JP2008119587A - Cleaning device and cleaning method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To resolve problems of a conventional cleaning device wherein a heat-melting adhesive attached on the surface of a treating object cannot be appropriately removed. <P>SOLUTION: This cleaning device for removing the heat-melting adhesive 101 attached on the surface of a thin plate-like treating object 100, includes: a first front surface spray part 121 spraying a first fluid for removing the adhesive 101 to the front surface of the treating object 100; a first rear surface spray part 131 spraying a second fluid for preventing attachment of the adhesive 101 to a region including at least an outer edge part of the rear surface of the treating object 100; and a first heating part 125 heating the first fluid sprayed by the first front surface spray part 121. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cleaning device or the like that removes a hot-melt adhesive that has adhered to the surface of a thin plate-like object to be processed.

  In recent years, in the manufacture of semiconductor devices, semiconductor wafers (hereinafter referred to as “wafers”) have been made thinner. For the purpose of reinforcing such thin wafers, the wafers can be bonded to a support substrate, for example. (For example, refer to Patent Document 1). In recent years, it has been proposed to use a hot-melt adhesive for such bonding.

  The wafer bonded to the support substrate using such a heat-meltable adhesive is eventually peeled off from the support substrate. However, simply peeling off the wafer peeled off from the support substrate. Since a part of the hot-melt adhesive is attached to the adhesive surface (here, the adhesive surface of the wafer is the surface), it is necessary to remove the adhesive.

  When removing such adhesives, there is no dedicated cleaning device, so manual processing such as immersing the entire wafer in the adhesive solvent or wiping the adhesive with the solvent by hand is required. It was done.

On the other hand, many cleaning apparatuses that perform a cleaning process as part of a semiconductor manufacturing process, such as removal of deposits after etching and peeling of resist residues, have been proposed. For example, there has been a wafer cleaning apparatus that prevents the cleaning liquid from flowing into the non-cleaning surface of the wafer by dropping a cleaning liquid on the upper surface of the wafer and blowing gas from the inside toward the outside on the lower surface of the wafer ( For example, see Patent Document 2).
Japanese Patent Laying-Open No. 2005-51055 (first page, FIG. 1 etc.) JP-A-8-64568 (first page, FIG. 1 etc.)

  However, when the heat-meltable adhesive is removed, when the above-described manual processing is performed, it takes time and the adhesive remains on the surface of the wafer. Various problems have occurred, such as variations in the removal state.

  Further, since the conventional cleaning device as described above is not a cleaning device specialized for removing the hot-melt adhesive, such a cleaning device appropriately removes the hot-melt adhesive. There was a problem that it was not possible. For example, in the cleaning apparatus as described above, since the cleaning is performed with a normal temperature cleaning liquid, the hot-melt adhesive that has solidified at normal temperature cannot be removed properly. Moreover, even if the cleaning liquid is a solvent for the adhesive, the adhesive in a completely solidified state will be removed, so it takes a very long time to remove and cannot be removed efficiently. It was.

  The cleaning device of the present invention is a cleaning device that removes the hot-melt adhesive adhered to the surface of the thin plate-like object to be processed, and is a first device for removing the adhesive on the surface of the object to be processed. A first surface spraying unit that sprays one fluid, and a first back surface spraying unit that sprays a second fluid for preventing adhesion of the adhesive to a region including at least the outer edge of the back surface of the processing object. And a first heating unit that heats the first fluid sprayed by the first surface spraying unit.

  With this configuration, the hot-melt adhesive that has adhered to the surface of the object to be processed can be automatically and appropriately removed. Moreover, it can prevent that the adhesive agent removed from the surface adheres to the back surface of a process target object.

  Further, the cleaning device of the present invention is the cleaning device, wherein the first heating unit heats the first fluid to a temperature at which the adhesive is removed by the first fluid. .

  With this configuration, it is possible to efficiently remove the hot-melt adhesive that has adhered to the surface of the object to be processed.

Further, the cleaning device of the present invention is the cleaning device in the cleaning device, wherein the first heating unit heats the first fluid to a temperature of 30 degrees or more and 50 degrees or less.
With this configuration, the adhesive can be efficiently removed.

  Moreover, the cleaning apparatus of the present invention is the cleaning apparatus further comprising a second heating unit that heats the second fluid sprayed by the first back surface spraying unit.

  With such a configuration, it is possible to reliably prevent the adhesive removed from the front surface from adhering to the back surface of the object to be processed.

  In the cleaning device of the present invention, in the cleaning device, the second heating unit is configured to heat the second fluid to a temperature at which the second fluid can prevent adhesion of the adhesive. Device.

  With such a configuration, it is possible to reliably prevent the adhesive removed from the front surface from adhering to the back surface of the object to be processed.

  The cleaning device of the present invention further includes a holding structure for holding the processing object in the cleaning device, and the holding structure includes a rotation mechanism that rotates while holding the processing object. It is a cleaning device.

  With this configuration, the adhesive can be efficiently removed by centrifugal force.

  Moreover, the cleaning apparatus of the present invention is the cleaning apparatus, wherein the holding structure holds the processing object at an outer edge portion of the processing object.

  With this configuration, the second fluid is sprayed on the entire back surface of the object to be processed, thereby preventing the adhesive that has come around from the outer edge of the object to be processed from adhering to the center of the back surface of the object to be processed. it can. In addition, after cleaning, contamination of the processing object can be prevented by leaving no adhesive or fluid between the back surface of the processing object and the holding structure.

  Moreover, the cleaning apparatus of the present invention is the cleaning apparatus according to the first aspect, wherein the first surface spraying section moves on the object to be processed when the first fluid is sprayed.

  With such a configuration, the first fluid can be sprayed with the same strength as a result on the entire surface of the object to be processed, and the adhesive can be efficiently removed.

  Moreover, the cleaning device of the present invention is the cleaning device in which the first back surface spraying unit sprays the second fluid from the center side to the outside of the processing object.

  With this configuration, it is possible to discharge the adhesive that has entered the back surface from the outer edge of the processing object to the outside of the processing object.

  In the cleaning apparatus of the present invention, the thin plate-like processing object is a processing object that has been bonded to another member by a bonding apparatus using an adhesive having heat melting property. The cleaning apparatus is a processing object peeled off from the other member.

  With such a configuration, the adhesive having a heat melting property that has been used for bonding with other members can be appropriately removed from the object to be processed, and is optimal for a bonding apparatus using a heat melting adhesive. An adhesive cleaning apparatus can be provided.

  Further, the cleaning device of the present invention is the cleaning device, wherein a second surface spraying unit that sprays a fourth fluid for removing the first fluid onto the surface of the processing object, and the processing object. The second fluid is applied to a region including at least an outer edge portion of the rear surface of the object to be processed, and a third surface spraying portion that sprays a fifth fluid for removing the fourth fluid on the surface of the processing object. It is a washing | cleaning apparatus which further comprises the 2nd back surface spraying part which sprays the 3rd fluid for removing.

  With this configuration, it is possible to remove all of the first fluid remaining after the removal of the adhesive from the object to be processed.

The cleaning device of the present invention is the cleaning device, wherein the first fluid is a solvent for the adhesive.
With this configuration, the adhesive can be removed appropriately.

  In the cleaning device of the present invention, the second fluid is a cleaning device in which the second fluid is pure water.

  With this configuration, it is possible to prevent the adhesive from adhering to the back surface of the object to be processed, and it is possible to reduce running costs by using inexpensive pure water.

  According to the cleaning apparatus and the like according to the present invention, the hot-melt adhesive that has adhered to the surface of the object to be processed can be automatically and appropriately removed.

  Hereinafter, embodiments of the cleaning apparatus and the like will be described with reference to the drawings. In addition, since the component which attached | subjected the same code | symbol in embodiment performs the same operation | movement, description may be abbreviate | omitted again.

(Embodiment)
FIG. 1 is a side view for explaining the configuration of the cleaning apparatus in the present embodiment. Moreover, FIG. 2 is the figure which looked at the washing | cleaning apparatus from upper direction for demonstrating the structure of a washing | cleaning apparatus.

  The cleaning apparatus uses the holding structure 110 that holds the thin plate-like processing object 100 and the first fluid for removing the hot-melt adhesive 101 attached to the surface of the processing object 100 as the processing object 100. The first surface spraying part 121 that sprays the first fluid spraying part 121 that sprays the second fluid for removing the adhesive to the region including at least the outer edge part of the back surface of the processing object 100. And a first heating unit 125 that heats the first fluid sprayed by the first surface spray unit 121 and a second heating unit 135 that heats the second fluid sprayed by the first back surface spray unit 131. Yes. In addition, a cover 170 is provided so as to cover the periphery except for the upper side of the processing object 100. Here, it is assumed that the processing object 100 is arranged in the cleaning apparatus so that the surface thereof is the upper surface.

  The thin plate-like processing object 100 used in the specific example of the present embodiment is a processing object in which a hot-melt adhesive 101 is attached to the surface. Specifically, as shown in Patent Document 1, another member (such as a support substrate) is used by using a heat-meltable adhesive 101 by a bonding apparatus that bonds a thin plate and another member. It is a thin plate-like processing target object that has been pasted together (not shown), and is a processing target object peeled off from this support substrate or the like. The hot-melt adhesive 101 that has been used for bonding with other members is attached to the surface that is the bonding surface of the thin plate-like object 100. The processing object 100 may be a thin plate-like processing object, for example, a thin plate-like processing object made of a semiconductor material such as a semiconductor wafer, a printed board made of epoxy resin, or the like. . In the case of a semiconductor wafer, the composition of the material does not matter. As the semiconductor wafer, for example, a wafer having a diameter of about 100 mm to about 300 mm can be used. The heat-meltable adhesive 101 is an adhesive that melts when heat is applied. For example, an adhesive or temporary fixing that can be used for bonding a normal wafer and a support substrate such as wax or grease that solidifies at room temperature. Agents can be used. This adhesive 101 is preferably one that can be attached or peeled off.

  The holding structure 110 includes a support 111 that supports the processing object from below in the vicinity of the peripheral edge of the thin plate-shaped processing object 100 (for example, a range of several tens of millimeters from the periphery of the processing object), and the processing object 100. A clamp 112 for suppressing the protrusion of the processing object 100 and a hollow rotating shaft 116 are provided near the periphery. The rotating shaft 116 is driven by a motor 115 via a belt 114 and a pulley 113. The rotating shaft 116, the belt 114, the pulley 113, and the motor 115 constitute a rotating mechanism that rotates while holding the processing object 100. The rotation speed of the holding structure 110 can be adjusted, for example, in the range of 0 to 1000 rpm. The clamp 112 is attached to the upper portion of the holding structure 110 so that the clamp 112 can be tilted or stood up. By tilting the clamp 112, the processing object 100 is sandwiched between the support 111 and the clamp 112 at the outer edge portion. So that it is held. Note that a gap may be formed between the clamp 112 and the processing object in a state where the processing object 100 is sandwiched. By doing in this way, at the time of cleaning, the processing object is held in a state of being lifted between the support column 111 and the clamp 112, so that the portion where the processing object 100 is held can be cleaned, It is possible to prevent the adhesive or fluid from adhering to or remaining from the held portion. In addition, the structure which inserts | pinches a process target object may be other structures other than the above. Here, a case where three pairs of the support 111 and the clamp 112 are provided will be described, but the number of each is not limited as long as the processing object 100 can be held.

  The first surface spray unit 121 is connected to a container 124 that holds a first fluid via a pipe and a pump 123, and driving the pump 123 allows the fluid in the container 124 to be processed. 100. The first surface spray unit 121 is, for example, a nozzle. The shape of the nozzle is not limited. The fluid has fluidity such as liquid or gas. The first fluid is a liquid or gas fluid used for removing the hot-melt adhesive, for example, a liquid that can be used as a cleaning liquid for the hot-melt adhesive, specifically, an adhesive. It is a solvent. This solvent is, for example, an alcohol solvent such as ethanol or isopropyl alcohol. Here, a case where the first fluid is ethanol will be described as an example. The 1st surface spraying part 121 should just be sprayed with the 1st fluid as a result, or may be made to contact with respect to the whole surface of the process target object 100 to rotate, for example. Further, the first surface spraying part 121 is attached to an area including the upper part of the processing object 100 by an arm 122 so as to be rotatable. The root of the arm 122 is attached to a rotation mechanism 126 configured by a motor, a gear, and the like. By driving the rotation mechanism 126, the arm 122 rotates in the horizontal direction while reciprocating around the root of the arm 122. It is possible to perform a so-called swing operation. In addition, since the structure of such a rotation mechanism 126 is well-known, description is abbreviate | omitted here. Here, the first surface spraying part 121 is positioned substantially on the center of the processing object 100 by adjusting the position of the arm 122.

  The first heating unit 125 is attached to the surface of the container 124 and heats the first fluid in the container 124 to a desired temperature. The first heating unit 125 is, for example, a heater or a heat exchanger. The desired temperature here is, for example, a temperature at which the hot-melt adhesive is removed by the first fluid. The desired temperature can improve the removal performance of the adhesive by, for example, softening or melting the heat-meltable adhesive by heat and activating the molecular mobility of the first fluid. It is possible temperature. However, when the first fluid is vaporized and the liquid is flammable, the desired temperature is preferably equal to or lower than the vaporization temperature of the first fluid. Specifically, when the first fluid is a liquid as described above, the desired temperature is preferably in the range of 20 ° C. to 50 ° C., and more preferably in the range of 30 ° C. to 50 ° C. Preferably, the temperature is around 40 ° C. Moreover, if it is gas which does not have flammability, it is preferable to set it as the temperature of melting | fusing point vicinity of a hot-melt adhesive. In addition, the 1st heating part 125 may be attached anywhere as long as the 1st fluid which the 1st surface spraying part 121 sprays can be heated, for example, the 1st surface spraying part 121, the container 124, It may be provided around the pipe connecting the two.

The first back surface spraying part 131 is connected to the container 134 holding the second fluid via the pipe and the pump 133, and by driving the pump 133, the second fluid in the container 134 is It sprays on the area | region including the at least outer periphery part vicinity of the process target object 100 from the 1st back surface spraying part 131. FIG. However, here, even if the second fluid is not sprayed directly in the vicinity of the outer edge portion, as a result, if the second fluid spreads in the vicinity of the outer edge portion, the second fluid is introduced into the region including the vicinity of the outer edge portion. Think of a fluid spray. The 1st back surface spraying part 131 is a nozzle, for example. You may make it spray a 2nd fluid on the whole back surface. The outer edge is an area within several tens of millimeters from the outer edge of the object to be processed. The shape of the nozzle is not limited. Here, as an example, the first back surface spraying part 131 is provided near the center on the back surface side of the processing object 100. The direction in which the first back surface spraying part 131 sprays the second fluid is adjusted in the direction toward the center side or the outside of the processing object 100, so that the adhesive removed by the second fluid is the processing target. It is preferable in order not to reattach to the back surface of the object 100. The second fluid is removed from the surface of the processing object 100 by the first fluid, and is a liquid or gas used to prevent the adhesion of the hot-melt adhesive that has entered the back surface of the processing object 100. It is a fluid. Since this fluid is already removed by the first fluid and the flowing adhesive is removed again, it is not particularly necessary to use an adhesive solvent or the like as in the first fluid. For this reason, for example, pure water or the like can be used. However, an adhesive solvent or the like may be used. Further, an inert gas such as N ₂ (nitrogen) gas or a gas such as dry air may be used. Here, as an example, a case where the second fluid is pure water will be described as an example.

  The second heating unit 135 is attached to the surface of the container 134 and heats the first fluid in the container 134 to a desired temperature. The second heating unit 135 is, for example, a heater or a heat exchanger. The desired temperature here means, for example, that the second fluid is removed when the hot-melt adhesive removed by the first fluid wraps around the back surface of the object to be processed. Or a temperature at which it can be prevented from adhering to the back surface. The desired temperature can improve the removal performance of the adhesive by, for example, softening or melting the heat-meltable adhesive with heat and activating the molecular mobility of the second fluid. It is possible temperature. However, when the second fluid is vaporized and the liquid is flammable, the desired temperature is preferably equal to or lower than the vaporization temperature of the second fluid. Specifically, when the first fluid is a liquid as described above, the desired temperature is preferably in the range of 20 ° C. to 50 ° C., more preferably around 40 ° C. Moreover, as long as it is gas which does not have flammability, the temperature near melting | fusing point of a heat-meltable adhesive agent may be sufficient. In addition, the 2nd heating part 135 may be attached anywhere as long as the 2nd fluid which the 1st back surface spraying part 131 sprays can be heated, for example, the 1st back surface spraying part 131, the container 134, and It may be provided around the pipe connecting the two. In addition, since the adhesive that wraps around the back surface of the object to be processed has already been peeled off from the object to be processed by the first fluid, it can be easily removed. It may be omitted and the second fluid may not be heated.

  Moreover, in this Embodiment, the washing | cleaning apparatus is the 2nd back surface spraying part 141 which sprays the 3rd fluid on the back surface of the process target object 100, and the 2nd surface which sprays the 4th fluid on the surface of the process target object 100. The spraying part 151 and the 3rd surface spraying part 161 which sprays the 5th fluid on the surface of the process target object 100 are provided.

The second back surface spraying unit 141 sprays the third fluid supplied through the piping onto the back surface of the processing object 100. The 2nd back surface spraying part 141 is a nozzle, for example. The shape of the nozzle is not limited. Specifically, this third fluid is an inert gas such as N ₂ gas or a gas such as dry air for blowing off the second fluid and drying it. Further, the second back surface spraying portion 141 is provided near the center of the back surface side of the processing object 100. The direction in which the second back surface spraying part 141 sprays the third fluid is adjusted so that the direction toward the center side or the outside of the processing object 100 is adjusted. It is preferable in order not to reattach to the back surface of the processing object 100.

  In addition, you may make it utilize the structure which supplies the 1st back surface spraying part 131 and a fluid to this in order to spray a 3rd fluid. In this case, the third fluid may be considered as the second fluid.

  Further, the second back surface spraying portion 141 is omitted, and a valve or the like that can switch the supply of the second fluid and the third fluid to the first back surface spraying portion 131 is provided. These fluids may be appropriately switched and sprayed from the first back surface spraying part 131.

  The second surface spraying unit 151 is connected to a container 154 that holds the fourth fluid via a pipe and a pump 153, and the pump 153 is driven to transfer the fluid in the container 154 to the object to be processed. Spray on 100 surfaces. The second surface spraying part 151 has the same structure as the first surface spraying part 121. The second surface spray unit 151 is, for example, a nozzle. The shape of the nozzle is not limited. Specifically, the fourth fluid is a fluid such as pure water for washing away the first fluid described above. Here, a case where the fourth fluid is pure water will be described as an example. Further, the second surface spraying portion 151 is attached to the region including the upper portion of the processing object 100 by the arm 152 so as to be rotatable. The root of the arm 152 is attached to a rotation mechanism (not shown) like the arm 122, and the rotation mechanism can be driven to perform a swing operation. Here, the second surface spraying section 151 is positioned substantially on the center of the processing object 100 by adjusting the position of the arm 152.

The third surface spraying unit 161 is specifically a nozzle, and sprays the fifth fluid supplied through the piping onto the surface of the processing object 100. The third surface spraying part 161 has the same structure as the second surface spraying part 151. The third surface spray unit 161 is, for example, a nozzle. The shape of the nozzle is not limited. Specifically, the fifth fluid is an inert gas such as N ₂ gas or a gas such as dry air for blowing off the fourth fluid for drying. Further, the third surface spraying part 161 is attached to an area including the upper part of the processing object 100 by an arm 162 so as to be rotatable. The root of the arm 162 is attached to a rotation mechanism (not shown), like the arm 122, and the swing mechanism can be driven by driving the rotation mechanism. Here, the third surface spraying part 161 is positioned substantially on the center of the processing object 100 by adjusting the position of the arm 162.

  In addition, you may make it utilize the structure which supplies the 1st surface spraying part 121 and a fluid to this in order to spray a 4th fluid or a 5th fluid. In this case, the fourth fluid or the fifth fluid may be considered as the first fluid.

  Moreover, the 2nd surface spraying part 151 and the 3rd surface spraying part 161 are abbreviate | omitted, and supply to the 1st surface spraying part 121 of the 1st fluid, the 4th fluid, and the 5th fluid can be switched. You may make it spray from the 1st surface spraying part 121 by providing a valve etc., switching suitably the 1st fluid, the 4th fluid, and the 5th fluid.

  Next, operation | movement of a washing | cleaning apparatus is demonstrated using FIGS. 3 to 5 are perspective views of main parts for explaining the operation of the cleaning apparatus.

  First, an adhesive cleaning process using the first front surface spraying part 121 and the first back surface spraying part 131 is performed. Hereinafter, this cleaning process will be described. Here, a case where the adhesive 101 is wax, the first fluid is ethanol, and the second fluid is pure water will be described as an example.

  First, as shown in FIG. 3, a thin plate-like processing object 100 peeled off from a support substrate (not shown) or the like, here a wafer having a diameter of about 200 mm as an example, a support column with the surface as an adhesive surface as an upper surface. Then, the clamp 112 is tilted and held on the holding structure 110. And the 1st surface spraying part 121 is moved to the center part of the process target object 100. FIG.

  Next, the motor 115 is driven, the holding structure 110 is rotated, and the processing object 100 is rotated. Here, the rotation speed is 50 rpm as an example. The rotational speed may be other than 50 rpm. However, in this process, if the rotational speed is too fast, the first fluid is immediately repelled from the processing object 100 by centrifugal force, and the processing object 100. It is preferable not to perform high-speed rotation because the time for staying on the surface of the film becomes short and the adhesive is not sufficiently removed.

  Next, the pump 123 is driven to spray ethanol, which is the first fluid heated to about 40 ° C. by the first heating unit 125, from the first surface spraying unit 121 onto the surface of the processing object 100. By spraying the first fluid, the adhesive 101 that has been peeled off or melted by the first fluid is removed from the processing object 100 together with the heated first fluid by the spraying force and the centrifugal force. Is done. The flow rate of the first fluid is about 1 liter / minute. In addition, when spraying, you may perform the swing operation | movement of the 1st surface spray part 121 above the process target object 100. FIG. By performing the swing operation, the first fluid can be sprayed on the entire surface of the processing object with the same strength, and the adhesive can be efficiently removed.

  At the same time, the pump 133 is driven and pure water, which is the second fluid heated from the first back surface spraying part 131 to the back surface of the processing object 100 by the second heating part 135 to about 40 ° C. Spray. The flow rate of the second fluid is about 1.5 liters / minute. By spraying the second fluid, the adhesive 101 that has been removed from the surface of the processing object 100 and is about to wrap around from the edge of the processing object 100 to the back surface of the processing object 100 together with the first fluid. It is removed from the back surface of the object to be processed 100 by the force of spraying the second fluid and the centrifugal force.

  After about 15 seconds to 1 minute from the start of spraying the first fluid and the second fluid, the spraying is finished, and the first surface spraying part 121 is moved from the top of the processing object 100 to complete the processing. To do. By this process, the adhesive having the heat melting property is removed from the surface of the processing object 100. Further, the removed adhesive can be prevented from adhering to the back surface of the processing object 100.

  Next, a process of removing the first fluid using the second front surface spraying part 151 and the first back surface spraying part 131, that is, a so-called rinse process is performed on the processing object 100 after the cleaning process. Hereinafter, this rinse process will be described. Here, as an example, a case where the fourth fluid is pure water will be described.

  First, as shown in FIG. 4, the second surface spray unit 151 is moved to the center of the processing object 100, the motor 115 is driven, the holding structure 110 is rotated, and the processing object 100 is rotated. . Note that at the end of the cleaning process, only the rotation speed may be appropriately adjusted without ending the rotation. Here, the rotation speed is 50 rpm as an example.

  Next, the pump 153 is driven to spray pure water as the fourth fluid from the second surface spray unit 151 onto the surface of the processing object 100. Since this process is a process of removing the first fluid from the front and back surfaces of the processing object 100, it is not necessary to heat the fourth fluid. The flow rate of the fourth fluid is about 1 liter / minute. By spraying the fourth fluid, the first fluid remaining on the surface of the processing object 100 is removed from the processing object 100 together with the fourth fluid by the spraying force and the centrifugal force. In addition, when spraying, you may make the 2nd surface spraying part 151 swing above the process target object 100. FIG. By performing the swing operation, the fourth fluid can be sprayed to the entire surface of the processing object 100 with the same strength, and the first fluid can be efficiently removed.

  At the same time, the pump 133 is driven to spray pure water, which is the second fluid, from the first back surface spray unit 131 to the back surface of the processing object 100. At this time, the second fluid may or may not be heated. The flow rate of the second fluid is about 1.5 liters / minute. By spraying the second fluid, the first fluid removed from the surface of the processing object 100 that has tried to wrap around from the edge of the processing object 100 to the back surface of the processing object 100 is the second fluid. It is removed from the back surface of the processing object 100 by the spraying force and the centrifugal force.

  After about 15 seconds to 1 minute from the start of spraying the fourth fluid and the second fluid, the spraying is finished, the second surface spraying part 151 is moved from above the processing object 100, and the processing is finished. To do. As the first fluid, a solvent is usually used. However, it is preferable that such a solvent does not remain in order to maintain the quality of a processing object such as a wafer at a high quality. In the present embodiment, the first fluid used for removing the adhesive 101 having the heat melting property can be removed from the surface of the processing object 100 by such a rinsing process. Further, the first fluid removed from the front surface of the processing object 100 can be prevented from adhering to the back surface of the processing object 100.

Next, with respect to the processing object 100 after the rinsing process, a process of removing pure water as the second and fourth fluids using the third surface spraying part 161 and the second back surface spraying part 141, A so-called blow process is performed. Hereinafter, the blow process will be described. Here, the case where the third and fifth fluids are N ₂ gas will be described as an example.

  First, as shown in FIG. 5, the third surface spray unit 161 is moved to the center of the processing object 100, the motor 115 is driven, the holding structure 110 is rotated, and the processing object 100 is rotated. . Note that, at the end of the rinsing process, only the rotation speed may be appropriately adjusted without ending the rotation. Here, the rotation speed is 800 rpm as an example. Although the rotational speed may be other than 800 rpm, the high-speed rotation is preferable here because the second and fourth fluids adhering to the object to be processed can be removed by centrifugal force.

Then, by supplying N ₂ gas to the third surface spray unit 161, a third surface spray unit 161, to the surface of the processing object 100, blowing N ₂ gas which is the fifth fluid. The blow process is a process of removing pure water, which is the fourth fluid, from the front and back surfaces of the processing object 100 by blowing it off or drying it, so there is no need to heat the fifth fluid. However, this fluid is heated by providing a heating unit (not shown) similar to the first heating unit 125 and the like, so that the fourth fluid can be easily dried and the time for removing the fourth fluid is shortened. it can. The flow rate of the fifth fluid is about 1 liter / minute. By spraying the fifth fluid, the fourth fluid remaining on the surface of the processing object 100 is blown off from the processing object 100 and removed by the spraying force and the centrifugal force. In addition, when spraying, you may make the 3rd surface spraying part 161 swing-process above the process target object 100. FIG. By performing the swing operation, the fifth fluid can be sprayed to the entire surface of the processing object 100 with the same strength, and the fourth fluid can be efficiently removed.

At the same time, N ₂ gas is supplied to the second back surface spraying unit 141, and N ₂ gas that is the third fluid is sprayed from the second back surface spraying unit 141 to the back surface of the processing object 100. . The flow rate of the third fluid is about 1.5 liters / minute. By spraying the third fluid, the second fluid remaining on the back surface of the processing object 100 is blown off by the spraying force and centrifugal force of the third fluid, and is removed from the back surface of the processing object 100. .

  After about 5 to 15 seconds have elapsed from the start of spraying the third fluid and the fifth fluid, the spraying is terminated, and the third surface spraying part 161 is moved from the top of the processing object 100 to complete the processing. To do. By such a blow process, the second fluid and the fourth fluid can be removed from the surface of the processing object 100, and the time for drying the processing object can be shortened.

  The combination of the first to fifth fluids shown above, the flow rate of each fluid in each process, the heating temperature, the rotation speed of the holding structure 110, the processing time of each process, etc. are merely examples, The heat-meltable adhesive 101 to be used can be appropriately changed so as to have an optimum value according to the material, the amount, the size of the object to be processed, or the like.

  In both the cleaning process and the rinsing process, the second fluid is sprayed onto the back surface of the processing object 100 such as the first back surface spraying part 131. However, in the present invention, as a structure for spraying the second fluid used in each process, a structure for spraying the second fluid including the first back surface spraying portion 131 as described above may be provided individually. In this case, the second fluid used for the cleaning treatment and the second fluid used for the rinsing treatment may be different from each other. At this time, in the structure in which the second fluid used for the rinsing process is sprayed, it is not necessary to provide a heating unit for heating the second fluid.

  As described above, in the present embodiment, the heated first fluid is sprayed to remove the hot-melt adhesive on the surface of the object to be processed. It becomes possible to remove the meltable adhesive.

  Further, in the present embodiment, it is possible to automatically remove the hot-melt adhesive without performing a manual process, and it is possible to reduce the labor required for removing the adhesive and Variations in the removal state can be eliminated. This also makes it possible to provide an automatic cleaning device specialized for removing hot-melt adhesive.

  In addition, since the second fluid is sprayed on the outer edge portion of the back surface of the object to be processed, in order to remove the adhesive that wraps around along with the first fluid from the surface to the region including at least the outer edge portion, It is possible to prevent the back surface of the processing object from being contaminated by an adhesive or the like. For example, if the object to be processed is a semiconductor wafer, the device is usually formed on the back surface side not bonded to the support substrate of the object to be processed described in the present application, so that the quality of the device is ensured. In order to do so, it is necessary to prevent the back surface of the processing object from being contaminated. Therefore, the quality of the device can be maintained by spraying the second fluid onto the back surface of the object to be processed as in the present embodiment.

  Further, since the processing object 100 is held by the outer edge portion by the holding structure 110, the second fluid or the like can be sprayed on the entire back surface of the processing object 100, and the processing object 100 can be sprayed from the outer edge of the processing object 100. It is possible to prevent the wraparound adhesive from adhering to the central portion of the back surface of the processing object 100. In addition, after the cleaning, the processing object 100 can be prevented from being soiled by preventing the adhesive 101 and fluid from remaining between the back surface of the processing object 100 and the holding structure 110.

  In the above embodiment, the processing object 100 is supported from below by the support 111, but in this embodiment, for example, the processing object 100 is mounted on a table-like mounting table (not shown). You may make it mount on top. However, such a mounting table needs to have a shape that allows fluid to be sprayed to the outer edge of the processing object 100. For example, it is preferable that the outer edge of the mounting table has a shape located on the inner side of the outer edge portion of the processing object 100. However, when such a mounting table is used, fluid or adhesive is likely to remain between the mounting table and the object to be processed. It is preferable to make the shape difficult to remain.

  In addition, the fluid, the flow rate, the heating temperature, the rotation speed of the holding structure, the processing time, and the like described in the above embodiment are examples, and the material, structure, size, and heat of the processing target to be cleaned Needless to say, it can be appropriately changed depending on the material of the meltable adhesive.

  In the present embodiment, the holding structure 110 is rotated to perform the cleaning process, the rinse process, and the blow process. However, the holding structure 110 may not be rotated. However, in this case, since the adhesive and fluid are not removed by centrifugal force, it is necessary to remove the adhesive, etc., just after the fluid is sprayed, so adjust the flow rate of the fluid, the direction of spraying, the shape of the nozzle, etc. There is a need to.

  The present invention is not limited to the above-described embodiments, and various modifications are possible, and it goes without saying that these are also included in the scope of the present invention.

  As described above, the cleaning device and the like according to the present invention are suitable as a cleaning device that removes the hot-melt adhesive adhered to the surface of the object to be processed. This is useful as a cleaning device or the like for cleaning the surface which is the bonding surface of the processing object bonded to the member.

The figure seen from the side surface for demonstrating the structure of the washing | cleaning apparatus in embodiment The figure seen from the upper surface for demonstrating the structure of the washing | cleaning apparatus The perspective view of the principal part for demonstrating operation | movement of the washing | cleaning apparatus The perspective view of the principal part for demonstrating operation | movement of the washing | cleaning apparatus The perspective view of the principal part for demonstrating operation | movement of the washing | cleaning apparatus

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Processing object 101 Adhesive 110 Holding structure 111 Support | pillar 112 Clamp 113 Pulley 114 Belt 115 Motor 116 Rotating shaft 121 First surface spray part 122, 152, 162 Arm 123, 133, 153 Pump 124, 134, 154 Container 125 First One heating part 126 Rotating mechanism 131 First back surface spraying part 135 Second heating part 141 Second back surface spraying part 151 Second surface spraying part 161 Third surface spraying part 170 Cover

Claims (15)

A cleaning device that removes a hot-melt adhesive adhering to the surface of a thin plate-like object to be processed,
A first surface spraying unit that sprays a first fluid for removing the adhesive on the surface of the processing object;
A first back surface spraying portion that sprays a second fluid for preventing adhesion of the adhesive to a region including at least an outer edge portion of the back surface of the processing object;
A cleaning apparatus comprising: a first heating unit that heats the first fluid sprayed by the first surface spraying unit. The cleaning device according to claim 1, wherein the first heating unit heats the first fluid to a temperature at which the adhesive is removed by the first fluid. The cleaning apparatus according to claim 1, wherein the first heating unit heats the first fluid so as to have a temperature of 30 degrees or more and 50 degrees or less. The said cleaning apparatus is a cleaning apparatus in any one of Claims 1-3 further equipped with the 2nd heating part which heats said 2nd fluid which said 1st back surface spraying part sprays. The cleaning device according to claim 4, wherein the second heating unit heats the second fluid to a temperature at which the second fluid can prevent adhesion of the adhesive. 6. The cleaning apparatus further includes a holding structure that holds the processing object, and the holding structure includes a rotation mechanism that rotates in a state where the processing object is held. Any of the cleaning apparatuses. The cleaning apparatus according to claim 6, wherein the holding structure holds the processing object at an outer edge portion of the processing object. The cleaning apparatus according to any one of claims 1 to 7, wherein the first surface spraying unit moves on the processing object when spraying the first fluid. The cleaning device according to any one of claims 1 to 8, wherein the first back surface spraying unit sprays the second fluid from the center side to the outside of the processing object. The thin plate-like processing object is a processing object that has been bonded to another member by a bonding apparatus using an adhesive having heat melting properties, and has been peeled off from the other member. The cleaning apparatus according to any one of claims 1 to 9, wherein A second surface spraying unit that sprays a fourth fluid for removing the first fluid on the surface of the processing object;
A third surface spraying unit that sprays a fifth fluid for removing the fourth fluid on the surface of the processing object;
The second back surface spraying section for spraying a third fluid for removing the second fluid to a region including at least an outer edge portion of the back surface of the processing object. Any of the cleaning apparatuses. The cleaning apparatus according to claim 1, wherein the first fluid is a solvent for the adhesive. The cleaning apparatus according to any one of claims 1 to 12, wherein the second fluid is pure water. A cleaning method for removing a hot-melt adhesive adhering to the surface of a thin plate-like object to be processed,
A heating step of heating the first fluid for removing the adhesive;
The heated first fluid is sprayed on the surface of the processing object, and a second fluid for preventing adhesion of the adhesive is sprayed on a region including at least the outer edge of the back surface of the processing object. A cleaning process step. After the washing step,
Rinse for spraying the fourth fluid for removing the first fluid onto the surface of the object to be treated and for spraying the second fluid to a region including at least the outer edge of the back surface of the object to be treated Processing steps;
A fifth fluid for removing the fourth fluid is sprayed on the surface of the processing object, and the second fluid is removed in a region including at least the outer edge of the back surface of the processing object. The cleaning method according to claim 14, further comprising: a blow processing step of spraying a third fluid for the purpose.

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