JP2008097295A - Temperature control apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature control apparatus capable of easily controlling temperature in a casing by simple configuration. <P>SOLUTION: The temperature control apparatus for controlling temperature in the casing is provided with a control part 2 for executing prescribed arithmetic processing in cooperation with other components arranged on a substrate in the casing and controlling temperature in the casing. When the temperature in the casing is lower than an operation guarantee temperature for guaranteeing the operation of the components on the substrate in the casing, the control part 2 generates heat by idling operation to raise its own temperature until the temperature in the casing reaches the operation guarantee temperature, thereby controlling the temperature in the casing. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a temperature control device that controls the temperature in a housing.

  In order to ensure the operation of each component included in the electronic device (housing), it is necessary to operate each component in a temperature range (temperature guaranteed range) in which the operation of each component is guaranteed. The temperature guarantee range of the parts provided in the electronic device is generally 0 ° C. to 70 ° C., for example, in the part for consumer use, but the operating environment of the electronic device is assumed to be a temperature environment lower than 0 ° C. The

  Conventionally, in order to guarantee the operation of electronic devices in a low temperature environment, parts for industrial applications with a wide guaranteed temperature range are used, or heaters and other heat generating media are installed in electronic devices to generate heat. It was necessary to be within the guaranteed temperature range (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 11-87862

  However, in the above-described conventional technology, since a heating medium such as a heater needs to be arranged in the electronic device, the configuration of the electronic device itself becomes complicated. For this reason, there existed a problem that the production cost of an electronic device became high and the mounting area of an electronic device was pressed.

  As a method for guaranteeing the operation of the electronic device in a low temperature environment without disposing a heat generating medium in the electronic device, there is a method of using parts for industrial use having a wide guaranteed temperature range. However, this method has a problem that the cost of parts increases and the production cost of electronic equipment increases compared to the case of using consumer parts with a narrow guaranteed temperature range.

  The present invention has been made in view of the above, and an object of the present invention is to obtain a temperature control device that can easily perform temperature control in a housing with a simple configuration.

  In order to solve the above-described problems and achieve the object, the present invention provides a temperature control device that controls the temperature in a housing in cooperation with components on the substrate on the substrate disposed in the housing. A temperature control unit that performs predetermined arithmetic processing and controls the temperature in the housing, and the temperature control unit is an operation-guaranteed temperature at which operation of the temperature in the housing is guaranteed for the components in the housing. When the temperature is lower than that, the idle operation is performed until the temperature inside the casing becomes equal to or higher than the operation guarantee temperature, and heat is generated to raise its own temperature.

  According to the present invention, when the temperature in the casing is lower than the guaranteed operation temperature of the component, the temperature control unit idles to generate heat and raise its own temperature. There is an effect that it can be easily performed.

  Embodiments of a temperature control device according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a block diagram showing the configuration of the temperature control apparatus according to the first embodiment of the present invention. The temperature control device 100 is disposed in a housing (a housing 20 described later) that operates as an electronic device or the like, performs predetermined arithmetic processing on a substrate (a substrate 30 described later), and the temperature in the housing 20. To control. The temperature control device 100 includes a temperature sensor 50 that detects the temperature in the housing 20 and a microprocessor 10 that performs predetermined arithmetic processing on the substrate 30.

  The temperature sensor (temperature detection unit) 50 includes a temperature detection unit 4, an operation guarantee temperature storage unit 3, and a low temperature detection signal transmission unit 5. The temperature detection unit 4 is configured to include a temperature detection circuit that detects the temperature in the housing, and inputs the detected temperature in the housing to the low-temperature detection signal sending unit 5 as housing temperature information.

  The operation guarantee temperature storage unit 3 stores a criterion (part operation guarantee temperature) for determining whether or not the control unit 2 is to perform an idle operation (an operation for increasing the temperature of the casing). The operation guarantee temperature storage unit 3 is connected to the low temperature detection signal sending unit 5 and provides the operation guarantee temperature to the low temperature detection signal sending unit 5. The operation guarantee temperature here is a temperature (for example, 0 ° C.) that guarantees the operation of the components (the microprocessor 10 and a component 61 described later) in the housing 20, and the electronic device (the housing 20, the temperature control device). 100).

  The low temperature detection signal sending unit 5 indicates that the inside of the housing is below a predetermined temperature based on the housing temperature information input from the temperature detecting unit 4 and the operation guaranteed temperature stored in the operation guaranteed temperature storage unit 3. It is determined whether or not a low temperature detection signal is sent to the microprocessor 10. The low temperature detection signal sending unit 5 sends the low temperature detection signal to the microprocessor 10 when the temperature of the casing temperature information input from the temperature detection unit 4 is lower than the operation guaranteed temperature stored in the operation guaranteed temperature storage unit 3. It is determined that the data is to be sent, and a low temperature detection signal is sent to the microprocessor 10.

  The microprocessor 10 has a heat generating mechanism 1 and includes a control unit 2 in the heat generating mechanism 1. The heat generating mechanism 1 includes an electronic component, a semiconductor component (not shown), etc. that generate heat while the microprocessor 10 is operating. The heat generating mechanism 1 generates heat while the control unit 2 causes the microprocessor 10 to perform an idle operation, for example, and raises the temperature in the housing 20 by this heat generation.

  The control unit (temperature control unit) 2 controls an idle operation and a normal arithmetic processing operation by the microprocessor 10. Here, the control unit 2 is connected to the temperature sensor 50, and when receiving a low temperature detection signal from the temperature sensor 50, performs an idle operation to increase the temperature in the housing 20. When the control unit 2 does not receive the low temperature detection signal from the temperature sensor 50, the control unit 2 performs a normal arithmetic processing operation and the like.

  Next, an external configuration (cross-sectional configuration) of the housing 20 will be described. FIG. 2 is a cross-sectional view showing an external configuration of the housing. The housing 20 (electronic device) protects the substrate 30 while fixing the substrate 30 disposed therein to the inner wall surface of the housing 20. The housing 20 has a temperature sensor 50, a component 61, a microprocessor 10, and the like mounted on a substrate 30 such as a printed circuit board.

  The component 61 is a component such as an electronic component or a semiconductor component that constitutes an electronic device, and performs predetermined arithmetic processing together with the microprocessor 10. The temperature sensor 50 and the microprocessor 10 are connected on the substrate 30 or in the substrate 30 via predetermined wiring. Here, the temperature sensor 50, the microprocessor 10, and the substrate 30 correspond to the temperature control device 100 described in FIG.

  Next, a temperature control processing procedure of the temperature control apparatus 100 according to the first embodiment will be described. FIG. 3 is a flowchart of a temperature control process performed by the temperature control apparatus according to the first embodiment.

  After the temperature control device 100 is turned on (step S10), the temperature in the housing 20 is measured by the temperature sensor 50 (temperature detection unit 4) of the temperature control device 100 (step S20). The temperature detection unit 4 transmits the measured temperature in the casing 20 to the low temperature detection signal transmission unit 5 as casing temperature information.

  The low temperature detection signal sending unit 5 receives the casing temperature information from the temperature detection unit 4. When the low temperature detection signal sending unit 5 receives the housing temperature information from the temperature detection unit 4, the low temperature detection signal transmission unit 5 extracts the operation guaranteed temperature from the operation guaranteed temperature storage unit 3. Then, the low temperature detection signal sending unit 5 compares the casing temperature information received from the temperature detection unit 4 with the operation guarantee temperature extracted from the operation guarantee temperature storage unit 3, and the detected temperature in the case 20 is detected. It is determined whether or not the temperature is within the guaranteed operating temperature range (eg, 0 ° C. or higher) (step S30).

  When the low temperature detection signal sending unit 5 determines that the detected temperature in the housing 20 is not within the range of the guaranteed operating temperature (NO in step S30), the low temperature detection signal sending unit 5 transmits a low temperature detection signal to the microprocessor 10. Thereby, the control part 2 of the microprocessor 10 receives a low temperature detection signal from the low temperature detection signal sending part 5 of the temperature sensor 50 (step S40).

  The control unit 2 of the microprocessor 10 that has received the low temperature detection signal from the temperature sensor 50 starts operation in the start-up mode (step S50). In the startup mode, the microprocessor 10 operates in an idle state so as not to affect peripheral circuits such as the component 61 (step S60).

  By the operation in the idle state, the microprocessor 10 (heat generation mechanism 1) generates heat. Here, heat propagation in the housing 20 will be described. FIG. 4 is a diagram for explaining heat propagation in the housing according to the first embodiment.

  As shown in the figure, when the microprocessor 10 in the housing 20 generates heat, heat conduction through the air in the housing 20 and heat conduction to the solid surface of the power supply layer and the ground layer in the inner layer of the substrate 30 occur. appear. Thereby, the temperature in the housing | casing 20 rises.

  During the start-up mode, the processes in steps S20 to S60 are repeatedly executed until the temperature in the housing 20 rises within the guaranteed operating temperature range. When the detected temperature in the casing 20 falls within the guaranteed operating temperature range (for example, 0 ° C. or higher) due to heat generated by the microprocessor 10 (step S30, YES), the low temperature detection signal sending unit 5 sends the microprocessor 10 to the microprocessor 10. Stops sending low temperature detection signal. Then, the low temperature detection signal sending unit 5 cancels the temperature detection by the temperature detection unit 4. When the microprocessor 10 no longer receives the low temperature detection signal from the low temperature detection signal sending unit 5, the microprocessor 10 switches from the start-up mode to the normal mode, and starts a normal arithmetic processing operation (becomes in a state to accept an arithmetic processing execution command) (step) S70).

  The substrate 30 is installed in the housing 20 so that the upper surface (lower surface) of the substrate 30 is parallel to the side surface of the housing 20 (the upper surface of the substrate 30 is perpendicular to the bottom surface of the housing 20). In this case, by placing the microprocessor 10 serving as a heat generating electronic component under the substrate 30 (position close to the bottom surface of the casing 20), air warmed by the microprocessor 10 is easily convected in the casing 20. Thereby, the temperature of the electronic component and semiconductor component (component 61 etc.) arrange | positioned at the upper part in the housing | casing 20 can be raised efficiently.

  Further, the temperature sensor 50 may be disposed at any position on the substrate 30, but for example, by being disposed at a position far away from the microprocessor 10, a position within the housing 20 where the temperature does not easily rise. The temperature at can be detected. As a result, the operating temperature of the electronic component or the like can be accurately guaranteed in the housing 20.

  In the present embodiment, the temperature sensor 50 determines whether or not the temperature in the housing 20 is within the guaranteed operating temperature range, but the microprocessor 10 may determine. In this case, only the measured temperature of the housing 20 is transmitted from the temperature sensor 50 to the microprocessor 10. Then, based on the measured temperature of the casing 20 and the guaranteed operating temperature range, the microprocessor 10 determines whether or not the temperature in the casing 20 is within the guaranteed operating temperature range.

  Further, in the present embodiment, the temperature sensor 50 includes the operation guarantee temperature storage unit 3, but the operation guarantee temperature storage unit 3 may include a configuration other than the temperature sensor 50 (component 61, microprocessor 10, etc.). Good. In this case, the low-temperature detection signal sending unit 5 and the microprocessor 10 obtain the operation guaranteed temperature from the operation guaranteed temperature storage unit 3 provided for other than the temperature sensor 50, and whether or not the temperature in the housing 20 is within the operation guaranteed temperature range. Determine whether.

  As described above, according to the first embodiment, when the temperature in the casing 20 is outside the guaranteed operating temperature range, the temperature in the casing 20 is within the guaranteed operating temperature range using the heat generated by the microprocessor 10. Since the temperature in the housing 20 is increased until the temperature reaches, the temperature in the housing 20 can be controlled within the guaranteed operating temperature range.

  Further, since the temperature in the housing 20 is increased by utilizing the heat generated by the microprocessor 10, it is inexpensive without using expensive industrial products even in an environment that is below the guaranteed operating temperature range. In addition, the operation of equipment (electronic parts) can be guaranteed. Therefore, it is possible to easily control the temperature in the housing 20 with a simple configuration.

Embodiment 2. FIG.
Next, a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, the microprocessor 10 has more heat generating components than the temperature control device of the first embodiment by accessing the other components and the like in the start-up mode.

  FIG. 5 is a block diagram showing the configuration of the temperature control device according to the second embodiment of the present invention, and FIG. 6 is a diagram for explaining the heat propagation in the housing according to the second embodiment. 5 and 6, the same numbers are assigned to the components that achieve the same functions as those of the temperature control device 100 and the housing 20 of the first embodiment shown in FIGS. 1 and 4. The description to be omitted is omitted.

  In the temperature control apparatus 100 of the second embodiment, the heat generating mechanism 1 includes a memory 11 and an FPGA (Field Programmable Gate Array) 12 arranged outside the microprocessor 10 in addition to the control unit 2 of the microprocessor 10. .

  The memory 11 is a component that constitutes an electronic device, and stores predetermined information. The FPGA 12 is a component constituting an electronic device, and is a programmable LSI (Large Scale Integration). The memory 11 and the FPGA 12 are disposed on the substrate 30.

  The memory 11 and the FPGA 12 are connected to the control unit 2, and when the microprocessor 10 enters the start-up mode, the control unit 2 accesses the memory 11 and the FPGA 12 so that the memory 11 and the FPGA 12 generate heat. That is, the memory 11 and the FPGA 12 here operate as heat generating components (a part of the heat generating mechanism 1) in the start-up mode in addition to normal operations (storage processing and programming processing).

  In the temperature control apparatus 100, when the microprocessor 10 receives the low temperature detection signal from the temperature sensor 50 and enters the start-up mode, the microprocessor 10 includes peripheral components (memory 11, FPGA 12) is accessed. At this time, the microprocessor 10 accesses the memory 11 and the FPGA 12 so as not to affect other peripheral circuits.

  Note that the components accessed by the microprocessor 10 in the startup mode are not limited to the memory 11 and the FPGA 12, and may be any components in the housing 20 (on the substrate 30).

  Further, when a programmable device such as FPGA 12 or PLD (Programmable Logic Device) is mounted on the substrate 30, a startup mode dedicated circuit (counter circuit or the like) for operating the programmable device independently inside may be prepared in advance. Good. As a result, the startup mode dedicated circuit can be operated during the startup mode, and the number of heat generating components can be increased.

  As described above, according to the second embodiment, since the microprocessor 10 accesses other components on the substrate 30 during the startup mode of the electronic device, the heat generating components in the startup mode are more than the temperature control device 100 according to the first embodiment. Will also increase. Thereby, the temperature of the housing | casing 20 can be raised by many heat-emitting components at the time of start-up mode of an electronic device, and it becomes possible to control the temperature in the housing | casing 20 efficiently and rapidly.

Embodiment 3 FIG.
Next, Embodiment 3 of the present invention will be described with reference to FIG. In the third embodiment, the time required for the housing 20 to reach the guaranteed operating temperature by the idle operation of the microprocessor 10 (hereinafter referred to as the guaranteed operating temperature arrival time) is calculated in advance. In the start-up mode, the microprocessor 10 performs an idle operation during the operation guarantee temperature reaching time calculated in advance.

  When the electronic device is used in an environment where the ambient temperature of the electronic device is constantly below the guaranteed operating temperature, the shape and physical properties of the housing 20, the substrate 30, the electronic component (component 61, microprocessor 10), etc. From the value, the time until the inside of the housing 20 reaches the operation guarantee temperature (operation guarantee temperature arrival time) is calculated.

  For example, when the ambient temperature of the housing 20 is constant, the operation guarantee temperature reaching time can be obtained from the thermal time constant of the electronic device. Specifically, the thermal time constant τ can be calculated by a calculation formula of thermal resistance R × heat capacity C. Further, the thermal resistance R of the entire electronic device can be calculated from the casing 20, the substrate 30, the element (not shown), the thermal resistance of air in the casing 20, and the thermal capacity C is the casing 20, the element, the casing. It can be calculated from the specific heat and volume of air in 20.

  The operation guarantee temperature arrival time calculated in this way is stored in the microprocessor 10 or the like. In the start-up mode, the control unit 2 performs an idle operation of the microprocessor 10 during the stored operation guarantee temperature reaching time.

  FIG. 7 is a diagram for explaining heat propagation in the housing according to the third embodiment. Among the constituent elements in FIG. 7, constituent elements that achieve the same functions as those of the housing 20 of the first embodiment shown in FIG. 4 are given the same numbers, and redundant descriptions are omitted. The housing 20 in FIG. 7 does not include the temperature sensor 50 on the substrate 30 as compared with the housing 20 illustrated in FIG. 4.

  When the power of the electronic device is turned on in an environment lower than the operation guarantee temperature (for example, the ambient temperature of the housing 20 is −5 ° C.), the microprocessor 10 of the temperature control device 100 stores the operation guarantee temperature arrival time stored. During startup mode. Thereby, it becomes possible to control the temperature in the housing 20 within the guaranteed operating temperature range without using the temperature sensor 50.

  In the third embodiment, the temperature in the housing 20 may be increased using the heat generating mechanism 1 described in the first embodiment, or the heat generating mechanism 1 described in the second embodiment may be used. The temperature in 20 may be raised.

  In the third embodiment, the microprocessor 10 performs the idle operation using the operation guarantee temperature arrival time calculated in advance. However, the operation guarantee temperature arrival time is calculated after the electronic device is turned on. May be. In this case, the shape and physical property values of the housing 20, the substrate 30, the electronic components, etc. are stored in advance in a means for calculating the operation guarantee temperature arrival time (not shown). Then, after the electronic device is turned on, the operation guaranteed temperature arrival time is calculated by means for calculating the operation guaranteed temperature arrival time, and the microprocessor 10 performs an idle operation using the calculated operation guaranteed temperature arrival time.

  As described above, according to the third embodiment, since the idle operation of the microprocessor 10 is performed using the operation guarantee temperature arrival time calculated in advance, the temperature control in the housing 20 can be performed without using the temperature sensor 50. This can be easily performed with a simple configuration.

Embodiment 4 FIG.
Next, a fourth embodiment of the present invention will be described. In the fourth embodiment, when the temperature in the housing 20 is out of the guaranteed operating temperature range during normal operation of the electronic device, the microprocessor 10 interrupts normal operation and switches to the startup mode.

  In the fourth embodiment, for example, the temperature in the housing 20 is controlled by a temperature control device similar to the temperature control device 100 in FIG. 1 described in the first embodiment, and thus the description of the configuration of the temperature control device is omitted.

  The electronic device performs normal operation when the temperature in the housing 20 is within the guaranteed operating temperature range. During this time, the temperature detection unit 4 of the temperature sensor 50 detects the temperature in the housing 20 and inputs the detected temperature in the housing 20 to the low temperature detection signal sending unit 5 as the housing temperature information.

  Then, the low-temperature detection signal sending unit 5 determines whether or not the temperature of the casing temperature information input from the temperature detection unit 4 is lower than the operation guarantee temperature stored in the operation guarantee temperature storage unit 3. ing.

  If the temperature inside the casing 20 falls outside the guaranteed operating temperature range (when the temperature falls below the guaranteed operating temperature) due to a decrease in the ambient temperature of the casing 20 during normal operation of the electronic device, the low temperature detection signal sending unit 5 Determines that the temperature of the casing temperature information input from the temperature detection unit 4 is lower than the operation guarantee temperature stored in the operation guarantee temperature storage unit 3, and transmits a low temperature detection signal to the microprocessor 10. .

  As a result, the microprocessor 10 (control unit 2) interrupts the normal operation and switches to the startup mode. The microprocessor 10 operates in an idle state so as not to affect the peripheral circuits.

  While operating in the idle state, the temperature detection unit 4 of the temperature sensor 50 detects the temperature in the housing 20, and uses the detected temperature in the housing 20 as the housing temperature information as the low temperature detection signal sending unit 5. To enter.

  Then, the low temperature detection signal sending unit 5 determines whether or not the temperature of the casing temperature information input from the temperature detection unit 4 is higher than the operation guarantee temperature stored in the operation guarantee temperature storage unit 3. When the temperature in the housing 20 falls within the guaranteed operating temperature range during operation in the idle state, the low temperature detection signal sending unit 5 indicates that the temperature of the housing temperature information input from the temperature detecting unit 4 is the guaranteed operating temperature. It is determined that the temperature is higher than the operation guarantee temperature stored in the storage unit 3, and the transmission of the low temperature detection signal to the microprocessor 10 is stopped.

  When the microprocessor 10 does not receive the low temperature detection signal from the low temperature detection signal sending unit 5, the microprocessor 10 switches from the start-up mode to the normal mode and starts normal operation. And the temperature detection part 4 of the temperature sensor 50 restarts the temperature detection in the housing | casing 20. FIG.

  As described above, in the fourth embodiment, when the temperature in the housing 20 is outside the guaranteed operating temperature range, the microprocessor 10 interrupts the normal operation and switches to the start-up mode, and the temperature in the housing 20 operates. When the temperature is within the guaranteed temperature range, the microprocessor 10 interrupts the startup mode and switches to normal operation.

  As described above, according to the fourth embodiment, when the electronic device operates, the microprocessor 10 operates while switching between the normal operation and the start-up mode according to the temperature in the housing 20. It becomes possible to accurately control the temperature in the housing 20 in accordance with the temperature change.

Embodiment 5. FIG.
Next, a fifth embodiment of the present invention will be described with reference to FIGS. In the fifth embodiment, a good heat conductor is disposed on the substrate 30 with respect to the temperature control device 100 of the first to fourth embodiments, and the heat generated from the microprocessor 10 is propagated through the good heat conductor.

  Here, as an example of the temperature control device 100 according to the fifth embodiment, a case where a good heat conductor is disposed on the substrate 30 of the temperature control device 100 according to the first embodiment shown in FIG. 4 will be described.

  FIG. 8 is a diagram for explaining heat propagation in the housing according to the fifth embodiment. Of the constituent elements in FIG. 8, constituent elements that achieve the same functions as those of the housing 20 of the first embodiment shown in FIG. 4 are given the same numbers, and redundant descriptions are omitted.

  In the case 20 of the fifth embodiment, a good conductor of heat is disposed in a place (such as the component 61) where heat generated from the microprocessor 10 is difficult to spread within the surface of the substrate 30. Specifically, the heat pipe 7 is installed on the upper surface of the microprocessor 10 (heat generating electronic component) and the component 61 so that the microprocessor 10 and the component 61 are in contact with the heat pipe (first heat propagation portion) 7. As a result, as shown in FIG. 9, the heat pipe 7, which is a good heat conductor, transfers heat generated from the microprocessor 10 to the component 61 and the like, so that the surface of the substrate 30 can be equalized.

  In the fifth embodiment, the heat pipe 7 is installed on the substrate 30 as a good heat conductor. However, the good heat conductor is not limited to the heat pipe 7, and an aluminum plate or a heat spreader may be installed.

  As described above, according to the fifth embodiment, when the heat pipe 7 which is a good conductor of heat is disposed on the substrate 30 and the start-up mode is set, the heat generated from the microprocessor 10 is transferred via the heat pipe 7. Therefore, the temperature in the housing 20 can be efficiently controlled.

Embodiment 6 FIG.
Next, a sixth embodiment of the present invention will be described with reference to FIGS. In the sixth embodiment, a good heat conductor is disposed in the inner layer portion of the substrate 30 with respect to the temperature control device 100 of the first to fifth embodiments, and the heat generated from the microprocessor 10 is propagated through the good heat conductor. .

  Here, as an example of the temperature control apparatus 100 according to the sixth embodiment, a case where a good heat conductor is disposed on the substrate 30 of the temperature control apparatus 100 according to the first embodiment shown in FIG. 4 will be described.

  10 and 11 are diagrams for explaining heat propagation in the housing according to the sixth embodiment. 10 and 11, the same reference numerals are given to the components that achieve the same functions as those of the housing 20 of the first embodiment shown in FIG. 4, and duplicate descriptions are omitted.

  The casing 20 of the sixth embodiment uses a substrate 30 in which a metal core (second heat propagation part) 8 is arranged in an intermediate layer of the substrate 30 such as a metal core substrate as a material of the substrate 30. When the microprocessor 10 enters the start-up mode, the metal core 8 such as a copper core is used as a solid ground (solid GND), and the heat generating mechanism 1 of the microprocessor 10 and the heat pipe 7 are connected. Thereby, as shown in FIG. 11, the metal core 8 which is a good conductor of heat performs heat transport of heat generated from the microprocessor 10, and the surface of the substrate 30 can be equalized.

  As described above, according to the sixth embodiment, the metal core 8 which is a good conductor of heat is disposed on the inner layer portion of the substrate 30 and the metal core 8 is used as a solid ground when the startup mode is entered. Heat generated from the processor 10 can be propagated on the substrate 30 (component 61) through the metal core 8. Therefore, it is possible to efficiently control the temperature in the housing 20.

  As described above, the temperature control device according to the present invention is suitable for temperature control in the housing.

1 is a block diagram showing a configuration of a temperature control device according to a first embodiment. It is sectional drawing which shows the external appearance structure of a housing | casing. 3 is a flowchart showing a temperature control processing procedure of the temperature control apparatus according to the first embodiment; FIG. 6 is a diagram for explaining heat propagation in the housing according to the first embodiment. It is a block diagram which shows the structure of the temperature control apparatus concerning Embodiment 2. FIG. FIG. 6 is a diagram for explaining heat propagation in a housing according to the second embodiment. FIG. 10 is a diagram for explaining heat propagation in the housing according to the third embodiment. FIG. 10A is a diagram (1) for explaining heat propagation in a housing according to the fifth embodiment; FIG. 10B is a diagram (2) for explaining heat propagation in the casing according to the fifth embodiment; FIG. 10A is a diagram (1) for explaining heat propagation in a housing according to the sixth embodiment; FIG. 10B is a diagram (2) for explaining heat propagation in the housing according to the sixth embodiment;

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heat generating mechanism 2 Control part 3 Operation guarantee temperature memory part 4 Temperature detection part 5 Low temperature detection signal sending part 7 Heat pipe 8 Metal core 10 Microprocessor 11 Memory 12 FPGA
20 housing 30 substrate 50 temperature sensor 61 component 100 temperature control device

Claims (8)

In the temperature control device that controls the temperature inside the housing,
A temperature control unit that performs predetermined arithmetic processing in cooperation with components on the substrate on the substrate disposed in the housing and controls the temperature in the housing,
The temperature control unit performs an idle operation until the temperature in the housing becomes equal to or higher than the operation-guaranteed temperature when the temperature in the housing is lower than the operation-guaranteed temperature that is guaranteed for the components in the housing. A temperature control device that generates heat and raises its own temperature. A temperature detection unit for detecting the temperature in the housing;
The temperature control device according to claim 1, wherein the temperature control unit performs the idle operation when the temperature detection unit detects a temperature lower than the operation guarantee temperature.   The temperature control unit stops the idle operation and performs the predetermined calculation process when the temperature detection unit detects a temperature higher than the operation guarantee temperature during the idle operation. The temperature control device according to claim 1 or 2.   The temperature control unit stops the predetermined calculation process and performs the idle operation when the temperature detection unit detects a temperature lower than the operation guarantee temperature during the predetermined calculation process. The temperature control apparatus according to any one of claims 1 to 3, wherein   The temperature control unit performs an idle operation for a period of time calculated for each case and necessary for an idle operation time required until the operation guarantee temperature is reached after power is turned on. The temperature control device according to claim 1, wherein the temperature is increased.   When the temperature controller raises its own temperature by performing an idle operation, it accesses another component different from the component on which it is installed to heat the other component and raise the temperature of the other component. The temperature control device according to any one of claims 1 to 5, wherein   The component operating in the housing and the temperature control unit are connected, and when the temperature control unit idles to generate heat, heat from the temperature control unit is transferred to the component operating in the housing. The temperature control device according to any one of claims 1 to 6, further comprising a first heat propagation unit to be operated.   The temperature control unit is arranged between the layers of the substrate as a ground line of the temperature control unit, and when the temperature control unit generates heat by idle operation, heat from the temperature control unit is heated to components operating in the casing. The temperature control device according to claim 1, further comprising a second heat propagation unit that propagates.

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