JP2008072077A - Semiconductor package structure and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor package structure and its manufacturing method. <P>SOLUTION: This semiconductor package structure and its manufacturing method comprise a wire frame 20, at least one chip 40, at least one controlling element 30, and at least one passive element 70. The chip and controlling element are mounted on the mounting base 26 of the wire frame, while a forming material 50 covers the wire frame, chip and controlling element, and forms a package object 10. The forming material installs at least one concave barrel 60, and the depth of the concave barrel is reached to the surface of the mounting base of the wire frame. The passive element is electrically connected to the wire frame inside the concave barrel. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a semiconductor package structure and a manufacturing method thereof, and more particularly to a semiconductor package structure having a recessed tank and a manufacturing method thereof.

  Package technologies such as a general semiconductor package system, for example, a thin small outline package (TSOP) format, a micro small outline package (MSOP), and a quarter small outline package (QSOP) are applied to a memory device in a home appliance. , To be produced on a memory card. FIG. 1 is a structural cross-sectional view of a package body having a known memory function. The conductive wire frame 100 is sequentially mounted with a control element 200, a flash memory 300, and a passive element 400, and further sealed with a molding material 500 to form a single package. Finally, the package body is classified into a non-defective product and a defective product by an electrical test.

  Since the above-described package body has a structure that is integrally molded by sealing, the molding material covers the control element 200, the flash memory 300, and the passive element 400 together, and further performs an electrical test. On the other hand, each IC element or the cause of the electrical failure in the manufacturing process cannot be grasped in advance during the packaging process, and an electrical test is performed after the packaging is completed. The device and the packaging material are discarded, and the production cost and time are increased. In addition, when a defective package body is detected, it is difficult to detect the cause of the electrical failure inside the package body after molding, so the yield cannot be improved. There is a need to overcome.

  In order to solve the above-mentioned problem, the present invention forms a concave tank in which a passive element is placed when packaging a molding material, and when the passive element is not placed, the package body is electrically tested first. Therefore, it is possible to determine whether or not a passive element is to be inserted, and it is an object to prevent a package body having poor electrical properties from inserting a passive element.

  A further object of the present invention is to form a concave tub with a molding material at the time of chip mounting and to examine the connection state of passive elements to be placed.

  In order to achieve the above object, the present invention provides a semiconductor package structure, and is installed on a lead frame comprising a plurality of inner pins, a plurality of outer pins, and at least one mounting base, and a mounting base of the lead frame. And at least one chip that is electrically connected to the lead frame, at least one control element that is installed on the mounting base of the lead frame and is electrically connected to the lead frame, and below the molding material. At least one recessed tank which is installed at an arbitrary position and is recessed into the mounting base surface, and at least one recessed tank which is installed in the recessed tank and connected to each inner pin and a plurality of outer pins And a passive element.

  To achieve the above object, the present invention provides a method of manufacturing a semiconductor package structure, providing a lead frame, at least one flash memory, and at least one connected to a mounting base of the lead frame. A step of providing a control element, and a plurality of inner pins of the lead wire frame, a mounting base, a flash memory, and a control element, and a plurality of outer pins of the lead wire frame are not covered; A step of providing a molding material to be formed; and a step of providing a passive element located in the concave tank and electrically connected to the lead frame.

  According to the present invention, it is possible to avoid a passive element from being placed in a package body having poor electrical properties.

  FIG. 2 is a cross-sectional view of a package body having a recessed tank according to an embodiment of the present invention. In the present embodiment, the package body 10 includes a conductive wire frame 20, a control element 30, and a flash memory 40. The conducting wire frame 20 includes a plurality of inner pins 22, outer pins 24, and a mounting base 26, and the control element 30 and the flash memory 40 are installed on the mounting base 26. The package body 10 applies the molding material 50 to cover the control element 30, the flash memory 40, the inner pin 22, and the mounting base 26, and the outer pin 24 is not covered by the molding material 50. Exposed outside. Moreover, the molding material 50 has the area | region without a molding material, forms the concave tank 60, and the concave tank 60 is installed in the arbitrary positions of the molding material 50, and the concave tank 60 of the molding material 50 is a part. The surface of the conductive wire frame 20 is exposed, the passive element 70 is inserted, and the passive element 70 and the conductive wire frame 20 are electrically connected. The mounting base 26 is provided with a plurality of drawn lines 80 that are electrically connected to the inner pins 22, the flash memory 40, and the control element 30. The molding material 50 is mainly made of epoxy, and the lead frame 20 is made of metal.

  FIG. 3 shows another embodiment of the present invention, in which concave tanks 60 and 62 are symmetrically installed above and below the package body 10, respectively, and the passive element 70 and the conductor frame 20 in the concave tank 60 are connected. It makes it easy to examine the condition. According to the spirit of the above-described embodiment, the concave tanks 60 and 62 of the package body 10 are installed at arbitrary positions above and below the package body 10 according to the requirements of circuit design, and the passive element 70 is mounted on the concave tank 60. To do. The package 10 of the present invention is applied to a storage medium of various electronic products such as a digital camera, a PDA, or a mobile phone, or an SD card, a multimedia card MMC, a compact flash (registered trademark) CF card, a memory Manufactures stick MS, smart media SM card, XD card, RS-MMC, mini SD card, transformer flash, etc.

  4A and 4B show a process of a package having a concave tub according to the present invention. As shown in FIG. 4A, first, the conductor frame 20 is provided, and the control element 30 and the flash memory 40 are sequentially installed above the conductor frame 20, and one end of the drawn line 80 is connected to the inner pin 22 and the control element by a bonding wire. 30 and the flash memory 40, and the other end is connected to the mounting base 26.

  As shown in FIG. 4B, a packaging process is performed by a mold, and the molding material 50 covers the flash memory 40 and the control element 30 of the lead frame 20, and the mold includes an upper mold 92 and Convex blocks 96 and 98 are installed in the structure of the lower mold 94, respectively. When the packaging process is executed, the convex blocks 96 and 98 conflict with the conductive wire frame 20 above and below, respectively, to generate a clamping action at the time of packaging, and prevent the molding material 50 from being completely covered. After injecting the molding material into the mold, the concave tanks 60 and 62 are formed, and then the passive element 70 is placed in the concave tank 60 and electrically connected to the conductor frame 20 in FIG. The package structure as shown is completed. According to the spirit of the embodiment of the present invention, the upper mold 92 and the lower mold 94 are provided with a single convex block 96, and when the package is formed, the concave tank 60 is formed, and then the passive element 70 is inserted. 2 completes the package structure.

  According to the above-described embodiment, the completed package body 10 undergoes an electrical test, and if the result is not normal, the package body 10 is discarded, and the package body of the known technology includes the control element, the flash memory, and the passive body. Since the electrical test is not performed after the device is packaged, unnecessary processing time can be reduced and material can be saved. In addition, the recessed tanks 60 and 62 of the present invention have lids (not shown) installed on the recessed tanks 60 and 62, and particles enter the recessed tanks 60 and 62, causing an electrical failure of the package body 10. To prevent becoming.

  As described above, the present invention submits a semiconductor package structure and a manufacturing method thereof, and when a molding material is used, when a passive element is placed by forming a concave tank, and when a passive element is not placed, The package body conducts an electrical test first, and the package body that passes the test places the passive element, so the defective product does not place the passive element, and the connection status of the passive element in the concave tank is analyzed. It is easy to do, and it can prevent that it becomes a cause of inferior goods.

  In the present invention, preferred embodiments have been disclosed as described above. However, the present invention is not limited to the present invention, and any person who is familiar with the technology can use various methods within the spirit and scope of the present invention. Variations and moist colors can be added, so the protection scope of the present invention is based on what is specified in the claims.

It is structure sectional drawing of the package body which has a well-known memory performance. It is sectional drawing of the package body which has a concave tank by the Example of this invention. FIG. 6 is a cross-sectional view of a package body having a recessed tank according to another embodiment of the present invention. It is a figure which shows the package process which has a concave tank by this invention. It is a figure which shows the package process which has a concave tank by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Conductive frame 200 Control element 300 Flash memory 400 Passive element 500 Molding material 10 Package body 20 Conductive frame 22 Inner pin 24 Outer pin 26 Mounted base 30 Control element 40 Flash memory 50 Molding material 60, 62 Recessed tank 70 Passive element 80 Drawing line 92 Upper die 94 Lower die 96, 98 Convex block

Claims (20)

A semiconductor package structure,
A conductive wire frame comprising a plurality of inner pins, a plurality of outer pins, and at least one mounting base;
At least one chip installed on the mounting base of the conducting wire frame;
At least one control element installed on the mounting base of the conducting wire frame;
A molding material covering the conductor frame, the chip, the inner pin, and the control element;
At least one recessed tank that is installed at an arbitrary position below the molding material and exposes part of the conductor frame;
At least one passive element installed on the surface of the conductive wire frame in the concave tank and electrically connected to the conductive wire frame;
A semiconductor package structure comprising:   The semiconductor package structure according to claim 1, wherein the chip is a flash memory.   The semiconductor package structure according to claim 1, wherein the molding material is made of epoxy.   The semiconductor package structure according to claim 1, wherein the conductive wire frame is made of a metal material.   The semiconductor package structure according to claim 1, wherein the outer pin is exposed from the molding material.   2. The semiconductor package structure according to claim 1, wherein the mounting base is provided with a plurality of drawn wires and electrically connected to the inner pin, the chip, and the control element, respectively.   2. The semiconductor package structure according to claim 1, wherein the semiconductor package structure is applied to a storage medium of an electronic product, and the storage medium of the electronic product includes a digital camera, a PDA, and a mobile phone.   The semiconductor package structure is applied to an electronic memory, and the electronic memory includes an SD card, an MMC card, a CF card, an MS, an SM card, an XD card, an RS-MMC card, a mini SD card, and a transflash. The semiconductor package structure according to claim 1. A semiconductor package structure,
A conductive wire frame comprising a plurality of inner pins, a plurality of outer pins, and at least one mounting base;
At least one chip installed on the mounting base of the conducting wire frame;
At least one control element installed on the mounting base of the conducting wire frame;
A molding material covering the mounting base, the chip, the inner pin, and the control element;
And at least a plurality of recessed tanks that are symmetrically installed at arbitrary positions above and below the molding material and expose a part of the surface of the conductor frame;
At least one passive element installed on the surface of the conductive wire frame in the concave tank and electrically connected to the conductive wire frame;
A semiconductor package structure comprising:   The semiconductor package structure according to claim 9, wherein the chip is a flash memory.   The semiconductor package structure according to claim 9, wherein the molding material is made of epoxy.   The semiconductor package structure according to claim 9, wherein the conductive wire frame is made of a metal material.   The semiconductor package structure according to claim 9, wherein the outer pin is exposed from the molding material.   10. The semiconductor package structure according to claim 9, wherein the mounting base is provided with a plurality of drawn wires and electrically connected to the inner pin, the chip, and the control element, respectively.   The semiconductor package structure according to claim 9, wherein the semiconductor package structure is applied to a storage medium of an electronic product, and the storage medium of the electronic product includes a digital camera, a PDA, and a mobile phone.   The semiconductor package structure is applied to an electronic memory, and the electronic memory includes an SD card, an MMC card, a CF card, an MS, an SM card, an XD card, an RS-MMC card, a mini SD card, and a transflash. The semiconductor package structure according to claim 9. A semiconductor packaging method, the method comprising:
Providing a conductor frame;
Providing at least one flash memory and at least one control element connected to a mounting base of the conductor frame;
Providing a molding material that covers the plurality of inner pins of the conductive wire frame, the mounting base, the flash memory, and the control element, and forms at least one concave tank;
Providing a passive element located on the lead frame in the recessed tank and electrically connected to the lead frame;
A semiconductor package method comprising:   Before covering the mounting base, the inner pin, the flash memory, and the control element of the conductive wire frame, one end of a plurality of drawn wires is electrically connected to the inner pin, the control element, and the flash memory, respectively, by wire bonding. The semiconductor package method according to claim 17, further comprising connecting the other end to the mounting base.   18. The mold according to claim 17, wherein the mold covers the mounting base, the inner pin, the flash memory, and the control element of the conductive wire frame, and the molding material is injected into the mold. The semiconductor package method as described.   20. The semiconductor package method according to claim 19, wherein the mold is provided with at least one convex block, and the concave tank of the molding material is molded.

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