JP2008082792A - Inspection apparatus and inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection device in which only a part to be inspected of a glass substrate on a mount is controlled in a short time so as to be at a prescribed temperature. <P>SOLUTION: The detection apparatus 10 includes the mount 11 mounting the glass substrate 50, a plurality of probes 12A electrically brought into contact with the glass substrate 50 on the mount 11, and a temperature controller 13 controlling the temperature of a TFT cell 51 of the glass substrate 50, wherein the electric characteristic of the glass substrate 50 is inspected while controlling the temperature of the part to be inspected (a part of the TFT cell 51 where the plurality of probes 12A are brought into contact therewith) by the temperature controller 13. The temperature controller 13 includes a heat medium 131 directly brought into contact with an upper surface of the part to be inspected without any gap, and controls the temperature of the part to be inspected via the heat medium 131. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention provides, for example, an inspection apparatus and an inspection method used for electrical inspection of a thin film transistor array (hereinafter referred to as “TFT array”) formed on a glass substrate for a flat panel display (hereinafter referred to as “FPD”). It is about.

  FPD panels are widely used as display devices such as mobile phones and digital cameras. In recent years, the panel size has become larger and larger depending on the application. A manufacturing process of the FPD panel includes a process of inspecting a TFT array formed on an FPD glass substrate (hereinafter simply referred to as “glass substrate”). The TFT array is configured by arranging a plurality of TFT cells vertically and horizontally on the upper surface of a glass substrate. In the TFT cell, peripheral circuits such as a TFT driving circuit are formed together with the TFT together with the TFT. Therefore, in the inspection of the TFT array, a glass substrate is mounted on the mounting table, a plurality of probes are electrically contacted with the glass substrate on the mounting table, and an inspection signal is applied, so that the TFT of each TFT cell Inspect peripheral circuits.

  In order to guarantee the temperature characteristics of the peripheral circuit of the TFT cell, a so-called reliability test is performed in which the temperature is changed from the low temperature region to the high temperature region at the stage of the TFT array, and the electrical characteristics of the peripheral circuit are measured in the high and low temperature region. There is a need to do it. When performing a reliability test, the temperature of the glass substrate is controlled via the mounting table by controlling the temperature of the mounting table with a temperature control device.

  However, in the conventional inspection method, when the temperature of the entire surface of the glass substrate is controlled via the mounting table, the thermal conductivity of the glass substrate is small, so the heat conduction speed from the mounting table to the upper surface of the glass substrate where the peripheral circuits are unevenly distributed is slow, Moreover, since the mounting table and the glass substrate are both solid and cannot be closely adhered to each other, the rate of heat conduction from the mounting table to the glass substrate becomes increasingly slow until the upper surface of the glass substrate reaches a predetermined inspection temperature. It takes a long time.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide an inspection apparatus and an inspection method that can control only an inspection portion of a glass substrate on a mounting table to a predetermined temperature in a short time. It is said.

  An inspection apparatus according to claim 1 of the present invention includes a mounting table on which an object to be inspected is mounted, a plurality of probes that are in electrical contact with the object to be inspected on the mounting table, and an inspection portion of the object to be inspected. A temperature control device that controls the temperature of the inspection object while controlling the temperature of the inspection portion by the temperature control device, wherein the temperature control device includes the inspection device. It has a heat medium that is in direct contact with the upper surface of the part without any gap, and the temperature of the inspection part is controlled via the heat medium.

  According to a second aspect of the present invention, there is provided the inspection device according to the first aspect, wherein the temperature control device includes a temperature-adjustable temperature adjusting body, and between the temperature adjusting body and the inspection portion. And a supply / discharge means for supplying and discharging the heat medium so as to form a layer of the heat medium.

  The inspection apparatus according to claim 3 of the present invention is the inspection apparatus according to claim 2, wherein the supply / discharge means is formed in the temperature adjustment body so as to open at the lower surface of the temperature adjustment body. A heat medium supply / discharge channel, a container for storing the heat medium, a circulation path connecting the container and the supply / discharge channel, and the circulation path are provided to circulate the heat medium. And a pump.

  An inspection apparatus according to claim 4 of the present invention is the inspection apparatus according to claim 3, wherein a flow rate adjusting mechanism is provided in the circulation path.

  According to a fifth aspect of the present invention, there is provided the inspection apparatus according to the third or fourth aspect, wherein the heat medium discharge portion is provided on the outer peripheral edge portion of the mounting table, and the discharge portion is provided with the heat medium discharge portion. The heat medium is collected in a container.

  An inspection apparatus according to a sixth aspect of the present invention is the inspection apparatus according to any one of the second to fifth aspects, further comprising means for supplying gas along the outer peripheral surface of the temperature adjusting body. It is characterized by that.

  An inspection apparatus according to a seventh aspect of the present invention is the inspection apparatus according to the first aspect, wherein the heat medium is formed as a sheet having high flexibility.

  An inspection apparatus according to an eighth aspect of the present invention is the inspection apparatus according to the seventh aspect, wherein a Peltier element is arranged on the flexible sheet.

  An inspection apparatus according to claim 9 of the present invention is the inspection apparatus according to any one of claims 1 to 8, wherein the object to be inspected is a glass substrate for a flat display. Is.

  In the inspection method according to claim 10 of the present invention, the inspection portion of the object to be inspected placed on the mounting table and the plurality of probes are brought into electrical contact, and the temperature of the inspection portion is controlled. An inspection method for inspecting electrical characteristics of the inspection portion, wherein the temperature of the inspection portion is controlled through a heat medium that is in direct contact with the upper surface of the inspection portion without a gap.

  An inspection method according to an eleventh aspect of the present invention is the method according to the tenth aspect, wherein a temperature adjusting body for controlling the temperature of the inspection portion is disposed on the upper surface side of the inspection portion, And a step of supplying and discharging the heat medium between the inspection portion and the temperature adjusting body.

  According to a twelfth aspect of the present invention, in the invention according to the eleventh aspect, in the heat medium supply / discharge step, the heat medium is supplied from the supply / discharge flow path provided in the temperature adjusting body. The medium is supplied and discharged.

  According to a thirteenth aspect of the present invention, there is provided the inspection method according to any one of the tenth to twelfth aspects, wherein the heat medium is a discharge portion formed on the outer peripheral edge of the mounting table. It is characterized by having the process discharged | emitted from.

  An inspection method according to claim 14 of the present invention is characterized in that, in the invention according to claim 10, a sheet having high flexibility is used as the heat medium.

  According to a fifteenth aspect of the present invention, the inspection method according to the fifteenth aspect is characterized in that the temperature of the flexible sheet is controlled using a Peltier element.

  ADVANTAGE OF THE INVENTION According to this invention, the inspection apparatus and inspection method which can control only the test | inspection part of the glass substrate on a mounting base to predetermined | prescribed temperature in a short time can be provided.

  Hereinafter, the present invention will be described based on the embodiment shown in FIGS. 1 is a block diagram showing the main part of an embodiment of the inspection apparatus of the present invention, FIG. 2 is a plan view of the mounting table of the inspection apparatus shown in FIG. 1, and FIG. 3 is another embodiment of the inspection apparatus of the present invention. It is a block diagram which shows the principal part of a form.

First Embodiment An inspection apparatus 10 according to the present embodiment, for example, as shown in FIG. 11, a probe card 12 having a plurality of probes 12A that are in electrical contact with the glass substrate 50 mounted on the mounting table 11, and a temperature control device 13 that controls the temperature of the inspection portion of the glass substrate 50. The temperature control device 13 is configured to inspect the electrical characteristics of the glass substrate 50 while controlling the inspection portion at a predetermined inspection temperature. A plurality of TFT cells 51 are arranged vertically and horizontally on a substantially entire upper surface of the glass substrate 50 to form a TFT array. At the time of inspection, for example, the plurality of probes 12A and the individual TFT cells 51 are sequentially brought into electrical contact to perform array inspection. Here, the inspection portion is a portion where a plurality of probes 12A are in electrical contact, and in this embodiment, one TFT cell 51 corresponds to the inspection portion.

  The mounting table 11 is provided in a probe chamber (not shown) so as to be movable in the X, Y, and Z directions, and the probe card 12 is disposed above the mounting table 11 and fixed to the upper surface of the probe chamber. An alignment mechanism (not shown) for aligning the glass substrate 50 on the mounting table 11 and the probe is provided in the probe chamber, and the positioning mechanism is moved while the mounting table 11 moves in the X, Y, and Z directions. The glass substrate 50 and the probe 12A are aligned with each other. After this alignment, the TFT array on the glass substrate 50 is inspected.

  Thus, the temperature control device 13 is configured to control the temperature of the glass substrate 50 from the upper surface. Since the peripheral circuit of the TFT cell 51 is unevenly distributed on the surface layer portion of the upper surface of the glass substrate 50, the temperature of the peripheral circuit of the TFT cell 51 can be controlled in a short time by controlling the temperature from the upper surface of the glass substrate 50. . The temperature control device 13 is configured to control the temperature of only the inspection portion, that is, one TFT cell 51 from its upper surface. Therefore, significant energy saving can be realized as compared with the conventional case where the temperature of the entire surface of the glass substrate 50 is controlled from the lower surface via the mounting table 11.

  For example, as shown in FIG. 1, the temperature control device 13 includes a heat medium 131 that is in contact with the upper surface of the TFT cell 51 without a gap, and is configured to control the temperature of the TFT cell 51 via the heat medium 131. The heat medium 131 is not particularly limited as long as it is in contact with the upper surface of the TFT cell 51 without any gap, but a heat medium that can be used in as wide a temperature range as possible is preferable. Further, the heat medium 131 can be selectively used for high temperature and low temperature depending on the inspection temperature. In the present embodiment, an electrically insulating liquid such as oil or florinate is used as the heat medium 131. Below, the case where it test | inspects in a low-temperature area | region below 0 degreeC using a fluorinate as a heat medium is demonstrated.

  The temperature control device 13 used in the present embodiment is not particularly limited as long as the temperature of the TFT cell 51 is controlled via the heat medium 131. As shown in FIG. 1, the temperature control device 13 includes a temperature-adjustable temperature adjusting body (hereinafter referred to as “temperature-control head”) 132, and a heat medium 131 between the temperature-control head 132 and the TFT cell 51. And a heat medium circulation device 133 that circulates the heat medium 131 so that the medium is interposed. The temperature adjustment head 132 faces the central opening of the probe card 12, and when the probe 12A is in electrical contact with the TFT cell 51, a gap (gap where the heat medium 131 is interposed) is formed between the temperature adjustment head 132 and the TFT cell 51. It is arranged to form. Therefore, it is preferable that the temperature control head 132 is configured as an integral structure so that the positional relationship with the probe card 12 is fixed. Since the heat medium 131 is interposed in the gap between the temperature control head 132 and the TFT cell 51, the temperature control head 132 and the TFT cell 51 efficiently exchange heat through the thin layer of the heat medium 131, It can be controlled to a predetermined inspection temperature in a short time. The temperature adjustment head 132 may be movable up and down with respect to the probe card 12.

  The temperature adjustment head 132 is connected to the refrigerator 135 and the pump 136 via, for example, a first circulation pipe 134. The secondary heat medium of the refrigerator 135 is circulated through the first flow path 132A in the temperature adjustment head 132 via the first circulation pipe 134 by the action of the pump 136, and the temperature adjustment head 132 is brought to a predetermined inspection temperature. It is designed to cool.

  The heat medium circulation device 133 is sequentially disposed on the downstream side of the tank 137 in the tank 137 that stores the heat medium 131, the second circulation pipe 138 that connects the tank 137 and the temperature control head 132, and the second circulation pipe 138. The heat medium 131 circulates between the tank 137 and the temperature adjustment head 132 via the second circulation pipe 138 by the action of the pump 139, and the temperature adjustment head 132 is provided. Between the glass substrate 50 and the glass substrate 50 to form a heat medium layer. When dust is mixed in the heat medium 131 while the heat medium 131 passes through the gap between the temperature control head 132 and the TFT cell 51, it is reliably removed by the filter 140 disposed in the second circulation pipe 138. Further, a first flow rate adjustment mechanism 138A is provided on the downstream side of the filter 140 in the forward path of the second circulation pipe 138, and the flow rate of the heat medium 131 supplied to the temperature adjustment head 132 is adjusted by the first flow rate adjustment mechanism 138A. It is. A second flow rate adjustment mechanism 138B is provided between the temperature adjustment head 132 and the tank 137 on the return path of the second circulation pipe 138, and the flow rate of the heat medium 131 supplied to the temperature adjustment head 132 is adjusted by the second flow rate adjustment mechanism 138B. I have to do it. The flow rate adjusting mechanism may be provided in at least one of the forward path and the return path of the second circulation pipe 138.

  The temperature control head 132 is formed with a plurality of second and third flow paths 132B and 132C through which the heat medium 131 circulates in a vertical direction. The plurality of second flow paths 132 </ b> B are arranged on the center side along the outer periphery of the temperature control head 132 as an inflow path of the heat medium 131, and each upper end opening is connected to the forward path side of the second circulation pipe 138. The third flow path 132C is arranged so as to surround the second flow path 132B along the outer periphery of the temperature control head 132 as an outflow path of the heat medium 131, and each upper end opening is connected to the return path side of the second circulation pipe 138. Has been.

  Therefore, while the heat medium 131 circulates between the temperature control head 132 and the tank 137 via the second circulation pipe 138 by the action of the pump 139, the heat medium 131 in the temperature control head 132 passes through the second flow path 132B. By flowing out into the gap between the lower surface of the temperature control head 132 and the TFT cell 51 from the lower end opening, and flowing into the lower end opening of the third flow path 132C through this gap, the gap between the temperature adjustment head 132 and the TFT cell 51 is reached. A thin layer of the heat medium 131 is formed. The heat medium 131 is cooled by the temperature adjustment head 132 cooled to a predetermined temperature by the secondary heat medium while passing through the plurality of second flow paths 132B, and the upper surface of the TFT cell 51 is instantaneously cooled.

  Further, as shown in FIG. 1, the temperature control head 132 is provided with a gas channel 141 for supplying a gas, for example, dry air, in a downward flow along the outer peripheral surface thereof, and flows down along the gas channel 141. Condensation to the temperature control head 132 is prevented by the dry air, and the layer of the heat medium 131 is sealed in the gap between the temperature control head 132 and the TFT cell 51 by the dry air, thereby preventing the heat medium 131 from escaping to the outside. can do.

  Further, as shown in FIG. 2, the mounting table 11 is formed with a discharge hole 11A for discharging the heat medium 131 along one side surface thereof, and this discharge hole 11A is connected via a pipe 142 as shown in FIG. After that, it is connected to the tank 137. Therefore, when the mounting table 11 moves and the temperature adjustment head 132 reaches the discharge hole 11A after the inspection is completed, the heat medium 131 adhering to the temperature adjustment head 132 passes to the tank 137 via the pipe 142 having a negative pressure. Return.

  Next, an example of the inspection method of this embodiment using the inspection apparatus 10 of this embodiment will be described. First, when the glass substrate 50 is mounted on the mounting table 11 in the prober room, the inspection electrode of the glass substrate 50 and the probe 12A are placed via the alignment mechanism while the mounting table 11 moves in the X, Y, and Z directions. Perform alignment. Thereafter, the mounting table 11 moves to a position directly below the TFT cell 51 to be inspected first, and the mounting table 11 is raised from that position to bring the inspection electrode of the TFT cell 51 into contact with the probe 12A.

  At this time, the refrigerator 135 and the pump 136 are started, the secondary heat medium circulates between the refrigerator 135 and the temperature adjustment head 132, and the temperature adjustment head 132 is cooled via the first flow path 132A. In synchronization with this, the pump 139 of the heat medium circulation device 133 is started, and the heat medium in the tank 137 circulates between the temperature control head 132 and the tank 137. In the temperature adjustment head 132, the heat medium 131 flows out from the second flow path 132B into the gap between the temperature adjustment head 132 and the TFT cell 51, and then forms a thin layer of the heat medium 131 through the gap. Return to tank 137 through 132C. The temperature adjustment head 132 instantaneously cools the upper surface of the TFT cell 51 to a predetermined inspection temperature via the heat medium 131. At this time, the flow rate of the heat medium 131 between the temperature adjustment head 132 and the TFT cell 51 is adjusted via the first and second flow rate adjustment mechanisms 138A and 138B. Thereby, the inspection apparatus 10 can perform a predetermined low temperature inspection. During the inspection, since the dry air is jetted in a downward flow along the gas flow path 141 on the outer peripheral surface of the temperature control head 132, dew condensation on the temperature control head 132 is prevented by the dry air and the layer of the heat medium 131 is formed. It can be contained in the gap between the temperature control head 132 and the TFT cell 51.

  When the inspection of the first TFT cell 51 is completed, the mounting table 11 is lowered and the gap between the temperature adjustment head 132 and the glass substrate 50 is increased. At this time, the first flow rate adjusting mechanism 138A is driven to temporarily increase the inflow amount of the heat medium 131 into the temperature adjustment head 132, and the volume of the heat medium 131 between the temperature adjustment head 132 and the glass substrate 50 is increased. When the gap between the temperature control head 132 and the glass substrate 50 is filled with the heat medium 131 and the mounting table 11 moves to the next TFT cell 51, the heat medium 131 has an appropriate volume between the temperature control head 132 and the glass substrate 50. Hold and intervene.

  After that, after the mounting table 11 moves in the horizontal direction to just below the next TFT cell 51, it rises to reduce the gap between the temperature control head 132 and the glass substrate 50, and the TFT cell 51 and the probe 12A are in electrical contact. . Since the gap between the temperature adjustment head 132 and the glass substrate 50 is reduced when the mounting table 11 is raised, the second flow rate adjustment mechanism 138B is driven to temporarily increase the outflow amount of the heat medium 131 from the temperature adjustment head 132, The volume of the heat medium 131 is reduced so that the heat medium 131 is interposed between the temperature control head 132 and the glass substrate 50 while maintaining an appropriate volume for heat exchange. Even when the mounting table 11 moves between the TFT cells 51, the dry air is jetted downward from the gas flow path 141. Therefore, the heat medium 131 on the lower surface of the temperature control head 132 is coupled with the action of the surface tension. And held by the lower surface of the temperature control head 132. When the probe 12A and the TFT cell 51 are in electrical contact with each other, a thin layer of the heat medium 131 is formed between them. Therefore, the temperature adjustment head 132 can instantaneously cool the TFT cell 51 to a predetermined inspection temperature via the heat medium 131.

  In the relationship in which the temperature adjustment head 132 and the probe card 12 are fixed, the gap between the temperature adjustment head 132 and the glass substrate 50 changes as the height of the mounting table 11 under inspection is increased or decreased. When the temperature control head 132 can be moved up and down with respect to the probe card 12, the mounting table 11 may follow the lifting operation and keep the gap between the temperature control head 132 and the glass substrate 50 constant.

  When the array inspection is completed by repeating the above operation, the heat medium 131 interposed in the gap between the temperature adjustment head 132 and the glass substrate 50 is discharged from the third flow path 132C of the temperature adjustment head 132, and then the pump 139 is stopped. When the heat medium 131 remains in the gap between the temperature control head 132 and the glass substrate 50, the mounting table 11 is moved in the horizontal direction so that the temperature control head 132 is disposed on the discharge hole 11A and the exhaust hole 11A is set to a negative pressure. Then, the remaining heat medium 131 is collected into the tank 137 from the discharge hole 11A.

  As described above, according to the present embodiment, the glass substrate 50 on the mounting table 11 and the plurality of probes 12A are brought into electrical contact, and the temperature control device 13 performs inspection while cooling the glass substrate 50 to a predetermined temperature. When performing, the temperature control device 13 has a heat medium 131 that is in direct contact with the upper surface of the inspection portion of the glass substrate 50 (the portion of the TFT cell 51 in contact with the plurality of probes 12 </ b> A) without any gap. Therefore, the peripheral circuit unevenly distributed on the upper surface of the glass substrate 50 can be directly cooled via the heat medium 131, and the thermal conductivity of the glass substrate 50 is small. In addition, only the TFT cell 51 of the glass substrate 50 on the mounting table 11 can be efficiently controlled from the upper surface to a predetermined temperature in a short time, thereby improving the inspection throughput. It can be. In addition, since only the inspection portion of the glass substrate 50 is controlled during inspection, energy saving can be promoted.

  In addition, according to the present embodiment, the temperature control device 13 includes the temperature adjustment head 132 that can adjust the temperature, and the heat that circulates the heat medium 131 so that the heat medium 131 flows through the gap between the temperature adjustment head 132 and the inspection portion. Therefore, the heat exchange between the temperature control head 132 and the TFT cell 51 can be efficiently performed via the heat medium 131. In addition, the heat medium circulation device 133 includes first and second flow paths 132B and 132C for heat medium circulation formed inside the temperature control head 132 so as to open at the lower surface of the temperature control head 132, and the heat medium 131. A tank 137 to be stored, a second circulation pipe 138 connecting the tank 137 to the first and second flow paths 132B and 132C, a pump 139 provided in the second circulation pipe 138 to circulate the heat medium 131, and Therefore, it is possible to form a thin layer of the heat medium 131 that passes through the gap between the temperature control head 132 and the TFT cell 51 and adheres closely to both the temperature control head 132 and the TFT cell 51 without gap. Further, since the first and second flow rate adjusting mechanisms 138A and 138B are provided on the forward path and the return path of the second circulation pipe 138, respectively, the temperature adjustment head 132 and the glass are moved while the mounting table 11 moves between the TFT cells 51 during the inspection. The volume of the heat medium 131 between the substrate 50 and the substrate 50 can be appropriately maintained.

Second Embodiment The inspection apparatus according to the present embodiment is configured according to the first embodiment except that the temperature control apparatus is different. Therefore, in the present embodiment, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals and the present invention will be described.

  For example, as shown in FIG. 3, the temperature control device 13 used in the inspection apparatus 10 </ b> A of the present embodiment includes a flexible heat medium 131 that is in direct contact with the upper surface of the inspection portion without a gap. And the temperature of the inspection portion is controlled.

  The flexible heat medium 131 has electrical insulation properties, and even if there are fine irregularities on the upper surface of the inspection portion, it deforms flexibly according to the irregularities and conforms to the irregularities, and adheres without forming a gap. Is. As such a heat medium 131, for example, a sheet-like material such as a cool sheet (trade name: manufactured by Okura Rubber Industry Co., Ltd.) is preferable. Therefore, in the present embodiment, the heat medium 131 is described as the heat medium sheet 131.

  The temperature control device 13 used in the present embodiment includes, for example, a Peltier element 132 as a temperature regulator, a temperature sensor 132A that detects the temperature of the Peltier element 132, a detection value of the temperature sensor 132A, and a preset low temperature. And a control circuit 132B that controls the Peltier element 132 to a predetermined set temperature based on the temperature of the region. Similar to the first embodiment, the Peltier element 132 is integrated with the probe card 12 so as to face the central opening of the probe card 12. The heat medium sheet 131 is bonded and fixed to the lower surface of the Peltier element 132, and is in close contact with the upper surface of the TFT cell 51 when the plurality of probes 12A and the TFT cell 51 are in electrical contact. is there.

  Next, the inspection method using the inspection apparatus 10A of the present embodiment is performed substantially in accordance with the first embodiment except that the temperature control method of the inspection part by the temperature control device 13 is different. Therefore, the characteristic part of this embodiment will be described. When the inspection portion of the glass substrate 50 on the mounting table 11 and the plurality of probes 12A of the probe card 12 are in electrical contact, the Peltier element 132 is the inspection portion of the glass substrate 50 via the heat medium sheet 131. And adheres without gaps.

  At this time, since the Peltier element 132 is at a set temperature based on the detection value of the temperature sensor 132A under the control of the control circuit 132B, the Peltier element 132 covers the upper surface of the TFT cell 51 via the heat medium sheet 131. Cool to the inspection temperature. At this time, since the heat medium sheet 131 is in close contact with the TFT cell 51 without any gap, the Peltier element 132 can instantaneously cool the TFT cell 51 to the inspection temperature via the heat medium sheet 131. In addition, what is necessary is just to reverse a polarity, when using the Peltier device 132 as a heating means.

  As described above, according to the present embodiment, in the temperature control device 13, the heat medium 131 is formed as a flexible sheet, and the temperature adjusting body is the Peltier element 132. Therefore, the heat medium sheet 131 is a Peltier element. Both the element 132 and the TFT cell 51 are in close contact with each other, and the upper surface of the TFT cell 51 can be instantaneously cooled to a predetermined inspection temperature by the Peltier element 132, so that the inspection throughput can be improved.

  Further, according to the present embodiment, since the heat medium sheet 131 is used, the structure of the temperature control device 13 can be simplified, not the complicated structure for circulating the heat medium 131 as in the first embodiment. .

  In addition, this invention is not restrict | limited to the said embodiment at all, A design change can be suitably carried out as needed. For example, in the first embodiment, the heat medium 131 is supplied from the second flow path 132B to the temperature adjustment head 132 by reversing the relationship between the second flow path 132B and the third flow path 132C, and the third flow path 132C. The heat medium 131 may be discharged from the storage medium. Further, dry air may be supplied from the third flow path 132C, and the second flow path 132B may be used as an inflow path and an outflow path for the heat medium 131. In this case, the gas flow path 141 can be omitted. . In short, if the method and apparatus for inspecting the object to be inspected by directly contacting the upper surface of the inspected part of the object to be inspected without any gap and controlling the temperature of the inspected part from the surface through the heat medium, the present invention is applicable. Included in the invention. The heat medium may be liquid, solid, or gas as long as it contacts the inspection portion without any gap.

  INDUSTRIAL APPLICABILITY The present invention can be suitably used in various processing apparatuses that require an endothermic action from an object to be processed in both a high temperature region and a low temperature region.

It is a block diagram which shows the principal part of one Embodiment of the test | inspection apparatus of this invention. It is a top view of the mounting base of the inspection apparatus shown in FIG. It is a block diagram which shows the principal part of other embodiment of the test | inspection apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Inspection apparatus 11 Mounting base 11A Discharge hole 12 Probe card 12A Probe 13 Temperature control apparatus 50 Inspected object 51 TFT cell (inspection part)
131 Heat medium, Heat medium sheet 132 Temperature control head, Peltier element (temperature control body)
132B second flow path (heat medium supply flow path)
132C 3rd flow path (flow path for discharging heat medium)
137 Tank (container)
138 Second circulation piping (circulation path)
139 Pump 140 Filter 141 Gas flow path

Claims (15)

  A mounting table for mounting the object to be inspected, a plurality of probes that are in electrical contact with the object to be inspected on the mounting table, and a temperature control device that controls the temperature of the inspection portion of the object to be inspected, An inspection apparatus for inspecting the electrical characteristics of the object to be inspected while controlling the temperature of the inspection portion with a temperature control device, the temperature control device having a heat medium that is in direct contact with the upper surface of the inspection portion without a gap. And the temperature of the inspection part is controlled via the heat medium.   The temperature control device includes a temperature adjustment body capable of adjusting temperature, and supply / discharge means for supplying and discharging the heat medium so as to form a layer of the heat medium between the temperature adjustment body and the inspection portion. The inspection apparatus according to claim 1.   The supply / exhaust means includes a supply / discharge passage for the heat medium formed in the temperature adjustment body so as to open at the lower surface of the temperature adjustment body, a container for storing the heat medium, the container, and the supply / discharge The inspection apparatus according to claim 2, further comprising: a circulation path that connects a flow path for use, and a pump provided in the circulation path so as to circulate the heat medium.   The inspection apparatus according to claim 3, wherein a flow rate adjusting mechanism is provided in the circulation path.   The inspection apparatus according to claim 3 or 4, wherein a discharge portion for the heat medium is provided at an outer peripheral edge portion of the mounting table, and the heat medium is collected from the discharge portion into the container.   6. The inspection apparatus according to claim 2, further comprising means for supplying gas along the outer peripheral surface of the temperature adjusting body.   The inspection apparatus according to claim 1, wherein the heat medium is formed as a flexible sheet.   The inspection apparatus according to claim 7, wherein a Peltier element is disposed on the flexible sheet.   The inspection apparatus according to claim 1, wherein the object to be inspected is a flat display glass substrate.   An inspection method in which an inspection part of an object to be inspected placed on a mounting table is in electrical contact with a plurality of probes, and an electrical property inspection of the inspection part is performed while controlling the temperature of the inspection part. An inspection method comprising controlling the temperature of the inspection portion via a heat medium that is in direct contact with the upper surface of the inspection portion without a gap.   A step of disposing a temperature adjusting body for controlling the temperature of the inspection portion on the upper surface side of the inspection portion; and a step of supplying and discharging the heat medium between the inspection portion and the temperature adjustment body. The inspection method according to claim 10.   The inspection method according to claim 11, wherein in the heat medium supply / discharge step, the heat medium is supplied / discharged from a supply / discharge flow path provided in the temperature adjusting body.   The inspection method according to any one of claims 10 to 12, further comprising a step of discharging the heat medium from a discharge portion formed at an outer peripheral edge portion of the mounting table.   The inspection method according to claim 10, wherein a flexible sheet is used as the heat medium.   The inspection method according to claim 14, wherein the temperature of the flexible sheet is controlled using a Peltier element.

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