JP2008109124A5 - - Google Patents
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- Publication number
- JP2008109124A5 JP2008109124A5 JP2007253117A JP2007253117A JP2008109124A5 JP 2008109124 A5 JP2008109124 A5 JP 2008109124A5 JP 2007253117 A JP2007253117 A JP 2007253117A JP 2007253117 A JP2007253117 A JP 2007253117A JP 2008109124 A5 JP2008109124 A5 JP 2008109124A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- peeling
- roller
- layer containing
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007253117A JP4459992B2 (ja) | 2006-09-29 | 2007-09-28 | 剥離装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006266531 | 2006-09-29 | ||
JP2007253117A JP4459992B2 (ja) | 2006-09-29 | 2007-09-28 | 剥離装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009261673A Division JP5341723B2 (ja) | 2006-09-29 | 2009-11-17 | 剥離装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008109124A JP2008109124A (ja) | 2008-05-08 |
JP2008109124A5 true JP2008109124A5 (es) | 2009-10-01 |
JP4459992B2 JP4459992B2 (ja) | 2010-04-28 |
Family
ID=39442178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007253117A Expired - Fee Related JP4459992B2 (ja) | 2006-09-29 | 2007-09-28 | 剥離装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4459992B2 (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101022017B1 (ko) * | 2008-10-01 | 2011-03-16 | 한국기계연구원 | 계층화 구조물 제조 장치 |
CN102184841A (zh) * | 2010-12-17 | 2011-09-14 | 无锡华润上华半导体有限公司 | 晶圆代工机台超纯水回收方法及系统 |
KR102309244B1 (ko) * | 2013-02-20 | 2021-10-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
US9427949B2 (en) | 2013-12-03 | 2016-08-30 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and stack manufacturing apparatus |
WO2015087192A1 (en) * | 2013-12-12 | 2015-06-18 | Semiconductor Energy Laboratory Co., Ltd. | Peeling method and peeling apparatus |
JP6268483B2 (ja) * | 2014-06-03 | 2018-01-31 | 旭硝子株式会社 | 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法 |
US9676175B2 (en) * | 2014-06-20 | 2017-06-13 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus |
JP6815096B2 (ja) | 2015-05-27 | 2021-01-20 | 株式会社半導体エネルギー研究所 | 剥離装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003237263A (ja) * | 2002-02-18 | 2003-08-27 | Minolta Co Ltd | 再生可能な情報保持体、該情報保持体の再生方法、及び再生装置 |
JP2004311955A (ja) * | 2003-03-25 | 2004-11-04 | Sony Corp | 超薄型電気光学表示装置の製造方法 |
JP2005079553A (ja) * | 2003-09-03 | 2005-03-24 | Seiko Epson Corp | 転写方法、剥離方法、及び剥離装置 |
JP4054359B2 (ja) * | 2004-07-02 | 2008-02-27 | シャープ株式会社 | フィルム剥離方法と装置 |
JP4749074B2 (ja) * | 2004-07-30 | 2011-08-17 | 株式会社半導体エネルギー研究所 | Icチップの作製方法及び装置 |
JP4479512B2 (ja) * | 2005-01-18 | 2010-06-09 | 東レ株式会社 | 回路基板用部材および回路基板用部材の製造方法 |
JP2006216891A (ja) * | 2005-02-07 | 2006-08-17 | Tokyo Univ Of Agriculture & Technology | 薄膜素子構造の作製方法、及び薄膜素子構造作製用の機能性基体 |
JP2006259095A (ja) * | 2005-03-16 | 2006-09-28 | Mitsubishi Paper Mills Ltd | 光架橋性樹脂組成物 |
-
2007
- 2007-09-28 JP JP2007253117A patent/JP4459992B2/ja not_active Expired - Fee Related
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