JP4959669B2 - Probe device - Google Patents

Description

  The present invention generally relates to a probe apparatus and a probe inspection method for inspecting an object to be inspected placed on a wafer-like substrate under temperature control, and more particularly, to a probe apparatus for more accurately measuring the electrical characteristics of the object to be inspected. And a probe inspection method.

  A probe device is used when inspecting electrical characteristics of an integrated circuit, a liquid crystal display device, or the like disposed on a wafer-like substrate (hereinafter referred to as “wafer”) such as a silicon substrate. As shown in FIG. 13, the conventional probe apparatus includes a probe card 14, a plurality of probes 26 provided on the probe card, a main chuck 6 for placing a wafer W, and main chucks in the X, Y, Z, and θ directions. A moving mechanism 12 for moving the object to be moved, an upper camera 39 and a lower camera 38 for aligning the object to be inspected with the probe card, a test head TH, a tester T, and the like. The main chuck 6 can be moved in a three-dimensional direction by the moving mechanism 12, and a holding mechanism for holding the wafer W is provided.

  Some of the main chucks 6 of the probe device can control the temperature of the object to be measured to a predetermined temperature. By changing the temperature condition at the time of measurement by this control, the test is performed in an environment according to the environment in which the inspected object is actually used. As such a probe device, Patent Document 1 discloses a device for controlling the temperature of a resistance heating element provided in the main chuck based on the temperature of the main chuck detected by temperature detecting means provided at the center of the main chuck. Is disclosed. This Patent Document 1 describes that the above test can be performed at a highly accurate temperature by controlling the temperature of each resistance heating element divided into a plurality of zones.

  Further, Patent Document 2 discloses a mounting surface of a main chuck divided into a plurality of regions, grooves provided in each of these divided regions, a supply / discharge path that opens in these grooves, and each of the above supply / discharges. An apparatus including a fluid supply source having excellent thermal conductivity, which is connected to a channel in a switchable manner, and an evacuation unit is disclosed. This apparatus has a structure in which heat is exchanged by supplying a fluid having excellent thermal conductivity, and a wafer is sucked and held by vacuum evacuation.

  However, since the above probe device heats or cools a relatively wide range of the main chuck, there is a problem that it is difficult to individually control the temperature of the object to be inspected. In addition, the device has a problem of large energy consumption. Further, the apparatus has a problem that the time required for temperature control is long.

Usually, in the inspection using the probe, a large needle pressure is applied from the probe to the wafer placed on the main chuck. In the conventional probe apparatus, when inspecting an object to be inspected arranged on the peripheral edge of the wafer, the result is that the main chuck 6 is tilted due to the needle pressure, as exaggeratedly shown by the one-dot chain line in FIG. There is a possibility that the probe cannot contact a predetermined position on the wafer.
JP-A-9-186112 JP 2001-230308 A

A reference example aims to provide a probe device and a probe method capable of accurately performing temperature control of an object to be inspected in probe inspection.

A reference example aims to provide a probe apparatus and a probe method capable of promptly and efficiently performing a probe test.

An object of this invention is to provide the probe apparatus which prevents that a main chuck inclines with the pressure applied with a probe.

According to a reference example , a probe apparatus is provided that inspects a plurality of objects to be inspected arranged on a wafer-like substrate under temperature control.

  A prober chamber, a stage base disposed in the prober chamber, an XY stage disposed on the stage base (the XY stage is configured to move the XY stage at least in the XY direction) -Equipped with a Y stage drive mechanism), a Z stage disposed on the XY stage (the Z stage comprises a Z stage lifting mechanism for raising and lowering the Z stage), disposed on the Z stage The main chuck (the main chuck includes a rotation drive mechanism for rotating the main chuck in the θ direction, a plurality of heating devices, a heat exchanger, and a temperature control device, and each of the plurality of heating devices includes: Each of the plurality of objects to be inspected and a size suitable for heating any one of the group of the plurality of objects to be inspected, each of the plurality of heating devices has a temperature sensor. The heat exchanger cools the object to be inspected heated by the plurality of heating devices, and the temperature control device detects each heating device and the heat exchanger based on the detection result of the temperature sensor. A probe card (the probe card is disposed opposite the main chuck in the prober chamber and has a plurality of probes).

The probe device based on the reference example may include any of the following more preferable configurations, or any combination thereof.

  Each of the plurality of heating devices has a cell structure corresponding to each of the plurality of test objects and a cell structure corresponding to a group consisting of the plurality of test objects, Each cell structure comprises a separate heat exchanger, and the temperature control device controls the temperature of each cell structure by controlling at least one of the heating device and the heat exchanger.

  The structure of the plurality of cells includes a heat insulating material for partitioning the cells.

  The main chuck is disposed on the Z stage via a θ stage, and the rotation driving mechanism rotates the main chuck in the θ direction on the θ stage.

The present invention therefore comprises a below, a probe apparatus for inspecting a plurality of inspection object disposed in the wafer-shaped substrate is provided.

A prober chamber, a stage base disposed in the prober chamber, a Z stage disposed on the stage base (the Z stage includes a Z stage lifting mechanism for raising and lowering the Z stage), and the Z stage (The XY stage has a first frame structure and has a first space at the center thereof, and the XY stage is moved at least in the X and Y directions.) XY movement drive mechanism), and a substrate fixing mechanism disposed on the XY stage (the substrate fixing mechanism has a second frame structure, and the first space and the center thereof) A second continuous space), a probe card (the probe card is disposed opposite to the main chuck in the prober chamber and has a plurality of probes), and a probe fixed on the Z stage Bing stage elevating mechanism mounted to the probing stage elevating mechanism, and probing stage (the probing stage disposed on the first space is consistent with extension of the axis thereof is suspended from the probe center of the probe card The width of the upper plane of the probing stage is set so that the inner width of the first frame structure defining the first space and the inner side of the second frame structure defining the second space are Narrower than the width , the upper plane comes into contact with the bottom surface of the substrate and supports the substrate from below when the probing stage is raised by the probing lift mechanism.

  The probe device based on the above aspect of the present invention can have any of the following more preferable configurations, or any combination thereof.

  The width of the upper plane of the probing stage corresponds to the area occupied by the tips of the probes on the probe card.

  The width of the upper plane of the probing stage is a size corresponding to the size of one object to be inspected.

  The probing stage includes a heating device for heating at least one object to be in electrical contact with the plurality of probes of the probe card among the plurality of objects to be inspected, and the temperature of these objects to be inspected. A temperature sensor is provided for measuring at least one of the temperatures of the heating device.

  The probing stage further includes a heat exchanger for cooling the object to be inspected.

  The substrate fixing mechanism includes a chuck plate, a chuck plate fixing mechanism, and a rotation driving mechanism for rotating the chuck plate fixing mechanism in the θ direction.

  The probing stage is detachably attached to the probing stage lifting mechanism.

  The chuck plate is detachably attached to the chuck plate fixing mechanism.

  The XY stage driving mechanism supports an XY stage moving mechanism that moves the XY stage at least in the XY direction on the Z stage, and an XY stage that can move smoothly on the Z stage. An XY stage support mechanism is provided.

  The XY stage moving mechanism includes a linear motor mechanism.

  The XY stage support mechanism includes an air bearing mechanism.

  The chuck plate includes at least one mechanism among a plurality of pressing member mechanisms for fixing the substrate, a mechanism for sucking and fixing the substrate, and a ring mechanism for pressing the substrate.

  According to another aspect of the present invention, there is provided a method for inspecting an object to be inspected W in a probe apparatus, comprising:

  (A) placing an object to be inspected on the chuck plate; (b) moving the XY stage in the X and Y directions by the XY stage driving mechanism; By rotating the wafer fixing mechanism, the probe card and the object to be inspected are aligned. As a result of this alignment, the object to be inspected always has an extension line whose axis is suspended from the probe center of the probe card. (C) the probing stage elevating mechanism raises the probing stage to bring the probing stage into contact with the bottom surface of the wafer; (d) A Z stage elevating mechanism raises the Z stage in the Z direction so that the object to be inspected is brought into contact with the probe; and (e) the Z stage is further moved. (D) inspecting the electrical characteristics of the object to be inspected, and (g) at least one mechanism of the Z stage elevating mechanism and the probing stage elevating mechanism. By lowering the probing stage in the Z direction, the contact between the probe, the object to be inspected and the chuck plate is released, and (h) by repeating the steps (b) to (g) above, a predetermined target object is obtained. Inspect all electrical properties of the specimen.

  It is preferable that the method further includes any one of the following configurations or a combination of any of the following configurations.

  In (f), the mechanism for overdriving the object to be inspected is at least one of the Z stage elevating mechanism and the probing stage elevating mechanism.

  The probing stage includes a heating device for heating a test object that is in electrical contact with the plurality of probes of the probe card, and the temperature of the test object and the heating device. A temperature sensor for measuring at least one of the temperatures; (f) prior to inspecting the electrical characteristics of the object to be inspected, the object to be inspected has a predetermined temperature by the heating device and the temperature sensor; Maintained.

  Furthermore, a heat exchanger for cooling the object to be inspected is provided, and (f) prior to inspecting the electrical characteristics of the object to be inspected, the object to be inspected is predetermined by the heating device, the temperature sensor, and the heat exchanger. Maintained at a temperature of

According to the reference example, the configuration includes a plurality of heating devices having a size suitable for heating each object to be inspected, a temperature sensor, a heat exchanger, and a main chuck including a temperature control device. It is possible to provide a probe device that facilitates efficient temperature control of an inspection object.

Further, according to the reference example , each of the plurality of heating devices is disposed corresponding to each of the plurality of objects to be inspected, and disposed corresponding to a group of the plurality of objects to be inspected among the plurality of objects to be inspected. The probe apparatus which makes it easy to carry out temperature control of a to-be-inspected object efficiently can be provided by the structure arrange | positioned in any of these.

Further, according to the reference example , the plurality of heating devices have a cell structure corresponding to each of the plurality of objects to be inspected, and a cell structure corresponding to a group of a plurality of objects to be inspected among the plurality of objects to be inspected, Thus, a probe device that makes it easy to efficiently control the temperature of an object to be inspected can be provided by the configuration in which any of the cell structures is provided and the temperature of each cell is controlled by the temperature control device.

In addition, according to the reference example , the structure in which the cell structure includes the heat insulating material for partitioning each other cell makes it easy to efficiently control the temperature of the object to be inspected without being affected by the temperature of the adjacent cells. A probe device can be provided.

  Further, according to the embodiment of the present invention, a wafer having a space in the center and having an XY stage having an XY movement mechanism, a substrate fixing mechanism, and a probing stage can eliminate the inclination of the main chuck. It is possible to provide a probe device that makes it easy to stably inspect even a peripheral object.

  According to the embodiment of the present invention, the probing stage is provided with a heating device, a heat exchanger, and a temperature control device, so that the tilt of the main chuck is eliminated and the inspected object at the wafer peripheral portion can be inspected stably. It is possible to provide a probe device that can easily control the temperature of an object to be inspected efficiently.

  In addition, according to the embodiment of the present invention, it is easy to efficiently control the temperature of the object to be inspected by the configuration in which the width of the upper surface of the probing stage is made to correspond to the size of one object to be inspected. A probe device can be provided.

  In addition, according to the embodiment of the present invention, it is possible to provide a probe device that makes it easy to select a probing stage suitable for an inspection object by using a configuration in which the probing stage can be replaced.

Hereinafter, a first reference example will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a main body of a probe device 100 according to a first reference example . The probe device 100 according to this reference example has a prober chamber 29. A stage base 2 is provided below the prober chamber 29. On the stage base, the XY stage 12, the Z stage 10, and the main chuck 6 are arranged side by side in the Z direction. In addition, the probe card 14 can be disposed in the upper portion of the prober chamber 29 so as to face the main chuck 6. The probe card 14 has a plurality of probes 26, and the plurality of probes 26 are used to inspect the electrical characteristics of the object to be inspected placed on the main chuck 6 . The XY stage represents a stage movable in the X and Y directions. This stage may be a combination of a structure that moves in the X direction and a structure that moves in the Y direction, or may be a structure in which one structure moves in both the X and Y directions.

  FIG. 2 is an enlarged view of a main part of the probe device of FIG. An XY stage 12 is disposed on the stage base 2 via an XY stage driving mechanism 16. The XY stage 12 includes an X stage 12a and a Y stage 12b, and the XY stage drive mechanism 16 includes an X guide rail and drive mechanism 16a and a Y guide rail and drive mechanism 16b. The XY stage 12 can be moved in the X and Y directions by an XY stage driving mechanism 16.

In this reference example , the Y stage 12b is mounted on the stage base 2 via the Y guide rail and the drive mechanism 16b, and can move along the Y guide rail. The X stage 12a is mounted on the Y stage via the X guide rail and the drive mechanism 16a, and can move along the X guide rail.

  The Z stage 10 is mounted on the X stage 12a via a Z stage lifting mechanism 31. The Z stage elevating mechanism 31 includes a Z stage guide 15 and a Z stage drive mechanism 8. The Z stage guide 15 supports a Z guide 15a that guides the elevation of the Z stage, a Z guide rail 15b that is attached to the XY stage 12 in parallel with the Z direction, and a Z guide rail 15b that is fixed to the X stage. And a reinforcing tool 15c. The Z stage drive mechanism 8 can be composed of, for example, a motor 8a disposed on the X stage, a ball screw 8b that is rotationally driven by the motor, and a nut member 8c that is fitted to the ball screw 8b and fixed to the Z stage. . When the motor 8a rotates the ball screw 8b, the nut member 8c moves up and down along the ball screw 8b. By this movement, the Z stage moves up and down along the Z guide rail 15b via the Z guide 15a. For example, a bearing or the like can be used for the Z guide 15a.

A θ stage 13 can be disposed on the Z stage. A rotation drive mechanism 17 can be disposed on the θ stage 13. Further, a main chuck 6 for placing a wafer on the θ stage 13 is disposed. The main chuck 6 is attached to the θ stage 13 via the θ guide rail 21 and is rotated along the θ guide rail 21 by the rotation drive mechanism 17. In this reference example , the rotational drive mechanism 17 is mounted on the θ stage 13, but it can also be mounted directly on the Z stage. In this case, the θ stage 13 can be omitted, but the upper plane of the Z stage is preferably enlarged.

The main chuck 6 can include a substrate fixing mechanism 23 for holding a mounted wafer. An example of the substrate fixing mechanism 23 is shown in FIG. In FIG. 3, the main chuck 6 includes, for example, a groove 23a formed on the surface thereof, and a supply / exhaust pipe 23b connected to the groove 23a. The wafer can be sucked and fixed to the surface of the main chuck 6 by evacuating the groove 23 a through the air supply / exhaust tube 23 b by the vacuum pump 22. In addition, as the substrate fixing mechanism, a suction mechanism using static electricity or a mechanical fixing mechanism can be used.

  In FIG. 2, the main chuck 6 includes a plurality of heating devices 18 for heating an object to be inspected on a wafer placed on the main chuck. Each heating device can be provided with a temperature sensor 19. Each heating apparatus has a size suitable for heating one inspection object or a group of a plurality of inspection objects, and is provided in an arrangement corresponding to the arrangement of the inspection objects on the wafer. That is, one heating device has a size corresponding to one or a group of mounted inspection objects, and is arranged so that one heating device and one or a group of inspection objects match. Thus, one heating device can accurately heat one or a group of objects to be inspected.

  Further, the main chuck 6 can include a heat exchanger 20 for cooling the object to be inspected. The heat exchanger 20 includes a fluid supply / discharge passage 20a and a fluid supply 20b, and cools the object to be inspected heated by the heating device by circulating a fluid having excellent thermal conductivity in the fluid supply / discharge passage 20a. To do. Further, when inspecting the electrical characteristics of an integrated circuit that generates heat at a high temperature, the heat exchanger 20 can be used to prevent overheating of the device under test.

In addition, the probe device according to this reference example includes a temperature control device 27. The temperature control device is connected to each heating device 18, temperature sensor 19, and heat exchanger 20. The temperature control device 27 can control at least one of the respective heating devices or heat exchangers based on the detection result of the temperature sensor 19 to bring the object to be inspected to a predetermined temperature.

In FIG. 4, the principal part of the probe apparatus 100 in a 2nd reference example is shown. In the second reference example , in addition to the probe device 100 of the first reference example , the heating device provided in the main chuck has a cell structure 9. Each cell structure 9 can be equipped with a heating device, a temperature sensor, and a heat exchanger. The temperature control device 27 is connected to the heating device 18, the temperature sensor 19, and the heat exchanger 20 of each cell, and can control the temperature of each cell individually based on the detection result of the temperature sensor.

  A cross-sectional view of the main chuck 6 taken along line AA in FIG. 4 is shown in FIG. Each cell structure 9 preferably has an arrangement corresponding to the arrangement of the objects to be inspected placed on the main chuck 6 or an arrangement corresponding to an arrangement of a group of a plurality of objects to be inspected. That is, one cell or a plurality of cells are arranged so as to match one or a group of objects to be inspected placed on the main chuck. Since each cell is provided with a heating device, a temperature sensor, and a heat exchanger, one or a group of objects to be inspected can be accurately heated or cooled. Furthermore, each cell structure 9 is provided with the heat insulating material 40 for partitioning each other, so that the object to be inspected can be controlled to a predetermined temperature in an environment that is hardly affected by the temperature of the adjacent cells.

Next, operations of the first and second reference examples will be described. In FIG. 1, a wafer W taken out from the cassette C by a transfer mechanism (not shown) is moved onto the main chuck 6 and placed thereon. After the substrate fixing mechanism 23 fixes the wafer, the wafer is aligned using the upper and lower cameras 39, 38 provided in the prober chamber 29. The wafer is aligned by moving the Y stage 12b according to the Y guide rail 16b and moving the X stage 12a according to the X guide rail 16a. The alignment in the θ direction is performed before and after the alignment in the X and Y directions. The alignment in the θ direction is performed by the rotation drive mechanism 17 rotating the main chuck 6 according to the θ guide rail 17b.

  After the alignment of the wafer is completed and the Z stage 10 is raised, the probe and the wafer come into contact with each other. After this contact, the inspection is started with the Z stage further raised and overdriven. The temperature control of the object to be inspected by the temperature control device is performed immediately before the inspection or in the middle of alignment, and after the object reaches the predetermined temperature, the electrical characteristics of the object to be inspected are inspected using a probe. The

FIG. 6 shows a main part of the probe apparatus 100 in the first embodiment of the present invention. The probe apparatus according to the first embodiment includes a stage base 2 at a lower portion of a prober chamber 29, and a Z stage 10 is mounted thereon via a Z stage lifting mechanism 31. Unlike the first reference example , the Z stage elevating mechanism 31 can be disposed on the stage base 2, but the other configurations and operations are the same as those of the first reference example . As shown in FIGS. 6 and 7, the Z stage drive mechanism 8 constituting the Z stage elevating mechanism 31 can be provided at one place in the center of the stage base 2. However, as shown in FIGS. It can also be provided.

  In FIG. 6, an XY stage 12 is disposed on the Z stage 10. This XY stage includes an XY stage drive mechanism 16 and can move in the X and Y directions on the Z stage. The XY stage driving mechanism 16 supports the XY stage moving mechanism 16c that moves the XY stage in the XY direction on the Z stage, and the XY stage so that the XY stage can move smoothly on the Z stage. An XY stage support mechanism 16d can be provided. As the XY stage moving mechanism 16c, for example, a linear motor mechanism can be adopted. Further, as the XY stage support mechanism 16d, for example, an air bearing mechanism or the like can be adopted. The XY stage drive mechanism 16 may be provided between the Z stage and the XY stage, but may be incorporated in each of the Z stage and the XY stage and may be configured integrally with each stage. . In the present embodiment, an LMSP manufactured by HIWIN CORPORATION can be used as the XY stage driving mechanism 16 by improving it. The LMSP is a linear motor type control system provided with an air bearing. The stage driving mechanism 16 adopting LMSP blows up compressed air from the lower surface of the stage, thereby slightly floating the stage and supporting it. In this state, the linear motor mechanism provided in the stage moves the stage in the X and Y directions.

  The XY stage 12 has a frame-like structure having a space at the center, and this can be a first frame-like structure, and the center space can be a first space 11a. The first frame-like structure is particularly preferably an annular structure. A substrate fixing mechanism 23 for holding the wafer is provided on the XY stage 12. The substrate fixing mechanism 23 also has a frame-like structure, which can be a second frame-like structure. A space that is at the center of the second frame-like structure and continues to the first space can be used as the second space 11b. The substrate fixing mechanism 23 can include a chuck plate 5 for holding the wafer and a chuck plate fixing mechanism 4 to which the chuck plate is fixed in order to hold the wafer in an arrangement covering the second space 11b. Both the chuck plate 5 and the chuck plate fixing mechanism 4 or at least the chuck plate 5 preferably have a frame-like structure, and this frame-like structure preferably has an annular structure. The chuck plate fixing mechanism 4 can be attached to the XY stage via the θ guide rail 21, and can be rotated in the θ direction by the rotation driving mechanism 17 that is also arranged on the XY stage.

  The wafer W is held on the chuck plate 5. The chuck plate 5 has a structure for holding the wafer W, and an example of the structure is shown in FIGS. 10 to 12b. FIG. 10 shows an embodiment of the chuck plate, and a pressing tool 34 rotatably attached to the chuck plate by a hinge 37 fixes the wafer placed on the chuck plate. The presser 34 can be manually moved up and down, but can also be automated. When the upper and lower parts of the presser 34 are automated, the wafer is placed on the chuck plate 5 in a state where the presser 34 is raised by the drive mechanism 30, and then the wafer is fixed by the drive mechanism lowering the presser. The The presser 34 can be provided at a plurality of locations on the chuck plate 5. FIG. 11 shows another embodiment of the chuck plate 5. The chuck plate 5 includes an intake / exhaust port 36 and an intake / exhaust pipe 35 therein. When the wafer is placed on the chuck plate, the vacuum pump 22 evacuates the intake / exhaust port 36 and the intake / exhaust pipe 35 so that the wafer can be sucked and fixed to the chuck plate.

  12a and 12b show still another embodiment, and the wafer is fixed by a ring-shaped member 33 as shown in FIG. 12b. The ring-shaped member 33 has struts 32 at a plurality of positions on the outer periphery, preferably at two positions. The support column 32 is disposed on the chuck plate 5 so as to be movable up and down. FIG. 12 a is a cross-sectional view of the chuck plate 5 having the ring-shaped member 33. The wafer is placed on the chuck plate 5 with the drive mechanism 30 lifting the support 32. Thereafter, when the drive mechanism 30 lowers the support 32, the ring-shaped member 33 presses the wafer, and the wafer can be fixed on the chuck plate.

  In the above embodiments, the chuck plate 5 is fixed to the chuck plate fixing mechanism 4, but it can be detachably attached. In that case, the chuck plate 5 on which the wafer is fixed beforehand outside the probe device can be attached to the chuck plate fixing mechanism 4. A probe card 14 having a plurality of probes 26 is arranged in the upper portion of the prober chamber so as to face the wafer W placed on the chuck plate 5.

As shown in FIG. 6, the probing stage 3 is disposed on the Z stage in the first space 11a and the second space 11b. The probing stage 3 is preferably arranged so that its axis coincides with an extended line depending from the probe center of the probe card 14. The probing stage 3 can be provided with a probing stage elevating mechanism 24 for elevating the probing stage 3 at the lower part thereof. When the probing stage 3 is raised by the probing stage lifting mechanism, the upper flat surface 3 a of the probing stage comes into contact with the bottom surface of the wafer W fixed to the chuck plate 5. The probing stage 3 supports the wafer from below by contacting the wafer W during probe inspection. Therefore, the upper part of the probing stage 3 is a plane. The width of the upper flat surface 3a of the probing stage 3 is defined as the inner width of the first frame structure (XY stage 12) that defines the first space 11a and the second frame that defines the second space 11b. The size is narrower than the area inside the structure (substrate fixing mechanism 23) and corresponds to the area occupied by the tips of a plurality of probes of the probe card, that is, the maximum area that can be inspected at one time. Here, the corresponding size means wider than the region.

  The probing stage lifting mechanism 24 moves the probing stage 3 up and down. The probing stage raising / lowering mechanism 24 is fixed on the Z stage, and can be composed of, for example, a motor 24a, a ball screw member 24b fixed to the motor 24a, and a nut member 24c fixed to the probing stage 3. . The ball screw member 24b is screwed into the nut member 24c. As the motor 24a rotates the ball screw 24b, the probing stage 3 moves up and down. The motor 24a can be arranged on the Z stage 10 as shown in FIGS. 6 to 8, but it can also be arranged inside the Z stage 10 as shown in FIG.

Next, the operation of the first embodiment will be described. In FIG. 6, the wafer W taken out from the cassette C by the transfer mechanism (not shown) is placed on the chuck plate 5 (a). When the chuck plate 5 fixes the wafer, the alignment of the object to be inspected is performed by the alignment means and the XY stage driving mechanism 16 that moves the XY stage 12 in the X and Y directions (b1). At this time, since the probing stage 3 and its lifting mechanism 24 are fixed to the Z stage 10, they do not move. Subsequently, while the rotation driving mechanism 17 rotates the wafer fixing mechanism 23, the position in the θ direction is determined in cooperation with the alignment mechanism (b2). When the positions in the X, Y, and θ directions are determined, the probing stage 3 is raised by the elevating mechanism 24, and the upper plane of the probing stage 3 contacts the bottom surface of the wafer W (c). When the Z stage elevating mechanism 31 raises the Z stage 10, the object to be inspected comes into contact with the probe (d). From this state, the wafer W is overdriven toward the probe card by further raising at least one of the Z stage elevating mechanism 31 or the probing stage elevating mechanism 24 (e). In this state, the inspection object is inspected (f). After the inspection is completed, the overdrive is released by lowering at least one of the Z stage elevating mechanism 31 or the probing stage elevating mechanism 24, and the Z stage elevating mechanism 31 lowers the Z stage 10 to inspect from the probe. Release the body (g1). Subsequently, the elevating mechanism 24 slightly lowers the probing stage 3 and separates the upper plane from the bottom surface of the wafer (g2). Then, alignment for the inspection object to be inspected next is performed again, and the next inspection object is inspected by the same procedure.

  The alignment in the X, Y, and θ directions is not limited to the order described above, and can be performed from any alignment. In the above method, the overdrive is performed by raising the Z stage 10, but when the probing stage 3 is in contact with the wafer W and the inspection object is in contact with the probe 26, the lifting mechanism 24 is It is also possible to perform overdrive by further raising the probing stage 3.

  Since the probing stage 3 is fixed on the stage base via a probing stage lifting mechanism, the inspection center of the probe card is always supported by the probing stage 3. Accordingly, the tilt of the main chuck 6 which is a problem in the conventional probe apparatus is prevented, and a stable probe inspection can be performed even on an object to be inspected located on the peripheral edge of the wafer.

7 to 9 show the main part of the probe apparatus 100 according to the second embodiment of the present invention. In the second embodiment, the probing stage 3 of the probe apparatus 100 of the first embodiment is provided with a mechanism for controlling the temperature of the object to be inspected. The probing stage 3 according to the present embodiment includes a heating device 18 below the upper surface of the probing stage 3, and further includes a temperature sensor 19 and a heat exchanger 20. The heating device 18 and the heat exchanger 20 respectively heat and cool a plurality of objects to be inspected with which the plurality of probes 26 of the probe card 14 are in electrical contact, and the temperature sensor measures the temperature of a predetermined object to be inspected. The predetermined object to be inspected is preferably an individual object to be inspected with which the probe is in electrical contact. Furthermore, as in the first and second reference examples , the probe device according to this embodiment also includes a temperature control device 27. The temperature control device 27 controls the heating device and the heat exchanger based on the detection result of the temperature sensor 19 to bring the object to be inspected or the heating device 18 to a predetermined temperature.

One or more heating devices 18 may be provided in the probing stage 3. When there are a plurality of heating devices, the cell structure 9 can be provided as in the second reference example . Moreover, the temperature sensor 19 and the heat exchanger 20 can be provided with the same number as the heating apparatus 18. FIG. The area of the upper plane of the probing stage 3 is preferably approximately the same as the size of one inspection object or a group of inspection objects to be inspected at a time. With such a configuration, it is possible to control the temperature of only the object to be inspected, and to shorten the time for raising the temperature of the object to be inspected. It also makes it possible to reduce energy consumption and loss.

  The probing stage 3 can be made of a metal having excellent thermal conductivity such as aluminum and is detachably attached to the probing stage lifting mechanism. Accordingly, it is possible to replace the inspection object with one having an optimum size. When exchanging the probing stage 3, the nut member 24c fixed to the probing stage can be removed from or attached to the ball screw 24b.

The operation of the second embodiment will be described based on the operation of the first embodiment . After the step (e) of overdriving the wafer W toward the probe card, the object to be inspected is heated and maintained at a predetermined temperature by a heating device, a temperature sensor and a heat exchanger provided in the probing stage 3 ( T). The temperature control of the object to be inspected may be performed before the overdrive step (e). After the temperature of the object to be inspected reaches a predetermined temperature, an inspection (f) of the electrical characteristics of the object to be inspected is performed. The operation of the first and second embodiments is shown in the flowchart of FIG.

  The probing stage 3 as in the above embodiment has excellent advantages such as the ease of manufacture and use with less warping and deflection of the plane because the upper plane has a limited area compared to the conventional main chuck. Make it easy. Further, it is easy to reduce variations in the temperature distribution on the surface of the probing stage 3. Further, in the above embodiment, since the volume of the probing stage 3 is relatively small and the number of heating devices is small, heat loss when heating the object to be inspected can be suppressed, and the object to be inspected can be heated quickly. In addition, when the object to be inspected is cooled, it can be easily cooled quickly without being disturbed by the residual heat of the heating device.

Probe device according to the first reference example . An example of the principal part of the probe apparatus of a 1st reference example . An example of a wafer suction fixing mechanism. The other example of the principal part of the probe apparatus of a 2nd reference example . FIG. 5 is a cross-sectional view of the main chuck 6 taken along line AA in FIG. 4. Examples of the main part of the probe apparatus of the first embodiment of the present invention. The other example of the principal part of the probe apparatus of 2nd Example of this invention. The other example of the principal part of the probe apparatus of 2nd Example of this invention. The other example of the principal part of the probe apparatus of 2nd Example of this invention. An example of a wafer fixture. Another example of a wafer fixture. It is another example of a wafer fixing tool, (a) is sectional drawing, (b) is a ring which fixes a wafer. Conventional probe device. The schematic diagram which illustrated the inclination of the main chuck in the conventional probe apparatus. The flowchart at the time of test | inspecting a to-be-inspected object using the probe apparatus by one Example of this invention.

Explanation of symbols

  2 ... stage base, 3 ... probing stage, 4 ... chuck plate fixing mechanism, 5 ... chuck plate, 6 ... main chuck, 7 ... Z unit, 9 ... cell structure, 10 ... Z stage, 12 ... XY stage, 13 ... Θ stage, 14 ... probe card, 16 ... XY stage drive mechanism, 17 ... rotary drive mechanism, 18 ... heating device, 19 ... temperature sensor, 20 ... heat exchanger, 21 ... θ guide rail, 23 ... substrate fixing Mechanism: 24 ... probing stage lifting mechanism, 25 ... fluid supply / discharge passage, 27 ... temperature control device, 28 ... fluid feeder, 29 ... prober chamber, 31 ... Z stage lifting mechanism.

Claims (12)

A probe apparatus for inspecting a plurality of objects to be inspected arranged on a wafer-like substrate, the probe apparatus includes:
Prober room;
An XY stage disposed in the prober chamber, the XY stage having a first frame structure and having a first space at the center thereof, the XY stage being the XY stage An XY drive mechanism for moving at least in the X and Y directions;
A substrate fixing mechanism disposed on the XY stage, and the substrate fixing mechanism has a second frame structure, and has a second space continuous with the first space at the center thereof;
A probe card disposed in the prober chamber so as to face the wafer-like substrate and having a plurality of probes;
A probing stage elevating mechanism disposed in the first space;
A probing stage attached to the probing stage lifting mechanism, the probing stage comprises:
The probing stage is arranged such that its axis coincides with an extension line hanging from the probe center of the probe card;
The width of the upper plane of the probing stage and the upper plane is defined as the width inside the first frame structure defining the first space and the width inside the second frame structure defining the second space. The upper flat surface is in contact with the bottom surface of the substrate and supports the substrate from below when the probing stage is raised by the probing lift mechanism.   The probe apparatus according to claim 1, wherein a width of an upper plane of the probing stage corresponds to a region occupied by tips of a plurality of probes of the probe card.   The probe apparatus according to claim 1, wherein an area of an upper plane of the probing stage is a size corresponding to a size of one object to be inspected.   The probing stage includes a heating device for heating at least one object to be in contact with a plurality of probes of the probe card among the plurality of objects to be inspected, and temperatures of these objects to be inspected. The probe apparatus of claim 1, comprising a temperature sensor for measuring at least one of the temperatures of the heating device.   The probe apparatus according to claim 1, wherein the probing stage further includes a heat exchanger for cooling the object to be inspected.   The probe apparatus according to claim 1, wherein the substrate fixing mechanism includes a chuck plate, a chuck plate fixing mechanism, and a rotation driving mechanism for rotating the chuck plate fixing mechanism in the θ direction.   The probe apparatus according to claim 1, wherein the probing stage is detachably attached to a probing stage elevating mechanism.   The probe apparatus according to claim 6, wherein the chuck plate is detachably attached to the chuck plate fixing mechanism. The prober chamber includes a stage base and a Z stage disposed on the stage base,
The XY stage drive mechanism moves the XY stage on the Z stage at least in the XY direction, and smoothly moves the XY stage on the Z stage. The probe apparatus of Claim 1 provided with the XY stage support mechanism supported so that it is possible.   The probe apparatus according to claim 9, wherein the XY stage moving mechanism includes a linear motor mechanism.   The probe apparatus according to claim 9, wherein the XY stage support mechanism includes an air bearing mechanism. The probe according to claim 1 , wherein the chuck plate includes at least one of a plurality of pressing member mechanisms for fixing the substrate, a mechanism for sucking and fixing the substrate, and a ring mechanism for pressing the substrate. apparatus.

Images