JP2008093555A - Washing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a washing device capable of maintaining a stable quality by removing foreign substances easily deposited on a plate side surface, and inexpensively and easily manufactured. <P>SOLUTION: The device for washing a substrate horizontally conveyed comprises a vessel filled with water or a chemical and loaded with the substrate immersed in the vessel and ultrasonic wave oscillator plates in the side face direction of the substrate, and the end faces of the substrate is washed by ultrasonic waves. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cleaning device for a printed wiring board or a copper clad laminate.

  Since printed wiring boards or copper-clad laminates use plastic resins such as epoxy or phenol, resin powder is generated at the time of cutting and adheres to the side of the board. Become. However, a printed wiring board or copper clad laminate cleaning apparatus generally has a structure of an apparatus for cleaning the board by spraying water or chemicals from above and below on the board to which water or chemicals are conveyed simultaneously with horizontal conveyance. Therefore, there is a problem that the removal rate of the foreign matter adhering to the side surface of the plate is extremely low, and it is not suitable for a process that deteriorates quality due to the foreign matter or dust, particularly in a circuit processing process.

  Therefore, as described in JP-A-2003-283111, as a cleaning device that emphasizes the removal of foreign matters and dust, the cleaning tank is sealed with a rubber roll or the like to store water or chemicals, and an ultrasonic transmitter is stored in the tank. A device that removes foreign matter and dust adhering to the front and back and sides of the printed wiring board or copper clad laminate by applying vibration to the board in the tank and a fixed nozzle that sprays water or chemicals from the side An apparatus for removing foreign matter and dust adhering to the side surface has been devised. Further, as described in JP-A-2003-324269, a nozzle for spraying a cleaning liquid from the top and bottom and side surfaces of a printed wiring board or a copper-clad laminate and spraying a chemical from the side surface is provided on the printed wiring board or the copper-clad laminate. A cleaning device has been devised in which the spraying direction varies so as not to hinder the conveyance.

  As another means, as described in JP-A-5-275852 and JP-A-4-196291, the printed wiring board or the copper-clad laminate is covered with a resin layer to prevent the generation of foreign matter and dust. The method is also adopted.

JP 2003-324269 A Japanese Patent Laid-Open No. 5-275852 JP-A-4-196291

  In a device that cleans the board by spraying water or chemicals at the same time that the printed wiring board or copper-clad laminate is transported horizontally, spray the sprayed body from above and below to the object to be transported. There is an advantage that the method for removing adhering foreign matter and dust is simple, the device design and manufacturing is easy and inexpensive, but the removal rate of foreign matter adhering to the side of the object to be cleaned is extremely low, and the quality due to foreign matter and dust It is unsuitable for use in processes that cause deterioration.

As a cleaning device that emphasizes the ability to remove foreign matter and dust, the cleaning tank is sealed with a rubber roll to store water or chemicals, and an ultrasonic transmitter is installed in the tank to give vibration to the plates in the tank. In a horizontal transport cleaning device that removes foreign matter and dust adhering to the front and back and side surfaces of the object to be cleaned, it is easy to remove foreign matter adhering to the side of the object to be cleaned. Since a long processing time is required, the transfer time becomes long, and the productivity is lowered or the apparatus is enlarged, resulting in expensive equipment. In addition, since the structure of the apparatus is complicated, the apparatus is more expensive than the cleaning apparatus having the above structure, and further, the equipment maintainability is deteriorated.
In a device that removes foreign matter and dust adhering to the side surface by providing a fixed nozzle that sprays cleaning liquid from the side surface, in a thin copper-clad laminate with a thickness of 0.2 mm or 0.1 mm, the plate is sprayed from the side surface. Inconveniences such as folding during transporting and catching between transport conveyors occur.

  Further, as described in JP-A-5-275852 and JP-A-4-196291, in the method of preventing the generation of foreign matter and dust by covering the side surface of the object to be cleaned with a resin layer, the covering step is performed. There is a drawback that the process increases and the process becomes complicated. An object of the present invention is to solve such problems and to provide a cleaning device that can maintain stable quality by easily removing foreign matter adhering to the side surface of the plate and that is easy to manufacture and inexpensive. And

The present invention relates to the following.
(1) In an apparatus for cleaning a horizontally transported substrate, the substrate is loaded and immersed in a tank filled with water or chemicals, an ultrasonic oscillation plate is provided in the side surface direction of the substrate, and the substrate end surface is ultrasonically removed. A substrate cleaning apparatus characterized by cleaning.
(2) The cleaning device according to (1), wherein the substrate is a printed wiring board or a copper clad laminate.

  It is possible to provide a cleaning device that can maintain stable quality by easily removing foreign substances adhering to the side surface of the plate and that is easy to manufacture and inexpensive.

  The present invention relates to a charging device attached to a device for horizontally transporting a printed wiring board or a copper clad laminate, wherein the plate is loaded and immersed in a tank filled with water or chemicals, and an ultrasonic oscillation plate is disposed in the side surface direction of the plate. The printed wiring board cleaning apparatus is characterized in that the printed wiring board or the end face of the copper clad laminate is cleaned by ultrasonic waves. According to the present invention, a sufficient end face cleaning effect can be obtained in the standby time before the horizontal conveyance, so that the quality can be stabilized.

  Furthermore, horizontal processing equipment and cleaning equipment can be handled by general equipment, so the equipment is not complicated and expensive, and is transported on a thin copper-clad laminate with a thickness of 0.1 mm. Yield deterioration due to folds or catching between conveyors does not occur. The ultrasonic wave has a frequency of 20 kHz to 50 kHz in order to improve the removal efficiency of foreign matter and dust adhering to the side surface, and the length of the ultrasonic oscillation plate is the length of the printed wiring board or copper clad laminate to be processed. It is preferable that the height is equal to or higher than the stacking height of the plate. The distance from the plate to the ultrasonic oscillation plate is preferably 5 to 20 cm, more preferably 5 to 10 cm. It is preferable to use water as the cleaning liquid in consideration of waste liquid processability. The washing time is preferably 2 minutes or more, more preferably 5 minutes or more.

  As shown in FIG. 1, in a loading device for a printed wiring board or a copper clad laminate, the board is loaded, an ultrasonic oscillation board is provided in the side surface direction of the board, and immersed in a tank filled with water or chemicals. By cleaning the end face of the printed wiring board or the copper-clad laminate with sound waves, the removal of foreign matters such as the object to be cleaned cutting powder adhering to the side surface and dust is improved.

(Example 1)
A glass epoxy-based double-sided copper-clad laminate “MCL-E-67” (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 1.0 mm and a copper foil thickness of 18 μm is 30 cm × 30 cm in size with a cutting pressure of 20 tons. I was cut. Next, 100 copper-clad laminates were stacked and then immersed in a tank, and 4 ultrasonic vibration plates having a size of 15 cm × 30 cm and a frequency of 35 kHz were parallel to the four sides of the copper-clad laminate, It was placed at a position 10 cm from the top and washed for 5 minutes.

  Then, using the horizontal conveyance type washing | cleaning apparatus of FIG. 3, the industrial water was spray-washed for 1 minute from the upper and lower sides of the copper clad laminated board at the pressure of 0.2 Mpa, and it dried for 15 second with 80 degreeC hot air. For spraying, a flat type spray having an injection angle of 90 degrees and a uniform pressure was used, the discharge amount was 7.8 L / min, and spraying was performed from a distance of 15 cm from the end of the processed sample. The laminated plate was dropped vertically from a height of 5 cm onto a glass plate placed horizontally, and the resin powder dropped on the glass plate was measured with a stereomicroscope at a magnification of 100 times to determine the number of adhered resin powders. The adhered resin powder per circumference of the laminate is shown in Table 1. Note that five samples were used.

(Comparative Example 1)
The copper-clad laminate cut in the same manner as in Example 1 was cleaned in the same manner as in Example 1 using the conventional horizontal conveyance type cleaning device of FIG. 3, and the number of adhered resin powders was determined. The results are shown in Table 1.

(Comparative Example 2)
Using the conventional horizontal conveying ultrasonic cleaner shown in FIG. 4, the copper clad laminate cut in the same manner as in Example 1 was immersed in industrial water and cleaned with ultrasonic waves. An ultrasonic transmitter having a size of 30 cm × 30 cm and a frequency of 35 kHz was used. The conveyance time was 1 minute. Adhesive resin powder was determined in the same manner as in Example 1. The results are shown in Table 1.

(Comparative Example 3)
Cleaning was carried out in the same manner as in Example 1 except that the industrial water spray from the side surface was fixedly sprayed from 90 degrees to the copper clad laminate using the conventional horizontal conveyance type cleaning device of FIG. However, it was impossible to prepare a sample due to catching between the conveyors.

  The cleaning device according to the present invention makes it possible to easily remove foreign matters such as cutting powder and dust adhering to the side surface, without causing problems such as breaking and catching even in a thin copper clad laminate having a thickness of 0.1 mm or less. Become.

It is a schematic explanatory drawing of the washing | cleaning apparatus by this invention. It is detailed explanatory drawing of the washing | cleaning apparatus by this invention. It is a schematic explanatory drawing of the washing | cleaning apparatus of the comparative example 1 by a conventional apparatus. It is a schematic explanatory drawing of the washing | cleaning apparatus of the comparative example 2 by a conventional apparatus. It is a schematic explanatory drawing of the washing | cleaning apparatus of the comparative example 3 by a conventional apparatus.

Explanation of symbols

1: Ultrasonic oscillation board 2: Printed wiring board or copper-clad laminate 3: Tank filled with water or chemicals 4: Movable for cleaning conveyor conveyor to-be-cleaned side 5: Spray nozzle 6: Spray for cleaning to-be-cleaned side nozzle

Claims (2)

  In an apparatus for cleaning a substrate transported horizontally, the substrate is loaded and immersed in a tank filled with water or chemicals, an ultrasonic oscillation plate is provided in the side surface direction of the substrate, and the substrate end surface is cleaned by ultrasonic waves. A substrate cleaning apparatus.   The cleaning apparatus according to claim 1, wherein the substrate is a printed wiring board or a copper clad laminate.

Images