JP2008066195A - Socket mechanism for semiconductor integrated circuit component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket mechanism for a semiconductor integrated circuit component that achieves elimination of poor contact between a contact part of a lid body and a lead terminal, regarding the socket mechanism for the semiconductor integrated circuit component. <P>SOLUTION: The socket mechanism for a semiconductor integrated circuit component comprises a socket pedestal or a printed circuit board, to which a semiconductor integrated circuit component to be measured is set, and the lid body that is mounted to the socket pedestal or the printed circuit board. The socket mechanism comprises so that the semiconductor integrated circuit component to be measured, which is set to the socket pedestal or the printed circuit board, is covered with the lid body and each lead terminal of the semiconductor integrated circuit component to be measured is pressed against a contact shoe of the socket pedestal or the printed circuit board by the contact part of the lid body so as to allow them to be electrically connected with each other. An elastically-deformable pressing plate, which is crimped to each lead terminal, when mounted to the socket pedestal or the printed circuit board, is attached to the contact part of the lid body corresponding to each lead terminal. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a socket mechanism for semiconductor integrated circuit components, and more particularly to a socket mechanism used for inspection, evaluation, and selection of surface mount packages such as SOP (Small Outline Package) and QFP (Quad Flat Package).

Conventionally, a socket mechanism has been widely used for inspection, evaluation, and sorting of semiconductor integrated circuit components, particularly surface mount packages such as SOP and QFP.
As disclosed in Patent Document 1, this socket mechanism is composed of a socket base for setting a semiconductor integrated circuit component to be measured, a printed circuit board for testing, and a lid (contact pusher) attached to the socket base. After setting the semiconductor integrated circuit component to be measured on the gantry or printed circuit board, cover the lid from above, and connect the lead terminal of the semiconductor integrated circuit component to be measured at the contact portion of the lid to the contact or printed circuit board on the socket gantry side. The electrical characteristics of the semiconductor integrated circuit component to be measured are inspected by being pressed and brought into electrical contact.
Japanese Patent No. 3109459

  However, if the accuracy of the lead terminals of the semiconductor integrated circuit components to be measured is poor, the lead thickness varies, and as a result, the semiconductor integrated circuit components to be measured set on the socket mount or printed circuit board are covered with a lid. Even if the lead terminal is pressed by the portion, the variation in the lead thickness cannot be absorbed and a gap corresponding to the variation is left between the contact portion and the lead terminal, causing a contact failure.

  The present invention has been devised in view of such circumstances, and an object of the present invention is to provide a socket mechanism for a semiconductor integrated circuit component that eliminates a contact failure between a contact portion of a lid and a lead terminal.

  In order to achieve such an object, the invention according to claim 1 comprises a socket base and a printed circuit board on which a semiconductor integrated circuit component to be measured is set, and a lid attached to the socket base and the printed circuit board. Cover the measurement semiconductor integrated circuit component with a lid, and press the lead terminal of the semiconductor integrated circuit component to be measured against the contact of the socket base or the printed circuit board at the contact portion of the lid to electrically contact the semiconductor integrated circuit component. In the socket mechanism, an elastically deformable pressing plate that is in pressure contact with the lead terminal is attached to the contact portion of the lid corresponding to each lead terminal when attached to a socket mount or a printed circuit board. To do.

  According to a second aspect of the present invention, in the socket mechanism for a semiconductor integrated circuit component according to the first aspect, the pressing plate is formed in an inverted V shape or arc shape when viewed from the front. The invention according to claim 3 is the socket mechanism of the semiconductor integrated circuit component according to claim 2, wherein the pressing plate is formed with a predetermined width dimension with a thickness capable of pressing the lead terminal, The center part of both ends is provided with a notch for deformation.

  According to a fourth aspect of the present invention, in the socket mechanism for a semiconductor integrated circuit component according to the third aspect, the holding plate has a guide hole formed in a central vertical direction, and the guide hole has a contact portion. In the socket mechanism of the semiconductor integrated circuit component according to claim 4, the elastic force of the pressing plate is provided in the contact portion. A metal receiving shaft that is elastically deformed by being pressed against the pressing plate during deformation is constructed above each pressing plate.

  Further, the invention according to claim 6 is the socket mechanism of the semiconductor integrated circuit component according to claim 5, wherein one end side of the receiving shaft protrudes outward from the contact portion. The invention according to item 7 is the socket mechanism of the semiconductor integrated circuit component according to claim 1, wherein the pressing plate is formed in a front inverted V shape or an arc shape by a thin plate spring. And

According to the invention according to each claim, even if the lead terminal accuracy of the semiconductor integrated circuit component to be measured is poor and the lead thickness varies, the variation in the lead thickness can be absorbed by the elastic deformation force of the holding plate, As a result, the connection sensitivity is improved, and the semiconductor integrated circuit component to be measured can be easily inspected, evaluated and selected.
According to the fifth aspect of the present invention, the variation in lead thickness can be absorbed by the double cushion due to the elastic deformation force of the holding plate and the elastic deformation force of the receiving shaft, and therefore there is an advantage that connection sensitivity is further improved. The invention according to claim 6 has the advantage that the measuring instrument can be connected to the one end side of the receiving shaft protruding outward from the contact portion via the clip.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
1 and 2 show an embodiment of a socket mechanism according to claims 1 to 6, and the socket mechanism 1 according to the present embodiment is a semiconductor integrated circuit component to be measured (hereinafter referred to as “measured IC”). 2 is configured with a test printed circuit board 5 for setting 3 and a lid (contact pusher) 7 which is detachably mounted on the printed circuit board 5 via a locking member (not shown), as shown in FIG. The lid body 7 is formed in a rectangular shape in plan view using an insulating material such as a plastic resin, and thick contact portions 9 project downward from left and right side portions thereof.

  As in the conventional case, the lid body 7 is configured to press the lead terminal 17 of the IC 7 to be measured to the printed circuit board 5 and make electrical contact with the printed circuit board 5 at the contact portion 9. The recess 15 is provided in the front-rear direction of the contact portion 9, and the recess 15 is partitioned into a plurality of chambers 19 by partition plates (not shown) corresponding to the plurality of lead terminals 17 of the IC 3 to be measured. ing. Then, one resin shaft (support shaft) 21 is laid in parallel in the front-rear direction of the contact portion 9 in each of the recesses 15 through the respective chambers 19. As shown in FIG. Both ends 21a of 21 are supported by a front wall 9a of the contact portion 9 and a rear wall (not shown).

Each chamber 19 is provided with a metal holding plate 23 that has been subjected to gold plating.
As shown in FIG. 1, the holding plate 23 is formed in a reverse V shape with a predetermined width dimension with a thickness capable of pressing the lead terminal 17, and the shaft 21 is inserted in the center thereof. A long hole-shaped guide hole 25 is provided in the vertical direction.

  Further, a deformed arc-shaped cutout 27 is provided at the center upper portion of both arm portions (both ends) 23 a of the presser plate 23, and the lid 7 is attached to the IC 3 to be measured attached to the printed circuit board 5. The tip of one arm portion 23a of the pressing plate 23 presses the lead terminal 17 and the tip of the other arm portion 23a presses the printed circuit board 5, while the entire pressing plate 23 is notched 27. It is designed to elastically deform around the center.

Each presser plate 23 moves upward along the guide hole 25 in accordance with the variation in the lead thickness of each lead terminal 17.
Further, as shown in FIG. 1, above the holding plate 23, one end 29 a side is held by the contact portion 9 and protrudes outward from the side wall 9 b of the contact portion 9, and the other end 29 b side is provided on the inner wall 9 c of the contact portion 9. A metal receiving shaft 29 that is loosely fitted in the insertion hole 31 is installed in a direction orthogonal to the shaft 21, and the entire pressing plate 23 is elastically deformed around the notch 27 as described above. On the other hand, when the pressing plate 23 moves upward along the guide hole 25, the pressing plate 23 comes into pressure contact with the receiving shaft 29 and the receiving shaft 29 is elastically deformed as shown in FIG.

For this reason, the lead terminal 17 is pressed by a so-called double cushion by the elastic deformation force of the holding plate 23 and the elastic deformation force of the receiving shaft 29.
A measuring instrument can be connected to one end 29a of the receiving shaft 29 protruding outward from the side wall 9b of the contact portion 9 via a clip.
Since the socket mechanism 1 according to the present embodiment is configured in this way, after setting the IC to be measured 3 on the printed circuit board 5, the lid body 7 is put on the IC 3 to be measured from above, and this is fixed to the locking member (FIG. 1, the tip of one arm portion 23 a of the pressing plate 23 presses the lead terminal 17 and the tip of the other arm portion 23 a presses the printed circuit board 5 as shown in FIG. 1. However, the entire pressing plate 23 is elastically deformed around the notch 27, and each pressing plate 23 moves upward along the guide hole 25 in accordance with the variation in the lead thickness of each lead terminal 17.

  When the pressing plate 23 moves upward in this manner, the pressing plate 23 is pressed against the receiving shaft 29 and the receiving shaft 29 is elastically deformed. As a result, the lead terminal 17 receives the elastic deformation force of the pressing plate 23 and the receiving force. Each lead terminal 17 is reliably pressed by each pressing plate 23 even if the lead terminal 17 is pressed by a so-called double cushion due to the elastic deformation force of the shaft 29 and the lead terminal 17 has poor accuracy and the lead thickness varies. Then, as described above, the measuring instrument is connected to the one end 29a of the receiving shaft 29 protruding outward from the side wall 9b of the contact portion 9 via the clip, thereby inspecting and evaluating the electrical characteristics of the IC 3 to be measured. Etc. can be performed.

As described above, according to this embodiment, even if the accuracy of the lead terminal 17 of the IC 3 to be measured is poor and the lead thickness varies, the lead is provided by the double cushion due to the elastic deformation force of the holding plate 23 and the elastic deformation force of the receiving shaft 29. Variations in thickness can be absorbed. As a result, connection sensitivity is improved, and the IC 3 to be measured can be easily inspected, evaluated, selected, and the like.
Further, by connecting a measuring instrument to one end 29a of the receiving shaft 29 protruding outward from the side wall 9b of the contact portion 9 via a clip, there is an advantage that the electrical characteristics of the IC 3 to be measured can be inspected and evaluated. Have.

  FIG. 3 shows a socket mechanism according to an embodiment of the first to fourth aspects of the present invention. The socket mechanism 33 according to the present embodiment omits the receiving shaft 29 and is elastically deformed to move upward along the guide hole 25. A pressing plate 23 that moves to the top of the room 19 (concave portion 15) is brought into contact with the top (ceiling) 35, and one end of the pressing plate 23 is in contact with the lead terminal 17. On the printed circuit board 5, a pattern 40 is provided in which the other end side of the pressing plate 23 abuts, and a measuring instrument is connected to the pattern 40.

Then, measurement data from the IC 3 to be measured is output from the lead terminal 17 and is conducted to the measuring instrument through the holding plate 23 and the pattern 40.
Since other configurations are the same as those of the embodiment of FIG. 1, the same components are denoted by the same reference numerals and description thereof is omitted.
Thus, according to the present embodiment, after setting the IC 3 to be measured on the printed circuit board 5, the lid 7 is placed on the IC 3 to be measured from above and is locked to the printed circuit board 5 by the locking member (not shown). Then, the variation in the lead thickness can be absorbed by the repulsive force from the top portion 35 and the elastic deformation force of the holding plate 23. As a result, also in this embodiment, the intended purpose is achieved as in the socket mechanism 1. Is possible.

  FIG. 4 shows a lid of a socket mechanism according to an embodiment of claims 1 and 7. The socket mechanism 37 according to the present embodiment replaces the pressing plate 23 with a pressing plate 39 using a thin plate spring. Since it is formed in a front inverted V shape and is supported by the support shaft 41 on the top (ceiling) 35 of each room 19 (recess 15), the other configurations are the same as in the embodiment of FIG. Those explanations are omitted.

  Since this embodiment is configured as described above, after setting the IC to be measured 3 on the printed circuit board 5, the lid body 7 is placed on the IC to be measured 3 from above, and this is attached to the printed circuit board 5 by a locking member (not shown). If locked, the variation in lead thickness can be absorbed by the elastic deformation force of the holding plate 39 formed by a leaf spring. As a result, the present embodiment also has the same expected as the socket mechanisms 1 and 33. It is possible to achieve the purpose.

In each of the above-described embodiments, the pressing plates 23 and 39 are formed in a reverse V shape when viewed from the front. However, the pressing plate may be formed in an arc shape when viewed from the front. It includes a letter shape that is reversed from the front.
Of course, the present invention can be applied to a socket mechanism including a lid and a socket base instead of the printed circuit board 5.

  Furthermore, as shown by a two-dot chain line in FIG. 1, the pattern 40 in FIG. 3 may be provided on the printed circuit board 5 instead of the receiving shaft 29.

It is a principal part expanded sectional view of the socket mechanism which concerns on one Embodiment of Claims 1 thru | or 6. It is a whole perspective view of a lid. It is a principal part expanded sectional view of the socket mechanism which concerns on one Embodiment of Claims 1 thru | or 4. It is a principal part expanded sectional view of the cover body of the socket mechanism which concerns on one Embodiment of Claim 1 and Claim 7.

Explanation of symbols

1,33,37 Socket mechanism 3 IC to be measured
5 Printed circuit board 7 Lid 9 Contact portion 15 Recess 17 Lead terminal 19 Chamber 21 Shaft (support shaft)
23, 39 Presser plate 23a Both arms (both ends)
25 Guide hole 27 Notch 29 Receiving shaft 31 Insertion hole 35 Top (ceiling)
40 patterns

Claims (7)

It consists of a socket base and printed circuit board on which the semiconductor integrated circuit components to be measured are set, and a lid attached to them, and covers the semiconductor integrated circuit components to be measured set on the socket base and printed circuit board to cover the cover. In the socket mechanism of the semiconductor integrated circuit component in which the lead terminal of the semiconductor integrated circuit component to be measured is pressed against the contact of the socket base or the printed circuit board to make electrical contact with
An elastically deformable pressing plate that press-contacts the lead terminal is attached to the contact portion of the lid body corresponding to each lead terminal when attached to a socket mount or a printed circuit board. Socket mechanism.   2. The socket mechanism for a semiconductor integrated circuit component according to claim 1, wherein the pressing plate is formed in an inverted V shape or arc shape when viewed from the front.   3. The presser plate according to claim 2, wherein the presser plate is formed to have a predetermined width dimension with a thickness capable of pressing the lead terminal, and a notch for deformation is provided in a central portion on both end sides. Socket mechanism for semiconductor integrated circuit components.   4. The semiconductor integrated circuit component according to claim 3, wherein a guide hole is formed in the vertical direction of the center of the pressing plate, and a support shaft inserted into the contact portion is inserted through the guide hole. Socket mechanism.   5. The semiconductor integrated circuit according to claim 4, wherein a metal bearing shaft, which is elastically deformed by pressing the pressing plate when the pressing plate is elastically deformed, is installed on the contact portion above each pressing plate. Part socket mechanism.   6. The socket mechanism for a semiconductor integrated circuit component according to claim 5, wherein one end side of the receiving shaft protrudes outward from the contact portion. 2. The socket mechanism for a semiconductor integrated circuit component according to claim 1, wherein the pressing plate is formed in a front inverted V shape or an arc shape by a thin plate spring.

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