JP2008091455A - Manufacturing method for conductor circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conductor circuit board manufacturing method which prevents a decrease in the adhesion of a conductive layer to an insulating board in a plating process, and enables the formation of a conductive layer showing fine electric characteristics. <P>SOLUTION: The conductive layer 2 is formed by applying conductive paste to the surface of the insulating board 1 and baking the conductive paste. A coating agent capable of forming a chemical barrier film is added to the conductive layer 2 to form a film 3 having a barrier property against a plating chemical on the surface of the conductive layer 2. The conductive layer 2 coated with the film 3 is then polished to expose the conductive layer 2. The conductor layer 2 can be plated with a bonding interface between conductive layer 2 and the insulating layer 1 is kept coated with the film 3. This prevents a plating solution, etc., from acting on the bonding interface, thus preventing a decrease in the adhesion of the conductive layer 2 to the insulating layer 1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a conductor circuit board in which a conductor circuit is formed using a conductive paste.

  In order to form conductive films and circuits such as wirings, conductive patterns, and electrodes of multilayer ceramic capacitors on the surface of an insulating substrate such as a ceramic substrate, conductive paste is widely used. There are two types of conductive pastes, a fired type and a non-fired type, and the fired type is usually used in applications requiring high heat resistance and high reliability as described above. Firing-type conductive paste usually contains metal powder and glass powder as solid components, and is prepared by adding and kneading a vehicle made of an appropriate resin or solvent to impart coatability thereto. . A conductive layer can be formed by applying a conductive paste to the surface of an insulating substrate by screen printing or the like and then heating and baking at a high temperature to remove organic components and sinter metal powder. Yes, a circuit or an electrode can be formed with this conductor layer (see, for example, Patent Document 1).

In addition, the surface of the conductor layer formed from the conductive paste is often plated with nickel, tin or the like for the purpose of protection from oxidation and improvement of solderability.
JP-A-6-204645

  However, the conductor layer formed from the conductive paste is dense to some extent due to the sintering of the metal particles, but due to the influence of organic components and the residual voids between the grain boundaries during the sintering of the metal particles, the sintered film Is usually porous. For this reason, when plating is performed, the pretreatment liquid or the plating liquid may permeate the gaps in the conductor layer and enter the bonding interface between the conductor layer and the insulating substrate. There has been a problem that the base of an insulating substrate such as a substrate may be eroded and the adhesion between the conductor layer and the insulating substrate may deteriorate.

  As one of the countermeasures, it is possible to improve to some extent by selecting and using a metal powder with good sinterability, and forming the conductor layer densely, but this method can also reduce the gap in the conductor layer. It is difficult to eliminate all of them, and conversely, excessive densification is accompanied by a large shrinkage of baking, and there is a risk of causing deformation and cracks in the insulating substrate.

  As another countermeasure, there is a method of selecting and adjusting the kind and addition amount of the glass powder to be contained in the conductive paste, and melting and flowing the glass during firing to seal the voids of the conductor layer. However, in order to completely prevent the penetration of the plating solution or the like by this method, it is necessary to add a lot of glass powder to the conductive paste in consideration of the firing conditions and the variation of the composition for each lot. In this case, the glass oozes out on the surface of the conductor layer, the surface of the conductor layer is covered with glass, and the problem of poor adhesion of the plating metal to the surface of the conductor layer arises. This leads to a decrease in electrical characteristics such as an increase in electrical resistance.

  The present invention has been made in view of the above points, and can prevent a decrease in adhesion of a conductor layer to an insulating substrate during plating, and can form a conductor layer with good electrical characteristics. An object of the present invention is to provide a method for producing a conductive circuit board.

  According to a first aspect of the present invention, there is provided a method for producing a conductive circuit board comprising: applying a conductive paste to a surface of a heat-resistant insulating substrate and baking the conductive layer to form a conductive layer and forming a chemical barrier film; After the conductor layer is impregnated to form a film having a barrier property against chemicals used for plating on the surface of the conductor layer, the film at a predetermined portion is removed to expose the conductor layer, and then the exposed conductor The layer is plated.

  According to this invention, a coating agent capable of forming a chemical barrier coating is applied to the conductor layer, and a coating having a barrier property against the chemical used for plating is formed on the surface of the conductive layer. When plating is carried out after removing the coating film at a predetermined part that needs to be plated, the bonding interface between the conductor layer and the insulating substrate is covered with a chemical barrier coating, and a plating solution or the like acts on this bonding interface. This can prevent the deterioration of the adhesion of the conductor layer to the insulating substrate. Further, it is not necessary to add a large amount of glass powder to the conductive paste, and the electrical characteristics of the conductor layer are not deteriorated. Furthermore, since the coating protects the conductor layer from corrosion such as oxidation, the portions that do not require soldering need not be plated.

  The invention of claim 2 is characterized in that, in claim 1, the conductive paste contains copper powder as the conductive powder.

  According to this invention, a conductive layer can be formed with the conductive paste containing copper powder, and a conductive layer with good electrical characteristics can be formed at low cost.

  The invention of claim 3 is characterized in that, in claim 1 or 2, the conductive paste contains glass powder.

  According to this invention, the glass acts as a sintering aid for the conductive powder (metal particles), improves the sinterability of the metal particles, and provides a denser conductor layer. As a binder between the insulating substrates, the adhesion of the conductor layer can be enhanced.

  The invention of claim 4 is the invention according to any one of claims 1 to 3, wherein the coating agent is one or more selected from silicone resins, epoxy resins, phenol resins, fluororesins, metal alkoxides or hydrolysates thereof, and silicon / nitrogen-containing compounds. It is characterized by being selected.

  According to this invention, an organic or inorganic film having a high barrier property against a plating solution or the like can be formed on the surface of the conductor layer.

  The invention of claim 5 is characterized in that, in claim 4, the coating agent is perhydropolysilazane.

According to the present invention, perhydropolysilazane can obtain a dense silica film (SiO ₂ ) even at a low temperature, so that a film having a higher chemical barrier property can be formed on the surface of the conductor layer.

A sixth aspect of the invention is characterized in that, in any one of the first to fifth aspects, the coating film at a predetermined portion of the conductor layer is removed by polishing.
According to this invention, the conductor layer can be removed by a simple process, the surface smoothness of the fired conductive film can be improved, the film thickness can be adjusted at the same time, and the practicality is high.

  The invention of claim 7 is at least one of a conductor circuit board and an element manufactured by the manufacturing method of any one of claims 1 to 6.

  According to the present invention, it is possible to obtain a conductor circuit board and an element that are inexpensive and have high electrical characteristics and reliability.

  According to the present invention, plating can be performed in a state in which the bonding interface between the conductor layer and the insulating substrate is covered with the chemical barrier coating, and the plating solution or the like can be prevented from acting on the bonding interface. It is possible to prevent the adhesiveness of the conductor layer from being lowered, and it is not necessary to add a large amount of glass powder to the conductive paste, and the electrical characteristics of the conductor layer are not lowered. Furthermore, since the chemical barrier coating protects the conductor layer from corrosion such as oxidation, the conductor layer that does not require plating, such as improved solderability, can be prevented from deterioration without plating. It is possible.

  Hereinafter, the best mode for carrying out the present invention will be described.

  In the present invention, the material of the insulating substrate 1 is not particularly limited, but any heat-resistant material that does not interfere with the firing temperature of the conductive paste such as ceramics can be used. For example, as the ceramic material, any materials such as alumina, aluminum nitride, silicon nitride, sialon, silicon carbide, boron nitride, silicon carbide composite material, and glass ceramic can be used.

  Further, the composition of the conductive paste of the present invention and the production method thereof are not particularly limited, and conventionally known ones can be used. The conductive paste is usually prepared by mixing and mixing glass powder, an organic binder, a solvent, and the like with a metal powder such as copper powder as a main component responsible for conductivity. The mixing method is not particularly limited, but can be performed using a three-ink roll. The blending ratio of each material is not particularly limited, but the range of 0.5 to 20 parts by weight of glass powder, 1 to 10 parts by weight of organic binder, and 2 to 30 parts by weight of solvent with respect to 100 parts by weight of metal powder. preferable.

  The conductive powder to be used is not particularly limited, but Au, Ag, Pt, Pd, Cu, Ni, Co, which are usually used in conductive pastes for forming terminal electrodes of conductor circuits and laminated electronic components. In particular, when the conductive powder containing Cu is used, the effects of the present invention can be enjoyed to a higher degree. This is because copper is inexpensive and excellent in conductivity, thermal conductivity, and the like. The conductive powder containing Cu may be Cu powder, copper oxide powder, Cu alloy powder or mixed powder of these and other conductive metals, and metal oxide, glass, ceramic on the surface of Cu powder. It is also possible to use a metal-inorganic composite powder in which an inorganic material such as a metal-inorganic composite powder is present, a metal-inorganic composite powder obtained by coating a metal oxide, glass, ceramic, or other metal powder with Cu.

  The particle size and shape of the metal powder used are not particularly limited, and may be appropriately selected according to the sinterability of the metal particles, the thickness of the target conductor layer, smoothness, denseness, etc. By using two or more kinds of particles having different particle diameters in combination, a dense conductor layer can be obtained, which is preferable. Here, when using copper powder as the metal powder, a mixture of copper powder having an average particle diameter exceeding 1 μm (the upper limit is about 100 μm) and fine copper powder having an average particle diameter of 1 μm or less can be used. Furthermore, the particle size may be designed so as to achieve close packing. By using fine copper powder mixed with copper powder having a large particle diameter in this way, fine copper powder enters the copper powder having a large particle diameter, and the copper powder is densely filled to improve electrical characteristics. It is something that can be done. The lower limit of the particle size of the fine copper powder is not particularly set, but about 1 nm is practically the lower limit. Moreover, the mixing amount of the fine copper powder is preferably in the range of 1 to 30 parts by mass with respect to 100 parts by mass of the copper powder having a large particle size.

  Moreover, when not using the thing of a large particle size and a fine particle size as mentioned above as a copper powder, it is preferable to use a copper powder whose average particle diameter is less than 10 micrometers. When copper powder having an average particle size of 10 μm or more is used, the denseness and smoothness of the obtained conductor layer may be reduced.

  The glass powder used is preferably a low-melting glass having a softening temperature of 300 to 800 ° C. In recent years, it is preferable to use lead-free glass powder because of concern for environmental problems. The kind of the lead-free low melting point glass is not particularly limited, and conventionally known borosilicate glass, bismuth glass, tin glass, and the like can be used. In order to improve the plating resistance, it is more preferable to use a glass having high water resistance, acid resistance and alkali resistance.

  The particle size of the glass powder used is not particularly limited, but those in the range of 0.1 to 10 μm are preferable. The glass powder melts and flows at a temperature equal to or lower than the sintering temperature of the metal particles, improves the sinterability of the metal particles, and acts as a binder between the conductor layer and the insulating substrate, thereby contributing to an improvement in adhesion.

  In addition, it is not necessary to use glass powder depending on the purpose of use, application, or paste formulation. In this case, it is preferable to use metal particles having a smaller particle size in order to improve the denseness of the sintered conductor layer and the adhesion with the insulating substrate.

  Further, the organic binder is not particularly limited, but is an organic compound that is easily burned off in the baking process and has a low ash content, for example, acrylics such as polybutyl methacrylate and polymethyl methacrylate, nitrocellulose, ethyl cellulose, acetic acid. Celluloses such as cellulose and butyl cellulose, polyethers such as polyoxymethylene, polyvinyls such as polybutadiene and polyisoprene can be used, and these can be used alone or in combination of two or more. Can also be used.

  Further, the solvent is not particularly limited, but an organic compound that gives an appropriate viscosity to the paste and can be easily volatilized by a drying process after the conductive paste is applied to the insulating substrate, such as carbitol and carbitol acetate. , Terpineol (terpineol), metacresol, dimethylimidazolidinone, dimethylformamide, terpinol, diacetone alcohol, triethylene glycol, paraxylene, ethyl lactate, isophorone, etc., can be used, these are One type can be used alone, or two or more types can be mixed and used.

  In addition to the above components, a surface active agent and an antioxidant can be added to the conductive paste as necessary.

  First, a conductive paste is applied to the surface of the insulating substrate 1. The method for applying the conductive paste is not particularly limited, and can be performed by a conventionally known method such as screen printing, ink jet printing, dipping, applicator coating, etc. At this time, the conductive paste can be conducted in an arbitrary pattern such as a circuit pattern. An adhesive paste can be applied. After the conductive paste is applied in this way, it is heated with a dryer or the like to remove the solvent of the conductive paste, and further placed in a baking furnace and heated and baked at a high temperature, whereby the surface of the insulating substrate 1 is illustrated. The conductor layer 2 can be formed as in 1 (a).

  The firing conditions for the conductive paste are not particularly limited, and conventional firing methods and conditions suitable for the properties of the conductive paste used can be used. For example, in the case of a copper paste, it can be fired at 700 to 1000 ° C. for 10 minutes or more in a nitrogen atmosphere.

  As shown in FIG. 1A, the conductive layer 2 is adhered to the insulating substrate 1 with high adhesion by the glass thin film 10 formed by melting the glass powder contained in the conductive paste during firing. In addition, a gap 11 is formed in the conductor layer 2 so that the gap between the metal particles is not completely filled during firing.

  Next, a coating agent capable of forming a chemical barrier film is applied to the conductor layer 2 formed on the insulating substrate 1 in this way. The method for applying the coating agent is not particularly limited. For example, the coating agent can reach the internal voids of the conductor layer 2 by dipping or applying the coating agent. It is only necessary that the film 3 can be formed on the surface 11. In order to allow the coating agent to quickly penetrate into the internal space of the conductor layer 2, it may be dipped under reduced pressure in a chamber.

Here, as the coating agent, an organic or inorganic polymer or a precursor thereof can be used. For example, silicone resin, epoxy resin, phenol resin, fluororesin, metal alkoxide or hydrolyzate thereof, silicon / nitrogen Containing compounds can be used. Among these, it is particularly preferable to use perhydropolysilazane. Perhydropolysilazane is converted to silica even at a low temperature to obtain a dense silica film (SiO ₂ ), so that a film having excellent chemical barrier properties can be formed on the surface of the conductor layer 2. It is preferable to use these coating materials after adjusting the viscosity with a solvent or the like so that the coating material 2 can easily enter the voids 11 of the conductor layer 2. The type of coating agent to be used and the number of times of application may be one time, but two or more types of coating agents or a plurality of times may be applied. The coating 3 can be formed on the inner and outer surfaces of the conductor layer 2 by applying the coating agent to the conductor layer 2 and then drying and curing at room temperature or under heating according to the drying or curing conditions of the coating agent. is there. In order to adjust the curing temperature of the coating agent or the physical properties of the cured film, a reaction catalyst or the like may be added to the coating agent.

  Here, since the barrier layer 3 is formed by impregnating the conductor layer 2 with a coating agent, as shown in FIG. 1 (b), the conductor layer 2 includes the conductor layer 2 as well as the surface thereof. The barrier coating 3 can also be formed on the surface of the gap 11 formed in the inside and the bonding interface between the conductor layer 2 and the insulating substrate 1. Since the barrier coating 3 is formed of the material as described above, it has a barrier property against chemicals used for plating such as a plating solution and a pretreatment solution before plating.

  After covering the surface of the conductor layer 2 with the barrier coating 3 in this way, the coating 3 on the surface (upper surface on the side opposite to the insulating substrate 1) is removed from all or part of the conductor layer 2 to obtain FIG. The conductor layer 2 is exposed as shown in FIG. The method for removing the coating 3 is not particularly limited, and it is sufficient that a coating at a predetermined portion can be removed, such as sandpaper polishing, buff polishing, blast polishing, plasma etching, and the like. Among them, buffing is a process that is usually performed for improving the surface smoothness of the conductor layer 2 and adjusting the film thickness, and is therefore suitable for the purpose of the present invention. Since the film removal is performed on the surface of the conductor layer 2, the surface of the void 11 in the conductor layer 2 and the film 3 formed on the bonding interface between the conductor layer 2 and the insulating substrate 1 remain as they are.

  Then, the conductor layer 2 is polished to remove the surface coating 3, and the metal of the conductor layer 2 is exposed at the portion where the coating 3 is removed, and then the conductor layer 2 is coated with a metal such as nickel plating or tin plating. By plating, a plating film 4 as shown in FIG. 1 (d) can be formed on the surface of the conductor layer 2. At this time, the surface of the gap 11 in the conductor layer 2 and the bonding interface between the conductor layer 2 and the insulating substrate 1 are covered with the coating 3 having a barrier property. Further, it is possible to prevent the plating solution or the like from coming into contact with the bonding interface between the conductor layer 2 and the insulating substrate 1, and to prevent the bonding interface between the conductor layer 2 and the insulating substrate 1 from being eroded by the plating solution or the like. Therefore, it is possible to prevent the adhesiveness between the conductor layer 2 and the insulating substrate 1 from deteriorating.

  In addition, by forming the barrier coating 3 on the surface of the conductor layer 2 in this way, the adhesion between the conductor layer 2 and the insulating substrate 1 is prevented from deteriorating during plating. There is no need to add a large amount of glass powder to the conductive paste forming the layer 2. Therefore, the glass does not ooze out on the surface of the conductor layer 2 to deteriorate the adhesion of the plated metal, and the electrical resistance of the conductor layer 2 is increased, and the electrical characteristics are not deteriorated. .

  Next, the present invention will be specifically described with reference to examples.

(Preparation of conductive paste)
As the copper powder, a base copper powder having an average particle diameter of 5 μm and three kinds of fine auxiliary copper powders were used. Further, borosilicate glass frit having a softening point of 600 ° C. and tin glass frit having a softening point of 590 ° C. were used as the glass powder. Furthermore, what melt | dissolved the acrylic resin as an organic binder in the carbitol and terpineol which are solvents was prepared. And each of these materials were mixed with the mixer of the mixing | blending of Table 1, and the electrically conductive paste of Nos. 1-3 was prepared by further mixing uniformly with 3 rolls. The viscosity of each obtained conductive paste at 25 ° C. was measured with a viscometer and shown in Table 1.

(Example 1)
No. 1 conductive paste was printed on an alumina substrate using a stainless screen # 250 having many 2 × 2 mm patterns. Next, the alumina substrate was dried with a blow dryer at 150 ° C. for 20 minutes to remove the solvent, and then placed in a belt furnace and fired in a nitrogen atmosphere under the condition of holding for 10 minutes after reaching the peak temperature of 900 ° C. Then, a conductor layer was formed (see FIG. 1A). At this time, in the temperature increase stage before the belt furnace, 200 ppm of oxygen was contained in the nitrogen atmosphere for burnout of the acrylic resin. The film thickness of the conductor layer thus formed was measured with a stylus type film thickness meter (“Tencor AS50” manufactured by Tenko). The results are shown in Table 2.

  After firing as described above, an alumina substrate is immersed for 10 minutes in a coating agent made of ethanol isopropanol hydrolyzate (prepared from “HAS-10” manufactured by Colcoat Co., Ltd .: 5% by mass of silica), Impregnated with coating agent. Next, the alumina substrate was taken out and stood still for 10 seconds to remove excess coating agent by dripping. Thereafter, the film was formed by drying and curing for 60 minutes with a 120 ° C. blower dryer (see FIG. 1B). By measuring the difference in mass before impregnation and after impregnation / dry curing, the coating amount by the coating was determined. The results are shown in Table 2.

  Next, the surface of the conductor layer was polished twice with a buffing machine (manufactured by Yamagata Kikai Co., Ltd.), and it was confirmed by microscopic observation that the copper of the conductor layer was exposed in the polished portion (see FIG. 1C). ). Table 2 shows the polishing amount.

  After polishing in this way, the alumina substrate was washed with distilled water and dried, and electroless nickel plating was performed on the surface of the conductor layer by the following method.

  First, after immersing the alumina substrate in an acidic cleaning agent (“ACL-007” manufactured by Uemura Kogyo Co., Ltd.) having a temperature of 40 ° C. for 180 seconds, the alumina substrate was immersed in a 100 g / L sulfuric acid aqueous solution for 60 seconds to perform surface treatment. Removed. Next, in order to adhere palladium to the copper of the conductor layer as a catalyst for electroless nickel plating deposition, it was immersed in a palladium activator ("MSR-28" manufactured by Uemura Kogyo Co., Ltd.) and then electroless nickel at 80 ° C. It was immersed in a plating solution ("NPR-4" manufactured by Uemura Kogyo Co., Ltd.) for 7 minutes. Thereafter, the substrate was dried at 150 ° C. for 20 seconds to obtain a circuit board having a nickel plating film attached to the conductor layer (see FIG. 1D).

(Example 2)
A circuit board was obtained in the same manner as in Example 1 except that the conductive paste No. 2 was used.

(Example 3)
A circuit board was obtained in the same manner as in Example 1 except that the conductive paste No. 3 was used.

Example 4
As a coating agent, a 5 mass% xylene solution of perhydropolysilazane (prepared from “NP110” manufactured by Clariant Japan Co., Ltd.) was used. Otherwise, the circuit board was obtained in the same manner as in Example 1.

(Example 5)
As the coating agent, a silicone resin (“KR251” manufactured by Shin-Etsu Silicone Co., Ltd .: nonvolatile content 10 mass%, toluene solvent) was used. Otherwise, the circuit board was obtained in the same manner as in Example 1.

(Example 6)
As a coating agent, a silicone resin (“KR400” manufactured by Shin-Etsu Silicone Co., Ltd .: solvent-free dealcohol type) was used. Otherwise, the circuit board was obtained in the same manner as in Example 1.

(Example 7)
An aluminum nitride substrate was used instead of the alumina substrate. Otherwise, the circuit board was obtained in the same manner as in Example 1.

(Comparative Examples 1-3)
A circuit board was obtained in the same manner as in Examples 1 to 3, except that the coating agent was not impregnated.

(Comparative Examples 4-6)
A circuit board was obtained in the same manner as in Comparative Examples 1 to 3, except that an aluminum nitride substrate was used instead of the alumina substrate.

(Comparative Example 7)
The conductor layer was not polished after impregnating and curing the coating agent. Otherwise, the circuit board was obtained in the same manner as in Example 1.

  About the circuit board obtained in said Examples 1-7 and Comparative Examples 1-7, the plating property of nickel plating and the adhesiveness of a conductor layer were measured.

  The plating property is measured by observing the surface of the conductor layer after nickel plating with an optical microscope. When the plating area is 100% of the surface of the conductor layer, “◯”, and 90% or less “×”. “,” Between them was evaluated as “Δ”. The results are shown in Table 2.

  The adhesion of the conductor layer is determined by soldering and fixing a tin-plated copper wire with a diameter of 0.6 mm to the surface of the conductor layer and pulling the conductor layer with the tin-plated copper wire in the direction perpendicular to the substrate. The adhesion of the conductor layer was measured with a tensile tester (“SS15WD” manufactured by Seishin Shoji Co., Ltd.). The adhesion of the conductor layer to the substrate was measured before and after plating. The results are shown in Table 2.

  As can be seen from Table 2, in Comparative Examples 1 to 6 in which plating was performed without covering the conductor layer with a coating with a coating agent, the adhesion of the conductor layer to the substrate was low. On the other hand, in each of the examples in which plating was performed after the conductor layer was coated with a coating with a coating agent, the adhesion of the conductor layer to the substrate was good.

  Further, in Comparative Example 7 in which the conductor layer was not polished after coating with a coating with a coating agent, the plating was hardly deposited, and there was a glass layer on the surface of the conductor layer, so that tin-plated copper wire could be soldered. Therefore, the adhesion of the conductor layer could not be evaluated.

An example of embodiment of this invention is shown and (a) thru | or (d) is sectional drawing, respectively.

Explanation of symbols

1 Insulating substrate 2 Conductor layer 3 Coating 4 Plating film

Claims (7)

  A conductive layer is formed by applying and baking a conductive paste on the surface of a heat-resistant insulating substrate, and a coating agent capable of forming a chemical barrier film is applied to the conductive layer to provide a barrier property against chemicals used for plating. A method of manufacturing a conductor circuit board, comprising: forming a coating film on a surface of a conductor layer; next, removing the coating film at a predetermined portion to expose the conductor layer; and then plating the exposed conductor layer .   The method for manufacturing a conductor circuit board according to claim 1, wherein the conductive paste contains copper powder as the conductive powder.   The method for producing a conductive circuit board according to claim 1, wherein the conductive paste contains glass powder.   4. The coating agent according to claim 1, wherein the coating agent is one or more selected from silicone resins, epoxy resins, phenol resins, fluororesins, metal alkoxides or hydrolysates thereof, and silicon / nitrogen-containing compounds. The manufacturing method of the conductor circuit board of description.   The method for producing a conductor circuit board according to claim 4, wherein the coating agent is perhydropolysilazane.   6. The method for manufacturing a conductor circuit board according to claim 1, wherein the coating film at a predetermined portion of the conductor layer is removed by polishing.   7. The method of manufacturing a conductor circuit board according to claim 1, wherein a conductor circuit board used as at least one of the conductor circuit board and the element is manufactured.

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