JPH1027704A - Manufacture of resistive part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve resistive parts in manufacturing yield by a method wherein before or after a resistor forming member is thermally treated, one or more elements contained in the member are quantitatively analyzed through a non-destructive method, and the resistor forming member is controlled in volume so that the resistance may be as prescribed. SOLUTION: X-rays 7 are quantified by letting them penetrate through a filter 8, collimated by a collimator 9, limited in irradiation area, and made to fall on a resistor forming member 11 on a board 10. The wavelength or energy intensity of fluorescent X-rays 12 induced by this irradiation is measured by a detector 14 through the intermediary of a filter 13, and elements contained the resistor forming member 11 are quantitatively analyzed by calculator 15. The intensity of fluorescent X-rays obtained from the resistor forming member 11 is in very close correlation with the resistance of a resistor, resistance determining elements are selected out of component elements contained in the member 11, the resistor forming member proper in volume to attain a target resistance is formed through a method such as printing, application, transfer or the like measuring the intensity of fluorescent X-rays of the above elements. By this setup, a resistive part can be lessened in manufacturing cost, and a trimming process can be dispensed with.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a resistor component such as a chip resistor or a hybrid circuit component used in a cellular phone or a small information device.

[0002]

2. Description of the Related Art Conventionally, as a method of manufacturing a resistance component, a method of applying a resistance value to a target value by trimming a resistor formed by printing or the like (hereinafter, referred to as hitting) is disclosed in Japanese Patent Application Laid-Open Publication No. H11-163873. This is introduced in JP-A-52-97158. Also, Japanese Patent Publication No. 55-32009 and Japanese Patent Application Laid-Open
Japanese Patent Application Laid-Open No. 292396/1992 discloses that a resistor is manufactured by a transfer method.

FIG. 5 shows the structure of a conventional resistor. In FIG. 5, 1 is a substrate, 2 is an electrode, and a plurality of resistors are formed at both ends of the resistor 3. As described above, the resistor 3 is formed by a printing or transfer method. Reference numeral 4 denotes a trimming portion, which is a trace where the resistance value is hit to a target value by removing the resistor 3 with a laser or the like. In a normal resistance component, a protective layer (not shown) is formed on the resistor 3 and the trimming portion 4, but is omitted in FIG. Reference numeral 5 denotes a micro crack, and a trimming portion 4
Occurs around the This micro crack 5 is generated regardless of the length and size of the trimming 4,
The noise characteristics of the completed resistor will be degraded.

Here, the reason why the resistance value of the resistor 3 cannot hit the target value is that the undulation or warpage of the substrate 1 affects the printing accuracy of the resistor 3. Therefore, it has been proposed to manufacture the resistor 3 by a transfer method. However, the effect of improving the hit rate of the resistance value is small and causes a cost increase. Not.

FIG. 6 shows an example of improving the hit rate of the resistance value when a conventional resistance component is formed. FIG. 6 shows an example of estimating the resistance value after heat treatment or curing by measuring the thickness and the cross-sectional area of a resistor forming member formed on a substrate or a transfer body. In FIG. 6, the X-axis is the thickness and cross-sectional area of the resistor forming member, and the Y-axis is the measured resistance value after firing or curing. As can be seen from FIG. 6, there is a correlation between the thickness and the cross-sectional area of the resistor forming member and the resistance value of the completed resistor. Unfortunately, however, the correlation is low, and it is difficult to hit the resistance value after heat treatment even if the thickness and cross-sectional area of the resistor are measured with high accuracy before heat treatment. Therefore, trimming by a laser or the like was necessary as described above.

As a method for analyzing the distribution state of the conductive substance in the glass region of the thick film resistor, see Japanese Patent Application Laid-Open No. Hei 5-11339.
No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No. 4, No.
Some seek to provide clues to elucidate the relationship with RC (temperature characteristics of resistance).

[0007]

However, this analysis method is
After baking the thick film resistor paste, it is effective to analyze as a destructive inspection a thick film resistor formed to a thickness of 100 nm or less with the sample peeled from the substrate. This method cannot be used when manufacturing a resistive component while analyzing a thick film resistor before being subjected to non-destructive analysis.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems and reduces the variation in resistance before or after heat treatment in a manufacturing process and manufactures the resistor to a desired value, thereby eliminating a trimming process. An object of the present invention is to reduce the cost of a resistor component by increasing the yield of producing a product within a resistance value region where trimming is possible even when trimming is performed.

[0009]

SUMMARY OF THE INVENTION In order to solve this problem, the present invention provides a method for predicting the resistance value with high accuracy before or after heat treatment by quantitatively analyzing elements of a resistor forming member. is there.

[0010] Thus, when the resistor forming member is formed on the substrate by printing or coating, the hit rate of the resistance value can be increased, and the yield can be increased. Particularly, when a resistor forming member formed on a substrate through a resistor forming step is subjected to elemental analysis before or after heat treatment, and when the result is fed back to the resistor forming step, a large number of resistive parts are manufactured. Cost reduction.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a method of manufacturing a resistor component by heat-treating a resistor forming member formed on a substrate to form a resistor. Before or after the heat treatment, at least one element in the resistor forming member is non-destructively quantitatively analyzed, and a resistance value after the heat treatment is predicted using a calibration curve prepared in advance to form the resistor forming member. This has the effect that the resistance value of the resistance component using the heat treatment type resistor can be hit with the target value with high accuracy.

According to a second aspect of the present invention, there is provided a method of manufacturing a resistance component in which a resistor forming member formed on a substrate is heat-treated as a resistor, before or after the resistor forming member is heat-treated. Later, non-destructive quantitative analysis of at least one element in the resistor forming member is performed, and a resistance value after the heat treatment is predicted using a calibration curve prepared in advance to adjust a heat treatment temperature profile of the resistor forming member. And
This has the effect that the resistance value of the resistance component using the heat treatment type resistor can be hit with the target value with high accuracy.

According to a third aspect of the present invention, there is provided a method of manufacturing a resistance component in which a resistor forming member formed on a substrate is heat-treated to form a resistor. The amount of organic components scattered by the heat treatment of the solvent in the resistor forming member is increased or decreased so that a coating amount corresponding to the resistance value is obtained. Can be hit with high accuracy.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a resistance component by heat-treating a resistor-forming member formed on a substrate to form a resistor, wherein the resistor-forming member is coated on the substrate. The non-organic element of at least one or more non-organic elements in the coated resistor forming member coated so as to obtain a desired resistance value when applied is non-destructively quantitatively analyzed, and the resistor is obtained so as to obtain a desired resistance value. It increases or decreases the amount of the organic component of the forming member, and has an effect that the resistance value of a resistance component using a heat treatment type resistor can be hit with a target value with high accuracy.

According to a fifth aspect of the present invention, there is provided a method for manufacturing a resistance component, in which a resistor forming member formed on a substrate is heat-treated to form a resistor. A plurality of resistor forming members exhibiting different resistance values are mixed so as to have a coating amount corresponding to the resistance value to be used, and the resistance value of a resistance component using a heat treatment type thick film resistor is set to a target value. Has the effect of being able to hit with high precision.

According to a sixth aspect of the present invention, a resistor forming member formed on a substrate is subjected to elemental analysis by X-ray fluorescence in a state formed on the substrate before or after heat treatment. The use of X-rays enables nondestructive and high-speed quantitative analysis of the resistor forming member, and obtains data for accurately hitting a resistance value of a resistance component using a heat treatment type thick film resistor to a target value. Therefore, the resistance component can be reduced in cost.

According to a seventh aspect of the present invention, a resistor forming member formed on a substrate through a resistor forming step is subjected to elemental analysis before or after heat treatment, and the result is fed back to the resistor forming step. By doing so, the resistance value accuracy is improved, and has an effect that the resistance value of the resistance component using the heat treatment type resistor can be hit with the target value with high accuracy.

Next, specific embodiments of the present invention will be described. (Embodiment 1) Embodiment 1 will be described with reference to FIGS. In the first embodiment, the formation amount of the resistor forming member is quantitatively analyzed before or after the heat treatment using a calibration curve prepared in advance, and the formation amount of the resistor forming member is increased or decreased so as to obtain a desired resistance value. Become.

FIG. 1 shows a state in which the resistance value of a resistor forming member is predicted using a fluorescent X-ray measuring apparatus before the resistance value is determined by heat treatment or hardening. In FIG. It is a tube and generates X-rays 7. The generated X-rays 7 are quantified by passing through a filter 8. Note that the filter 8 can also function as a shutter.
Reference numeral 9 denotes a collimator which defines an irradiation area of the X-ray 7. The X-rays 7 squeezed by the collimator 9 are applied to the resistor forming member 11 on the substrate 10. The X-rays 7 applied to the resistor forming member 11 generate fluorescent X-rays at the same time as scattered X-rays. This fluorescent X-ray 12 is passed through a filter 13 to the detector 1.
4 shows that the intensity of the fluorescent X-ray 12 at each wavelength or each energy is measured, and that the element is quantified and analyzed by the computer 15.

FIG. 2 shows the correlation between the fluorescent X-ray intensity and the amount of the substance. FIG. 2 shows that the substance amount and the fluorescent X-ray intensity are proportional to each other. In the first embodiment, one or more elements in the resistor forming member 11 can be selected. For example, ruthenium and glass components can be selected.

FIG. 3 shows the relationship between the fluorescent X-ray intensity of the resistor forming member and the resistance value of the resistor after the heat treatment. It can be seen from FIG. 3 that a very strong correlation is obtained.
In FIG. 3, the X axis represents the resistance value, and the Y axis represents the fluorescent X-ray intensity of the element of the resistor forming member. In the first embodiment, a high-precision correlation as shown in FIG. 3 is obtained by selecting a resistance value determining element from among elements of the resistor forming member 11. In the first embodiment, FIG. 3 is used as a calibration curve, and the resistor forming member 1 is used.
While measuring the intensity of the fluorescent X-rays, the amount of the resistor forming member enough to obtain the target resistance value is formed by a method such as printing, coating and transfer.

This will be described in more detail. First, an example of a method for creating a calibration curve will be described. A commercially available resistor paste was selected as the resistor forming member 11. First, a plurality of electrode patterns were printed on a alumina substrate with a commercially available electrode paste made of silver / palladium, and heat-treated at 850 ° C. Next, the resistor paste was printed at each thickness so as to connect the plurality of electrode patterns, and the printed resistor paste was measured for the fluorescent X-ray intensity of the ruthenium element using a commercially available fluorescent X-ray measuring device. . After the resistor paste was heat-treated at 850 ° C., the resistance value was measured. When this resistance value and the result of the fluorescent X-ray intensity of the ruthenium element were graphed, a very strong correlation similar to that of FIG. 3 was obtained, and this was input to a computer as a calibration curve.

Next, assuming that the target resistance value is 10 kΩ, the X-ray intensity at which this 10 kΩ is obtained is obtained from a calibration curve, and the resistor paste is applied so that the coating amount enough to obtain this X-ray intensity can be obtained. It was adjusted and printed on an alumina substrate on which an electrode pattern was formed. Although the amount of the solvent can be increased or decreased in adjusting the resistor paste, the viscosity may decrease depending on the resistor paste. In that case, a mixed solution of a solvent and a resin (usually called a vehicle or a reducer) can be added. Alternatively, the printing amount can be changed by adjusting the printing pressure and the printing speed on the printing press side.

In this manner, the resistor paste was continuously printed on 3000 alumina substrates, and continuous printing was performed for several hours on each of the alumina substrates so that the applied amount of the resistor paste reached the target value. The printed alumina substrate was leveled for 3 minutes and then continuously put into a heat treatment furnace. When the resistance of the resistor thus completed was measured, it was found that the resistance was 99% of the target resistance of 10 kΩ.
These were within ± 0.5%. Thereafter, by forming a protective layer on the surface of the resistor and forming an end face electrode, a non-trimmed resistor was completed.

A hit test of the resistance value was similarly performed by the conventional method. Similarly, a resistor paste was printed on an alumina substrate on which electrodes were formed, the resistor paste was dried, and the relationship between the dried film thickness and the resistance after heat treatment was graphed. As a result, a weak correlation as shown in FIG. 6 was obtained.
Therefore, this was used as a calibration curve. Next, similarly, the target resistance value is set to 10 kΩ, and 3,000 sheets are continuously formed while adjusting the printed film thickness of the resistor so that the resistance film thickness at which the 10 kΩ is obtained (15.0 μm in the experiment). An alumina substrate was printed. However, since the alumina substrate has a large surface roughness and undulation, it was difficult to measure the printed film thickness of the resistor with high accuracy. In addition, it is troublesome to inspect the alumina substrate which is continuously printed by sampling, and the production cost is increased.

This will be described in more detail. Note that, as the tracer, an element that determines the resistance value, such as ruthenium, can be selected, but other than that, a glass component can be selected.
In this case, it is advisable to create a calibration curve as shown in FIG. 3 for the relationship between the glass components (lead, silicon, aluminum, boron, zinc, etc.) and their resistance values. When a calibration curve was actually prepared, a calibration curve as shown in FIG. 3 was obtained, in which the larger the glass amount, the lower the resistance value, and the smaller the glass amount, the higher the resistance value. Generally, since the resistor paste is mass-produced in lots of several tens of kilograms, the composition ratio in the lot is stable, so that there is no problem even if the amount of glass is used as a tracer. Even if the composition of the resistor paste changes, it can be dealt with by taking a calibration curve similar to that of FIG.

(Embodiment 2) In Embodiment 2, a desired resistance value can be obtained by adjusting the heat treatment temperature of the resistor forming member.

First, electrodes were formed on an alumina substrate in the same manner as in the first embodiment. Then, 2,000 sheets were continuously printed thereon using a commercially available resistor paste. Then, the printed alumina substrate was heat-treated at each temperature to determine a change in resistance value.

As a result, a correlation between the heat treatment temperature and the resistance as shown in FIG. 4 was obtained. In FIG. 4, the X-axis represents the heat treatment temperature (° C.), and the Y-axis represents the resistance value (Ω). In some cases, the correlation did not become linear depending on the resistor material. These were processed by the computer of FIG. 1 to determine the correlation between firing conditions and resistance values. Based on the correlation obtained in this manner, each print sample was heat-treated while adjusting the heat-treatment temperature so as to have a target resistance value. At the same time, we made various experiments on resistance value fluctuations during refiring and made a database. In this way, a firing system was constructed in consideration of the variation of the actual firing furnace, and the yield was increased.

(Third Embodiment) In the third embodiment, the adjustment is made by adjusting the amount of the resistive member formed on the substrate.

This will be described in more detail. First, a commercially available thick film paste was used as the resistor paste. Then, a quantitative analysis was performed on the resistor material having the target resistance value of 0.1Ω. In such a low-resistance material, since a metal material such as silver or palladium other than ruthenium is contained inside the resistor, such a metal material was analyzed in the measurement by fluorescent X-ray. Silver and palladium were also included in the electrode material at both ends of the resistor, but such a material did not affect the measurement accuracy by filtering or adjusting the collimator diameter.

Here, a drawing method was used as a method of forming the resistor forming member on the substrate. In this method, a resistor paste put in a cylinder is pressed and extruded from a small nozzle. The distance between the nozzle and the substrate was kept constant by using a diamond stylus. First, a predetermined amount of the resistor paste was applied under some conditions, and then the resistor paste was subjected to a fluorescent X-ray analysis to quantitatively analyze a metal material. After the sample was fired, the resistance was measured, and a correlation was obtained between the sample and the qualitative analysis.

Next, drawing was performed with an actual product pattern, and the application amount of the resistor paste was adjusted so that the application amount (application amount) became a target resistance value. This coating amount was adjusted by the air pressure supplied to the cylinder. When an incompressible material such as a hydraulic pressure is used for pressing the cylinder, more precise control can be performed.

(Fourth Embodiment) In the fourth embodiment, the adjustment is made by adjusting the amount of the organic material component in the resistor forming member on the substrate.

This will be described in more detail. First, a commercially available thick film paste was used as the resistor paste. Then, this thick film paste was diluted with a solvent and used as gravure ink to perform high-speed printing on an alumina substrate by an offset method using a gravure printing machine. The diluting solvent was automatically supplied using a viscosity adjusting device so that the resistance value fluctuation due to drying of the solvent in the gravure ink did not occur.

By performing quantitative analysis of the printed resistor paste film using fluorescent X-rays, the completed resistance value could be predicted. Also, by adjusting the organic components such as the solvent (or the amount of resin) added to the resistor gravure ink so as to obtain the desired resistance value after firing based on this expectation, it is possible to manufacture a resistance component with a high yield. Was.

(Fifth Embodiment) In the fifth embodiment, adjustment is performed by mixing a plurality of resistor forming members having different resistance values.

This will be described in more detail. First, as a resistor paste, paste A (for 0.005 Ω) and paste B (for 0.015 Ω), which are commercially available, which exhibit different resistance values, are used for ultra-low resistance.
For) was used. Then, the paste A and the paste B were applied to a predetermined shape on an alumina nitride substrate while being blended in a micro dispenser machine, and fired at a low temperature. From these, a blend ratio that would provide a target resistance value was determined, and a prototype was produced while monitoring the blend amount of paste A and paste B using fluorescent X-rays online.

For reference, Paste A and Paste B were blended in advance to try to hit the resistance value. However, since this material was easy to precipitate and separate easily, it was better to blend it on the machine to obtain the resistance value and TCR. (Temperature characteristic) was stable. The paste A and the paste B were obtained by diffusing ultrafine metal particles into an organic solvent.

(Embodiment 6) In Embodiment 6, before or after heat treatment, a resistor forming member formed on a substrate through a resistor forming step is subjected to elemental analysis, and the result is fed back to the resistor forming step. By doing so, the resistance value accuracy is improved.

This will be described in more detail. First, a resistor forming member was formed on a substrate through a resistor forming step. Then, the resistor forming member on this substrate was quantitatively analyzed using fluorescent X-rays. The result is fed back to the resistor forming step to improve the resistance value accuracy. Since the same effect was obtained before the heat treatment of the resistor in this quantitative analysis, it is also possible to quantitatively analyze the resistor forming member before the heat treatment and feed back the result.

When a curable resistor prepared by dispersing carbon black in an epoxy resin or a phenol resin is used as a resistor forming material, the curing temperature is 80 ° C. or higher.
Although the temperature can be lower than 00 ° C., it is preferably lower than 150 ° C. when a resin is used for the substrate.

In the case of a fired thick film resistor made by dispersing a metal powder or ruthenium (or ruthenium oxide) in a resin solution simultaneously with a glass powder as a resistor forming material, the firing temperature is usually 850 ° C. However, a low temperature specification (about 500 ° C.) can be used.

In the case where an electrode solution prepared by dispersing ultrafine metal particles in a solvent is used as the resistor forming material,
It is also possible to form a film at a temperature of at least ° C. In this case, the amount of metal applied (the weight applied per unit area) could be measured with high accuracy by using fluorescent X-rays.

When the correlation between the amount of application of various resistor materials and the resistance value was determined, it was found that it would be better to use a material component that does not scatter due to heat treatment in the resistor forming member. Such materials include ruthenium, nickel,
Metal materials such as silver, copper, gold, platinum, lead, bismuth,
One or more glass materials such as zinc, silicon, and boron can be selected. Alternatively, by using the ratio of the peak height of each element when analyzed by fluorescent X-ray, the resistance value or TCR can be hit with high accuracy before or after the heat treatment.

As a method for quantitatively analyzing the resistor forming member, alpha-rays, beta-rays, gamma-rays and the like can be used in addition to fluorescent X-rays. Thus, high-speed measurement can be performed without contact. In addition, by using a wavelength dispersion type detector instead of an energy dispersion type detector for fluorescent X-rays or the like, it is possible to separate with high precision even if the material has a more adjacent atomic number (for example, ruthenium, silver or palladium).

Further, about 100 to 2000 resistors are simultaneously formed on one substrate such as a chip resistor,
In the production of a resistance component that is divided into individual pieces after firing, mapping of a resistor forming member in a substrate (eg, 0.1)
Quantitative analysis of the element distribution over the entire surface of the substrate of several cm square with the mmφ spot) can also reduce the resistance value distribution in the substrate. By such mapping, for example, an imbalance of squeegee (printing pressure) in screen printing can be found. Specifically, a substrate is set on a screen printing machine or the like, and a number of resistor forming members are printed on the substrate in a product pattern, and this is subjected to quantitative analysis using fluorescent X-rays or the like with a mapping function. It is possible to detect thickness unevenness and coating unevenness of the formed member. By feeding back this result to the printing press, the squeegee balance, the gap balance between the plate and the printing medium, and the like can be automatically calibrated, and printing with even less variation can be performed.

The non-trimming resistor thus produced has a result that the noise characteristic is superior to the conventional trimming product by 10 dB to 20 dB or more. Further, even in the case of trimming, the production yield in the trimmable resistance value region can be improved, and the cost can be reduced.

[0049]

As described above, according to the present invention, in a method of manufacturing a resistance component which is made into a resistor by heat treatment, a resistance value is predicted and obtained with high accuracy before or after heat treatment of the resistor forming member. By obtaining the resistance value, it is possible to obtain an advantageous effect that the manufacturing cost of the resistance component can be reduced and the trimming step can be omitted.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a state in which a resistance value according to an embodiment of the present invention is predicted using a fluorescent X-ray measurement apparatus.

FIG. 2 is an explanatory diagram showing a correlation between a fluorescent X-ray intensity and a substance amount according to an embodiment of the present invention.

FIG. 3 is an explanatory diagram showing the relationship between the fluorescent X-ray intensity of the resistor forming member and the resistance of the resistor after heat treatment according to one embodiment of the present invention;

FIG. 4 is an explanatory diagram showing a correlation between a heat treatment temperature and a resistance value according to one embodiment of the present invention.

FIG. 5 is a partially cutaway perspective view showing the structure of a conventional resistor.

FIG. 6 is an explanatory diagram showing an example of a conventional improvement in the hit rate of a resistance value.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Electrode 3 Resistor 4 Trimming part 5 Micro crack 6 X-ray generating tube 7 X-ray 8 Filter 9 Collimator 10 Substrate 11 Resistor forming member 12 Fluorescent X-ray 13 Filter 14 Detector 15 Computer

Claims (7)

[Claims] In a method of manufacturing a resistance component, wherein a resistor forming member formed on a substrate is heat-treated to be a resistor, at least one of the resistor forming members before or after heat-treating the resistor forming member. A method for manufacturing a resistance component, wherein one or more elements are quantitatively analyzed in a non-destructive manner, and a formation amount of the resistor forming member is adjusted so as to obtain a desired resistance value. 2. A method for manufacturing a resistance component, wherein a resistor forming member formed on a substrate is heat-treated to form a resistor, wherein at least one of the resistor forming members is provided before or after the resistor forming member is heat-treated. A method for manufacturing a resistance component, wherein one or more elements are non-destructively quantitatively analyzed and a heat treatment temperature profile of a resistor forming member is adjusted so as to obtain a desired resistance value. 3. A method of manufacturing a resistance component, wherein a resistor forming member formed on a substrate is heat-treated to form a resistor, wherein the resistor forming member has a coating amount corresponding to a target resistance value on the substrate. A non-destructive quantitative analysis of at least one or more elements of the resistive member formed so as to be applied, and a resistive component for adjusting the amount of coating of the resistive member so as to obtain a desired resistance value. Production method. 4. A method of manufacturing a resistance component, wherein a resistor forming member formed on a substrate is heat-treated to form a resistor, wherein at least one of the resistor forming members is provided before or after the resistor forming member is heat-treated. A method for manufacturing a resistance component, wherein one or more non-organic elements are quantitatively analyzed in a non-destructive manner, and the amount of an organic component in the resistor forming member is increased or decreased so as to obtain a desired resistance value. 5. A method of manufacturing a resistance component, wherein a resistor forming member formed on a substrate is heat-treated to form a resistor, wherein the resistor forming member is different so that a desired resistance value is obtained on the substrate. A method of manufacturing a resistance component in which a plurality of resistor forming members exhibiting a resistance value are mixed. 6. A resistor forming member formed on a substrate,
The method for manufacturing a resistance component according to any one of claims 1 to 5, wherein elemental analysis is performed by X-ray fluorescence before or after the heat treatment. 7. Elemental analysis of a resistor forming member formed on a substrate through a resistor forming step before or after heat treatment,
7. The method for manufacturing a resistance component according to claim 1, wherein the result is fed back to said resistor formation step to improve resistance value accuracy.