JP2008091245A - Contact - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact allowing a conductive member like a shield case to be further easily arranged on a printed wiring board. <P>SOLUTION: This contact 1 is provided with solder joint parts 3 and 4, a contact part 5, a spring part 6, and projecting parts 7 and 8. When an end of a plate-like part provided for a shield case is introduced into a pace between the projecting part 7 and the projecting part 8, the projecting parts 7 and 8 are brought into a state preventing the plate-like part from displacing to a position departing from the contact part 5 in relation to the thickness direction of the plate-like part. Accordingly, contact of an end surface of the plate-like part to the contact part 5 can be surely kept even when force to displace the plate-like part in the thickness direction acts thereon unlike a contact using only a structure to bring the end surface of the plate-like part provided for the shield case 33 into contact with the contact part. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  According to the present invention, a conductive pattern and a conductive member included in a printed wiring board are electrically connected by being surface-mounted on the printed wiring board and sandwiched between the printed wiring board and a conductive member different from the printed wiring board. Related to the contact to be connected.

2. Description of the Related Art Conventionally, a technique for housing a surface-mounted component mounted on a printed wiring board in a shield case is known (for example, see Patent Document 1 below).
In the case of the technique described in Patent Document 1, the printed wiring board is provided with an engagement recess, while the shield case is provided with an engagement claw, and the engagement claw is inserted into the engagement recess, thereby removing the shield case. It was supposed to be attached to a printed wiring board.
JP 2001-148594 A

  However, when the structure as described in Patent Document 1 is adopted, the engagement claw cannot be inserted into the engagement recess unless the engagement recess and the engagement claw are positioned accurately. Therefore, there has been a problem that it is not easy to attach the shield case to the printed wiring board.

  In addition, the printed wiring board has to be provided with an engagement recess, so that the strength of the printed wiring board is reduced and cracks are easily generated, and the form of the conductor pattern that can be formed on the printed wiring board can be restricted. There was also a problem.

  The present invention has been made to solve the above problems, and an object of the present invention is to provide a contact that allows a conductive member such as a shield case to be disposed on a printed wiring board more easily. .

Hereinafter, the configuration employed in the present invention will be described.
The contact of the present invention is mounted on the surface to be attached to the printed wiring board, and is sandwiched between the printed wiring board and a conductive member different from the printed wiring board, so that the printed wiring board includes A contact for electrically connecting a conductor pattern and the conductive member, a solder joint portion soldered to the conductor pattern, and a contact point between the conductive member and the solder joint And a spring that presses the contact portion against the conductive member by elastically deforming the contact portion in contact with the conductive portion and the contact portion. And a plurality of projecting portions projecting in a direction away from the printed wiring board, and the plurality of projecting portions include a plate-like portion provided in the conductive member at the end surface of the plate-like portion. When the pressure contact is made, a number of the protruding portions are arranged on the front side of the plate-like portion, and the remaining some of the protruding portions are arranged on the back side of the plate-like portion. When the plate-like portion is displaced in the thickness direction of the plate-like portion, several of the projecting portions come into contact with the front side or the back side of the plate-like portion, so that the plate-like portion Is prevented from being displaced to a position deviating from the contact portion.

  According to the contact configured as described above, the surface of the contact is mounted on the surface to be mounted of the printed wiring board, and the end surface of the plate-like portion, which is a part of the conductive member, is brought into contact with the contact portion. The conductive pattern provided on the plate and the conductive member can be electrically connected.

  Therefore, for example, unlike the technique described in Patent Document 1, it is not necessary to insert the engaging claw of the conductive member into the engaging recess formed in the printed wiring board. The work of attaching to the wiring board becomes easy. Moreover, since it is not necessary to provide an engagement recessed part in a printed wiring board, the intensity | strength of a printed wiring board does not fall and it becomes difficult to restrict | limit the form of the conductor pattern which can be formed in a printed wiring board.

  Further, in the case of the present invention, the plurality of projecting portions prevent the plate-like portion from displacing in the thickness direction of the plate-like portion until the plate portion is disengaged from the contact portion. Therefore, unlike the case where only the structure in which the end face of the plate-like portion provided in the conductive member is simply brought into contact with the contact portion is employed, even if a force is applied to displace the plate-like portion in the thickness direction, Contact between the end face of the plate-like portion and the contact portion can be reliably maintained.

  Furthermore, in the case of the present invention, since the contact portion is disposed at a position surrounded by the plurality of protruding portions, the contact portion is protected by the plurality of protruding portions, and the operator can touch the contact portion with fingers or fingers. The possibility of catching the tool is reduced, and the contact portion can function as designed. Although there is a possibility that an operator may hook a finger or a tool on a plurality of projecting portions, the plurality of projecting portions have a high degree of design freedom as long as they do not have to have a function as a contact portion. . Therefore, for example, it is possible to make the structure stronger than the contact portion, and even if the operator hooks a finger or a tool, it is not as problematic as the contact portion. Further, even if the plurality of protruding portions are somewhat damaged, the function as a contact is not impaired, and in this respect as well, there is no problem as in the case where the contact portion is damaged.

  By the way, in the contact according to the present invention, the solder joint portion, the contact portion, the spring portion, and the protruding portion may be configured by bending a metal thin plate punched into a predetermined shape.

  Since the contact can be manufactured only from the metal thin plate, the contact manufacturing cost is higher than the contact configured using other materials in addition to the metal thin plate. Can be suppressed and an inexpensive contact can be provided.

  Further, when the contact of the present invention is formed by bending a metal thin plate punched into a predetermined shape as described above, for example, the following structure may be employed as an example of a specific structure.

  That is, when the printed wiring board is horizontally disposed and the mounting target surface is the upper surface of the printed wiring board, the solder joint is a horizontally disposed plate-like body. The lower surface side is solder-bonded to the conductor pattern, and the contact portion is a horizontally disposed plate-like body, disposed above the solder joint portion, and the upper surface side of the end face of the plate-like portion. The spring part is a plate-like body whose lower end side is continuous with the solder joint part and whose upper end side is continuous with the contact part, and the projecting part has an upper end from the contact part. Is a plate-like body bent into a form protruding upward, and the plate-like portion provided in the conductive member is made vertical so that the horizontal lower end surface of the plate-like portion is pressed against the horizontal upper surface of the contact portion. When some of the protrusions are on the plate It is arranged on the front side of the part, and the remaining several protruding portions are arranged on the back side of the plate-like part, and the plate-like part is displaced in the thickness direction of the plate-like part. In such a case, some of the projecting portions are in contact with the front side or the back side of the plate-like portion at portions protruding upward from the contact portion, so that the plate-like portion is removed from the contact portion. It is good that it is configured to prevent displacement up to.

  According to the contact configured as described above, since the solder joint portion, the contact portion, the spring portion, and the projecting portion are formed of a plate-like body, the solder joint portion, the contact portion, and the spring having the expected functions are provided. The contact provided with the portion and the projecting portion can be made of a metal thin plate only.

  Further, in the contact having the above structure, the solder joint portion has a shape having a notch at an end portion, and the spring portion extends from an end portion on one side of both sides sandwiching the notch. It is preferable that the solder joint is solder-bonded to the conductor pattern in the region on the other side.

  According to the contact configured as described above, when the solder joint is soldered to the conductor pattern in the region opposite to the portion where the spring portion is extended across the notch, the solder joint and the print are printed. Even if the molten solder flows toward the spring portion through a slight gap between the wiring board and the wiring board, the flow of the solder stops at the portion where there is a notch. Therefore, the base part of the spring part will not be soldered to the printed wiring board. Unlike the case where the solder flows into the base part of the spring part, the characteristics of the spring part are exhibited as designed. be able to.

  In the thickness direction of the plate-like portion, the contact according to the present invention is configured such that the direction approaching the front and back surfaces of the plate-like portion is the inside, and the direction away from the front and back surfaces of the plate-like portion is the outside. The positional relationship between the end portion and the inner end portion of the projecting portion is such that the outer end portion of the contact portion is outside the projecting portion, or the outer end portion of the contact portion and the projecting portion. By providing any one of the structures in which the interval between the inner end portions of the contact portion is smaller than the thickness of the plate-like portion, the plate-like portion is provided between the outer end portion of the contact portion and the inner end portion of the projecting portion. It is preferable that the structure does not drop off.

  According to the contact configured as described above, when the outer end portion of the contact portion has a structure outside the inner end portion of the protruding portion, the contact portion and the protruding portion are viewed from the introduction direction of the plate-like member. And the gap between the contact portion and the protruding portion does not exist when viewed from the direction of introduction of the plate-like member. Further, in the case of having a structure in which the distance between the outer end portion of the contact portion and the inner end portion of the projecting portion is smaller than the thickness of the plate-like portion, the contact portion and the projecting portion as viewed from the introduction direction of the plate-like member There is a gap between them, but the gap is smaller than the thickness of the plate-like portion.

  Therefore, in any case, the plate-like portion does not fall off between the outer end portion of the contact portion and the inner end portion of the protruding portion, and the end surface of the plate-like portion and the contact portion are more reliably brought into contact with each other. Will be able to.

  In the contact according to the present invention, the orientation of the plate-like portion is 90 around the axis extending in the vertical direction with reference to the position where the lower end surface of the plate-like portion can be pressed against the upper surface of the contact portion. Even when the orientation is rotated, the lower end surface of the plate-like portion can be pressed against the upper surface of the contact portion, and at that time, some of the protruding portions are on the front side of the plate-like portion. In order to prevent the plate-like portion from being displaced to a position where the plate-like portion is disengaged from the contact portion, with the remaining some of the protruding portions being arranged on the back side of the plate-like portion. It should be configured.

  According to the contact configured as described above, the direction of the plate-like portion can be rotated by 90 degrees, so that the contact and the plate-like portion can be selected in a relative positional relationship between the contact and the plate-like portion. The degree of freedom is increased with respect to the relative positional relationship with the plate-like portion. Also, the degree of freedom is increased with respect to the mounting direction when the contacts are soldered to the printed wiring board.

  In addition, when the configuration as described above is adopted, a form in which plate-like portions exist at both the position before rotating 90 degrees and the position after rotating 90 degrees (for example, a cross section perpendicular to the vertical direction) Can be brought into contact with the contact portion. The end face of the L-shaped, T-shaped, or + -shaped conductive member can be brought into contact with the contact portion. Therefore, not only can the direction of the plate-shaped part be rotated 90 degrees, but also, for example, a corner part of a conductive member having a L-shaped cross section perpendicular to the vertical direction can be contacted with the end face. Can be brought into contact with the part. Or a ribbed plate-like portion of a conductive member whose cross section perpendicular to the vertical direction is T-shaped, and a lattice portion of a conductive member whose cross-section perpendicular to the vertical direction is + -shaped. However, the end face can be brought into contact with the contact portion.

Next, embodiments of the present invention will be described with specific examples.
[First Embodiment]
FIG. 1 is a perspective view of a contact exemplified as an embodiment of the present invention. 2A is a plan view of the contact, FIG. 2B is a left side view of the contact, FIG. 2C is a front view of the contact, and FIG. 2D is a right side of the contact. The figure and the figure (e) are bottom views of the contact.

  The contact 1 is a component that is surface-mounted on the surface to be attached to the printed wiring board, and is sandwiched between the printed wiring board and a conductive member different from the printed wiring board, thereby providing a conductor pattern included in the printed wiring board. Are electrically connected to the conductive member.

The contact 1 includes solder joint portions 3 and 4, a contact portion 5, a spring portion 6, projecting portions 7 and 8, and the like.
The solder joint portions 3 and 4 are portions to be soldered to the conductor pattern.

  The contact portion 5 is a portion that becomes a contact point with the conductive member, and is electrically connected to the solder joint portion 3 via the spring portion 6. Further, the contact portion 5 is disposed in a gap between the protruding portion 7 and the protruding portion 8. Furthermore, the contact portion 5 also functions as a member that provides a suction surface for sucking with a suction nozzle of an automatic mounting machine.

The spring portion 6 is a portion that functions to press the contact portion 5 against the conductive member by being elastically deformed with the contact between the conductive member and the contact portion 5.
The projecting portions 7 and 8 are portions protruding in a direction away from the printed wiring board, and these projecting portions 7 and 8 have a gap through which the end of the plate-like portion provided in the conductive member can be introduced. It is provided free of charge.

  In this embodiment, the solder joint portions 3 and 4, the contact portion 5, the spring portion 6, and the protruding portions 7 and 8 are configured by bending a metal thin plate punched into a shape as shown in FIG. Has been.

  More specifically, the metal thin plate punched into the shape shown in FIG. 3 is valley-folded so that the angle on the paper surface side of FIG. 3 is 90 degrees at the bent portion B1, and the bent portion B2 of FIG. Fold it up so that the angle on the front side of the paper is 270 degrees. 3 is folded at a folding portion B3 so that the angle on the front side in FIG. 3 is 270 degrees, and is folded at a folding portion B4 so that the angle on the front side in FIG. 3 is 90 degrees. Further, the folded portion B5 is valley-folded so that the angle on the paper surface side in FIG. 3 is 155 degrees, and the folded portion B6 is valley-folded so that the angle on the paper surface side in FIG. 3 is 25 degrees. In addition, each bending part B1-B6 should just be bent with the appropriate curvature according to each bending angle.

When the metal thin plate is bent as described above, the contact 1 has a form as described below.
First, the projecting portions 7 and 8 are both a projecting-end-side plate-shaped portion 21 and a projecting-end-side plate-shaped portion that are arranged with a space between the mounting target surface when mounted on the surface of the printed wiring board. 21 has a first plate-like leg portion 23 that is bent from one end of the plate 21 and extends toward the attachment target surface, and a second plate-like leg portion 25 that is bent from the other end of the protruding-side plate-like portion 21 and extends toward the attachment target surface. It becomes a form.

  Further, the solder joint portions 3 and 4 are continuous with both the first plate-like leg portions 23 provided in the projecting portions 7 and 8, respectively, and are bent from both first plate-like leg portions 23 to be attached to the attachment target surface. It is continuous with both the first plate-like joint portion 11 extending in the direction along the second plate-like leg portion 25 provided in each of the projecting portions 7 and 8, and is bent from both second plate-like leg portions 25. It becomes the form which has the 2nd plate-shaped junction part 12 extended in the direction along the attachment object surface.

  Further, the spring portion 6 extends from the base portion at the end portion of the first plate-like joint portion 11 with the base portion being a portion between the first plate-like leg portions 23 and 23 provided in the projecting portions 7 and 8 respectively. Thus, the leaf spring extends in a direction that forms an acute angle (25 degrees in this embodiment) between the projecting portion 7 and the projecting portion 8 and the surface to be attached.

Further, the contact portion 5 is a plate-like body formed so that the tip of the spring portion 6 is folded back and arranged parallel to the attachment target surface.
In addition, the stopper part 27 is provided between the 2nd plate-shaped leg parts 25 and 25 with which each protrusion part 7 and 8 is provided. When the end of the plate-like portion provided in the conductive member is introduced between the protruding portion 7 and the protruding portion 8, the stopper portion 27 is caused by excessively strong force acting on the spring portion 6. The spring portion 6 functions as a spacer for preventing plastic deformation. Further, compared to the case where only the second plate-like leg portions 25, 25 having a relatively narrow width are provided alone, the rigidity of the second plate-like leg portions 25, 25 is improved by providing the stopper portion 27, which is excessive. When an external force is applied, it is possible to prevent the second plate leg portions 25, 25 from buckling at the bent portion B4.

  By the way, in this embodiment, the 1st plate-shaped junction part 11 has the form which has the notches 28 and 28 between the 1st plate-shaped leg part 23 with which each of the protrusion parts 7 and 8 are provided, and the base part of the spring part 6. Has been. By providing such notches 28, 28, when the first plate-like joint portion 11 is soldered to the conductor pattern at a location opposite to the base of the spring portion 6 with the notches 28, 28 sandwiched therebetween, It can be set as the structure which suppresses that the melted solder flows into the base side of the spring part 6 by the notches 28 and 28.

  That is, when the first plate-like joint portion 11 is soldered on both sides sandwiching the vicinity of the base portion of the spring portion 6 in order to prevent the vicinity of the base portion of the spring portion 6 from being soldered to deteriorate the characteristics of the spring portion 6. If the cutouts 28 and 28 are not provided, the molten solder may flow straight into the vicinity of the base portion of the spring portion 6 through a position corresponding to the cutouts 28 and 28.

  On the other hand, when the notches 28 and 28 are provided, the molten solder does not flow into the position where the notches 28 and 28 exist, but only around the base of the spring portion 6 in the form of wrapping around the notches 28 and 28. Since it cannot flow, solder becomes difficult to flow near the base of the spring portion 6. Therefore, by providing such notches 28, 28, it is possible to avoid the vicinity of the base portion of the spring portion 6 from being soldered and to prevent the characteristics of the spring portion 6 from being deteriorated.

  For example, as illustrated in FIG. 4, the contact 1 configured as described above is mounted on the surface to be attached to the printed wiring board 31 when the shield case 33 is fixed on the printed wiring board 31 with the screws 35. The conductive pattern provided in the printed wiring board 31 and the shield case 33 are electrically connected by being sandwiched between the printed wiring board 31 and the shield case 33 (= conductive member different from the printed wiring board). To do.

  More specifically, the shield case 33 is formed in a plate shape at the contact portion with the contact 1, and the projecting portions 7 and 8 are on the front and back sides of the plate portion. In the direction as shown in FIG. 5, when introduced into the gap between the protruding portion 7 and the protruding portion 8, the contact portion 5 comes into pressure contact with the end face of the plate-like portion as shown in FIG. Thereby, the conductor pattern with which the printed wiring board 31 is provided, and the shield case 33 are electrically connected. In the present embodiment, the conductor pattern included in the printed wiring board 31 is a portion having a ground potential, and thus the shield case 33 also has a ground potential.

  Further, when the end of the plate-like portion provided in the shield case 33 is introduced into the gap between the protruding portion 7 and the protruding portion 8, the protruding portions 7 and 8 are arranged in the thickness direction of the plate-like portion. In this state, the plate-like portion is prevented from being displaced to a position where it is disengaged from the contact portion 5. Therefore, unlike a contact that employs only a structure in which the end surface of the plate-like portion provided in the shield case 33 is simply brought into contact with the contact portion, even if a force is applied to displace the plate-like portion in the thickness direction, The contact between the end face of the shaped portion and the contact portion 5 can be reliably maintained.

  Furthermore, in the present embodiment, the positional relationship between the outer end of the contact portion 5 and the inner end of the projecting portions 7 and 8 in the thickness direction of the plate-like portion is such that the outer end of the contact portion 5 protrudes. A structure that is located outside the inner ends of the installation portions 7 and 8 is employed. More specifically, as shown in FIG. 3, the width W1 between the inner ends of the projecting portions 7 and 8 and the width W2 between the outer ends of the contact portion 5 are the outer end portions of the contact portion 5. The width W2 between them is larger.

  When such a structure is adopted, no matter how thin the plate-like portion provided in the shield case 33 is, the gap between the inner end of the protruding portion 7 or the protruding portion 8 and the outer end of the contact portion 5 is not limited. Does not have a gap that would cause the plate-like portion to fall off. Therefore, even if the end of the plate-like portion provided in the shield case 33 is displaced within the width W1 between the inner ends of the projecting portions 7 and 8, the contact between the end surface of the plate-like portion and the contact portion 5 is ensured. Can be maintained.

  As described above, according to the contact 1, the contact is surface-mounted on the mounting target surface of the printed wiring board 31, and the end surface of the plate-like portion that is a part of the shield case 33 is brought into contact with the contact portion 5. The conductor pattern provided in the printed wiring board 31 and the shield case 33 can be electrically connected.

  Therefore, for example, unlike the technique described in Patent Document 1, it is not necessary to insert the engaging claw of the shield case into the engaging recess formed in the printed wiring board. The work of attaching to the plate 31 is facilitated.

  Further, in the case of the contact 1, the projecting portions 7 and 8 are in a state in which the plate-like portion is prevented from being displaced to a position where it is disengaged from the contact portion 5 in the thickness direction of the plate-like portion. It is possible to reliably maintain the contact between the end surface of the contact point and the contact portion 5.

  Furthermore, in the case of the contact 1, since the contact portion 5 is disposed in the gap between the protruding portion 7 and the protruding portion 8, the contact portion 5 is protected by the protruding portions 7 and 8, and The possibility that a person will hook a finger or a tool on the contact portion 5 is reduced, and the contact portion 5 can function as designed.

  In addition, since the contact 1 is formed by punching a metal thin plate and bending it, the manufacturing cost of the contact 1 can be suppressed compared to a structure using other materials in addition to the metal thin plate, Inexpensive contacts can be provided.

  Further, since the shield case 33 can be held at a position slightly separated from the printed wiring board 31 via the contact 1, the corners of the shield case 33 do not directly contact the printed wiring board 31, and printing is performed at the corners of the shield case 33. It becomes difficult to damage the wiring board 31.

  Further, since the contact portion 5 is provided at the tip of the spring portion 6 and is in contact with the shield case 33, the printed wiring board 31 and the shield case are different from those which are soldered to the shield case. When 33 vibrates, the contact portion 5 can move slightly relative to the shield case 33. Therefore, with this relative movement, the contact portion 5 and the contact end surface on the shield case 33 side are rubbed against each other, and an oxide film is hardly formed. Accordingly, contact failure due to the oxide film is unlikely to occur.

[Second Embodiment]
FIG. 6 is a perspective view of a contact exemplified as an embodiment of the present invention. 7A is a plan view of the contact, FIG. 7B is a left side view of the contact, FIG. 7C is a front view of the contact, and FIG. 7D is a right side of the contact. The figure and the figure (e) are bottom views of the contact.

  As in the first embodiment, the contact 51 is a component that is surface-mounted on the surface to be attached to the printed wiring board, and is printed between the printed wiring board and another conductive member. The conductor pattern provided in the wiring board and the conductive member are electrically connected.

  The contact 51 includes solder joint portions 53 and 54, a contact portion 55, a spring portion 56, projecting portions 57 and 58, and the like. Since the functions of these units are the same as those in the first embodiment, a detailed description thereof will be omitted (see the first embodiment if necessary).

  In addition, as a configuration different from the first embodiment, the contact 51 includes support pieces 61 and 62. The support pieces 61 and 62 are likely to be crushed or to be overturned by an external force acting on the projecting portion 57 and the projecting portion 58, for example. In such a case, the projecting portion 57 and the projecting portion 58 are prevented from being greatly deformed by contacting the printed wiring board at the end portion on the printed wiring board side (the lower end portion in FIG. 6). Playing a role.

  The contact 51 configured as described above has the same operation and effect as the contact 1 described in the first embodiment, and the support pieces 61 and 62 deform the projecting portion 57 and the projecting portion 58. Can also be prevented.

[Third Embodiment]
FIG. 8 is a perspective view of a contact exemplified as an embodiment of the present invention. 9A is a plan view of the contact, FIG. 9B is a left side view of the contact, FIG. 9C is a front view of the contact, and FIG. 9D is a right side of the contact. The figure and the figure (e) are bottom views of the contact.

  As in the first and second embodiments, the contact 71 is a component that is surface-mounted on the surface to be attached to the printed wiring board, and is sandwiched between the printed wiring board and another conductive member. Thus, the conductive pattern provided on the printed wiring board and the conductive member are electrically connected.

  The contact 71 includes solder joint portions 73 and 74, a contact portion 75, a spring portion 76, projecting portions 77 and 78, and the like. Since the functions of these units are the same as those in the first and second embodiments, a detailed description thereof will be omitted (see the first embodiment if necessary).

  However, unlike the first embodiment, in the contact 71, the solder joint portions 73 and 74, the contact portion 75, and the spring portion 76 are constituted by metal parts, while the projecting portions 77 and 78 are plastic parts. It is constituted by.

  The projecting portions 77 and 78 are integrally formed with the frame 79 by various engineering plastics having heat resistance that can withstand heating during surface mounting, for example. At the time of molding the projecting portions 77 and 78 and the frame 79, metal parts to be the solder joint portions 73 and 74, the contact portion 75, and the spring portion 76 are installed in the mold, and for example, a molding method such as outsert molding or the like. It is integrated by.

The contact 71 configured in this manner also exhibits the same operations and effects as the contact 1 described in the first embodiment.
[Fourth Embodiment]
FIG. 10 is a perspective view of a contact exemplified as an embodiment of the present invention. 11A is a plan view of the contact, FIG. 11B is a left side view of the contact, FIG. 11C is a front view of the contact, and FIG. 11D is a right side of the contact. The figure and the figure (e) are bottom views of the contact.

  This contact 81 is also a component that is surface-mounted on the surface to be mounted of the printed wiring board, as in the above embodiments, and is printed between the printed wiring board and the conductive member different from the printed wiring board. The conductor pattern provided in the wiring board and the conductive member are electrically connected.

  The contact 81 includes solder joint portions 83 and 84, a contact portion 85, a spring portion 86, and the like. Since the functions of these units are the same as those in the first embodiment, a detailed description thereof will be omitted (see the first embodiment if necessary).

  Further, as a configuration different from the first embodiment, the contact 81 includes four projecting portions 91, 92, 93, 94, between the projecting portion 91 and the projecting portion 93, and projecting. Solder joint portions 95 and 96 are also provided between the portion 92 and the protruding portion 94.

The contact 81 configured in this way also exhibits the same operations and effects as the contact 1 described in the first embodiment.
In addition to the solder joint portions 83 and 84 equivalent to the solder joint portions 3 and 4 included in the contact 1 described in the first embodiment, the solder joint portions 95 and 96 are also provided. Can be made higher than that of the contact 1 described in the first embodiment.

  Further, the contact 81 is provided with projecting portions 91 and 93 on the front side of the plate-like portion with the orientation of the plate-like member when the end surface of the plate-like portion provided in the conductive member is brought into contact with the contact portion 85. The projecting portions 92 and 94 can be arranged in the first direction on the back side of the plate-like portion, and the projecting portions 91 and 92 are provided on the front side of the plate-like portion. It is also possible to make the second orientation such that the projecting portions 93 and 94 are disposed on the back side of the.

  That is, even if the contact 81 has the second direction rotated by 90 degrees with respect to the first direction in which the end face of the plate-like portion can be pressed against the contact portion 85, The end surface of the plate-like portion can be brought into pressure contact with the contact portion 85.

  Therefore, in the case of each contact shown in the first to third embodiments, only one type of relative positional relationship between the contact and the plate-like portion provided in the conductive member can be selected. If so, two relative positional relationships between the contact 81 and the plate-like portion provided in the conductive member can be selected, and the relative positional relationship between the contact 81 and the plate-like portion increases. . Also, the degree of freedom is increased with respect to the mounting direction when the contact 81 is soldered to the printed wiring board.

  Moreover, by adopting the structure like the contact 81, a form in which plate-like portions exist at both the position before rotating 90 degrees and the position after rotating 90 degrees (for example, vertically) The end face of the conductive member having a vertical cross section of L-shape, T-shape, or + -shape) can be brought into contact with the contact portion. Therefore, the corner portion of the conductive member whose cross section perpendicular to the vertical direction is L-shaped, the plate-like portion of the conductive member whose cross section perpendicular to the vertical direction is T-shaped, and the vertical direction Even if it is a lattice portion of a conductive member whose vertical cross section is a + character shape, its end face can be brought into contact with the contact portion 85.

  In the present embodiment, the projecting portions 91 and 92 are arranged on the front side of the plate-like portion, and the projecting portions 93 and 94 are arranged on the back side of the plate-like portion. In the second orientation, the projecting portions 91 and 93 are disposed on the front side of the plate-shaped portion, and the projecting portions 92 and 94 are disposed on the back side of the plate-shaped portion. Compared with the case where it does, overlap with the protrusion parts 91-94 and the contact part 85 becomes large about the thickness direction of a plate-shaped part. Therefore, the effect of preventing the plate-like portion from falling off from the contact portion 85 becomes higher when the second direction is set.

[Fifth Embodiment]
FIG. 12 is a perspective view of a contact exemplified as an embodiment of the present invention. 13A is a plan view of the contact, FIG. 13B is a left side view of the contact, FIG. 13C is a front view of the contact, and FIG. 13D is a right side of the contact. The figure and the figure (e) are bottom views of the contact.

  This contact 101 is also a component that is surface-mounted on the surface to be mounted of the printed wiring board, as in the above embodiments, and is printed by being sandwiched between the printed wiring board and another conductive member. The conductor pattern provided in the wiring board and the conductive member are electrically connected.

  The contact 101 includes solder joint portions 102, 103, 104, a contact portion 105, a spring portion 106, projecting portions 107, 108, and the like. Since the functions of these units are the same as those in the first embodiment, a detailed description thereof will be omitted (see the first embodiment if necessary).

  Further, as a configuration different from the first embodiment, the contact 101 has a direction in which a gap between the projecting portions 107 and 108 extends and a direction in which the spring portion 106 extends intersects each other. Yes. By adopting such a structure, the protruding portions 107 and 108 are made thicker than the embodiments described above, and the mechanical strength of the protruding portions 107 and 108 is improved.

  In addition, solder joints 111 and 112 are provided between the projecting portions 107 and 108, so that the joint strength to the printed wiring board can be made higher than that of the contact 1 described in the first embodiment. it can.

  Further, stopper portions 113 and 114 are provided on the upper surface side of the solder joint portions 111 and 112. The stopper portions 113 and 114 play the same role as the stopper portion 27 shown in the first embodiment, but in the first embodiment, the stopper portion 27 is provided only on one side with respect to the spring portion 6. On the other hand, in the fifth embodiment, stopper portions 113 and 114 are provided on both sides of the spring portion 106. Therefore, the effect of preventing the spring portion 106 from being plastically deformed can be enhanced.

  Also in the present embodiment, the overlap between the projecting portions 107 and 108 and the contact portion 105 can be made larger than that in the first embodiment in the thickness direction of the plate-like portion. Therefore, the effect of preventing the plate-like portion from falling off from the contact portion 105 can be made higher than that of the first embodiment.

[Sixth Embodiment]
FIG. 14 is a perspective view of a contact exemplified as an embodiment of the present invention. 15A is a plan view of the contact, FIG. 15B is a left side view of the contact, FIG. 15C is a front view of the contact, and FIG. 15D is a right side of the contact. The figure and the figure (e) are bottom views of the contact.

  This contact 121 is also a component that is surface-mounted on the surface to be mounted of the printed wiring board, as in the above embodiments, and is printed by being sandwiched between the printed wiring board and another conductive member. The conductor pattern provided in the wiring board and the conductive member are electrically connected.

  The contact 121 includes solder joint portions 123 and 124, a contact portion 125, a spring portion 126, and the like. Since the functions of these units are the same as those in the first embodiment, a detailed description thereof will be omitted (see the first embodiment if necessary).

  Further, as a configuration different from the first embodiment, the contact 121 includes four projecting portions 131, 132, 133, and 134, between the projecting portion 131 and the projecting portion 133, and in a projecting manner. Solder joint portions 135 and 136 are also provided between the portion 132 and the protruding portion 134.

The contact 121 configured in this way also exhibits the same operations and effects as the contact 1 described in the first embodiment.
In addition to the solder joints 123 and 124 equivalent to the solder joints 3 and 4 included in the contact 1 described in the first embodiment, the solder joints 135 and 136 are also provided. Can be made higher than that of the contact 1 described in the first embodiment. The structure including the solder joints 135 and 136 is substantially the same as that of the fourth embodiment, but the joint area between the solder joints 135 and 136 and the printed wiring board is larger in the sixth embodiment. Therefore, the bonding strength with respect to the printed wiring board can be made higher than that of the fourth embodiment.

  Further, in the same manner as in the fourth embodiment, when the contact 121 is brought into contact with the contact portion 125 at the end surface of the plate-like portion provided in the conductive member, the direction of the plate-like member is set to the protruding portion 131 on the front side of the plate-like portion. 133, and the projecting portions 132 and 134 are arranged on the back side of the plate-like portion, and the projecting portions 131 and 132 are arranged on the front side of the plate-like portion. It can also be made the 2nd direction which is provided and the protrusion parts 133 and 134 are arrange | positioned by the back side of a plate-shaped part.

  That is, even when the contact 121 has the second direction rotated by 90 degrees with respect to the first direction in which the end face of the plate-like part can be brought into pressure contact with the contact portion 125. The end face of the plate-like portion can be brought into pressure contact with the contact portion 125.

  Therefore, in the case of each contact shown in the first to third embodiments and the fifth embodiment, only one relative positional relationship between the contact and the plate-like portion included in the conductive member can be selected. In the case of the contact 121 of the embodiment, as in the fourth embodiment, two relative positional relationships between the contact 121 and the plate-like portion included in the conductive member can be selected, and the contact 121 and the plate-like portion can be selected. The degree of freedom is increased with respect to the relative positional relationship. Also, the degree of freedom is increased with respect to the mounting direction when the contact 121 is soldered to the printed wiring board.

  In addition, by adopting the structure like the contact 121, a form in which plate-like portions exist at both the position before rotating 90 degrees and the position after rotating 90 degrees (for example, vertically) The end face of the conductive member having a vertical cross section of L-shape, T-shape, or + -shape) can be brought into contact with the contact portion. Therefore, the corner portion of the conductive member whose cross section perpendicular to the vertical direction is L-shaped, the plate-like portion of the conductive member whose cross section perpendicular to the vertical direction is T-shaped, and the vertical direction Even if it is a lattice portion of a conductive member whose vertical cross section is a + character shape, its end face can be brought into contact with the contact portion 125.

  In the present embodiment, the projecting portions 131 and 132 are disposed on the front side of the plate-shaped portion, and the projecting portions 133 and 134 are disposed on the back side of the plate-shaped portion. In such a second orientation, the projecting portions 131 and 133 are disposed on the front side of the plate-shaped portion, and the projecting portions 132 and 134 are disposed on the back side of the plate-shaped portion. Compared with the case where it overlaps, the overlap with the protrusion parts 131-134 and the contact part 125 becomes large about the thickness direction of a plate-shaped part. Therefore, the effect of preventing the plate-like portion from falling off from the contact portion 125 is higher in the second orientation.

[Other Embodiments]
As mentioned above, although embodiment of this invention was described, this invention is not limited to said specific one Embodiment, In addition, it can implement with a various form.

  For example, in the first embodiment, as shown in FIG. 3, the width W1 between the inner end portions of the projecting portions 7 and 8 and the width W2 between the outer end portions of the contact portion 5 The width W2 between the outer end portions is larger, but even if other configurations are adopted, a plate shape is formed between the outer end portion of the contact portion 5 and the inner end portions of the projecting portions 7 and 8. A structure in which the portion does not fall off can be configured.

  Specifically, even if a gap is formed between the outer end portion of the contact portion 5 and the inner end portions of the projecting portions 7 and 8, the interval is made smaller than the thickness of the plate-like portion. In this case, the plate-like portion does not fall off between the outer end portion of the contact portion 5 and the inner end portions of the projecting portions 7 and 8. Therefore, you may employ | adopt such a structure.

  Moreover, in the said 1st Embodiment, although the shield case was shown as an example of an electroconductive member, the specific form of an electroconductive member is not limited at all, and it has a plate-shaped part used as a contact location with a contact. Any conductive member may be used as long as it is a conductive member.

The perspective view of the contact illustrated as 1st Embodiment of this invention. (A) is a plan view of the contact, (b) is a left side view of the contact, (c) is a front view of the contact, (d) is a right side view of the contact, and (e) is a bottom view of the contact. Figure. The development before bending of the contact. The perspective view which shows the state which pinched | interposed the contact between the printed wiring board and the shield case. Explanatory drawing which shows the contact-like body of the contact part with which the contact is provided, and the plate-shaped part with which a shield case is provided. The perspective view of the contact illustrated as 2nd Embodiment of this invention. (A) is a plan view of the contact, (b) is a left side view of the contact, (c) is a front view of the contact, (d) is a right side view of the contact, and (e) is a bottom view of the contact. Figure. The perspective view of the contact illustrated as 3rd Embodiment of this invention. (A) is a plan view of the contact, (b) is a left side view of the contact, (c) is a front view of the contact, (d) is a right side view of the contact, and (e) is a bottom view of the contact. Figure. The perspective view of the contact illustrated as 4th Embodiment of this invention. (A) is a plan view of the contact, (b) is a left side view of the contact, (c) is a front view of the contact, (d) is a right side view of the contact, and (e) is a bottom view of the contact. Figure. The perspective view of the contact illustrated as 5th Embodiment of this invention. (A) is a plan view of the contact, (b) is a left side view of the contact, (c) is a front view of the contact, (d) is a right side view of the contact, and (e) is a bottom view of the contact. Figure. The perspective view of the contact illustrated as 6th Embodiment of this invention. (A) is a plan view of the contact, (b) is a left side view of the contact, (c) is a front view of the contact, (d) is a right side view of the contact, and (e) is a bottom view of the contact. Figure.

Explanation of symbols

  1, 51, 71, 81, 101, 121... Contact, 3, 4, 53, 54, 73, 74, 83, 84, 95, 96, 102, 103, 104, 111, 112, 123, 124, 135, 136... Joint, 5, 55, 75, 85, 105, 125... Contact, 6, 56, 76, 86, 106, 126... Spring, 7, 8, 57, 58 , 77, 78, 91, 92, 93, 94, 107, 108, 131, 132, 133, 134... Projecting portion, 11... First plate joint, 12. Joining part, 21 ... projecting side plate-like part, 23 ... first plate-like leg part, 25 ... second plate-like leg part, 27, 113, 114 ... stopper part, 28 ... notch 31 ... Printed wiring board, 33 ... Shield case, 61, 62 ... Supporting piece, 9 ... frame.

Claims (6)

A conductive pattern provided on the printed wiring board and the conductive surface is mounted on a surface to be attached to the printed wiring board and sandwiched between the printed wiring board and a conductive member different from the printed wiring board. A contact for electrically connecting a member,
A solder joint that is soldered to the conductor pattern;
A portion that becomes a contact point with the conductive member, and a contact portion that is electrically connected to the solder joint, and
A spring portion that presses the contact portion against the conductive member by elastically deforming with the contact between the conductive member and the contact portion;
A plurality of projecting portions projecting away from the printed wiring board,
When the plate-like portion provided in the conductive member is brought into pressure contact with the contact portion at the end face of the plate-like portion, several of the protrusions are arranged on the front side of the plate-like portion. It is arranged, and the remaining some of the protruding portions are arranged on the back side of the plate-like portion,
When the plate-like portion is displaced in the thickness direction of the plate-like portion, some of the projecting portions abut on the front side or the back side of the plate-like portion, so that the plate-like portion is the contact point. A contact characterized by preventing displacement to a position that deviates from the part. The solder joint portion, the contact portion, the spring portion, and the protruding portion are:
It is configured by bending a thin metal plate punched into a predetermined shape.
The contact according to claim 1. Based on the vertical direction when the printed wiring board is disposed horizontally and the mounting target surface is the upper surface of the printed wiring board,
The solder joint is a plate-like body arranged horizontally, and is solder-joined to the conductor pattern on the lower surface side,
The contact portion is a horizontally disposed plate-shaped body, disposed above the solder joint portion, and is in a form of contacting the end surface of the plate-shaped portion on the upper surface side,
The spring portion is a plate-like body whose lower end side is continuous with the solder joint portion and whose upper end side is continuous with the contact portion,
The protruding portion is a plate-like body whose upper end is bent so as to protrude upward from the contact portion, and a horizontal lower end surface of the plate-like portion with the plate-like portion provided in the conductive member being vertical. Are pressed against the horizontal upper surface of the contact portion, and some of the protruding portions are arranged on the front side of the plate-like portion, and the remaining some of the protruding portions of the plate-like portion are It is supposed to be arranged on the back side,
When the plate-like portion is displaced in the thickness direction of the plate-like portion, some of the protruding portions are portions that protrude upward from the contact portion and contact the front side or the back side of the plate-like portion. 3. The contact according to claim 2, wherein the contact prevents the plate-like portion from being displaced to a position where the plate-like portion is disengaged from the contact portion. The solder joint portion has a shape having a notch at an end,
A structure in which the spring portion is extended from an end portion on one side of both sides of the notch, and the solder joint portion is soldered to the conductor pattern in a region on the other side; The contact according to claim 3, wherein the contact is made. With respect to the thickness direction of the plate-like portion, the direction approaching the front and back surfaces of the plate-like portion is the inside, and the direction away from the front and back surfaces of the plate-like portion is the outside, and the outer end portion of the contact portion and the protruding portion The positional relationship with the inner end portion is such that the outer end portion of the contact portion is outside the projecting portion, or the distance between the outer end portion of the contact portion and the inner end portion of the projecting portion is By providing one of the structures made smaller than the thickness of the plate-like portion, the plate-like portion does not fall off between the outer end portion of the contact portion and the inner end portion of the protruding portion. The contact according to claim 3 or 4, characterized by the above-mentioned. When the orientation of the plate-like portion is rotated 90 degrees around the axis extending in the vertical direction with reference to the position where the lower end surface of the plate-like portion can be pressed against the upper surface of the contact portion However, the structure is such that the lower end surface of the plate-like portion can be pressed against the upper surface of the contact portion. At this time, some of the protruding portions are arranged on the front side of the plate-like portion, and the remaining number of The protruding portion is in a state of being disposed on the back side of the plate-like portion, and the plate-like portion is prevented from being displaced to a position where it is disengaged from the contact portion. Item 6. The contact according to any one of Item 5.

Images