JP2008064694A5 - - Google Patents

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Publication number
JP2008064694A5
JP2008064694A5 JP2006244980A JP2006244980A JP2008064694A5 JP 2008064694 A5 JP2008064694 A5 JP 2008064694A5 JP 2006244980 A JP2006244980 A JP 2006244980A JP 2006244980 A JP2006244980 A JP 2006244980A JP 2008064694 A5 JP2008064694 A5 JP 2008064694A5
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JP
Japan
Prior art keywords
temperature
vacuum chamber
measured
control means
measuring apparatus
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Pending
Application number
JP2006244980A
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Japanese (ja)
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JP2008064694A (en
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Priority to JP2006244980A priority Critical patent/JP2008064694A/en
Priority claimed from JP2006244980A external-priority patent/JP2008064694A/en
Publication of JP2008064694A publication Critical patent/JP2008064694A/en
Publication of JP2008064694A5 publication Critical patent/JP2008064694A5/ja
Pending legal-status Critical Current

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Claims (4)

真空チャンバーと、前記真空チャンバー内において被測定物の形状を測定する渉光学系と、前記真空チャンバーの減圧時に、空気の断熱膨張による前記被測定物の温度低下を抑制するための温調手段と、を有することを特徴とする干渉計測装置。 A vacuum chamber, and the interference optical system for measuring the shape of the workpiece in said vacuum chamber, during decompression of the vacuum chamber, temperature control means for suppressing a temperature drop of the object to be measured by the adiabatic expansion of the air And an interference measuring device characterized by comprising: 前記温調手段は、調水を前記被測定物の近傍に供給する配管手段を有することを特徴とする請求項1記載の干渉計測装置。 The interference measuring apparatus according to claim 1, wherein the temperature adjusting means includes piping means for supplying temperature- controlled water near the object to be measured. 前記温調手段は、前記被測定物の近傍に配設された放熱部材であることを特徴とする請求項1記載の干渉計測装置。 The temperature control means, interference measuring apparatus according to claim 1, wherein the a heat dissipating member that is disposed close to the object to be measured. 前記温調手段は、度を上昇させた気体を前記真空チャンバー内に供給する温度制御器であることを特徴とする請求項1記載の干渉計測装置。 The temperature control means, interference measuring apparatus according to claim 1, wherein the gas that increases the temperature is a temperature controller to be supplied to the vacuum chamber.
JP2006244980A 2006-09-11 2006-09-11 Interference measuring instrument Pending JP2008064694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006244980A JP2008064694A (en) 2006-09-11 2006-09-11 Interference measuring instrument

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006244980A JP2008064694A (en) 2006-09-11 2006-09-11 Interference measuring instrument

Publications (2)

Publication Number Publication Date
JP2008064694A JP2008064694A (en) 2008-03-21
JP2008064694A5 true JP2008064694A5 (en) 2009-11-12

Family

ID=39287526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006244980A Pending JP2008064694A (en) 2006-09-11 2006-09-11 Interference measuring instrument

Country Status (1)

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JP (1) JP2008064694A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5489690B2 (en) * 2009-12-15 2014-05-14 キヤノン株式会社 Interference measurement device
KR101248369B1 (en) 2011-07-21 2013-04-01 주식회사 현대케피코 Altitude test chamber

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57190318A (en) * 1981-05-19 1982-11-22 Toshiba Mach Co Ltd Electron beam exposure device
JPS61239624A (en) * 1985-04-16 1986-10-24 Toshiba Mach Co Ltd Apparatus and process of loading
JP3466707B2 (en) * 1994-05-23 2003-11-17 キヤノン株式会社 Interference measurement method and interference measurement apparatus using the same
JPH10312960A (en) * 1997-05-13 1998-11-24 Toshiba Mach Co Ltd Sample temperature stabilizer for electronic beam plotting device
JPH11168056A (en) * 1997-12-03 1999-06-22 Nikon Corp Wafer-holding device
JPH11312640A (en) * 1998-02-25 1999-11-09 Canon Inc Processor and device manufacturing method using the processor
JP2000088512A (en) * 1998-09-17 2000-03-31 Nikon Corp Interference measuring apparatus
JP2000161230A (en) * 1998-11-30 2000-06-13 Toshiba Ceramics Co Ltd Vacuum device and evacuating method
JP3950698B2 (en) * 2002-02-08 2007-08-01 キヤノン株式会社 Semiconductor exposure equipment
JP2006086387A (en) * 2004-09-17 2006-03-30 Nikon Corp Substrates transfer system, exposure equipment, and substrates transfer method

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