JP2008124328A - Mounting jig for flexible printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting jig for soldering that can prevent a reinforcing plate from being deformed by heat when a flexible printed wiring board to which the reinforcing plate made of synthetic resin with low heat resistance is adhered is subject to reflow soldering. <P>SOLUTION: The mounting jig 20 is used to solder a flexible printed wiring board 10 to which a reinforcing plate 11 made of synthetic resin having thermal deformation temperature lower than the melting point of a solder is adhered. The mounting jig 20 includes a placement part 21 that is made of metal with high thermal conductivity and wherein the flexible printed wiring board 10 is placed, a housing part 22 that is provided to the placement part 21 to which a portion bonded with the reinforcing plate 11 is inserted, and a protective cover 23 that is brought into contact with the housing part 22 from its both sides so as to cover the housing part 22. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a mounting jig for a flexible printed wiring board, and in particular, when reflow soldering a flexible printed wiring board in which a reinforcing plate made of a synthetic resin having low heat resistance is bonded to a terminal portion of a connector, The present invention relates to a mounting jig for soldering that can prevent thermal deformation of a reinforcing plate.

  In general, a flexible printed wiring board uses a synthetic resin having high heat resistance such as polyimide. However, for example, in a terminal portion of a connector, polyimide is likely to be elastically deformed, and contact failure may occur due to temporal deformation. Therefore, a reinforcing plate made of synthetic resin, which hardly causes plastic deformation for a long time, is bonded. For example, polyester or the like has elasticity and is less likely to be deformed with time, and when used as a reinforcing plate for a terminal portion of a connector, poor contact is unlikely to occur and costs are low. However, since polyester has a low heat distortion temperature of 80 ° C., component mounting by reflow soldering is inappropriate.

When soldering a substrate using a synthetic resin having a thermal deformation temperature equal to or lower than the melting temperature of solder, for example, in Patent Document 1, a heat insulating holder made of a heat insulating plate material is used as a predetermined unit of electronic components to be soldered. When the soldering surrounding area surrounding the lead and the lead is formed thin, and the inter-land part in each electronic component is formed thicker than the thin part, and when soldering the lead to the land of the flexible printed wiring board A configuration is disclosed in which the flexible printed wiring board is brought into contact with a soldering jig so that the land and the lead are positioned in an opening provided in the heat insulating holder.
JP-A-11-26924

  The invention described in Patent Document 1 is a jig used for flow soldering (wave soldering), and prevents the occurrence of a bridge, thereby improving productivity and connecting reliability of a soldered portion. is there. However, there is no description regarding the reinforcing plate bonded to the flexible printed wiring board.

  Therefore, the present invention provides a mounting jig for soldering that can prevent thermal deformation of a reinforcing plate when reflow soldering a flexible printed wiring board to which a reinforcing plate made of synthetic resin having low heat resistance is bonded. The purpose is to provide.

  The present invention has been proposed to achieve the above object, and the invention according to claim 1 is a flexible printed wiring board formed by bonding a reinforcing plate made of a synthetic resin having a thermal deformation temperature equal to or lower than the melting temperature of solder. In this soldering mounting jig, the mounting jig is inserted with a mounting portion that is formed of a metal having high thermal conductivity and on which the flexible printed wiring board is mounted, and a portion to which the reinforcing plate is bonded. Therefore, there is provided a mounting jig for a flexible printed wiring board, comprising: a storage portion provided in the mounting portion described above; and a protective cover that covers both sides of the storage portion and covers the storage portion. provide.

  According to this configuration, the flexible printed wiring board is placed on the placement portion of the mounting jig, and the portion where the reinforcing plate is bonded is inserted into the storage portion provided in the placement portion. When the reflow soldering is performed by covering the storage part by contacting the protective cover from both sides of the storage part, when the mounting portion of the flexible printed wiring board rises to the melting temperature of the solder, The part is shielded by a protective cover. Thus, the temperature rise of the reinforcing plate is suppressed, and the reinforcing plate can be prevented from being thermally deformed above the heat deformation temperature.

  The invention according to claim 2 provides the mounting jig for the flexible printed wiring board according to claim 1, wherein the storage portion is an opening hole penetrating in a vertical direction at a predetermined position of the placement portion. To do.

  According to this configuration, since the storage portion is an opening hole penetrating in the vertical direction, for example, even a terminal portion of a connector provided on a flexible printed wiring board, only the terminal portion is stored in the storage portion. Heat can be shielded by the protective cover, and other mounting portions can be placed on the placement portion and soldered.

  The invention according to claim 3 is characterized in that the protective cover is formed by bonding a heat shielding metal plate to the outside of the heat insulating material. The mounting jig for a flexible printed wiring board according to claim 1 or 2, I will provide a.

  According to this configuration, since the protective cover is formed by bonding the heat shielding metal plate to the outside of the heat insulating material, when reflow soldering, the heat applied to the mounting jig is shielded by the metal plate, Heat insulation is prevented from being conducted into the storage portion by the heat insulating material, and the temperature rise of the reinforcing plate can be made equal to or lower than the heat deformation temperature.

  When reflow soldering a flexible printed wiring board to which a synthetic resin reinforcing board having low heat resistance is bonded, the present invention places the flexible printed wiring board on the mounting portion of the mounting jig, This part is inserted into the storage part and covered with protective covers from both the upper and lower sides, so that the heat applied to the reinforcing plate having low heat resistance can be suppressed to the heat deformation temperature or lower when soldering.

  Thus, for example, even when a synthetic resin having low heat resistance such as polyester is used for the terminal portion of the connector of the flexible printed wiring board, it is possible to perform component mounting by reflow soldering. The protective cover is made of an inexpensive material that is easy to use, such as a heat shielding metal plate such as aluminum and a heat insulating material such as glass epoxy resin, and can effectively protect the reinforcing plate from high heat.

  Hereinafter, the flexible printed wiring board mounting jig according to the present invention will be described with reference to preferred embodiments. The purpose of providing a mounting jig for soldering that can prevent thermal deformation of a reinforcing plate when reflow soldering a flexible printed wiring board to which a reinforcing plate made of synthetic resin having low heat resistance is bonded. In order to achieve the present invention, the present invention provides a mounting jig for soldering a flexible printed wiring board obtained by adhering a reinforcing plate made of a synthetic resin whose thermal deformation temperature is equal to or lower than the melting temperature of solder. A mounting portion that is formed of a highly flexible metal and mounts the flexible printed wiring board; a storage portion that is provided in the mounting portion in order to insert a portion to which the reinforcing plate is bonded; and the storage portion This is realized by comprising a protective cover that abuts from both sides and covers the storage portion.

  1 and 2 show a mounting jig according to the present invention. A mounting jig 20 shown in FIG. 1 has a reinforcing plate 11 made of synthetic resin having a thermal deformation temperature equal to or lower than the melting temperature of solder (200 to 230 ° C.). The flexible printed wiring board 10 formed by bonding is used when reflow soldering. In this embodiment, the reinforcing plate 11 bonded to the back surface side of the terminal 12 of the connector is made of a synthetic resin having elasticity and low temporal deformation, such as polyester having low heat resistance. Since polyester has a low heat distortion temperature of 80 ° C., it is inherently unsuitable for mounting by reflow soldering.

  The mounting jig 20 is provided in the mounting portion 21 for inserting the mounting portion 21 for mounting the flexible printed wiring board 10 and the terminal 12 portion of the connector to which the reinforcing plate 11 is bonded. It is comprised from the part 22 and the protective cover 23 which contact | abuts from the upper and lower surfaces of this accommodating part 22, and covers the accommodating part 22. FIG.

  The mounting portion 21 is formed of a metal having high thermal conductivity such as aluminum, and when the mounting portion of the flexible printed wiring board 10 rises to a solder melting temperature of 200 to 230 ° C., a good heat dissipation effect can be obtained. It has become. The size of the storage portion 22 is an opening hole penetrating in the vertical direction so that the connector terminal 12 portion to which the reinforcing plate 11 is bonded can be stored.

  The protective cover 23 covering the storage portion 22 is formed by bonding a heat shielding metal plate 25 to the outside of the heat insulating material 24. In this embodiment, for example, a heat shielding metal plate 25 such as an aluminum plate having a thickness of 1 mm and a heat insulating material 24 such as a glass epoxy laminated plate having a thickness of 1.5 mm are used. The means for abutting and fixing the protective cover 23 to both surfaces of the storage portion 22 is fixed by any method including adhesion by an adhesive material.

  When reflow soldering is performed in this state, when the mounting portion of the flexible printed wiring board 10 mounted on the mounting portion 21 of the mounting jig rises to the melting temperature of the solder, the mounting jig 20 is applied. The heat is blocked by the protective cover 23, and the heat is prevented from being conducted into the storage portion 22. Therefore, the heat applied to the reinforcing plate 11 having low heat resistance can be set to the heat deformation temperature or lower.

  Thus, even when the reinforcing plate 11 having low heat resistance such as polyester is bonded to the terminal 12 of the connector of the flexible printed wiring board 10, it is possible to perform component mounting by reflow soldering. The protective cover 23 is an inexpensive material that is easy to use, such as a heat-insulating metal plate 25 such as aluminum and a heat insulating material 24 such as glass epoxy resin, and can effectively protect the reinforcing plate from high heat. it can.

  It should be noted that the present invention can be variously modified without departing from the spirit of the present invention, and the present invention naturally extends to the modified ones.

The top view of the mounting jig which concerns on this invention. AA sectional view taken on the line AA of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Flexible printed wiring board 11 Reinforcement board 12 Connector terminal 20 Mounting jig 21 Mounting part 22 Storage part 23 Protective cover 24 Heat insulating material 25 Metal plate for heat insulation

Claims (3)

In a mounting jig for soldering of a flexible printed wiring board formed by adhering a reinforcing plate made of synthetic resin whose thermal deformation temperature is equal to or lower than the melting temperature of solder,
The mounting jig is provided in the mounting portion for inserting a mounting portion formed of a metal having high thermal conductivity and mounting the flexible printed wiring board and a portion to which the reinforcing plate is bonded. A flexible printed wiring board mounting jig comprising: a storage portion; and a protective cover that abuts the storage portion by contacting both sides of the storage portion.   2. The mounting jig for a flexible printed wiring board according to claim 1, wherein the storage portion is an opening hole penetrating in a vertical direction at a predetermined position of the placement portion.   3. The flexible printed wiring board mounting jig according to claim 1, wherein the protective cover is formed by bonding a heat shielding metal plate to the outside of the heat insulating material.

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