JP2008062373A - Inner periphery polishing method for disc-like substrate and disc-like substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inner periphery polishing method for polishing a hole drilled at the center of a disc-like substrate very precisely. <P>SOLUTION: The inner periphery polishing method comprises steps of: (S103) inserting a brush into the hole drilled in the disc-like substrate having the hole at the center; (S105) fixing one end and the other end of the brush to a pair of rotary shafts provided at positions where they are apart from each other; and (S108) rotating at least either of the brush and the disc-like substrate, and polishing it. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for polishing an inner periphery of a disk-shaped substrate such as a glass substrate for a magnetic recording medium.

  In response to the increasing demand for recording media, the manufacture of disk substrates, which are disk-shaped substrates, has recently become active. As a magnetic disk substrate which is one of the disk substrates, an aluminum substrate and a glass substrate are widely used. This aluminum substrate is characterized by high workability and low cost, and one glass substrate is characterized by excellent strength, surface smoothness and flatness. In particular, recently, the demand for miniaturization and high density of the disk substrate has been remarkably increased, and the degree of attention of the glass substrate capable of achieving high density with small roughness of the surface of the substrate has increased.

Various improvements have been made to the method of manufacturing such a magnetic disk substrate. As a conventional technique described in the publication, there is a technique for polishing an inner peripheral surface of a glass disk having a central hole (see, for example, Patent Document 1 and Patent Document 2).
In Patent Document 1, a laminated glass disk on which glass disks are laminated is set so as to be rotatable around a central axis, and a shaft-equipped polishing brush having innumerable brush bristles around the axis is inserted into the central hole of the laminated glass disk. Then, the inner peripheral surface of the laminated glass disk is polished by rotating the polishing brush with a shaft in the direction opposite to the rotating direction of the laminated glass disk while reciprocating.
Further, Patent Document 2 proposes a polishing method in which a glass substrate is immersed in a polishing liquid containing floating abrasive grains so as not to cause insufficient polishing or poor polishing due to liquid breakage. Moreover, in this patent document 2, by rotating the brush hair helically planted on the rotation shaft and polishing it, a fresh polishing liquid is always circulated and supplied to the surface to be polished, so that the polishing efficiency, reproducibility and accuracy are improved. A technique for enhancing the above is disclosed.

  FIGS. 10A and 10B are views for explaining a conventional method for polishing an inner periphery of a disc-shaped substrate (including the methods of Patent Documents 1 and 2). 10 (a) and 10 (b), a brush shaft is inserted into the center hole of the laminated disk-shaped substrate (laminated workpiece), and the brush shaft is used as a drive source in the upper direction (upper axis direction) of the brush shaft. It is rotating. Here, FIG. 10A shows an inner peripheral polishing method in which the lower shaft of the brush shaft is not supported at all and the brush shaft rotates while the lower shaft is free (free). FIG. 10B shows an inner peripheral polishing method in which the brush shaft rotates with a support such as a bearing provided on the lower shaft of the brush shaft.

  In this conventional method, in the case of one-side support as shown in FIG. 10 (a), the unsupported one side (non-fixed side) shakes greatly as shown in the right figure of FIG. 10 (a). The inner diameter of the disk on only one side where the brush has swung is greatly shaved. Further, in the lower shaft support degree as shown in FIG. 10 (b), the shaft is displaced (for example, lifted up) with respect to the support portion of the lower shaft, and the center portion swings as shown in the right figure of FIG. 10 (b). Becomes larger, and the inner diameter of the disk in the central portion is greatly shaved. In particular, when the brush rotates at a high speed, the phenomenon of the shake becomes remarkable. Further, when the diameter of the disk is reduced and the diameter of the inner peripheral surface to be processed is also reduced, and when the shaft diameter of the brush is required to be reduced accordingly, the rigidity of the brush shaft becomes weaker, and as shown in FIG. One side (non-fixed side) runout as shown in the right figure and the center part runout as shown in the right figure in FIG.

There are conventional techniques related to solving these problems (see, for example, Patent Document 3 and Patent Document 4).
In Patent Document 3, one end of the shaft of the shaft-equipped polishing brush is fixed by a motor, and the other end of the shaft is rotatably supported in the brush shaft support hole. Then, in this supported state, it moves up and down integrally with the brush shaft support hole so that the rotational support state continues even if the shaft-equipped polishing brush reciprocates. This prevents the shaft tip at the other end of the brush that is not on the motor fixing side from shaking.
In Patent Document 4, a polishing brush with a shaft is inserted into the center hole of the laminated glass disk, and the inner peripheral surface is polished by rotating and reciprocating in a state where a load is applied downward to the shaft. As a result, downward tension is applied to the shaft, and even if a thin shaft is used, bending and minute vibration can be prevented, and polishing of each part at the upper, middle and lower parts of the laminated glass disk is performed evenly. It is described that it can.

Japanese Patent Laid-Open No. 11-33886 JP-A-11-221742 JP 2000-84828 A JP 2006-7350 A

  However, in the configuration in which the other end of the shaft is simply supported and only one end is rotationally driven as described above, for example, it is difficult to uniformly process the inner peripheral surface due to the twisting phenomenon of the shaft, and the polishing accuracy of the inner peripheral surface is deteriorated. It has become apparent that In particular, when the brush shaft has a flexible shaft core, or when it is necessary to make the brush shaft thinner in order to polish small-diameter holes, the inner peripheral surface can be uniformly polished. It becomes more difficult.

  The present invention has been made in order to solve the technical problems as described above, and an object of the present invention is to perform inner peripheral polishing capable of polishing a central opening of a disk-shaped substrate with extremely high accuracy. It is to provide a method.

  In order to achieve such an object, a method for polishing an inner periphery of a disk-shaped substrate to which the present invention is applied includes a step of inserting a brush into the opening of a disk-shaped substrate having a hole in the center, one end of the brush, and the like. A step of fixing the ends to a pair of rotating shafts provided at positions spaced apart from each other; and a step of rotating and polishing at least one of a brush or a disk-shaped substrate.

Here, the brush inserted into the hole is preferable in that the hair tips are arranged in a spiral shape, so that the polishing liquid can be satisfactorily filled in the hole in the center of the disk-shaped substrate. . This is particularly effective when, for example, a polishing apparatus that does not dip the entire disk-shaped substrate into the polishing liquid is used.
Further, even when the brush core is flexible, the brush inserted into the opening can be made uniform by being fixed to the pair of rotating shafts.
Further, as the brush, a first brush having a low bristle hardness and a long length, and a second brush having a bristle hardness and a short length compared to the first brush are used. it can.

Further, this polishing step is excellent in that, for example, the twisting phenomenon of the brush shaft can be suppressed if the brush is rotated by synchronously rotating the pair of rotating shafts. In particular, when the diameter of the disk-shaped substrate becomes small and it is necessary to use a thin brush, the effect is great. In addition, when an embodiment in which the core of the brush is formed by twisting the wire is employed, the effect of synchronous rotation can be expected to be even greater.
Furthermore, the pair of rotating shafts are synchronously rotated by mechanically connecting the pair of rotating shafts by a single motor or by controlling individual motors provided for each pair of rotating shafts.

  On the other hand, when the present invention is grasped from another viewpoint, an inner circumferential polishing method to which the present invention is applied includes a step of inserting a first brush into the opening of a disk-shaped substrate having an opening at the center, A step of fixing one end and the other end of the brush to a pair of rotating shafts provided at positions spaced apart from each other, a step of rotating and polishing at least one of the first brush or the disc-like substrate, and a disc shape Extracting the first brush from the substrate, inserting the second brush into the opening of the disk-shaped substrate, fixing one end and the other end of the second brush to a pair of rotating shafts; And rotating and polishing at least one of the second brush or the disk-shaped substrate.

Here, the second brush can be characterized in that the hardness of the hair is higher than that of the first brush.
In addition, the second brush can be characterized in that the length of the hair is shorter than that of the first brush.

  Furthermore, the disk-shaped substrate to which the present invention is applied can be characterized in that the inner periphery is polished by these inner periphery polishing methods.

  According to the present invention configured as described above, it is possible to stably rotate the brush from both ends of the brush shaft as compared with the case where these configurations are not adopted, and the center hole of the disk-shaped substrate is formed. Polishing can be performed with extremely high accuracy.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIGS. 1-1 (a) to (d) and FIGS. 1-2 (e) to (h) are diagrams showing a manufacturing process of a disk-shaped substrate (disk substrate) to which the present embodiment is applied. In this manufacturing process, first, the raw material of the disk-shaped substrate (work) 10 is placed on the surface plate 21 in the primary lapping process shown in FIG. 1-1 (a), and the flat surface 11 of the disk-shaped substrate 10 is shaved. At this time, for example, diamond coating particles are dispersed and scattered on the surface of the surface plate 21 on which the disk-shaped substrate 10 is placed. Next, in the inner and outer peripheral grinding step shown in FIG. 1-1 (b), the opening 12 provided in the center of the disc-shaped substrate 10 is ground by the inner peripheral grindstone 22, and the outer periphery 13 of the disc-shaped substrate 10 is outer peripheral. Grind with the grindstone 23. At this time, it is possible to easily ensure the coaxiality of the inner and outer diameters by sandwiching the inner and outer peripheral surfaces of the disc-shaped substrate 10 with the inner and outer peripheral grinding stones 22 and 23 and simultaneously processing them. In the outer periphery polishing step shown in FIG. 1-1C, the outer periphery 13 of the disk-shaped substrate 10 is polished using the outer periphery polishing brush 24. Thereafter, in the secondary lapping step shown in FIG. 1-1D, the disc-like substrate 10 is placed on the surface plate 21, and the plane 11 of the disc-like substrate 10 is further shaved.

  Next, in the inner periphery polishing step shown in FIG. 1-2 (e), the brush 60 is inserted into the central opening of the disc-like substrate 10 to polish the opening 12 of the disc-like substrate 10. Thereafter, the disk-shaped substrate 10 is placed on the surface plate 21 in the primary polishing step shown in FIG. 1-2 (f), and the flat surface 11 of the disk-shaped substrate 10 is polished. For this polishing, for example, a hard polisher is used as a non-woven fabric (abrasive cloth). Further, planar polishing using a soft polisher is performed in the secondary polishing step shown in FIG. Thereafter, cleaning and inspection are performed in the final cleaning / inspection step shown in FIG. 1-2 (h), and a disk-shaped substrate (disk substrate) is manufactured.

Next, the inner periphery polishing step shown in FIG.
FIG. 2 is a flowchart showing the flow of the inner periphery polishing step. First, the overall processing flow will be roughly described. In the inner periphery polishing process, first, the disk-shaped substrate (workpiece) 10 is set on a mounting jig (step 101). Next, the disk-shaped substrate 10 (laminated workpiece) stacked on the mounting jig is set in the holder (step 102). Then, the first brush is inserted into the central hole of the laminated workpiece set in the holder (step 103). The first brush is a brush that is softer than the second brush described later and has a long bristle length. It is used to satisfactorily polish the chamfered portion formed on the inner periphery of the disk-shaped substrate (workpiece) 10. Both the first brush and the second brush are characterized in that the hair tips are arranged in a spiral shape and the core has flexibility.

  Next, the holder in which the laminated work is set and the first brush is inserted is set in the polishing apparatus in a horizontal position (step 104). Then, one end of the brush protruding from the end of the holder is fixed to the first rotating shaft of the polishing apparatus, and the other end of the brush is fixed to the second rotating shaft of the polishing apparatus (step 105). With the above operation process, the attachment of the workpiece to the polishing apparatus is completed.

  After the work is attached, the pump is driven to supply the polishing liquid to the liquid tank of the polishing apparatus (step 106). In the region of the liquid tank of the polishing apparatus, the holder is set in a horizontal state, and in this state, approximately half of the horizontal axis direction of the holder is immersed in the polishing liquid. Further, before and after the supply of the polishing liquid, the brush core is pulled in the axial direction by the polishing apparatus, and the pulled state is maintained (step 107).

  In this state, while supplying the polishing liquid, the brush is rotated in the first direction, and the holder is rotated in the second direction which is the rotation direction opposite to the first direction to perform polishing ( Step 108). At this time, the holder is reciprocated in the axial direction of the brush (step 109). By reciprocating, it becomes possible to shift the position of the brush that comes in contact with the workpiece by moving the holder and the brush relative to each other, preventing unevenness of polishing by polishing the same location with the same brush, More uniform polishing is possible. This polishing operation is performed for a predetermined polishing time (step 110). That is, the control unit of the polishing apparatus determines whether or not a predetermined time has elapsed as the time required for polishing (polishing time) obtained from an empirical rule. If the polishing time has not elapsed, step 108 is performed. When the polishing time elapses, the polishing apparatus is stopped (step 111).

  Thereafter, the polishing apparatus is operated to release the pull on the brush, and one end and the other end of the brush are removed from the rotating shaft (step 112). Then, the one end and the other end of the holder are reversed, the holder is placed on the polishing apparatus, and the processes shown in steps 104 to 112 are repeated (step 113). In this way, by performing the same process by reversing the holder, it is possible to change the polishing conditions, such as reversal of the rotation direction, and to suppress uneven polishing due to the polishing conditions. After the polishing after the reversal is completed, the first brush is removed from the holder, and the second brush having a higher hardness than the first brush is inserted into the opening in the center of the laminated workpiece set in the holder. (Step 114). The second brush with high hardness is for polishing the inner peripheral surface of the disk-shaped substrate 10 and has a shorter hair length than the first brush. Thereafter, in the processes shown in steps 104 to 113, the polishing process is performed in the same manner as the polishing process performed using the first brush (step 115). Note that the polishing conditions such as the polishing time and the number of rotations in step 110 can be made different depending on whether the first brush is used or the second brush is used. After the polishing process is completed, the brush and workpiece are taken out from the holder (step 116), the inner peripheral polishing process is ended, and the process proceeds to the next process.

Next, the inner periphery polishing process shown in each step of FIG. 2 will be described in more detail with reference to the drawings.
FIGS. 3A to 3D and FIGS. 3B to 3E are perspective views for explaining attachment of the disc-like substrate 10 shown in Step 101 to the jig. FIG. 3A is a perspective view of the disk-shaped substrate 10 as a work, and FIG. 3B is a partial cross-sectional view of the center hole portion of the disk-shaped substrate 10. 3C shows the polishing liquid introduction spacer 41, and FIG. 3D shows the both end spacers 42. FIG. Further, FIG. 3-2 (e) shows a state where the elements shown in FIGS. 3-1 (a) to (d) are attached to the jig 44. FIG.

  The disk-shaped substrate 10 to be polished is, for example, a glass having a diameter of about 21.66 mm, a thickness of about 1 mm, and a diameter of the central aperture 12 of about 6 mm in order to produce a disk substrate having a diameter of 0.85 inches. It is a substrate. As shown in FIG. 3B, the opening 12 of the disk-shaped substrate 10 includes an inner peripheral surface 12a and a chamfered portion 12b obtained by cutting the corner of the inner peripheral surface 12a. By providing the chamfered portion 12b, it is possible to suppress problems such as cracks and chipping in subsequent processing steps and assembly steps.

  The polishing liquid introducing spacer 41 shown in FIG. 3C has a function of supplying a polishing liquid (slurry) to the central opening 12 of the stacked disk-shaped substrate 10 (laminated work). In order to achieve such a function, as shown in FIG. 3C, the polishing liquid introduction spacer 41 includes an end surface 41a and an axial surface 41b that forms a surface having a smaller diameter than the outer diameter of the end surface 41a. A plurality of (for example, six) circulation supply holes 41c, which are through holes for supplying the polishing liquid (slurry) to the opening 12 at the center of the laminated workpiece, are formed on the axial surface 41b. The inner circumference of the axial surface 41 b has a larger diameter than the inner circumference of the disc-like substrate 10. Further, as a material of the polishing liquid introducing spacer 41, synthetic resin such as ABS, POM, Teflon (registered trademark), polyamide or the like is used.

  The both-end spacer 42 shown in FIG. 3D does not arrange the disk-shaped substrate 10 at the end of the brush where the number of stacked disk-shaped substrates 10 may be adjusted or the polishing properties may become unstable. It is provided for. The both end spacers 42 are formed of the same material as the polishing liquid introducing spacer 41 (ABS, POM, Teflon (registered trademark), synthetic resin such as polyamide). The outer diameter dimension is slightly smaller (for example, about 1 to 5 mm) than the outer diameter dimension of the disk-shaped substrate 10, and the inner diameter dimension is equal to or greater than the inner diameter of the disk-shaped substrate 10.

As shown in FIG. 3-2 (e), the disk-shaped substrate 10 shown in FIGS. 3-1 (a) and (b) is superposed to form a laminated work, and FIGS. 3-1 (c) and (d). And the dummy substrate 43 are attached to the jig 44. In this jig, for example, 150 disc-like substrates 10 are overlapped as a whole, and for example, 40 sheets between one end where the both-end spacers 42 are provided and the polishing liquid introduction spacer 41, between the two polishing liquid introduction spacers 41. In addition, for example, 40 sheets of laminated workpieces are attached from the polishing liquid introduction spacer 41 to both end spacers 42 at the other end. By providing the dummy substrate 43 between each spacer (polishing liquid introduction spacer 41, both end spacers 42) and the disc-like substrate 10, the disc-like substrate 10 formed by the contact of each spacer with the flat surface 11 of the disc-like substrate 10 is provided. Quality degradation can be suppressed. However, this dummy substrate 43 may not be used depending on the material of each spacer.
Then, by laminating the disk-shaped substrate 10 as shown in FIG. 3-2 (e), the interval between the polishing liquid introduction spacers 41 and the position in the axial direction are determined.

  FIG. 4 is a view showing a substrate holder (holder) 50 for setting the laminated workpiece shown in step 102. The substrate holder 50 is formed entirely of stainless steel, for example, and includes a mounting hole 51 for mounting the stacked disk-shaped substrate 10 (laminated workpiece) as shown in FIG. An inflow opening 53 is provided for allowing the polishing liquid (slurry) to flow into the outer periphery 52a and the mounting hole 51. Further, a fin 54 is provided in the vicinity of the inflow opening 53 and on the surface of the outer periphery 52 a and guides the polishing liquid (slurry) to the inflow opening 53. The inflow openings 53 and the fins 54 are formed at two positions in the axial direction. For example, six inflow openings 53 are provided on the surface of the outer periphery 52 a, and fins are provided between the inflow openings 53. 54 is formed.

  As shown in FIG. 3-2 (e), the two positions in the axial direction where the inflow openings 53 are formed are set when the laminated work shown in FIG. 3-2 (e) is set on the substrate holder 50. It almost coincides with the axial position of the two polishing liquid introduction spacers 41 set. Due to the structure formed by the step formed between the outer periphery 52a and the outer periphery 52b having a larger diameter than the outer periphery 52a and the fin 54, the polishing liquid (slurry) is scraped up by the rotation of the substrate holder 50. A polishing liquid (slurry) is supplied to the opening 53 for use.

  In addition, the substrate holder 50 is formed with contact ring members 55 made of acetal resin such as Delrin (registered trademark of DuPont) on the outer periphery 52b at two (a plurality of) axial positions. Further, gears 56 for rotating the substrate holder 50 are formed at two positions in the axial direction. Furthermore, a nut 57 for pressing the laminated workpiece in the axial direction after the laminated workpiece is inserted and fixing the laminated workpiece to the substrate holder 50 is provided. In FIG. 4, the nut 57 is shown only on one side in the axial direction. However, after the laminated workpiece is inserted, the nut 57 is also provided on the other side in the axial direction. That is, after inserting the laminated work into the mounting hole 51, the nut 57 is tightened using the other screw portion 58 to fix the laminated work. After fixing the laminated workpiece by the nut 57, the jig 44 shown in FIG. 3-2 (e) is pulled out from the laminated workpiece and removed. The contact ring member 55 is used for positioning the entire substrate holder 50 when the substrate holder 50 is disposed in the polishing apparatus, and also defines the interaxial distance between the drive side gear (described later) of the polishing apparatus and the gear 56. In addition, the substrate holder 50 abuts on a flange (described later) of the polishing apparatus to reciprocate the substrate holder 50 in the axial direction.

  FIG. 5 is an external view showing the brush 60 inserted into the central hole 12 of the disc-like substrate 10 set in the substrate holder 50 in Step 103 and Step 114. The brush 60 includes a brush portion 61 formed by arranging the hair tips in a spiral shape, a large diameter portion 62 formed continuously at both ends of the brush portion 61, and a continuous diameter portion 62. And a shaft 63 forming one end and the other end. The large diameter portion 62 includes a caulking portion 62a for coupling the end of the brush portion 61 to the shaft 63, and a damming portion for damming (preventing) the flow of the polishing liquid (slurry) from the brush portion 61 to the end portion. 62b. That is, when the brush 60 rotates in a predetermined direction with the substrate holder 50 being dipped in the polishing liquid (slurry), the brush portion 61 formed by arranging the hair tips in a spiral shape is unidirectional in the axial direction. The polishing liquid (slurry) flows through At this time, the polishing liquid (slurry) is blocked by the blocking part 62b of the large diameter part 62, and the flow of the polishing liquid (slurry) to the end of the brush 60 is prevented.

  The brush 60 needs to make the core of the brush 60 thinner in order to polish the inner diameter of a small-diameter disk such as 0.85 inch as the opening 12 at the center of the disc-like substrate 10. Therefore, in this embodiment, for example, a plurality of wires (materials: for example, mild steel wire (SWRM), hard steel wire (SWRH), stainless steel wire (SUSW), brass wire (BSW), workability, rigidity, etc. The brush portion 61 is formed by sandwiching the hair of the brush (material: for example, nylon (trade name of DuPont)) and twisting the wire in which the hair is sandwiched. By twisting this wire to form the brush part 61, the brush bristles formed on the brush part 61 can be spiraled, and the polishing liquid is formed in the opening 12 at the center of the inserted laminated workpiece. (Slurry) can be allowed to flow in the axial direction, and the polishing liquid (slurry) can be transported well at this location. Further, by providing the blocking portions 62b at both ends of the brush portion 61, it is possible to suppress the flow of the polishing liquid (slurry) to the end portions.

  In the brush 60 having such a configuration, the core of the brush portion 61 of the brush 60 has flexibility. In this embodiment, the “flexibility” refers to flexibility that allows a person to bend lightly by holding both ends, and flexibility that allows a person to touch and bend both ends. As an example, for example, with a brush 60 formed by twisting four wires sandwiching the bristles of a brush with a soft steel wire (SWRM) having a diameter of about 0.2 mm, both ends of the brush shaft are held with free end support, Deflection was seen when the central part of the brush 60 was pressed at about 100 gf. This value varies depending on the thickness, type, twisting method and the like of the wire. As this flexibility, for example, both ends of the brush shaft may be held with free end support, and the flexibility may be such that the center portion of the brush 60 bends while being pressed at about several hundred gf.

  In the present embodiment, as the brush 60, two types of a first brush and a second brush are prepared. The first brush inserted in step 103 is a brush with soft and long hairs, and the second brush inserted in step 114 is a brush with hard and short hairs compared to the first brush. By using the first brush with soft and long bristles, the chamfered portion 12b (see FIG. 3-1) of the disc-like substrate 10 is polished well. On the other hand, the inner peripheral surface 12a (see FIG. 3A) of the disc-like substrate 10 can be satisfactorily polished by using the second brush with hard and short hair. Thus, a plurality of surfaces can be satisfactorily polished by using a plurality of brushes 60 having different hair states. In the disk substrate as a product, since the dimensional accuracy of the inner peripheral surface 12a is required more, it is preferable to use a brush 60 that is good for polishing the inner peripheral surface 12a as the second brush that is a subsequent process.

Next, the polishing apparatus 70 used in steps 104 to 112 will be described with reference to FIGS.
FIG. 6 is a perspective view showing a state in which the substrate holder 50 on which the disc-like substrate 10 and the brush 60 are set is set in the polishing apparatus 70 with the axial direction as the horizontal direction (substantially horizontal direction). FIG. 7 is an explanatory view showing a drive system of the polishing apparatus 70. Further, FIG. 8 is an explanatory view showing a drive system for rotating the substrate holder 50, omitting the state viewed from the second rotating shaft 72 side in the axial direction of the polishing apparatus 70 shown in FIG. 6. .

  As shown in FIGS. 6 and 7, the polishing apparatus 70 includes a first rotating shaft 71 to which one end of the shaft 63 of the brush 60 is fixed, and a second rotating shaft 72 to which the other end of the shaft 63 is fixed. And a liquid tank 73 for storing a polishing liquid (slurry). In addition, a first support shaft 74 and a second support shaft 75 that support the substrate holder 50 are provided. The second support shaft 75 is provided with a drive side gear 76 that meshes with the gear 56 of the substrate holder 50 and rotates the substrate holder 50.

  The first rotating shaft 71 and the second rotating shaft 72 are constituted by integrated members 71a and 72a integrated with the rotating shaft, and divided members 71b and 72b attached by set screws (not shown) or the like. These are combined in a plane including the central axis to form the individual first rotating shaft 71 and second rotating shaft 72. When the substrate holder 50 is placed on the polishing apparatus 70 with the divided members 71b and 72b removed, both ends of the shaft 63 of the brush 60 are accommodated in the central portions of the integrated members 71a and 72a. Thereafter, the split members 71 b and 72 b are attached to the integrated members 71 a and 72 a with set screws, so that one end of the shaft 63 can be fixed to the first rotating shaft 71 and the other end can be fixed to the second rotating shaft 72.

  The first support shaft 74 and the second support shaft 75 are provided with ring members 74 a, 74 c, 75 a, and 75 c that support the substrate holder 50 by contacting the contact ring member 55 of the substrate holder 50. . The four annular members 74a, 74c, 75a, 75c support the substrate holder 50 in the horizontal direction while positioning the substrate holder 50, and even when the first support shaft 74 and the second support shaft 75 rotate, The contact with the contact ring member 55 is maintained, and the position of the substrate holder 50 with respect to the shaft 63 of the brush 60 is maintained within a combination accuracy that does not affect polishing. Further, the annular members 74a, 74c, 75a, and 75c are brought into contact with the contact annular member 55, so that the center distance between the gear 56 of the substrate holder 50 and the drive side gear 76 of the polishing apparatus 70 is set within a predetermined range. Keeps the bite well. As shown in FIG. 4, the substrate holder 50 is provided with gears 56 at two positions in the axial direction. Even when the substrate holder 50 is reversed at step 113 in FIG. It is possible to connect the gear 76 to one of the gears 56.

  As shown in FIG. 8, the polishing apparatus 70 includes a holder drive motor 77 that is a drive source, a belt 78 that transmits the drive force of the holder drive motor 77 to the first support shaft 74 and the second support shaft 75, and And a pulley 79. When the belt 78 is rotated in the direction F by the holder driving motor 77, the first support shaft 74 and the second support shaft 75 are rotated in the direction G. By this rotation in the G direction, the drive side gear 76 provided on the second support shaft 75 also rotates in the G direction, and the gear 56 (on the substrate holder 50 side) meshing with the drive side gear 76 rotates in the E direction. As a result, the substrate holder 50 rotates in the E direction.

  Further, as shown in FIGS. 6 and 7, the annular members 74a, 74c, 75a, 75c of the first support shaft 74 and the second support shaft 75 are provided with flanges 74b for reciprocating the substrate holder 50. , 74d, 75b, 75d are formed. The flanges 74b, 74d, 75b, and 75d are ring edges that are larger in diameter than the ring members 74a, 74c, 75a, and 75c, and are in contact with the ring members 74a, 74c, 75a, and 75c. It faces the side surface of the annular member 55. The flange 74 b and the flange 74 d are arranged symmetrically in the axial direction of the first support shaft 74. Similarly, the flange 75b and the flange 75d are arranged symmetrically in the axial direction of each of the second support shafts 75. When the first support shaft 74 and the second support shaft 75 are reciprocated in the axial direction, the side surfaces of the flange edges of the flanges 74b, 74d, 75b, 75d push the contact ring member 55, thereby The substrate holder 50 can be reciprocated. That is, when the first support shaft 74 and the second support shaft 75 are moved in the direction B in FIG. 7, the flange 74 d and the flange 75 d push one of the contact ring members 55 of the substrate holder 50, whereby the substrate holder 50 moves in the B direction. On the other hand, when the first support shaft 74 and the second support shaft 75 are moved in the direction C in FIG. 7, the flange 74 b and the flange 75 b push the other contact ring member 55 of the substrate holder 50, whereby the substrate holder 50 moves in the C direction. As described above, in the present embodiment, instead of reciprocating the shaft 63 of the brush 60 to which a tensile force is applied, the substrate holder 50 is reciprocated, and the stacked disk-shaped substrate 10 (laminated workpiece) ) Is reciprocated. This enables relative movement in the axial direction between the brush 60 and the disk-shaped substrate 10 (laminated workpiece) laminated.

  As shown in FIG. 7, the polishing apparatus 70 includes a brush motor 81 that rotates the brush 60. Further, as a coupling mechanism for synchronously rotating at one end and the other end of the shaft 63 of the brush 60 using the rotation of the brush motor 81, a first pulley 82, a first belt 83 that is a toothed belt, and a second pulley. 84, a rotary shaft 85, a third pulley 86, a second belt 87 that is a toothed belt, and a fourth pulley 88. By these connection mechanisms, the rotation of the brush motor 81 is mechanically connected to the first rotation shaft 71 and the second rotation shaft 72, and one end and the other end of the shaft 63 of the brush 60 rotate in synchronization. It becomes possible. Instead of such mechanical connection, a configuration in which a motor is individually connected to each of the first rotating shaft 71 and the second rotating shaft 72 and is electrically synchronized can be employed.

The polishing apparatus 70 also includes an air cylinder 91 that applies a tensile force (tension) in the axial direction to the brush 60, and a tension mechanism 92 that applies the tensile force of the air cylinder 91 to the second rotating shaft 72. . Due to the pulling force by the air cylinder 91, the second rotating shaft 72 moves in the direction A in the drawing via the pulling mechanism 92. By maintaining the state in which the air cylinder 91 is pulled, the pulling force (tension) in the axial direction with respect to the brush 60 is maintained. An example of this movement will be described in detail. For example, a ball spline 92a capable of transmitting torque and enabling linear motion rolling motion is provided in connection with the second rotating shaft 72. When the air cylinder 91 is operated and pulled in the A direction by the pulling mechanism 92, the ball spline 92a can be slid to reduce the distance between the second rotating shaft 72 and the fourth pulley 88. In this state, The second rotating shaft 72 is rotated by the driving force obtained from the brush motor 81 through the coupling mechanism. As another example, the distance between the second rotating shaft 72 and the fourth pulley 88 is not changed, and the position of the fourth pulley 88 is shifted in the A direction by the pulling force of the air cylinder 91. A configuration that can maintain the transmission force from the two belts 87 may be employed.
In addition, it is also possible to employ a configuration in which a pulling mechanism is provided on both of the first rotating shaft 71 and the second rotating shaft 72 as well as on both of the rotating shafts.

  Further, the polishing apparatus 70 includes stirring blades 93 on the first support shaft 74 and the second support shaft 75. By rotating the stirring blade 93 by the rotation of the first support shaft 74 and the second support shaft 75, it is possible to circulate the polishing liquid (slurry) at the bottom of the liquid tank 73.

  Further, the polishing apparatus 70 has a drive motor 95 and an eccentric cam 96 as a mechanism for reciprocating the first support shaft 74 and the second support shaft 75 in the axial directions shown in the B and C directions in the figure. , A link 97, and a moving body 98. The eccentric cam 96 is rotated by the rotation of the drive motor 95, and the link 97 connected to the eccentric cam 96 swings the moving body 98. As a result, the first support shaft 74 and the second support shaft 75 connected to the moving body 98 reciprocate in the B direction and the C direction in the drawing. As described above, the substrate holder 50 is reciprocated by the reciprocation of the first support shaft 74 and the second support shaft 75.

FIG. 9 is a perspective view for explaining a state in which the polishing liquid (slurry) 100 is supplied to the liquid tank 73. As shown in step 106 of FIG. 2, a pump (not shown) is driven to supply the polishing liquid (slurry) 100 to the liquid tank 73 of the polishing apparatus 70. In the liquid tank 73, the polishing liquid (slurry) 100 is stored up to almost the center of the horizontally set substrate holder 50. That is, a part, not all, of the substrate holder 50 is dipped in the polishing liquid (slurry) 100.
In the present embodiment, the first support shaft 74 and the second support shaft 75 are provided outside the liquid tank 73, and the first support shaft 74, the second support shaft 75, and the brush motor 81 (see FIG. 7). Various drive mechanisms such as a coupling mechanism are also separated from the liquid tank 73. As a result, the polishing liquid (slurry) 100 is not immersed in various drive mechanisms, and the problem that mechanical parts such as bearings are worn by the abrasive contained in the polishing liquid (slurry) can be solved.

  Before and after the process of step 106, as shown in step 107, the air cylinder 91 (see FIG. 7) is operated to apply a pulling force to the shaft 63 of the brush 60. The tensile force is preferably about 5 to 50 kgf, more preferably about 10 to 20 kgf. In the present embodiment, eccentric rotation as shown in FIGS. 10A and 10B is suppressed by supporting the shaft 63 of the brush 60 at both ends and applying tension. For this reason, the lower limit value of the pulling force is an experimentally determined value that suppresses eccentric rotation in consideration of the rigidity of the brush, the rotation speed of the brush, and the like. On the other hand, as described with reference to FIG. 5, the shaft core of the brush portion 61 of the brush 60 is formed by twisting a wire. Therefore, the upper limit value of the pulling force is determined according to the characteristics of the brush 60 as a value that does not overstretch the axis of the brush portion 61 and does not disturb the properties of the brush tips.

  Thereafter, as a process of step 108, the first rotating shaft 71 and the second rotating shaft 72 are connected to both ends of the brush 60 to which a tensile force is applied in a state where the polishing liquid (slurry) 100 shown in FIG. 9 is supplied. Use to rotate in the first direction (D direction in the figure). As a rotation speed of the brush 60, about 1500-2000 rpm is preferable, for example. At the same time, the holder drive motor 77 shown in FIG. 8 is activated to rotate the substrate holder 50 in the second direction (E direction in the figure). As the rotation speed of the substrate holder 50, 20 rpm, 40 rpm, 60 rpm, or the like is selected. At this time, the drive motor 95 shown in FIG. 7 is operated to reciprocate the substrate holder 50 in the axial direction as described in Step 109.

  When the substrate holder 50 is rotated in the E direction in the state shown in FIG. 9, the polishing liquid (slurry) 100 is scraped up by the fins 54, and the polishing liquid (slurry) 100 is introduced into the substrate holder 50 from the inflow opening 53. Flow into. Then, the polishing liquid (slurry) 100 supplied from the inflow opening 53 wraps the polishing liquid introduction spacer 41 shown in FIG. 3-2 (e) inside the substrate holder 50, and FIG. ) And the inner peripheral surface of the substrate holder 50 are filled with a polishing liquid (slurry) 100. Then, the polishing liquid (slurry) 100 is supplied to the central opening 12 of the stacked disk-shaped substrate 10 (laminated workpiece) through the circulation supply hole 41 c of the polishing liquid introducing spacer 41. The polishing liquid (slurry) 100 supplied to the central aperture 12 is moved in the axial direction by the brush 60 in which the hair tips are arranged in a spiral shape. Due to these actions, even if polishing is started from a state in which a part of the substrate holder 50 is dipped in the polishing liquid (slurry) 100, the opening 12 at the center of the disk-shaped substrate 10 (laminated workpiece) is axially formed. Is sufficiently filled with the polishing liquid (slurry) 100.

Here, conventionally, when polishing a disk substrate with a predetermined brush, the polishing liquid is dropped on the inner peripheral surface, which is the surface to be polished, or the entire disk substrate and brush are immersed in a tank of the polishing liquid. . For example, when the structure shown in FIGS. 10A and 10B is employed, if a mechanism for rotating the brush shaft is provided in the lower shaft direction of the brush shaft, the mechanical parts are quickly eroded by the polishing liquid. There was a problem. For this reason, in the arrangement as shown in FIGS. 10A and 10B, it is difficult to support both shafts of the brush and to drive both shafts in rotation.
In the present embodiment, the substrate holder 50 is held in a horizontal state, and a part of the disk-shaped substrate 10 (laminated workpiece) is dipped in the polishing liquid (slurry) 100. Then, by rotating the substrate holder 50 and the brush 60 in this state, it is possible to sufficiently supply the polishing liquid (slurry) 100 to the opening 12 at the center of the stacked disk-shaped substrate 10 (laminated workpiece). It became. At this time, in the present embodiment, the first rotary shaft 71 and the second rotary shaft 72 and various drive mechanisms for driving them are separated from the liquid tank 73 in which the polishing liquid (slurry) 100 is stored. Is arranged. This makes it possible to operate the apparatus in a state where various mechanical components are not affected by the polishing liquid (slurry) 100, and for example, it is possible to prevent bearing wear due to the abrasive.

  As described above in detail, according to the present embodiment, the brush can be stably rotated from both ends of the brush shaft. The twisting phenomenon can be suppressed by fixing the both ends of the brush, but the effect is particularly great when the hole at the center of the disk-shaped substrate is small, the brush is thin, and the rigidity is low. Further, by using a brush in which the bristles are arranged in a spiral shape, the flow of the polishing liquid in the opening in the center of the disk-shaped substrate is improved, but on the other hand, the problem due to the twisting phenomenon tends to increase. However, according to the present embodiment, by fixing both ends of the brush to the rotating shaft, even when using a brush in which the hair tips are arranged in a spiral shape, the center hole of the disk-shaped substrate is polished with extremely high accuracy. can do.

  In addition, an end surface (inner peripheral surface) and a chamfered portion exist in the center hole of the disk-shaped substrate, but the brush is located on the chamfered portion where the distance from the central axis and the angle of the surface contacting the brush differ from the end surface. A single brush is difficult to achieve satisfactory polishing by clearing conditions such as entering. In the present embodiment, the chamfered portion is mainly polished by the first brush having a long bristle length and low rigidity, and mainly using two brushes of the second brush having a short bristle length and high rigidity. By polishing the end surface (inner peripheral surface), it is possible to optimize the polishing operation in accordance with the polishing surface, and it is possible to accurately polish the central opening of the disk-shaped substrate. At that time, by first polishing the chamfered portion first and then mainly polishing the end surface (inner peripheral surface), it is possible to improve the dimensional accuracy after polishing for the demanding end surface (inner peripheral surface). it can.

(A)-(d) is the figure which showed the manufacturing process of the disk shaped board | substrate (disk board | substrate) to which this Embodiment is applied. (E)-(h) is the figure which showed the manufacturing process of the disk shaped board | substrate (disk board | substrate) to which this Embodiment is applied. It is a flowchart which shows the flow of an inner periphery grinding | polishing process. (A)-(d) is a perspective view for demonstrating attachment to the jig | tool of the disk shaped board | substrate shown to step 101. FIG. (E) is a perspective view for explaining attachment of the disk-shaped substrate shown in Step 101 to a jig. It is the figure which showed the board | substrate holder (holder) for setting the laminated workpiece shown to step 102. FIG. It is an external view which shows the brush inserted in the opening of the center of the disk shaped board | substrate set to the board | substrate holder in step 103, step 114. FIG. It is the perspective view which showed the state by which the board | substrate holder with which the disk-shaped board | substrate and the brush were set was set to the grinding | polishing apparatus by making an axial direction into a horizontal direction. It is explanatory drawing which showed the drive system of the grinding | polishing apparatus. It is explanatory drawing which showed the drive system of rotation of a substrate holder. It is a perspective view for demonstrating the state which supplied polishing liquid (slurry) to the liquid tank. (A), (b) is a figure for demonstrating the inner periphery grinding | polishing method of the disk shaped board | substrate conventionally performed.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Disk-shaped board | substrate, 12 ... Opening hole, 50 ... Board | substrate holder, 60 ... Brush, 61 ... Brush part, 63 ... Shaft, 70 ... Polishing apparatus, 71 ... 1st rotating shaft, 72 ... 2nd rotating shaft

Claims (10)

Inserting a brush into the aperture of the disc-shaped substrate having an aperture in the center;
Fixing one end and the other end of the brush to a pair of rotating shafts provided at positions spaced apart from each other;
A method for polishing an inner periphery of a disk-shaped substrate, comprising: rotating and polishing at least one of the brush or the disk-shaped substrate.   The method of polishing an inner periphery of a disk-shaped substrate according to claim 1, wherein the brushes inserted into the openings have hair tips arranged in a spiral shape.   The method of polishing an inner periphery of a disk-shaped substrate according to claim 1 or 2, wherein the brush inserted into the opening has a flexible core.   4. The method of polishing an inner periphery of a disk-shaped substrate according to claim 1, wherein in the polishing step, the brush is rotated by synchronously rotating the pair of rotating shafts. 5.   The pair of rotating shafts are synchronously rotated by mechanically connecting the pair of rotating shafts by a single motor or by controlling individual motors provided for each of the pair of rotating shafts. 4. A method for polishing an inner periphery of a disk-shaped substrate according to 4.   The disk according to any one of claims 1 to 5, wherein the brush is a first brush and a second brush having a bristle hardness and a shorter length than the first brush. Method for polishing the inner periphery of a substrate. Inserting a first brush into the aperture of the disc-shaped substrate having an aperture in the center;
Fixing one end and the other end of the first brush to a pair of rotating shafts provided at positions spaced apart from each other;
Polishing by rotating at least one of the first brush or the disk-shaped substrate;
Extracting the first brush from the disk-shaped substrate;
Inserting a second brush into the aperture of the disk-shaped substrate;
Fixing one end and the other end of the second brush to the pair of rotating shafts;
Polishing the inner periphery of the disk-shaped substrate, comprising rotating and polishing at least one of the second brush or the disk-shaped substrate.   8. The method of polishing an inner periphery of a disk-shaped substrate according to claim 7, wherein the second brush has a bristle hardness higher than that of the first brush.   The method of polishing an inner periphery of a disk-shaped substrate according to claim 7 or 8, wherein the second brush has a shorter hair length than the first brush.   A disk-shaped substrate whose inner periphery is polished by the method according to claim 1.

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