JP2008069368A - Method for manufacturing prepreg and resin impregnation apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a prepreg which controls the residence time of the resin varnish in a dipping tank effectively, maintains the good impregnation of a substrate with a resin even when using the resin varnish of high-viscosity and high thixotropy, and can inhibit the adhesion of the resin varnish having high viscosity or gelled. <P>SOLUTION: A long substrate 1 is passed through a resin varnish 2 stored in a dipping tank 3. A resin varnish 2 is supplied to a dipping tub 3 at a position of an opposite side of a drawer position of a substrate 1 to an advancing position of the substrate 1. A resin varnish 2 is discharged from a dipping tank 3 at a position of an opposite side of an advancing position of a substrate 1 to a drawer position of a substrate 1. Thereby, the flowing of a resin varnish 2 which goes in an advance direction of a substrate 1 in a dipping tank 3 is generated. Moreover, adding to the discharge of the resin varnish 2, a resin varnish 2 is discharged from a lower part of the pathway of a substrate 1 in a dipping tank 3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for producing a prepreg in which a resin component is B-staged after impregnating a resin varnish while conveying a long substrate, and a resin impregnation used for impregnation of the resin varnish into the substrate in this method It relates to the device.

  A prepreg used for manufacturing a printed wiring board is usually produced by impregnating a fibrous base material 1 with a resin varnish 2 containing a thermosetting resin, and drying by heating to a B stage state. Yes. In producing such a prepreg, a continuous process of sequentially impregnating the resin varnish 2 and heating and drying while continuously conveying the long base material 1 is widely adopted.

  In producing the prepreg as described above, various methods of impregnation with the resin varnish 2 are employed, and one of them is by dipping. As shown in FIG. 8, the long base 1 is continuously introduced into the dip tank 3 in which the resin varnish 2 is stored and immersed in the resin varnish 2, and is led out from the dip tank 3. The excess base resin 1 is squeezed out so that the base material 1 passes between the pair of squeeze rolls 4. And the base material 1 which impregnated the resin varnish 2 in this way is conveyed to the following process, and is heat-dried. Here, reference numeral 5 in FIG. 8 is a scraping tool for scraping off the resin varnish 2 attached to the squeeze roll 4, reference numeral 6 is a supply pipe for supplying the resin varnish 2 to the dip tank 3, and reference numeral 8 is a dip. Reference numeral 9 denotes an dip roll, which is an overflow tank for receiving the resin varnish 2 overflowed from the tank 3.

Thus, when impregnating the resin varnish 2 by dipping, it is necessary to keep the viscosity of the resin varnish 2 stored in the dipping tank 3 constant, but the solvent is volatilized from the resin varnish 2 in the dipping tank 3. As a result, the viscosity of the resin varnish 2 increases, and the impregnation of the substrate 1 may not be sufficiently obtained. Accordingly, the resin varnish 2 is sequentially discharged from the dip tank 3 and the viscosity-adjusted resin varnish 2 is sequentially supplied to keep the viscosity of the resin varnish 2 in the dip tank 3 constant. . For example, in the case shown in FIG. 8, the resin varnish 2 is supplied from the supply pipe 6 connected to the bottom of the dip tank 3 into the dip tank 3 and the resin varnish 2 overflowing from the dip tank 3 is discharged. Yes. In addition, as disclosed in Patent Document 1, there is also a type in which a resin varnish whose viscosity is adjusted is supplied from the upper side and the lower side of the base material, and the overflowed resin varnish is discharged from the dip tank.
JP 2003-335875 A

  However, in the conventional method as described above, since the flow of the resin varnish 2 in the dip tank 3 is easily blocked by the base material 1, the resin varnish 2 stays in the dip tank 3, thereby increasing the viscosity or gel. Resin varnish 2 is generated, and therefore, the resin impregnation property to the base material 1 may be reduced, or the resin varnish 2 having increased viscosity or gel may adhere to the base material 1 and the moldability may be deteriorated. there were. For example, in the case shown in FIG. 8, the region surrounded by the base material 1 on the upper side of the path of the base material 1 is blocked by the base material 1 and the resin varnish 2 tends to stay. The gelled resin varnish 2 tends to accumulate in the vicinity of the drawing position of the base material 1, which may adhere to the base material 1 and lead to deterioration of moldability. Moreover, in the thing of patent document 1, it was trying to suppress the residence of a resin varnish by supplying resin varnish from the upper and lower sides of a base material, but still this base material in the upper side of the path | route of a base material The resin varnish is apt to stay in the area surrounded by, so when using a resin varnish with high viscosity and high thixotropy, it is gelled near the extraction position of the base material on the top surface of the resin varnish. The resin varnish was easily collected.

  The present invention has been made in view of the above points, effectively suppressing the retention of the resin varnish in the dip tank, even when using a high viscosity, high thixotropic resin varnish. Method for producing prepreg capable of maintaining good impregnation of resin and preventing adhesion of highly viscous or gelled resin varnish, and resin impregnation used for impregnation of resin varnish to substrate in this method The object is to provide an apparatus.

  The method for producing a prepreg according to claim 1 includes a step of impregnating a base material 1 with a resin varnish 2 while conveying a long base material 1 and a resin component of the base material 1 impregnated with the resin varnish 2 in a B stage. A step of impregnating the base material 1 with the resin varnish 2 allows the long base material 1 to pass through the resin varnish 2 stored in the dip tank 3. The resin varnish 2 is supplied to the dip tank 3 at a position opposite to the drawing position of the substrate 1 with respect to the entry position of the substrate 1, and the entry position of the substrate 1 with respect to the drawing position of the substrate 1 The resin varnish 2 is discharged from the dip tank 3 at a position opposite to the dip tank 3 to cause the resin varnish 2 to flow in the direction of travel of the substrate 1 in the dip tank 3, and the resin varnish 2 in addition to the discharge of the base material 1 in the dip tank 3 Wherein the from below and discharges the resin varnish 2.

  Thereby, the resin varnish 2 in the region where the resin varnish 2 flows in the traveling direction of the base material 1 between the one surface of the base material 1 facing the inner surface of the dip tank 3 and the inner surface of the dip tank 3. At this time, since the flow direction of the resin varnish 2 is the direction toward the traveling direction of the base material 1, the flow of the resin varnish 2 is promoted over the entire dip tank 3. Resin varnish 2 is less likely to stay throughout. Further, a region extending from the supply position of the resin varnish 2 at a position opposite to the drawing position of the base material 1 to the entry position of the base material 1 to the discharge position of the resin varnish 2 below the path of the base material 1. The flow of the resin varnish 2 can be further promoted.

  The invention according to claim 2 is based on claim 1, in which the substrate 1 is supported by the dip roll 9 in the dip tank 3 and the resin varnish 2 is discharged from below the path of the substrate 1 in the dip tank 3. The resin varnish 2 is discharged from the entry position side of the base material 1 below the dip roll 9.

  For this reason, it extends from the supply position of the resin varnish 2 at a position opposite to the drawing position of the base material 1 with respect to the entry position of the base material 1 to the discharge position of the resin varnish 2 below the path of the base material 1. The flow of the resin varnish 2 can be further promoted in the region.

  According to a third aspect of the present invention, in the first or second aspect, the supply of the resin varnish 2 to the dip tank 3 and the discharge of the resin varnish 2 from the dip tank 3 are performed uniformly in the width direction of the substrate 1. Thus, the resin varnish 2 is caused to flow in the dip tank 3 in the traveling direction of the substrate 1.

  Thereby, the uniform flow of the resin varnish 2 can be promoted in the width direction of the base material 1 in the dip tank 3.

  According to a fourth aspect of the present invention, in any one of the first to third aspects, the resin varnish 2 is supplied to the dip tank 3 at a position opposite to the drawing position of the base material 1 with respect to the entry position of the base material 1. And discharge | emission of the resin varnish 2 from the dip tank 3 in the position on the opposite side to the approach position of the base material 1 with respect to the drawing position of the base material 1 is performed by the overflow system.

  Thereby, it becomes easy to generate a uniform flow in the direction of the substrate 1 without being influenced by the nozzle shape or pressure variation.

  The resin impregnation apparatus according to claim 5 is a resin impregnation apparatus for impregnating the base material 1 with the resin varnish 2 while conveying the long base material 1, and a dip tank 3 in which the resin varnish 2 is stored. Supply means for supplying the resin varnish 2 into the dip tank 3 at a position opposite to the drawing position of the base material 1 with respect to the entry position of the base material 1; A discharge means for discharging the resin varnish 2 from the dip tank 3 at a position opposite to the entry position of the material 1, and, in addition to the discharge means, the resin varnish 2 in the dip tank 3 It has the discharge port 22 discharged | emitted from the downward direction of 1 path | route, It is characterized by the above-mentioned.

  Thereby, with the supply of the resin varnish 2 from the supply means and the discharge of the resin varnish 2 from the discharge means, the gap between the one surface of the substrate 1 facing the inner surface of the dip tank 3 and the inner surface of the dip tank 3 In this case, the resin varnish 2 flows toward the traveling direction of the substrate 1, and the resin varnish 2 is less likely to stay in this region. At this time, the flowing direction of the resin varnish 2 is the direction toward the traveling direction of the substrate 1. Therefore, the flow of the resin varnish 2 is promoted over the entire dip tank 3, and the resin varnish 2 is less likely to stay over the entire dip tank 3. Further, the flow of the resin varnish 2 is further promoted in a region extending from the supply position of the resin varnish 2 at a position opposite to the drawing position of the base material 1 to the entry position of the base material 1 to the discharge port 22. Can do.

  The invention according to claim 6 is the invention according to claim 5, wherein the dip tank 3 is provided with a dip roll 9 that supports the base material 1 in the dip tank 3 and the discharge port 22 is a base below the dip roll 9. It is provided on the entry position side of the material 1.

  Accordingly, the flow of the resin varnish 2 is further promoted in a region extending from the supply position of the resin varnish 2 at a position opposite to the drawing position of the base material 1 to the entry position of the base material 1 to the discharge port 22. be able to.

  The resin impregnating apparatus according to claim 7 is a resin impregnating apparatus for impregnating the base material 1 with the resin varnish 2 while conveying the long base material 1, and a dip tank 3 in which the resin varnish 2 is stored. Supply means for supplying the resin varnish 2 into the dip tank 3 at a position opposite to the drawing position of the base material 1 with respect to the entry position of the base material 1; A discharge means for discharging the resin varnish 2 from the dip tank 3 at a position opposite to the entry position of the material 1, and in addition to the supply means and the discharge means, Supply means for supplying the resin varnish 2 into the dip tank 3 at the position of the base material 1 at the drawing position side, and the resin varnish 2 at the position of the base material 2 at the entry position side with respect to the drawing position of the base material 1 And a discharge means for discharging from the dip tank 3.

  Thereby, with supply of the resin varnish 2 from the supply means and discharge of the resin varnish 2 from the discharge means, the resin varnish 2 flows toward the traveling direction of the base material 1 on both sides of the base material 1, Resin varnish 2 is less likely to stay in this region, and at this time, the flow direction of resin varnish 2 is the direction toward the direction of travel of substrate 1, so that the flow of resin varnish 2 is accelerated throughout the entire dip tank 3. This makes it difficult for the resin varnish 2 to stay over the entire dip tank 3.

  The invention according to an eighth aspect is the guide plate according to the seventh aspect, wherein the guide plate guides the flow direction of the resin varnish 2 along the traveling direction of the base material 1 on one side and the other side of the base 1 in the dip tank 3, respectively. 19 is provided.

  Thereby, the path | route which the resin varnish 2 distribute | circulates between both surfaces of the base material 1 and each guide plate 19 is formed, respectively, and the flow of the resin varnish 2 in this path | route is further accelerated | stimulated.

  The invention according to claim 9 is characterized in that, in addition to the discharge means, the discharge port 22 for discharging the resin varnish 2 from below the path of the substrate 1 in the dip tank 3 is provided. And

  Accordingly, the flow of the resin varnish 2 is further promoted in a region extending from the supply position of the resin varnish 2 at a position opposite to the drawing position of the base material 1 to the entry position of the base material 1 to the discharge port 22. be able to.

  The invention according to claim 10 is the supply port 23 for discharging the resin varnish 2 in the direction along the flow direction of the resin varnish 2 generated by the supply means and the discharge means in addition to the supply means. Is provided in the dip tank 2.

  Thereby, the flow of the resin varnish 2 between the arrangement position of the supply port 23 and the discharge position of the resin varnish 2 at a position opposite to the entry position of the substrate 1 with respect to the drawing position of the substrate 1 is performed. It can be further promoted.

  The invention according to claim 11 is that in any one of claims 5 to 10, the supply means supplies the resin varnish 2 uniformly in the width direction of the substrate 1 in the dip tank 3. Features.

  Thereby, the uniform flow of the resin varnish 2 can be promoted in the width direction of the base material 1 in the dip tank 3.

  The invention according to claim 12 is characterized in that, in any one of claims 5 to 11, the supply means includes a supply overflow tank 20 for supplying the resin varnish 2 to the dip tank 3 by overflow. And

  Thereby, a uniform flow can be easily generated in the width direction of the substrate 1 without being influenced by the nozzle shape or pressure variation.

  The invention according to claim 13 is the invention according to any one of claims 5 to 12, wherein the discharge means discharges the resin varnish 2 uniformly in the width direction of the substrate 1 in the dip tank 3. It is characterized by.

  Thereby, the uniform flow of the resin varnish 2 can be promoted in the width direction of the base material 1 in the dip tank 3.

  In the present invention, by using the supply and discharge of the resin varnish to the dip tank, the renewal of the resin varnish can be promoted over the entire dip tank, and thereby the impregnating property of the resin varnish to the base material In addition to keeping the viscosity of the resin varnish high, the resin varnish is prevented from becoming highly viscous or gelled, and it is possible to prevent the resin varnish from becoming highly viscous or gelled from adhering to the base material, thereby preventing deterioration of moldability. Even when a high viscosity, high thixotropic varnish is used, the occurrence of defects can be suppressed.

  Hereinafter, the best mode for carrying out the present invention will be described.

  As the base material 1, an appropriate fibrous base material used for producing a prepreg is used. Examples thereof include woven fabrics or nonwoven fabrics of glass fibers and appropriate organic fibers. As the base material 1, a long one is used. While the base material 1 is transported along the longitudinal direction, the base material 1 is sequentially impregnated with the resin varnish 2, and the base material impregnated with the resin varnish 2 is used. A prepreg is manufactured through a step of converting the resin component of the material 1 into a B-stage.

  The resin varnish 2 is also an appropriate one used for the preparation of a prepreg. For example, a resin composition containing a thermosetting resin such as an epoxy resin or a PPO (polyphenylene oxide) resin is diluted with an organic solvent. Those whose viscosity has been adjusted are used.

  In impregnating the base material 1 with the resin varnish 2, a dipping method in which the base material 1 is immersed in the resin varnish 2 in the dip tank 3 is used.

  1-6 shows the example of the resin impregnation apparatus which impregnates the base material 1 with the resin varnish 2 by the dipping method. In these examples, in the dip tank 3 in which the resin varnish 2 is stored, a dip roll 9 having a horizontal rotation shaft is disposed so as to sink in the resin varnish 2, and the base material 1 is located above the dip tank 3. Is introduced into the resin varnish 2, supported by the dip roll 9, folded back upward, led out from the liquid surface of the resin varnish 2, and conveyed so as to be drawn upward. At this time, the dip roll It is conveyed so as to pass through the resin varnish 2 in 9. At this time, the path of the substrate 1 in the resin varnish 2 is substantially V-shaped.

  Moreover, the base material 1 drawn out from the dip tank 3 passes between the pair of squeeze rolls 4, so that excess of the resin varnish 2 attached to the base material 1 is squeezed out. It has become.

  In the present invention, the resin varnish 2 is supplied to the dip tank 3 and the excess resin varnish 2 in the dip tank 3 is discharged. At this time, the extraction position of the base material 1 with respect to the entry position of the base material 1 The resin varnish 2 is supplied to the dip tank 3 at a position opposite to the dip tank 3 and the resin varnish 2 is discharged from the dip tank 3 at a position opposite to the entry position of the substrate 1 with respect to the drawing position of the substrate 1. Thus, the flow and flow of the resin varnish 2 in the traveling direction of the base material 1 is generated in the dip tank 3 by using the supply and discharge of the resin varnish 2.

  Here, the entry position of the base material 1 is a position where the liquid level of the resin varnish 2 stored in the dip tank 3 and the base material 1 intersect when the base material 1 is introduced toward the dip tank 3. Further, the drawing position of the base material 1 is a position where the liquid surface of the resin varnish 2 and the base material 1 intersect when the base material 1 in the dip tank 3 is drawn.

  When the supply and discharge of the resin varnish 2 are performed in this way, even if the solvent is volatilized from the resin varnish 2, the resin varnish 2 in the dip tank 3 is sequentially updated to keep the viscosity of the resin varnish 2 constant. Since the flow of the resin varnish 2 occurs along the traveling direction of the substrate 1, the flow of the resin varnish 2 is further inhibited without being inhibited, and the resin varnish 2 is spread over the entire dip tank 3. The renewal of the resin varnish 2 can be maintained at a constant level, and the viscosity and gelation of the resin varnish 2 can be suppressed to increase the viscosity. The gelled resin varnish 2 can be prevented from adhering to the substrate 1, and the moldability can be prevented from deteriorating.

  At this time, the resin impregnation apparatus is provided with supply means for supplying the resin varnish 2 to the dip tank 3 and discharge means for discharging the resin varnish 2 from the dip tank 3.

  For example, as shown in FIG. 7, the supply means includes a supply pipe 6 that is a supply path for the resin varnish 2, and a drive source 13 such as a pump that generates a drive force for causing the resin varnish 2 to flow through the supply pipe 6. Can be configured. Further, the discharge means can be constituted by, for example, a discharge pipe 7 that is a discharge path of the resin varnish 2 and a drive source 14 such as a pump that generates a driving force for allowing the resin varnish 2 to flow through the discharge pipe 7. .

  FIG. 4 shows an example of a resin impregnation apparatus. In the illustrated example, the inner surface of the dip tank 3 has a shape along the path of the substrate 1 in the dip tank 3, and this inner surface functions as a guide plate 19 that guides the flow direction of the resin varnish. A path through which the resin varnish 2 flows is formed between the surface of the substrate 1 facing the guide plate 19 and the guide plate 19. Further, the position opposite to the drawing position of the base material 1 with respect to the entry position of the base material 1, in the illustrated example, the edge on the side where the base material 1 of the dip tank 3 enters and the entry position of the base material 1 A discharge device 18 such as a discharge nozzle for discharging the resin varnish 2 from above the dip tank 3 toward the dip tank 3 is provided. The discharger 18 forms a part of the supply means by connecting the supply pipe 6 of the supply means. The resin varnish 2 is supplied to the dip tank 3 by discharging the resin varnish 2 from the discharger 18.

  On the other hand, a discharge overflow tank is provided at a position opposite to the entry position of the base material 1 with respect to the extraction position of the base material 1, in the illustrated example, the edge of the dip tank 3 on the side from which the base material 1 is drawn. 8 is provided. The discharge overflow tank 8 is connected to the discharge pipe 7 in the discharge means and forms a part of the discharge means. The resin varnish 2 is discharged from the dip tank 3 by overflowing from the dip tank 3 and flowing into the discharge overflow tank 8.

  Using such a resin impregnation apparatus, the resin varnish 2 in the dip tank 3 is allowed to pass while the long base material 1 is conveyed, and the resin varnish 2 is supplied from the supply means and the resin varnish from the discharge means. 2 is discharged, the resin varnish 2 flows in the traveling direction of the base material 1 between the one surface of the base material 1 facing the inner surface of the dip tank 3 and the inner surface of the dip tank 3, The resin varnish 2 is less likely to stay in this region. At this time, since the flow direction of the resin varnish 2 is the direction toward the traveling direction of the base material 1, the flow of the resin varnish 2 is not hindered by the progress of the base material 1, and the flow of the resin varnish 2 is accelerated. Therefore, the flow of the resin varnish 2 is also promoted in the region surrounded by the base material 1 on the upper side of the path of the base material 1, and the resin varnish 2 is hardly retained throughout the dip tank 3. Become. Thereby, the viscosity of the resin varnish 2 in the dip tank 3 can be kept constant, and the amount of impregnation of the resin varnish 2 with respect to the base material 1 can be kept constant. The generation of the gelled resin varnish 2 can be prevented to prevent the resin varnish 2 from adhering to the substrate 1, and the deterioration of the moldability can be prevented, and the viscosity and the thixotropy are high. Even when the varnish is used, the occurrence of defects can be suppressed.

  Further, in the illustrated example, the inner surface of the dip tank 3 has a shape along the path of the base material 1 in the dip tank 3 and functions as a guide plate 19 that guides the flow direction of the resin varnish. Since a path through which the resin varnish 2 flows is formed between the surface facing the guide plate 19 and the guide plate 19, the flow of the resin varnish 2 in this path is further promoted.

  In such a resin impregnation apparatus, it is preferable that the supply of the resin varnish 2 by the supply means is performed uniformly in the width direction of the base material 1. For example, the discharge port of the discharger 18 is connected to the base material 1. A long slit is formed along the width direction, and the resin varnish 2 is discharged from the discharge port at a uniform flow rate. In this case, a uniform flow of the resin varnish 2 in the width direction of the base material 1 can be promoted in the dip tank 3, and the resin varnish 2 is renewed throughout the base material 1 to be gelled to the base material 1. It is possible to further reliably prevent the resin varnish 2 from adhering or molding defects.

  Further, the discharge of the resin varnish 2 by the discharge means is preferably performed uniformly in the width direction of the base material 1. For example, the discharge overflow tank 8 is provided along the width direction of the base material 1 and dip. The height of the partition between the tank 3 and the discharge overflow tank 8 is the same throughout. Also in this case, the uniform flow of the resin varnish 2 can be promoted in the width direction of the base material 1 in the dip tank 3, and the resin varnish 2 is renewed throughout the base material 1 and gelled to the base material 1. It is possible to more reliably prevent the resin varnish 2 from adhering or molding defects.

  In the example shown in FIG. 5, in the configuration of FIG. 4, instead of the discharger 18, a supply overflow tank 20 is provided at the edge of the dip tank 3 on the side where the base material 1 enters. The overflow tank 20 is connected to the supply pipe 6 of the above-mentioned supply means, and forms a part of the supply means. By supplying the resin varnish 2 to the supply overflow tank 20, the resin varnish 2 overflows the supply overflow tank 20 and is supplied to the dip tank 3. In such a resin impregnation apparatus, it becomes easy to generate a uniform flow in the width direction of the substrate 1 without being influenced by the nozzle shape or pressure variation.

  Moreover, also in such a resin impregnation apparatus, it is preferable to supply the resin varnish 2 by the supply means uniformly over the width direction of the base material 1. And the height of the partition between the dip tank 3 and the supply overflow tank 20 is the same throughout. Also in this case, the uniform flow of the resin varnish 2 can be promoted in the width direction of the base material 1 in the dip tank 3, and the resin varnish 2 is renewed throughout the base material 1 and gelled to the base material 1. It is possible to more reliably prevent the resin varnish 2 from adhering or molding defects.

  Moreover, in the example shown in FIG. 6, the horizontal adjustment partition 21 which can be moved up and down is provided as a partition between the dip tank 3 and the discharge overflow tank 8 in the structure shown in FIG. By moving the horizontal adjustment partition 21 up and down, the height of the partition between the dip tank 3 and the discharge overflow tank 8 is changed, thereby adjusting the discharge amount of the resin varnish 2 from the dip tank 2. Accordingly, the flow rate of the resin varnish 2 in the dip tank 2 can be adjusted, and adhesion of the gelled resin varnish 2 to the base material 1 and molding defects do not occur. Therefore, the base material 1 can be impregnated with the resin varnish 2 under optimum conditions.

  Of course, such a horizontal adjustment partition 21 may be provided in the example shown in FIG.

  Further, in the example shown in FIG. 1, in the configuration shown in FIG. 6, a discharge port 22 for discharging the resin varnish 2 from the dip tank 3 is provided below the path of the base material 1 in the dip tank 3. is there. In the illustrated example, the discharge port 22 is provided below the dip roll 9 at the bottom of the dip tank 3. It is preferable that the discharge port 22 is formed at a position slightly below the dip roll 9 on the entry position side of the substrate 1 as shown. The discharge port 22 sucks the resin varnish 2 and discharges the resin varnish 2 from the dip tank 3 at the position where the discharge port 22 is formed. For example, the discharge port 22 is connected to the discharge pipe 7 and discharged. Part of the means.

  When such a discharge port 22 is provided, the resin varnish 2 supplied to the dip tank 3 is discharged from the discharge port 22, so that the base material 1 can be moved with respect to the entry position of the base material 1. The flow of the resin varnish 2 is further promoted in a region extending from the supply position of the resin varnish 2 at the position opposite to the drawing position to the discharge port 22, and the flow of the resin varnish 2 forms the discharge port 22. Branching from the position to the discharge port 22 and to the discharge position of the resin varnish 2 at a position opposite to the entry position of the substrate 1 with respect to the extraction position of the substrate 1, It is discharged from the dip tank 3. Thereby, adhesion of the gelatinized resin varnish 2 to the base material 1, molding defects, and the like can be further reliably prevented.

  Of course, such a discharge port 22 may be provided in the configuration shown in FIGS.

  In the example shown in FIG. 2, in the example shown in FIG. 3, a supply port 23 that assists the flow of the resin varnish 2 in the dip tank 3 by discharging the resin varnish 2 into the dip tank 3 is provided. In the illustrated example, the supply port 23 is provided at the bottom of the dip tank 3 on the side where the base material 1 is pulled out of the dip tank 3 with respect to the dip roll 9. At this time, the supply port 23 is provided closer to the drawing position of the substrate 1 than the discharge port 22. The supply port 23 is formed so as to discharge the resin varnish 2 upward, that is, the flow direction of the resin varnish 2 between the substrate 1 and the inner surface of the dip tank 3 on the downstream side of the dip roll 9. The resin varnish 2 is discharged in a direction along (upward in the illustrated example). Such a supply port 23 forms a part of the supply means, for example, by connecting to the supply pipe 6 of the supply means. The resin varnish 2 is supplied to the dip tank 3 by discharging the resin varnish 2 from the discharger 18.

  When such a supply port 23 is provided, the resin varnish 2 is discharged from the supply port 23, whereby the formation position of the supply port 23 (discharge position of the resin varnish 2) and the drawing position of the substrate 1 are based. The flow of the resin varnish 2 between the resin varnish 2 at a position opposite to the entry position of the material 1 and the discharge position of the resin varnish 2 is further promoted, whereby adhesion of the gelled resin varnish 2 to the substrate 1 and It is possible to prevent molding defects and the like more reliably. The supply port 23 only needs to discharge the resin varnish 2 in the direction along the flow of the resin varnish 2 in the dip tank 3, and therefore the formation position of the supply port 23 is limited to that shown in FIG. I can't.

  Of course, such a supply port 23 may be provided in the configuration shown in FIGS.

  In the example shown in FIG. 3, the dip tank 3 is formed separately with an inlet 24 of the base material 1 opening upward and an outlet 25 of the base material 1 opening upward. The inlet 24 is formed at the same time, and the outlet 25 is formed at the other end as a tubular flow path. In the illustrated example, the dip tank 3 is formed in a substantially V shape along the path of the base material 1, and one end of the V-shaped dip tank 3 is formed as an entrance 24 of the base material 1 opening upward, The other end is formed as an outlet 25 of the base material 1 opening upward. The dip roll 9 is disposed in a substantially vertex position of the V shape in the dip tank 3. At this time, the inner surface of the dip tank 3 facing one surface of the substrate 1 has a shape along the path of the substrate 1 in the dip tank 3, and this inner surface guides the flow direction of the resin varnish 2. It functions as a guide plate 19. As a result, a path through which the resin varnish 2 flows is formed in the dip tank 3 between one surface of the base material 1 and the guide plate 19 facing the base material 1. Moreover, the inner surface of the dip tank 3 facing the other surface of the base material 1 also has a shape along the path of the base material 1 in the dip tank 3, and serves as a guide plate 19 that guides the flow direction of the resin varnish 2. Function. As a result, a path through which the resin varnish 2 flows is also formed in the dip tank 3 between the other surface of the substrate 1 and the guide plate 19 facing the other surface.

  In addition, above the entrance 24 of the dip tank 3, the position of the base material 1 relative to the position of entry of the base material 1 and the position of the base material 1 opposite to the position of withdrawal of the base material 1. Discharger 18 such as a discharge nozzle for discharging the resin varnish 2 toward the dip tank 3 is provided at the position on the drawing position side. The discharger 18 forms a part of the supply means by connecting the supply pipe 6 of the supply means. The discharger 18 preferably supplies the resin varnish 2 uniformly in the width direction of the substrate 1. For example, the discharge port of the discharger 18 extends along the width direction of the substrate 1. It is preferable to form a long slit and discharge the resin varnish 2 from the discharge port at a uniform flow rate. In addition, an appropriate supply mechanism for the resin varnish 2 may be provided in place of the discharger 18. For example, the position of the entrance 24 opposite to the drawing position of the substrate with respect to the entering position of the substrate, and the substrate The above-described supply overflow tank 20 may be provided at the edge of the base material at the position where the base material is pulled out.

  The outlet 25 has a wide opening, is located on the side opposite to the base entry position relative to the base drawer position, and on the base entry position side relative to the base drawer position. In the position, a discharge overflow tank 8 is provided at each edge of the outlet 25. The discharge overflow tank 8 is connected to the discharge pipe 7 in the discharge means as described above and forms a part of the discharge means. At this time, the discharge of the resin varnish 2 by the discharge means is preferably performed uniformly in the width direction of the base material 1. For example, the discharge overflow tank 8 is provided on one side and the other side of the base 1. It is preferable that the edge is provided along the width direction of the substrate 1 and the height of the partition between the dip tank 3 and the discharge overflow tank 8 is the same throughout.

  In the resin impregnation apparatus formed in this way, the resin varnish 2 is discharged from the discharger 18 at a position opposite to the entry position of the substrate 1 with respect to the extraction position of the substrate on the entrance 24 side, The resin varnish 2 is discharged from the overflow tank at a position opposite to the base material entry position with respect to the base material extraction position on the outlet 25 side, whereby one surface of the path of the base material 1 in the dip tank 3 On the side, the resin varnish flows in the direction of travel of the substrate 1. Also, the resin varnish 2 is discharged from the discharger 18 at a position on the base material entry position side with respect to the base material pull-out position on the entrance 24 side, and the base 25 is on the base side with respect to the base material pull-out position. By discharging the resin varnish 2 from the discharge overflow tank 8 at the position on the material entry position side, the resin varnish heading in the traveling direction of the substrate 1 also on the other side of the path of the substrate 1 in the dip tank 3 Flow occurs. As described above, the flow of the resin varnish 2 toward the traveling direction of the substrate 1 occurs on both sides of the path of the substrate 1 in the dip tank 3, so that the resin varnish 2 stays on both sides of the path of the substrate 1. As a result, the viscosity of the resin varnish 2 in the dip tank 3 can be kept constant, and the amount of impregnation of the resin varnish 2 with respect to the substrate 1 can be kept constant. It is possible to prevent the resin varnish 2 having a high viscosity or gelation from being generated and prevent the resin varnish 2 from adhering to the base material, thereby preventing deterioration of moldability.

  Further, in the illustrated example, the inner surface of the dip tank 3 has a shape along the path of the base material 1 in the dip tank 3 on one side and the other side of the path of the base material 1, and the resin varnish is formed. Since it functions as a guide plate 19 that guides the flow direction and a path through which the resin varnish 2 flows is formed between both surfaces of the substrate 1 and each guide plate 19, the flow of the resin varnish 2 in this path is It is further promoted.

  In the configuration shown in FIG. 3, the supply port 23 and the discharge port 22 as described above may be provided.

(Reference Examples 1-3, Examples 1-3, Comparative Example 1)
Using the respective apparatus configurations shown in the above-described embodiments, reference examples, and the prior art shown in FIG. 8, the base material 1 is actually impregnated with the resin varnish 2, and the results are shown. evaluated.

  Here, a product number “WEA-05E” manufactured by Nitto Boseki Co., Ltd. was used as the substrate 1, and this was conveyed while applying a tension of 245 to 294 N / m (24 to 30 kgf / m).

  Moreover, as the resin varnish 2, the following two types of varnish 1 and varnish 2 were used.

  -Varnish 1: Brominated epoxy ("DER514L EK80" manufactured by Dow Chemical Japan Co., Ltd.) 67.3 mass%, novolak type epoxy resin ("YDCN220 EK75" manufactured by Toto Kasei Co., Ltd.) 10.3 mass%, dicyandiamide (Nippon Carbide Industries) FR-4 type obtained by blending 11.9% by mass of a 12% by mass DMF solution “DICY” manufactured by Co., Ltd., 10.5% by mass of methoxypropanol, and 0.03% by mass of 2-methyl-4-methylimidazole. , Viscosity 200 cps (cP), thixotropic index (TI value) 2 or less.

  Varnish 2: 16% by mass of PPO (“Noryl 640-111” manufactured by Nippon GE Plastics Co., Ltd.), 24% by mass of TAIC (manufactured by Nippon Kasei Co., Ltd.), 50% by mass of toluene (manufactured by Nacalai Tesque Co., Ltd.), perbutyl P ( Nippon Oil & Fat Co., Ltd.) 20% by mass, silica (“Admafine S0-C2” manufactured by Admatechs Co., Ltd.) 8% by mass, filler-containing PPO resin varnish, viscosity 600-800 cps (cP), thixotropic Index (TI value) 5-6.

  And for every embodiment, the base material 1 was continuously impregnated with the resin varnish 2, and then heated and dried at 130 ° C. for 5 minutes to form a B-stage of the resin component to produce a prepreg. .

  Table 1 below shows the results of observing the appearance of the produced prepreg when the above varnishes 1 and 2 were used as the resin varnish 2 and the prepreg was continuously produced for 10 hours, 20 hours, and 30 hours. Shown in “Vertical line” was evaluated for the presence or absence of resin unevenness of the prepreg caused by poor impregnation due to viscosity change of the resin varnish 2, and “gelled product” was adhered to the surface of the prepreg with the gelled resin varnish 2. This is an evaluation of the presence or absence of molding defects.

  The numbers 6, 18, 20, and 23 in the supply amount column in the table indicate the supply amount of the resin varnish 2 from the supply pipe 6, the discharge device 18, the supply overflow tank 20, and the supply port 23, respectively. The numbers 8 and 22 indicate the discharge amount of the resin varnish 2 from the discharge overflow tank 8 and the discharge port 22, respectively.

  As shown in Table 1, compared with Comparative Example 1, the occurrence of defects was sequentially suppressed in Reference Examples 1 to 3 and Examples 1 to 3, and this was the case where a high viscosity, high thixotropic varnish 2 was used. However, it was confirmed that the occurrence of defects could be suppressed.

It is a schematic sectional drawing which shows an example of embodiment of this invention. It is a schematic sectional drawing which shows the other example of embodiment of this invention. It is a schematic sectional drawing which shows the other example of embodiment of this invention. It is a schematic sectional drawing which shows an example of a reference example. It is a schematic sectional drawing which shows the other example of a reference example. It is a schematic sectional drawing which shows the other example of a reference example. It is the schematic which shows the circulation flow of a resin varnish. It is a schematic sectional drawing which shows an example of a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base material 2 Resin varnish 3 Dip tank 9 Dip roll 19 Guide plate 20 Supply overflow tank 22 Discharge port 23 Supply port

Claims (13)

A process for producing a prepreg comprising a step of impregnating a base material impregnated with a resin varnish while conveying a long base material, and a step of forming a B-stage resin component of the base material impregnated with the resin varnish,
The step of impregnating the base material with the resin varnish allows the long base material to pass through the resin varnish stored in the dip tank, and is opposite to the base material drawing position with respect to the base material entry position. In this position, the resin varnish is supplied to the dip tank, and the resin varnish is discharged from the dip tank at a position opposite to the base entry position with respect to the base drawing position. It causes the resin varnish to flow in the direction of travel,
And in addition to discharge | emission of the said resin varnish, the resin varnish is discharged | emitted from the downward direction of the path | route of the base material in a dip tank, The manufacturing method of the prepreg characterized by the above-mentioned. Support the base material with the dip roll in the dip tank,
The resin varnish is discharged from the entry position side of the substrate below the dip roll when discharging the resin varnish from below the substrate path in the dip tank. Production method.   By supplying the resin varnish to the dip tank and discharging the resin varnish from the dip tank uniformly over the width direction of the base material, the resin varnish flows in the direction of the base material in the dip tank. The method for producing a prepreg according to claim 1, wherein the prepreg is produced.   Supply of the resin varnish to the dip tank at a position opposite to the substrate entry position with respect to the substrate entry position, and at a position opposite to the substrate entry position with respect to the substrate draw position The method for producing a prepreg according to any one of claims 1 to 3, wherein the resin varnish is discharged from the dip tank by an overflow method. A resin impregnation apparatus for impregnating the base material with a resin varnish while conveying a long base material,
A dip tank in which the resin varnish is stored; supply means for supplying the resin varnish into the dip tank at a position opposite to the base drawing position with respect to the base entry position; Discharging means for discharging the resin varnish from the dip tank at a position opposite to the position of the base material with respect to the position;
And in addition to the said discharge | emission means, the resin impregnation apparatus provided with the discharge port which discharges | emits the resin varnish from the downward direction of the path | route of the base material in a dip tank. The dip tank provides a dip roll that supports the base material in the dip tank.
6. The resin impregnation apparatus according to claim 5, wherein the discharge port is provided on the base material entry position side below the dip roll. A resin impregnation apparatus for impregnating the base material with a resin varnish while conveying a long base material,
A dip tank in which the resin varnish is stored; supply means for supplying the resin varnish into the dip tank at a position opposite to the base drawing position with respect to the base entry position; Discharging means for discharging the resin varnish from the dip tank at a position opposite to the position of the base material with respect to the position;
Further, in addition to the supply means and the discharge means, the supply means for supplying the resin varnish into the dip tank at a position on the base drawing position side with respect to the base entry position, and the base drawing position And a discharging means for discharging the resin varnish from the dip tank at a position on the entry position side of the base material.   8. A resin impregnation apparatus according to claim 7, wherein guide plates for guiding the flow direction of the resin varnish along the traveling direction of the substrate are provided on one side and the other side of the substrate in the dip tank. .   The resin impregnation apparatus according to claim 7 or 8, further comprising a discharge port for discharging the resin varnish from below the path of the base material in the dip tank, in addition to the discharge means.   The supply port for discharging the resin varnish in a direction along the flow direction of the resin varnish generated by the supply unit and the discharge unit in addition to the supply unit is provided in the dip tank. 9. The resin impregnation apparatus according to 8.   The resin impregnation apparatus according to any one of claims 5 to 10, wherein the supply means supplies the resin varnish uniformly in the width direction of the base material in the dip tank.   12. The resin impregnation apparatus according to claim 5, wherein the supply means includes a supply overflow tank for supplying the resin varnish to the dip tank by overflow.   The resin impregnation apparatus according to any one of claims 5 to 12, wherein the discharge means discharges the resin varnish uniformly in the width direction of the substrate in the dip tank.