CN116209152A - Fluid compliant body, apparatus and method for sonicating a component carrier in a fluid - Google Patents

Abstract

The present application provides a fluid compliant body (100), an apparatus (114) and a method for treating a component carrier (102) with ultrasound (130) in a fluid. The fluid compliant body (100) is for housing a component carrier (102), wherein the fluid compliant body (100) comprises a carrier body (104) and a cover body (110), the carrier body (104) comprising a housing compartment (106) for housing the component carrier (102), the cover body (110) covering the carrier body (104) and the component carrier (102), wherein at least one of the carrier body (104) and the cover body (110) comprises an opening (190) exposing a major portion of a respective major surface of the component carrier (102) when the component carrier (102) is housed in the housing compartment (106).

Description

Fluid compliant body, apparatus and method for sonicating a component carrier in a fluid

Technical Field

The present invention relates to fluid-compliant bodies. Furthermore, the invention relates to an apparatus for sonicating a component carrier in a fluid and to a method of sonicating a component carrier in a fluid.

Background

In the context of increasing product functions of component carriers equipped with one or more electronic components and increasing miniaturization of such components and increasing numbers of components to be mounted on component carriers, such as printed circuit boards, increasingly powerful array-like components or packages having a plurality of components are being employed, which have a plurality of contacts or connections, wherein the spacing between the contacts is smaller and smaller. Removal of heat generated by these components and the component carriers themselves during operation is an increasing problem. At the same time, the component carrier should be mechanically strong and electrically reliable in order to be able to operate even under severe conditions.

When a component carrier (e.g., a printed circuit board or interposer) is separated from a component carrier structure (e.g., a panel) during manufacture, the separated component carrier may become contaminated, for example, by dust that adheres strongly to the component carrier. This may affect the reliability of the component carrier.

Disclosure of Invention

It may be desirable to manufacture component carriers with high reliability.

According to an exemplary embodiment of the present invention, a fluid compliant body for housing a component carrier is provided, wherein the fluid compliant body comprises a carrier body comprising a housing compartment for housing the component carrier and a cover body covering the carrier body and the component carrier, wherein at least one of the carrier body and the cover body comprises an opening exposing a major portion of a respective main surface of the component carrier when the component carrier is housed in the housing compartment.

According to another exemplary embodiment of the present invention, an apparatus for sonicating a component carrier in a fluid (in particular a liquid) is provided, wherein the apparatus comprises a fluid-compliant body having the above-mentioned features for housing the component carrier and being physically contactable with the fluid (in particular a liquid) such that ultrasound is transmitted from the fluid (in particular a liquid) to the component carrier in the housing compartment when the fluid-compliant body is in physical contact with the fluid (in particular a liquid).

According to yet another exemplary embodiment of the present invention, a method of sonicating a component carrier in a fluid (in particular in a liquid) is provided, wherein the method comprises: receiving a component carrier in a receiving compartment in a carrier body of a fluid compliant body; covering the carrier body and the component carrier with a cover body of the fluid compliant body; physically contacting the fluid compliant body with a fluid (particularly a liquid) for transmitting ultrasound from the fluid (particularly a liquid) to the component carrier in the receiving compartment; and exposing a major portion of the respective major surface of the component carrier through the opening of at least one of the carrier body and the cover body when the component carrier is received in the receiving compartment.

In the context of the present application, the term "fluid" may particularly denote a gas (e.g. air) and/or a liquid (e.g. water or an aqueous solution), which optionally comprises solid particles. Accordingly, exemplary embodiments of the present invention relate to ultrasonic cleaning of component carriers in gaseous and/or liquid environments.

In the context of the present application, the term "component carrier" may particularly denote any support structure capable of housing one or more components on and/or in the component carrier to provide mechanical support and/or electrical connection. In other words, the component carrier may be configured as a mechanical carrier and/or an electronic carrier for the component. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. However, the component carrier may also be a larger structure, for example, a panel (e.g., having a size of 2418 square inches) or array (e.g., a quarter panel) of multiple PCBs or interposers may be separated.

In the context of the present application, the term "fluid compliant body" may particularly denote a physical structure specifically configured for housing a component carrier and configured (particularly in terms of material selection) to be able to be brought into physical contact with a fluid, particularly a liquid such as an aqueous solution. In particular, the fluid compliant body may be liquid compliant, i.e. may be configured to be immersed in a liquid or may be configured to float on a liquid. When configured to float on a liquid (e.g., water or an aqueous solution) rather than being immersed in the liquid, the fluid compliant body may be referred to as a floating body. In the latter configuration, the fluid compliant body may be configured to float on the liquid like a boat, rather than move down into the liquid until the bottom of the container.

In the context of the present application, the term "ultrasound source" may particularly denote a device configured for generating ultrasound. Ultrasound may particularly represent sound waves with frequencies above the upper limit of human hearing. For example, an ultrasound source may operate at frequencies of 20kHz up to several gigahertz. For ultrasonic cleaning, an ultrasonic frequency of, in particular, 20kHz to 80kHz, in particular, 20kHz to 40kHz may be used. The ultrasonic waves may be generated by a transducer that may emit ultrasonic waves. For example, the active elements in an ultrasound transducer may be made of a ceramic crystalline material, such as a piezoelectric material.

According to exemplary embodiments of the present invention, component carriers (e.g., printed circuit boards, interposers, integrated circuit substrates, etc.) separated from larger component carrier structures (e.g., panels comprising an arrangement of a plurality of component carriers that are still integrally connected) may be ultrasonically cleaned in a fluid (e.g., gas or liquid) in a simple, efficient, and reliable manner, for example. After separation or singulation (singulation) of the component carriers from the component carrier structure, the separated component carriers may still be contaminated with dust and dirt due to the separation process. Advantageously, ultrasound generated in a gaseous atmosphere and/or in a liquid solution can be used for efficient cleaning of the component carrier after separation. For this purpose, the ultrasound source may be arranged for generating ultrasound in a liquid or gas. Advantageously, during ultrasonic cleaning, the component carrier may be housed in a fluid compliant body that includes openings to expose a majority of the surface of the component carrier (particularly of the PCB type) for efficient performance of the cleaning process. At the same time, each component carrier may be well secured by the fluid compliant body. Accordingly, correspondingly singulated cleaned component carriers can be manufactured with high throughput (throughput) and high reliability.

Detailed description of exemplary embodiments

Hereinafter, further exemplary embodiments of the fluid compliant body, the apparatus and the method will be described.

In an embodiment, the fluid compliant body is configured to: when the fluid compliant body is in physical contact with a fluid, in particular with a liquid and/or a gas, ultrasound is transmitted from the fluid, in particular from the liquid and/or the gas, to the component carrier in the receiving compartment. In particular, the apparatus may include a container coupled to an ultrasonic source and containing a liquid, the ultrasonic source configured to generate ultrasound in the liquid. In this way, a simple and efficient ultrasonic cleaning of the component carrier may be achieved in a fluid environment.

In embodiments, the fluid compliant body may be configured for floating on a liquid, in particular an aqueous liquid. Further, the fluid compliant body may be configured as a component carrier for transmitting ultrasound from the liquid into the receiving compartment when the fluid compliant body floats on the liquid. In particular, the fluid compliant body with the housed component carrier may be placed for floating on a liquid. In certain situations or for certain kinds of component carriers, it may be undesirable to dip the component carrier alone into a liquid for ultrasonic cleaning, as well as for handling purposes. To enable ultrasonic cleaning of even liquid sensitive component carriers and/or a set of component carriers that will be handled in a simple and efficient manner, exemplary embodiments of the present invention place the component carriers in the receiving compartments of the carrier body of the common fluid compliant body and then place the fluid compliant body onto the liquid, thereby facilitating transmission of ultrasound from the liquid to the component carriers while the fluid compliant body floats on the liquid and receives the component carriers for efficient cleaning. This may allow for simple manipulation of the component carrier during efficient ultrasonic cleaning.

However, in other embodiments, the component carrier housed in the fluid compliant body may be immersed in the liquid when ultrasound is transmitted from the liquid to the component carrier. For example, in some embodiments, the fluid compliant body or carrier body does not float on the liquid, but is transported between tank chain conveyors.

In an embodiment, at least one of the carrier body and the cover body is configured for securely retaining the component carrier when the component carrier is received in the receiving compartment. Advantageously, this can reliably protect the sensitive component carrier from damage during ultrasonic cleaning.

In an embodiment, the fluid compliant body includes a cover body that covers the carrier body and the component carrier. The component carrier in the compartment can thus also be protected from the top side by the cover.

In an embodiment, at least one of the carrier body and the cover body comprises an opening exposing a major portion (in particular, at least 50% or even at least 80% of the area) of the respective major surface of the component carrier when the component carrier is accommodated in the accommodation compartment. Thus, functional exchange between the respective main surfaces of the respective component carriers and the environment can be achieved while the component carriers are housed within the fluid compliant body, for example for achieving a heat rinse process, an air knife process, a drying process, a water knife cleaning process, etc.

In an embodiment, the fluid compliant body comprises or consists of a resin, such as an epoxy resin. Thus, the fluid compliant body may be made of a material similar to the component carrier or at least a dielectric portion of the component carrier, so that foreign objects may be reliably prevented from being introduced into the component carrier manufacturing process. Meanwhile, the above-described resin material may have floatability on an aqueous solution or other liquid when the fluid compliant body is appropriately shaped. Further, the resin of the fluid compliant body may be sufficiently soft or smooth to prevent scratching of the component carrier housed in the fluid compliant body.

In an embodiment, the receiving compartment is shaped such that the received component carrier contacts the carrier body only in the corner portions of the carrier body (i.e. in the corner regions). In this case, it is possible that the respective component carrier is placed in one of the receiving compartments and contacts only a horizontal side surface (which may be nonfunctional) instead of a vertical side wall. However, various configurations are possible: for example, two points of contact between the component carrier and the structure of the receiving compartment may be defined in each corner by, for example, two fixing protrusions in each of the four corners. Advantageously, the receiving compartment may be shaped such that the received component carrier contacts the carrier body at only the vertical sidewall surface portions of the component carrier, rather than on the horizontal major surface of the component carrier. This may be achieved by the above-described configuration with a respective pair of fixing protrusions in each corner of the respective receiving compartment. More specifically, the only surface portion of the component carrier that is in direct physical contact with the carrier body and the fluid compliant body as a whole may be the vertical surface portion of each component carrier that abuts the corner structure of the carrier body. For example, such surface portions may be side walls of the plate-like member carrier. Advantageously, keeping the contact area small may protect the component carrier from the risk of scratches that may cause damage to the component carrier, in particular the solder mask of the component carrier. By having only the side walls in the edges of the component carrier in contact with the carrier body, and at the same time the main surfaces of the component carrier in the compartment remain out of contact with the fluid compliant body, proper ultrasonic cleaning and reliable protection of the component carrier against damage can be ensured.

In an embodiment, the fluid compliant body comprises a component carrier housed in the housing compartment. Thus, the component carrier may form part of the fluid compliant body and may be immersed in the liquid or may float with the carrier body on the liquid below, wherein ultrasound is supplied to the component carrier for cleaning by the liquid. Preferably, the component carrier is an interposer.

In an embodiment, the fluid compliant body includes at least one surface mount component on each component carrier. Such Surface Mounted Device (SMD) type components, for example passive components such as capacitors, may be particularly liquid sensitive. By placing the component carrier in the fluid compliant body together with the SMD components of the component carrier during the ultrasonic treatment, the surface mounted components may be protected from mechanical loads and/or excessive shocks of liquid that may damage these surface mounted components. When the fluid-compliant body floats on the liquid, the surface-mounted component of the component carrier in the fluid-compliant body may face away from the liquid.

In an embodiment, the apparatus comprises loading means (e.g. comprising at least one robot arm) for inserting the component carrier into the receiving compartment, in particular for inserting the component carrier into the receiving compartment prior to the sonication. It is also possible that the apparatus comprises unloading means (e.g. comprising at least one robot) for taking the component carrier out of the containment compartment, e.g. after sonication. Thus, the temporary insertion of the component carrier into the receiving compartment of the carrier body for the ultrasonic treatment and the subsequent removal of the component carrier for further treatment may be automated by implementing a corresponding robot or the like. This may increase the throughput of the component carrier through the cleaning line and may avoid the risk of the component carrier being contaminated when contacted by an operator.

In an embodiment, the apparatus includes a loading device (e.g., including at least one robot) configured for placing the fluid compliant body on or in the liquid. Additionally or alternatively, the apparatus may include an unloading device (e.g., including at least one robot arm) configured to remove the fluid-compliant body from the liquid. Manipulation of the fluid compliant body loaded with the component carrier may also be automated, for example, through the use of at least one robotic arm. This can also increase the number of component carriers that are cleaned by ultrasound at a time, and can protect the component carriers from deterioration due to scratches or the like.

In an embodiment, the apparatus comprises a conveyor mechanism, in particular a conveyor belt, configured for conveying the fluid compliant body along the liquid. Thus, the conveyor mechanism may direct the fluid compliant body loaded with the component carrier along the liquid subjected to ultrasound to further increase the degree of automation of the ultrasound cleaning architecture. Such a conveyor mechanism may be, for example, a conveyor belt or a roller conveyor. In embodiments where the apparatus comprises at least one further treatment stage (in particular a cleaning stage and/or a drying stage) in addition to the ultrasonic cleaning stage, the conveyor mechanism may convey the fluid compliant body in which the component carrier is housed along a plurality of treatment stages, namely at least the ultrasonic cleaning stage and at least one further treatment stage. For example, a conveyor mechanism may convey a fluid compliant body having a component carrier along multiple tanks for a multi-stage process.

In an embodiment, the method comprises: the component carrier is cleaned by ultrasound. In particular by indirect impact of ultrasound in the liquid via the fluid compliant body on the component carrier accommodated in the accommodation compartment, it has surprisingly been found that nevertheless an efficient cleaning of the singulated component carrier of dust or dirt due to the singulation process can be achieved. By rigidly mounting the component carrier in the fluid compliant body and by immersing or floating the fluid compliant body in or on a liquid that serves as the ultrasound source carrier medium, a sufficient ultrasound coupling can be achieved between the liquid and the component carrier (optionally with electronic components mounted on the component carrier). At the same time, simplified batch processing of multiple component carriers by a single fluid compliant body may be achieved.

In an embodiment, the method comprises: dust is removed from the component carrier by ultrasound, at least a portion of which is considered to be a residue of a cutting process that cuts the component carrier structure (e.g., panel) into a plurality of component carriers (e.g., PCBs or interposers). Dicing is an efficient process of separating a component carrier structure into individual component carriers that achieves high throughput but generates a large amount of dust or dirt. By ultrasonic cleaning of the component carrier while the component carrier is accommodated in a fluid compliant body on or in an ultrasonically active liquid, an efficient removal of such residues from the component carrier can be achieved as described. However, other types of contaminants can also be effectively removed from the component carrier by the impact of ultrasound mediated through the fluid compliant body.

In an embodiment, the method comprises: the component carrier is sprayed with an aqueous spray prior to cleaning the component carrier by ultrasound, particularly while the component carrier is contained within the fluid compliant body. Thus, the described ultrasonic cleaning of the separated component carrier may be synergistically combined with spray-based cleaning. The combination of these two complementary cleaning processes can achieve efficient cleaning performance of the component carrier after singulation.

In an embodiment, the method comprises: the component carrier is subjected to a heat rinsing process before and/or after cleaning the component carrier by ultrasound, in particular while the component carrier is contained within the fluid compliant body. Heating the rinse fluid, such as a spray, may further enhance the cleaning effect of the rinse process. Advantageously, the first heat-rinsing treatment may be performed before the ultrasonic cleaning and the second heat-rinsing treatment may be performed after the ultrasonic cleaning. This may allow for excellent cleaning results.

In an embodiment, the method comprises: the component carrier is treated with the air knife before and/or after cleaning of the component carrier by ultrasound, in particular while the component carrier is contained within the fluid compliant body. Such an air knife may be used to act on an exposed surface of a component carrier housed within a fluid compliant body and moving along the air knife such that the air knife removes debris, dirt, and/or dust from an impacted surface area of the respective component carrier.

In an embodiment, the method comprises: after the heat rinsing process, the component carrier is subjected to a drying process, in particular while the component carrier is housed within the fluid compliant body. After the sequence of ultrasonic cleaning and subsequent heat rinse cleaning, the component carrier may be dried to remove liquid residues. This can ensure the electrical reliability of the manufactured component carrier.

In an embodiment, the method comprises: the component carrier (or at least the component mounted on the component carrier) is kept out of direct contact with the liquid while ultrasound is transmitted from the liquid to the component carrier. Thus, even a water-sensitive component carrier (optionally with a water-sensitive component mounted on and/or in the component carrier) can be reliably cleaned by an indirect ultrasonic cleaning process without direct liquid impact by complete immersion.

However, in some processes and embodiments, the component carrier carried by the fluid compliant body may be in a fully liquid immersed state.

In an embodiment, the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conducting layer structure. For example, the component carrier may be a laminate of the mentioned electrically insulating layer structure and electrically conductive layer structure, which laminate is formed in particular by the application of mechanical pressure and/or thermal energy. The mentioned stack may provide a plate-like component carrier that is capable of providing a large mounting surface for further components and yet is very thin and compact. The term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of discontinuous islands in a common plane.

In an embodiment, the component carrier is shaped as a plate. This contributes to a compact design, wherein the component carrier nevertheless provides a large base for the mounting components on the component carrier. In addition, in particular, a bare die (die) as an example of an embedded electronic component can be conveniently embedded in a thin plate such as a printed circuit board due to its small thickness.

In an embodiment, the component carrier is configured as one of the group comprising a printed circuit board, a substrate (in particular an IC substrate) and an interposer.

In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a board-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, e.g. by applying pressure and/or by supplying thermal energy. As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, whereas the electrically insulating layer structure may comprise resin and/or glass fibres, so-called prepregs, or FR4 material. Vias as via connections may be formed by forming vias through the laminate, for example by laser drilling or mechanical drilling, and by filling these with an electrically conductive material, in particular copper, so that the individual electrically conductive layer structures are connected to each other in a desired manner. In addition to one or more components that may be embedded in a printed circuit board, the printed circuit board is typically configured to house the one or more components on one surface or on opposite surfaces of the board-like printed circuit board. The one or more components may be connected to the respective major surfaces by welding. The dielectric portion of the PCB may include a resin having reinforcing fibers (e.g., glass fibers).

In the context of the present application, the term "substrate" may particularly denote a small component carrier. The substrate may be a relatively small component carrier with respect to the PCB, on which one or more components may be mounted and which may serve as a connection medium between one or more chips and another PCB. For example, the substrate may have substantially the same dimensions as the components (particularly electronic components) to be mounted on the substrate (e.g., in the case of a Chip Scale Package (CSP)). More specifically, the substrate may be understood as such a carrier: a carrier for an electrical connection or grid, a component carrier comparable to a Printed Circuit Board (PCB) but having a rather high density of laterally and/or vertically arranged connections. The transverse connection is for example a conductive channel, while the vertical connection may be for example a borehole. These lateral and/or vertical connections are arranged within the base plate and may be used to provide electrical, thermal and/or mechanical connection of housed or non-housed components (such as bare wafers), in particular IC chips, to a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrate". The dielectric portion of the substrate may comprise a resin with reinforcing particles (e.g., reinforcing spheres, particularly glass spheres).

The substrate or interposer may include or consist of at least one of the following: glass; silicon (Si); photosensitive or dry etchable organic materials such as epoxy-based build-up materials (e.g., epoxy-based build-up films); or a polymer compound such as polyimide, polybenzoxazole or benzocyclobutene-functional polymer.

In an embodiment, the at least one electrically insulating layer structure comprises at least one of: resins (such as reinforced or non-reinforced resins, for example epoxy resins or bismaleimide-triazine resins), cyanate ester resins, polyphenylene derivatives, glass (in particular glass fibers, laminated glass, glass-like materials), prepregs (such as FR-4 or FR-5), polyimides, polyamides, liquid Crystal Polymers (LCPs), epoxy-based laminated films, polytetrafluoroethylene (PTFE, teflon (Teflon)), ceramics and metal oxides. Reinforcing structures made of glass (multiple layer glass), for example, such as meshes, fibers or spheres, may also be used. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based laminate films or photosensitive dielectric materials, may also be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate ester resins, low temperature co-fired ceramics (LTCC), or other low, very low or ultra low DK materials may be implemented as electrically insulating layer structures in the component carrier.

In an embodiment, the at least one electrically conductive layer structure comprises at least one of: copper, aluminum, nickel, silver, gold, palladium, and tungsten. Although copper is generally preferred, other materials or coated versions thereof, particularly coated with superconducting materials such as graphene, are also possible.

At least one component that may be embedded in the stack may be selected from the group comprising: a non-electrically conductive inlay (e.g., a ceramic inlay, preferably comprising aluminum nitride (AlN)), an electrically conductive inlay (e.g., a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g., a heat pipe), a light guiding element (e.g., an optical waveguide or a light conductor connection), an optical element (e.g., a lens), an electronic component, or a combination thereof. For example, the component may be an active electronic component, a passive electronic component, an electronic chip, a memory device (e.g., DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light emitting diode, an optocoupler, a voltage converter (e.g., a DC/DC converter or an AC/DC converter), a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, a sensor, an actuator, a microelectromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductance, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components may also be embedded in the component carrier. For example, a magnetic element may be used as the member. Such magnetic elements may be permanent magnetic elements (e.g., ferromagnetic elements, antiferromagnetic elements, multiferroic elements, or ferrimagnetic elements, such as ferrite cores) or may be paramagnetic elements. However, the component may also be a substrate, interposer or other component carrier, for example in the form of a board in a board. The component may be surface mounted on the component carrier and/or may be embedded in the interior of the component carrier. In addition, other components may be used as the components.

In an embodiment, the component carrier is a laminate type component carrier. In such embodiments, the component carrier is a composite of a multi-layer structure that is stacked and joined together by the application of pressure and/or heat.

After processing the inner layer structure of the component carrier, one main surface or the opposite main surfaces of the processed layer structure may be covered symmetrically or asymmetrically with one or more further electrically insulating layer structures and/or electrically conducting layer structures, in particular by lamination. In other words, stacking may continue until a desired number of layers is obtained.

After the formation of the stack with the electrically insulating layer structure and the electrically conductive layer structure is completed, the resulting layer structure or component carrier may be surface treated.

In particular, in terms of surface treatment, an electrically insulating solder resist may be applied to one major surface or the opposite two major surfaces of the laminate or component carrier. For example, a layer of, for example, solder resist may be formed over the entire major surface and then patterned to expose one or more electrically conductive surface portions that will serve to electrically couple the component carrier to the electronic periphery. The surface portion of the component carrier that is covered with the solder resist, particularly the surface portion containing copper, can be effectively protected from oxidation or corrosion.

In terms of surface treatment, a surface treatment may also be selectively applied to the exposed electrically conductive surface portions of the component carrier. Such surface treatments may be electrically conductive covering materials on exposed electrically conductive layer structures (e.g., pads, conductive traces, etc., including or consisting of copper in particular) on the surface of the component carrier. If such exposed electrically conductive layer structures are not protected, the exposed electrically conductive component carrier material (particularly copper) may be oxidized, resulting in lower reliability of the component carrier. Further, the surface treatment portion may be formed as, for example, a joint portion between the surface mount component and the component carrier. The surface treatment has the function of protecting the exposed electrically conductive layer structures, in particular copper tracks and/or copper pads, and the surface treatment may effect a bonding process with one or more components, for example by soldering. Examples of suitable materials for the surface treatment are Organic Solderability Preservative (OSP), electroless Nickel Immersion Gold (ENIG), gold (particularly hard gold), electroless tin, nickel gold, nickel palladium, electroless Nickel Immersion Palladium Immersion Gold (ENIPIG), and the like.

The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment.

Drawings

Fig. 1 illustrates an apparatus for ultrasonically treating a component carrier on or in a fluid-compliant body in a liquid according to an exemplary embodiment of the invention.

Fig. 2 illustrates a multiple cleaning stage apparatus for treating a component carrier on or in a fluid compliant body for cleaning in multiple cleaning stages according to an exemplary embodiment of the present invention.

Fig. 3-11 illustrate different views and cross-sections of a fluid compliant body and apparatus for ultrasonically treating a component carrier on or in such a fluid compliant body in a liquid according to an exemplary embodiment of the invention.

Detailed Description

The illustrations in the figures are schematic. In different drawings, similar or identical elements are provided with the same reference numerals.

Before the exemplary embodiments will be described in more detail with reference to the accompanying drawings, some basic considerations upon which the exemplary embodiments of the present invention have been developed will be summarized.

According to an exemplary embodiment of the present invention, a fluid compliant body is provided in the shape of a boat for receiving a component carrier during ultrasonic cleaning of the component carrier while the boat floats on or is immersed in a liquid that generates ultrasonic waves. When the component carrier is received in a vessel or fluid compliant body floating on top of a liquid, no direct physical contact, or at least no direct physical contact of complete immersion, takes place between the component carrier and the liquid serving as the medium of the ultrasonic carrier. In contrast, the component carrier may be indirectly impacted by the ultrasound through the material of the fluid compliant body without being completely immersed in the liquid, and thus the component carrier is not immersed in the liquid during the ultrasonic cleaning. This may allow for performing an ultrasonic treatment even on a water-sensitive component carrier and/or an electronic component mounted on and/or in the component carrier. Even if the fluid-compliant body is configured (e.g., by providing a macroscopic opening at the bottom side of the fluid-compliant body) for enabling fluid contact between the liquid and the component carrier in the fluid-compliant body, the component carrier does not have to be completely submerged in the liquid for ultrasonic cleaning, but can float on top of the liquid within the fluid-compliant body. This may simplify handling of the plurality of component carriers in the fluid compliant body during ultrasonic cleaning, and may also allow the plurality of component carriers in the fluid compliant body to be transported along the container or canister during ultrasonic cleaning. Thus, high throughput and efficient cleaning can be synergistically combined.

In various embodiments, the fluid-compliant body housing the plurality of component carriers may float on the liquid (as described in the preceding paragraph) or may be immersed in the liquid, e.g., the fluid-compliant body housing the plurality of component carriers may float on the liquid (as described in the preceding paragraph) or be immersed in the liquid as it is transported along the liquid by a conveyor mechanism or the like.

By providing openings in the carrier body and/or the cover body of the fluid compliant body in which the plurality of component carriers are housed, while holding them tightly in place, it can be ensured that: when the fluid compliant body floats on or is immersed in the ultrasonically activated liquid, the high surface area of the component carrier can be effectively cleaned by the ultrasound.

For example, an interposer, PCB, or other component carrier may first be impacted by a water spray to remove coarse contaminants that may remain on the component carrier after it is singulated from the panel. Thereafter, the component carrier housed in the housing compartment in the fluid compliant body may be placed on or in the liquid in the tank or container, and ultrasound waves may be generated by the ultrasound transducer within the liquid. The ultrasonic waves may also propagate up to the fluid compliant body in functional or physical contact with the liquid, and by coupling of the fluid compliant body and a component carrier housed in the fluid compliant body, the ultrasonic waves may also propagate to the component carrier. Thus, during ultrasonic treatment of the component carrier, the fluid compliant body with the component carrier housed therein may float on the water (or another liquid) in the tank like a boat. The fluid compliant body may also be partially or completely immersed in the liquid. The conveyor belt or roller belt may also drive the boat-shaped fluid compliant body through the ultrasonic bath. Advantageously, the component carrier may be accommodated in the accommodation compartment in a gentle or smooth manner to avoid scraping of the main surface of the component carrier, in particular to avoid surface-mounted components and/or solder masks on the component carrier. The avoidance of scratches on the mounting component is of concern as the height of the mounting component may protrude beyond the PCB surface. When the PCB is placed in the ship, the ship's hull may have an open design that creates a space between the component and the steel strip (conveyor) that protects the component. This also stabilizes the transport without moving relative to each other, thereby eliminating the risk of additional scraping. For example, a gentle but still ultrasound transmitting coupling between the component carrier and the fluid compliant body may be achieved by fixing (e.g. clamping) the component carrier with opposing surfaces only at the side walls of the component carrier only in the corner portions of the carrier body of the fluid compliant body. This may combine efficient ultrasound coupling with reliable scratch protection.

According to an exemplary embodiment of the present invention, a cleaning line for cleaning individual units of a component carrier is provided, which cleaning line improves the throughput of the component carrier, in particular a PCB, during and after a cutting process.

The corresponding workflow may include separating the panel into an array of component carriers, in particular into quarter panels. This may be achieved by cutting, for example. Thereafter, the array may be cut, in particular by mechanical cutting, into individual component carriers (also denoted as cards or units, such as printed circuit boards, interposers or IC substrates). The process can be performed at high speed, so that a large amount of dust or dirt may be generated. After cutting, the component carrier may be subjected to a warp measuring tool for measuring warp.

Very advantageously, exemplary embodiments of the present invention provide a cleaning line for cleaning a component carrier after dicing and prior to warp measurement. The cleaning process for removing dust from the cut units may be very advantageous, as the cutting may involve sawing and may create a lot of contamination on the cut component carriers. The mentioned cleaning line may be embodied as a machine which can remove dust from the unit with high pressure water (e.g. water spray) and ultrasonic impact. The singulation by cutting in combination with the described cleaning line can significantly improve the throughput of the processed component carrier. In particular for the interposer-type component carrier, so that an effective treatment can be performed by suppressing the risk of contamination.

Advantageously, the floating or submerged boat-type fluid compliant body for the receiving part carrier may be provided with a hollow design. This may allow cleaning dust on the unit or component carrier in an easy and simple manner. Preferably, the fluid compliant body may be configured with a convex design made of a resin material. The component carrier may be reliably protected from edge cracking when it is accommodated in the accommodation compartment in the fluid compliant body. With such a manufacturing architecture, the cleanliness and throughput of the manufactured component carrier, preferably the interposer product, can be improved. The described implementation of the cleaning line may enable improved organic stain removal.

Fig. 1 shows an apparatus 114 according to an exemplary embodiment of the invention, the apparatus 114 being used for processing a printed circuit board type or interposer type component carrier 102 mounted on or in a fluid compliant body 100 with ultrasound 130 in a liquid 108, for example in water.

The component carrier 102 may be a board-like laminated PCB or interposer. More specifically and as shown in detail 132 in fig. 1, each of component carriers 102 may include a laminated layer stack including one or more electrically conductive layer structures 134 and/or one or more electrically insulating layer structures 136. The electrically conductive layer structure 134 may include one or more patterned metal foils and vertical through-connections, such as copper filled vias that may be created by drilling and electroplating. The electrically insulating layer structure 136 may comprise a respective resin (e.g. a respective epoxy resin), preferably comprising reinforcing particles (e.g. glass fibres or glass spheres) in the respective resin. For example, the electrically insulating layer structure 136 may be made of FR 4.

Although not shown in fig. 1, the component carrier 102 may be manufactured on the basis of a panel comprising an (e.g. substantially matrix-like) arrangement of integrally connected preforms of the component carrier 102. Such panels (e.g., having a size of 24x 18 square inches) may first be separated into quarter panels by cutting, and then each of the quarter panels may be separated into individual component carriers 102 by cutting, preferably by mechanical cutting. This process may be efficient in terms of throughput, but may generate a significant amount of dust and dirt that may adhere to the various component carriers 102. The illustrated apparatus 114 may facilitate cleaning of the component carrier 102 to thereby remove dust and dirt.

Further, each of the component carriers 102 may include one or more surface mount components 112, the surface mount components 112 being, for example, passive electronic components such as capacitors or inductors, or active electronic components such as semiconductor wafers. Such a component 102 may be water sensitive. In other words, it may be advantageous to protect certain components 112 from being fully immersed in water to remain intact.

As shown in fig. 1, before the component carrier 102 is treated with the ultrasonic waves 130, the component carrier 102 may be subjected to a water jet cleaning process for removing a portion of dust and dirt from the cut component carrier 102. More specifically, pre-treating the component carrier 102 prior to ultrasonic treatment may include spraying the component carrier 102 with an aqueous spray.

Thereafter, the component carriers 102 may be transported to the apparatus 114 by a conveyor belt 142 of the loading device 140. In the illustrated embodiment, a conveyor belt 142 may be used to transport the component carriers 102 to the liquid receptacles 116 of the apparatus 114. The control unit 144 of the apparatus 114 may control the conveyor belt 142 of the loading device 140.

As also shown in fig. 1, the loading device 140 may include a robot arm (robot) 120 for handling the component carrier 102 and the fluid compliant body 100 at the supply side of the apparatus 114. For example, the robot 120 on the left hand side of fig. 1 may insert the component carrier 102 into the receiving compartment 106 of the fluid compliant body 100. In addition, the robot 120 may place the fluid compliant body 100 loaded with the component carrier 102 onto the liquid 108 in the container 116. The robot 120 may be controlled by a control unit 144.

As already mentioned, the apparatus 114 for treating the component carrier 102 with ultrasound 130 comprises a tank or container 116, which tank or container 116 may be at least partially filled with the liquid 108, e.g. the tank or container 116 may be at least partially filled with water. The ultrasonic source 118 may be functionally coupled with the receptacle 116 for coupling ultrasonic waves generated by the ultrasonic source 118 into the liquid 108 in the receptacle 116. For example, the ultrasonic source 118 may be immersed directly in the liquid 108. An ultrasonic source 118 may also be attached to the outer wall of the vessel 116 for achieving indirect ultrasonic coupling with the liquid 108. The ultrasound source 118 may be controlled by a control unit 144. For example, the ultrasonic source 118 may be a piezoelectric ultrasonic transducer configured to generate ultrasound in the liquid 108. As shown in fig. 1, the ultrasound source 118 may be disposed inside the liquid-containing volume of the container 116 for generating the ultrasound 130 and coupling the ultrasound 130 directly into the liquid 108. Alternatively, the ultrasound source 118 may be attached to the container 116 from outside for transmission of the generated ultrasound 130 through the wall of the container 116 into the liquid 108. A plurality of ultrasound sources 118 may also be provided at the container 116. The generated ultrasound 130 may propagate through the liquid 108 and thereby may also impinge the fluid compliant body 100 floating on the liquid 108 with ultrasound.

The fluid compliant body 100 is configured to house a plurality of component carriers 102 and may be placed on top of a liquid 108 to float on the liquid 108 like a boat. The material of the boat-shaped fluid-compliant body 100 and the shape of the boat-shaped fluid-compliant body 100 may be configured such that when the PCB-type component carrier 102 is received in the receiving compartment 106 defined within the fluid-compliant body 100, the fluid-compliant body 100 floats on a liquid 108, such as water. Advantageously, the ultrasound 130 generated by the ultrasound source 118 at the receptacle 116 and propagating through the liquid 108 may then be transmitted from the liquid 108 to the component carrier 102 located in the receiving compartment 106 of the fluid compliant body 100 for impacting the component carrier 102 located in the receiving compartment 106 of the fluid compliant body 100 with the ultrasound 130. Thus, the component carrier 102 may be subjected to ultrasonic cleaning when housed in the fluid compliant body 100, and thus, there is no need to completely immerse the component carrier 102 in the ultrasonically activated aqueous liquid 108. Thus, even the water-sensitive component carrier 102 may be subjected to ultrasonic cleaning to remove contaminants such as dust and dirt from the cutting process. Advantageously, the described indirect ultrasound-based cleaning process of the component carrier 102 is also compatible with the liquid-sensitive surface-mounted electronic components 112. The component carrier 102 may or may not be partially in contact with the liquid 108 during ultrasonic cleaning, but the component carrier 102 need not be completely immersed in the liquid 108. Furthermore, housing the plurality of component carriers 102 in the receiving compartment 106 of the fluid compliant body 100 during the ultrasonic treatment may simplify handling of the component carriers 102 during the treatment as compared to individual handling of each component carrier 102 individually.

More specifically, the fluid compliant body 100 configured for housing the component carriers 102 may include a bottom side carrier body 104 with a plurality of housing compartments 106 defined in the carrier body 104, each configured for housing one component carrier 102. The carrier body 104 may comprise, for example, a plate-like bottom surface, which may optionally have one or more openings or may be closed. The vertical projection structure (e.g., the securing projection 186, e.g., compare fig. 10 and 11) of the carrier body 104 may define a plurality of receiving compartments 106 in the carrier body 104, each receiving compartment being shaped and sized for receiving a respective component carrier 102.

As best seen in fig. 10 and 11, the receiving compartment 106 is shaped or the receiving compartment 106 is configured such that the received rectangular component carrier 102 contacts the carrier body 104 only in the corner portions of the component carrier 102. Advantageously, the component carrier 102 accommodated in the accommodation compartment 106 may be in direct physical contact with the carrier body 104 only through the side walls of the component carrier 102 and only in the corner portions of the carrier body 104. This can ensure that the non-contact main surface of the component carrier 102, and in particular the solder mask which can be applied here, is reliably protected from scratches.

Further, fig. 1 shows that the fluid compliant body 100 includes a cover body 110, the cover body 110 covering the carrier body 104 and the component carrier 102 at the top side of the fluid compliant body 100. Thus, the component carrier 102 is sandwiched between the carrier body 104 and the cover body 110, and thus the component carrier 102 is reliably prevented from falling off the fluid compliant body 100 during handling and sonication. The cover body 110 may be a substantially plate-shaped cover that may or may not have an opening for exposing a major surface portion of the component carrier 102.

The fluid compliant body 100, as well as the materials and shape of the components of the fluid compliant body 100 in the form of the carrier body 104 and the cover body 110, may be configured for floating on a liquid 108, such as water, even when the component carrier 102 is carried in the receiving compartment 106. In addition to the described shapes of the carrier body 104 and the cover body 110, this floating property may be facilitated by a material selection according to which the fluid compliant body 100 and the components of the fluid compliant body 100 in the form of the carrier body 104 and the cover body 110 comprise or consist of a resin, such as an epoxy resin. Such a resin may have a density small enough to allow the boat-type fluid compliant body 100 with the housed component carrier 102 to float on the water bath of the liquid 108 (rather than immersed in the water bath of the liquid 108). Thus, the fluid compliant body 100 of fig. 1 may also be represented as a floating body.

However, in other exemplary embodiments of the present invention, the component carrier 102 housed in the fluid compliant body 100 does not float on the liquid 108 (e.g., water), but is partially or completely immersed in the liquid 108.

Since resins of the kind described above may also form part of the electrically insulating layer structure 136 of the component carrier 102 (which part of the electrically insulating layer structure 136 may be made of a prepreg, which may comprise a resin, such as an epoxy, and optionally reinforcing particles, such as glass fibers or glass spheres), the material of the fluid compliant body 100 may help to inhibit non-PCB-type foreign objects from entering the manufacturing process. Thus, the resin fluid compliant body 100 can advantageously avoid contamination of the component carrier 102 with foreign matter. Further, the resin material of the fluid compliant body 100 may prevent scratching of the component carrier 102.

Last but not least, the fluid compliant body 100 can be configured for transmitting ultrasound from the liquid 108 to the component carrier 102 in the receiving compartment 106. Thus, the coupling of the component carrier 102 within the fluid compliant body 100 via the receiving compartment 106 and ultimately with the liquid 108 in the container 116 may be such that: the generation of ultrasound 130 in the liquid 108 will result in an ultrasonic impact to the housed component carrier 102. Thus, upon installation of the component carrier 102 in the receiving compartment 106 and placement of the fluid compliant body 100 on the liquid 108 while simultaneously operating the ultrasonic source 118 to generate the ultrasonic sound waves 130 will trigger ultrasonic cleaning of the component carrier 102 without taking any other measures.

As also shown in fig. 1, the apparatus 114 may include a conveyor mechanism 122, the conveyor mechanism 122 being embodied herein as a roller conveyor, the conveyor mechanism 122 being configured for conveying the fluid compliant body 100 along the liquid 108 in the receptacle 116. The conveyor mechanism 122 may be controlled by a control unit 144. Thus, in conjunction with the robot 120, a fully automated ultrasonic-based cleaning system for cleaning the cut component carrier 102 may be implemented. Ultrasonic cleaning may be performed during movement of the fluid compliant body 100 in the liquid 108 by the conveyor mechanism 122.

Still referring to fig. 1, the apparatus 114 may include another robot 120' of the unloading device 150 for processing the component carrier 102 and the fluid compliant body 100 on a post-processing side, i.e., downstream of the canister or container 116. In the illustrated embodiment, the unloading apparatus 150 may also include a conveyor belt 152, the conveyor belt 152 being used to transport the component carriers 102 away from the apparatus 114. The control unit 144 of the apparatus 114 may also control the unloading device 150. For example, the other manipulator 120' on the right hand side of fig. 1 may remove the fluid compliant body 100 from the liquid 108 and may remove the component carrier 102 from the receiving compartment 106 of the fluid compliant body 100.

During operation of the apparatus 114, the component carrier 102 may be assembled into the receiving compartment 106 in the carrier body 104 of the fluid compliant body 100. Further, the fluid compliant body 100 with the housed component carrier 102 may be positioned at a liquid level of the container 116 for floating on the liquid 108 housed therein. Advantageously, ultrasound 130 is transmitted from the liquid 108 to the component carrier 102 located in the receiving compartment 106 of the fluid compliant body 100. By taking this measure, the component carrier 102 is cleaned by ultrasound 130. This may allow cutting residues such as dust to be removed from the component carrier 102 by the ultrasound 130. Such a cutting residue may be a residue of a cutting process of cutting a component carrier structure such as a panel into a plurality of component carriers 102. Advantageously, the apparatus 114 according to fig. 1 may allow the component carrier 102 to remain out of direct contact with the liquid 108 (in particular water) when transmitting ultrasound 130 from the liquid 108 to the component carrier 102 during ultrasonic cleaning.

Fig. 2 illustrates an apparatus 114 for treating a component carrier 102 on or in a fluid compliant body 100 for cleaning in accordance with another exemplary embodiment of the present invention. In particular, the treatment of the component carrier 102 is implemented in the fluid compliant body 100 in the device 114 according to fig. 2 and comprises the treatment of the component carrier 102 with ultrasound 130 in the liquid 108. An overview of the device 114 is given in the upper part of fig. 2, while the lower part of fig. 2 shows a front view of the device 114.

According to fig. 2, the component carrier 102 in the fluid compliant body 100 may be processed between the loading device 140 and the unloading device 150. In the loading device 140, a plurality of component carriers 102 may be inserted into the respective receiving compartments 106 of the fluid compliant body 100. After cleaning in multiple stages as described in more detail below, the cleaned component carrier 102 may be removed from the fluid compliant body 100 at the unloading apparatus 150 for further processing. Thus, the component carrier 102 may remain housed within the fluid compliant body 100 during the entire cleaning sequence between the loading device 140 and the unloading device 150. For example, one or more robots (see reference numerals 120, 120' in fig. 1) may be implemented in the loading device 140 for loading the separated component carriers 102 for subsequent cleaning processes and/or in the unloading device 150 for unloading the processed component carriers 102 for further processing.

As shown, the conveyor mechanism 122, which may also be represented as a tank chain conveyor, may transport the fluid compliant body 100 with the component carrier 102 therein along an entire cleaning line between the loading device 140 and the unloading device 150. According to fig. 2, the conveyor mechanism 122 comprises an upper conveyor 122A and a lower conveyor 122B, wherein the fluid compliant body 100 can be compressed from both sides between the upper conveyor 122A and the lower conveyor 122B.

In the first tank 154 of the cleaning line of the apparatus 114, the component carrier 102 in the fluid compliant body 100 may be subjected to a thermal rinse process (e.g., using rinse water at a temperature of 40 ℃). For example, a hot rinse fluid may be sprayed onto the component carrier 102 in the fluid compliant body 100 through the rinse nozzles 156.

Referring now to the subsequent blocks, indicated by reference numeral 158, as the component carrier 102 in the fluid-compliant body 100 travels over the conveyor mechanism 122, the component carrier 102 in the fluid-compliant body 100 may be conveyed through an air knife (shown by the nozzle 160) to blow liquid and/or debris from the component carrier 102.

Thereafter, the fluid compliant body 100 passes through the second tank 164 with the component carrier 102 of the fluid compliant body 100 and is subjected to overflow cleaning by use of the cleaning nozzle 166.

In the third tank 168 of the cleaning line of the apparatus 114, the component carrier 102 in the fluid compliant body 100 may then be subjected to another thermal rinsing process (e.g., using rinse water at a temperature of 40 ℃). For example, another hot rinse fluid may be sprayed onto the component carrier 102 in the fluid compliant body 100 for additional rinsing through another rinse nozzle 170.

In the fourth tank 172 of the cleaning line of the apparatus 114, the component carrier 102 in the fluid compliant body 100 may then be subjected to ultrasonic cleaning by the ultrasound 130 transmitted from the liquid 108 to the fluid compliant body 100 immersed in the liquid 108 and from the fluid compliant body to the contained component carrier 102. This may be accomplished by immersing the component carrier 102 in the liquid 108. More specifically, there may be a water-filled chamber, and the component carrier 102 may be completely immersed in the liquid 108. The ultrasonic generator 118 may also be completely immersed in the liquid 108.

In the fifth tank 174 of the cleaning line of the apparatus 114, the component carrier 102 in the fluid compliant body 100 may then be subjected to yet another thermal rinsing process (e.g., using rinse water at a temperature of 40 ℃). For example, a further hot rinse fluid may be sprayed onto the component carrier 102 in the fluid compliant body 100 for additional rinsing through the rinse nozzles 176.

After the heat rinse process in the fifth tank 174, the component carrier 102 is subjected to a drying process in block 178 through a drying nozzle 180. In this process, a sufficiently long can is provided and the processing time is increased to dry the PCB. An alternative air knife may also be provided for drying.

Cleaning and drying of the component carrier 102 in the fluid compliant body 100 may be accomplished by a hot-blowing process in block 182 (e.g., at a temperature of 80 ℃).

As shown in fig. 2, the component carrier 102 may remain within the respective fluid compliant body 100 throughout the multiple cleaning process between the loading device 140 and the unloading device 150. In particular, the respective fluid compliant body 100 may be moved along each cleaning stage by a continuously operating conveyor mechanism 122. In embodiments, the cleaning stage may include at least one or more hot rinse stages, one or more air knife treatment stages, one or more ultrasonic rinse stages, and one or more drying stages.

Fig. 3-11 illustrate different views and cross-sections of an apparatus 114 for treating a component carrier 102 on a fluid compliant body 100 with ultrasound 130 in a liquid 108 according to an exemplary embodiment of the invention. With particular reference to the device 114 shown in fig. 2.

Referring to fig. 3, a fluid compliant body 100 according to an exemplary embodiment of the present invention is shown in a state in which a cover body 110 has been pivoted relative to a carrier body 104 to access respective (here six) receiving compartments 106 for manipulation of a component carrier 102 having a surface mount component 112. In the illustrated configuration, the component carrier 102 may be assembled in the receiving compartment 106 or may be removed from the receiving compartment 106. Fig. 3 also shows that the cover body 110 includes a plurality of openings 190, each opening 190 being assigned to a respective one of the receiving compartments 106. Through the opening 190, a substantial portion (e.g., at least 80%, and especially at least 90% of the upper major surface area) of the respective major surface of the component carrier 102 may be exposed when the component carrier 102 is received in the receiving compartment 106 and when the fluid compliant body 100 is closed, i.e., when the cover body 110 is pivoted downward and secured to the carrier body 104. This allows the respective top side portions of the component carrier 102 to be exposed to the environment as the component carrier 102 is maneuvered within the fluid compliance body 100.

Referring to fig. 4, a shipping view of the loaded fluid compliant body 100 from the loading device 140 to the conveyor mechanism 122 or tank chain conveyor is shown. The unit or component carrier 102 is carried by a fluid compliant body 100 secured in a conveyor mechanism 122 or tank chain conveyor.

Fig. 5 shows a fourth tank 172, wherein in the fourth tank 172, the component carrier 102 housed within the fluid compliant body 100 is subjected to ultrasonic rinsing, as described above.

Referring to fig. 6, a dry block is shown (compare reference numerals 178, 182 in fig. 2). For example, the circulation of the flow of hot air from the air knife dries the fluid compliant body 100 and the component carrier 102 (e.g., PCB) after a previous cleaning process.

Fig. 7 shows a top view of the carrier body 104 of the fluid compliant body 100 without the component carriers 102 in each of the receiving compartments 106. Also shown are securing tabs 186 projecting upwardly from the plate carrier body 104 and for securing the component carriers 102 within the respective receiving compartments 106. Further, spacers 188 are shown for spacing the carrier body 104 relative to the cover body 110. More specifically, the spacers 188 on the carrier body 104 may have a protruding shape that mates with corresponding recesses located at corresponding locations on the cover body 110 such that the carrier body 104 and the cover body 110 may be assembled together to ensure that each of the component carriers 102 (e.g., PCB-type component carriers 102) is disposed at a well-defined location between the carrier body 104 and the cover body 110. Fig. 7 also shows that the carrier body 104 includes a plurality of openings 190, each opening 190 being assigned to a respective one of the receiving compartments 106. Through the opening 190, a substantial portion (e.g., at least 80% or at least 90% of the lower major surface area) of the respective major surface of the component carrier 102 may be exposed when the component carrier 102 is received in the receiving compartment 106 and when the fluid compliant body 100 is closed, i.e., when the cover body 110 is secured to the carrier body 104. This allows the respective bottom side portions of the component carrier 102 to be exposed to the environment as the component carrier 102 is maneuvered within the fluid compliance body 100. Fig. 8 shows the carrier body 104 of the fluid compliant body 100 according to fig. 7 after assembly of the component carrier 102 with the surface mount component 112 in the receiving compartment 106. Fig. 9 shows the corresponding fluid compliant body 100 according to fig. 8 loaded with the component carrier 102 and after covering the carrier body 104 and the component carrier 102 with the cover body 110.

Referring to fig. 10 and 11, details of the securing tab 186 are shown. The fixing projection 186 protrudes upward from the flat base of the carrier body 104 and has an inclined side wall tapered downward. Thus, the component carrier 102 near the base of the carrier body 104 will be held and secured between the upwardly projecting and tapered fixing tabs 186 at a vertical level defined by the arrangement and shape of the fixing tabs 186 and by the precise geometry of the component carrier 102. As best shown in fig. 10, each component carrier 102 is received in a respective receiving compartment 106 by physical contact only or by clamping at the vertical side walls of the plate-like component carrier 102 that engage the securing tabs 186 of the fluid compliant body 100. More specifically, each rectangular component carrier 102 may be secured at each of the four corners of the rectangular component carrier 102 by engaging a respective pair of securing tabs 186 of the fluid compliant body 100 in each of the four corners. Advantageously, the opposite planar major surfaces of the component carrier 102 may not be in contact with the fluid compliant body 100, and the fixation may be achieved solely by the vertical sidewalls of the component carrier 102. Thus, the receiving compartment 106 is shaped and defined by the securing tabs 186 such that the received component carrier 102 contacts the carrier body 104 only in the corners of the component carrier 102. This protects, among other things, the solder resist on the major surface of the component carrier 102 from scratches.

The spacers 188 of the carrier body 104 may space the carrier body 104 relative to the cover body 110 and may also serve to mechanically connect the carrier body 104 with corresponding connection structures of the cover body 110.

It should be noted that the term "comprising" does not exclude other elements or steps and the "a" or "an" does not exclude a plurality. Elements described in association with different embodiments may also be combined.

It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the claims.

The practice of the invention is not limited to the preferred embodiments shown in the drawings and described above. Rather, many variations are possible using the solutions shown and according to the principles of the invention, even in the case of radically different embodiments.

Claims (24)

1. A fluid compliant body (100), the fluid compliant body (100) for housing a component carrier (102), wherein the fluid compliant body (100):

comprising a carrier body (104) and a cover body (110), the carrier body (104) comprising a receiving compartment (106) for receiving a component carrier (102), the cover body (110) covering the carrier body (104) and the component carrier (102);

Wherein at least one of the carrier body (104) and the cover body (110) comprises an opening (190), the opening (190) exposing a major portion of a respective major surface of the component carrier (102) when the component carrier (102) is received in the receiving compartment (106).

2. The fluid compliant body (100) of claim 1, wherein the fluid compliant body (100) is configured for: when the fluid compliant body (100) is in physical contact with a fluid, in particular with a liquid (108), ultrasound (130) is transmitted from the fluid, in particular from the liquid (108), to a component carrier (102) in the receiving compartment (106).

3. The fluid compliant body (100) of claim 1 or 2, wherein at least one of the carrier body (104) and the cover body (110) is configured for securely retaining the component carrier (102) when the component carrier (102) is received in the receiving compartment (106).

4. A fluid compliant body (100) according to claim 2 or 3, wherein the fluid compliant body (100):

configured for floating on the liquid (108), in particular configured for floating on an aqueous liquid; and

A component carrier (102) configured for transmitting ultrasound (130) from the liquid (108) into the receiving compartment (106) when the fluid compliant body (100) floats on the liquid (108).

5. The fluid compliant body (100) of any one of claims 1 to 4, wherein the fluid compliant body (100) comprises a resin or the fluid compliant body (100) is composed of a resin.

6. The fluid compliant body (100) of any one of claims 1 to 5, wherein the receiving compartment (106) is configured such that: the received component carrier (102) contacts the carrier body (104) only in the corner portions of the carrier body (104) and/or only at the side walls of the component carrier (102).

7. The fluid compliant body (100) of any one of claims 1 to 6, wherein the fluid compliant body (100) comprises the component carrier (102) housed in the housing compartment (106).

8. The fluid compliant body (100) of claim 7, wherein the fluid compliant body (100) comprises a surface mount component (112) on each component carrier (102).

9. An apparatus (114) for treating a component carrier (102) with ultrasound (130) in a fluid, in particular the fluid is a liquid (108), wherein the apparatus (114) comprises a fluid compliant body (100) according to any one of claims 1 to 8, the fluid compliant body (100) being for accommodating a component carrier (102) and being capable of being in physical contact with the fluid, in particular with the liquid (108), such that: when the fluid compliant body (100) is in physical contact with the fluid, in particular with the liquid (108), ultrasound (130) is transmitted from the fluid, in particular from the liquid (108), to the component carrier (102) in the receiving compartment (106).

10. The apparatus (114) of claim 9, wherein the apparatus (114) comprises a container (116) coupled to an ultrasonic source (118) and containing the liquid (108), the ultrasonic source (118) being configured for generating ultrasound (130) in the liquid (108).

11. The apparatus (114) according to claim 9 or 10, wherein the apparatus (114) comprises loading means (140) for inserting the component carrier (102) into the receiving compartment (106), and/or the apparatus (114) comprises unloading means (150) for removing the component carrier (102) from the receiving compartment (106).

12. The apparatus (114) of claim 11, wherein the loading device (140) is configured for placing the fluid compliant body (100) on or in the liquid (108) and/or the unloading device (150) is configured for retrieving the fluid compliant body (100) from the liquid (108).

13. The apparatus (114) according to any one of claims 9 to 12, wherein the apparatus (114) comprises a conveyor mechanism (122) configured for conveying the fluid compliant body (100) along the liquid (108), in particular the conveyor mechanism (122) is a conveyor belt or a roller conveyor.

14. The device (114) according to any one of claims 9 to 13, wherein the device (114) comprises at least one of the group consisting of: at least one hot rinse stage, at least one air knife treatment stage, and at least one drying stage.

15. A method of treating a component carrier (102) with ultrasound (130) in a fluid, in particular the fluid is a liquid (108), wherein the method comprises:

-housing a component carrier (102) in a housing compartment (106) located in a carrier body (104) of a fluid compliant body (100);

-covering the carrier body (104) and the component carrier (102) with a cover body (110) of the fluid compliant body (100);

bringing the fluid compliant body (100) into physical contact with the fluid, in particular with the liquid (108), for transmitting ultrasound (130) from the fluid, in particular from the liquid (108), to the component carrier (102) in the receiving compartment (106); and

when the component carrier (102) is received in the receiving compartment (106), a major portion of a respective major surface of the component carrier (102) is exposed through an opening (190) of at least one of the carrier body (104) and the cover body (110).

16. The method according to claim 15, wherein the method comprises: -cleaning the component carrier (102) by means of the ultrasound (130).

17. The method according to claim 15 or 16, wherein the method comprises: dust is removed from the component carrier (102) by the ultrasound (130), at least a portion of the dust being considered as a residue of a cutting process that cuts the component carrier structure into a plurality of component carriers (102).

18. The method according to any one of claims 15 to 17, wherein the method comprises: the component carrier (102) is sprayed with an aqueous spray before and/or after the component carrier (102) is cleaned by the ultrasound (130), in particular before and/or after the component carrier (102) is cleaned by the ultrasound (130), the component carrier (102) being sprayed with an aqueous spray while the component carrier (102) is contained within the fluid compliant body (100).

19. The method according to any one of claims 15 to 18, wherein the method comprises: -subjecting the component carrier (102) to a heat rinsing process before and/or after cleaning the component carrier (102) by means of the ultrasound (130), in particular-subjecting the component carrier (102) to a heat rinsing process while the component carrier (102) is accommodated within the fluid compliant body (100) before and/or after cleaning the component carrier (102) by means of the ultrasound (130).

20. The method of claim 19, wherein the method comprises: -after the heat-rinsing process, subjecting the component carrier (102) to a drying process, in particular, -after the heat-rinsing process, subjecting the component carrier (102) to a drying process while the component carrier (102) is housed within the fluid compliant body (100).

21. The method according to any one of claims 15 to 20, wherein the method comprises: -treating the component carrier (102) with an air knife (158) before and/or after cleaning the component carrier (102) by means of the ultrasound (130), in particular-treating the component carrier (102) with an air knife (158) while the component carrier (102) is contained within the fluid compliant body (100) before and/or after cleaning the component carrier (102) by means of the ultrasound (130).

22. The method according to any one of claims 15 to 21, wherein the method comprises: the component carrier (102) housed in the fluid compliant body (100) is immersed in the liquid (108) while the ultrasound (130) is transmitted from the liquid (108) to the component carrier (102).

23. The method according to any one of claims 15 to 22, wherein the method comprises: -placing the fluid compliant body (100) with the component carrier (102) received for floating on the liquid (108).

24. The method of any one of claims 15 to 21 or 23, wherein the method comprises: the component carrier (102) is kept out of contact with the liquid (108) while the ultrasound (130) is transmitted from the liquid (108) to the component carrier (102).

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