width of the internal terminal, connection reliability can be further ensured. In the case of the layout of the piezoelectric substrate 1 in the present embodiment, even if the pitch of the ink chambers 4 is reduced, the connection reliability is achieved by forming internal terminals at both ends of the piezoelectric substrate 1 and increasing the terminal width of the internal terminals. Sex can be secured.

  Next, an electrode 6 is formed on the inner wall of the ink chamber 4 by vapor deposition, sputtering, plating, or the like. When the electrode 6 is formed, a metal film similar to the electrode 6 is formed not only on the inner walls of the ink chamber 4 and the shallow groove portion 5 but also on the entire upper surface of the piezoelectric substrate 1. In this state, since the ink chambers 4 are short-circuited, after forming a metal film on the upper surface of the piezoelectric substrate 1, grinding is performed on the uppermost surface of the piezoelectric substrate 1 using a dicing machine. Cut to 20 μm. Thus, as a result of scraping a part from the uppermost surface, the piezoelectric substrate 1 has a thickness of 1.0 mm, and the electrode 6 is separated for each ink chamber 4. In this state, the electrode 6 is continuously formed on the inner wall from the ink chamber 4 to the shallow groove portion 5. When this grinding process is performed, the parallelism between the back surface and the front surface of the piezoelectric substrate 1 can be 1 μm or less. A portion of the electrode 6 formed on the inner wall of the shallow groove portion 5 serves as an “internal terminal”.

  Subsequently, as shown in FIG. 7, the dicing blade 31 is used to process the transverse communication portions 7a and 7b forming part of the common ink chamber. The transverse communication portions 7 a and 7 b are formed in a groove shape so as to be orthogonal to the ink chamber 4 at a position in the middle of the ink chamber 4 avoiding the shallow groove portion 5. The depth of the transverse communication portions 7 a and 7 b as grooves is shallower than that of the ink chamber 4. By processing in this way, the electrode 6 formed on the inner wall of the ink chamber 4 is electrically continuous without interruption at the positions of the transverse communication portions 7a and 7b. Conduction to the terminal is ensured. Since the transverse communication portions 7a and 7b of the common ink chamber are for supplying ink to all the ink chambers 4, the channel resistance is reduced by increasing the groove width of the transverse communication portions 7a and 7b. However, if the length of the section sandwiched between the crossing communication portions 7a and 7b is shortened, the active area is reduced accordingly, so it is preferable to set the length appropriately.

  6 and 7, only the piezoelectric substrate 1 having an area corresponding to one of the ink jet heads is shown and described. However, in actuality, as shown in FIG. It is preferable to simultaneously produce a structure corresponding to a plurality of inkjet heads using the substrate 1w. In that case, the dicing blade 30 performs groove processing while repeating vertical movement as indicated by an arrow 92 in FIG.

  Through the steps so far, it is possible to obtain a state in which a number of structures for individual ink jet heads are arranged on one wafer-like substrate 1w. A region corresponding to each of the inkjet heads is divided by cutting the wafer with a dicing machine. For example, by dividing the portion Z1 in FIG. 8A, the piezoelectric substrate 1 corresponding to one ink jet head is obtained as shown in FIG. 8B. A large number of piezoelectric substrates 1 can be obtained from one wafer-like substrate 1w.

  Next, as shown in FIG. 9, the external connection terminals 22 formed using a flexible wiring board are connected. The external connection terminals 22 are connected to the electrodes 6 on the inner surface of the shallow groove portion 5 that opens to the end surface of the piezoelectric substrate 1 having a size corresponding to one ink jet head, that is, the internal terminals. This connection is made through a sheet-like anisotropic conductive resin 27. The external connection terminals 22 have a structure in which metal wiring portions 29 are arranged on the surface, and the metal wiring portions 29 are respectively pressed against the internal terminals via an anisotropic conductive resin 27. By doing so, the ink jet head 10 shown in FIG. 5 is obtained. In the inkjet head 10, each metal wiring portion 29 and the internal terminal of each shallow groove portion 5 are electrically connected independently via the anisotropic conductive resin 27, so that the ink chamber of the inkjet head 10 is A desired potential can be applied to the electrode 6 formed on the inner wall 4 from the outside. Therefore, the inkjet head 10 can be driven from the outside.

  As for the connection method of the external connection terminal 22, in addition to the connection method through the anisotropic conductive resin as described above, the lead of the flexible wiring board is directly connected to each internal terminal, or the wire connection is used. The method etc. can be considered.

  Next, in order to protect the electrode 6 formed on the inner wall of the ink chamber 4 of the ink jet head 10 from ink, an electrode protective film (not shown) is formed to a thickness of about 10 μm. This electrode protective film adheres not only to the piezoelectric substrate 1 of the inkjet head 10 but also to the external connection terminal 22 which is a flexible wiring substrate.

(Process to prepare nozzle plate)
As described above, the method of manufacturing the ink jet head module in the present embodiment includes a step of preparing one nozzle plate having a plurality of nozzle hole groups each including one or more nozzle holes. The nozzle plate here may be, for example, the nozzle plate 25 shown in FIG. FIG. 10 shows a single state of the nozzle plate 25. When preparing such a nozzle plate by itself, it can be manufactured as follows. The plate used as the material for the nozzle plate 25 is made of a polymer material such as polyimide film or polyethersulfone. A water repellent film (not shown) having a water repellent effect on the ink is formed on the surface of the plate, which is the ink ejection surface, of the front and back surfaces. Next, a protective tape is applied to protect the water repellent film. Hole processing is performed by irradiating excimer laser light from the surface of the plate that becomes the bonding surface.

  First, excimer laser light is irradiated using a mask having a pattern corresponding to the nozzle hole group 43 including one or more nozzle holes 23. By irradiating excimer laser light through a polymer material such as polyimide film or polyethersulfone or a water-repellent film until it reaches a part of the protective tape, the molecular bond of the polymer material is broken, and the polymer The material decomposes into a molecular or atomic state and evaporates. By doing so, it is possible to obtain a shape reflecting the mask pattern. In the region where the nozzle hole 23 is to be formed, the water repellent film can be completely removed. This drilling is performed by controlling the number of pulses using a pulse-controlled excimer laser device. By doing so, the nozzle holes 23 are formed in a stable arrangement with a high reproducibility at a pitch corresponding to the ink chambers 4 of the inkjet heads 10 and the number corresponding to the ink chambers 4 of the plurality of inkjet heads 10. That is, as many nozzle hole groups 43 as the number of inkjet heads 10 are formed. The outer size of the nozzle plate 25 is larger than the outer size surrounding the whole of the plurality of inkjet heads 10 accommodated in the head accommodating region 24 of one frame body 20, and further on the outermost surface of the frame body 20 outside the head accommodating region 24. It is the size which covers a part of.

(Process of mounting multiple inkjet heads on the nozzle plate)
As described above, the manufacturing method of the inkjet head module in the present embodiment includes a plurality of inkjet heads each having an ink outlet group including one or more ink outlets with respect to the nozzle plate. There is also included a step of mounting such that each of the ink outlet groups individually overlaps and communicates with any of the plurality of nozzle hole groups. Therefore, this “mounting process” will be described.

  “A plurality of ink jet heads each having an ink outlet group including one or more ink outlets” refers to a plurality of ink jet heads 10. FIG. 11 is an explanatory diagram of a process of mounting the inkjet head 10 on the nozzle plate 25. A plurality of inkjet heads 10 including the piezoelectric substrate 1 and the external connection terminals 22 are mounted on one nozzle plate 25.

(Nozzle plate bonding device)
This operation can be performed by diverting a conventional nozzle plate bonding apparatus. Here, the nozzle plate bonding apparatus includes a plate-like fixing portion, a pressurizing tool having an object adsorption function and being displaceable, and first and second cameras for alignment of the object. Is. This nozzle plate bonding apparatus is conventionally used for attaching a nozzle plate having a size corresponding to one inkjet head to one inkjet head.

  The conventional usage of this nozzle plate bonding apparatus is as follows. First, the ink jet head is fixed and supported on a fixed part, and the first camera is used to image the opening serving as the mark of the ink jet head to obtain the coordinate position, thereby obtaining the center coordinates of the ink jet head. On the other hand, the nozzle plate is sucked and supported by the pressurizing tool, and the center coordinates of the nozzle plate are obtained by imaging the nozzle holes of the nozzle plate with the second camera to obtain the coordinate position. Next, the center coordinates of the inkjet head and the nozzle plate are made to coincide with each other by displacing the pressurizing tool, and the two are overlapped and pressed to be bonded.

  Using the conventional nozzle plate bonding apparatus that has been used in this manner, a step of mounting a plurality of inkjet heads on the nozzle plate in the present embodiment is performed. In this case, first, the nozzle plate 25 is fixedly supported by the fixing portion 151, and the inkjet head 10 is sucked and supported by the pressure tool 158. In this way, the inkjet head 10 is sequentially aligned and mounted on one nozzle plate 25, and is bonded by pressing with a pressing tool. As a result, as shown in FIG. 12, a structure 50 in a state where a plurality of inkjet heads 10 are bonded to the surface of one nozzle plate 25 is obtained. This is fitted into the concave portion of the frame 20 shown in FIG.

  The nozzle plate bonding apparatus here is not limited to a dedicated apparatus for bonding the nozzle plate, but may be a general COB (Chip On Board) apparatus. The COB device is a device for positioning and mounting a chip-shaped component such as an IC chip on a wiring board or the like with high accuracy. A COB apparatus usually includes a stage for installing a wiring board, a camera for detecting alignment marks on the wiring board side and the chip-like component side, and a tool for picking up by picking up the chip-like component. I have.

(More detailed explanation)
This will be described in more detail below. First, as shown in FIG. 11, the nozzle plate 25 is arranged on the fixing part 151 of the nozzle plate bonding apparatus and fixed.

  Next, an adhesive is applied to the surface of the inkjet head 10 where the ink chamber 4 is present. In this coating step, a bar coater device 152 shown in FIGS. 13A to 13C is used. As shown in FIGS. 13A and 13B, the bar coater device 152 is provided with fine irregularities on the outer peripheral surface of a cylindrical member. FIG. 13 (c) shows an enlarged portion Z2 in FIG. 13 (b). When rubbing the target surface with the bar coater 152, the adhesive passes through the gap 153 in FIG. Using this bar coater device 152, as shown in FIG. 14, the epoxy adhesive 155 applied linearly on the polyimide film 154 is spread. In this way, a uniform adhesive layer having a thickness of 4 μm is formed on the surface of the polyimide film 154. Further, the surface of the ink jet head 10 where the ink chamber 4 is located is pressed onto the polyimide film 154 coated with an adhesive, and is transferred onto the polyimide film 154 in the region of the ink chamber 4 of the ink jet head 10. It is possible to apply an adhesive having a uniform thickness of 2 μm, which is half the thickness of a uniform epoxy adhesive having a thickness of 4 μm.

  Next, the inkjet head 10 to which the adhesive is applied and the nozzle plate 25 fixed on the fixing part 151 are bonded. For this purpose, as shown in FIG. 11, the inkjet head 10 is adsorbed and fixed to the pressure tool 158 so that the side to which the adhesive is applied is directed downward. Similarly, the nozzle hole group 43 of the nozzle plate 25 is imaged by the first alignment camera 156 to obtain the coordinate position. Each ink chamber 4 of the inkjet head 10 that is suction-fixed to the pressure tool 158 is imaged by the second alignment camera 157 to obtain the coordinate position. Thereafter, the center coordinates of all the ink chambers 4 existing in one inkjet head 10 and the coordinates of the center of one nozzle hole group 43 of the nozzle plate 25 are respectively calculated. After the pressing tool 158 is displaced in the horizontal direction so that both center coordinates coincide with each other, the pressing tool 158 is lowered. By doing so, the ink chamber 4 in which the adhesive layer of the inkjet head 10 is transferred is brought into contact with the nozzle plate 25 and is pressurized. As a result, the inkjet head 10 is bonded to the nozzle plate 25.

  As shown in FIG. 5, in the ink jet head 10, a region where the ink chamber 4 opens with respect to the upper surface of the piezoelectric substrate 1 is an ink outlet 40, and a combination of the ink outlets 40 across the plurality of ink chambers 4 is an ink outlet group. 80. Since the coordinates of the ink chambers 4 are determined by the first and second alignment cameras 156 and 157 and are aligned and bonded by the pressurizing tool 158, each ink outlet group 80 of the plurality of inkjet heads 10 has a nozzle plate. In this case, each of the plurality of nozzle hole groups 43 provided on 25 is individually overlapped and communicated.

  In this way, a plurality of ink jet heads each having an ink outlet group composed of one or more ink outlets with respect to the nozzle plate 25, and each of the ink outlet groups of the plurality of ink jet heads includes the plurality of nozzle holes. The mounting process is completed so as to individually overlap and communicate with any of the groups.

  By sequentially repeating the above-described operation for the number of ink jet heads, as shown in FIG. 12, a structure 50 in which a plurality of ink jet heads 10 are mounted on one nozzle plate 25 is obtained.

(Action / Effect)
In the present embodiment, the relative positions of the plurality of inkjet heads are adjusted, and then the nozzle plates are not covered together so as to cover them. Since there is no need to adjust the relative position between each other and the conventional nozzle plate bonding apparatus can be used, there is an advantage that a new bonding apparatus or jig is not required.

  According to the manufacturing method of the ink jet head module in the present embodiment, by adhering the ink jet head 10 to the nozzle plate 25, the ink jet head 10 is bonded to all six axes of X, Y, Z, α, β, and γ. It is uniquely defined by the mounting accuracy of the device. Further, by adhering the frame body 20 to the structure 50 thus obtained, the position with respect to the Z axis can be reliably regulated.

  There are a plurality of nozzle hole groups in which nozzle holes are arranged at high density, and an ink jet head module 100 in which a plurality of ink jet heads 10 are arranged so that these nozzle hole groups are arranged at a constant pitch in a wide area. 1), the inkjet head module manufacturing method according to the present embodiment can easily produce a high-precision inkjet head module using a conventional nozzle plate bonding apparatus. it can.

(Production of frame)
Next, a method for manufacturing the frame 20 shown in FIG. 4 will be described. The frame 20 has a head accommodating area 24 for accommodating the plurality of inkjet heads 10.

  In order to obtain the frame 20, a plate material such as aluminum, stainless steel, and ceramics having a thickness of 3 mm is prepared, and a counterbore is formed in an oval shape at a depth of 0.95 mm with respect to one surface of the plate material as shown in FIG. Processing. A concave portion obtained by the counterboring process is defined as a head accommodating region 24. Hole processing is performed on the bottom surfaces of the semicircular regions at both ends of the head accommodating region 24 to form through holes. By this hole processing, an ink supply port 41a and an ink discharge port 41b are formed as shown in FIG. Further, as shown in FIG. 4, a pipe is connected to the lower surface of the plate so as to communicate with the ink supply port 41a and the ink discharge port 41b, respectively, thereby forming an ink supply tube 21a and an ink discharge tube 21b.

  The head housing area 24 of the frame 20 is for housing and bonding the ink jet head 10. As described above, the inkjet head 10 is finished to have a thickness of 1.0 mm by grinding, and the counterbore depth of the head accommodation region 24 of the frame 20 is set so that the inkjet head 10 is in the head accommodation region 24. The ink jet head 10 is set so as to protrude out of the head accommodating area 24 by 50 μm in the thickness direction when it is housed inside.

(Adhesion between frame and nozzle plate)
Subsequently, in the structure 50 illustrated in FIG. 12, an adhesive is applied to the back surface of the piezoelectric substrate 1 included in the inkjet head 10, that is, the surface opposite to the nozzle plate 25. As shown in FIG. 16, the frame body 20 is supported so that the head accommodating area 24 is on the lower side, and the structure body 50 that is supported in a posture in which the nozzle plate 25 is on the lower side is covered from above. Glue. Thus, the state shown in FIG. 1 is obtained. This adhesion is performed by aligning the positions so that the plurality of inkjet heads 10 of the structure 50 fit into the head accommodating region 24.

  That is, in the manufacturing method of the ink jet head module in the present embodiment, the frame body 20 having the head housing area 24 for housing the plurality of ink jet heads 10 is attached to the nozzle plate 25 after the “mounting step”. And fixing.

  In the method of manufacturing an ink jet head module in the present embodiment, it is preferable that each of the plurality of ink jet heads is a top shooter type. If the top shooter type inkjet head is used as in the inkjet head 10 shown in the present embodiment, a surface having a large area on the back surface of the piezoelectric substrate 1 can be used as a reference surface, and is provided on the frame body 20. This is because it can be securely bonded and fixed to the head receiving area 24 formed. By so doing, the protrusion variation of the plurality of inkjet heads 10 as viewed in the height direction from the surface of the frame body 20 can be suppressed to 5 μm or less.

  As shown in FIG. 1, the outer size of the nozzle plate 25 is larger than the combined outer size of the plurality of inkjet heads 10, and is large enough to cover a part of the surface of the frame body 20, Since the inkjet head 10 protrudes 50 μm from the surface of the frame body 20, a gap of 50 μm is generated between the surface of the frame body 20 and the nozzle plate 25. If an adhesive is applied in advance to at least one of the frame 20 and the nozzle plate 25 in the region where the nozzle plate 25 covers the surface of the frame 20, the adhesive is applied to the entire gap of 50 μm by capillary action. Since it penetrates, sealing can be performed using this.

  At this time, an adhesive is poured into the gap between the external connection terminal 22 and the frame body 20 and the gap between the nozzle plate 25 and the external connection terminal 22 to seal them.

  If the thickness of the flexible wiring board serving as the external connection terminal 22 is a problem, the portion of the frame 20 where the flexible wiring board is arranged is previously processed to be recessed by the thickness of the flexible wiring board. That's fine. By carrying out like this, it becomes possible to seal with an adhesive agent without gap. By applying the adhesive in this manner, a stepped portion between the nozzle plate 25 and the frame 20 is formed with a gentle taper shape by the adhesive, and during the wiping operation, the occurrence of wiping residue by the wiper blade, Wear of the wiper blade can be reduced.

  As for the outer size of the nozzle plate 25, it is sufficient if there is a region bonded to the frame body 20, the same size as the frame body 20, or in some cases larger than the frame body 20.

  Ink flows from the ink supply pipe 21 a and flows into the head accommodation area 24 which is a space defined by the frame body 20 and the nozzle plate 25. In the head accommodating region 24, the ink first enters the common ink chamber described above, and flows into the ink chamber 4 of each inkjet head 10 from the transverse communication portions 7 a, 7 b, 7 c, and 7 d of the plurality of inkjet heads 10. Is driven, ink is ejected from the corresponding nozzle hole 23.

  Since the frame body 20 includes the ink supply pipe 21a and the ink discharge pipe 21b, when removing the air that has entered the inkjet head, by pressurizing the ink from these pipes and nozzle holes, along with the ink, The air can be pushed out, and the air that has entered inside can be easily discharged. In addition, depending on the type of ink, the dispersion state may change due to a part of the ink constituent material being settled by staying inside the ink jet head, but when using such type of ink The ink can be circulated by using the ink supply pipe 21a and the ink discharge pipe 21b, so that the ink can be prevented from staying and a highly reliable ink jet head can be obtained.

(Embodiment 3)
(Constitution)
With reference to FIGS. 17-21, the inkjet head module in Embodiment 3 based on this invention is demonstrated. As shown in FIG. 17, the inkjet head module 100 h according to the present embodiment has a plurality of inkjet heads mounted on one nozzle plate 25, and the nozzles so that the portions of the plurality of inkjet heads fit within the frame body 20. In common with the inkjet head module 100 shown in Embodiment 1, the frame 20 is attached to the plate 25. The inkjet head module 100h has the same appearance as the inkjet head module 100, but the internal structure is different. FIG. 18 shows the nozzle plate 25 removed from the inkjet head module 100h in order to make the internal structure easy to understand.

  As shown in FIG. 18, a plurality of inkjet heads 10 are accommodated in the head accommodating region 24, but a spacer member 26 is disposed between the inkjet heads 10. That is, in the head accommodating region 24, the plurality of inkjet heads 10 are arranged in a plane with one or more spacer members 26 interposed therebetween. As shown in FIG. 19, the spacer member 26 is a rectangular parallelepiped member provided with two through grooves 26 e on the upper surface. The length L and thickness H of the spacer member 26 are the piezoelectric substrate 1 included in the inkjet head 10. Are substantially the same as the length and thickness, and only the width W is different. That is, the thickness of the inkjet head 10 and the thickness H of the spacer member 26 are substantially equal.

  The spacer member 26 is provided with a through groove or a through hole for mediating the flow of ink between the two inkjet heads 10 arranged on both sides of the spacer member 26. In the example shown in FIGS. 18 and 19, a through groove 26e is provided. The position and width of the through groove 26e on the upper surface of the spacer member 26 are equal to the position and width of the transverse communication portions 7a and 7b on the upper surface of the inkjet head 10 shown in FIG. As shown in FIG. 18, the spacer member 26 is disposed between the inkjet heads 10, so that the gap between the inkjet heads 10 is almost completely filled, and the transverse communication portion 7 a on the upper surface of the inkjet head 10. , 7b, 7c, 7d communicate with the through groove 26e on the upper surface of the spacer member 26.

  When assembling the inkjet head module 100h in the present embodiment, the piezoelectric substrate 1 and the spacer member 26 are combined so that the structure 51 shown in FIG. 20 is obtained instead of the structure 50 shown in FIG. The ink jet head module according to the third embodiment of the present invention includes a structure 51. Even if the external dimensions of the piezoelectric substrate and the spacer member of the inkjet head are different, or even if the external dimensions of the piezoelectric substrate are mixed in the inkjet head, these are combined in the same plane to accommodate the head. What is necessary is just to make it fit in the area | region 24. FIG.

  In the inkjet head module 100h according to the present embodiment, the configuration of the portion other than that the spacer member 26 is disposed between the inkjet heads 10 is the same as that of the inkjet head module 100 described in the first embodiment.

(Action / Effect)
In the present embodiment, since the spacer member 26 is arranged so as to fill the gap between the inkjet heads 10, deformation of the nozzle plate 25 in the portion between the inkjet heads 10 can be suppressed.

  As the ink discharge is repeated, the ink adheres to the nozzle plate 25. If this ink or other adhered matter adheres to the nozzle hole 23, it will cause ink landing deterioration. To avoid this, the surface of the nozzle plate 25 is periodically wiped with a wiper blade made of an elastic material. The work of eliminating is performed. In this operation, if the gap between the inkjet heads 10 is hollow, the nozzle plate 25 may be deformed so that it is depressed by the wiper blade. Since the spacer member 26 is disposed so as to fill the gap between the heads 10, it is possible to prevent the nozzle plate 25 from being deformed, and as a result, the wiper blade and the nozzle plate 25 are in close contact with each other, so that wiping can be performed. Generation | occurrence | production of a residue can be reduced and it becomes possible to eliminate a deposit more completely. In particular, when the thickness of the spacer member 26 and the thickness of the inkjet head 10 are equal, it is preferable because the pressure by the wiper blade can be continuously received at a constant height.

  In addition, since the nozzle plate 25 can be prevented from being deformed or peeled off even when internal or external pressure is applied to the nozzle plate 25 by operations such as nozzle suction or ink extrusion for air discharge, it is highly reliable. It can be an inkjet head or an inkjet head module.

  Since the through groove 26e is formed on the upper surface of the spacer member 26 as shown in FIG. 19, ink can be supplied to the plurality of inkjet heads 10 without interrupting the ink supply path. Therefore, it is not necessary to separately prepare an ink supply system, and ink can be supplied with a very simple structure.

  In the present embodiment, the piezoelectric substrate 1 and the spacer member 26 of the inkjet head 10 have the same length and thickness with respect to the external dimensions, but only the width is different. However, the piezoelectric substrate 1 and the spacer member 26 have different lengths, All of the width and thickness may be equal.

  Note that the spacer member may be provided with a through hole in the vicinity of the upper surface instead of the through groove on the upper surface as long as it can communicate with the transverse communication portion on the upper surface of the inkjet head 10. For example, instead of the spacer member 26, a space member 26h shown in FIG. 21 may be used.

  Since the inkjet head module as shown in the first or third embodiment can simultaneously print a large area with high accuracy, if such an inkjet head module is incorporated in a production apparatus, a wiring pattern can be obtained. And color filters can be efficiently and accurately produced by an ink jet printing method.

  Preferably, each of the plurality of inkjet heads 10 included in the inkjet head modules 100 and 100h according to the first and third embodiments is a top shooter type. With such a configuration, the wide surface of the ink jet head can be securely bonded and fixed to the head housing region of the frame body using the wide surface as a reference surface.

  In each of the above-described embodiments, an example in which six inkjet heads 10 are arranged in a staggered manner in one head accommodation region 24 has been described, but the number of inkjet heads arranged in one head accommodation region is as follows. Other than 6, the arrangement may be other than staggered.

  In each of the above-described embodiments, an example in which the transverse communication portion is provided as two through grooves in one ink jet head has been described. However, the number of such transverse communication portions may be other than two.

  The above embodiments have been described on the assumption that each ink jet head is a top shooter type, but the present invention may be applied to ink jet heads other than the top shooter type.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and includes all modifications within the scope and meaning equivalent to the terms of the claims.

It is a perspective view of the inkjet head module in Embodiment 1 based on this invention. It is arrow sectional drawing regarding the II-II line | wire in FIG. It is a perspective view of the state which removed the nozzle plate from the inkjet head module in Embodiment 1 based on this invention. FIG. 4 is a perspective view of a state where a plurality of inkjet heads are further removed from the state of FIG. 3. It is a perspective view of the inkjet head contained in the inkjet head module in Embodiment 1 based on this invention. It is explanatory drawing of the 1st process of the manufacturing method of the inkjet head module in Embodiment 2 based on this invention. It is explanatory drawing of the 2nd process of the manufacturing method of the inkjet head module in Embodiment 2 based on this invention. (A) is explanatory drawing of the wafer-like board | substrate which can be used in the manufacturing method of the inkjet head module in Embodiment 2 based on this invention, (b) respond | corresponds to each one of an inkjet head from a wafer-like board | substrate. It is explanatory drawing of a mode that an area | region is divided | segmented. It is explanatory drawing of a mode that an external connection terminal is connected to a piezoelectric substrate in the manufacturing method of the inkjet head module in Embodiment 2 based on this invention. It is a perspective view of the nozzle plate used with the manufacturing method of the inkjet head module in Embodiment 2 based on this invention. It is explanatory drawing of the process of mounting an inkjet head in a nozzle plate in the manufacturing method of the inkjet head module in Embodiment 2 based on this invention. It is a perspective view of the structure obtained in the middle step of the manufacturing method of the inkjet head module in Embodiment 2 based on this invention. (A), (b), (c) is the front view, side view, and partial enlarged view of a bar-coater apparatus, respectively. It is explanatory drawing of the process of spreading the adhesive apply | coated on the polyimide film. It is explanatory drawing of the process of counterboring the surface of the board | plate material which should become a frame. It is explanatory drawing of the process of adhere | attaching a frame to a structure in the manufacturing method of the inkjet head module in Embodiment 2 based on this invention. It is a perspective view of the inkjet head module in Embodiment 3 based on this invention. It is a perspective view of the state which removed the nozzle plate from the inkjet head module in Embodiment 3 based on this invention. It is a perspective view of the spacer member contained in the inkjet head module in Embodiment 3 based on this invention. It is a perspective view of the structure contained in the inkjet head module in Embodiment 3 based on this invention. It is a perspective view of the spacer member contained in the modification of the inkjet head module in Embodiment 3 based on this invention. It is a front view of the 1st example of the structure of the conventional side shooter type inkjet head. It is arrow sectional drawing regarding the XXIII-XXIII line | wire of FIG. It is sectional drawing of the 2nd example of the structure of the conventional side shooter type inkjet head. It is a perspective view of an example of the conventional top shooter type ink jet head. It is arrow sectional drawing regarding the XXVI-XXVI line | wire of FIG. It is a perspective view of the structure which has arrange | positioned the inkjet head with respect to the holding member by a prior art. It is explanatory drawing of the shift | offset | difference of the X-axis direction in a prior art.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Piezoelectric substrate, 1w wafer-like substrate, 4 ink chamber, 5 shallow groove part, 6 electrodes, 7a, 7b, 7c, 7d transverse communication part, 7h, 7i, 7j, 7k, 7m, 7n blank part, 20 frame, 30 , 31 Dicing blade, 10 Ink jet head, 21a Ink supply pipe, 21b Ink discharge pipe, 22, 109 External connection terminal, 23, 107 Nozzle hole, 24 Head accommodation area, 25, 125 Nozzle plate, 26, 26h Spacer member, 26e Through groove, 29 Metal wiring part, 40 Ink outlet, 41a Ink supply port, 41b Ink discharge port, 43 Nozzle hole group, 50, 51 structure, 80 Ink outlet group, 91, 92 arrow, 100, 100h Inkjet head module, 101 Piezoelectric substrate, 102 Cover member, 104 Ink chamber, 106 Plate, 108 electrode, 109z external substrate, 110 holding member, 111 ink discharge port, 112 conductive material, 151 fixing portion, 152 bar coater device, 153 gap, 154 polyimide film, 155 epoxy adhesive, 156 first alignment camera, 157 Second alignment camera, 158 Pressurizing tool, 201, 202, 301 (Conventional) inkjet head.

Claims (10)

One nozzle plate having a plurality of nozzle hole groups composed of one or more nozzle holes;
A plurality of inkjet heads each having an ink outlet group composed of one or more ink outlets;
A head housing area for housing the plurality of inkjet heads, and a frame body fixed to the nozzle plate;
The ink jet head module, wherein the plurality of ink jet heads are bonded to the nozzle plate such that each of the ink outlet groups individually overlaps and communicates with any of the plurality of nozzle hole groups.   2. The inkjet head module according to claim 1, wherein the frame body has a common ink chamber for temporarily storing ink to be supplied to the plurality of inkjet heads inside the head accommodation region.   The inkjet head module according to claim 1, wherein the frame includes an ink supply port for receiving ink from outside and an ink discharge port for discharging ink separately from the nozzle hole.   4. The inkjet head module according to claim 1, wherein in the head accommodating region, the plurality of inkjet heads are arranged in a plane with one or more spacer members interposed therebetween. 5.   The inkjet head module according to claim 4, wherein a thickness of the inkjet head and a thickness of the spacer member are substantially equal.   The said spacer member is provided with the penetration groove | channel or the penetration hole for mediating the passage of the ink between the two said inkjet heads arranged in the both sides of the said spacer member. Inkjet head module.   The inkjet head module according to claim 1, wherein each of the plurality of inkjet heads is a top shooter type. Preparing one nozzle plate having a plurality of nozzle hole groups composed of one or more nozzle holes;
A plurality of ink jet heads each having an ink outlet group including one or more ink outlets with respect to the nozzle plate, and each of the ink outlet groups of the plurality of ink jet heads is individually separated from any of the plurality of nozzle hole groups. A method of manufacturing an ink jet head module including a step of mounting so as to overlap and communicate with each other.   The method of manufacturing an ink jet head module according to claim 8, further comprising a step of fixing a frame body having a head housing area for housing the plurality of ink jet heads to the nozzle plate after the mounting step. .   The method of manufacturing an inkjet head module according to claim 8 or 9, wherein each of the plurality of inkjet heads is a top shooter type.

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