JP2008108671A - Branching connector - Google Patents

Branching connector Download PDF

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Publication number
JP2008108671A
JP2008108671A JP2006292547A JP2006292547A JP2008108671A JP 2008108671 A JP2008108671 A JP 2008108671A JP 2006292547 A JP2006292547 A JP 2006292547A JP 2006292547 A JP2006292547 A JP 2006292547A JP 2008108671 A JP2008108671 A JP 2008108671A
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branch
line
connector
circuit board
conductive adhesive
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Eiji Yanada
英二 梁田
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Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce an area of a circuit board mounting a waveform shaping circuit to be arranged inside a branching connector and aim at downsizing of the branching connector. <P>SOLUTION: For the branching connector 10 to be provided at a position at which a plurality of branched lines are connected from a trunk line, a circuit board equipped with a conductive pattern of trunk-line wires 21 and branched line wires 22 is housed in a connector housing 11. The trunk-line wires 21 are connected with branched line wires 22 through a waveform shaping circuit 25 connecting resistors and coils in parallel, the waveform shaping circuit 25 has a gap each provided between the branched line wire 22 and the trunk-line wire 21, and a conductive adhesive 26 is applied to each gap to make up a resistance layer, and at the same time, a chip coil 27 is arranged on the surface of the resistance layer, electrodes at either end of the chip coil 27 are firmly adhered to the conductive adhesive 26 to make up a parallel circuit of the resistor and the coil. Further, the circuit board 20 has terminal materials 31 for the trunk line connected to the trunk-line wires 21 and terminal materials 32 for the branched lines connected to the branched line wires 22 set in protrusion. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、分岐コネクタに関し、詳しくは、自動車に搭載され、自動車内に配索されるLAN内に介設され、通信回路の分岐接続部で発生する信号の反射を減衰する機能をコネクタ内に設けたものである。   The present invention relates to a branch connector, and more particularly, the connector has a function of attenuating reflection of a signal generated at a branch connection portion of a communication circuit, which is installed in an automobile and is installed in a LAN routed in the automobile. It is provided.

従来、自動車に配索される電線同士の接続にはコネクタが多く用いられており、特開2006−4852号公報(特許文献1)では、電子部品を内蔵したコネクタが提供されている。
特許文献1で提供されたコネクタ1は、図9に示すように、アッパーケース2とロアケース3からなるハウジング4内に複数の電子部品5を実装した回路基板6を収容して、該回路基板6に接続した端子7を外部電線(図示せず)の端末の端子と接続している。
Conventionally, a connector is often used for connection between electric wires arranged in an automobile, and Japanese Patent Application Laid-Open No. 2006-4852 (Patent Document 1) provides a connector incorporating an electronic component.
As shown in FIG. 9, the connector 1 provided in Patent Document 1 accommodates a circuit board 6 in which a plurality of electronic components 5 are mounted in a housing 4 including an upper case 2 and a lower case 3, and the circuit board 6 The terminal 7 connected to is connected to the terminal of the terminal of the external electric wire (not shown).

特許文献1で提供されているコネクタ1は電子部品5を実装した回路基板6を内蔵しているため、コネクタに様々な機能を持たせることができ、通信回路の分岐点に電子部品5である抵抗及びコイルを実装して波形整形回路を構成すると、分岐点における信号の反射を減衰することができる。
しかしながら、前記波形整形回路を構成するためには、図10(A)に示すように回路基板6に抵抗91とコイル92の両方を実装しなければならず、電子部品5実装面の面積が大きい回路基板6が必要となる。
Since the connector 1 provided in Patent Document 1 incorporates a circuit board 6 on which an electronic component 5 is mounted, the connector can have various functions, and the electronic component 5 is at a branch point of the communication circuit. When a waveform shaping circuit is configured by mounting a resistor and a coil, signal reflection at a branch point can be attenuated.
However, in order to configure the waveform shaping circuit, both the resistor 91 and the coil 92 must be mounted on the circuit board 6 as shown in FIG. 10A, and the area of the electronic component 5 mounting surface is large. The circuit board 6 is required.

また、抵抗91やコイル92等の電子部品5は、半田付けにより回路基板6に実装される。特に、チップ型の電子部品5では、図10(C)に示すように、回路基板6の導体パターン95に設けたランド部94に半田93を印刷し、図10(D)に示すように電子部品5の電極(図示せず)を半田93に接合させ、電子部品5と導体パターン95を電気的に接続している。
前記電子部品5とランド部94の接合強度を確保するためには、回路基板6にランド部94の面積を確保して、ランド部94と半田93の接する面積を大きくする必要がある。このため大きい面積の回路基板6が必要となり、回路基板6を収容するコネクタ1が大型化するという問題がある。
The electronic components 5 such as the resistor 91 and the coil 92 are mounted on the circuit board 6 by soldering. In particular, in the chip-type electronic component 5, as shown in FIG. 10C, the solder 93 is printed on the land portion 94 provided in the conductor pattern 95 of the circuit board 6, and the electronic as shown in FIG. Electrodes (not shown) of the component 5 are joined to the solder 93, and the electronic component 5 and the conductor pattern 95 are electrically connected.
In order to ensure the bonding strength between the electronic component 5 and the land portion 94, it is necessary to secure the area of the land portion 94 on the circuit board 6 and increase the area where the land portion 94 and the solder 93 are in contact with each other. Therefore, a circuit board 6 having a large area is required, and there is a problem that the connector 1 that accommodates the circuit board 6 is enlarged.

特開2006−4852号公報JP 2006-4852 A

本発明は前記問題に鑑みてなされたものであり、分岐コネクタにおいて、通信回路の分岐点に信号の反射を低減する波形整形回路を設ける場合において、波形整形回路を実装している回路基板の面積を小さくし、分岐コネクタの小型化を図ることを課題としている。   The present invention has been made in view of the above problems, and in a branch connector, when a waveform shaping circuit for reducing signal reflection is provided at a branch point of a communication circuit, the area of a circuit board on which the waveform shaping circuit is mounted. The problem is to reduce the size of the branch connector and reduce the size of the branch connector.

前記課題を解決するため、本発明は、幹線から複数の支線を分岐接続する位置に設ける分岐コネクタであって、
コネクタハウジング内に、幹線ラインと支線ラインの導体パターンを設けた回路基板を収容し、前記幹線ラインは抵抗とコイルとを並列接続した波形整形回路を介して前記支線ラインと接続させ、
前記波形整形回路は、前記支線ラインと前記幹線ラインとを隙間を空けて設け、該隙間に導電性接着剤を塗布して抵抗層を設けると共に、該抵抗層の表面にチップコイルを配置し、該チップコイルの両端の電極を前記導電性接着剤に固着して、前記抵抗とコイルとの並列回路を形成しており、さらに、
前記回路基板に、前記幹線ラインに接続した幹線用端子材と、支線ラインに接続した支線用端子材を突設していることを特徴とする分岐コネクタを提供している。
In order to solve the above problems, the present invention is a branch connector provided at a position where a plurality of branch lines are branched and connected from a trunk line,
In a connector housing, a circuit board provided with a conductor pattern of a trunk line and a branch line is accommodated, and the trunk line is connected to the branch line via a waveform shaping circuit in which a resistor and a coil are connected in parallel.
The waveform shaping circuit is provided with a gap between the branch line and the main line, a conductive layer is applied to the gap to provide a resistance layer, and a chip coil is disposed on the surface of the resistance layer. The electrodes at both ends of the chip coil are fixed to the conductive adhesive to form a parallel circuit of the resistor and the coil,
A branch connector is provided in which a terminal material for a main line connected to the main line and a terminal material for a branch line connected to the branch line are projected from the circuit board.

本発明の分岐コネクタでは、抵抗層である導電性接着剤とチップコイルからなる波形整形回路を実装した回路基板をコネクタハウジング内に収容し、幹線ラインから波形整形回路を介在させて支線ラインを分岐している。
波形整形回路を構成する導電性接着剤とチップコイルは、回路基板に半田付けで実装するのではなく、導電性接着剤を回路基板に塗布し、導電性接着剤の表面にチップコイルを載置し、該チップコイルの両端を導電性接着剤と固着している。
通常、導電性接着剤は回路基板に設けた導体パターンと比較して導電率が低いことより、導電性接着剤を抵抗として機能させ、導電性接着剤の塗布層は抵抗層として用いている。よって、当然のことながら、本発明で用いる導電性接着剤は、接続する導体パターンより導電率が低いものとしている。
このように、抵抗層となる導電性接着剤の表面にチップコイルを接着させ、該チップコイルの両端を抵抗層と接続することにより、幹線ラインと支線ラインとを、抵抗とコイルとを並列接続した波形整形回路を介在させて接続している。
In the branch connector of the present invention, a circuit board on which a waveform shaping circuit composed of a conductive adhesive as a resistance layer and a chip coil is mounted is accommodated in the connector housing, and the branch line is branched from the main line via the waveform shaping circuit. is doing.
The conductive adhesive and chip coil that make up the waveform shaping circuit are not mounted on the circuit board by soldering. Instead, the conductive adhesive is applied to the circuit board and the chip coil is placed on the surface of the conductive adhesive. The both ends of the chip coil are fixed to the conductive adhesive.
In general, a conductive adhesive has a lower electrical conductivity than a conductor pattern provided on a circuit board, so that the conductive adhesive functions as a resistance, and the conductive adhesive coating layer is used as a resistance layer. Therefore, as a matter of course, the conductive adhesive used in the present invention has a lower conductivity than the conductive pattern to be connected.
In this way, the chip coil is bonded to the surface of the conductive adhesive that becomes the resistance layer, and both ends of the chip coil are connected to the resistance layer, so that the main line and the branch line are connected in parallel. Are connected via a waveform shaping circuit.

本発明では、前記のように、抵抗とコイルとを別個に回路基板上に半田付けで実装しておらず、抵抗層にチップコイルを重ねて配置しているため、設置スペースをとらず、回路基板の小型化を図ることができる。
また、導電性接着剤は導体パターンに設けるランド部に直接塗布されるため、チップ型の抵抗を半田を用いて導体パターンに接続する場合に比べて、ランド部と導電性接着剤の接触面積が少なくても接合強度を保つことができる。
このため回路基板の面積をより小さくすることができ、分岐コネクタを小型化できる。
In the present invention, as described above, the resistor and the coil are not separately mounted on the circuit board by soldering, and the chip coil is placed on the resistance layer so that the installation space is not required, and the circuit The size of the substrate can be reduced.
In addition, since the conductive adhesive is directly applied to the land portion provided in the conductor pattern, the contact area between the land portion and the conductive adhesive is larger than when a chip-type resistor is connected to the conductor pattern using solder. Even if it is at least, the bonding strength can be maintained.
For this reason, the area of a circuit board can be made smaller and a branch connector can be reduced in size.

前記導電性接着剤は、例えば、微粒子状もしくはフィラーにした白金、金、銀、銅、アルミニウム等の導電性金属を高分子系絶縁物に配合して導電性を持たせた材料により形成している。
前記高分子系絶縁物として、フェノール樹脂、ユリア樹脂、ポリエステル樹脂、エポキシ樹脂、シリコン樹脂、ポリエチレン、ポリスチロール、硬質塩化ビニル、軟質塩化ビニル、酢酸セルロース、ポリエチレンテレフタレート、フッ素樹脂、生ゴム、軟質ゴム、エボナイト、ブチルゴム、ネオプレンゴム、シリコンゴム等が挙げられる。
The conductive adhesive is made of, for example, a material that is made conductive by blending a conductive metal such as platinum, gold, silver, copper, aluminum, or the like in the form of fine particles or filler into a polymer-based insulator. Yes.
As the polymer insulator, phenol resin, urea resin, polyester resin, epoxy resin, silicon resin, polyethylene, polystyrene, hard vinyl chloride, soft vinyl chloride, cellulose acetate, polyethylene terephthalate, fluororesin, raw rubber, soft rubber, Examples include ebonite, butyl rubber, neoprene rubber, and silicon rubber.

導電性接着剤とチップコイルからなる波形整形回路の幹線・支線用端子材間のインピーダンスは、使用する通信回路のバスのインピーダンス(Z0)の6%〜50%、好ましくは10%〜22%とすることが好ましい。
前記インピーダンスが6%以上であれば、通信回路の分岐部における信号の反射を減衰させることができる。一方、50%を越えると受信側の電圧低下を招き通信エラーが発生する恐れがある。
The impedance between the trunk / branch terminal material of the waveform shaping circuit comprising the conductive adhesive and the chip coil is 6% to 50%, preferably 10% to 22%, of the impedance (Z0) of the bus of the communication circuit used. It is preferable to do.
When the impedance is 6% or more, the reflection of the signal at the branch portion of the communication circuit can be attenuated. On the other hand, if it exceeds 50%, a voltage drop on the receiving side may be caused and a communication error may occur.

前記波形整形回路の抵抗値は、導電性接着剤の塗布量を変化させることにより調節することができる。
導電性接着剤の抵抗値は、導電性接着剤の塗布面積ではなく、塗布厚さにより調節することができる。即ち、導電性接着剤の塗布面積を一定とした場合、導電性接着剤の塗布の厚みを大とすることで抵抗値を小さくすることができる一方、導電性接着剤の厚みを薄くすることで抵抗値を大きくすることができる。
なお、導電性接着剤の塗布の厚みを一定とした場合に、導電性接着剤を塗布する面積を広くすることにより、断面積が大きくなり抵抗値を小さくすることができる一方、塗布面積を狭くすることで抵抗値を大きくすることができるが、塗布面積を大きくすると、スペースをとるため、塗布厚さで抵抗値を調節することが好ましい。
The resistance value of the waveform shaping circuit can be adjusted by changing the application amount of the conductive adhesive.
The resistance value of the conductive adhesive can be adjusted not by the application area of the conductive adhesive but by the application thickness. That is, when the application area of the conductive adhesive is constant, the resistance value can be reduced by increasing the thickness of the application of the conductive adhesive, while the thickness of the conductive adhesive is reduced. The resistance value can be increased.
In addition, when the thickness of the application of the conductive adhesive is constant, by increasing the area where the conductive adhesive is applied, the cross-sectional area can be increased and the resistance value can be reduced, while the application area is reduced. By doing so, the resistance value can be increased. However, if the coating area is increased, a space is taken, and it is preferable to adjust the resistance value by the coating thickness.

前記コネクタハウジングに上下2段に端子収容室を並設し、各段毎に前記幹線用端子材または支線用端子材を収容していると共に、前記回路基板は前記上下2段の端子収容室の端面側に1つ設けており、
前記幹線及び支線は、差動伝送線路を構成するツイストペア電線あるいはシールドツイストペア電線等のペア電線からなり、該ペア電線の第1通信線と第2通信線の各端末に接続した端子が、前記上下2段の各端子収容室に収容している前記幹線用端子材または支線用端子材とそれぞれ接続されることが好ましい。
The connector housing is arranged in two upper and lower stages in the connector housing, and the main line terminal material or branch line terminal material is accommodated in each stage, and the circuit board is provided in the upper and lower two stage terminal accommodating chambers. One is provided on the end face side,
The trunk line and the branch line are made of a paired electric wire such as a twisted pair electric wire or a shielded twisted electric wire constituting a differential transmission line, and terminals connected to each terminal of the first communication line and the second communication line of the pair electric wire It is preferable that the main line terminal material or the branch line terminal material accommodated in each of the two-stage terminal accommodating chambers is connected.

前記構成によれば、車載用のLANに介設され、通信回路の幹線から支線を分岐する分岐コネクタにおいて、回路基板の幹線ラインと支線ラインとの間に、前記導電性接着剤とチップコイルを並列接続した波形成形回路を介在させているため、前記導電性接着剤とチップコイルを信号の反射を早期に減衰させることができる。   According to the above configuration, in the branch connector that is provided in the in-vehicle LAN and branches the branch line from the trunk line of the communication circuit, the conductive adhesive and the chip coil are disposed between the trunk line and the branch line of the circuit board. Since the waveform forming circuits connected in parallel are interposed, the conductive adhesive and the chip coil can attenuate the reflection of signals at an early stage.

前述したように、本発明の分岐コネクタによれば、抵抗層である導電性接着剤の表面にチップコイルを固着させているので、回路基板上にチップコイルのための面積を確保する必要がない。さらに、導電性接着剤は導体パターンのランド部に直接塗布されるので導電性接着剤とランド部の接触面積が少なくても接合強度を保つことができる。このため、回路基板の面積を小さくすることができ、分岐コネクタを小型化できる。   As described above, according to the branch connector of the present invention, since the chip coil is fixed to the surface of the conductive adhesive that is the resistance layer, it is not necessary to secure an area for the chip coil on the circuit board. . Furthermore, since the conductive adhesive is directly applied to the land portion of the conductor pattern, the bonding strength can be maintained even if the contact area between the conductive adhesive and the land portion is small. For this reason, the area of a circuit board can be made small and a branch connector can be reduced in size.

本発明の実施形態を図面を参照して説明する。
図1乃至図7に本発明の第1実施形態の分岐コネクタ10を示す。
分岐コネクタ10は、図1に示すように、CAN通信(差動伝送方式)を行う車載LAN100において、幹線101から複数本の支線102が分岐する分岐部103を形成するものである。
Embodiments of the present invention will be described with reference to the drawings.
1 to 7 show a branch connector 10 according to a first embodiment of the present invention.
As shown in FIG. 1, the branch connector 10 forms a branch portion 103 in which a plurality of branch lines 102 branch from a trunk line 101 in an in-vehicle LAN 100 that performs CAN communication (differential transmission method).

分岐コネクタ10は図2および図3(A)(B)に示すように、コネクタハウジング11の一側に設けたコネクタ嵌合部16を備えると共に、その背面側の他側に、回路基板20を収容する基板収容部12を備えている。基板収容部12には、プリント基板からなる回路基板20と、回路基板20に半田付けで突設した幹線用端子材31、支線用端子材32を収容している。   As shown in FIGS. 2 and 3A and 3B, the branch connector 10 includes a connector fitting portion 16 provided on one side of the connector housing 11, and a circuit board 20 on the other side of the back side. A substrate housing portion 12 for housing is provided. The board accommodating portion 12 accommodates a circuit board 20 made of a printed circuit board, and a main line terminal material 31 and a branch line terminal material 32 that protrude from the circuit board 20 by soldering.

長方形状の回路基板20には、図4、図6および図7(A)に示すように、長さ方向に沿った図中上下両側辺に沿って、導体パターンからなる幹線ライン21(21−1,21−2)を設け、これら幹線ライン21に挟まれた中央領域に支線ライン22を設けている。前記支線ライン22は、幹線ライン21−1と対向する複数の支線ライン22−1を回路基板20の長さ方向に間隔をあけて形成すると共に、幹線ライン21−2と対向する複数の支線ライン22−2を同様に長さ方向に間隔をあけて形成している。
前記幹線ライン21には複数の支線ライン22と対向する位置にランド部21aを夫々形成する一方、各支線ライン22の幹線ライン側の先端に前記ランド部21aと隙間をあけてランド部22aを形成している。各支線ライン22の他端にもランド部22bを形成し、該ランド部22bの中央に端子孔23を設け、前記支線用端子材32を貫通させて半田付けしている。
前記幹線ライン21の両端にも夫々端子孔24を設け前記幹線用端子材31を貫通させて半田付けしている。
As shown in FIGS. 4, 6, and 7 (A), the rectangular circuit board 20 has a trunk line 21 (21-21) made of a conductor pattern along the upper and lower sides along the length direction. 1, 21-2), and a branch line 22 is provided in a central region sandwiched between the main lines 21. The branch line 22 is formed with a plurality of branch lines 22-1 facing the trunk line 21-1 at intervals in the length direction of the circuit board 20, and a plurality of branch lines facing the trunk line 21-2. 22-2 is similarly formed at intervals in the length direction.
The main line 21 is formed with land portions 21a at positions opposed to the plurality of branch line 22, respectively, while the land portions 22a are formed at the ends of the branch lines 22 on the main line side with gaps between the land portions 21a. is doing. A land portion 22b is also formed at the other end of each branch line 22, a terminal hole 23 is provided in the center of the land portion 22b, and the branch terminal material 32 is penetrated and soldered.
Terminal holes 24 are provided at both ends of the main line 21, respectively, and the main line terminal material 31 is penetrated and soldered.

前記幹線ライン21−1の各ランド部21aと複数の支線ライン22−1の各ランド部22aとの間、同様に、幹線ライン21−2の各ランド部21aと複数の支線ライン22−2の各ランド部22aとの間に、図4、図5に示す波形整形回路25を設け、幹線ライン21を波形整形回路25を介して支線ライン22に分岐接続している。
各波形整形回路25は抵抗層である導電性接着剤26と、導電性接着剤26の表面に接着したチップコイル27を備えている。
Between each land part 21a of the trunk line 21-1 and each land part 22a of the plurality of branch lines 22-1, similarly, each land part 21a of the trunk line 21-2 and a plurality of branch lines 22-2. A waveform shaping circuit 25 shown in FIGS. 4 and 5 is provided between each land portion 22a, and the main line 21 is branched and connected to the branch line 22 via the waveform shaping circuit 25.
Each waveform shaping circuit 25 includes a conductive adhesive 26 which is a resistance layer, and a chip coil 27 bonded to the surface of the conductive adhesive 26.

前記導電性接着剤26は図6(B)及び図7(B)に示すように、ランド部21aと22aの表面及びその間の隙間の基板表面に所要厚さで塗布している。
前記該導電性接着剤26の表面に、図7(C)に示すように、チップコイル27を載置し、該チップコイル27の両端の電極27aを導電性接着剤26に固着して、導電性接着剤26とチップコイル27を並列接続させている。
As shown in FIGS. 6B and 7B, the conductive adhesive 26 is applied to the surfaces of the land portions 21a and 22a and the substrate surface in the gap therebetween with a required thickness.
As shown in FIG. 7C, the chip coil 27 is placed on the surface of the conductive adhesive 26, and the electrodes 27a at both ends of the chip coil 27 are fixed to the conductive adhesive 26 to conduct the conductive. The adhesive 26 and the chip coil 27 are connected in parallel.

詳細には、図7(B)に示すように、対向配置された幹線ライン21の各ランド部21aと支線ライン22のランド部22aにかけて、導電性接着剤26を矩形状に塗布してランド部21aと22aとを導電性接着剤26を介して電気的に接続する。該導電性接着剤26の左右方向Xの幅はランド部21a、22aの幅よりも小さくし、隣接するランド部間に塗布する導電性接着剤26と接触させないようにしている。
前記導電性接着剤26は、銀等の導電性金属からなるフィラーを熱硬化性樹脂と配合して混練したものからなり、前記幹線ライン21および支線ライン22の導電率よりも低くしている。
Specifically, as shown in FIG. 7B, a conductive adhesive 26 is applied in a rectangular shape to each land portion 21a of the main line 21 and the land portion 22a of the branch line 22 that are arranged to face each other. 21 a and 22 a are electrically connected through the conductive adhesive 26. The width of the conductive adhesive 26 in the left-right direction X is made smaller than the width of the land portions 21a and 22a so as not to contact the conductive adhesive 26 applied between adjacent land portions.
The conductive adhesive 26 is made of a filler made of a conductive metal such as silver and kneaded with a thermosetting resin, and has a conductivity lower than that of the trunk line 21 and the branch line 22.

前記導電性接着剤26を塗布した後に、該導電性接着剤26が粘着性を有する状態で、その表面にチップコイル27を載せて固着している。該チップコイル27は、その長さ方向の両端に一対の電極27aを備え、該電極27aを導電性接着剤26と固着して電気的に接続している。
前記のように、チップコイル27を導電性接着剤26と固着した後に、加熱して導電性接着剤26を硬化している。
After the conductive adhesive 26 is applied, a chip coil 27 is placed and fixed on the surface in a state where the conductive adhesive 26 has adhesiveness. The chip coil 27 includes a pair of electrodes 27 a at both ends in the length direction, and the electrodes 27 a are fixedly connected to the conductive adhesive 26 to be electrically connected.
As described above, after the chip coil 27 is fixed to the conductive adhesive 26, the conductive adhesive 26 is cured by heating.

前記幹線ライン21(21−1、21−2)の両端に設けた端子孔24を挿入して半田付けで突設する幹線用端子材31及び、各支線ライン22(22−1、22−2)の他端に設けた端子孔23に挿入して半田付けで突設する支線用端子材32は、いずれも導電性金属材からなる棒体状とし、突出端側に、幹線回路の電線および支線回路の電線の各端末に接続したメス端子と嵌合接続するオス端子部31a、32aを形成している。   The main line terminal material 31 is inserted by inserting the terminal holes 24 provided at both ends of the main line 21 (21-1, 21-2) and protruded by soldering, and the branch line 22 (22-1, 22-2). The branch terminal material 32 that is inserted into the terminal hole 23 provided at the other end and protruded by soldering is in the form of a rod made of a conductive metal material. Male terminal portions 31a and 32a are formed to be fitted and connected to the female terminals connected to the terminals of the wires of the branch circuit.

前記回路基板20を収容するコネクタハウジング11は、図2および図3に示すように、基板収容部12は左右方向Xに長い矩形状の空洞部で、他側のコネクタ嵌合部16との間に仕切壁13が介在し、仕切壁13にコネクタ嵌合部16と基板収容部12に連通する上下2段の端子貫通穴13aを設けている。かつ、基板収容部12の上下左右の側壁の内面には基板係止用段部12aを設けている。   As shown in FIGS. 2 and 3, the connector housing 11 that accommodates the circuit board 20 is a rectangular hollow portion that is long in the left-right direction X, and between the connector fitting portion 16 on the other side. A partition wall 13 is interposed between the upper and lower terminals through-holes 13 a communicating with the connector fitting portion 16 and the substrate housing portion 12. In addition, substrate locking step portions 12 a are provided on the inner surfaces of the upper, lower, left and right side walls of the substrate housing portion 12.

基板収容部12の背面側開口12bから回路基板20を挿入し、回路基板20に突設された幹線用端子材31のオス端子部31aを左右の端子貫通穴13a−1に挿入し、支線用端子材32のオス端子部32aを両側の端子貫通穴13a−1の間に設けた端子貫通穴13a−2に挿入している。
回路基板20は背面側開口12bとほぼ同じ大きさであり、回路基板20の端部はコネクタハウジング11の内壁で保持されると共に、基板係止用段部12aにより係止される。
The circuit board 20 is inserted from the back side opening 12b of the board housing part 12, and the male terminal part 31a of the trunk line terminal material 31 protruding from the circuit board 20 is inserted into the left and right terminal through holes 13a-1 for branch lines. The male terminal portion 32a of the terminal material 32 is inserted into a terminal through hole 13a-2 provided between the terminal through holes 13a-1 on both sides.
The circuit board 20 is substantially the same size as the back side opening 12b, and the end of the circuit board 20 is held by the inner wall of the connector housing 11 and is locked by the board locking step 12a.

また、基板収容部12の背面側開口12bを閉鎖するカバー40を備えている。カバー40は背面側開口12bを閉鎖する側壁40aと、側壁40aの周縁から突出した周壁40bからなり、図2に示すように、周壁40bの内面の所要箇所に、コネクタハウジング11の外面11cに設けた係止突起11aを係止するための係止凹部40cを設けている。
該カバー40はコネクタハウジング11の基板収容部12の背面側開口12bに被せ、コネクタハウジング11の係止突起11aをカバー40の係止凹部40cに係止して、カバー40をコネクタハウジング11に取りつけている。
また、コネクタハウジング11の外面には車体へコネクタハウジング11を固定するロック部11bを設けている。
Further, a cover 40 for closing the back side opening 12b of the substrate housing portion 12 is provided. The cover 40 includes a side wall 40a that closes the rear side opening 12b and a peripheral wall 40b that protrudes from the peripheral edge of the side wall 40a, and is provided on the outer surface 11c of the connector housing 11 at a required position on the inner surface of the peripheral wall 40b as shown in FIG. A locking recess 40c for locking the locking protrusion 11a is provided.
The cover 40 is placed on the back side opening 12b of the board housing portion 12 of the connector housing 11, the locking projection 11 a of the connector housing 11 is locked to the locking recess 40 c of the cover 40, and the cover 40 is attached to the connector housing 11. ing.
Further, a lock portion 11b for fixing the connector housing 11 to the vehicle body is provided on the outer surface of the connector housing 11.

前記分岐コネクタ10のコネクタ嵌合部16には、図3(B)に示すコネクタ50を複数個並列状態で嵌合する構成としており、これらの各コネクタ50は差動伝送線路を構成するツイストペア電線60に接続されている。
各コネクタ50は、上下各1個の端子収容室52(52A、52B)をコネクタハウジング11に設け、上段の端子収容室52Aには、ツイストペア電線60の第1通信線61(CAN_H)の端末に接続したメス端子63Aが挿入係止されている一方、下段の端子収容室52Bには、ツイストペア電線60の第2通信線62(CAN_L)の端末に接続した端子63Bが挿入係止されている。
A plurality of connectors 50 shown in FIG. 3B are fitted in the connector fitting portion 16 of the branch connector 10 in a parallel state, and each of these connectors 50 is a twisted pair electric wire constituting a differential transmission line. 60.
Each connector 50 is provided with one upper and lower terminal accommodating chambers 52 (52A, 52B) in the connector housing 11, and the upper terminal accommodating chamber 52A is connected to the terminal of the first communication line 61 (CAN_H) of the twisted pair electric wire 60. While the connected female terminal 63A is inserted and locked, the terminal 63B connected to the terminal of the second communication line 62 (CAN_L) of the twisted pair electric wire 60 is inserted and locked in the lower terminal accommodating chamber 52B.

前記コネクタハウジング51の表面には弾性係止片53を設け、該弾性片53の外面に突設した係止突起54を分岐コネクタ10のコネクタ嵌合部16の上壁内面に設けた係止突起16aに係止してロック結合する構成としている。   An elastic locking piece 53 is provided on the surface of the connector housing 51, and a locking protrusion 54 provided on the outer surface of the elastic piece 53 is provided on the inner surface of the upper wall of the connector fitting portion 16 of the branch connector 10. It is set as the structure latched on 16a and lock-coupled.

前記構成からなる本発明の分岐コネクタ10では、抵抗層である導電性接着剤26の表面にチップコイル27を固着させ、波形整形回路を構成する抵抗とコイルを並設するのではなく、積層しているため、回路基板20上にチップコイル24のための面積を確保する必要がない。
また、導電性接着剤26はランド部および基板表面に直接塗布されるため、半田を用いる場合に比べてランド部と導電性接着剤26の接触面積が少なくても接合強度を保つことができる。このため、回路基板20を小さくすることができ、分岐コネクタ10を小型化できる。
In the branch connector 10 of the present invention having the above-described configuration, the chip coil 27 is fixed to the surface of the conductive adhesive 26 that is the resistance layer, and the resistor and the coil constituting the waveform shaping circuit are not arranged in parallel but are laminated. Therefore, it is not necessary to secure an area for the chip coil 24 on the circuit board 20.
In addition, since the conductive adhesive 26 is directly applied to the land portion and the substrate surface, the bonding strength can be maintained even if the contact area between the land portion and the conductive adhesive 26 is small as compared with the case where solder is used. For this reason, the circuit board 20 can be made small and the branch connector 10 can be reduced in size.

なお、本実施形態では、分岐コネクタ10に差動伝送線路を構成するツイストペア電線60を接続しているため、コネクタハウジング11内に幹線用端子材31または支線用端子材32を上下2段で配置しているが、ペア電線以外の電線を接続する場合には、コネクタハウジング11に1段あるいは3段以上で幹線用端子材31または支線用端子材32を配置してもよい。該分岐コネクタ10に接続するペア電線はツイストペア電線60に限らず、シールドツイストペア電線60等であってもよい。   In the present embodiment, since the twisted pair electric wire 60 constituting the differential transmission line is connected to the branch connector 10, the main line terminal material 31 or the branch line terminal material 32 is arranged in two stages in the connector housing 11. However, when connecting wires other than the pair wires, the main terminal material 31 or the branch terminal material 32 may be arranged in the connector housing 11 in one or more stages. The pair wires connected to the branch connector 10 are not limited to the twisted pair wires 60 but may be shielded twisted pair wires 60 or the like.

図8(A)は第1実施形態の第1変形例を示す。前記第1実施形態では、導電性接着剤26の左右方向Xの幅はランド部21a、22aの幅より狭くしているが、同一幅としている。   FIG. 8A shows a first modification of the first embodiment. In the first embodiment, the width of the conductive adhesive 26 in the left-right direction X is smaller than the width of the land portions 21a and 22a, but is the same width.

図8(B)に第1実施形態の第2変形例を示す。
第2変形例では、隙間をあけて対向配置されたランド部21aとランド部22aの間に全面的に導電性接着剤26を塗布するのではなく、間隔をあけて両側に導電性接着剤26A、26Bを塗布して、ランド部21aとランド部22aを接続している。
前記2つの導電性接着剤26A,26Bの表面にチップコイル24を接着し、チップコイル27の一対の電極27aはそれぞれ両方の導電性接着剤26A,26Bと電気的に接続させている。
導電性接着剤26A、26Bは抵抗として機能するので、2つの抵抗を並列接続した状態となり、同形状の矩形状の導電性接着剤26を1つ実装するよりも抵抗値を小さくすることができ、抵抗値の調節を行うことができる。また、導電性接着剤26A、26Bとチップコイル24は並列接続される。
なお、他の構成および作用効果は第1実施形態と同様のため、同一の符号を付して説明を省略する。
FIG. 8B shows a second modification of the first embodiment.
In the second modification, the conductive adhesive 26 is not applied to the entire surface between the land portions 21a and the land portions 22a opposed to each other with a gap, but the conductive adhesive 26A is provided on both sides with a space therebetween. 26B is applied to connect the land portion 21a and the land portion 22a.
The chip coil 24 is adhered to the surfaces of the two conductive adhesives 26A and 26B, and the pair of electrodes 27a of the chip coil 27 are electrically connected to both the conductive adhesives 26A and 26B, respectively.
Since the conductive adhesives 26A and 26B function as resistors, the two resistors are connected in parallel, and the resistance value can be made smaller than mounting one rectangular conductive adhesive 26 of the same shape. The resistance value can be adjusted. Further, the conductive adhesives 26A and 26B and the chip coil 24 are connected in parallel.
In addition, since another structure and an effect are the same as that of 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

本発明は前記実施形態に限定されず、本発明の特許請求の範囲内の種々の形態が含まれるものである。   The present invention is not limited to the above-described embodiments, and includes various forms within the scope of the claims of the present invention.

本発明の分岐コネクタにより形成した分岐部を示す概略図である。It is the schematic which shows the branch part formed with the branch connector of this invention. 本発明の第1実施形態の分岐コネクタに相手側コネクタを嵌合した状態での断面図である。It is sectional drawing in the state which fitted the other party connector to the branch connector of 1st Embodiment of this invention. (A)は分岐コネクタの分解斜視図であり、(B)はコネクタ嵌合部に挿入されるコネクタの斜視図である。(A) is an exploded perspective view of a branch connector, (B) is a perspective view of the connector inserted in a connector fitting part. 回路基板の平面図である。It is a top view of a circuit board. 回路基板のI−I断面図である。It is II sectional drawing of a circuit board. (A)は回路基板上の幹線ラインと支線ラインを示した図であり、(B)は導電性接着剤を塗布を示した図である。(A) is the figure which showed the trunk line and branch line on a circuit board, (B) is the figure which showed application | coating with the conductive adhesive. (A)〜(C)は回路基板に導電性接着剤を塗布しチップコイルを固着する説明図である。(A)-(C) are explanatory drawings which apply | coat a conductive adhesive to a circuit board, and adhere a chip coil. 第1実施形態の変形例を示す図である。It is a figure which shows the modification of 1st Embodiment. 従来例を示す図である。It is a figure which shows a prior art example. 他の従来例を示す図であり、(A)は平面図、(B)はB−B断面図、(C)は回路基板に半田を実装した要部拡大図、(D)は回路基板に抵抗とコイルを実装した要部拡大図である。It is a figure which shows another prior art example, (A) is a top view, (B) is BB sectional drawing, (C) is the principal part enlarged view which mounted the solder on the circuit board, (D) is a circuit board. It is the principal part enlarged view which mounted resistance and a coil.

符号の説明Explanation of symbols

10 分岐コネクタ
11 コネクタハウジング
12 基板収容部
12a 基板係止用段部
13 仕切壁
13a 端子貫通穴
16 コネクタ嵌合部
20 回路基板
21 幹線ライン
22 支線ライン
21a、22a ランド部
23 貫通穴
25 波形整形回路
26 導電性接着剤
27 チップコイル
31 幹線用端子材
32 支線用端子材
DESCRIPTION OF SYMBOLS 10 Branch connector 11 Connector housing 12 Board | substrate accommodating part 12a Board | substrate latching step part 13 Partition wall 13a Terminal through hole 16 Connector fitting part 20 Circuit board 21 Trunk line 22 Branch line 21a, 22a Land part 23 Through hole 25 Waveform shaping circuit 26 Conductive adhesive 27 Chip coil 31 Terminal material for trunk line 32 Terminal material for branch line

Claims (3)

幹線から複数の支線を分岐接続する位置に設ける分岐コネクタであって、
コネクタハウジング内に、幹線ラインと支線ラインの導体パターンを設けた回路基板を収容し、前記幹線ラインは抵抗とコイルとを並列接続した波形整形回路を介して前記支線ラインと接続させ、
前記波形整形回路は、前記支線ラインと前記幹線ラインとを隙間を空けて設け、該隙間に導電性接着剤を塗布して抵抗層を設けると共に、該抵抗層の表面にチップコイルを配置し、該チップコイルの両端の電極を前記導電性接着剤に固着して、前記抵抗とコイルとの並列回路を形成しており、さらに、
前記回路基板に、前記幹線ラインに接続した幹線用端子材と、支線ラインに接続した支線用端子材を突設していることを特徴とする分岐コネクタ。
A branch connector provided at a position for branch connection of a plurality of branch lines from a main line,
In a connector housing, a circuit board provided with a conductor pattern of a trunk line and a branch line is accommodated, and the trunk line is connected to the branch line via a waveform shaping circuit in which a resistor and a coil are connected in parallel.
The waveform shaping circuit is provided with a gap between the branch line and the main line, a conductive layer is applied to the gap to provide a resistance layer, and a chip coil is disposed on the surface of the resistance layer. The electrodes at both ends of the chip coil are fixed to the conductive adhesive to form a parallel circuit of the resistor and the coil,
A branch connector characterized in that a branch line terminal material connected to the branch line and a branch line terminal material connected to the branch line are provided on the circuit board.
前記導電性接着剤の塗布量により抵抗値を調節している請求項1に記載の分岐コネクタ。   The branch connector according to claim 1, wherein a resistance value is adjusted by an application amount of the conductive adhesive. 前記コネクタハウジングに基板収容部を並設し、前記回路基板と、前記回路基板に接続した前記幹線用端子材または支線用端子材を収容していると共に、
前記幹線及び支線は、差動伝送線路を構成するツイストペア電線あるいはシールドツイストペア電線等のペア電線からなり、該ペア電線の第1通信線と第2通信線の各端末に接続した端子が、前記幹線用端子材または支線用端子材とそれぞれ接続される構成としている請求項1または請求項2に記載の分岐コネクタ。
A board housing portion is arranged in parallel in the connector housing, and the circuit board and the trunk line terminal material or branch line terminal material connected to the circuit board are housed,
The trunk line and the branch line are made of a paired electric wire such as a twisted pair electric wire or a shielded twisted electric wire constituting a differential transmission line, and the terminal connected to each terminal of the first communication line and the second communication line of the pair electric wire is the main line. The branch connector according to claim 1, wherein the branch connector is configured to be connected to the terminal material for branch or the terminal material for branch line.
JP2006292547A 2006-10-27 2006-10-27 Branching connector Pending JP2008108671A (en)

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JP2011034854A (en) * 2009-08-03 2011-02-17 Nippon Soken Inc Branch connector and information-ransmitting device
JP2012185931A (en) * 2011-03-03 2012-09-27 Furukawa Electric Co Ltd:The Branch connector
JP2012195172A (en) * 2011-03-16 2012-10-11 Furukawa Electric Co Ltd:The Branch connector
JP2022035479A (en) * 2020-08-21 2022-03-04 矢崎総業株式会社 Substrate protection structure used during assembly of inner housing

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JP2011034854A (en) * 2009-08-03 2011-02-17 Nippon Soken Inc Branch connector and information-ransmitting device
JP2012185931A (en) * 2011-03-03 2012-09-27 Furukawa Electric Co Ltd:The Branch connector
JP2012195172A (en) * 2011-03-16 2012-10-11 Furukawa Electric Co Ltd:The Branch connector
JP2022035479A (en) * 2020-08-21 2022-03-04 矢崎総業株式会社 Substrate protection structure used during assembly of inner housing
JP7168619B2 (en) 2020-08-21 2022-11-09 矢崎総業株式会社 PCB protection structure when assembling the inner housing

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