JP2008108978A - Method and apparatus for forming insulating film in three-dimensional circuit substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a method and an apparatus for forming an insulating film in a three-dimensional circuit substrate wherein a more uniform insulating film can be formed more speedily. <P>SOLUTION: A hoop material supply unit 11 and a hoop material take-up unit 11A for successively moving a plurality of solid substrates 1 arranged in a metal hoop material H, two front/back nozzles 12 and 12A for irradiating the moving solid substrates 1 with particles of an insulating material, and a twisting mechanism 13 for changing the irradiation angle of the fine particles with respect to the solid substrates 1 are provided. The substrate feeding process for successively moving the plurality of solid substrates 1 is achieved by the hoop material supply unit 11 and the hoop material take-up unit 11A, and the fine particle irradiation process is achieved while changing the irradiation angle with the nozzles 12, 12A and the twisting mechanism 13, thereby the plurality of nozzles can irradiate the solid substrates 1 with the fine particles in the state where the solid substrates 1 are being moved, and irradiation can be carried out while changing the irradiation angle with respect to the solid substrates 1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an insulating film forming method and an insulating film forming apparatus for a three-dimensional circuit board in which an insulating film is formed on the surface of a three-dimensional board made of metal by irradiating fine particles of an insulating material.

  Conventional three-dimensional circuit components (MID: Molded Interconnet Device) are generally applied to electronic / opto devices and the like that are required to be small and light, and often require high heat dissipation characteristics.

By the way, as a method of forming an insulating film on a conductive material, a method of vigorously irradiating fine particles of an insulating material such as ceramic is known. In this method, the aerosol of ceramic fine particles created using helium gas is finely pulverized with the energy when irradiated with the ceramic fine particles that collided with the substrate, so that the substrate as the workpiece is irradiated from the nozzle in the sealed chamber, The fine fragment particles are adhered to the substrate to form a dense insulating film (see Patent Document 1).
JP 2004-256920 A (pages 14-15, FIG. 1)

  However, in the above conventional method, the substrate is supported by the substrate holder so as to face the nozzle, and the substrate is irradiated with the fine particles from the fixed nozzle while reciprocating the substrate holder. The formation of the insulating film is limited only when the substrate is a flat surface, and it is difficult to apply the insulating film to a three-dimensional substrate having an uneven surface.

  In the conventional method, the substrate is supported by the substrate holder and reciprocated over a relatively short distance. Therefore, it is necessary to replace the substrates one by one and repeat the film forming operation. It is low, mass production is difficult, and the product unit price is increased.

  Therefore, the present invention provides a method for forming an insulating film on a three-dimensional circuit board that can form a more uniform insulating film on a three-dimensional metal substrate more quickly in order to obtain a three-dimensional circuit board having higher heat dissipation. And it aims at obtaining the insulating-film formation apparatus.

  In the method for forming an insulating film of a three-dimensional circuit board according to the first aspect of the present invention, a plurality of metal three-dimensional boards arranged in a line at predetermined intervals are sequentially fed, and a plurality of nozzles are used on the surface of the three-dimensional board. An insulating film forming step of forming an insulating film by irradiating fine particles of an insulating material from a direction, and a circuit forming step of forming a circuit on the three-dimensional substrate on which the insulating film is formed are characterized.

  The invention according to claim 2 is characterized in that a plurality of fine particle ejection openings are formed in the nozzle.

  The invention according to claim 3 is characterized in that the plurality of nozzles are arranged toward the three-dimensional board on a semicircular arc whose center is the three-dimensional board.

  The invention according to claim 4 is characterized in that the plurality of nozzles are arranged toward the three-dimensional board on a circumference having the three-dimensional board as a center.

  In the invention of claim 5, the plurality of nozzles are provided in a rotatable cylindrical body surrounding the three-dimensional substrate, and the jet port formed on the inner periphery of the cylindrical body is circumferential with respect to the radial direction. Is inclined at a predetermined angle.

  The invention of claim 6 is characterized in that unnecessary fine particles are removed from the surface of the three-dimensional substrate before forming the insulating film on the three-dimensional substrate in the insulating film forming step.

  The invention according to claim 7 is characterized in that the diameters of the fine particles irradiated from a plurality of nozzles are different for each nozzle.

  In the eighth aspect of the invention, the irradiation of fine particles by a plurality of nozzles can be independently operated, and the nozzle facing the surface of the moving three-dimensional substrate is selectively controlled while controlling the moving speed of the three-dimensional substrate. It is characterized by operating.

  The invention according to claim 9 is characterized in that the irradiation angle of the nozzle with respect to the three-dimensional substrate is configured to be variable, and is controlled so that the irradiation angle is opposed to the surface of the moving three-dimensional substrate.

  In the invention of claim 10, the nozzle is arranged concentrically at a predetermined interval with respect to the inner cylinder in which the fine particle ejection port is formed on the outer periphery, and the fine particle ejection port is disposed on the inner periphery. It is configured to have an outer cylinder to be formed, and the three-dimensional board is moved between the inner cylinder and the outer cylinder in the direction of the cylinder axis while spirally rotating.

  In the invention of claim 11, a plurality of nozzles having different irradiation directions of the fine particles are provided, and the three-dimensional substrate and the nozzle are rotated in the moving direction of the three-dimensional substrate while relatively rotating around the three-dimensional substrate moving direction axis. Reciprocally move relatively.

  In the insulating circuit forming apparatus for a three-dimensional circuit board according to the invention of claim 12, a substrate feeding means for sequentially feeding a metal three-dimensional board arranged in a line at predetermined intervals, and a plurality of directions on the moving three-dimensional board And a nozzle for irradiating fine particles of an insulating material.

  According to the method for forming an insulating film of a three-dimensional circuit board according to the first aspect of the present invention, since the fine particles are irradiated from a plurality of directions while sequentially moving the three-dimensional board, the insulating film on the three-dimensional board is formed more quickly. In addition to being able to form a film, it is possible to irradiate fine particles of an insulating material from a plurality of directions, so that it is possible to improve the productivity while enabling more uniform film formation on the uneven surface of the three-dimensional substrate, and a three-dimensional circuit board can be obtained at a lower cost. It becomes like this.

  According to the invention of claim 2, since a plurality of nozzle outlets are formed, it is possible to increase the diffusion efficiency of the fine particles ejected from the nozzle and form the insulating film more uniformly.

  According to the invention of claim 3, since the fine particles can be irradiated toward the three-dimensional substrate from the nozzle outlets arranged on the semicircular arc having the three-dimensional substrate substantially at the center, the uneven surface of the three-dimensional substrate is flat, inclined, vertical. Even in the case of various surfaces such as surfaces, since each surface can be formed in parallel, an insulating film can be applied at a high speed and a nozzle can be installed in a small space. The size of the device can be reduced.

  According to the invention of claim 4, since the fine particles can be irradiated toward the three-dimensional substrate from the nozzle outlets arranged on the circumference having the three-dimensional substrate substantially at the center, the uneven surfaces of the plurality of three-dimensional substrates are arranged in parallel. It is possible to form a high-speed insulating film by forming a film, and it is possible to reduce the size of the apparatus by installing a nozzle in a space-saving manner. The trouble of turning the three-dimensional substrate over can be saved.

  According to the invention of claim 5, since the nozzle outlet is inclined with respect to the radial direction, the cylindrical nozzle can be automatically rotated by the energy for injecting the fine particles from the outlet, and the cylindrical nozzle By irradiating fine particles in all directions of the three-dimensional substrate arranged inside, it is possible to form a more uniform film on the uneven surface including the back side of the three-dimensional substrate.

  According to the sixth aspect of the present invention, unnecessary fine particles can be removed before the insulating film is formed, and the activated surface of the three-dimensional substrate can be exposed. Thus, the film formation efficiency can be increased.

  According to the seventh aspect of the present invention, the film formation time can be shortened by making the diameter of the fine particles different for each nozzle. In particular, it is preferable to form a denser insulating film at a higher speed by reducing the diameter of the fine particles irradiated from the nozzle toward the surface layer side.

  According to the eighth aspect of the invention, since the nozzle having the optimum angle with respect to the surface of the moving three-dimensional substrate can be selectively operated while controlling the moving speed of the three-dimensional substrate, the irradiation of the extra fine particles is performed. By eliminating this, variation in the thickness of the insulating film can be reduced efficiently, and the amount of fine particles used can be saved.

  According to the ninth aspect of the present invention, the surface of the three-dimensional substrate can be irradiated with the fine particles at an optimum angle, so that the thickness of the insulating film can be made more uniform, and the nozzles are continuously irradiated to generate the fine particles at the start of injection. Can be eliminated.

  According to the invention of claim 10, since the fine particles can be simultaneously irradiated from the inner cylinder and the outer cylinder on the front and back of the three-dimensional substrate, rapid film formation is possible, and in the film formation step, the three-dimensional substrate is moved spirally. The substantial moving distance of the three-dimensional substrate can be increased, and as a result, the apparatus can be reduced in size.

  According to the eleventh aspect of the invention, it is possible to simultaneously irradiate the three-dimensional substrate with the fine particles from more directions, so that the film formation time can be shortened.

  According to the insulating film forming apparatus for a three-dimensional circuit board according to the invention of claim 12, the plurality of three-dimensional substrates are sequentially moved by the substrate feeding means, and the three-dimensional substrate is irradiated with the fine particles of the insulating material from a plurality of directions. Therefore, the insulating film on the three-dimensional substrate can be formed more rapidly, and the fine particles of the insulating material can be irradiated from a plurality of directions, so that a more uniform film can be formed on the uneven surface of the three-dimensional substrate.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  (First Embodiment) FIG. 1 is a block diagram schematically showing a series of manufacturing steps of a three-dimensional substrate, FIG. 2 is a perspective view showing an arrangement state of the three-dimensional substrate, and FIG. 3 is a schematic configuration of an insulating film forming apparatus. FIG.

  In the present embodiment, as shown in FIG. 1, a metal hoop material H in the form of a band formed of aluminum or copper is used as a material for a three-dimensional substrate, and a structure forming process A, an insulating film forming process B, and a circuit forming process. The case where the single article of the three-dimensional board | substrate 1 is formed through C and the board | substrate separation process D is illustrated.

  That is, in such a method of manufacturing a three-dimensional circuit board, first, the three-dimensional board 1 and the pilot holes 2 for alignment are formed in the metal hoop material H shown in FIG. Insulating films are formed on both surfaces of the substrate 1, and a circuit is formed on the three-dimensional substrate 1 on which the insulating film is formed in the circuit forming step C. Finally, the three-dimensional substrate 1 on which the circuit is formed in the substrate separating step D is cut individually. It comes to separate.

  As shown in FIG. 2, the three-dimensional substrate 1 is formed at a predetermined interval in the length direction of the metal hoop material H. An uneven surface 1a is formed in the central portion of the three-dimensional substrate 1 by forging or the like, and an opening 1b is partially formed in the peripheral portion and bordered.

  An insulating film forming apparatus 10 for a three-dimensional circuit board shown in FIG. 3 includes a hoop material feeding portion 11 and a hoop material winding portion 11A as substrate feeding means for sequentially moving a plurality of three-dimensional substrates 1 arranged in a metal hoop material H, Two nozzles 12 and 12A before and after irradiating the moving solid substrate 1 with the fine particles of the insulating material, and a twist mechanism 13 as an irradiation angle varying means for changing the irradiation angle of the fine particles with respect to the three-dimensional substrate 1 Is done.

  In other words, in the present embodiment, the plurality of three-dimensional substrates 1 are sequentially fed by the hoop material feeding unit 11 and the hoop material winding unit 11A, and the metal hoop material H is twisted by the twisting mechanism 13, so that the three-dimensional substrate 1 is formed from the nozzles 12 and 12A. In contrast, the fine particles of the insulating material can be irradiated from a plurality of different directions.

  In addition, the insulating film forming apparatus 10 for the three-dimensional circuit board accommodates the hoop material feeding part 11, the winding part 11 A, the nozzles 12, 12 A and the twist mechanism 13 in a sealed film forming chamber 14 and supplies it from a cylinder 15. The carrier gas such as helium gas is supplied to the nozzles 12 and 12A through the aerosolization chambers 16 and 16A, and the pressure in the film forming chamber 14 is maintained in a substantially vacuum state by the vacuum pump 17. It is.

  In the aerosol chambers 16 and 16A, fine particles of an insulating material such as ceramic and a carrier gas are mixed, and the three-dimensional substrate 1 is vigorously irradiated from the nozzles 12 and 12A. A simple insulating film is formed.

  The nozzles 12, 12 </ b> A are disposed below the metal hoop material H, and are disposed on both the front and rear sides with respect to the feeding direction of the metal hoop material H with the twist mechanism 13 interposed therebetween. The angle of the three-dimensional substrate 1 with respect to the nozzles 12 and 12A can be arbitrarily variably set by, for example, twisting and reversing.

  According to the above-described embodiment, when forming the insulating film on the three-dimensional substrate 1, the three-dimensional substrate 1 is sequentially fed by the hoop material feeding unit 11 and the winding unit 11A, and the metal hoop material H is twisted by the twist mechanism 13. As a result, it is possible to irradiate the fine particles of the insulating material while changing the irradiation angle from the nozzles 12 and 12A to the three-dimensional substrate 1, so that the insulating film can be formed on the surface of the three-dimensional substrate 1 more quickly and the three-dimensional substrate. By changing the irradiation angle of the fine particles with respect to 1, a more uniform film formation on the uneven surface 1a of the three-dimensional substrate 1 is realized.

  For this reason, in this embodiment, productivity can be improved while enabling the formation of an insulating film on the three-dimensional substrate 1 having the uneven surface 1a, and the three-dimensional substrate 1 can be provided at low cost.

  4 and 5 show a modification of the present embodiment, FIG. 4 is a schematic configuration diagram of an insulating film forming apparatus for a three-dimensional circuit board, and FIG. 5 shows another arrangement state of the three-dimensional board ( It is a perspective view shown to a) and (b), respectively. In addition, below, the code | symbol common to the component corresponding to the structure mentioned above is attached | subjected, and the overlapping description shall be abbreviate | omitted.

  The three-dimensional circuit board insulating film forming apparatus 10A according to the present modification is mounted with a plurality of three-dimensional boards 1 connected to a pallet 21 conveyed by a conveyor 20 as a board feeding means instead of the metal hoop material H. It is what you do. That is, the pallet 21 is sequentially conveyed from the sheet supply magazine 22 by the conveyor 20, and after the insulating film is formed on the three-dimensional substrate 1, the pallet 21 is stored in the sheet storage magazine 22A.

  In the pallet 21, the entire upper surface of the mounted three-dimensional substrate 1 is exposed upward as well as the entire lower surface is exposed downward, and the fine particles ejected from the nozzles 12, 12 </ b> A disposed below are exposed to the lower surface of the three-dimensional substrate 1. The entire surface is irradiated.

  Further, a reversing mechanism 23 as an irradiation angle variable means is provided at an intermediate portion of the conveyor 20, and the top and bottom of the pallet 21 is reversed by the reversing mechanism 23. In addition, nozzles 12 and 12A are arranged on both front and rear sides of the reversing mechanism 23.

  The three-dimensional substrate 1 mounted on the pallet 21 can be arranged in a single row as shown in FIG. 5 (a), or in a plurality of rows as shown in FIG. 5 (b). -It is possible to arrange in multiple lines. Of course, alternate arrangements are possible.

  Even in this modification, the same effect as the first embodiment can be obtained, and an insulating film can be quickly formed on the surface of the three-dimensional substrate 1, and the irradiation angle of the fine particles with respect to the three-dimensional substrate 1 can be changed. This makes it possible to form a more uniform film on the uneven surface 1a of the three-dimensional substrate 1.

  (Second Embodiment) FIG. 6 is a front view showing the state of film formation on a three-dimensional substrate including the nozzles upside down, and FIG. 7 is an enlarged cross-sectional view of a portion A in FIG. In addition, below, the code | symbol common to the component corresponding to the said embodiment shall be attached | subjected, and the overlapping description shall be abbreviate | omitted.

  The insulating film forming apparatus for a three-dimensional circuit board according to the present embodiment basically has the same configuration as that of the first embodiment and the modification. That is, as shown in FIG. 6, the insulating film m is formed by irradiating the surface of the three-dimensional substrate 1 with the fine particles ejected from the nozzles 12 and 12A.

  However, as shown in FIG. 7, a point different from the above-described embodiment is that a plurality of outlets 12 h for injecting fine particles are formed at the tips of the nozzles 12 and 12 </ b> A.

  At this time, the plurality of jet nozzles 12h are evenly distributed at the tips of the nozzles 12 and 12A, but the distribution frequency can be appropriately changed according to the shape of the uneven surface 1a of the three-dimensional substrate 1 to be irradiated.

  Therefore, according to the present embodiment, since the plurality of nozzles 12h of the nozzles 12 and 12A are formed, as shown in FIG. 6, the diffusion efficiency of the fine particles ejected from the nozzles 12 and 12A is increased, and the insulating film m is made more uniform. It can be formed into a film.

  (Third Embodiment) FIG. 8 is a perspective view of a nozzle according to this embodiment. In addition, below, the code | symbol common to the component corresponding to the said embodiment shall be attached | subjected, and the overlapping description shall be abbreviate | omitted.

  Even in the present embodiment, the configuration is basically the same as that of the first embodiment. However, as shown in FIG. 8, it differs from the above-described embodiment in that a plurality of nozzles 30 h of the nozzle 30 are arranged toward the three-dimensional substrate 1 on a semicircular arc having the three-dimensional substrate 1 as the center. is doing.

  That is, the nozzle 30 is formed in a semi-cylindrical shape, and a plurality of jet nozzles 30h are formed at predetermined intervals on the inner periphery thereof, and a fine particle (aerosol) supply port 30p is provided in the middle of the semi-cylindrical nozzle 30. Are provided so that the fine particles supplied from the supply port 30p are uniformly ejected from the plurality of ejection ports 30h.

  Then, the three-dimensional substrate 1 is allowed to pass through the central portion 30c of the semi-cylindrical nozzle 30.

  Of course, even in the present embodiment, a plurality of nozzles 30 are arranged in the front and rear, and the twist mechanism 13 and the reversing mechanism 23 shown in FIGS. 3 and 4 are provided between the nozzles 30.

  Therefore, according to the present embodiment, since the fine particles can be irradiated toward the three-dimensional substrate 1 from the plurality of jet nozzles 30h arranged on the semicircular arc having the three-dimensional substrate 1 as a substantially center, the uneven surface 1a of the three-dimensional substrate 1 is flat and inclined. Even in the case of vertical surfaces, these surfaces can be formed simultaneously. Therefore, the insulating film can be formed at a higher speed, and the nozzle 30 can be installed in a space-saving manner, and the apparatus can be downsized.

  (Fourth Embodiment) FIG. 9 is a perspective view of a nozzle according to this embodiment. In addition, below, the code | symbol common to the component corresponding to the said embodiment shall be attached | subjected, and the overlapping description shall be abbreviate | omitted.

  Even in the present embodiment, the configuration is basically the same as that of the first embodiment. However, in the present embodiment, as shown in FIG. 9, a plurality of the ejection openings 31 h of the nozzle 31 are arranged toward the three-dimensional substrate 1 on the circumference having the three-dimensional substrate 1 as the center. Is different.

  That is, the nozzle 31 is formed in a cylindrical shape, and a plurality of jet ports 31h are formed at predetermined intervals on the inner periphery thereof, and a fine particle supply port 31p is provided on a part of the outer periphery of the nozzle 31, and the supply port 31p The fine particles supplied from the nozzles are ejected uniformly from the plurality of ejection ports 31h.

  The three-dimensional substrate 1 is allowed to pass through the central portion 31 c of the cylindrical nozzle 31.

  Therefore, according to the present embodiment, since the fine particles can be irradiated toward the three-dimensional substrate 1 from the plurality of jet nozzles 31h arranged on the circumference having the three-dimensional substrate 1 as the center, the uneven surface 1a of the three-dimensional substrate 1 is simultaneously formed. Can be membrane. Therefore, the insulating film can be formed at a higher speed, and the nozzle 31 can be installed in a space-saving manner, thereby reducing the size of the apparatus.

  Moreover, in this embodiment, since the front and back both surfaces of the three-dimensional board | substrate 1 can be formed into a film simultaneously, the effort which reverses the three-dimensional board | substrate 1 can be saved. Therefore, it is not necessary to provide the twisting mechanism 13 and the reversing mechanism 23 shown in FIGS. 3 and 4, and there is an advantage that the insulation film forming apparatus 10 for the three-dimensional circuit board can be further simplified.

  (Fifth Embodiment) FIG. 10 is a perspective view of a nozzle according to this embodiment, and FIG. 11 is a cross-sectional view of a jet port. In addition, below, the code | symbol common to the component corresponding to the said embodiment shall be attached | subjected, and the overlapping description shall be abbreviate | omitted.

  Even in the present embodiment, the configuration is basically the same as that of the first embodiment. However, as shown in FIG. 10, the nozzle 32 is formed in a rotatable cylindrical shape surrounding the three-dimensional substrate 1, and as shown in FIG. 11, the jet port 32 h formed on the inner periphery thereof is formed in the radial direction r. In contrast to the above embodiment, the predetermined angle θ is inclined in the circumferential direction.

  A fine particle supply port 32p is provided on the outer periphery of the cylindrical nozzle 32, and the fine particles supplied from the supply port 32p are uniformly ejected from the plurality of ejection ports 32h.

  Of course, also in this embodiment, a plurality of nozzles 32 are arranged in the front and rear, and the twist mechanism 13 and the reversing mechanism 23 shown in FIGS. 3 and 4 are provided between the plurality of nozzles 32.

  Therefore, according to the present embodiment, since the nozzle 32h of the nozzle 32 formed in a rotatable cylindrical shape is inclined in the radial direction, the cylindrical nozzle 32 is automatically activated by the energy for injecting fine particles from the nozzle 32h. And can be uniformly formed on the uneven surface 1a including the back side of the three-dimensional substrate by irradiating fine particles in all directions of the three-dimensional substrate 1 disposed in the cylindrical nozzle 32. Become.

  For this reason, in this embodiment, since both the front and back surfaces of the three-dimensional substrate 1 can be formed simultaneously, as in the fourth embodiment, it is possible to save the trouble of turning the three-dimensional substrate 1 upside down. 23 can be omitted, and the insulation film forming apparatus 10 for the three-dimensional circuit board can be further simplified.

  (Sixth Embodiment) FIG. 12 is a side view showing the relationship between a nozzle and a three-dimensional board according to this embodiment. In addition, below, the code | symbol common to the component corresponding to the said embodiment shall be attached | subjected, and the overlapping description shall be abbreviate | omitted.

  Even in the present embodiment, the configuration is basically the same as that of the first embodiment. That is, as shown in FIG. 12, two nozzles 12 and 12A are provided before and after the moving solid substrate 1 is irradiated with the fine particles of the insulating material.

  However, an adhering powder removal nozzle 33 that ejects carrier gas toward the three-dimensional substrate 1 is provided between the two nozzles 12 and 12A, and before the three-dimensional substrate 1 is sent to the nozzle 12A, the preceding nozzle 12 irradiates the carrier gas. This is different from the above embodiment in that unnecessary fine particles Ic that have not been formed are previously removed from the surface of the three-dimensional substrate 1.

  Therefore, according to the present embodiment, unnecessary fine particles Ic that have not been formed before the three-dimensional substrate 1 is fed into the nozzle 12A can be removed. Therefore, in the stage before forming the insulating film m, the three-dimensional substrate 1 is always provided. The activated surface of can be exposed. Since the film can be formed on the activated exposed surface, the interlayer strength of the insulating film m can be further strengthened and the film formation efficiency can be improved.

  (Seventh Embodiment) FIG. 13 is a side view showing the relationship between a nozzle and a three-dimensional board according to this embodiment. In addition, below, the code | symbol common to the component corresponding to the said embodiment shall be attached | subjected, and the overlapping description shall be abbreviate | omitted.

  Even in the present embodiment, the configuration is basically the same as that of the first embodiment. That is, as shown in FIG. 13, two nozzles 12 and 12A are provided before and after the moving solid substrate 1 is irradiated with the fine particles of the insulating material.

  However, it differs from the above embodiment in that the diameters of the fine particles Ic1 and Ic2 irradiated from the nozzles 12 and 12A are different for the nozzles 12 and 12A.

  That is, in the present embodiment, the diameter of the fine particles Ic1 irradiated from the nozzles 12 arranged in the front with respect to the moving direction of the three-dimensional substrate 1 is made relatively large, and the fine particles Ic2 irradiated from the nozzles 12A arranged in the rear. The diameter is relatively small.

  Therefore, according to the present embodiment, the film formation time can be shortened by changing the diameters of the fine particles Ic1 and Ic2 irradiated to the nozzles 12 and 12A, and the fine particles Ic1 and Ic1 irradiated from the nozzles 12 and 12A can be shortened. By reducing the diameter of Ic2 as the surface layer, a dense and strong insulating film can be formed at a higher speed.

  (Eighth Embodiment) FIGS. 14A and 14B are explanatory views respectively showing the selective operation states of the nozzles with respect to the surface of the three-dimensional board according to this embodiment by (a) to (e). In addition, below, the code | symbol common to the component corresponding to the said embodiment shall be attached | subjected, and the overlapping description shall be abbreviate | omitted.

  Even in the present embodiment, the configuration is basically the same as that of the first embodiment. That is, the fine particles of the insulating material are irradiated from the nozzle 34 while moving the three-dimensional substrate 1.

  However, as shown in FIG. 14, in order to irradiate one solid substrate 1 with the fine particles Ic, a plurality of (three in this embodiment) first nozzles 34a, second nozzles 34b, and third nozzles 34c are used as one set of nozzles. The point 34 is different from the above embodiment.

  The irradiation angles of the plurality of first to third nozzles 34a to 34c are made different from each other, the irradiation of the fine particles Ic by the respective nozzles 34a to 34c can be independently operated, and the moving speed of the three-dimensional substrate 1 The optimum nozzles 34a to 34c facing the surface of the moving three-dimensional substrate 1 are selectively operated while controlling the above.

  That is, the irradiation direction of the fine particles Ic is directed forward with respect to the moving direction of the three-dimensional substrate 1, the second nozzle 34b is directed perpendicular to the three-dimensional substrate 1, and the third nozzle 34c is It is directed rearward with respect to the moving direction of the three-dimensional substrate 1.

  Specifically, in FIG. 14A, the three-dimensional substrate 1 is fed at a low speed while operating the first nozzle 34a, and the front end surface 1c of the three-dimensional substrate 1 is irradiated with the fine particles Ic. In FIG. The three-dimensional substrate 1 is fed at a high speed while operating the first nozzle 34a and the second nozzle 34b, and the fine particle Ic is irradiated to the upper surface front edge 1d of the three-dimensional substrate 1 and the front edge inclined surface 1e of the uneven surface 1a.

  14C, the solid substrate 1 is fed at a high speed while operating the second nozzle 34b, and the bottom surface 1f of the uneven surface 1a of the three-dimensional substrate 1 is irradiated with the fine particles Ic. In FIG. The three-dimensional substrate 1 is fed at a high speed while the one nozzle 34a is operated, and the fine particle Ic is irradiated on the inclined surface 1g of the rear edge of the uneven surface 1a of the three-dimensional substrate 1.

  Further, in FIG. 14E, the three-dimensional substrate 1 is fed at a low speed while operating the second nozzle 34b and the third nozzle 34c, and the upper surface rear edge 1h and the rear end surface 1i of the three-dimensional substrate 1 are irradiated with the fine particles Ic.

  Therefore, according to the present embodiment, the optimal first to third nozzles 34a to 34c facing (preferably directly facing) the surface of the moving three-dimensional substrate 1 are selected while controlling the moving speed of the three-dimensional substrate 1. By operating in an effective manner, it is possible to efficiently reduce the variation in the thickness of the insulating film by eliminating the irradiation of extra fine particles, and to save the amount of fine particles to be used.

  (Ninth Embodiment) FIG. 15 is an explanatory view showing the change in the irradiation angle of the nozzle with respect to the three-dimensional substrate according to this embodiment by (a) to (c), and FIG. 16 is a perspective view showing an example of the irradiation angle changing device. FIG. In addition, below, the code | symbol common to the component corresponding to the said embodiment shall be attached | subjected, and the overlapping description shall be abbreviate | omitted.

  Even in the present embodiment, the configuration is basically the same as that of the first embodiment. That is, the fine particles of the insulating material are irradiated from the nozzle 35 while moving the three-dimensional substrate 1.

  However, as shown in FIGS. 15A to 15C, the angle of the nozzle 35 can be varied, and the angle of the nozzle 35 is controlled so that the irradiation angle is optimum for the surface of the moving three-dimensional substrate 1. The point which did is different from the said embodiment.

  That is, as shown in FIG. 15A, when forming the front end face 1c of the three-dimensional substrate 1, for example, the nozzle 35 is inclined forward with respect to the moving direction of the three-dimensional substrate 1, and FIG. When the upper surface leading edge 1d of the three-dimensional substrate 1 is formed as shown in FIG. 1, the nozzle 35 is set perpendicular to the three-dimensional substrate 1, and the uneven surface 1a of the three-dimensional substrate 1 is formed as shown in FIG. When the front edge inclined surface 1 e is formed, the nozzle 35 is inclined backward with respect to the moving direction of the three-dimensional substrate 1.

  FIG. 16 exemplifies the angle control of the nozzle 35 when the nozzle 35 is formed in a semi-cylindrical shape as shown in the third embodiment, for example, and connects both end portions of the semi-cylindrical nozzle 35 in this way. By changing the directivity angle of the nozzle 35 around the rotation center C, the angle at which the fine particles are irradiated from the jet outlet 35h to the three-dimensional substrate 1 passing through the center portion 35c can be controlled. Reference numeral 35p denotes a supply port for aerosol particles.

  Therefore, according to this embodiment, the surface of the three-dimensional substrate 1 can be irradiated with the fine particles at an optimum angle, so that the thickness of the insulating film can be made constant, and the nozzle 35 can continuously irradiate the surface. It is possible to eliminate powder accumulation generated at the start of injection.

  (Tenth Embodiment) FIG. 17 is a perspective view of a nozzle according to this embodiment, and FIG. 18 is an enlarged sectional view taken along the line BB in FIG. In addition, below, the code | symbol common to the component corresponding to the said embodiment shall be attached | subjected, and the overlapping description shall be abbreviate | omitted.

  Even in the present embodiment, the configuration is basically the same as that of the first embodiment. That is, the fine particles of the insulating material are irradiated from the nozzle 36 while moving the three-dimensional substrate 1.

  However, as shown in FIGS. 17 and 18, the nozzle 36 is arranged concentrically with a predetermined interval with respect to the inner cylinder 36 </ b> A having a fine particle ejection port 36 </ b> Ah formed on the outer periphery thereof. The outlet 36Bh is composed of an outer cylinder 36B formed on the inner periphery, and the three-dimensional substrate 1 is moved in the cylinder axis direction while rotating spirally between the inner cylinder 36A and the outer cylinder 36B. This is different from the above embodiment.

  As shown in FIG. 17, a fine particle (aerosol) supply port 36Ap is provided at the center of the inner cylinder 36A, and a fine particle (aerosol) supply port 36Bp is provided at a part of the outer periphery of the outer cylinder 36B. It is done.

  Therefore, according to the present embodiment, the three-dimensional substrate 1 is helically rotated between the inner cylinder 36A in which the fine particle outlet 36Ah is formed on the outer periphery and the outer cylinder 36B in which the fine particle outlet 36Bh is formed on the inner periphery. However, since the fine particles can be simultaneously irradiated from the inner cylinder 36A and the outer cylinder 36B to the front and back of the three-dimensional substrate 1, the film can be formed quickly, and the three-dimensional substrate 1 is moved spirally. A substantial film forming distance can be increased, and the apparatus can be downsized.

  (Eleventh Embodiment) FIG. 19 is an explanatory view showing the relationship between a nozzle and a three-dimensional board according to this embodiment. In addition, below, the code | symbol common to the component corresponding to the said embodiment shall be attached | subjected, and the overlapping description shall be abbreviate | omitted.

  Even in the present embodiment, the configuration is basically the same as that of the first embodiment. That is, the fine particles of the insulating material are irradiated from the nozzle 37 while moving the three-dimensional substrate 1.

  However, as shown in FIG. 19, a plurality of nozzles 37 having different irradiation directions of the fine particles are provided, and the nozzles 37 and the three-dimensional substrate 1 are relatively reciprocated in the moving direction of the three-dimensional substrate while relatively rotating. The point is different from the above embodiment.

  That is, a plurality of nozzles 37 are arranged in the moving direction of the three-dimensional substrate 1 and arranged in an arc shape so that the irradiation direction of each fine particle is directed to one three-dimensional substrate 1.

  In the present embodiment, the plurality of nozzles 37 are fixed to the arcuate mounting plate 38, and the three-dimensional board 1 is rotated around the rotation axis C along the movement direction and reciprocated in the movement direction. It has become.

  Therefore, according to the present embodiment, since the three-dimensional substrate 1 is rotated and reciprocated while irradiating the fine particles from the plurality of nozzles 37 having different irradiation directions, the three-dimensional substrate can be simultaneously irradiated with the fine particles from multiple directions. The film formation time can be shortened.

  In the present embodiment, the same effect can be obtained by rotating and reciprocating the nozzle 37 with respect to the three-dimensional substrate 1.

  By the way, although this invention was demonstrated taking the example in 1st-11th embodiment, various other embodiment can be employ | adopted in the range which is not restricted to these embodiments and does not deviate from the summary of this invention.

It is a block diagram showing roughly a series of manufacturing processes of a solid board in a 1st embodiment of the present invention. It is a perspective view which shows the arrangement | sequence state of the solid substrate in 1st Embodiment of this invention. It is a schematic block diagram of the insulating film formation apparatus of the three-dimensional circuit board in 1st Embodiment of this invention. It is a schematic block diagram of the insulating-film formation apparatus of the three-dimensional circuit board which shows the modification of 1st Embodiment of this invention. It is a perspective view which shows the other arrangement | sequence state of the three-dimensional board | substrate which shows the modification of 1st Embodiment of this invention to (a) and (b), respectively. It is a front view which shows the film-forming state on the three-dimensional board | substrate in 2nd Embodiment of this invention reversely upside down including a nozzle. It is an expanded sectional view of the A section in FIG. It is a perspective view of the nozzle in 3rd Embodiment of this invention. It is a perspective view of the nozzle in 4th Embodiment of this invention. It is a perspective view of the nozzle in 5th Embodiment of this invention. It is sectional drawing of the jet nozzle in 5th Embodiment of this invention. It is a side view which shows the relationship between the nozzle and solid substrate in 6th Embodiment of this invention. It is a side view which shows the relationship between the nozzle and solid substrate in 7th Embodiment of this invention. It is explanatory drawing which each shows the selective operation state of the nozzle with respect to the surface of the solid substrate in 8th Embodiment of this invention by (a)-(e). It is explanatory drawing which each shows the irradiation angle change of the nozzle with respect to the solid substrate in 9th Embodiment of this invention by (a)-(c). It is a perspective view which shows an example of the irradiation angle change apparatus in 9th Embodiment of this invention. It is a perspective view of the nozzle in 10th Embodiment of this invention. FIG. 18 is an enlarged cross-sectional view along the line BB in FIG. 17. It is explanatory drawing which shows the relationship between the nozzle and solid board | substrate in 11th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 3D substrate 1a Uneven surface 10, 10A 3D circuit board insulation film forming apparatus 11 Hoop material feeding part (substrate feeding means)
11A Hoop material winding part (substrate feeding means)
12, 12A, 30, 31, 32, 34, 35, 36, 37 nozzles 12h, 30h, 31h, 32h, 35h, 36Ah, 36Bh Spout 20 Conveyor (substrate feed means)
34a First nozzle 34b Second nozzle 34c Third nozzle 36A Inner cylinder 36B Outer cylinder m Insulating film Ic, Ic1, Ic2 Fine particles

Claims (12)

  An insulating film forming step of forming an insulating film by sequentially irradiating fine particles of an insulating material from a plurality of directions using nozzles on the surface of the three-dimensional board while sequentially feeding metal three-dimensional boards arranged linearly at predetermined intervals An insulating film forming method for a three-dimensional circuit board, comprising:   The method for forming an insulating film on a three-dimensional circuit board according to claim 1, wherein a plurality of fine particle ejection holes are formed in the nozzle.   The method for forming an insulating film on a three-dimensional circuit board according to claim 1, wherein the plurality of nozzles are arranged toward the three-dimensional board on a semicircular arc whose center is the three-dimensional board.   The method for forming an insulating film on a three-dimensional circuit board according to claim 1, wherein the plurality of nozzles are arranged toward a three-dimensional board on a circumference having the three-dimensional board as a center.   A plurality of nozzles are provided in a rotatable cylindrical body surrounding the three-dimensional substrate, and a jet port formed on the inner periphery of the cylindrical body is inclined at a predetermined angle in the circumferential direction with respect to the radial direction. The method for forming an insulating film on a three-dimensional circuit board according to claim 1 or 2.   The unnecessary fine particles are removed from the surface of the three-dimensional substrate before forming the insulating film on the three-dimensional substrate in the insulating film forming step. The method for forming an insulating film on a three-dimensional circuit board.   The method for forming an insulating film on a three-dimensional circuit board according to any one of claims 3 to 5, wherein the diameters of the fine particles irradiated from the plurality of nozzles are different for each nozzle.   The fine particle irradiation by a plurality of nozzles can be independently operated, and the nozzle facing the surface of the moving three-dimensional substrate is selectively operated while controlling the moving speed of the three-dimensional substrate. The insulating film formation method of the three-dimensional circuit board as described in any one of 3-5.   The irradiation angle of the nozzle with respect to the three-dimensional substrate is configured to be variable, and the irradiation angle is controlled so as to be opposed to the surface of the moving three-dimensional substrate. The method for forming an insulating film on a three-dimensional circuit board. The nozzle includes an inner cylinder in which a fine particle ejection port is formed on the outer periphery, and an outer cylinder in which the fine particle ejection port is formed on the inner circumference and arranged concentrically with a predetermined interval with respect to the inner cylinder. Configure
3. The method for forming an insulating film on a three-dimensional circuit board according to claim 1, wherein the three-dimensional substrate is moved between the inner cylinder and the outer cylinder in the cylinder axis direction while being spirally rotated.   A plurality of nozzles having different irradiation directions of the fine particles are provided, and the three-dimensional substrate and the nozzle are relatively reciprocated in the moving direction of the three-dimensional substrate while relatively rotating about the moving direction axis of the three-dimensional substrate. The method for forming an insulating film on a three-dimensional circuit board according to claim 1 or 2. A substrate feeding means for sequentially feeding a metal three-dimensional substrate arranged linearly at a predetermined interval;
A nozzle that irradiates the moving solid substrate with fine particles of insulating material from a plurality of directions;
An apparatus for forming an insulating film of a three-dimensional circuit board, comprising:

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