JP2004006473A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit Download PDF

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Publication number
JP2004006473A
JP2004006473A JP2002159088A JP2002159088A JP2004006473A JP 2004006473 A JP2004006473 A JP 2004006473A JP 2002159088 A JP2002159088 A JP 2002159088A JP 2002159088 A JP2002159088 A JP 2002159088A JP 2004006473 A JP2004006473 A JP 2004006473A
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JP
Japan
Prior art keywords
temperature
circuit
functional circuit
functional
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002159088A
Other languages
Japanese (ja)
Inventor
Kazufumi Ishikawa
Kyohiko Mizobata
Kazuhiro Yoshida
吉田 和弘
溝端 教彦
石川 和史
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, 松下電器産業株式会社 filed Critical Matsushita Electric Ind Co Ltd
Priority to JP2002159088A priority Critical patent/JP2004006473A/en
Publication of JP2004006473A publication Critical patent/JP2004006473A/en
Pending legal-status Critical Current

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Abstract

A semiconductor integrated circuit that can guarantee operation in a low-temperature environment is provided.
An entire semiconductor integrated circuit includes a functional circuit, a control circuit for controlling operation and output of the functional circuit, and a temperature detecting element for detecting a temperature of the functional circuit.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor integrated circuit having a control circuit capable of controlling a temperature of a functional circuit so that the functional circuit operates at an appropriate temperature.
[0002]
[Prior art]
The so-called normal temperature specification is a standard design of a semiconductor integrated circuit so that a normal function operates at normal temperature. Even though the room temperature specification is used, the semiconductor integrated circuit may be used in a cold region or an extremely cold region, so that the operating temperature of the semiconductor integrated circuit may be minus several tens of degrees (° C.).
[0003]
Normally, a semiconductor integrated circuit does not include a function of controlling its own temperature. Therefore, even in a low-temperature environment such as an extremely cold region or a high-temperature environment such as a scorching region, in order to guarantee the operation of the semiconductor integrated circuit so that it operates normally, within a predetermined guaranteed temperature from low to high temperatures. The design and manufacture of a semiconductor integrated circuit are performed based on the assumption that normal operation is performed.
[0004]
As a measure for keeping the operating temperature constant, generally, by forming a functional circuit element on a substrate whose temperature can be controlled, or, for example, as shown in JP-A-2000-31974, The operating temperature of the functional element has been controlled by bringing at least a part of the functional element into contact with a thermal isolation structure having a function of converting an electric signal into heat.
[0005]
As described above, a semiconductor integrated circuit is designed with specifications that guarantee its operation when used within a predetermined guaranteed temperature from a low temperature to a high temperature.
[0006]
[Problems to be solved by the invention]
Actually, when the circuit operates, it generates heat, so it is rarely used for a long time in a cryogenic environment at a very low temperature.However, when the power is turned on in a cryogenic environment, the It operates in a low temperature condition, and its operation may fluctuate or malfunction.Therefore, it is necessary to guarantee operation from low to high temperature so that such operation does not occur, and therefore use in a low temperature environment It takes a great deal of man-hours to design a specification that can withstand.
[0007]
Further, even when the temperature of the semiconductor integrated circuit becomes higher than the guaranteed temperature in the specification design, the circuit may malfunction or malfunction.
[0008]
The present invention has been made to overcome the above-described disadvantages, and has as its object to provide a semiconductor integrated circuit that can operate in a predetermined temperature range.
[0009]
[Means for Solving the Problems]
The present invention has a function circuit on a semiconductor substrate, a temperature detection element for detecting the temperature of the function circuit, and a control circuit for controlling the temperature of the function circuit, in order to achieve the above object, When the temperature of the functional circuit is lower than the operation guarantee minimum temperature of the function, the control circuit operates part or all of the functional circuit to raise the temperature of the functional circuit, and Provided is a semiconductor integrated circuit that is controllable so that an output is not output to the outside, whereby the temperature can be controlled so that the functional circuit always operates normally at an appropriate temperature.
[0010]
Further, the present invention provides a functional circuit on a semiconductor substrate, a temperature detecting element for detecting a temperature of the functional circuit, a heating circuit for increasing a temperature inside or outside the functional circuit, a temperature of the functional circuit and a temperature of the functional circuit. A control circuit for controlling the heating circuit for increasing the temperature, wherein when the temperature of the functional circuit is lower than the operation guarantee minimum temperature of the function, the control circuit operates the heating circuit for increasing the temperature, and Provided is a semiconductor integrated circuit that can be controlled so as not to output an output from the functional circuit to the outside while increasing the temperature of the circuit, so that the functional circuit always operates normally at an appropriate temperature. Temperature can be controlled.
[0011]
Further, in the semiconductor integrated circuit according to the present invention, the temperature of the functional circuit is increased until the temperature of the functional circuit reaches the operation guarantee minimum temperature, and thereafter, the temperature increasing operation of the functional circuit by the temperature increasing heating circuit is performed. The temperature of the functional circuit can be controlled so that the functional circuit always operates normally at an appropriate temperature.
[0012]
Furthermore, the semiconductor integrated circuit of the present invention does not output the signal of the semiconductor integrated circuit to the outside until the functional circuit reaches the operation guarantee minimum temperature, and when the functional circuit reaches the operation guarantee minimum temperature, By initializing the functional circuit and controlling the semiconductor integrated circuit to output a signal to the outside, the temperature can be controlled so that the functional circuit always operates normally at an appropriate temperature.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail. FIG. 1 is a circuit element block diagram according to the embodiment of the present invention. In FIG. 1, the entire semiconductor integrated circuit 11 on a substrate, a functional circuit 12 for realizing an original function, a control circuit 13 for controlling the operation and output of the functional circuit 12, and a temperature detecting element 14 for detecting the temperature of the functional circuit 12 Are respectively shown.
[0014]
An external input signal to the semiconductor integrated circuit 11 is input to the functional circuit 12 through an input signal line 15.
[0015]
The control circuit 13 determines whether or not the temperature of the functional circuit 12 is lower than a minimum temperature at which the function is guaranteed, that is, a so-called operation guarantee minimum temperature, based on a signal from the temperature detecting element 14 present inside the functional circuit 12. When the temperature of the circuit 12 is lower than the operation guarantee minimum temperature, the signal appearing on the output signal line 16 of the function circuit 12 is kept until the temperature of the function circuit 12 becomes higher than the operation guarantee minimum temperature. The temperature of the functional circuit 12 is increased by controlling the output of the entire semiconductor integrated circuit 11 so as not to be output from the output signal line 17 to the outside, and operating a part or all of the functional circuit 12.
[0016]
After the temperature of the functional circuit 12 reaches or exceeds the operation guarantee minimum temperature, the control circuit 13 initializes the functional circuit 12, and a signal appearing on the output signal line 16 of the functional circuit 12 passes through the control circuit 13. , From the output signal line 17 as an output signal of the entire semiconductor integrated circuit 11.
[0017]
As a result, in the entire semiconductor integrated circuit 11, the operation at a low temperature can be guaranteed only by adding the control circuit 13 and the temperature detection element 14 to the functional circuit 12, so that the number of steps in designing the functional circuit 12 increases. Is almost gone.
[0018]
In addition, since the function originally included in the functional circuit 12 can be used to raise the temperature of the functional circuit 12, the increase in the circuit area of the entire semiconductor integrated circuit 11 is caused by the control circuit 13 and the temperature detection. It is sufficient to increase by the circuit area of the element 14.
[0019]
In the above-described embodiment, the temperature detecting element 14 is described as being inside the functional circuit 12, but the temperature detecting element 14 may be outside the functional circuit 12 on the substrate.
[0020]
Further, after the temperature of the functional circuit 12 reaches or exceeds the operation guarantee minimum temperature, the operation for increasing the temperature is stopped. However, the temperature decreases when the function circuit 12 operates and drops below the operation guarantee minimum temperature. In this case, the control circuit 13 controls again the signal on the output signal line 16 of the functional circuit 12 so as not to be output from the output signal line 17 to the outside as the output signal of the entire semiconductor integrated circuit 11. A part of or all of the functional circuit 12 is operated by 13 to raise the temperature of the functional circuit 12. Then, after the temperature of the functional circuit 12 is restored to the above-mentioned minimum temperature for operation guarantee, the control circuit 13 initializes the functional circuit 12 again, and the signal of the output signal line 16 of the functional circuit 12 passes through the control circuit 13. Alternatively, the output signal of the entire semiconductor integrated circuit 11 may be output from the output signal line 17 to the outside. Even in this case, since the operation result of the functional circuit 12 at a temperature lower than the operation guarantee minimum temperature is not output to the outside, it is possible to avoid outputting an abnormal signal from the entire semiconductor integrated circuit 11 to the outside. .
[0021]
Further, instead of stopping the output from the output signal line 17 as described above, the control circuit 13 detects the tendency of the temperature to drop below the operation guarantee minimum temperature when the functional circuit 12 operates, and By operating the remaining circuit elements that are not operating within 12 to increase the temperature thereof, it is also possible to continue controlling so that the temperature does not fall below the operation guarantee minimum temperature. According to this, since the functional circuit 12 does not malfunction below the operation guarantee minimum temperature, the aging operation of the entire semiconductor integrated circuit 11 can be stabilized.
[0022]
FIG. 2 is a block diagram according to another embodiment of the present invention. 2, the entire semiconductor integrated circuit 21, a functional circuit 22, a control circuit 23 for controlling the operation and output of the functional circuit 22, a temperature detecting element 24 for detecting the temperature of the functional circuit 22, an input signal line 25, and a functional circuit 22 , An output signal line 27 from the entire semiconductor integrated circuit 21 and a heating circuit 28 for temperature rise.
[0023]
An input signal from outside the entire semiconductor integrated circuit 21 is first input to the functional circuit 22 through the input signal line 25. The control circuit 23 determines whether the temperature of the functional circuit 22 is lower than the lowest temperature at which the function is guaranteed, that is, the so-called minimum operation guarantee temperature, based on a signal from the temperature detection element 24 inside the functional circuit 22. . When the temperature of the functional circuit 22 is lower than the minimum operation guarantee temperature, the control circuit 23 controls the output signal line of the functional circuit 22 until the temperature of the functional circuit 22 becomes higher than the minimum operation guarantee temperature. The control is performed so that the output from 26 is not output to the outside from the output signal line 27 as the output of the entire semiconductor integrated circuit 21.
[0024]
At the same time, the temperature of the functional circuit 22 is increased by operating the temperature increasing heat generating circuit 28 by the control circuit 13 during that time. After the temperature of the functional circuit 22 reaches or exceeds the minimum operation guarantee temperature, the control circuit 23 initializes the functional circuit 22 and outputs an output signal appearing on the output signal line 26 of the functional circuit 22 through the control circuit 23. The output of the entire semiconductor integrated circuit 21 is output from the output signal line 27 to the outside.
[0025]
As a result, in the entire semiconductor integrated circuit 21, the operation at a low temperature can be guaranteed only by adding the control circuit 23, the temperature detecting element 24, and the heating circuit 28 for increasing the temperature to the functional circuit 22. In designing, man-hours hardly increase. Further, since the heating circuit for temperature rise 28 is separated from the functional circuit 22, the temperature can be controlled by a dedicated circuit.
[0026]
In the above-described embodiment, the description has been given assuming that the temperature detecting element 24 exists inside the functional circuit 22. However, the temperature detecting element 24 may be similarly operated when the temperature detecting element 24 is present on a substrate outside the functional circuit 22. it can.
[0027]
In the above-described embodiment, the heat-up circuit 28 for increasing the temperature is provided outside the functional circuit 22. However, the heat-generating circuit 28 can be similarly operated when included in the functional circuit 22 or the control circuit 23. .
[0028]
Further, after the temperature of the functional circuit 22 has reached or exceeded the operation guarantee minimum temperature, the operation for increasing the temperature is stopped. However, the temperature decreases during the operation of the function circuit 22 and falls below the operation guarantee minimum temperature. In this case, control is performed again by the control circuit 23 so that the signal on the output signal line 26 of the functional circuit 22 is not output from the output signal line 27 to the outside as the output signal of the entire semiconductor integrated circuit 21. You can also. In the meantime, the temperature increasing heating circuit 28 is operated to increase the temperature of the functional circuit 22. After the temperature of the functional circuit 22 reaches the minimum operation guarantee temperature, the functional circuit 12 is initialized again. By doing so, the signal on the output signal line 26 of the functional circuit 22 can be output to the outside from the output signal line 27 as an output signal of the entire semiconductor integrated circuit 21 through the control circuit 23. In this case, since an operation result at or below the operation guarantee minimum temperature is not output, a situation in which a malfunction signal is given to an external device can be avoided even for the entire semiconductor integrated circuit 21.
[0029]
Furthermore, as described above, instead of stopping the output from the output signal line 27, when the temperature decreases during the operation of the functional circuit 22, the temperature is controlled by the control circuit 23 to the minimum operation guarantee temperature. It is also possible to continue to control the temperature increasing heat generating circuit 28 by noting that the temperature does not fall below. This prevents the functional circuit 22 from malfunctioning below the operation guarantee minimum temperature, so that the entire semiconductor integrated circuit 21 can be stably operated.
[0030]
【The invention's effect】
According to the semiconductor integrated circuit of the present invention, even when the ambient temperature is lower than the temperature at which the function of the functional circuit is guaranteed, that is, the circuit operation is started at a temperature lower than the minimum operation guarantee temperature, the control circuit controls the entire semiconductor integrated circuit. Since the temperature of the functional circuit can be raised until the operation guarantee minimum temperature is reached without outputting an output signal to the outside, for example, even in an extremely low temperature environment where the operation of the functional circuit is not guaranteed, The circuit can operate normally.
[0031]
Further, according to the semiconductor integrated circuit of the present invention, since the entire semiconductor integrated circuit does not output an external signal until the functional circuit reaches a normal operation, the peripheral device caused by the signal from the semiconductor integrated circuit is not output. Malfunction can be avoided, and the reliability can be improved.
[0032]
Furthermore, if the operation of the control circuit is guaranteed to a low temperature, the temperature at which the operation of the functional circuit is guaranteed can be increased, so that the burden on each element used in the functional circuit in accordance with the design criteria of the specifications can be reduced.
[Brief description of the drawings]
FIG. 1 is a block diagram of a semiconductor integrated circuit according to an embodiment of the present invention. FIG. 2 is a block diagram of a semiconductor integrated circuit according to another embodiment of the present invention. FIG. 3 is a cross-sectional view of a conventional thermal electronic device. FIG. 4 is a plan view showing a conventional semiconductor integrated circuit.
11, 21 Entire semiconductor integrated circuit 12, 22 Functional circuit 13, 23 Control circuit 14, 24 Temperature detecting element 15, 25 Input signal line 16, 26 Output signal line 17, 27 from functional circuit Output signal line 28 Heat generation for temperature rise circuit

Claims (6)

  1. A function circuit on the semiconductor substrate, a temperature detection element for detecting the temperature of the function circuit, and a control circuit for controlling the temperature of the function circuit, wherein the temperature of the function circuit is lower than the operation guarantee minimum temperature of the function. When the temperature is low, the control circuit operates a part or all of the functional circuit to increase the temperature of the functional circuit and control the output from the functional circuit so as not to output to the outside. .
  2. 2. The semiconductor according to claim 1, wherein the temperature of the functional circuit is increased until the temperature of the functional circuit becomes the operation guarantee minimum temperature, and thereafter, the temperature of the functional circuit is increased by part or all of the functional circuit. Integrated circuit.
  3. A functional circuit on a semiconductor substrate, a temperature detecting element for detecting the temperature of the functional circuit, a heating circuit for increasing the temperature inside or outside the functional circuit, and controlling the temperature of the functional circuit and the heating circuit for increasing the temperature A control circuit that operates, when the temperature of the functional circuit is lower than the operation guarantee minimum temperature of the function, causes the control circuit to operate the heating circuit for increasing the temperature, thereby increasing the temperature of the functional circuit. And a semiconductor integrated circuit that does not output an output from the functional circuit to the outside.
  4. 4. The method according to claim 3, wherein the temperature of the functional circuit is increased until the temperature of the functional circuit reaches the operation guarantee minimum temperature, and thereafter, the operation of increasing the temperature of the functional circuit by the temperature increasing heating circuit is stopped. Semiconductor integrated circuit.
  5. 5. The control circuit according to claim 1, wherein the temperature of the functional circuit is raised until the functional circuit reaches the minimum operation guarantee temperature, and thereafter, the temperature of the functional circuit is controlled so as not to fall below the minimum operation guarantee temperature. A semiconductor integrated circuit according to one of the above.
  6. The signal of the semiconductor integrated circuit is not externally output until the functional circuit reaches the minimum temperature, and the functional circuit is initialized when the functional circuit reaches the operation guarantee minimum temperature, and the signal of the semiconductor integrated circuit is output. 6. The semiconductor integrated circuit according to claim 1, which externally outputs the signal.
JP2002159088A 2002-05-31 2002-05-31 Semiconductor integrated circuit Pending JP2004006473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002159088A JP2004006473A (en) 2002-05-31 2002-05-31 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002159088A JP2004006473A (en) 2002-05-31 2002-05-31 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JP2004006473A true JP2004006473A (en) 2004-01-08

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005340486A (en) * 2004-05-27 2005-12-08 Fujitsu Ltd Temperature adaptive circuit, method and program for raising temperature of circuit
WO2008087756A1 (en) * 2007-01-16 2008-07-24 Panasonic Corporation Integrated circuit device, method for controlling operation of integrated circuit device, and method for manufacturing integrated circuit device
EP2164174A2 (en) * 2008-09-11 2010-03-17 Osram Gesellschaft mit beschränkter Haftung Method and circuit to increase breakdown voltage of MOS transistors at low temperatures
JP2011049242A (en) * 2009-08-25 2011-03-10 Nec Computertechno Ltd Temperature change adjusting module, and temperature change adjusting method
WO2012114400A1 (en) * 2011-02-21 2012-08-30 パナソニック株式会社 Integrated circuit
JP2013064677A (en) * 2011-09-20 2013-04-11 Renesas Electronics Corp Semiconductor device and temperature sensor system
JP2015158505A (en) * 2015-04-21 2015-09-03 ルネサスエレクトロニクス株式会社 semiconductor device
WO2017098801A1 (en) * 2015-12-11 2017-06-15 京セラドキュメントソリューションズ株式会社 Image forming apparatus

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005340486A (en) * 2004-05-27 2005-12-08 Fujitsu Ltd Temperature adaptive circuit, method and program for raising temperature of circuit
WO2008087756A1 (en) * 2007-01-16 2008-07-24 Panasonic Corporation Integrated circuit device, method for controlling operation of integrated circuit device, and method for manufacturing integrated circuit device
JPWO2008087756A1 (en) * 2007-01-16 2010-05-06 パナソニック株式会社 Integrated circuit device, operation control method of integrated circuit device, and manufacturing method of integrated circuit device
JP4623683B2 (en) * 2007-01-16 2011-02-02 パナソニック株式会社 Integrated circuit device, operation control method of integrated circuit device, and manufacturing method of integrated circuit device
US8089180B2 (en) 2007-01-16 2012-01-03 Panasonic Corporation Integrated circuit device, method of controlling operation of integrated circuit device, and method of fabricating integrated circuit device
EP2164174A3 (en) * 2008-09-11 2010-05-26 Osram Gesellschaft mit beschränkter Haftung Method and circuit to increase breakdown voltage of MOS transistors at low temperatures
EP2164174A2 (en) * 2008-09-11 2010-03-17 Osram Gesellschaft mit beschränkter Haftung Method and circuit to increase breakdown voltage of MOS transistors at low temperatures
JP2011049242A (en) * 2009-08-25 2011-03-10 Nec Computertechno Ltd Temperature change adjusting module, and temperature change adjusting method
US8952499B2 (en) 2011-02-21 2015-02-10 Panasonic Intellectual Property Management Co., Ltd. Integrated circuit
WO2012114400A1 (en) * 2011-02-21 2012-08-30 パナソニック株式会社 Integrated circuit
JP2013064677A (en) * 2011-09-20 2013-04-11 Renesas Electronics Corp Semiconductor device and temperature sensor system
US9389127B2 (en) 2011-09-20 2016-07-12 Renesas Electronics Corporation Semiconductor device and temperature sensor system
JP2015158505A (en) * 2015-04-21 2015-09-03 ルネサスエレクトロニクス株式会社 semiconductor device
WO2017098801A1 (en) * 2015-12-11 2017-06-15 京セラドキュメントソリューションズ株式会社 Image forming apparatus
CN107921800A (en) * 2015-12-11 2018-04-17 京瓷办公信息系统株式会社 Image processing system
JPWO2017098801A1 (en) * 2015-12-11 2018-05-24 京セラドキュメントソリューションズ株式会社 Image forming apparatus
CN107921800B (en) * 2015-12-11 2019-11-05 京瓷办公信息系统株式会社 Image forming apparatus

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