JP2007294665A - Probe card transfer method, prober and probe card supply/recovery system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve throughput by exchanging a probe card immediately after inspection ends at a low temperature in a prober. <P>SOLUTION: This prober is configured to inspect a plurality of semiconductor devices formed on a wafer by a tester by connecting each terminal of the tester to the electrodes of the semiconductor devices, and provided with a wafer chuck 18 for holding a wafer; a chiller system for cooling the wafer chuck 18, and for lowering the temperature of the wafer; an openable/closeable door 47 for transferring a probe card 24 with the outside; and dry air introducing mechanisms 772 and 75 for introducing drying gas to a prober 10 to make the pressure of the inside of the prober higher than the peripheral pressure. In the case of opening the door 47 when the temperature of the wafer chuck 18 is lower than the peripheral temperature of the prober by a predetermined temperature or more, the drying gas is introduced to the inside of the prober by the drying gas introducing mechanisms. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a prober for connecting a die electrode to a tester in order to perform electrical inspection of a plurality of semiconductor chips (die) formed on a semiconductor wafer, and a probe card delivery method used by mounting the prober on the prober. In particular, the present invention relates to a prober that can cool a wafer chuck holding a wafer and perform inspection in a low-temperature environment, a probe card delivery method using such a prober, and a supply / recovery system.

  In the semiconductor manufacturing process, various processes are performed on a thin disk-shaped semiconductor wafer to form a plurality of chips (dies) each having a semiconductor device (device). Each chip is inspected for electrical characteristics, then separated by a dicer, and then fixed to a lead frame and assembled. The inspection of the electrical characteristics is performed by a wafer test system composed of a prober and a tester. The prober holds the wafer on the stage and brings the probe into contact with the electrode pad of each chip. The tester supplies power and various test signals from the terminals connected to the probe, and analyzes the signals output to the electrodes of the chip with the tester to check whether it operates normally.

  Semiconductor devices are used in a wide range of applications, and there are semiconductor devices (devices) that can be used in low-temperature environments such as -55 ° C and high-temperature environments such as 200 ° C. It is required that the inspection can be performed. Therefore, a wafer temperature adjusting means for changing the surface temperature of the wafer chuck, such as a heater mechanism and a chiller mechanism, is provided below the wafer mounting surface of the wafer chuck that holds the wafer in the prober, and is held on the wafer chuck. The heated wafer is heated or cooled.

  FIG. 1 is a diagram showing a schematic configuration of a wafer test system including a prober having a wafer temperature adjusting means. As shown, the prober 10 includes a base 11, a moving base 12, a Y-axis moving table 13, an X-axis moving table 14, a Z-axis moving unit 15, and a Z-axis moving table provided thereon. 16, θ rotation unit 17, wafer chuck 18, wafer alignment camera 19, support columns 20 and 21, head stage 22, card holder 23 provided on the head stage 22, and probe attached to the card holder 23. Card 24. A probe 25 is provided on the probe card 24. The movement base 12, the Y-axis movement table 13, the X-axis movement table 14, the Z-axis movement unit 15, the Z-axis movement table 16, and the θ rotation unit 17 move the wafer chuck 18 in the three-axis direction and the Z-axis direction. A moving / rotating mechanism that rotates around the center is configured. Since the moving / rotating mechanism is widely known, the description thereof is omitted here. The probe card 24 has a probe 25 arranged according to the electrode arrangement of the device to be inspected, and is exchanged according to the device to be inspected. A needle alignment camera 19 for detecting the position of the probe and a cleaning mechanism for cleaning the probe are provided, but are omitted here.

  The tester 30 includes a tester body 31 and a contact ring 32 provided on the tester body 31. The probe card 24 is provided with a terminal connected to each probe, and the contact ring 32 has a spring probe arranged so as to contact the terminal. The tester body 31 is held with respect to the prober 10 by a support mechanism (not shown). The prober 10 performs measurement in cooperation with the tester 30 in the wafer test, but its power supply system and mechanism are independent from the tester body and the test head.

  When performing the inspection, the tip position of the probe 25 is detected by a needle alignment camera (not shown). Next, with the wafer W to be inspected held by the wafer chuck 18, the Z-axis moving table 16 is moved so that the wafer W is positioned under the wafer alignment camera 19, and the electrode pads of the semiconductor chips on the wafer W are moved. The position of is detected. It is not necessary to detect the positions of all the electrode pads of one chip, and the positions of several electrode pads may be detected. Further, it is not necessary to detect the electrode pads of all the chips on the wafer W, and the positions of the electrode pads of several chips are detected.

  After detecting the position of the probe 25 and the position of the electrode on the wafer W, the wafer chuck 18 is rotated by the θ rotating unit 17 so that the arrangement direction of the electrode pads of the chip matches the arrangement direction of the probe 25. Then, after moving so that the electrode pad of the chip to be inspected on the wafer W is positioned below the probe 25, the wafer chuck 18 is raised and the electrode pad is brought into contact with the probe 25. Then, a power source and a test signal are supplied from the tester main body 31 to the electrode via the contact ring 32, and a signal output to the electrode is detected to check whether it operates normally.

  For the wafer to be inspected, a sealed wafer cassette containing multiple wafers is placed adjacent to the prober, the wafer cassette door is opened from inside the prober, and the wafer cassette and prober internal space are disconnected from the surroundings. Then, the wafer to be inspected is supplied by being taken out and transferred onto a wafer chuck. The inspected wafer is returned to the wafer cassette. The wafer cassette is filled with a predetermined gas (for example, dry air).

  As described above, since the electrode arrangement differs for each device to be inspected, the probe card 24 has the probe 25 arranged according to the electrode arrangement of the device to be inspected, and is exchanged according to the device to be inspected. A multi-probing process in which a plurality of devices are simultaneously inspected by increasing the number of probes has been performed. In recent years, the number of devices that can be inspected at the same time has been increasing to improve inspection throughput, and a probe having several thousand probes. A card has also been realized. Such probe cards are heavy and can be damaged if the operator manually replaces them. Also, such a probe card is very expensive, and if it is damaged, the damage is great. Therefore, Patent Documents 1 and 2 describe configurations for automatically exchanging probe cards. In a general probe card automatic replacement method, a probe card to be mounted is placed on a tray that is pulled out of the prober, the probe card placed on the tray is moved onto the wafer chuck 18, and the wafer chuck 18. Is moved directly below the card holder and lifted, and is attached to the card holder by the mounting mechanism. Since an automatic probe card replacement method is widely known, further explanation is omitted.

  The above is the schematic configuration of the wafer test system. In a prober capable of heating or cooling the wafer chuck and inspecting the held wafer W at a high temperature or a low temperature, a heater 26 and a chuck coolant path 27 are provided in the wafer chuck 18. Is provided. Cooling liquid flows from the cooling liquid source 28 to the chuck cooling liquid path 27 via the supply path 29A, and cools the surface of the wafer chuck 18 holding the wafer W. The coolant that has passed through the chuck coolant path 27 is recovered by the coolant source 28 via the recovery path 29B. Here, a portion constituted by the chuck coolant path 27, the coolant source 28, the supply path 29A, and the recovery path 29B is referred to as a chiller system. The heater 26 generates heat to heat the surface of the wafer chuck 18 that holds the wafer W. Further, a temperature sensor 41 is provided in the vicinity of the surface of the wafer chuck 18, and the control unit 42 of the cooling liquid source 28 supplies the cooling liquid supplied from the cooling liquid source 28 according to the surface temperature of the wafer chuck 18 detected by the temperature sensor 41. Control the temperature of the source.

  In addition, a vacuum path or the like for vacuum-sucking the wafer W is provided in the wafer chuck 18, and various modifications can be made to the arrangement of the heater 26, chuck coolant path 27, and vacuum path in the wafer chuck 18. is there.

  When the inspection is performed with the wafer set at a predetermined set temperature, the heater 26 or the chiller system is operated so that the wafer chuck 18 reaches a predetermined set temperature while the wafer W is held on the wafer chuck 18. The wafer chuck 18 is made of a material such as a metal such as aluminum or copper or a ceramic having good thermal conductivity.

  Further, in order to improve the temperature adjustment efficiency, the prober capable of adjusting the temperature should block the gas (air) between the inside including the wafer chuck 18 and the surroundings as much as possible, that is, seal the inside of the prober as much as possible. It has been broken. In particular, when the temperature of the wafer W and the wafer chuck 18 is lowered, if the humidity of the air (gas) in the prober is high, dew condensation occurs in the low temperature portion, causing a problem that normal inspection cannot be performed. Therefore, in this case, a dry gas is introduced into the prober.

  Since the configuration of the prober and wafer test system described above is widely known, further description is omitted here.

  Further, Patent Document 3 divides the surface of the wafer chuck 18 into a plurality of regions, and provides a temperature adjustment mechanism (heating mechanism and chiller system) and a temperature sensor that can be controlled independently for each region, and detects each temperature sensor. It describes that the temperature adjustment mechanism in each region is controlled based on the measured temperature.

JP 2000-150596 A (Overall) JP 2004-170267 A (Overall) JP 2001-210683 A (Overall)

  When the inspection is performed with the wafer W at a high temperature or a low temperature, after the wafer W is placed on the wafer chuck 18, the temperature adjustment mechanism is operated so that the wafer chuck 18 reaches a predetermined temperature, and the wafer chuck 18 reaches a predetermined temperature. Start inspection. When the inspection is performed for a certain period of time, members around the wafer chuck 18 such as the card holder 23 and the probe card 24 also approach a predetermined temperature.

  When the inspection is completed and the next inspection of a wafer having a different specification is performed, the probe card is replaced. The prober is required to improve the throughput, and it is desirable to replace the probe card as soon as the previous inspection is completed. However, when the temperature condition of the previous inspection is low, external gas (air) enters the prober when the door is opened and the tray is pulled out to replace the probe card. As described above, when the wafer chuck 18 and its peripheral portion are at a low temperature and the temperature is lower than the dew point of the external gas, dew condensation occurs on the wafer chuck 18 and its peripheral portion. Various problems such as corrosion occur.

  Therefore, conventionally, when the probe card is replaced after the inspection at a low temperature is completed, even when the inspection at the low temperature is performed again, the temperature of the wafer chuck is increased to a certain level, for example, the environment where the prober is installed. The probe card was replaced after the temperature was raised above room temperature to prevent condensation. For this reason, since it took time until the probe card can be replaced after the inspection is completed, there is a problem that the throughput is low. If inspection is performed again at a low temperature after replacement of the probe card, it takes time to lower the temperature of the wafer chuck again, which requires a longer time before the next inspection can be started, further reducing the throughput. There was a problem to do.

  The present invention solves such a problem, and an object of the present invention is to improve the throughput by allowing the probe card to be replaced immediately after the low-temperature inspection is completed in the prober.

  In order to achieve the above object, according to the present invention, when the probe card is transferred between the prober and the outside in a state where the temperature inside the prober is lower than a predetermined temperature by the surrounding environment, a dry gas is introduced into the prober. A positive pressure state in which the pressure inside the prober is higher than the surroundings is reduced to reduce gas intrusion that causes dew condensation from the outside into the prober.

  That is, the probe card delivery method of the present invention includes a probe that has a probe that contacts an electrode of a semiconductor device formed on a wafer, a probe card that is connected to the probe, and a contact terminal that contacts each terminal of the tester. A probe card delivery method for delivering a probe card through an openable / closable door provided between the prober and the outside in order to attach and detach the probe card. When the inside of the prober is lower than the temperature around the prober by a predetermined temperature or more, when opening the door, a dry gas is introduced into the prober so that the pressure inside the prober is higher than the surroundings. It is characterized by.

  In order to prevent the occurrence of dew condensation, the atmospheric dew point in the prober, particularly in the vicinity of the wafer chuck and the surrounding low temperature portion, may be set below the temperature of the portion in the prober. According to the present invention, the prober is filled with a dry gas having a low dew point, and the gas pressure inside the prober is higher than the outside, so that the intrusion of the outside gas into the prober is prevented, so that no condensation occurs. .

  In order to increase the internal pressure by introducing the dry gas into the prober, a jet outlet is provided for jetting the gas from the dry gas source that generates and outputs the dry gas into the prober. When replacing the probe card, it is necessary to open the door and pull out the tray that delivers the probe card to the outside, and since outside air enters from that portion, it is desirable to provide a spout around the door. Further, since the probe card is removed for replacement and the portion is opened to the outside, it is desirable to provide a jet outlet also in the vicinity of the card holder to which the probe card is attached.

  The probe card is automatically removed, and the tray on which the probe card is placed is pulled out, so that the probe card is collected, and when a new probe card is placed on the tray, it is automatically attached. Supplying the probe card to the tray and collecting it from the tray may be performed manually or using a robot, but the probe card is transported in a sealed box (card) provided on the carrier (cart). The probe card is accommodated in a cassette. The card cassette is filled with dry gas.

  The probe card is accommodated in a card stocker. The card stocker also has a dry gas introduction mechanism that introduces a dry gas into the card stocker so that the pressure in the card stocker is higher than the surroundings. A plurality of probe cards are accommodated in the card stocker, and the probe card to be used is moved and sealed in the card cassette of the transport carriage. The transport carriage is moved to the prober door, the prober and card cassette doors are opened, the probe card collected from the tray is moved into the card cassette, and then the probe card in the card cassette is moved onto the tray.

  According to the present invention, since the probe card can be replaced immediately after the low-temperature inspection is completed in the prober, the throughput is improved.

  FIG. 2 is a diagram showing the overall configuration of the wafer probing test system according to the embodiment of the present invention. In FIG. 2, reference numeral 10 is a prober, 31 is a tester body, and the basic configuration is the same as the conventional example shown in FIG. The tester body 31 can be rotated by an arm 45 that is rotatably supported by a base 46. The contact ring 32 contacts the probe card 24 attached to the prober 10, and the connection terminal of the tester body 31 serves as a probe. Connected. The prober 10 is provided with a door 47 for pulling out the probe card 24 to the outside. Reference numerals 47 and 48 indicate portions that accommodate the wafer cassette, the coolant source 28, and the like.

  Reference numeral 50 indicates a card stocker that accommodates a plurality of probe cards. The card stocker 50 has a plurality of stages, each of which houses a probe card, and each stage has a door for delivering the probe card. The inside of the card stocker 50 is hermetically sealed so that a dry gas is introduced into the card stocker 50. Further, the dry gas can be supplied to other devices connected via a connection valve 51 provided at the lower stage. Yes.

  Reference numeral 60 indicates a card transport cart. The card transport cart 60 receives the probe card from the card stocker 50 and stores it inside the prober 10, transports it to the prober 10, opens the door 47 of the prober 10, and delivers the tray probe card to the prober 10. The collected probe card is returned to the card stocker 50. The card transport cart 60 includes a movable base 61 supported by wheels, a column 64 provided in the base 61 and extending in the vertical direction, and a movable table 62 provided so as to be movable in the vertical direction along the column 64. And a card cassette 63 provided on the moving table 62. The card cassette 63 has a door for delivering the probe card to a portion not shown, and after the probe card is received, the door is closed to make the inside sealed. Here, the card cassette 63 shifts the accommodated probe card in the lateral direction, further accommodates another probe card, shifts the accommodated two probe cards in the opposite lateral direction, and removes the initially accommodated probe card from the outside. Can be passed to. Instead of shifting in the horizontal direction, it is also possible to shift in the vertical direction as in Patent Document 3. Note that the card transport cart 60 is moved by being pushed by the operator, or the card transport cart 60 is provided with a drive source and a control unit, and is moved by automatic control to perform the hand-over operation. It is also possible to automate a part.

  FIG. 3 is a diagram for explaining the probe card delivery operation between the card stocker 50 and the card cassette 63 of the card transport cart 60. As shown in the figure, the card stocker 50 is supported by a column 52. The card stocker 50 is composed of five stages 56A to 56E, and a probe card is accommodated in each stage. Each stage is provided with a base member 57 (only the second stage 56B is shown) for holding the probe card, and doors 58A-58E are provided on the delivery side, and the doors 58A-58E rotate around the hinges 59A-59E as rotation axes. Supported as possible. The lowermost stage 54 accommodates a control unit, a drive source, and the like.

  The card stocker 50 has a drain 53 to which a dry gas having a pressure slightly higher than the atmospheric pressure is supplied from an external dry gas source (not shown), and the supplied dry air is in a predetermined location of the card stocker 50 and each stage. The inside of the card stocker 50 can be maintained in a positive pressure state at a higher atmospheric pressure than the surrounding atmosphere. The positive pressure state may be set only when the probe card 24 is delivered, or the positive pressure state may be always set.

  When the card transport cart 60 is moved to a predetermined position in front of the card stocker 50 as shown in FIG. 3, the connection valve 51 of the card stocker 50 and the connection valve 68 of the card transport cart 60 are combined and supplied through the drain 53. The dry gas is ejected from an ejection port 69 provided in the card cassette 63 of the card transport carriage 60, and the inside of the card cassette 63 is brought into a positive pressure state with respect to the surrounding atmosphere. In this state, the card cassette 63 is moved to a height suitable for returning the probe card 24 from which the card cassette 63 has been recovered, the door of the card stocker 50 (here, the second door 58B) is opened, and the door 66 of the card cassette 63 is opened. The moving base 65 in the card cassette 63 is moved to a position close to the base member 57, and the support ring 66 of the probe card 24 is slid (slid), and the probe card 24 supported by the support ring 66 is moved. It is moved on the base member 57. In this way, the probe card 24 is collected in the card stocker 50. Then, the moving base 65 is moved into the card cassette 63, and the door of the card stocker 50 and the door 66 of the card cassette 63 are closed.

  Next, the card cassette 63 is moved to a height suitable for the stage in which the probe card to be mounted is accommodated, the doors 58 (any of 58A to 58E) and 66 are opened, and the moving base 65 is brought close to the base member 57. The probe card 24 supported by the support ring 66 is moved onto the base member 57, the moving base 65 is moved into the card cassette 63, and the door of the card stocker 50 and the door 66 of the card cassette 63 are closed. . As a result, the probe card to be mounted is accommodated in the card cassette 63.

  During the above operation, the inside of the card stocker 50 and the card cassette 63 is maintained in a positive pressure state in which the atmospheric pressure is higher than the surrounding atmosphere, so that the surrounding atmosphere almost enters the inside of the card stocker 50 and the card cassette 63. Absent. Accordingly, the inside of the card stocker 50 and the card cassette 63 is maintained filled with dry gas.

  FIG. 4 is a diagram for explaining the probe card delivery operation between the prober 10 and the card cassette 63 of the card transport cart 60. As illustrated, the prober 10 is supported by a support 71 (only one is shown). The prober 10 has the same configuration as the conventional one shown in FIG. 1, and a base 74 is provided on a support base 73 attached to a column 21 of a door 47 portion for probe card delivery. The door 47 can rotate about the hinge 72 as a rotation axis.

  The prober 10 is supplied with a dry gas having a pressure slightly higher than the atmospheric pressure from a dry gas source 72 provided in the portions indicated by 47 and 48. The supplied dry air is a predetermined place of the prober 10 and the vicinity of the door 47 or a card. It is ejected from a spout 75 provided in the vicinity of the holder 23, and the inside of the prober 10 can be maintained in a positive pressure state at a higher atmospheric pressure than the surrounding atmosphere. It should be noted that the positive pressure state may be always set, the positive pressure state only at the time of inspection at a low temperature, or the positive pressure state only at the time of delivery of the probe card 24 if the sealing degree is good.

  The card transport cart 60 is moved to a predetermined position in front of the door 47 as shown in FIG. At this time, the connection valve 76 of the prober 10 and the connection valve 68 of the card transport carriage 60 are combined, and the dry gas is supplied from the dry gas source 72, and from the spout 69 provided in the card cassette 63 of the card transport carriage 60. As a result, the inside of the card cassette 63 is brought into a positive pressure state with respect to the surrounding atmosphere. In this state, the door 47 of the prober 10 is opened, the door 66 of the card cassette 63 is opened, and the moving base 65 is moved to a position close to the base 74. At this time, in the prober 10, the support ring 66 on the base 74 is moved onto the wafer chuck 18, and the probe card 24 collected from the card holder 23 is removed and placed on the support ring 66 on the wafer chuck 18. The probe card 24 supported by the support ring 66 is moved on the base 74. The probe card 24 supported by the support ring 66 on the base 74 is moved onto the moving base 65, and the moving base 65 is moved into the card cassette 63. Then, as described above, the moving base 65 is moved in the lateral direction (in the drawing, the direction perpendicular to the paper surface), the moving base 65 on which the collected probe card 24 is placed is moved to the retracted position, and the probe card 24 to be mounted. Is moved to another transfer base 65 delivery position. Then, another moving base 65 is moved to a position close to the base 74, and the probe card 24 supported by the support ring 66 is further moved from the base member 74 onto the wafer chuck 18. During this time, the moving base 65 is moved into the card cassette 63, and the door of the card stocker 50 and the door 66 of the card cassette 63 are closed. The probe card 24 on the wafer chuck 18 is attached to the card holder 23 by a method similar to the conventional method.

  During the above operation, the prober 10 and the inside of the card cassette 63 are maintained in a positive pressure state in which the atmospheric pressure is higher than the surrounding atmosphere, so that the surrounding atmosphere hardly enters the inside of the card stocker 50 and the card cassette 63. . Accordingly, the inside of the card stocker 50 and the card cassette 63 is maintained in a state filled with a dry gas, and even if the wafer chuck 18 and its peripheral members are at a low temperature in the previous inspection, the dew point is caused by the dry gas. Since it is low, condensation does not occur.

  In the example of FIG. 4, since the probe card 24 is removed near the door 47 that is open to the outside air and the multi-card holder 23 is provided with a dry gas ejection port, the outside air can be more effectively removed. Intrusion into the prober 10 can be prevented.

  In the above embodiment, not only the prober but also the dry gas is jetted into the card cassette so that the inside becomes a positive pressure, but the occurrence of condensation can be reduced without making the card cassette a positive pressure. .

  At present, wafers and probe cards need to be supplied to the prober and recovered, and as described above, the wafer is supplied and recovered using a wafer cassette filled with dry gas and containing a large number of wafers. Since no outside air enters during the process, the problem of dew condensation does not occur. It is conceivable to supply and collect the probe card by a method of connecting a sealed space such as a wafer cassette. However, in order to enable this, a large-scale device is required, which not only causes a problem of an increase in cost. It cannot be applied to a prober that is already in use, because the repair will be large. On the other hand, according to the present invention, it can be realized with a simple change by utilizing the function provided in the conventional prober.

  The present invention can be applied to any prober as long as it can be inspected at a low temperature.

It is a figure which shows schematic structure of a wafer test system provided with the prober which has a wafer temperature adjustment mechanism. It is a figure which shows the whole structure of the wafer probing test system of the Example of this invention. In an Example, it is a figure explaining the delivery operation | movement of the probe card between the card stocker and the card cassette of a card conveyance carriage. In an Example, it is a figure explaining the delivery operation | movement of the probe card between a prober and the card cassette of a card conveyance trolley | bogie.

Explanation of symbols

18 Wafer chuck 24 Probe card 26 Heater 27 Chuck coolant path 28 Coolant source 30 Tester 47 Door 50 Card stocker 60 Card transport cart 63 Card cassette

Claims (7)

And a probe card having a probe that contacts an electrode of a semiconductor device formed on the wafer, a contact card that is connected to the probe and that contacts each terminal of the tester, and a cooling mechanism that cools the held wafer. In the prober, in order to attach and detach the probe card, a probe card delivery method for delivering the probe card through an openable / closable door provided in the prober,
When the inside of the prober is lower than the temperature of the prober by a predetermined temperature or more, when opening the door, a dry gas is introduced into the prober so that the pressure inside the prober is higher than the surroundings. The probe card delivery method.   2. The probe card delivery method according to claim 1, wherein delivery of the probe card is performed between a sealed box having an openable / closable door and the prober.   The probe card delivery method according to claim 2, wherein a dry gas is introduced into the box. A prober for connecting each terminal of the tester to an electrode of the semiconductor device in order to inspect a plurality of semiconductor devices formed on the wafer with a tester,
A wafer chuck for holding the wafer;
A chiller system that cools the wafer chuck and lowers the temperature of the held wafer;
Openable and closable for transferring a probe card having a probe that contacts an electrode of a semiconductor device formed on a wafer and a contact terminal that is connected to the probe and that contacts each terminal of the tester to / from the outside. Door,
A dry gas introduction mechanism for introducing a dry gas into the prober so that the pressure inside the prober is higher than the surroundings, and
A prober characterized in that when the wafer chuck is opened at a temperature lower than a predetermined temperature from the periphery of the prober, when the door is opened, a dry gas is introduced into the prober by the dry gas introduction mechanism. A prober according to claim 5;
A card stocker for accommodating the probe card;
A probe card supply / collection system comprising: a card carrier that conveys the probe card that is attached and detached between the prober and the card stocker, and delivers the probe card between the prober and the card stocker.   6. The probe card supply / collection system according to claim 5, wherein the card stocker includes a dry gas introduction mechanism that introduces a dry gas into the card stocker so that the pressure in the card stocker is higher than the surroundings.   The probe card supply / claim according to claim 5 or 6, wherein the card carrier includes a dry gas introduction mechanism for introducing a dry gas into the card carrier so that the pressure in the card carrier is higher than the surroundings. Collection system.

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