JP2008078217A - Mounting apparatus and method of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting apparatus for shortening a tact time required for mounting a semiconductor chip. <P>SOLUTION: The electronic component mounting apparatus is provided with a mounting tool 31 that is driven in the horizontal and vertical directions, a wafer table 11 for supplying semiconductor chips picked up with the mounting tool provided to be driven in the horizontal direction, a chip camera 25 for picking up the semiconductor chip positioned at the pickup position by the wafer table, a substrate camera 39 for picking up the substrate 5 positioned at a predetermined position for transfer, and a controller for mounting the semiconductor chip on the substrate by positioning the mounting tool on the basis of pickup of the substrate image with the substrate camera after positioning the mounting tool at the pickup position and then picking up the semiconductor chip based on the pickup of the semiconductor chip by the chip camera. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for mounting an electronic component picked up from a component supply unit by a mounting tool on a substrate.

  A mounting apparatus for mounting electronic components on a substrate has a mounting tool. This mounting tool is driven in the X, Y direction (horizontal direction) and Z direction (vertical direction) by the driving means. The mounting apparatus is provided with a wafer table as a component supply unit driven in the horizontal direction.

  A wafer ring having a sheet with a semiconductor wafer attached thereto is supplied to the wafer table. The semiconductor wafer is divided into a large number of semiconductor chips as electronic components in a matrix, and is separated at a predetermined interval by the sheet being stretched.

  A component camera is disposed above the wafer table. The wafer table is driven based on movement amounts in the X direction and Y direction set in advance according to the arrangement interval of the semiconductor chips, and a predetermined semiconductor chip is positioned at the pickup position.

  When the sheet is stretched to form a predetermined gap between adjacent semiconductor chips, the stretch amount is not uniform in the X direction and the Y direction due to the directionality of the sheet, or even in the same X direction or Y direction, In some cases, the amount of elongation of the sheet is not uniform between the central portion and the peripheral portion of the wafer ring.

  Therefore, even if the semiconductor chip is positioned at the pickup position based on a preset movement amount, the semiconductor chip may not be accurately positioned at the regular pickup position because the amount of sheet stretching is not constant.

  Therefore, if the semiconductor chip is positioned at the pickup position based on a preset movement amount, the semiconductor chip is imaged by the component camera, and the wafer table is driven again in the X direction and the Y direction based on the imaging. The position is corrected, and the semiconductor chip is precisely positioned at the regular pickup position.

  When the semiconductor chip is positioned at the regular pickup position, the mounting tool is driven above the pickup position and then lowered to pick up the positioned semiconductor chip. Since the mounting tool is driven in the X and Y directions based on a preset regular pickup position, the center is precisely positioned above the regular pickup position.

  The mounting tool that picks up the semiconductor chip is positioned above the mounting position for mounting the semiconductor chip on the substrate based on the imaging signal from the substrate camera that images the substrate, and then driven in the downward direction. Thereby, the semiconductor chip is mounted at the mounting position of the substrate.

A mounting apparatus for mounting such a semiconductor chip is disclosed in Patent Document 1. Note that Patent Document 1 is a so-called flip chip bonder in which the upper and lower surfaces of the picked-up semiconductor chip are reversed and mounted, whereas the mounting apparatus described in [Background Art] reverses the upper and lower surfaces of the picked-up semiconductor chip. It is different in that it is a so-called die bonder that is mounted without any problems.
JP 2004-103603 A

  By the way, the mounting apparatus described above moves the wafer table based on a preset movement amount, positions the picked-up semiconductor chip at the pick-up position, and then picks up the semiconductor chip with a component camera to obtain a regular one. A positional deviation amount with respect to the pickup position is obtained, and the wafer table is driven again in the X and Y directions based on the positional deviation amount to position the semiconductor chip at a regular pickup position.

  On the other hand, in order to improve productivity, the wafer table is driven at a high speed. However, if the wafer table is driven based on a preset amount of movement and then driven again based on the imaging of the component camera to position the semiconductor chip at the regular pickup position, the wafer table that is driven and positioned at a high speed is It may take some time for the vibration to converge.

  For this reason, the semiconductor chip cannot be picked up from the regular pick-up position by the mounting tool unless the vibration of the driven wafer table is settled, so that the tact time required for pick-up becomes long and the productivity is lowered. There was a thing.

  In addition, when the wafer table is driven based on the imaging of the component camera, a minute distance is driven at a high speed. For this reason, the load applied to the driving parts such as the bearings of the wafer table is increased with the high-speed driving at a minute distance, which may cause the driving parts to be damaged early.

  According to the present invention, the wafer table is driven based on a preset amount of movement, and then the wafer table is micro-driven again based on the imaging of the component imaging means that images the picked-up electronic component. Another object of the present invention is to provide a mounting apparatus and a mounting method capable of precisely mounting the electronic component on the mounting position of the substrate.

The present invention is a mounting apparatus for mounting electronic components on a substrate,
A mounting tool that is driven horizontally and vertically;
A component supply unit that supplies the electronic component that is provided so as to be driven in the horizontal direction and is picked up by the mounting tool;
Component imaging means for imaging the electronic component positioned at the pickup position by the component supply unit;
Substrate imaging means for imaging the substrate transported and positioned at a predetermined position;
Based on the imaging of the electronic component by the component imaging means, the mounting tool is positioned at the pickup position to pick up the electronic component, and then the imaging of the substrate by the board imaging means and the electronic by the component imaging means are performed. An electronic component mounting apparatus comprising: control means for positioning the mounting tool on the basis of imaging of the component and mounting the electronic component on the substrate.

The present invention is a mounting apparatus for mounting electronic components on a substrate,
A mounting tool that is driven horizontally and vertically;
A component supply unit that supplies the electronic component that is provided so as to be driven in the horizontal direction and is picked up by the mounting tool;
Component imaging means for imaging the electronic component positioned at the pickup position by the component supply unit;
Substrate imaging means for imaging the substrate transported and positioned at a predetermined position;
The mounting position for picking up the electronic component by the mounting tool and mounting the electronic component on the substrate based on the imaging of the electronic component by the component imaging unit and the imaging of the substrate by the substrate imaging unit And a control means for mounting the electronic component on the substrate by positioning the electronic component on the board.

  When positioning the electronic component picked up by the component supply unit at the pickup position, it is preferable to correct the position shift amount of the electronic component calculated at the previous positioning and position the electronic component picked up this time at the pickup position. .

This invention is a mounting method for mounting an electronic component on a substrate,
Positioning the electronic component at the pickup position;
Imaging the positioned electronic component, and calculating a positional deviation amount with respect to a regular pickup position based on the imaging;
Correcting the mounting tool for picking up the electronic component based on the calculation of the positional deviation amount of the electronic component to the pickup position to pick up the electronic component;
Imaging the substrate;
Mounting the electronic component by positioning a mounting tool that picks up the electronic component on the basis of the imaging of the substrate and the imaging of the electronic component with respect to the substrate, and mounting the electronic component Is in the way.

This invention is a mounting method for mounting an electronic component on a substrate,
Positioning the electronic component at the pickup position;
Imaging the positioned electronic component, and calculating a positional deviation amount with respect to a regular pickup position based on the imaging;
A step of picking up the electronic component by a mounting tool;
Imaging the substrate;
Positioning a mounting tool that picks up the electronic component based on the calculation of the amount of positional deviation of the electronic component and imaging of the substrate, and mounting the electronic component on the mounting position of the electronic component mounted on the substrate; An electronic component mounting method characterized by comprising:

The electronic component is positioned at the pickup position based on a preset movement amount,
The positioning is preferably performed by correcting the positional deviation amount of the electronic component positioned at the pickup position at the previous mounting and positioning the electronic component picked up this time at the pickup position.

  According to the present invention, if the electronic component is positioned at a preset pickup position, even if the electronic component is deviated from the normal pickup position, the electronic component is high on the substrate without correcting the deviation. Can be implemented with accuracy. This eliminates the need for correcting the position of the electronic component at the time of pick-up, thereby reducing the tact time required for mounting.

Embodiments of the present invention will be described below with reference to the drawings.
The mounting apparatus shown in FIG. A transport rail 2 in which a pair of L-shaped members are arranged in parallel is provided along the width direction at the center in the front-rear direction of the apparatus main body 1. A substrate supply unit 3 is provided at one end of the transport rail 2, and a substrate recovery unit 4 is provided at the other end.

  Substrate 5 is sent from the substrate supply unit 3 to the transport rail 2 one by one by a pusher (not shown). The substrate 5 sent to the transport rail 2 is pitch-fed and positioned by a feed mechanism 6 shown in the block diagram of FIG. 5, and a semiconductor chip 23 as an electronic component to be described later is placed at a mounting position of the substrate 5 at a predetermined position. Implemented. As will be described later, the substrate 5 on which the semiconductor chip 23 is mounted is stored in the substrate recovery unit 4.

  A wafer table 11 serving as a component supply unit is provided in front of the transfer rail 2 of the apparatus main body 1. The wafer table 11 can be driven in the horizontal direction, that is, the X and Y directions. That is, the apparatus main body 1 is provided with a base table 12. The base table 12 is provided with an X table 13. The X table 13 is driven in the X direction by a first X drive source 14 provided on the base table 12.

  As shown in FIG. 2, a support 15 is provided on the X table 13 so as to be movable in the Y direction, and the wafer table 11 is provided on the support 15. The support 15 is driven along the Y direction by a first Y drive source 16 provided on the X table 13. Thereby, the wafer table 11 can be driven in the X and Y directions together with the support 15.

  As shown in FIG. 1, in the apparatus main body 1, a cassette 17 is provided on one side of the wafer table 11 so as to be positioned in the vertical direction by a vertical drive mechanism 18 shown in FIG. A plurality of wafer rings 19 shown in FIG. 4 are accommodated in the cassette 17 at predetermined intervals in the vertical direction. Of the wafer rings 19 stored in the cassette 17, the wafer ring 19 positioned at a predetermined height is taken out from one side by a take-out mechanism (not shown) and supplied onto the wafer table 11.

  As shown in FIG. 4, a resin sheet 21 is stretched over the wafer ring 19. A semiconductor wafer 22 indicated by a chain line in FIG. The semiconductor wafer 22 is divided into a number of ridge-like semiconductor chips 23, and the resin sheet 21 is stretched to be stretched on the wafer ring 19, so that the adjacent semiconductor chips 23 are separated from each other at a predetermined interval. It is separated by.

  As shown in FIG. 2, a chip camera 25 is disposed above the wafer table 11 as component imaging means for imaging a semiconductor chip 23 picked up by a mounting tool 31 described later. In this chip camera 25, the optical center is made to coincide with the center of the semiconductor chip 23 positioned at the regular pickup position. The imaging signal of the chip camera 25 is output to the image processing unit 26 shown in FIG.

  The control device 27 drives the wafer table 11 based on preset positioning data. Thereby, the plurality of semiconductor chips 23 held on the wafer ring 19 are sequentially positioned at the pickup position.

  The semiconductor chip 23 positioned at the pickup position is imaged by the chip camera 25. The imaging signal of the chip camera 25 is processed by the image processing unit 26 and output to the control device 27.

The control device 27 is an optical center of the chip camera 25, that is, a normal pickup position (X _p0 , Y _p0 ), which is a normal pickup position, and a semiconductor chip 23 driven to the pickup position based on preset positioning data. A deviation amount (ΔX _p , ΔY _p ) with respect to the center coordinates (X _P1 , Y _P1 ) is calculated.

That is, even if the semiconductor chip 23 is positioned based on the positioning data set in advance, the center coordinates of the semiconductor chip 23 are caused by the non-uniform elongation of the resin sheet 21 when stretched on the wafer ring 19 as described above. In (X _P1 , Y _P1 ), the deviation (ΔX _p , ΔY _p ) occurs with respect to the regular pickup coordinates (X _p0 , Y _p0 ).

  A mounting tool 31 for picking up the semiconductor chip 23 positioned at the pick-up position is located in a position corresponding to the wafer table 11 across the transport rail 2 in the X and Y directions which are horizontal and the Z direction which is vertical. It is provided so that it can be driven.

  That is, a base table 32 is provided in the apparatus main body, and an X table 33 is provided on the base table 32 so as to be movable along the X direction. The X table 33 is driven in the X direction by a second X drive source 34 provided on one side of the base table 32.

  The X table 33 is provided with a Y movable body 35 movably along the Y direction. The Y movable body 35 is driven in the Y direction by a second Y drive source 36 provided on one side of the X table 33.

  A base end of an arm 41 is fixed to the Y movable body 35, and a mounting head 38 that is driven in the Z direction by a Z drive source 37 is provided at the tip of the arm 41. The mounting head 31 is provided with the mounting tool 31 with the axis line vertical. Therefore, the mounting tool 31 is driven in the X, Y, and Z directions.

  A substrate camera 39 as a substrate imaging means for imaging the substrate 5 is disposed above the substrate 5 which is transported by the transport rail 2 and positioned at a predetermined position. The substrate camera 39 images an alignment mark (not shown) provided on the substrate 5 and outputs the image signal to the image processing unit 26.

The image processing unit 26 processes an imaging signal from the substrate camera 39 and outputs the processed image signal to the control device 27. The control device 27 calculates the center coordinates (X _b0 , Y _b0 ) of the alignment mark positioned on the transport rail 2 based on the imaging signal from the board camera 39. Then, mounting coordinates (X _b1 , Y _b1 ) of the semiconductor chip 23 mounted on the substrate 5 are calculated from the center coordinates (X _b0 , Y _b0 ) of the alignment mark.

  As shown in FIG. 5, the first X drive source 14, the first Y drive source 16, and the mounting tool 31 that drive the wafer table 11 in the X and X directions are driven in the X, Y, and Z directions. The second X drive source 34, the second Y drive source 36, the Z drive source 37, and the vertical drive mechanism 18 that drives the cassette 17 in the vertical direction are controlled by the control device 27. .

  Next, a procedure for mounting the semiconductor chip 23 on the substrate 5 by the mounting apparatus having the above configuration will be described.

The wafer table 11 is driven in the X and Y directions based on preset positioning data, and the semiconductor chip 23 to be picked up is positioned at the pick-up position. Then, the semiconductor chip 23 positioned in the pickup position by the chip camera 25 is captured, if the center coordinates (X _{P1, Y P1)} is calculated, the center coordinates (X _P1 of the semiconductor chip 23 based on the calculation , Y _P1 ) and the deviation amount (ΔX _p , ΔY _p ) between the regular pickup coordinates (X _p0 , Y _p0 ) are calculated.

Next, the mounting tool 31 is driven in the X and Y directions, and the center coordinates (X _P1 ) of the semiconductor chip 23 positioned by correcting the position based on the shift amount (ΔX _p , ΔY _p ) during the driving. , Y _P1 ).

The mounting tool 31 is usually positioned above the normal pickup coordinates (X _p0 , Y _p0 ). However, as described above, the deviation (ΔX _p , ΔY _p ) between the center coordinates (X _P1 , Y _P1 ) of the semiconductor chip 23 positioned at the pickup position and the regular pickup coordinates (X _p0 , Y _p0 ). Therefore, the driving amount of the mounting tool 31 in the X and Y directions is corrected according to the amount of deviation.

As a result, the mounting tool 31 is positioned with its axis aligned with the center coordinates (X _P1 , Y _P1 ) of the semiconductor chip 23 positioned so as to deviate from the normal pickup coordinates (X _p0 , Y _p0 ).

If the mounting tool 31 is positioned in this manner, the mounting tool 31 is driven in the downward direction, and if the semiconductor chip 23 is sucked, it is driven in the upward direction. Next, the mounting tool 31 is positioned above the mounting position (X _b1 , Y _b1 ) of the semiconductor chip 23 on the substrate 5 calculated based on the imaging of the substrate camera 39 and the imaging of the chip camera 25, and then in the downward direction. Driven. As a result, the semiconductor chip 23 sucked and held by the mounting tool 31 is mounted at the mounting position of the substrate 5.

Next, when the semiconductor chip 23 is mounted on the substrate 5, the amount of deviation from the normal pickup coordinates (X _p0 , Y _p0 ) of the semiconductor chip 23 calculated based on imaging by the chip camera 25 at the previous pickup. (ΔX _p , ΔY _p ) is negative, that is, the semiconductor chip 23 to be picked up after being corrected is positioned at the pickup position based on preset position data. That is, positioning is performed based on the previous deviation amount (ΔX _p , ΔY _p ) and the calculated next deviation amount.

This prevents the amount of deviation in the X and Y directions of the semiconductor chips 23 sequentially positioned at the pickup position from being added sequentially, so that the normal pickup coordinates (X _The shift amount with respect to ( _p0 , _Yp0 ) is prevented from gradually increasing.

If the semiconductor chip 23 is mounted on the substrate 5 in this way, the semiconductor chip 23 to be picked up by driving the wafer table 11 in the X and Y directions based on the positioning data set in advance is positioned at the pickup position. At this time, the center coordinates (X _P1 , Y _P1 ) of the semiconductor chip 23 with respect to the regular pick-up coordinates (X _p0 , Y _p0 ) due to non-uniform elongation of the resin sheet 21 to which the semiconductor chip 23 is adhered. Even if there is a deviation, the deviation amount (ΔX _p , ΔY _p ) is corrected when the mounting tool 31 for picking up the semiconductor chip 23 is driven to the pickup position and when it is driven from the pickup position to the mounting position.

  Therefore, it is not necessary to drive the wafer table 11 twice as in the prior art, so that not only can the tact time be shortened and productivity can be improved, but also the wafer table 11 can be made minute. Since it is not necessary to drive, it is possible to prevent early damage of the drive components.

In the above embodiment, when the semiconductor chip 23 is picked up by the mounting tool 31, the semiconductor chip 23 positioned at the pick-up position is picked up by the chip camera 25, and the normal pick-up coordinates (X _p0 , Y _{p0) of the} semiconductor chip 23 are taken. ) And the center coordinates (X _P1 , Y _P1 ) of the semiconductor chip 23 are calculated (ΔX _p , ΔY _p ).

  Then, the mounting tool 31 is corrected in the X and Y directions based on the calculated shift amount and positioned at the pickup position, whereby the axis of the mounting tool 31 is shifted from the normal pickup position. The semiconductor chip 23 is picked up in accordance with the coordinates, and the shift amount at the time of picking up is corrected when driving from the pick-up position to the mounting position.

  However, when the stretch amount of the resin sheet 21 holding the semiconductor chip 23 on the wafer ring 19 is small, even if the axis of the mounting tool 31 does not coincide with the center coordinates of the semiconductor chip to be picked up at the time of picking up, It may be possible to pick up the semiconductor chip 23 by the mounting tool 31.

In such a case, the semiconductor chip 23 positioned at the pickup position is imaged by the chip camera 25, so that the normal pickup coordinates (X _p0 , Y _p0 ) of the semiconductor chip 23 and the semiconductor chip positioned at the pickup position are obtained. If the amount of deviation (ΔX _p , ΔY _p ) from the center coordinates (X _P1 , Y _P1 ) of 23 is calculated, the normal pick-up is performed without correcting the position of the mounting tool 31 in the X and Y directions based on the amount of deviation. The semiconductor chip 23 is picked up by positioning at the pickup coordinates (X _p0 , Y _p0 ) as the position.

Next, when the mounting coordinates (X _b1 , Y _b1 ) of the semiconductor chip 23 mounted on the substrate 5 are calculated by the substrate camera 39, the semiconductor chip 23 calculated based on the imaging of the chip camera 25 is used as the mounting coordinates. Is corrected by the above-described deviation amount (ΔX _p , ΔY _p ).

As a result, the mounting tool 31 matches the mounting coordinates (X _b1 , Y _b1 ) with the center position of the semiconductor chip 23 held with the center shifted from the axis of the mounting tool 31 by the shift amount. The semiconductor chip 23 can be mounted on the substrate 5.

  That is, even when the axis of the mounting tool 31 does not coincide with the center of the semiconductor chip 23 at the time of pickup, the semiconductor chip 23 can be precisely positioned and mounted at the mounting position of the substrate 5.

  In the above embodiment, the substrate camera is arranged above the transport rail. However, the substrate camera may be provided at the tip of the arm provided with the mounting tool. By doing so, when the mounting tool is driven to pick up the semiconductor chip, the mounting position can be calculated by imaging the substrate positioned on the transport rail.

  In the above embodiment, the mounting coordinates of the semiconductor chip mounted on the substrate are calculated using the substrate camera. When the positioning hole is provided on the substrate, the positioning hole is used. In some cases, the substrate is mechanically positioned by a pin or the like.

In such a case, the semiconductor chip can be mounted by correcting the position of the semiconductor chip only by the deviation amount (ΔX _p , ΔY _p ) obtained by the chip camera and positioning and mounting the semiconductor chip at a predetermined mounting position on the substrate. Good.

The top view which shows schematic structure of the mounting apparatus of one embodiment of this invention. The side view of the said mounting apparatus. The side view of the mechanism which drives up and down the cassette in which the wafer ring was accommodated. The top view of the wafer ring with which the semiconductor wafer was hold | maintained with the resin sheet. The block diagram of a control circuit.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Wafer table, 19 ... Wafer ring, 22 ... Semiconductor wafer, 23 ... Semiconductor chip, 25 ... Chip camera (component imaging means), 26 ... Image processing part, 27 ... Control apparatus, 31 ... Mounting tool, 39 ... Substrate camera (Substrate imaging means).

Claims (6)

A mounting device for mounting electronic components on a substrate,
A mounting tool that is driven horizontally and vertically;
A component supply unit that supplies the electronic component that is provided so as to be driven in the horizontal direction and is picked up by the mounting tool;
Component imaging means for imaging the electronic component positioned at the pickup position by the component supply unit;
Substrate imaging means for imaging the substrate transported and positioned at a predetermined position;
Based on the imaging of the electronic component by the component imaging means, the mounting tool is positioned at the pickup position to pick up the electronic component, and then the imaging of the board by the board imaging means and the electronic by the component imaging means are performed. An electronic component mounting apparatus comprising: control means for positioning the mounting tool on the basis of imaging of the component and mounting the electronic component on the substrate. A mounting device for mounting electronic components on a substrate,
A mounting tool that is driven horizontally and vertically;
A component supply unit that supplies the electronic component that is provided so as to be driven in the horizontal direction and is picked up by the mounting tool;
Component imaging means for imaging the electronic component positioned at the pickup position by the component supply unit;
Substrate imaging means for imaging the substrate transported and positioned at a predetermined position;
The mounting position for picking up the electronic component by the mounting tool and mounting the electronic component on the substrate based on the imaging of the electronic component by the component imaging unit and the imaging of the substrate by the substrate imaging unit And a control means for mounting the electronic component on the substrate by positioning the electronic component on the board.   When positioning the electronic component picked up by the component supply unit at the pick-up position, the electronic component picked up this time is positioned at the pick-up position by correcting the displacement amount of the electronic component calculated at the previous positioning. The electronic component mounting apparatus according to claim 1 or 2. A mounting method for mounting electronic components on a substrate,
Positioning the electronic component at the pickup position;
Imaging the positioned electronic component, and calculating a positional deviation amount with respect to a regular pickup position based on the imaging;
Correcting the mounting tool for picking up the electronic component based on the calculation of the positional deviation amount of the electronic component to the pickup position to pick up the electronic component;
Imaging the substrate;
Mounting the electronic component by positioning a mounting tool that picks up the electronic component on the basis of the imaging of the substrate and the imaging of the electronic component with respect to the substrate, and mounting the electronic component Method. A mounting method for mounting electronic components on a substrate,
Positioning the electronic component at the pickup position;
Imaging the positioned electronic component, and calculating a positional deviation amount with respect to a regular pickup position based on the imaging;
A step of picking up the electronic component by a mounting tool;
Imaging the substrate;
Positioning a mounting tool that picks up the electronic component based on the calculation of the amount of positional deviation of the electronic component and imaging of the substrate, and mounting the electronic component on the mounting position of the electronic component mounted on the substrate; An electronic component mounting method comprising the steps of: The electronic component is positioned at the pickup position based on a preset movement amount,
6. The positioning according to claim 4, wherein the electronic component picked up this time is positioned at the pickup position by correcting a positional deviation amount of the electronic component positioned at the pickup position at the previous mounting. Electronic component mounting method.

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