JP2008122741A5 - - Google Patents

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Publication number
JP2008122741A5
JP2008122741A5 JP2006307477A JP2006307477A JP2008122741A5 JP 2008122741 A5 JP2008122741 A5 JP 2008122741A5 JP 2006307477 A JP2006307477 A JP 2006307477A JP 2006307477 A JP2006307477 A JP 2006307477A JP 2008122741 A5 JP2008122741 A5 JP 2008122741A5
Authority
JP
Japan
Prior art keywords
optical element
molded body
groove
recess
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006307477A
Other languages
Japanese (ja)
Other versions
JP4986581B2 (en
JP2008122741A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2006307477A priority Critical patent/JP4986581B2/en
Priority claimed from JP2006307477A external-priority patent/JP4986581B2/en
Publication of JP2008122741A publication Critical patent/JP2008122741A/en
Publication of JP2008122741A5 publication Critical patent/JP2008122741A5/ja
Application granted granted Critical
Publication of JP4986581B2 publication Critical patent/JP4986581B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (3)

光素子が実装される表面および裏面を有する樹脂製の成形体からなり、
上記成形体の表面に形成された複数の光ファイバ用の挿入溝と、
上記複数の挿入溝の一端ごとに位置し、且つ上記成形体の表面側に向かって広がるように傾斜する光反射面と、を備え、
記成形体の表面には、実装すべき光素子と導通する電子部品を実装する凹溝または凹部が形成されている光素子用基板であって
上記成形体の表面には、当該光素子用基板が実装される配線基板に形成された外部配線と接続される第2の表面配線が形成され
上記複数の光ファイバ用の挿入溝ごとにおける一端側には、上記成形体の表面に対して直角で且つ垂直なファイバ停止面が、該ファイバ停止面の上辺と光反射面の最低部とが共通するように位置しており
上記凹溝または凹部の深さは、該凹溝または凹部に実装される電子部品の上面と上記成形体の表面とがほぼ面一となるように設定されている
ことを特徴とする光素子用基板。
It consists of a resin molded body having a front surface and a back surface on which the optical element is mounted,
Insert grooves for a plurality of optical fibers formed on the surface of the molded body,
A light reflecting surface that is located at one end of each of the plurality of insertion grooves and is inclined so as to spread toward the surface side of the molded body,
On the surface of the upper Symbol molded body, a substrate for an optical element groove or recess for mounting electronic components to conductive and implementation should do light elements are formed,
A second surface wiring connected to an external wiring formed on the wiring board on which the optical element substrate is mounted is formed on the surface of the molded body ,
A fiber stop surface perpendicular to and perpendicular to the surface of the molded body is provided at one end of each of the plurality of optical fiber insertion grooves, and the upper side of the fiber stop surface and the lowest part of the light reflection surface are common. Is located to
The depth of the groove or recess is set so that the upper surface of the electronic component mounted in the groove or recess and the surface of the molded body are substantially flush with each other .
An optical element substrate characterized by the above.
前記光反射面は、前記光ファイバ用の挿入溝に対し、平面視で直角にして前記表面に形成される反射溝の一部である、
ことを特徴とする請求項1に記載の光素子用基板。
The light reflection surface is a part of a reflection groove formed on the surface at a right angle in a plan view with respect to the insertion groove for the optical fiber.
The optical element substrate according to claim 1.
記成形体の表面には、光反射面または該光反射面を含む反射溝の上方に実装すべき前記光素子と前記凹溝または凹部に実装すべき電子部品とを導通する第1の表面配線が形成されている、
ことを特徴とする請求項1または2に記載に記載の光素子用基板。
On the surface of the pre-Symbol shaped body, a first surface that conducts the electronic components to be mounted and the optical element to be mounted above the reflecting groove including a light reflecting surface or the light reflecting surface to said groove or recess wiring is formed,
The optical element substrate according to claim 1, wherein the substrate is for an optical element.
JP2006307477A 2006-11-14 2006-11-14 Optical device substrate Expired - Fee Related JP4986581B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006307477A JP4986581B2 (en) 2006-11-14 2006-11-14 Optical device substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006307477A JP4986581B2 (en) 2006-11-14 2006-11-14 Optical device substrate

Publications (3)

Publication Number Publication Date
JP2008122741A JP2008122741A (en) 2008-05-29
JP2008122741A5 true JP2008122741A5 (en) 2011-07-07
JP4986581B2 JP4986581B2 (en) 2012-07-25

Family

ID=39507542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006307477A Expired - Fee Related JP4986581B2 (en) 2006-11-14 2006-11-14 Optical device substrate

Country Status (1)

Country Link
JP (1) JP4986581B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9036955B2 (en) * 2011-01-25 2015-05-19 Tyco Electronics Corporation Optical interposer
US8818144B2 (en) 2011-01-25 2014-08-26 Tyco Electronics Corporation Process for preparing an optical interposer for waveguides

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2977338B2 (en) * 1990-09-28 1999-11-15 株式会社東芝 Semiconductor module
US5345527A (en) * 1993-09-03 1994-09-06 Motorola, Inc. Intelligent opto-bus with display
JPH0777634A (en) * 1993-09-09 1995-03-20 Fujitsu Ltd Optical terminal device
JP3064969B2 (en) * 1997-07-03 2000-07-12 日本電気株式会社 Light receiving module and manufacturing method thereof
JP3775069B2 (en) * 1998-09-18 2006-05-17 住友電気工業株式会社 Optical receiver module
JP2001156381A (en) * 1999-11-30 2001-06-08 Kyocera Corp Optical module
JP2002357745A (en) * 2001-05-31 2002-12-13 Kyocera Corp Optical module
JP2004119493A (en) * 2002-09-24 2004-04-15 Sumitomo Electric Ind Ltd Optical module
US7306378B2 (en) * 2004-05-06 2007-12-11 Intel Corporation Method and apparatus providing an electrical-optical coupler
JP2006084891A (en) * 2004-09-17 2006-03-30 Fujikura Ltd Optical connection device

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