JP2008116969A - Liquid crystal panel, and device for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal panel in which local weakening of mechanical strength is prevented and unexpected exfoliation of a polarizer plate can be inhibited. <P>SOLUTION: The liquid crystal panel 350 includes: a pair of substrate cells 351a and 351b bonded together with liquid crystal sealed in between; and polarizer plates 352a and 352b bonded to the outer surfaces of the substrate cells 351a and 351b, respectively, wherein: one end of the substrate cell 351a protrudes from one end of the substrate cell 351b; connection terminals 353 for driving the liquid crystal panel are formed on the inner surface of a protruding portion 351aa; and the polarizer plate 352a is made to extend to the outer surface of the protruding portion 351aa. Moreover, the edges 352aa and 352ba of the polarizer plates 352a and 352b, respectively, are all so formed as to have a vertical section that becomes thinner and thinner toward the substrate cells 351a and 351b. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a liquid crystal panel in which a polarizing plate is bonded to each outer surface of a pair of substrate cells that are bonded to each other and liquid crystal is sealed between them, and a liquid crystal that is bonded to each other to form a liquid crystal. The present invention relates to an apparatus for manufacturing a liquid crystal panel, which has a plurality of glass substrate substrates adjacent to each other and divides a glass substrate having a polarizing plate attached on both sides to obtain a plurality of liquid crystal panels.

  Conventionally, as a method for dividing a glass substrate, the glass substrate is fixed on the stage of the cutting apparatus by means such as vacuum adsorption, and the outer peripheral portion is made of cemented carbide, diamond or the like on one side of the glass substrate. With a wheel-shaped cutter formed of a hard member, a linear streak called a scribe (hereinafter sometimes referred to as “crack”) is applied, and pressed from the opposite surface side, or a rolling roller, etc. A so-called scribing method is generally used in which pressing is performed along the scribe line by the pressing means, and cracks in the direction perpendicular to the substrate surface generated in the scribe grooves of the glass substrate are developed and cut.

  In recent years, in liquid crystal display elements and similar display devices, large-sized glass substrate materials in which transparent electrodes such as ITO films, thin films such as insulating films and alignment films are formed on the surface in advance for the purpose of manufacturing products at low cost. Is divided into a desired size and shape. In the division of the glass substrate on which this film formation layer (hereinafter sometimes referred to as “film formation”) is formed, various problems that could not occur with the conventional glass substrate scribing method arise. For example, if scribing is performed on the film forming surface side, the film forming in the vicinity of the scribe line is broken and scattered as fine particle dust, causing a quality defect. Further, in the method of scribing on the opposite surface where the film is not formed, the film formation surface is brought into contact with the mounting table of the cutting apparatus, so that the film is damaged or deformed.

  For such inconvenience, there is a conventional example in which a large-sized glass substrate on which a film has been formed is scribed in a strip shape with a predetermined dimension (for example, Patent Document 1). The content is intended to solve the above disadvantages by scribing the glass surface opposite to the film formation surface.

  A conventional example will be described with reference to FIG. The glass substrate 101 has a film formation 102 formed on one side, and the film formation 102 is fixed on the upper surface of a surface plate 103 which is a mounting table by suction means such as a vacuum (not shown). The platen 103 is provided with linear openings 104 at a predetermined interval, and the scribe means 105 that is a crack forming means for forming a scribe, that is, a crack, moves along the opening 104, and is made of glass. A scribe is applied to the lower surface of the substrate 101. The push-out means 106 is a means such as an air cylinder that guides the glass substrate 101 to a predetermined position together with the positioning means 107. The push-out pin 110 is arranged at the tip, and the positioning pin 111 is also arranged at the tip of the positioning means 107. Has been. The pressing unit 109 is a unit for applying a load to the upper surface of the surface plate 103 from the film forming surface side to press the glass substrate 101.

  Next, the operation will be described. When the surface plate 103 is positioned at a point indicated by a dotted line, after the glass substrate 101 is placed by a transport device (not shown), a positioning pin at the tip of the positioning means 107 is also received by an alignment signal from a control means (not shown). 111 descends on the surface of the surface plate 103. Next, the push pin 110 at the tip of the push means 106 is extended and moved in the direction of the arrow until the glass substrate 101 on the surface plate 103 hits the positioning pin 111, and the cutting position of the glass substrate 101 and the opening 104 are moved. Perform alignment. Next, the control means instructs the suction of the glass substrate 101 to the surface plate 103, moves the pressing means 109 to the scribe position, applies a pressing force to the upper surface of the glass substrate 101, and then instructs the scribe means 105. Then, scribing is performed on the lower surface of the glass substrate 101. The scribing means 105 moves at every scribing interval, that is, every pitch of the opening 104, and repeats scribing. Since this is a method of scribing from the lower surface of the glass substrate 101 through the opening 104 formed in the surface plate 103, only the force for adsorbing and fixing the glass substrate 101 to the surface plate 103 by the adsorbing means against the scribe load of the scribing means 105. In order to compensate for this, a downward load is applied by the pressing means 109 from the glass substrate deposition surface side.

  However, the scribing method (slicing method) and scribing device (slicing device) according to the above-described conventional example mainly assume the cutting of a glass substrate in which a protective film is formed on a large plate glass, but the formation of thin films such as ITO films. In the glass substrate thus formed, in the holding means using a weight-like general load application as shown by 109 in FIG. 52 for balancing with the scribe load from the lower surface side, the thin film is broken by the load of the holding means itself. There was a problem that.

  In addition, for the purpose of further reducing the cost of liquid crystal display elements, a method of dividing a film formed in the state of a large glass material, such as laminating films such as a polarizing plate and a protective sheet, which has been performed after dividing the glass substrate Has been tried. Conventionally, polarizing plates are generally attached to the outer surfaces of upper and lower glass substrates at the end of the liquid crystal cell manufacturing process, which is an obstacle to cost reduction in terms of alignment with glass substrates and simplification of work processes. It was.

  In a thin film such as an ITO film, the thickness of the film formation layer is within a few μm, but in the case of a film layer such as a polarizing plate, the thickness is about 10 μm to 0.6 mm. In the scribing of the glass substrate on which such a film layer is formed, it is impossible to scribe directly from the film forming surface side. In the cutting method and the cutting apparatus shown in the above conventional example, cutting is impossible due to the presence of the film layer in the cutting step after scribing.

  On the other hand, in particular, when manufacturing a small and medium-sized liquid crystal panel up to about 5 inches in size, first, a large glass substrate bonded to each other is divided to collect a strip-shaped glass substrate, and then this strip-shaped glass substrate is collected. A glass substrate is subjected to predetermined treatments such as liquid crystal injection and sealing, and further divided into cells of a predetermined panel size to form a plurality of single cells, and then a polarizing plate is attached to each single cell. The technique of obtaining multiple panels was common.

  Here, a liquid crystal panel obtained by using this conventional method will be described with reference to FIG. FIGS. 53A and 53B are perspective views showing the external appearance of a conventional liquid crystal panel, where FIG. 53A shows the front side and FIG. 53B shows the back side. The liquid crystal panel 550 is composed of a pair of substrate cells 551a and 551b that are bonded to each other and sealed with a liquid crystal, and one side of one substrate cell 551a protrudes from one side of the other substrate cell 551b. A connection terminal 553 for driving the liquid crystal panel is formed on the inner surface of the protrusion 551aa. Further, polarizing plates 552a and 552b are attached to the outer surfaces of the respective substrate cells 551a and 551b so as to cover a display region (not shown). In the case of a liquid crystal panel applied to a so-called backlight type liquid crystal display device that transmits light from a light source for display, these polarizing plates 552a and 552b have substantially the same size, and are just substrates. The cells 551a and 551b are disposed opposite to each other.

  By the way, in said conventional method, since it is necessary to stick a polarizing plate separately for every cell single item, there exists a problem that production efficiency is very bad. Even if pasting is performed using a dedicated device, the increase in the processing speed per polarizing plate is restricted due to the influence of static electricity in particular (generally it requires at least about 8 seconds to 10 seconds). In response to market demands for securing a high production volume (number of liquid crystal panels), a large number of devices are required to process a large number of polarizing plates in parallel, which greatly increases capital investment. There arises a problem that the cost of the liquid crystal panel as the final product is increased.

As a technique for avoiding such a problem, a liquid crystal panel in which a polarizing plate provided with a cut for dividing at a predetermined position is attached to a plastic substrate, and then the plastic substrate is divided using the cut as a guide to obtain a plurality of liquid crystal panels. There exists a manufacturing method (for example, patent document 2). According to this method, since the polarizing plate is attached to the substrate before dividing, the number of attaching steps of the polarizing plate itself can be significantly reduced, and the production efficiency can be improved without making a significant capital investment.
Japanese Patent Laid-Open No. 11-64834 (mainly specification) JP-A-6-342139

  However, the above method has the following problems. First, the polarizing plate itself is obtained by coating polyvinyl alcohol with cellulose triacetate with a sand or acrylic resin, and the thickness of the polarizing plate is about 0.2 mm to 0.6 mm. If the cut is provided, the cut is easily deformed by an inadvertent load, and there is a possibility that the polarizing plate may be bent or broken eventually. Especially when affixing to a substrate, it is necessary to appropriately affix it so that a break is located at a predetermined position of the substrate while suppressing its bending and breakage, so a device with considerable accuracy must be prepared. Therefore, it cannot be said to be advantageous for cost reduction of the liquid crystal panel.

  Secondly, when the substrate is divided, the polarizing plate itself is also divided (even when divided along the cut, the polarizing plates existing at both ends of the cut are divided), but the substrate is particularly brittle. When a glass substrate is applied, the properties of the substrate and the polarizing plate are completely different. And so on. In other words, it is extremely difficult to divide without degrading the quality, and there remains a problem with this dividing method. In Patent Document 2, since a plastic substrate that is of the same type as the polarizing plate is used as the substrate, it can be said that no particular consideration is given to the dividing method.

  On the other hand, in the conventional liquid crystal panel shown in FIG. 53, since the individual thicknesses of the substrate cells 551a and 551b are thin (for example, about 0.4 mm to 0.7 mm in the case of glass), the strength is particularly low in the protrusion 551aa. It can be said that it is in the situation. Accordingly, when the liquid crystal panel is transported or incorporated into the liquid crystal display device, if it is bumped or dropped carelessly, breakage or deformation at the protrusion 551aa or damage at the corner of the protrusion 551aa occurs. Careful handling is required.

  In recent years, the function of the polarizing plate itself is increasing, and the polarizing plate is formed by laminating sheets having various optical characteristics. For this reason, there are many cases where burrs, burrs, etc. are generated on the periphery of the polarizing plate attached to the substrate cell, which makes it difficult to assemble to the liquid crystal display device, or the polarizing plate is removed from the substrate cell. It may come off carelessly. Furthermore, when a protective film that can be peeled off on the outer surface of the polarizing plate is laminated integrally with the polarizing plate, the film is inadvertently removed from the polarizing plate when the liquid crystal panel is transported or incorporated into a liquid crystal display device. There is also a problem of peeling and scratching the polarizing plate itself.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a liquid crystal panel that can prevent a local strength decrease and suppress an inadvertent peeling of a polarizing plate. In addition to this, in order to improve the production efficiency of the liquid crystal panel, in the liquid crystal panel manufacturing apparatus that obtains a plurality of liquid crystal panels by dividing the glass substrate on which the polarizing plate is bonded, the above is performed without breaking the quality. It is to obtain a liquid crystal panel.

  The present invention provides a liquid crystal panel in which a polarizing plate is attached to each outer surface of a pair of substrate cells that are bonded to each other and liquid crystal is sealed between them, and at least one side of the one substrate cell is the other of the other substrate cells. It protrudes from at least one side of the substrate cell, a connection terminal for driving a liquid crystal panel is formed on the inner surface of the protruding portion, and the polarizing plate extends on the outer surface of the protruding portion.

  In addition, the periphery of each polarizing plate is within 1 mm inside the periphery of each substrate cell.

  Further, the present invention provides a liquid crystal panel in which a polarizing plate is attached to each outer surface of a pair of substrate cells that are bonded to each other and liquid crystal is sealed between each other. It is characterized in that the cross section tapers toward the substrate cell.

  In addition, each of the end faces is inclined with respect to the outer surface of each of the substrate cells to be more than 90 ° and not more than 135 °.

  Moreover, the protective film which can peel on the outer surface of each said polarizing plate is laminated | stacked integrally with each said polarizing plate, It is characterized by the above-mentioned.

  The present invention also divides a glass substrate having a plurality of adjacent glass substrate cells bonded to each other and encapsulating liquid crystal between them and having polarizing plates attached to both surfaces. In the liquid crystal panel manufacturing apparatus for obtaining a plurality of liquid crystal panels having the above-described configuration, a glass substrate exposing means for removing a part of the polarizing plate in a strip shape to expose the glass substrate in a strip shape, and the glass substrate exposing means And a crack forming means for forming a crack for splitting along the strip-shaped region of the glass substrate that is exposed, and the glass substrate is split along the crack.

  Further, the glass substrate exposing means is a laser irradiation mechanism for irradiating the polarizing plate with a laser.

  Further, the crack forming means is a gas injection mechanism that injects a quenching gas into a band-like region of the glass substrate heated by the laser irradiation.

  Further, the glass substrate exposing means is a cutting mechanism for cutting and removing a part of the polarizing plate.

  Further, the cutting mechanism is constituted by a blade that cuts a part of the polarizing plate into a strip shape, and the cross-sectional shape of the cutting edge is any one of a U-shape, a trapezoidal shape, a semicircular shape, or a circular shape. It is characterized by.

  Further, the cutting mechanism is disposed between the first and second blades that are opposed to each other at a predetermined interval and cut a part of the polarizing plate into a strip shape, and the first and second blades. And a third blade that scrapes the band-shaped portion of the polarizing plate cut by the second blade from the glass substrate.

  Further, the predetermined interval is set within a range of 1 mm to 3 mm.

  The first and second blades are a pair of wheel cutters that are coaxially integrated, and the blade edge angle is set within a range of 30 ° to 90 °.

  Moreover, the diameter of the wheel cutter which comprises the said 1st, 2nd cutter is set in the range of 5 mm-10 mm, It is characterized by the above-mentioned.

  Further, the first and second blades are blades that are relatively movable only in a direction in which cutting proceeds with respect to the polarizing plate, and a plurality of cutting depths are sequentially reduced in the cutting progress direction. Each of which has a cutting edge.

  Further, the cutting edge of the first and second blades is set so as not to contact the glass substrate.

  Further, the cutting tool constituting the cutting mechanism is coated so that the removed polarizing plate does not adhere.

  Further, the crack forming means is a wheel cutter.

  In addition, an operating mechanism for selectively operating the glass substrate exposing means and the crack forming means is provided.

  Further, the operating mechanism is characterized in that the glass substrate exposing means and the crack forming means are operated in an order such that the traveling direction of the cutter constituting the cutting mechanism does not intersect the crack.

  Further, the operating mechanism operates only the glass substrate exposing means to form the first band-like region, and then the glass substrate exposing means and the crack formation in a direction orthogonal to the first band-like region. Operating the means to form the second strip region and the first crack, and then operating only the crack forming means along the first strip region to form the second crack. It is characterized by operating.

  In the liquid crystal panel of the present invention, the protrusion is reinforced by the polarizing plate, and the strength is improved. Further, the end face of the polarizing plate is not inadvertently caught and can be prevented from peeling off.

  Further, in the liquid crystal panel manufacturing apparatus of the present invention, the polarizing plate is first removed in a strip shape along the boundary between the substrate cells, and then a split crack is formed along the strip region of the glass substrate thus exposed. Then, the glass substrate is divided along the cracks, so that a substrate cell forming a liquid crystal panel is obtained. That is, it becomes possible to divide without degrading the quality, and no special apparatus is required when the polarizing substrate is attached to the glass substrate, and the production efficiency is improved.

  Hereinafter, a glass substrate cutting method and a cutting apparatus, a liquid crystal panel and a liquid crystal panel manufacturing apparatus according to embodiments of the present invention will be described in detail with reference to the drawings in order. In the drawings for explaining the embodiments of the invention, those having the same function are denoted by the same reference numerals as much as possible, and repeated explanation is omitted.

  First, the glass substrate cutting method according to the first embodiment of the present invention will be described. 1 to 3 show a glass substrate cutting method according to the first embodiment of the present invention. FIG. 1A is a schematic side view showing a state of removal of film formation on a glass substrate, and FIG. 1B is a front view of FIG. 1A viewed from the left. FIG. 2 shows the details of the operation of FIG. 1, and FIG. 3 shows the formation of scribe (cracks) in the glass substrate. Here, the term “film formation” refers to a film such as a polarizing plate, a resin film, a protective film, or the like that is thicker than a thin film such as an overcoat film or a transparent electrode.

  In FIG. 1, 1 is a glass substrate on which a film 1a is formed, and 2 is a glass substrate exposing means for exposing a glass substrate 1 by cutting, peeling and removing a part of the film 1a into a strip shape. A peeling cutter 3 such as a sculpture sword that constitutes is a stage for placing and fixing a glass substrate. As shown in FIG. 1 (b), the peeling cutter 2 has a substantially V-shaped cross section with an opening angle θ, and the tip blade portion touches the lower surface of the film 1a, that is, the glass surface of the glass substrate 1. In a state of being in contact with and pressed against the glass substrate, the film forming la is moved from the left to the right in FIG. Are cut, peeled off and removed as shown in FIG. 1 (a). The pressing force of the peeling cutter 2 on the glass substrate is adjusted by the thickness and material of the film formation 1a. This value is within 1N (Newton) in the case of forming a resin or the like having a thickness of up to several tens of μm, but it is several tens of N in a film of about 0.5 mm.

  In FIG. 1 (a), the optimum cutting angle α formed between the peeling cutter 2 and the surface of the glass substrate 1 is adjusted according to the thickness and material of the film 1a and set to an optimum value to peel off the film. Do. The angle β formed by the peeling cutter 2 and the tip of the blade part may be approximately 90 °. However, the thickness of the film formation, such as when the film formation 1a is a thin film of a few dozen μm or a thick film layer, etc. Adjust according to the material so that the best peeling is performed.

  FIG. 2 shows details of the state of cutting and peeling of the film 1a by the peeling cutter 2 of FIG. In the simplest case, the peeling cutter 2 bends a plate-like material having a thickness t into a substantially V shape whose cross section forms the angle θ of FIG. 1B, and forms a clearance angle γ over the entire tip of the blade as shown in FIG. A cutting blade like a V-shaped engraving sword is formed.

  FIG. 3 shows a state in which a scribe line (crack) 5a is formed by pressing and rolling the wheel-shaped scribe cutter 4 constituting the crack forming means downward in the peeling groove 5 peeled by the peeling cutter 2. A cutter wheel 4a having a tip formed of diamond, cemented carbide or the like is rotatably supported by a support shaft 4b on a scribing means 4 which is a crack forming means. The tip angle of the wheel cutter 4a can be widely used in the range of about 60 ° to 140 ° depending on the thickness and material of the glass substrate. Therefore, when the cutter wheel 4a applies the scribe marks 5a on the surface of the glass substrate 1, the film formation 1a is performed. The size of the opening angle θ of the peeling cutter 2 shown in FIG. 1B is set so that the shape and dimension of the peeling groove portion 5 can be ensured so as not to interfere with the above.

  FIG. 4A is a diagram showing a cutting method according to the second embodiment of the present invention, and only the cross-sectional shape of the peeling cutter of FIG. 2B is different from FIG. 1 illustrating the first embodiment. The difference between the second embodiment of FIG. 4A and the first embodiment is that the opening shape of the tip blade portion of the peeling cutter 12 is not V-shaped, and the portion in contact with the glass substrate surface is shown in FIG. It is the point which has comprised the circular arc shape of the radius of R1 shown. The second embodiment is characterized in that the width of the bottom portion of the peeling groove 5 shown in FIG. 3, that is, the width of the glass substrate exposed portion (band-like region) is the first because the tip blade section of the peeling cutter 12 has an arc shape. Compared to the first embodiment, it can be secured more widely, and there is a margin in alignment of the tip end of the cutter wheel 4a, and the pressing force to the peeling cutter tip blade is not concentrated on one point as in the first embodiment. For this reason, the sharpness of the tip edge portion of the peeling cutter 12 is long-lasting. The size R1 and the opening angle of the tip blade portion are set appropriately in consideration of the tip angle of the cutter wheel 4a and the thickness of the film formation 1a as in the first embodiment. Other operations and scribe formation are the same as those in the first embodiment, and are therefore omitted.

  FIG. 4B shows a cutting method according to the third embodiment of the present invention. In the third embodiment, the features of the second embodiment are more actively advanced, and the cross-sectional shape of the tip blade portion of the peeling cutter 22 is a straight portion having a width L1 in contact with the surface of the glass substrate 1 and the film formation 1a. It is comprised by the oblique side part of opening angle (theta) 1 cut | disconnected. The two contact portions are connected by two small arcs r2 in order to cut and peel the film 1a satisfactorily and to extend the cutting blade life of the cutting edge of the peeling cutter 22. Compared with the second embodiment, the third embodiment is characterized in that the width of the bottom portion of the peeling groove 5 is set to L1, and therefore, the dimension setting of the peeling groove is easy. The setting of L1 and θ1, which are the shape and dimensions of the tip blade portion, is the same as in the second embodiment in that the tip angle of the cutter wheel 4a and the thickness of the film formation layer 1a are set appropriately. Other operations and scribe formation are also the same as those in the first embodiment, and are therefore omitted.

  5 and 6 show a cutting method according to the fourth embodiment of the present invention. FIG. 5A is a side view showing a state in which the film formation 1a on the glass substrate 1 in the fourth embodiment is cut by two opposing flat cutters 32 and 32 ′, and FIG. It is the front view which looked at a) from the arrow direction. In the present embodiment, the film formation 1a is formed by arranging two cutters in a substantially parallel state to form a separation groove of the film formation 1a for bringing the tip of the cutter wheel 4a into contact with the glass surface of the glass substrate 1 when scribing. In the state of being in contact with the film, the film is moved in the direction of the arrow in FIG. As an example of the two cutters 32 and 32 ′, a side shape as shown in FIG. 5A is formed, and the cutting angle is set within an optimum angle according to the thickness and material of the film formation 1a, for example, in the range of 20 ° to 50 °. It arrange | positions so that (epsilon) may be set, it moves in parallel with the glass substrate 1 in the press-contact state to the arrow direction, and cuts the film-forming 1a. As shown in FIG. 5 (b), the two cutters 32 and 32 ′ have a cutter interval L2 within the range in which the tip of the cutter wheel does not interfere with the film formation 1a when scribing the glass substrate 1, as in the third embodiment. And the tilt angle θ2.

  In the fourth embodiment, even after the film formation 1a is cut by the two flat plate cutters 32 and 32 ′, the film formation 1a remains in the state of the peeling waste 1b shown in FIG. It is necessary to peel off and remove the part. As a specific example of the means, the cross-sectional shape introduced in FIG. 4B of the third embodiment is trapezoidal or U-shaped, and the bottom width L1 is the same as or slightly smaller than L2 in FIG. 5B. It peels and removes with the peeling cutter which has a shape. In the fourth embodiment, cutting and peeling are separate processes, but it is possible to cut the film 1a sharply compared to the first to third embodiments, and cutting of a film having a large thickness of 1 mm to 2 mm. Even in this case, the cutting quality of the cut surface is good. In addition, it is characterized in that a cutter can be procured at low cost by using a well-known commercially available cutter blade 32b as shown in FIG.

  FIG. 7 shows a cutting method according to the fifth embodiment of the present invention. It is the content which developed 4th Embodiment, and is the same content as the cutting, peeling, and scribe method of 4th Embodiment except the point which changed the cutter 32 of FIG. 5 to the cutter 42 of FIG. Accordingly, the left or right side view of FIG. 7 is the same as FIG. In the first to fourth embodiments, the film 1a can be cut and peeled only in one direction of the movement of the cutter, whereas in this embodiment, the side shape of the cutting cutter 42 is as shown in FIG. By making the shape, it is possible to cut in both the left and right directions in FIG. 7 without changing the arrangement of the cutters with respect to the change of the cutting direction. The cutting angles ε1 and ε2 in the cutter 42 are set to values that can obtain cutting conditions optimal for the thickness and material of the film 1a. When cutting by both reciprocations of the cutter 42, ε1 and ε2 are usually set to be the same. The separation and removal of the separation waste 1b are performed separately in the left-right direction by the same method as in the fourth embodiment.

  FIG. 8 shows a cutting method according to the sixth embodiment of the present invention. In the present embodiment, the peeling cutter 52 includes a cutter blade 52a and a holding portion 52b. The cutter blade 52a of the present embodiment can be applied to the cutter blade 52a by any of the cutting and peeling cutters used in the cutting methods of the first to fifth embodiments. The holding part 52b serves as a so-called handle for holding the cutter blade 52a during the cutting and peeling operations of the film formation 1a, and the holding part 52b has a length dimension and a cross-sectional shape of a rectangular shape with a predetermined dimension. By unifying and standardizing, when the peeling cutter 52 is fixed to a jig or apparatus and the film is cut and peeled, all the cutters of the first to fifth embodiments are replaced with the same jig or apparatus. Can be used.

  Further, by forming the holding portion 52b with an elastic body having an appropriate elasticity, for example, a resin such as Duracon or Delrin, rubbers such as silicon rubber or nitrile rubber having more flexible elasticity, and in some cases, a material such as wood Even when variations in the thickness or hardness of the film forming layer to be peeled occur, there is an effect of absorbing the variation in cutting and peeling resistance by the elastic action of the holding portion 52b, and a cutting apparatus to which the technology of this embodiment is applied is manufactured. It can also be applied as a safety mechanism. In addition, you may utilize the effect | action of the coil springs 77a and 77b (refer FIG. 15, FIG. 17) described in 9th Embodiment mentioned later for the elastic effect provided to such a peeling cutter 52. FIG.

  The cutting part of the film formation 1a used in the first to sixth embodiments, the blade part of the peeling cutter is made of a material such as general carbon tool steel, martensitic stainless steel, etc., if necessary, such as heat treatment. However, the present invention is not limited to the above materials as long as various film formations 1a having different materials and thicknesses can be appropriately cut and peeled. In addition, the cutting and peeling cutter of the film formation 1a of the present embodiment is formed by re-polishing and repeatedly using the tip edge portion by forming the cross-sectional shape shown in the first to fifth embodiments into a long shape. It is possible to extend the life of the cutter blade.

  FIG. 9 shows a cutting method according to the seventh embodiment of the present invention. In the dividing method of the present embodiment, the film 1a can be peeled and removed as a pre-scribing process in any of the first to sixth embodiments. That is, in the first to sixth embodiments, as shown in FIG. 3, the peeling groove 5 is formed in the film formation 1 a by cutting, peeling, and removing, and the scribing is performed on the bottom 1 c of the peeling groove 5, that is, on the belt-like region of the glass substrate 1. This was a cutting method in which the means 4 was pressed and rolled to apply the scribe marks 5a. In the seventh embodiment, the glass substrate is scribed and divided on the surface opposite to the film forming surface.

  As shown in FIG. 9, the glass substrate 1 is fixed to the mounting table 3 by fixing means such as vacuum suction (not shown). A long hole 3 a is formed in the mounting table 3 for the scribing means 4 to scribe from the lower surface side of the glass substrate 1. This embodiment is a method of forming the scribe streaks 5c on the opposite side surface immediately below the bottom 1c of the peeling groove 5 formed on the glass substrate 1 by the method described in the first to sixth embodiments.

  In the glass substrate dividing step after the scribing step, the glass substrate is divided by applying pressure from the opposite side surface where the scribe streaks have been applied to advance cracks in the scribe streaks. In the case of the method of scribing to the bottom 1c of the peeling groove 5 formed in the film formation 1a, it is necessary to press and cut from the surface opposite to the scribe surface in the dividing step after scribing. In the method of placing the film surface directly on the surface plate and applying a load with a press or rolling wheel from the upper side and cutting, the film formation layer in contact with the mounting table may be destroyed or deformed by the pressure applied at the time of cutting. However, according to the cutting method of the seventh embodiment, the pressing by the plate-shaped pressing jig or the rolling roller according to the shape and dimension of the peeling groove 5 is concentrated on the peeling groove bottom 1c in FIG. Pressurization allows the scribe streaks 5c to extend in the vertical direction and can be divided, and the glass substrate can be divided without being pressurized or in contact with the film formation 1a.

  10 to 13 show the contents of the dividing method according to the eighth embodiment of the present invention. In the present embodiment, a glass substrate on which a film having a relatively large thickness of about 0.05 mm to 2 mm, such as a resin film, is formed is considered in order to satisfactorily cut and peel off the film peeling before scribing. Therefore, combining the advantages of the peeling cutter used in the first embodiment and the second embodiment, the tip blade shape of the first embodiment or the second embodiment is formed from a round bar-like material, and a better film formation The purpose is to perform peeling.

  FIG. 10 shows a front view and a side view of the peeling cutter 62 used in this embodiment. A round bar-like material such as cemented carbide or carbon tool steel is processed as a peeling cutter. d1 is the outer diameter of the round bar material, and a material having an appropriate size is used depending on the thickness of the film to be peeled, but a material having a diameter of 5 mm to 10 mm is usually used. F cuts a part of the outer periphery d1 in parallel with the outer periphery as shown in FIG. 10, and has the same role as the processing reference surface of the other part and the holding portion 52b shown in FIG. 8 described in the sixth embodiment. It is a flat holding part for the purpose of making it. Although the total length L3 of the peeling cutter 62 is determined by the holding tool or apparatus of the peeling cutter, it is set to 35 mm in this embodiment. As shown in the front view of FIG. 10, a peeling blade portion having a substantially V-shaped cross section with an opening angle θn is formed to a length L4 from the end surface portion of the peeling cutter 62. The value of θn will be described in detail later. The blade length L4 is 5 mm to 10 mm as determined by the material and thickness of the film to be peeled, but is 7 mm in this embodiment. The rear edge of the blade groove on the right side of the portion i in the figure is a gently arc-shaped groove having a radius R3, and has a function of smoothly removing the peeled linear stripping waste 1b. In this embodiment, R3 is 38 mm. The value of the shape R4 of the bottom of the V-shaped blade portion is also set to a size range of about 0.5 mm to 1 mm depending on the material of the film formation, the thickness, and the size of the scribe cutter. In this embodiment, R4 is 0.5 mm. The tip of the blade portion needs to be devised to peel off without leaving film formation, and the tip angle is formed in a two-stage configuration of θ7 and θ8. 10 and 13, t1 is the length from the blade tip to the boundary line between θ7 and θ8, and details are shown in the C direction arrow view of FIG. In this embodiment, t1 is set to 0.3 mm, θ7 is set to 30 °, and θ8 is set to 40 °. By setting t1 to a very small dimension of about 0.3 mm, the substantial tip angle θ7 is set to a small value of 30 ° to ensure good peeling machinability, and the tip angle θ8 is set to 40 only at t1 at the tip of the blade. The purpose is to set the angle to 0 ° and ensure the strength of the tip of the peeling cutter 62.

  Next, the function and effect of the eighth embodiment will be described focusing on the illustrated content. FIG. 11 shows a state where the film formation 1 a on the glass substrate 1 is peeled and removed by the peeling cutter 62. An arrangement angle θ9 of the peeling cutter with respect to the glass substrate corresponds to a rake angle in peeling cutting, and an appropriate value is set in a range of 35 ° to 45 ° depending on the thickness and material of the film formation. In this embodiment, it was set to 43 ° in the peeling cutting of a rubber-based film having a thickness of 1 mm, and a good peeling result was obtained. FIG. 11 shows a state in which the peeling cutter 62 moves in the H direction to cut and peel off the film forming 1a. The The pressing force in the vertical downward direction of the peeling cutter 62, that is, the lower side of the surface of the glass substrate 1, may be about 1 to 40N. appear.

  10 will be described with reference to FIG. 12, which is an enlarged view of the front view of the peeling cutter 62. FIG. θ3 is an opening angle that constitutes the cutting edge of the tip edge portion of the peeling cutter 62, and is set to 50 ° to 140 ° according to the tip angle of the scribe cutter. θ4 is an opening angle at a position 3 mm to 10 mm deeper than the tip blade portion, and is set to be small within a range of 3 ° to 6 ° with respect to θ3. The reason and effect of setting the value of θ4 smaller than θ3 will be described with reference to FIG. 13 is a cross-sectional view of an arbitrary position mn of the cutting edge of the cutter 62 of FIG. 12 as viewed from above. By setting θ4 smaller than θ3, when the peeling cutter 62 advances in the K direction and cuts and peels the film 1a, an angle of δ2 is formed with respect to the cutting direction. The presence of δ2 plays a role of increasing the so-called shear angle in the cutting theory, and improves the cutting and peeling of the film. As a result of the experiment, it was confirmed that the workability of cutting peeling and the cutting quality were remarkably improved as compared with the case where there was no δ2 in the 1 mm thick resin film formation, that is, when θ3 and θ4 were set to the same angle. In this embodiment, for example, when θ4 is set to 80 °, θ3 is set to 84 °, that is, when θ4 is set to be smaller by 4 °, the cutting performance of film formation is the best, and as described above, θ4 is set to 3 ° relative to θ3. If it was set small in the range of ˜6 °, substantially the same good cutting quality was obtained. Note that the improvement in machinability obtained by setting the opening angle of θ4 in the back to be smaller than the opening angle θ3 of the peeling cutter is remarkable when the film thickness is 0.5 mm or more and the material is resin or rubber. Was confirmed.

  In addition, δ1 in FIG. 10 indicates that the tip of the blade portion is not perpendicular to the outer periphery of the peeling cutter 62 but has a shape slightly inclined inward in the figure, and by setting θ3 to be smaller than θ4 As a result, it means that δ1 is generated. Further, θ5 and θ6 in FIG. 12 are cross-sectional views of the vicinity of the blade tip viewed from the C direction. For example, when θ3 is set to 84 ° and θ4 is set to 80 °, θ7 is set to 30 ° in FIGS. , Θ5 is about 22 ° and θ6 is about 31 ° even when θ8 is 40 °.

  As described above, the material of the peeling cutter 62 may be any method such as heat treating only the tip edge portion after heat-treatable material such as cemented carbide or carbon tool steel, or heat treating the whole. The eighth embodiment is characterized by the shape of the film-forming peeling cutter and the peeling method, and the scribing process after peeling is either the method represented by the first embodiment or the method of the seventh embodiment. But it is possible.

  Next, a cutting apparatus to which the cutting method of the first to eighth embodiments is applied will be described as a ninth embodiment of the present invention. FIG. 14 is an explanatory view in the front direction of a cutting apparatus using the cutting method of the first to eighth embodiments. 66 includes a scribe cutter and / or a peeling cutter below and presses the scribe cutter and the peeling cutter against the glass substrate 1 with a predetermined load by a well-known hydraulic pressure, pneumatic pressure, spring force or the like not shown. However, it is a scribe unit that translates in the horizontal direction in the drawing along a guide rail 67 made of a known ball slide or the like. In the example of FIG. 14, a part of the scribe unit 66 is fixed to the timing belt 65 and is not shown. The pulley 64 is rotated by driving means such as a motor, and the required amount is moved along the guide rail 67 by the movement of the timing belt 65 stretched around the pulley 64. The driving means of the scribe unit 66 is a timing belt method in the description of the figure, but may be a known moving means such as a ball screw, a motor for driving the same, and a driving method by a control device.

  The main body 60, the mounting table 63, and the support table 63a are integrally formed, and the mounting table 63 is provided with suction holes in an appropriate arrangement in the vertical direction of the drawing, and glass is fixed by fixing means such as vacuum suction (not shown). The substrate 1 is fixed to the upper surface of the mounting table 63. The mounting table 63 and the support table 63a can be rotated by 90 ° when viewed from above or below in FIG. The moving block 200 is the entire unit straddling the U-shaped portion on the main body 60. The moving block 200 is shown in FIG. 14 with respect to the main body 60 by a pair of left and right ball screws 68 and a guide 69 by driving means and control means such as a motor (not shown). It is possible to move a predetermined amount in the front-rear direction. As described above, the cutting apparatus according to the present embodiment can scribe the glass substrate 1 in a grid pattern in the XY direction by the sliding movement of the scribe unit 66 and the configuration in which the mounting table 63 rotates by 90 °. It is.

  FIG. 15 shows the structure of the scribe unit 66 in FIG. 14 in detail. Reference numeral 71 denotes a unit substrate, which is engaged with the timing belt 65 and the guide rail 67 shown in FIG. 14, and the entire scribe unit 66 slides. Reference numeral 74 denotes a coupling portion that couples the unit substrate 71 and the scribe substrate 75, and a rear surface portion 74 b of the coupling portion 74 is integrally fixed to the unit substrate 71 with bolts or the like from the back of the unit substrate 71. The front surface portion 74a and the rear surface portion 74b of the coupling portion 74 are together with a scribe substrate 75 fixed integrally with the front surface portion 74a by a sliding means called a dovetail or a dovetail shown in the figure, or a known sliding means such as a ball slide. It is slidable in the vertical direction. Due to the tension of a coil spring (not shown), the front surface portion 74a of the coupling portion 74 and the scribe substrate 75 integrally coupled thereto are always pulled upward with respect to the unit substrate 71. ing. The upward pulling stopper is a tip portion of a micrometer screw 72 fixed to the unit substrate 71 via a micrometer fixing block 73. The micrometer screw 72 plays a role of finely adjusting the vertical position of the entire unit of the scribe board 75 in the vertical direction at the tip of the peeling means and the scribe means described later, and fixing it at an appropriate position.

  A substantially L-shaped peeling block 81 and a scribe block 82 are coaxially and rotatably supported on the scribe substrate 75 by a rotation shaft 83. Similarly, adjustment screws 76a and 76b having hook-like hooks at the tips are screwed to the support block 76 fixed to the scribe board 75, and the hook-like hooks and the upper part of the arm of the peeling block 81 are located above. The spring-loaded screw 78b and the spring-loaded screw 78a, which is also screw-fixed above the arm of the scribe block 82, are stretched by coil springs 77a and 77b. With this structure, the peeling block 81 and the scribe block 82 are always applied with a force that rotates counterclockwise as viewed from the front right side in FIG. That is, the peeling means 202 and the scribe means 14 are always pushed downward. The stopper of the counterclockwise rotation is a stopper / pressing means 79 in which tips of stopper screws 80a and 80b, which are engaged with screws on upper arms of the peeling block 81 and the scribe block 82, are fixed to the scribe board 75. This is accomplished by abutting against the tip portions 79a and 79b disposed on the head. The downward pressing force of the peeling means 202 and the scribing means 14 is different from about 10 to 20N for the scribing means 14 and about 1 to 40N for the peeling means 202, so the tensions of the coil springs 77a and 77b corresponding to the appropriate loads are set. To do. The fine adjustment of the tension is performed by screwing the adjustment screws 76a and 76b into the support block 76. Reference numeral 84 denotes a film formation surface detection means, which is a signal (not shown) indicating the vertical position of the film formation surface of the glass substrate by the extension of the spindle integrated with the tip detection portion by a known electric detection means such as a linear scale or a differential transformer. It is detected as an electrical signal through the cable. The tip 84a of the film surface detection means 84 is made of a rolling wheel made of resin such as nylon or Teflon (registered trademark), and the measuring force of the detection unit is set to a low value of 0.2 N (Newton) or less. It is devised so that scratches and deformation do not occur on the surface of 1a. FIG. 16A is a plan view of the main parts of the peeling block 81, the scribe block 82, the peeling means 202 serving as the glass substrate exposing means, the scribe means 14 and the film formation surface detecting means 84 shown in FIG. The film forming detection means 84, the peeling means 202 and the scribing means 14 are arranged on the same line, so that both the peeling of the film forming 1a and the scribing of the upper surface of the glass substrate 1 are performed simultaneously by the single movement of the scribing unit 66. It shows that it can be done.

  Next, operation | movement and an effect | action of the cutting device of 9th Embodiment of this invention are demonstrated. FIG. 17 shows a state where the scribing unit 66 is at the left end standby position in the cutting apparatus shown in FIG. 14, that is, the detection tip 84 a of the film formation surface detection means 84, the peeling means 202, and the scribing means 14 are all separated from the upper surface of the glass substrate 1. The front view of the state in a position is shown. In this state, the peeling block 81 and the scribe block 82 are given a counterclockwise rotational force about the rotation shaft 83 by the tension of the coil springs 77a and 77b. A stopper that rotates counterclockwise is formed in contact with the tip portions 79a and 79b of 79, and is stationary. In the operation as the cutting device, first, the scribe unit 66 moves in the direction of the arrow M in FIG. When the detection tip 84a of the film formation surface detecting means 84 rides on the glass substrate 1 as the peeling block 81 moves to the right, the surface position of the film formation 1a is detected, and the air built in the stopper / pressing means 79 is detected. The cylinder extends, the tip 79a pushes the stopper screw 80a by a specified amount, and the tip of the peeling means 202 corrects the thickness of the film 1a on the glass substrate 1 based on the detection result of the detection means 84, and the glass surface position is corrected. Controlled to reach. When the scribe unit 66 moves by the dimension L5 in FIG. 17, the peeling means 202 starts cutting and peeling the film 1a. When the scribe unit 66 further moves by the dimension L6 in FIG. 17, the cutter wheel 14a at the tip of the scribe means 14 rides on the upper surface of the glass substrate 1 after the film 1a is peeled off. A counterclockwise rotational force acts on the scribe block 82 due to the tension of the coil spring 77b, and a predetermined pushing force acts downward on the tip of the cutter wheel 14a due to this action. The surface of the glass substrate 1 is scribed by this pressing force. FIG. 18 shows a state where the peeling means 202 peels off the film 1a and the scribe means 14 scribes the exposed upper surface of the glass substrate 1 after peeling. As described above, the cutter wheel 14a at the tip of the scribe means 14 constitutes a rolling wheel similar to the detection means tip 84a. Like the peeling means 202, the surface position of the glass substrate 1 is detected in advance, and the cutter wheel 14a is detected. It is not necessary to adjust the vertical position of the tip of the glass substrate, and the scribing can be performed on the upper surface of the glass substrate 1 by moving the rolling wheel-shaped cutter wheel 14a downward in a pressing state. Therefore, in the state shown in FIG. 18, the tip end 79b of the stopper / pressing means 79 that rotates the scribe block 82 in the clockwise direction is not operating.

  17 and 18 is an example of the dust removing means. For example, the dust removing means 85 can be moved flexibly together with the scribe unit 66 such as a soft resin or a rubber hose. The part is disposed in the vicinity of the peeling means 202 and the scribing means 14, and the dust after peeling or scribing is removed by a negative pressure supply means such as a vacuum, but depending on the size and amount of the generated dust, It is also effective to use a positive pressure supply means. The film formation after peeling can be removed by the removing means provided in the peeling means 202 as shown in FIG. 10G described in the eighth embodiment. A brush-like removing device may be provided.

  In FIG. 18, when the scribing unit 66 is further moved and the detection tip 84a of the detection means 84 is disengaged below the upper surface position of the film forming 1a, a scribing process end signal is generated. After the distance between the detection tip 84a input in advance from this point and the tip of the peeling means 202, that is, the dimension L5 shown in FIG. 17, the scribing unit 66 moves and the peeling is completed, the tip of the stopper / pressing means 79 is completed. 79a further extends the air cylinder by a control means (not shown), and controls the peeling means 202 to be separated above the surface of the glass substrate 1. The scribing means 14 also needs to be controlled in the same way, but, similarly to the peeling means, a method is also possible in which the scribing unit 66 is opened upward after moving by a distance L6 between the detection tip 84a and the cutter wheel 14a shown in FIG. However, during the scribing, the tip 79b of the stopper / pressing means 79 and the stopper screw tip 80b are separated from each other. At the same time as the scribing is completed and the cutter wheel 14a is released below the upper surface of the glass substrate 1, the tension of the coil spring 77b. As a result, the tip 79b and the stopper screw tip 80b come into contact with each other. It is also possible to extend the air cylinder by using this as an ON signal of an electrical contact and open the scribe means 14 above the glass substrate. The latter is technically simpler. As described above, after the peeling of the film 1a and the scribing on the surface of the glass substrate 1 after the peeling are completed, the driving means scribe is performed in a state where the peeling means 202 and the scribe means 14 are pushed up so as not to interfere with the glass substrate. The unit 66 is returned to the standby position. The moving block 200 described with reference to FIG. 14 moves by a necessary amount in the front-rear direction of FIG. 14 and repeats peeling and scribing again. It is possible to scribe the glass substrate 1 on which the film has been formed in this way in a strip shape at a desired interval. Furthermore, by performing the same process after rotating the mounting table 63 described with reference to FIG.

  Further, as means for performing film peeling and scribing on the film forming glass substrate in a lattice shape, as described in the explanation of FIG. 14, the scribe unit 66 is in the left-right direction of FIG. It is also possible to use a structure in which the stage 63 moves in the front-rear direction of FIG. In this case, the scribing means and the peeling means at the lower end of the scribing unit 66 of FIG. Specifically, it is a structure like the movement unit 410 of FIG. 41 which shows the 18th-21st embodiment mentioned later. 430 in the moving unit 410 in FIG. 41 is two opposing wheel cutters that cut the polarizing plate, but this is replaced with a single scribing cutter wheel, and 460 is replaced with a peeling means, The function of turning 90 ° can be given, and by providing the function of turning 180 °, film peeling and scribing can be performed in both the reciprocating directions of X and Y directions. .

  The peeling means 202 and the scribing means 14 have different timings of peeling and scribing, and when the scribing unit 66 returns to the standby position after the peeling and scribing ends, the peeling means 202 and the scribing means 14 come into contact with the glass substrate. Since it is necessary to lift upward and open so as not to interfere, the air cylinder incorporated in the stopper / pressing means 79 and controlling the amount and timing of extension by a control means (not shown) is also provided with the tip 79a for the peeling block. It is necessary to dispose two portions on the tip portion 79b for the scribe block. In the ninth embodiment, as shown in FIG. 18, the peeling means 202 is a method of fixing the peeling cutter introduced in the first embodiment to the peeling block with a cutter set screw 86. However, the first to sixth embodiments and the eighth embodiment Any of the peeling cutters used in the cutting method described in the embodiment can be applied to the cutting apparatus of this embodiment. The tip position of the peeling means 202 needs to be accurately placed on the surface position of the glass substrate 1 when the film 1a is peeled off, but the vertical position of each tip is appropriate depending on the screwing amount of the stopper screws 80a and 80b. Adjust to the correct state. The finest position adjustment is required in the vertical position of the tip of the peeling means 202, and it is necessary to guide it to the glass upper surface position of the glass substrate 1 immediately before entering the peeling process. It is adjusted accurately by adjusting the screw 72. The nut 203 is for fixing after adjusting the screwing amount of the stopper screw 80. Further, in the ninth embodiment, as shown in FIG. 18, the peeling means 202 is fixed to the groove in which the peeling block 81 is formed by screwing, but the configuration relating to the adjustment of the cutting angle with respect to the glass substrate surface of the peeling means. Although not shown as a specific example, the peeling means 202 is formed as a semi-fixed configuration by dividing the vicinity of the peeling means 202 slightly from the center of the horizontal direction arm of the peeling block 81 into a structure that rotates via a rotating shaft. This can be realized by providing a mechanism for fixing the clamping angle by adjusting the angle for peeling 1a to an appropriate value.

  Next, a cutting device according to a tenth embodiment of the present invention will be described. In the ninth embodiment, as shown in FIG. 16A, the peeling means 202 and the scribing means 14 are arranged on the same line with respect to the moving direction of the scribing unit, and the film peeling and scribing is performed by one movement of the scribing unit. Although the method is performed at the same time, the tenth embodiment is a method in which the peeling unit 202 and the scribe unit 14 are arranged in accordance with the interval of scribing in a strip shape. FIG. 16B shows the positional relationship between the peeling block 81 ′ and the scribe block 82 ′ in the present embodiment. If the advancing direction of the scribing unit when scribing in a strip shape is the direction of the arrow in FIG. 16B, the peeling block 81 'must be installed on the front side in the traveling direction and the peeling process must be performed first. The interval S1 between the peeling unit 202 and the scribe unit 14 is adjusted to the pitch interval for scribing in a strip shape by a method such as adjusting the thickness of the spacer 204. The point of performing both film peeling and scribing by one movement of the scribing unit is the same as that of the ninth embodiment. It is a difference. When scribing a large plate-shaped glass substrate at a predetermined pitch, it is necessary to move the scribing unit for two steps in comparison with the ninth embodiment, but in comparison with the ninth embodiment, the cutting device is a scribing unit. It is not necessary to extend in the moving direction, and the dividing device can be designed compactly in the width direction. Further, it is possible to install an appropriate peeling dust removing means at a rear portion from the traveling direction of the peeling means 202 with a sufficient space, and it is also difficult to be affected by the peeling dust remaining in the peeling groove during scribing. The other basic configuration as the cutting device is substantially the same as that of the ninth embodiment, and is omitted.

  A glass substrate cutting method and a cutting apparatus according to an eleventh embodiment of the present invention will be described with reference to FIG. In the ninth embodiment, a detection means for detecting an electrical signal is provided in front of the peeling means as a means for accurately disposing the tip of the peeling cutter at the glass upper surface position of the glass substrate at the beginning of the peeling process, and the film forming upper surface position is detected. Then, the method of correcting the film thickness with programmable control and other control means and introducing the tip of the peeling means to the upper surface position of the glass substrate was introduced. However, when the thickness of the film formation 1a is 1 mm or more, variation in the thickness dimension, etc. If the tip of the peeling means is guided to a position above the surface of the glass substrate due to the influence of the film, the film is not sufficiently peeled off and the film that cannot be removed at the bottom of the peeling groove remains, or conversely, is guided downward from the surface of the glass substrate. In such a case, the tip of the first stage of the peeling hits the end surface of the glass substrate, and in severe cases, there is a concern that the scribe unit may be damaged. In particular, such a trouble is likely to occur at the start of peeling of the edge of the glass substrate 1, that is, the film formation 1a. The eleventh embodiment relates to this type of problem solving means, and forms an escape portion (film formation unnecessary portion) on the outer periphery of a large-sized glass substrate to be divided, and this film formation is unnecessary when cutting the glass substrate. It is a means to solve the problem on the premise of throwing away the department. In the method shown in FIG. 19A, a relief portion S that does not form a film is formed on the end surface portion of the large glass substrate, which is a raw material. The dimension of S varies depending on the thickness of film formation and the control capability of the cutting apparatus, but is set to 2 to 10 mm, for example. The tip of the peeling means is a method of moving the scribe unit by bringing the tip of the peeling means into contact with the glass surface of the S portion within the range of the S dimension, and absorbing variations in the control of the tip of the peeling cutter within the range of the S dimension. Then, after reliably contacting the surface of the glass substrate, the film can be peeled off with a margin from the outer end of the film forming section. The method shown in FIG. 19B does not remove the film formation of the escape portion S in advance, and performs film separation with the tip of the peeling means set to a pressure of about 1 to 40 N below the glass substrate. The tip of the peeling means starts film peeling from the vicinity of the outer edge of the film-forming glass at the left end of the figure, and the tip of the peeling means draws a locus like R5 in the figure and falls within the range of S ′. To reach the glass substrate surface. Since a part of the film formation remains in the hatched portion in the figure, this S ′ portion is used as an escape portion and discarded when cutting the glass substrate. If the step illustrated in FIG. 19B is Y-direction scribe, the X-direction peeling and scribing is performed first to form the peeling groove 5 and then rotated 90 ° to perform the same peeling and scribing in a lattice shape. Is shown. In the present embodiment, when the glass substrate is scribed in a lattice shape, both (a) and (b) must provide relief portions S or S ′ in the entire outer periphery. S1 and S2 indicate pitch intervals when scribing in a strip shape, and usually the same dimensions are set.

  The contents of the eleventh embodiment are applied to both the dividing method and the dividing device described above. In the case of film-forming glass scribing, even if the film is peeled off manually by peeling means in the extreme case, the film remains peeled off at the outer edge of the large plate-shaped glass substrate before scribing and cutting. The means for providing a film formation unnecessary portion on the outer periphery described in the eleventh embodiment solves this problem. As a cutting apparatus, as a method for guiding the tip of the peeling means described in the ninth embodiment to the glass surface position of the glass substrate at the start of peeling, the film forming surface position is detected by the detecting means to correct the film thickness. The method of positioning the tip of the peeling means in the vertical direction at the start of peeling is difficult to realize in terms of accuracy when the variation in film thickness is large. As a means for solving this problem, as in the case of the eleventh embodiment, if a film formation unnecessary portion is provided on the outer periphery of the glass substrate, the design and configuration burden of the cutting apparatus can be greatly reduced.

  FIG. 20 is an explanatory view showing the principle of the cutting apparatus according to the twelfth embodiment of the present invention, in which the cutting method of the seventh embodiment described with reference to FIG. 9 is applied to the cutting apparatus. As shown in FIG. 20A, the cutting apparatus of the present embodiment has a plurality of negative pressure supply paths 209 for fixing the glass substrate 1 to the mounting table 3 by negative pressure supply means such as vacuum (not shown). Are provided in an appropriate arrangement, and long holes 3a for scribing the scribing means 4 from the lower surface side of the glass substrate 1 are provided at intervals corresponding to the scribing pitch. In the cutting apparatus of this embodiment, the peeling means for peeling and removing the film formation 1a of the glass substrate 1 and the respective tips of the scribe means 4 are located on the vertical direction line when viewed from the advancing direction and move together, and the peeling means A scribe 5c is formed immediately below the peeling groove 5 formed by the above. In the case of this embodiment, since it is necessary to cut along the film-forming peeling groove 5 in the glass substrate cutting step after scribing, the cutter wheel 4a at the tip of the scribing means 4 is as described above as shown in FIG. However, it is necessary to arrange the stripping groove 5 directly below the vertical direction as viewed from the traveling direction, but not so strictly in the cutter moving direction which is the front-rear direction of the drawing. Depending on the thickness of the glass substrate, the glass substrate 1 needs to be scribed by applying a load of 10 N or more. In a cutting apparatus that scribes from the lower side of the glass substrate, the glass substrate 1 is mounted by the push-up force of the scribe means 4. As a means for preventing this, the load balance wheel 205 shown in FIG. 20 (a) is disposed at a position closest to the rear with respect to the moving direction of the peeling means. The load balance wheel 205 is a rotatable rolling wheel made of a soft material such as polyurethane rubber having a tip substantially the same size and shape as the cutter wheel 4 a at the tip of the scribing means 4, and the glass substrate 1 is mounted on the mounting table 3. In order to fix it stably, it is positioned immediately after the peeling means while applying a scribe load P1 and a pressing load P2 that can be balanced, and moves so as to follow the peeling means. In the method of maintaining the balance of the fixing force of the glass substrate by directly applying a load to the film formation surface by the weight-shaped load applying means, the protective film may be broken or damaged, but in this embodiment, the lower surface side of the glass substrate At the same time as the scribing of the film, by applying a necessary load to the bottom of the peeling groove after peeling the film forming surface applied to the upper surface by the peeling means and pressing and rolling it, the film 1a is not contacted at all and scratched. Scribing is possible with the glass substrate being stably fixed. In FIG. 20A, the peeling means is omitted.

  The glass cutting (partitioning) after the scribing is performed by applying a load from the opposite surface side where the scribing is performed and causing the cracks in the scribe part to progress. For this reason, in the ninth to eleventh embodiments, scribing is applied to the bottom of the separation groove 5 for film formation, and a load is applied from the back side of the film formation surface for cutting. On the other hand, in the twelfth embodiment, as shown in FIG. 20B, by scribing the lower surface of the glass substrate, the film formed immediately above the scribe is peeled to form a peeling groove having a required cross section. A wire rod 207 made of a resin such as urethane or metal having an appropriate size is placed on the peeling groove 5 immediately above the scribe line 5c, and a rotating roller 206 having a concave groove that fits the wire material at the tip is 50 to 50. By applying a 200N load P3 through a wire and rolling it by pressing, a cutting apparatus capable of film formation peeling, scribing and cutting of the glass substrate without any upside down of the glass substrate can be provided. 208 is a cushioning material used at the time of division. In this embodiment, glass cutting after scribing can be combined as an integrated device for scribing and cutting, with a cutting function added to the cutting device. After scribing with the cutting device, cutting with the cutting device Also good. In the present embodiment, there is no need to contact and pressurize the film formation surface in terms of the conditions in each process, including scribing the glass substrate and further fixing the glass substrate to the apparatus until it is divided. It is characterized by quality maintenance and protection. Further, instead of the rotary roller 206, it may be cut by a plate-like press member that is aligned with the bottom of the peeling groove 5.

  21 and 22 show a thirteenth embodiment of the present invention. The feature of this embodiment is that, in principle, the film peeling step and the scribing step are separate processes, and the film forming side of the glass substrate is received by the protrusion 13a of the mounting table in FIG. An unnecessary portion 11c for supporting is formed on the film forming side.

  FIG. 21 shows the contents of the separation of the film formation 11a on the premise that the product part used for the product such as the liquid crystal display device and the unnecessary part are separated. FIG. 22 shows a method and a state in which scribing is performed directly under the peeling groove on the opposite surface side of the glass substrate (directly above as shown in the vertical relationship in FIG. 22) after the film formation 11a is peeled and removed in FIG.

  The operation and the like of this embodiment will be described based on the illustrated contents. The glass substrate 11 is the same as that of the said embodiment by which the film-forming 11a was formed in the single side | surface. A plurality of suction paths 6 for fixing the glass substrate 11 by a negative pressure supply means such as a vacuum are formed in the mounting table 3 at a predetermined pitch. The peeling groove 15 is formed by a peeling cutter (not shown) at a pitch interval corresponding to the required dimension in the width direction of the unnecessary portion 11c and the product portion 11d with reference to the A end surface which is one end surface of the glass substrate 11. Since the method for forming the peeling groove 15 is the same as in the first and second embodiments, a detailed description thereof is omitted. The size of the unnecessary portion 11c is set according to the strength condition related to the thickness of the glass substrate or the film formation 11a, the size of the product portion 11d, and the size of the suction path 16 shown in FIG. Since the unnecessary part 11 is a part to be discarded eventually, it is desired to keep it to the minimum necessary. However, when the glass substrate is cut by applying a load from the opposite side of the scribe forming surface in the glass substrate breaking process, If the ratio is too small, cutting may be difficult, so that point is also taken into consideration, and the dimensions are set by securing more than the necessary minimum dimensions of the mounting table projection 13a of FIG. . The dimension of the product portion 11d is set by adding a finishing allowance to the product size of the liquid crystal display device or the like as necessary.

  FIG. 22 illustrates a method and contents for flipping the glass substrate 11 upside down after the peeling step shown in FIG. 21 and fixing the glass substrate 11 to the mounting table 13 and scribing the surface opposite to the peeling surface. The stage 13 for performing scribing in the present embodiment is different from the stage 3 shown in FIG. 21, and the protrusions 13a and 13 are located at positions corresponding to the dimensions and pitch intervals of the unnecessary parts formed by the peeling process. The recesses 13b are alternately arranged as shown. The upper surface of the protrusion 13a has the same height, and receives and supports and fixes the film forming surface side of the unnecessary portion 11c of FIG. The fixing method is performed by the same negative pressure supply means as the conventional method through the suction path 16. In this state, scribe marks are formed by the scribe cutter 4 immediately above the peeling groove 15 formed in the glass substrate 11 in terms of the vertical relationship in FIG. As a method for scribing the position immediately above the peeling groove 15, the scribe cutter 4 is driven by a detection means such as a known optical sensor or an abutting jig, a ball screw, or a timing belt by a servo motor, based on the end face A. It is easy to scribe a desired position on the opposite surface of the glass substrate corresponding to the position where the separation groove 11a shown in FIG. 21 is formed by a combination of the means and a control means such as a numerical control formula. The recess 13b is for preventing the film forming part of the product part 11d from coming into contact with the mounting table and causing damage or damage.

  In the present embodiment, since scribing is performed on the surface of the glass substrate opposite to the film forming surface, scribing is possible without being affected by the film forming in the scribing process. Further, the film formation on the side opposite to the scribe surface is not affected by the presence of the film formation layer even in the glass substrate breaking process because the position corresponding to the scribe line is peeled off in the shape of a groove. Further, in the above description of the present embodiment, the film forming / peeling step is performed first, and then the scribing method is performed. Since it is easy to do, the scribing process shown in FIG. 22 can be performed first.

  A fourteenth embodiment of the present invention will be described with reference to FIG. In the above description of the third embodiment, the film peeling and scribing of the single-sided glass substrate has been described, but this embodiment is a dividing method in the case where a film is formed on both surfaces. The point which forms the unnecessary part 21c and the product part 21d in the glass substrate 21 is the same as that of 3rd Embodiment. The mounting table 23 provided with the projections 23a and the recesses 23b corresponding to these dimensions is used in both the peeling and scribing processes. When the film is peeled off, the glass substrate on which the film is formed on both sides using the mounting table 23 on which the projections 23a and the recesses 23b shown in FIG. 23 are formed is first peeled on one side and then on the glass substrate. 21 is reversed and sequentially performed on the opposite surface side. It is possible to easily realize the vertical relationship between the peeling groove forming part and the scribe forming part on both sides in the vertical direction by using the control means based on the A end face. In this embodiment, it is also possible to perform scribing for each side after film formation peeling for each side has been completed, and both processes for the opposite side are performed after film formation peeling for one side and scribe formation are completed. A method is also possible.

  As described above in detail, according to the above-described embodiment, a parting film is removed in a strip shape by an amount necessary for crack formation, and a crack for cutting along the strip region of the exposed glass substrate is removed. Therefore, all kinds of film formation from thin films such as overcoat films and transparent electrodes to films having a thickness of 1 to 2 mm such as films such as polarizing plates, resin films, protective films, etc. About the formed glass substrate, the cutting method and the cutting apparatus which can cut a glass substrate can be provided, without being influenced by presence of film-forming. It should be noted that the present invention is not limited to the contents specifically described based on the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  Next, embodiments of the liquid crystal panel and the liquid crystal panel manufacturing apparatus of the present invention will be described with reference to the drawings. First, the liquid crystal panel which is 15th Embodiment of this invention is explained in full detail. 24 is a perspective view showing the appearance of the liquid crystal panel of the fifteenth embodiment. FIG. 24A is a front side, FIG. 24B is a back side, and FIG. 25 is a longitudinal sectional view of the liquid crystal panel. .

  The liquid crystal panel 350 is a pair of substrate cells 351a and 351b in which liquid crystal is sealed and sealed between each other (here, the substrate cell 351a is a TFT substrate, and hereinafter referred to as “TFT substrate cell”). The substrate cell 351b is a color filter substrate and may be referred to as a “color filter substrate cell” below, and one side of the TFT substrate cell 351a protrudes from one side of the color filter substrate cell 351b. A connection terminal 353 for driving the liquid crystal panel is formed on the inner surface of the protrusion 351aa. The connection terminal 353 receives FPC (Flexible Printed Circuit) or COG (Chip On Glass) for receiving an electrical signal and lighting the liquid crystal panel 350 in a state where the liquid crystal panel 350 is mounted on the liquid crystal display device. Is connected.

  In addition, the liquid crystal panel 350 is applied to a backlight type liquid crystal display device, and polarizing plates 352a and 352b (here, polarized light) are almost all over the outer surfaces of the substrate cells 351a and 351b. The plate 352a is on the TFT substrate cell 351a side, and may hereinafter be referred to as “TFT side polarizing cell”, and the polarizing plate 352b is on the color filter substrate cell 351b side, and hereinafter referred to as “color filter side polarizing cell”. It may be abbreviated as “plate cell”). Here, from the viewpoint of the function required for each polarizing plate 352a, 352b, each polarizing plate 352a, 352b covers a display region (not shown), that is, the mutual size is almost the same, and the substrate cell 351a is just the same. However, in the liquid crystal panel 350 of the present invention, the TFT side polarizing cell 352a is intentionally extended to the outer surface of the protruding portion 351aa. The reason for this will be described below.

  The thickness of each of the substrate cells 351a and 351b constituting the liquid crystal panel 350 is very thin, for example, about 0.4 mm to 0.7 mm in the case of glass, so that in the overlap region including the display region bonded to each other. While the thickness is doubled and the strength is increased, the protruding portion 351aa can be said to be in a state where the strength is low with the thickness of the TFT substrate cell 351a alone. On the other hand, since the thickness of the TFT side polarizing plate cell 352a is about 0.2 mm to 0.6 mm, the TFT side polarizing plate cell 352a is formed as a protruding portion with the aim of reinforcing the protruding portion 351aa by utilizing this thickness. It extends to the outer surface of 351aa. As a result, the strength of the protruding portion 351aa is increased, and even if the protruding portion 351aa is accidentally bumped or dropped during transportation or incorporation into the liquid crystal display device, the protruding portion 351aa is broken or deformed, or the corner of the protruding portion 351aa. It is difficult for defects to occur.

  The distance h from the edge of the TFT-side polarizing plate cell 352a to the edge of the protrusion 351aa (see FIG. 25), that is, the width of the glass exposed outside can sufficiently compensate for the strength of the protrusion 351aa. . The exposed width is the same for the edges of the substrate cells 351a and 351b with respect to the edges of the other polarizing plates 352a and 352b.

  In addition, peripheral end surfaces 352aa and 352ba of the respective polarizing plates 352a and 352b are tapered toward the respective substrate cells 351a and 351b. Specifically, these end surfaces 352aa and 352ba are formed by a laser irradiation mechanism 420 and a cutting mechanism 460 of the liquid crystal panel manufacturing apparatus 400 described later in detail, and are inclined surfaces or curved surfaces. Accordingly, the end surfaces 352aa and 352ba (particularly corner portions) of the polarizing plates 352a and 352b are not accidentally caught when the liquid crystal panel 350 is transported or incorporated in the liquid crystal display device, and peeling is prevented. The In addition, when the protective film is laminated | stacked integrally with this on the outer surface of each polarizing plate 352a, 352b, it is effective in preventing peeling of the film from each polarizing plate 352a, 352b.

  Here, the suitable aspect of each end surface 352aa and 352ba is described. In determining a suitable mode of each end face 352aa, 352ba, typically, the liquid crystal panel manufacturing apparatus 400 according to an eighteenth embodiment, which will be described later in detail, is used, and the cutting edge shape of the blade 461 of the cutting mechanism 460 is variously changed (specifically, Is a U-shaped cross section shown in FIG. 32 (a) or a trapezoidal cross section blade shown in FIG. Is shown in FIG.

  FIG. 26 shows various characteristics with respect to the inclination angle g (the rising angle of the side blade of the blade 461) of the peripheral edge of the polarizing plates 352a and 352b shown in FIG. FIG. As the inclination angle g, 90 ° to 135 ° is selected, and as various properties, the strength of the protrusion 351aa, the delta-shaped chipping of the polarizing plates 352a and 352b, the peeling of the protective film, and the substrate cell 351a, Four items, that is, the remaining adhesive that adhered between 351b and the polarizing plates 352a and 352b, are selected, and each item is determined based on three criteria of good, normal, and poor for each inclination angle g. As shown in FIG. 26, in order to satisfy the normal or higher in any item, the inclination angle g is in the range of 90 ° to 135 °, and the end surfaces 352aa and 352ba are inclined in this range. It can be said that it is preferable.

  Note that the preferable condition found by this investigation is applied when the end surfaces 352aa and 352ba are inclined surfaces, but the end surfaces 352aa and 352ba are tapered toward the respective substrate cells 351a and 351b. Of course, a curved surface may be used. Further, the material of the substrate cells 351a and 351b is not limited to glass, and the step of attaching the polarizing plates 352a and 352b is divided into individual substrate cells 351a and 351b unless production efficiency is desired. Later, polarizing plates 352a and 352b cut to a predetermined size may be attached.

  Next, an embodiment of a liquid crystal panel manufacturing apparatus suitable for manufacturing the liquid crystal panel 350 as described above will be described with reference to the drawings. A specific procedure for manufacturing the liquid crystal panel 350 will be described last.

  First, a liquid crystal panel manufacturing apparatus according to a sixteenth embodiment of the present invention will be described. FIG. 27 is a schematic perspective view showing the appearance of the liquid crystal panel manufacturing apparatus according to the sixteenth embodiment, and FIG. 28 is an enlarged view of a main part of the glass substrate. As shown in FIG. 27, the liquid crystal panel manufacturing apparatus 400 generally includes a bed (not shown) that is a mounting table on which a strip-shaped glass substrate 301 with a polarizing plate 302 attached on the upper surface is placed, and the bed. It is comprised from the movement unit 410 horizontally movable above. The moving unit 410 is equipped with a laser irradiation mechanism 420, a cutting wheel cutter 430, and a distance sensor 440 so as to protrude downward, and these move together with the moving unit 410. .

  The laser irradiation mechanism 420 is a CO2 laser device used for a general processing machine, and irradiates a high-power laser. As will be described later, the wheel cutter 430 forms a split crack in the glass substrate 301, and its diameter u1 is about 2.5 mm, and the blade edge angle w1 is an obtuse angle of about 120 to 150 ° (see FIG. 29), and is supported by the moving unit 410 via a spring spring or an air spring (not shown) so as to apply a constant pressing force to the glass substrate 301. The distance sensor 440 is a contact-type sensor that detects displacement of the upper surface of the polarizing plate 302 on the glass substrate 301 placed on the bed, and includes a laser irradiation mechanism 420, a wheel cutter 430, and upper surfaces of the polarizing plate 302. It is used to control the distance of the to keep constant. The reason why such control is performed is to stabilize the focal point of the laser with respect to the laser irradiation mechanism 420 and to stabilize the pressing force with respect to the wheel cutter 430. As the moving speed of the moving unit 410 on which these are mounted, an appropriate moving speed of the wheel cutter 430 is set to about 200 to 500 mm / sec. Of course, at this speed, the laser output of the laser irradiation mechanism 420 is sufficient. Yes.

  Next, the operation of the liquid crystal panel manufacturing apparatus 400 will be described. As shown in FIG. 27, the moving unit 410 moves in the direction of the arrow D on the boundary between cells in the glass substrate 301. At this time, the laser irradiation mechanism 420 first moves the laser toward the polarizing plate 302. And move ahead of the wheel cutter 430. As a result, a part of the polarizing plate 302 irradiated with the laser is sequentially melted and removed by heat, and the glass substrate 301 is exposed in a band shape to form the band-shaped region 11. Following the laser irradiation mechanism 420, the wheel cutter 430 moves along the band-like region 311 to form a split 312 (hereinafter, sometimes referred to as “scribe”) (FIG. 28). reference).

  In this way, a crack 312 is formed on the boundary between cells in the glass substrate 301, and then the glass substrate 301 is easily divided along the crack 312 when a load is applied to the glass substrate 301 as necessary. A liquid crystal panel is obtained. In addition, it does not need to give load to the glass substrate 301, but at the same time the crack 312 is formed, it may be developed and divided, but it is still divided along the crack 312. In practice, in consideration of production efficiency, the moving unit 410 is horizontally moved with respect to all the boundaries between a plurality of cells, and the operation of the liquid crystal panel manufacturing apparatus 400 is sequentially repeated. After turning 301 upside down and scribing the back surface of the glass substrate 301 with the wheel cutter 430, the glass substrate 301 is divided. If the polarizing plate 302 is also attached to the back surface, the operation of the liquid crystal panel manufacturing apparatus 400 described above is performed.

  Thus, even if the liquid crystal panel manufacturing apparatus 400 is the glass substrate 301 to which the polarizing plate 302 is attached, the glass substrate 301 is damaged at an inappropriate position, or the polarizing plate 302 is carelessly peeled off. Therefore, it is extremely effective for efficiently obtaining a liquid crystal panel having excellent quality.

  In addition, although the CO2 laser apparatus is applied as the laser irradiation mechanism 420, it is not restricted to this, The shape dimension of the wheel cutter 430 is not necessarily limited to the above. Further, the distance sensor 440 is not limited to a contact sensor, and may be a non-contact sensor.

  Next, a liquid crystal panel manufacturing apparatus according to a seventeenth embodiment of the present invention is described with reference to FIG. In the figure, the same reference numerals are given to the portions having the same names and the same functions as those in FIGS. The same applies to the 18th to 21st embodiments described later. The feature of the seventeenth embodiment is that the wheel cutter 430 in the sixteenth embodiment is replaced with a gas injection mechanism 450. As shown in FIG. 30, the moving unit 410 is provided with a gas injection mechanism 450 having a nozzle 451 for injecting gas toward the band-like region 311 of the glass substrate 301 at the rear stage of the laser irradiation mechanism 420. As the gas injected from the nozzle 451, compressed air or inert gas (for example, nitrogen gas) is applied.

  The operation of the liquid crystal panel manufacturing apparatus 400 is basically the same as that of the above-described sixteenth embodiment, but differs in the manner in which the scribe is formed. This will be described below. The laser irradiated from the laser irradiation mechanism 420 removes a part of the polarizing plate 302 by heating and melting, and at the same time, the belt-like region 311 of the glass substrate 301 exposed thereby is heated, and this belt-like region 311 has a high temperature. become. Then, the belt-like region 311 in the high temperature state is rapidly cooled by the gas jetted from the nozzle 451 of the gas jetting mechanism 450 that has moved subsequently, causing thermal contraction, and a crack is generated. In the present embodiment, this crack is utilized as the splitting crack 312.

  Next, a liquid crystal panel manufacturing apparatus according to an eighteenth embodiment of the present invention is described with reference to FIGS. A feature of the eighteenth embodiment is that the laser irradiation mechanism 420 in the sixteenth embodiment is replaced with a cutting mechanism 460. As shown in FIG. 31, the moving unit 410 is provided with a cutting mechanism 460 configured with a blade 461 that projects at a predetermined angle with respect to the polarizing plate 302 in the front stage of the wheel cutter 430.

  The operation of the liquid crystal panel manufacturing apparatus 400 is basically the same as that of the above-described sixteenth embodiment, but differs in a mode in which a part of the polarizing plate 302 is removed. This will be described below. When the cutting mechanism 460 moves on the boundary between the cells in the glass substrate 301, the polarizing plate 302 is scraped off like a sword by the blade 461, and the glass substrate 301 is exposed in a band shape to form a band-shaped region 311. It will be done. Here, the scraped pieces 302 a of the polarizing plate 302 are removed along the blade 461.

  According to such a cutting mechanism 460, the belt-like region 311 can be easily formed, and the cutting mechanism 460 is sufficient in mechanical configuration, so that the cutting amount can be easily managed and maintained.

  Here, an example of the edge shape of the blade 461 will be described with reference to FIG. As shown in FIG. 32A, when the cross-sectional shape is a U-shaped blade, the polarizing plate 302 can be scraped off with a certain width, and the width of the strip-like region 311 of the exposed glass substrate 301 is also stable. To do. Further, as shown in FIG. 32 (b), when the blade has a trapezoidal cross section, the same action as that of the above-described blade having a U-shaped cross section occurs, and in addition, the polarizing plate 302 left on the glass substrate 301. Therefore, the polarizing plate 302 is less likely to be carelessly peeled off. In addition, since the frictional resistance from the blade 461 applied to the chip 302a of the shaved polarizing plate 302 is substantially reduced, the chip 302a is smoothly removed along the blade 461.

  Further, as shown in FIG. 32 (c), in the case of a blade having a semicircular cross section, in addition to the same action as the blade described above, the frictional resistance from the blade 461 applied to the chip 302a is further reduced. Further, there is an advantage that the blade 461 itself can be easily manufactured. However, it should be noted that the degree of expression of the band-like region 311 decreases. Further, as shown in FIG. 32 (d), when the cutter has a circular cross section, in addition to the same action as the above-described semicircular cross section, a rotation mechanism that rotates the blade tip is provided. The entire circumference of the cutting edge can be used for cutting, leading to an improvement in the life of the blade 461. However, it is necessary to provide a mechanism for discharging the chips 302a.

  Next, a liquid crystal panel manufacturing apparatus according to a nineteenth embodiment of the present invention is described with reference to FIGS. The feature of the nineteenth embodiment is that the cutting mechanism 460 in the eighteenth embodiment is modified. As shown in FIG. 33, the moving unit 410 includes a cutting mechanism 460 in front of the wheel cutter 430. The cutting mechanism 460 is opposed to the moving unit 410 at a predetermined interval v as shown in FIGS. It is comprised from a pair of cutter 462,463 each arrange | positioned and having one cutting edge, and the cutter 464 arrange | positioned in the lower part between these cutters 462,463. Here, the blade 464 has the same width as the predetermined interval v, and plays a role of keeping the blades 462 and 463 constant at the predetermined interval v. Further, a support member 465 having the same width as the predetermined interval v is disposed in the upper part between the blades 462 and 463, and the support member 465 is supported by the moving unit 410. Yes. The blades 462, 463, 464 and the support member 465 are integrated by screws, rivets, etc. in consideration of blade replacement.

  The operation of the liquid crystal panel manufacturing apparatus 400 is basically the same as that of the above-described eighteenth embodiment, but is slightly different in a mode in which a part of the polarizing plate 302 is removed. This will be described below. As shown in FIGS. 33 and 36, when the cutting mechanism 460 moves on the boundary between cells in the glass substrate 301 in the short side direction of the glass substrate 301 (in the direction of arrow D in the drawing), first, the cutter The polarizing plate 302 is cut into strips by 462 and 463. Next, the strip-shaped portion of the cut polarizing plate 302 is scraped off from the glass substrate 301 by the blade 464 to become chips 302 a and is removed along the blade 464. At the same time, the glass substrate 301 is exposed in a band shape and a band-shaped region 311 is formed.

  According to such a cutting mechanism 460, it is possible to obtain the same effect as that of the above-described eighteenth embodiment, but in particular, the cutting mechanism 460 is configured by combining a plurality of blades. If it is desired to change the width of the band-like region 311 of the glass substrate 301, it can be achieved by simply exchanging only the blade 464. If the blade is individually deteriorated, only the blade can be replaced independently. That is, it is easy to cope with the diversification of the width of the belt-like region 311 and is effective for reducing the running cost of the blade itself.

  Next, a liquid crystal panel manufacturing apparatus according to a twentieth embodiment of the present invention is described with reference to FIG. The feature of the twentieth embodiment is that the shape of the pair of blades 462 and 463 in the nineteenth embodiment is modified to suppress cutting resistance to the polarizing plate 302. In each of the cutting edges such as the blades 462 and 463 in the nineteenth embodiment, when the polarizing plate 302 is thick, the cutting load borne by the cutting edge inevitably increases, in other words, the cutting with respect to the polarizing plate 302. Since the resistance is increased, problems such as deformation of the polarizing plate 302 during cutting and occurrence of a triangular-shaped chip at the end of the cutting are induced. Therefore, in this embodiment, as shown in FIG. 37, each of the blades 462 ′ and 463 ′ is provided with a plurality of cutting edges whose cutting depths are small in order toward the cutting progress direction (the direction of arrow D in the drawing). (2 in the figure). In this way, since the cutting load borne by one blade edge is reduced, the cutting resistance against the polarizing plate 302 is also reduced, and the above-described problem is hardly induced.

  Next, a liquid crystal panel manufacturing apparatus according to a twenty-first embodiment of the present invention is described with reference to FIGS. The feature of the twenty-first embodiment is that the pair of blades 462 and 463 in the nineteenth embodiment are replaced with wheel cutters. As shown in FIG. 38, the moving unit 410 includes a cutting mechanism 460 in front of the wheel cutter 430. The cutting mechanism 460 includes a pair of blades 462 and 463 shown in FIGS. Instead, as shown in FIG. 39, a pair of wheel cutters 466, 467 arranged coaxially at a predetermined interval v are provided. In this way, the cutting resistance with respect to the polarizing plate 302 can be further suppressed. Here, the cutting edge angle w2 of the wheel cutters 466 and 467 is 30 to 90 from the viewpoint of preventing inadvertent peeling from the cut portion of the polarizing plate 302 remaining on the glass substrate 301 while ensuring the cutting depth. It has an acute angle of °. In addition, the diameter u2 is 5 mm to 10 mm in consideration of the installation space of the rotating shaft, securing of the peripheral speed for high speed cutting, and securing of its own strength.

  Here, other matters common to the eighteenth to twenty-first embodiments will be supplemented below. According to the liquid crystal panel manufacturing apparatus 400 of the present invention, a part of the polarizing plate 302 is cut and removed in a strip shape by a blade or a wheel cutter, but when the blade or the like reaches the glass substrate 301, There is a risk that the cutting edge such as a blade may be lost or scratched on the glass substrate 301. In particular, this scratch is not preferable because it causes unscheduled breakage and deterioration of quality in the glass substrate 301. On the other hand, between the glass substrate 301 and the polarizing plate 302, there is actually an adhesive layer having a minute thickness to which both are attached. Therefore, initial settings are made so that the cutting edges of these blades and the like do not reach the glass substrate 301 so as to be within the adhesive layer, and further, monitor control is performed by the position sensor 440 during cutting. As an alternative, a blade material that is harder than the polarizing plate 302 and softer than the glass substrate 301 may be used.

  In addition, the width of the band-like region 311 of the glass substrate 301 is set to be 1 mm or more in consideration of securing an effective region of the polarizing plate 302 in the liquid crystal panel and easily forming the splitting crack 312 without impairing the quality. An appropriate range is 3 mm, preferably 1 mm to 2.5 mm. Therefore, to reproduce this, it is necessary to set the dimensions of the blade or the like. In particular, in the nineteenth to twenty-first embodiments, the predetermined interval v between the pair of blades 462 and 463 and the wheel cutters 466 and 467 is set to be the same. It can be easily achieved by setting within the range.

Further, from the viewpoint of smoothly removing the cut chips 302a of the polarizing plate 302 without stagnation in the blade or the like, a coating process such as Teflon (registered trademark) or diamond is applied to the blade or the like so that the chips 2a do not adhere to the blade or the like. Has been. Thereby, the life of the blade or the like is also improved.
The liquid crystal panel manufacturing apparatus of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, the adhesive that bonds the glass substrate 301 and the polarizing plate 302 is not limited, and an acrylic or silicon-based general adhesive can be applied. Particularly in the nineteenth to twenty-first embodiments, the polarizing plate Since 302 is scraped off by the blade 465, it is preferable to select one that is easy to scrape while maintaining an appropriate adhesive strength to the extent that there is no problem at the product level. Further, a protective laminate film may be attached to the surface of the polarizing plate 302. By peeling it off at the time of product shipment, a melt attached to the surface or a cullet for cutting glass (fine glass piece) is removed. This is preferable because it can be removed. In the above embodiment, the moving unit 410 moves with respect to the bed, but the bed on which the glass substrate 301 is placed may move.

  Next, a specific procedure for manufacturing the liquid crystal panel 350 using the liquid crystal panel manufacturing apparatus 400 will be described in detail with reference to the drawings. 40 is a perspective view showing the appearance of a glass substrate as a material of the liquid crystal panel 350, FIG. 41 is a schematic side view of the liquid crystal panel manufacturing apparatus with respect to the glass substrate, and FIG. 42 is the glass after the liquid crystal panel manufacturing apparatus is operated. It is a longitudinal cross-sectional view of a board | substrate. 43 is a perspective view showing the appearance of the glass substrate, where (a) shows the TFT side and (b) shows the dividing position on the color filter side. Here, typically, the liquid crystal panel manufacturing apparatus 400 of the eighteenth embodiment is used (see FIG. 31), and the cutting edge 461 of the cutting mechanism 460 has a trapezoidal cross section (see FIG. 32B). Apply.

  First, as a material for the liquid crystal panel 350, a glass substrate 301 including a pair of TFT substrates 301a and a color filter substrate 301b bonded to each other is prepared. The glass substrate 301 includes a plurality of TFT substrate cells 51a and color filter substrate cells 51b that are dividedly arranged, that is, adjacent to each other in a grid pattern. Between the TFT substrate cells 51a and the color filter substrate cells 51b, Liquid crystal is enclosed. Further, a TFT side polarizing plate 302a and a color filter side polarizing plate 302b are attached to the outer surfaces of the TFT substrate 301a and the color filter substrate 301b so as to cover all the TFT substrate cells 51a (FIG. 40). reference). A protective film is laminated on each outer surface of the TFT side polarizing plate 302a and the color filter side polarizing plate 302b.

  Next, the glass substrate 301 is set on the bed of the liquid crystal panel manufacturing apparatus 400 so that the TFT substrate 301a side is up, and the moving unit 410 is connected to the parallel boundaries U1, U2,... In FIG. 43, the boundary U1 is moved in one direction from the end of the glass substrate 301 to the end (direction of arrow D in FIGS. 31 and 18). Thereby, the TFT side polarizing plate 302a is scraped off by the blade 461, the TFT substrate 301a is exposed in a band shape, and a band-like region 311a (see FIG. 42) is formed. Following this, the wheel cutter 430 moves along the belt-like region 311a, and a scribe 312a (see FIG. 42) is formed.

  Thereafter, the glass substrate 301 is translated in the horizontal plane, and the above operations are sequentially repeated with respect to the boundaries U2, U3,..., And then the glass substrate 301 is rotated by 90 ° in the horizontal plane. The above operation is repeated with respect to the boundaries Q1, Q2... (See FIG. 43) perpendicular to the scribe lines 312b (see FIG. 43).

  Next, the glass substrate 301 is inverted and the above operation is repeated on the color filter substrate 301b. This operation is slightly different from the operation on the TFT substrate 301a. That is, the boundary V1, V2 (see FIG. 43) between the color filter substrate cells 351b facing the boundaries U1, U2,... Boundaries W1, W2,... (See FIG. 43) are set in parallel with V1, V2,. And it moves to one direction (the direction of arrow D in Drawing 31 and Drawing 41) from end to end of glass substrate 301 in order alternately with boundaries V1, W1, V2, W2,.

  Thereby, the color filter side polarizing plate 302b is scraped off by the blade 461, the color filter substrate 301b is exposed in a strip shape, and strip regions 311c and 311d (see FIG. 42) are alternately formed. Following this, the wheel cutter 430 moves along the belt-like regions 311c and 311d, and scribes 312c and 312d (see FIG. 42) are formed.

  Thereafter, the glass substrate 301 is rotated by 90 ° in a horizontal plane, and the above-described boundaries T1, T2 (see FIG. 43) between the color filter substrate cells 351b facing the boundaries Q1, Q2,. By repeating the operation, a scribe 312e (see FIG. 43) is formed.

  Then, by applying a load to the glass substrate 301 as necessary, the pair of TFT substrate cells 351a and color filter substrate cells 351b are divided along the scribes 312a to 312e. At this time, a portion 354 (hatched portion in FIG. 42) existing between the scribe 312d and the scribe 312d in the color filter substrate 301b (including the filter-side polarizing plate 302b) is removed as an unnecessary portion. As a result, the protrusion 351aa is formed in the TFT substrate cell 351a. Finally, a COG or FPC is connected to the connection terminal 353 provided on the inner surface of the protrusion 351aa, and the liquid crystal panel 350 is completed (see FIG. 24).

  In the liquid crystal panel 350 thus completed, the TFT side polarizing plate cell 352a extends over almost the entire outer surface of the TFT substrate cell 351a including the protruding portion 351aa, and the color filter covers the entire outer surface of the other filter substrate cell 351b. The side polarizing plate cells 352b are attached to each other.

  Further, the peripheral edge surfaces 352aa and 352ba of each TFT side polarizing plate cell 352a and the color filter side polarizing plate cell 352b are cut into inclined surfaces reflecting the rising angle of the side blade of the blade 461, and further each TFT substrate. The exposed width of the peripheral edge on the outer surface of the cell 351a and the color filter substrate cell 351b reflects almost half of the width of the lower blade in the blade 461. That is, by adjusting the shape and size of the blade 461, it is possible to easily achieve a suitable state as described above with respect to the strength of the liquid crystal panel and the peeling resistance of the polarizing plate.

  Note that, of course, it is possible to obtain the liquid crystal panel 350 by the same procedure as described above even when using the liquid crystal panel manufacturing apparatus 400 according to another embodiment other than the eighteenth embodiment.

  By the way, when the liquid crystal panel is cut out from the large glass substrate in this way, it is necessary to perform the above-described dividing operation in both the horizontal direction (Y direction) and the vertical direction (Y direction). The problem like this occurs. This aspect will be described with reference to FIGS. 44 to 48. First, as shown in FIG. 44, when the glass substrate 301 to which the polarizing plate 302 is attached is divided in the X direction, for example, a blade cutter 461 serving as a cutting mechanism 460 serving as a glass substrate exposing means is a wheel cutter 430. Is moved in the X direction, and stripping removal and scribing of the polarizing plate 302 are simultaneously performed. Then, the polarizing plate 302 is peeled off to form a band-shaped region 311, and at the same time, a scribe line (crack for dividing) 312 is formed at the center on the band-shaped region 311. Next, similarly in the Y direction perpendicular to the X direction, as shown in FIG. 45, the moving unit 410 having the blade 461 followed by the wheel cutter 430 is moved in the Y direction, and the polarizing plate 302 is peeled off and scribed. Do it at the same time. In this division, since the blade 461 is run ahead of the wheel cutter 430 that performs scribing, the glass substrate with a polarizing plate can be divided in substantially the same processing time as in the case of only the conventional glass cutting step.

  However, as shown in FIG. 46, when the blade 461 is moved in the Y direction perpendicular to the previously formed X-direction scribe line 312, the tip of the blade 461 pressed against the band-like region 311 on the glass substrate 301 is scribed. It collides at right angles with the glass level difference (scribe line 312) generated in the above. As a result, as shown in FIG. 47, a panel edge chip 315 serving as a divided cross portion is generated, or as shown in FIG. 48, a chip 461a at the tip of the blade 461 is generated. Therefore, the running cost increases due to the shortened life of the blade 461 and the quality of the liquid crystal panel 350 decreases. Therefore, when removing and removing the polarizing plate 312, it can be said that it is desirable that the blade 461 travels without passing through the previously formed scribe line 312, that is, without intersecting.

  Therefore, a dividing method for solving such a problem will be described below with reference to FIGS. 49 to 51. First, as shown in FIG. 49, the scribe wheel cutter 430 is retracted, and only the polarizing plate peeling blade 461 is pressed against the glass substrate 301 and moved in the X direction with respect to the X direction of the glass substrate 301. . That is, in the first movement in the X direction, the polarizing plate 302 is peeled and removed to form the band-shaped region 311, but the scribe line 312 is not formed in the band-shaped region 311.

  Subsequently, as shown in FIG. 50, the polarizing plate is peeled off and scribed simultaneously with respect to the Y direction of the glass substrate 301 as described above. That is, the band-like region 311 and the scribe line 312 are formed. In this case, since the scribe line 312 does not exist in the portion where the polarizing plate 302 is peeled and removed, that is, in the band-like region 311 formed by the first movement in the X direction, the tip of the blade 461 becomes the scribe line 312. The polarizing plate 301 can be smoothly peeled off without colliding.

  Finally, as shown in FIG. 51, this time the blade 461 is retracted, and only the wheel cutter 430 travels in the belt-like region 311 formed by the first movement in the X direction (the second movement in the X direction). ) To scribe the glass substrate 301 in the X direction to form a scribe line 312 and divide. In this way, by dividing in the order of X direction, Y direction, and X direction, the processing time slightly increases, but the blade life can be greatly extended, and the quality of the liquid crystal panel is also improved. Can be increased.

  In addition, if there is a margin for the processing time of the division, only the peeling and removing operation of the polarizing plate 302 is first performed in both the X direction and the Y direction to form the band-like region 311 in both directions, and then only the scribe is performed. You may make it perform. Furthermore, it goes without saying that the apparatus can be divided into an apparatus that performs only the peeling removal of the polarizing plate and an apparatus that performs only the scribing and can perform individual processing.

  The glass substrate cutting method, glass substrate cutting apparatus, liquid crystal panel, and liquid crystal panel manufacturing apparatus of the present invention are useful in the technical field related to liquid crystal display devices.

FIGS. 1A and 1B are schematic views showing a film formation removal state in the glass substrate cutting method according to the first embodiment of the present invention, where FIG. 1A is a side view and FIG. FIG. 2 is an enlarged view of FIG. FIG. 3 is a schematic front view showing a formation state of a crack (scribe) in the first embodiment. FIG. 4 is a schematic front view for explaining removal of a film in the cutting method according to the second and third embodiments of the present invention. 5A and 5B are schematic views for explaining film formation removal in the cutting method according to the fourth embodiment of the present invention. FIG. 5A is a side view and FIG. 5B is a front view. FIG. 6 is a schematic side view showing another example of the fourth embodiment. FIG. 7 is a schematic front view for explaining the removal of the film formation in the cutting method according to the fifth embodiment of the present invention. FIG. 8 is a schematic side view for explaining the removal of the film formation in the cutting method according to the sixth embodiment of the present invention. FIG. 9: is a schematic front view which shows the formation condition of the crack in the cutting method of 7th Embodiment of this invention. FIG. 10 is an external view of a cutter in the cutting method according to the eighth embodiment of the present invention. FIG. 11 is a schematic side view for explaining removal of the film formation in the eighth embodiment. FIG. 12 is a detailed front view of the cutter in the eighth embodiment. 13 is a sectional view taken along line mn in FIG. FIG. 14 is a front view of a glass substrate cutting apparatus according to the ninth embodiment of the present invention. FIG. 15 is a perspective view of a crack forming means (scribe unit) in the cutting apparatus according to the ninth embodiment. FIG. 16 is a plan view of the cutting device according to the ninth and tenth embodiments of the present invention as viewed from above. FIG. 17 is a front plan view showing a state before the film removal operation in the cutting apparatus of the ninth embodiment. FIG. 18 is a front plan view showing a state during the film removal operation in the cutting apparatus according to the ninth embodiment. FIG. 19 is a schematic diagram for explaining the principle of film removal in the glass substrate cutting method and apparatus according to the eleventh embodiment of the present invention. FIG. 20 is a schematic view for explaining the film substrate cutting method and the film forming removal and crack formation in the glass substrate cutting method and apparatus thereof according to the twelfth embodiment of the present invention. FIG. 21 is a cross-sectional view showing the state of film removal in the glass substrate cutting method according to the thirteenth embodiment of the present invention. FIG. 22 is a cross-sectional view showing a state of crack formation in the cutting method of the thirteenth embodiment. FIG. 23 is a sectional view showing a state of film removal and crack formation in the cutting method according to the fourteenth embodiment of the present invention. FIG. 24 is a perspective view showing the appearance of a liquid crystal panel according to the fifteenth embodiment of the present invention. FIG. 25 is a longitudinal sectional view of the liquid crystal panel of the fifteenth embodiment. FIG. 26 is a diagram schematically showing various characteristics with respect to the end face angle of the polarizing plate in the liquid crystal panel of the fifteenth embodiment. FIG. 27 is a schematic perspective view showing the appearance of a liquid crystal panel manufacturing apparatus according to the sixteenth embodiment of the present invention. FIG. 28 is an enlarged view of a main part of the glass substrate. FIG. 29 is an external view showing a wheel cutter for cutting. FIG. 30 is a schematic perspective view showing the appearance of the liquid crystal panel manufacturing apparatus of the seventeenth embodiment of the present invention. FIG. 31 is a schematic perspective view showing the appearance of the liquid crystal panel manufacturing apparatus according to the eighteenth embodiment of the present invention. FIG. 32 is an external perspective view showing an example of a blade shape in the liquid crystal panel manufacturing apparatus of the third embodiment. FIG. 33 is a schematic perspective view showing the appearance of the liquid crystal panel manufacturing apparatus of the nineteenth embodiment of the present invention. FIG. 34 is a schematic perspective view showing the outer appearance of the cutter in the liquid crystal panel manufacturing apparatus of the nineteenth embodiment. FIG. 35 is an exploded perspective view of the blade of FIG. FIG. 36 is a cross-sectional view for explaining the operation of the liquid crystal panel manufacturing apparatus of the nineteenth embodiment. FIG. 37 is a sectional view showing a blade in the liquid crystal panel manufacturing apparatus according to the twentieth embodiment of the present invention. FIG. 38 is a schematic perspective view showing the appearance of the liquid crystal panel manufacturing apparatus according to the twenty-first embodiment of the present invention. FIG. 39 is an external view showing a cutter in the liquid crystal panel manufacturing apparatus of the twenty-first embodiment. FIG. 40 is a perspective view showing the appearance of a glass substrate that is a material of the liquid crystal panel of the present invention. 41 is a schematic side view showing an example of a liquid crystal panel manufacturing apparatus for the glass substrate of FIG. 42 is a longitudinal sectional view of the glass substrate after the liquid crystal panel manufacturing apparatus of FIG. 41 is operated. FIG. 43 is a perspective view showing the appearance of the glass substrate after operating the liquid crystal panel manufacturing apparatus of FIG. FIG. 44 is a perspective view showing a state during operation in the X direction in the liquid crystal panel manufacturing apparatus of the present invention. FIG. 45 is a perspective view showing a state during operation in the Y direction in the liquid crystal panel manufacturing apparatus of the present invention. FIG. 46 is a longitudinal sectional view showing a state during operation in the Y direction in the liquid crystal panel manufacturing apparatus of the present invention. FIG. 47 is an external perspective view of the liquid crystal panel obtained by the operation of the liquid crystal panel manufacturing apparatus of FIGS. FIG. 48 is an external perspective view of the blade used in the operation of the liquid crystal panel manufacturing apparatus of FIGS. FIG. 49 is an example showing a preferred operation in the liquid crystal panel manufacturing apparatus of the present invention, and is a perspective view showing a state during the first operation in the X direction. 50 is a perspective view showing a state in which the liquid crystal panel manufacturing apparatus of FIG. 49 is operating in the Y direction after the operation. FIG. 51 is a perspective view showing a state during the second operation in the X direction after the operation of the liquid crystal panel manufacturing apparatus of FIG. FIG. 52 is a front view showing an example of a conventional glass substrate cutting apparatus. FIG. 53 is a perspective view showing the appearance of a conventional liquid crystal panel.

Claims (21)

In a liquid crystal panel in which a polarizing plate is attached to each outer surface of a pair of substrate cells that are bonded to each other and liquid crystal is sealed between them,
At least one side of the one substrate cell protrudes from at least one side of the other substrate cell, a connection terminal for driving a liquid crystal panel is formed on the inner surface of the protruding portion, and the polarizing plate is formed on the outer surface of the protruding portion. A liquid crystal panel characterized by extending.   2. The liquid crystal panel according to claim 1, wherein a peripheral edge of each polarizing plate exists within 1 mm inside a peripheral edge of each substrate cell. In a liquid crystal panel in which a polarizing plate is attached to each outer surface of a pair of substrate cells that are bonded to each other and liquid crystal is sealed between them,
The liquid crystal panel, wherein an end face of a peripheral edge of each polarizing plate is tapered in cross section toward each substrate cell.   4. The liquid crystal panel according to claim 3, wherein each of the end faces is inclined with respect to the outer surface of each of the substrate cells to be greater than 90 ° and less than 135 °.   5. The liquid crystal panel according to claim 4, wherein a protective film that can be peeled off is laminated integrally with each polarizing plate on an outer surface of each polarizing plate. A glass substrate having a plurality of adjacent glass substrate cells bonded to each other and encapsulating liquid crystal between them and having a polarizing plate attached to both sides thereof is divided to claim 1 or In a liquid crystal panel manufacturing apparatus for obtaining a plurality of liquid crystal panels according to 3,
A glass substrate exposing means for removing a part of the polarizing plate in a strip shape to expose the glass substrate in a strip shape, and for cutting along the strip-shaped region of the glass substrate exposed by the glass substrate exposing means A liquid crystal panel manufacturing apparatus, comprising: a crack forming means for forming a crack; and dividing the glass substrate along the crack.   The liquid crystal panel manufacturing apparatus according to claim 6, wherein the glass substrate exposing means is a laser irradiation mechanism that irradiates the polarizing plate with a laser.   The liquid crystal panel manufacturing apparatus according to claim 7, wherein the crack forming unit is a gas injection mechanism that injects a quenching gas into a band-shaped region of the glass substrate heated by the laser irradiation.   The liquid crystal panel manufacturing apparatus according to claim 6, wherein the glass substrate exposing means is a cutting mechanism that cuts and removes a part of the polarizing plate.   The cutting mechanism is composed of a blade that cuts off a part of the polarizing plate into a strip shape, and the cross-sectional shape of the blade edge is any one of a U shape, a trapezoidal shape, a semicircular shape, or a circular shape. The liquid crystal panel manufacturing apparatus according to claim 9.   The cutting mechanism is disposed between the first and second cutters, which are opposed to each other at a predetermined interval and cuts a part of the polarizing plate into a strip shape, and the first and second cutters. The liquid crystal panel manufacturing apparatus according to claim 9, further comprising: a third blade that scrapes the band-shaped portion of the polarizing plate cut by the blade from the glass substrate.   The liquid crystal panel manufacturing apparatus according to claim 11, wherein the predetermined interval is set in a range of 1 mm to 3 mm.   The first and second blades are a pair of wheel cutters that are coaxially integrated, and the blade edge angle is set within a range of 30 ° to 90 °. The liquid crystal panel manufacturing apparatus described in 1.   The liquid crystal panel manufacturing apparatus according to claim 13, wherein a diameter of a wheel cutter constituting the first and second blades is set in a range of 5 mm to 10 mm.   The first and second blades are blades that are relatively movable only in a direction in which cutting progresses with respect to the polarizing plate, and a plurality of cutting edges whose cutting depths are small in order toward the cutting progress direction. The liquid crystal panel manufacturing apparatus according to claim 11, wherein each of the liquid crystal panel manufacturing apparatuses comprises:   The liquid crystal panel manufacturing apparatus according to claim 11, wherein the cutting edges of the first and second blades are set so as not to contact the glass substrate.   The liquid crystal panel manufacturing apparatus according to any one of claims 10 to 12, wherein the blade constituting the cutting mechanism is coated so that the removed polarizing plate does not adhere.   The liquid crystal panel manufacturing apparatus according to claim 10, wherein the crack forming means is a wheel cutter.   The liquid crystal panel manufacturing apparatus according to claim 18, further comprising an operation mechanism that selectively operates the glass substrate exposing unit and the crack forming unit.   The said actuating mechanism operates the said glass substrate exposure means and the said crack formation means in the order in which the advancing direction of the cutter which comprises the said cutting mechanism does not cross | intersect the said crack. Liquid crystal panel manufacturing equipment.   The operating mechanism operates only the glass substrate exposing means to form the first band-like region, and then moves the glass substrate exposing means and the crack forming means in a direction perpendicular to the first band-like region. Operate to form the second strip region and the first crack, and then operate only the crack forming means along the first strip region to form the second crack. The liquid crystal panel manufacturing apparatus according to claim 20.

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