JP2008109124A5 - - Google Patents

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Publication number
JP2008109124A5
JP2008109124A5 JP2007253117A JP2007253117A JP2008109124A5 JP 2008109124 A5 JP2008109124 A5 JP 2008109124A5 JP 2007253117 A JP2007253117 A JP 2007253117A JP 2007253117 A JP2007253117 A JP 2007253117A JP 2008109124 A5 JP2008109124 A5 JP 2008109124A5
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JP
Japan
Prior art keywords
substrate
peeling
roller
layer containing
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007253117A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008109124A (ja
JP4459992B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007253117A priority Critical patent/JP4459992B2/ja
Priority claimed from JP2007253117A external-priority patent/JP4459992B2/ja
Publication of JP2008109124A publication Critical patent/JP2008109124A/ja
Publication of JP2008109124A5 publication Critical patent/JP2008109124A5/ja
Application granted granted Critical
Publication of JP4459992B2 publication Critical patent/JP4459992B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007253117A 2006-09-29 2007-09-28 剥離装置 Expired - Fee Related JP4459992B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007253117A JP4459992B2 (ja) 2006-09-29 2007-09-28 剥離装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006266531 2006-09-29
JP2007253117A JP4459992B2 (ja) 2006-09-29 2007-09-28 剥離装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009261673A Division JP5341723B2 (ja) 2006-09-29 2009-11-17 剥離装置

Publications (3)

Publication Number Publication Date
JP2008109124A JP2008109124A (ja) 2008-05-08
JP2008109124A5 true JP2008109124A5 (enExample) 2009-10-01
JP4459992B2 JP4459992B2 (ja) 2010-04-28

Family

ID=39442178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007253117A Expired - Fee Related JP4459992B2 (ja) 2006-09-29 2007-09-28 剥離装置

Country Status (1)

Country Link
JP (1) JP4459992B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101022017B1 (ko) * 2008-10-01 2011-03-16 한국기계연구원 계층화 구조물 제조 장치
CN102184841A (zh) * 2010-12-17 2011-09-14 无锡华润上华半导体有限公司 晶圆代工机台超纯水回收方法及系统
WO2014129519A1 (en) * 2013-02-20 2014-08-28 Semiconductor Energy Laboratory Co., Ltd. Peeling method, semiconductor device, and peeling apparatus
US9427949B2 (en) 2013-12-03 2016-08-30 Semiconductor Energy Laboratory Co., Ltd. Peeling apparatus and stack manufacturing apparatus
WO2015087192A1 (en) * 2013-12-12 2015-06-18 Semiconductor Energy Laboratory Co., Ltd. Peeling method and peeling apparatus
JP6268483B2 (ja) * 2014-06-03 2018-01-31 旭硝子株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP2016021560A (ja) * 2014-06-20 2016-02-04 株式会社半導体エネルギー研究所 剥離装置
JP6815096B2 (ja) 2015-05-27 2021-01-20 株式会社半導体エネルギー研究所 剥離装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003237263A (ja) * 2002-02-18 2003-08-27 Minolta Co Ltd 再生可能な情報保持体、該情報保持体の再生方法、及び再生装置
JP2004311955A (ja) * 2003-03-25 2004-11-04 Sony Corp 超薄型電気光学表示装置の製造方法
JP2005079553A (ja) * 2003-09-03 2005-03-24 Seiko Epson Corp 転写方法、剥離方法、及び剥離装置
WO2006003816A1 (ja) * 2004-07-02 2006-01-12 Sharp Kabushiki Kaisha フィルム剥離方法と装置
JP4749074B2 (ja) * 2004-07-30 2011-08-17 株式会社半導体エネルギー研究所 Ｉｃチップの作製方法及び装置
JP4479512B2 (ja) * 2005-01-18 2010-06-09 東レ株式会社 回路基板用部材および回路基板用部材の製造方法
JP2006216891A (ja) * 2005-02-07 2006-08-17 Tokyo Univ Of Agriculture & Technology 薄膜素子構造の作製方法、及び薄膜素子構造作製用の機能性基体
JP2006259095A (ja) * 2005-03-16 2006-09-28 Mitsubishi Paper Mills Ltd 光架橋性樹脂組成物

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