JP4252083B2 - Disc-shaped substrate polishing apparatus and substrate holder - Google Patents

Description

  The present invention relates to a polishing apparatus for polishing an inner periphery of a disk-shaped substrate such as a glass substrate for a magnetic recording medium.

  In response to the increasing demand for recording media, the manufacture of disk substrates, which are disk-shaped substrates, has recently become active. As a magnetic disk substrate which is one of the disk substrates, an aluminum substrate and a glass substrate are widely used. This aluminum substrate is characterized by high workability and low cost, and one glass substrate is characterized by excellent strength, surface smoothness and flatness. In particular, recently, the demand for miniaturization and high density of the disk substrate has been remarkably increased, and the degree of attention of the glass substrate capable of achieving high density with small roughness of the surface of the substrate has increased.

Various improvements have been made to such a magnetic disk substrate manufacturing apparatus. As a prior art described in the publication, there is a technique for polishing an inner peripheral surface of a glass disk having a central hole (see, for example, Patent Documents 1 to 3).
In Patent Document 1, a laminated glass disk on which glass disks are laminated is set so as to be rotatable around a central axis, and a shaft-equipped polishing brush having innumerable brush bristles around the axis is inserted into the central hole of the laminated glass disk. Then, the laminated glass disk is reciprocated while rotating in the direction opposite to the rotation direction of the shaft-equipped polishing brush to polish the inner peripheral surface of the laminated glass disk.

  Further, Patent Document 2 includes a cylindrical holding jig that stores and holds a plurality of magnetic disk substrates to be polished in a concentric and stacked state. The holding jig is held via a housing so as to be rotatable about an axis. At this time, the holding jig is held in the horizontal direction.

  Furthermore, in Patent Document 3, a glass disk having a center hole in a donut board shape is stacked and stored in a work storage box, and the outer peripheral edge of the upper end surface of the stacked glass disk is tightened with a bolt through a holding member. The glass disk is set in the work storage box. Then, the work storage box in which the glass disk is set is placed on the rotary drive body 22 of the polishing apparatus and fixed with bolts.

Japanese Patent Laid-Open No. 11-33886 JP 2006-15450 A JP 2000-84828 A

  However, in the prior art described in, for example, Patent Document 1 and Patent Document 2 described above, the disks are directly stacked on the polishing apparatus. For this reason, work before and after the actual polishing operation such as disk stacking and disk removal becomes complicated, resulting in a decrease in work efficiency.

  For example, as described in Patent Document 3, the above problem can be solved by adopting a configuration in which a disk is stacked on a holder such as a work storage box and then installed in a polishing apparatus. However, when this holder is fixed to the polishing apparatus with, for example, a bolt, it is difficult to fix the holder while accurately positioning it, and the number of man-hours for positioning and fixing becomes very large.

  Furthermore, if you want to make the inner circumference polishing more uniform in stacked workpieces, for example, change the corresponding position between the polishing brush and the substrate holder to change the polishing conditions and suppress uneven polishing. Is effective. At this time, for example, it is very effective to reverse the stacked workpieces in the axial direction. However, in the conventional technique, it is not easy to reverse the stacked workpieces. As a result, in the past, it has been necessary to abandon the adoption of a good polishing operation or a good polishing work with a great amount of man-hours.

The present invention has been made to solve the technical problems as described above, and an object thereof is to simplify the work of attaching a workpiece to a polishing apparatus.
Another object is to provide a polishing apparatus or the like that can easily change the polishing conditions.

In order to achieve such an object, a disk-shaped substrate polishing apparatus to which the present invention is applied is provided in a mounting hole and an outer peripheral portion where a plurality of disk-shaped substrates having an opening in the center are mounted along the axial direction. A substrate holder that is removed from the apparatus when the disc-shaped substrates are individually mounted, a brush that is inserted into the aperture of the disc-shaped substrate and polishes the aperture, and is provided in the substrate holder. A drive side gear that meshes with the gear and a drive unit that rotationally drives the drive side gear are provided.

Here, if the gear provided on the substrate holder is provided at a position that meshes with the drive-side gear even when the substrate holder is used while being reversed in the axial direction, the laminated workpiece can be simplified. It becomes possible to reverse, and uneven polishing can be suppressed by changing the polishing conditions. In addition, a plurality of gears provided in the substrate holder should be provided at substantially target positions with respect to the axial direction of the substrate holder so that the gears engage with the driving gear even when the substrate holder is inverted in the axial direction. Can be characterized.

Further, the substrate holder further includes a contact ring member provided on the outer peripheral portion, and the contact ring member contacts the ring member attached to the rotation shaft provided with the drive side gear. The meshing relationship between the gear and the drive-side gear that applies driving force to the gear can be determined.
Furthermore, a plurality of contact ring members are provided in the axial direction of the substrate holder, and a plurality of ring members are provided corresponding to each of the contact ring members. The substrate holder can be supported in the horizontal direction by supporting the ring member.
In addition, a flange that is provided on the annular member or the contact annular member and reciprocates the substrate holder in the axial direction can be further provided.

  On the other hand, a substrate holder to which the present invention is applied includes a mounting hole in which a plurality of disc-shaped substrates having an opening in the center are mounted, an opening for inflow of polishing liquid communicating from the mounting hole to the outer periphery, and the vicinity of the opening And it was provided with the fin provided in the outer peripheral surface, and guide | inducing the polishing liquid to opening, and the gearwheel provided in an outer peripheral part.

From another point of view, the present invention is a substrate holder that is removed from the polishing apparatus when a disc-shaped substrate is mounted, and the mounting is such that a plurality of disc-shaped substrates having a hole in the center are mounted along the axial direction. A hole, a gear provided on the outer periphery for rotating the disk-like substrate separately with respect to a brush inserted into the opening of the disk-like substrate and polishing the opening, and a gear provided on the outer periphery. And an abutment ring member that defines a meshing relationship with a driving side gear that applies a driving force to the gear.

  Furthermore, the disk-shaped substrate to which the present invention is applied can be characterized in that the inner periphery is polished by these apparatuses.

  According to the present invention configured as described above, it is possible to greatly reduce the work of setting a laminated workpiece in which a disk-shaped substrate is laminated in a polishing apparatus, as compared with the case where these configurations are not adopted.

  In addition, a mounting hole for mounting a plurality of disc-shaped substrates having an opening in the center, an opening for inflow of polishing liquid communicating from the mounting hole to the outer periphery, and a surface in the vicinity of the opening and on the outer peripheral surface By providing the fin that guides the polishing liquid to the opening, the polishing liquid can be satisfactorily flowed into the central opening of the disk-shaped substrate in a state set in the polishing apparatus.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIGS. 1-1 (a) to (d) and FIGS. 1-2 (e) to (h) are diagrams showing a manufacturing process of a disk-shaped substrate (disk substrate) to which the present embodiment is applied. In this manufacturing process, first, the raw material of the disk-shaped substrate (work) 10 is placed on the surface plate 21 in the primary lapping process shown in FIG. 1-1 (a), and the flat surface 11 of the disk-shaped substrate 10 is shaved. At this time, for example, diamond abrasive grains are dispersed and scattered on the surface of the surface plate 21 on which the disk-shaped substrate 10 is placed. Next, in the inner and outer peripheral grinding step shown in FIG. 1B, the hole 12 provided at the center of the disc-shaped substrate 10 is ground by the inner peripheral grindstone 22, and the outer periphery of the disc-shaped substrate 10 is 13 is ground by the outer peripheral grindstone 23. At this time, it is possible to easily ensure the coaxiality of the inner and outer diameters by sandwiching the inner and outer peripheral surfaces of the disc-shaped substrate 10 with the inner and outer peripheral grinding stones 22 and 23 and simultaneously processing them. In the outer periphery polishing step shown in FIG. 1-1C, the outer periphery 13 of the disk-shaped substrate 10 is polished using the outer periphery polishing brush 24. Thereafter, in the secondary lapping step shown in FIG. 1-1D, the disc-like substrate 10 is placed on the surface plate 21, and the plane 11 of the disc-like substrate 10 is further shaved.

  Next, in the inner periphery polishing step shown in FIG. 1-2 (e), the brush 60 is inserted into the central opening of the disc-like substrate 10 to polish the opening 12 of the disc-like substrate 10. Thereafter, the disk-shaped substrate 10 is placed on the surface plate 21 in the primary polishing step shown in FIG. 1-2 (f), and the flat surface 11 of the disk-shaped substrate 10 is polished. For this polishing, for example, a hard polisher is used as a non-woven fabric (abrasive cloth). Further, planar polishing using a soft polisher is performed in the secondary polishing step shown in FIG. Thereafter, cleaning and inspection are performed in the final cleaning / inspection step shown in FIG. 1-2 (h), and the disk-shaped substrate (disk substrate) 10 is manufactured.

Next, a polishing apparatus used in the inner peripheral polishing step shown in FIG. 1-2 (e) will be described with reference to FIGS.
FIG. 2 is an external view showing the overall configuration of a disc-like substrate polishing apparatus 70 to which the present embodiment is applied. Here, a perspective view shows a state where a substrate holder 50 (described later) on which a disk-shaped substrate 10 and a brush 60 (described later) are set is set in the polishing apparatus 70 with the axial direction as the horizontal direction (substantially horizontal direction). . FIG. 3 is an explanatory view showing a drive system of the polishing apparatus 70. Further, FIG. 4 is an explanatory view showing a drive system for rotating the substrate holder 50, omitting the state viewed from the second rotation shaft 72 side in the axial direction of the polishing apparatus 70 shown in FIG. 2. ing.

  As shown in FIGS. 2 and 3, the polishing apparatus 70 includes a first rotating shaft 71 to which one end of the shaft 63 of the brush 60 is fixed, and a second rotating shaft 72 to which the other end of the shaft 63 is fixed. And a liquid tank 73 for storing a polishing liquid (slurry). In addition, a first support shaft 74 and a second support shaft 75 that support the substrate holder 50 are provided. The second support shaft 75 is provided with a drive side gear 76 that meshes with the gear 56 of the substrate holder 50 and rotates the substrate holder 50.

  The first rotating shaft 71 and the second rotating shaft 72 are constituted by integrated members 71a and 72a integrated with the rotating shaft, and divided members 71b and 72b attached by set screws (not shown) or the like. These are combined in a plane including the central axis to form the individual first rotating shaft 71 and second rotating shaft 72.

  The first support shaft 74 and the second support shaft 75 are provided with ring members 74 a, 74 c, 75 a, and 75 c that support the substrate holder 50 by contacting the contact ring member 55 of the substrate holder 50. . The four annular members 74a, 74c, 75a, 75c support (hold) the substrate holder 50 in the horizontal direction while positioning the substrate holder 50, and the first support shaft 74 and the second support shaft 75 rotate. Even in this case, the contact with the contact ring member 55 is maintained, and the position of the substrate holder 50 with respect to the shaft 63 of the brush 60 is held within the combination accuracy that does not affect the polishing. Further, the annular members 74a, 74c, 75a, and 75c are brought into contact with the contact annular member 55, so that the center distance between the gear 56 of the substrate holder 50 and the drive side gear 76 of the polishing apparatus 70 is set within a predetermined range. Keeps the bite well.

More specifically, in the radial positioning of the substrate holder 50, the contact ring member 55 is caused by the weight of the substrate holder 50 (including the stacked disk-shaped substrates 10) so that the contact ring member 55 has an annular shape with two support shafts (74, 75). This is done by contacting the members 74a, 74c, 75a, 75c. Due to this self-weight, the component force in the separation direction due to the meshing of the gear 56 and the drive side gear 76, the acting force in the separation direction due to the flow of the polishing liquid (slurry), the acting force in the separation direction generated during polishing by the brush 60, etc. It is designed to obtain a sufficient resistance against any acting force in the direction away from the drive side gear 76. By adopting such a configuration, it is possible to perform the reversal mounting operation and the detaching operation of the substrate holder 50 in an extremely short time, and the workability can be improved.
On the other hand, in the positioning of the substrate holder 50 in the thrust direction, the side surface of the contact ring member 55 is regulated with a slight backlash (clearance, clearance) by flanges 74b, 74d, 75b, and 75d described later. Yes.

  The substrate holder 50 is provided with gears 56 (first gear and second gear) at two axial positions (described later), and when the substrate holder 50 is inverted (repeated) in the axial direction. In addition, it is possible to connect the drive side gear 76 of the polishing apparatus 70 to one of the gears 56. The first gear and the second gear are provided at substantially target positions with respect to the axial direction of the substrate holder 50. And even when it is used by reversing, it is comprised so that favorable meshing with respect to the drive side gear 76 can be maintained.

  Next, as shown in FIG. 4, the polishing apparatus 70 transmits a holder drive motor 77 as a drive source and the drive force of the holder drive motor 77 to the first support shaft 74 and the second support shaft 75. A belt 78 and a pulley 79 are provided. When the belt 78 is rotated in the direction F by the holder driving motor 77, the first support shaft 74 and the second support shaft 75 are rotated in the direction G. By this rotation in the G direction, the drive side gear 76 provided on the second support shaft 75 also rotates in the G direction, and the gear 56 (on the substrate holder 50 side) meshing with the drive side gear 76 rotates in the E direction. As a result, the substrate holder 50 rotates in the E direction.

  When the substrate holder 50 is supported on the first support shaft 74 and the second support shaft 75, the center J of the substrate holder 50, the center K of the first support shaft 74, and the second support shaft 75. A triangle JKL is formed by the center L. The triangle JKL forms an isosceles triangle with the base KL sharing the horizontal axis (X axis) and having the center J as the apex. The contact ring members 55, 55 and the ring members 74a, 74c, 75a, 75c are in contact so that the triangle JKL forms such an isosceles triangle. The triangle JKL forms an isosceles triangle with the base KL sharing the horizontal axis (X axis) and having the center J as the apex, so that the load of the substrate holder 50 is applied to the first support shaft 74 and the second support shaft 75. Evenly added, stable support is possible. However, it is also possible to support in such a positional relationship that the two central axes constituting the vertices of the triangle do not share the X axis, or are inequilateral triangles that are not isosceles triangles. It is important to prevent this positional relationship from being broken during processing even when it is supported by such a positional relationship that forms another triangle.

  2 and 3, the annular members 74a, 74c, 75a, 75c of the first support shaft 74 and the second support shaft 75 are provided with flanges 74b for reciprocating the substrate holder 50. , 74d, 75b, 75d are formed. The flanges 74b, 74d, 75b, and 75d are ring edges having a diameter larger than that of the annular members 74a, 74c, 75a, and 75c, and are in contact with the annular members 74a, 74c, 75a, and 75c. It faces the side surface of the annular member 55. The flange 74 b and the flange 74 d are arranged symmetrically in the axial direction of the first support shaft 74. Similarly, the flange 75b and the flange 75d are arranged symmetrically in the axial direction of each of the second support shafts 75.

  As shown in FIG. 3, the polishing apparatus 70 includes a brush motor 81 that rotates the brush 60. Further, as a coupling mechanism for synchronously rotating at one end and the other end of the shaft 63 of the brush 60 using the rotation of the brush motor 81, a first pulley 82, a first belt 83 that is a toothed belt, and a second pulley. 84, a rotary shaft 85, a third pulley 86, a second belt 87 that is a toothed belt, and a fourth pulley 88. By these connection mechanisms, the rotation of the brush motor 81 is mechanically connected to the first rotation shaft 71 and the second rotation shaft 72, and one end and the other end of the shaft 63 of the brush 60 rotate in synchronization. It becomes possible. Instead of such mechanical connection, a configuration in which a motor is individually connected to each of the first rotating shaft 71 and the second rotating shaft 72 and is electrically synchronized can be employed.

  Further, the polishing apparatus 70 includes an air cylinder 91 that applies a tensile force (tension) in the axial direction to the brush 60, and a tension mechanism 92 that applies the tensile force of the air cylinder 91 to the second rotating shaft 72. . Due to the pulling force of the air cylinder 91, the second rotating shaft 72 moves in the direction A in FIG. By maintaining the state in which the air cylinder 91 is pulled, the pulling force (tension) in the axial direction with respect to the brush 60 is maintained.

  An example of this movement will be described in detail. For example, a ball spline 92a capable of transmitting torque and enabling linear motion rolling motion is provided in connection with the second rotating shaft 72. When the air cylinder 91 is operated and pulled in the A direction by the pulling mechanism 92, the ball spline 92a can be slid to reduce the distance between the second rotating shaft 72 and the fourth pulley 88. In this state, The second rotating shaft 72 is rotated by the driving force obtained from the brush motor 81 through the coupling mechanism. In this example of movement, the position of the fourth pulley 88 does not change even when the second rotating shaft 72 is pulled by the air cylinder 91, and the driving force from the brush motor 81 can be received.

As another example of the movement, there is a method in which a predetermined bearing or the like is used instead of the ball spline 92a and the distance between the second rotating shaft 72 and the fourth pulley 88 is not changed. That is, it is possible to maintain the tensile force (tension) in the axial direction with respect to the brush 60 also by a mechanism that shifts the second rotating shaft 72 to the fourth pulley 88 in the A direction as it is by the pulling force of the air cylinder 91. In order to rotate the brush 60 from the second rotating shaft 72 after applying this mechanism and applying a pulling force, for example, the length of the fourth pulley 88 in the axial direction is increased, and the second belt 87 Several methods are conceivable, such as a method of sliding the fourth pulley 88 itself, a method of sliding the rotating shaft 85 in the middle of the driving force coupling mechanism, and the like. By adopting these methods, it is possible to transmit the rotation of the brush motor 81 to the fourth pulley 88 using the second belt 87 even when a tensile force is applied to the brush 60.
In addition, it is also possible to employ a configuration in which a pulling mechanism is provided on both of the first rotating shaft 71 and the second rotating shaft 72 as well as on both of the rotating shafts.

  Further, the polishing apparatus 70 includes stirring blades 93 on the first support shaft 74 and the second support shaft 75. By rotating the stirring blade 93 by the rotation of the first support shaft 74 and the second support shaft 75, the bottom of the liquid tank 73, especially the polishing liquid in the vicinity of the four corners containing a large amount of polishing debris etc. It is possible to effectively circulate the slurry.

  Further, the polishing apparatus 70 has a drive motor 95 and an eccentric cam 96 as a mechanism for reciprocating the first support shaft 74 and the second support shaft 75 in the axial directions shown in the B and C directions in the figure. , A link 97, and a moving body 98. The eccentric cam 96 is rotated by the rotation of the drive motor 95, and the link 97 connected to the eccentric cam 96 swings the moving body 98. As a result, the first support shaft 74 and the second support shaft 75 connected to the moving body 98 reciprocate in the B direction and the C direction in the drawing. The substrate holder 50 is reciprocated by the reciprocation of the first support shaft 74 and the second support shaft 75.

Next, the structure of the members (elements) such as the disk-shaped substrate 10 attached to the substrate holder 50, the brush 60, and the substrate holder 50 will be described.
FIGS. 5A to 5D are diagrams for explaining elements mounted on the substrate holder 50. FIG. 5A is a perspective view of the disk-shaped substrate 10 which is a workpiece, and FIG. 5B is a partial cross-sectional view of a hole portion at the center of the disk-shaped substrate 10. FIG. 5C shows the polishing liquid introduction spacer 41, and FIG. 5D shows the both end spacers 42.

  The disk-shaped substrate 10 to be polished is, for example, a glass having a diameter of about 21.66 mm, a thickness of about 1 mm, and a diameter of the central aperture 12 of about 6 mm in order to produce a disk substrate having a diameter of 0.85 inches. It is a substrate. As shown in FIG. 5B, the opening 12 of the disk-shaped substrate 10 includes an inner peripheral surface 12a and a chamfered portion 12b obtained by cutting the corner of the inner peripheral surface 12a. By providing the chamfered portion 12b, it is possible to suppress problems such as cracks and chipping in subsequent processing steps and assembly steps.

  The polishing liquid introducing spacer 41 shown in FIG. 5C has a function of supplying a polishing liquid (slurry) to the central hole 12 of the stacked disk-shaped substrate 10 (laminated workpiece). In order to achieve such a function, as shown in FIG. 5C, the polishing liquid introducing spacer 41 includes an end surface 41a, an axial surface 41b that forms a surface having a smaller diameter than the outer diameter of the end surface 41a, and the shaft A plurality of (for example, six) circulation supply holes 41c, which are through holes for supplying the polishing liquid (slurry) to the opening 12 at the center of the laminated work, are formed on the direction surface 41b. An opening 41d that forms the inner periphery of the axial surface 41b is provided at the center of the polishing liquid introduction spacer 41. The circulation supply hole 41c functions as a communication portion that allows the opening 41d to communicate with the axial surface 41b that is the outer peripheral portion. The inner circumference (opening hole 41 d) of the axial surface 41 b has a diameter larger than the inner circumference of the disc-like substrate 10. Further, as a material of the polishing liquid introducing spacer 41, synthetic resin such as ABS, POM, Teflon (registered trademark), polyamide or the like is used.

  The both-end spacers 42 shown in FIG. 5D do not arrange the disk-shaped substrate 10 at the end of the brush 60 where the number of stacked disk-shaped substrates 10 is adjusted or the polishing properties may become unstable. Is provided. The both end spacers 42 are formed of the same material as the polishing liquid introducing spacer 41 (ABS, POM, Teflon (registered trademark), synthetic resin such as polyamide). The outer diameter dimension is slightly smaller (for example, about 1 to 5 mm) than the outer diameter dimension of the disk-shaped substrate 10, and the inner diameter dimension is equal to or greater than the inner diameter of the disk-shaped substrate 10.

FIG. 6 is a perspective view showing a state in which each element shown in FIGS. 5A to 5D is attached to the jig 44. As shown in FIG. 6, a laminated workpiece is formed by superimposing the disk-like substrates 10 shown in FIGS. 5A and 5B, and the members shown in FIGS. 5C and 5D and the dummy substrate 43 are formed. It is attached to the jig 44. In this jig 44, for example, 150 disk-like substrates 10 are overlaid in total, and for example, 40 sheets between the one end where the both-end spacers 42 are provided and the polishing liquid introduction spacer 41, and two polishing liquid introduction spacers 41. Between, for example, 70 sheets, for example, 40 sheets of laminated workpieces are attached from the polishing liquid introducing spacer 41 to the other end spacers 42 at the other end. By providing the dummy substrate 43 between each spacer (polishing liquid introduction spacer 41, both end spacers 42) and the disc-like substrate 10, the disc-like substrate 10 formed by the contact of each spacer with the flat surface 11 of the disc-like substrate 10 is provided. Quality degradation can be suppressed. However, this dummy substrate 43 may not be used depending on the material of each spacer.
Then, by laminating the disk-shaped substrate 10 as shown in FIG. 6, the interval between the polishing liquid introduction spacers 41 and the position in the axial direction are determined.

  FIG. 7 is a view showing a substrate holder (holder) 50 for setting a laminated workpiece as shown in FIG. As shown in FIG. 2, the substrate holder 50 is used in the polishing process while being placed on the polishing apparatus 70. The substrate holder 50 is formed entirely of, for example, stainless steel, and includes a mounting hole 51 that is one mode of a mounting portion for mounting the stacked disk-shaped substrate 10 (laminated workpiece) as shown in FIG. 50 is provided with an inflow opening 53 through which the outer periphery 52a of the 50 and the mounting hole 51 are communicated to allow the polishing liquid (slurry) to flow. As the mounting portion, instead of the mounting hole 51, for example, the substrate holder 50 is configured to be divided into several parts (for example, two parts) in the axial direction, and after the laminated work is attached, the parts divided into several parts are combined. (Fixed) to form the substrate holder 50 to mount the laminated workpiece is also conceivable. Further, a fin 54 is provided in the vicinity of the inflow opening 53 and on the surface of the outer periphery 52 a and guides the polishing liquid (slurry) to the inflow opening 53. The inflow openings 53 and the fins 54 are formed at two locations in the axial direction. For example, six inflow openings 53 are provided on the surface of the outer periphery 52 a, and the fins 54 are formed between the individual inflow openings 53. Has been.

  The two positions in the axial direction where the inflow openings 53 are formed are such that when the laminated workpiece shown in FIG. 6 is set on the substrate holder 50, the two polishing liquid introduction spacers 41 set as shown in FIG. It almost coincides with the axial position. Due to the structure formed by the step formed between the outer periphery 52a and the outer periphery 52b having a larger diameter than the outer periphery 52a and the fin 54, the polishing liquid (slurry) is scraped up by the rotation of the substrate holder 50. A polishing liquid (slurry) is supplied to the opening 53 for use.

  In addition, the substrate holder 50 is formed with contact ring members 55 made of acetal resin such as Delrin (registered trademark of DuPont) on the outer periphery 52b at two (a plurality of) axial positions. Further, gears 56 for rotating the substrate holder 50 are formed at two positions in the axial direction. As described above, the two gears 56 constituting the first gear and the second gear are provided at positions that are mutually targeted with respect to the axial direction of the substrate holder 50. That is, the contact ring members 55 and the like provided at two locations together with the two gears 56 are also arranged so as to be objects in the axial direction including the arrangement direction and position thereof. As a result, even when the substrate holder 50 is inverted (repeated) in the axial direction, the drive-side gear 76 of the polishing apparatus 70 can be connected to one of the gears 56, and the substrate holder 50 is inverted. Even in this case, the slide movement of the substrate holder 50 in the axial direction can be realized as it is.

  Furthermore, a nut 57 for pressing the laminated workpiece in the axial direction after the laminated workpiece is inserted and fixing the laminated workpiece to the substrate holder 50 is provided. In FIG. 7, the nut 57 is shown only on one side in the axial direction. However, after the laminated workpiece is inserted, the nut 57 is also provided on the other side in the axial direction. That is, after inserting the laminated work into the mounting hole 51, the nut 57 is tightened using the other screw portion 58 to fix the laminated work. In the nuts 57 attached to both ends of the substrate holder 50, in order to pull out the jig 44 and insert the brush 60, and to allow a polishing liquid (slurry) to flow during polishing, a nut opening 57a is formed at the center in the axial direction. (See FIG. 2). After fixing the laminated workpiece with the nut 57, the jig 44 shown in FIG. 6 is pulled out from the laminated workpiece and removed. The contact ring member 55 is used for positioning the entire substrate holder 50 when the substrate holder 50 is disposed in the polishing apparatus 70 as described above (see, for example, FIG. 2). 56, and a role of reciprocating the substrate holder 50 in the axial direction in contact with the flanges 74 b, 74 d, 75 b, 75 d of the polishing apparatus 70.

  FIG. 8 is an external view showing the brush 60 inserted into the hole 12 at the center of the disc-like substrate 10 set in the substrate holder 50. The brush 60 includes a brush portion 61 formed by arranging the hair tips in a spiral shape, a large diameter portion 62 formed continuously at both ends of the brush portion 61, and a continuous diameter portion 62. And a shaft 63 forming one end and the other end. The large-diameter portion 62 dams (suppresses the flow) a caulking portion 62a for coupling the end of the brush portion 61 to the shaft 63 and a flow from the brush portion 61 to the end of the polishing liquid (slurry). A stopper 62b is provided. That is, as will be described later, when the brush 60 rotates in a predetermined direction with the substrate holder 50 being dipped in the polishing liquid (slurry), the brush portion 61 is formed by arranging the hair tips in a spiral shape. A polishing liquid (slurry) flows in one axial direction. At this time, the polishing liquid (slurry) is blocked by the blocking part 62b of the large diameter part 62, and the flow of the polishing liquid (slurry) to the end of the brush 60 is prevented.

  In order to polish the inner diameter of a small-diameter disk such as 0.85 inches as the polishing of the opening 12 at the center of the disk-shaped substrate 10 with the brush 60, it is necessary to make the core of the brush 60 thinner. Therefore, in this embodiment, for example, a plurality of wires (materials: for example, mild steel wire (SWRM), hard steel wire (SWRH), stainless steel wire (SUSW), brass wire (BSW), workability, rigidity, etc. The brush portion 61 is formed by sandwiching the hair of the brush (material: for example, nylon (trade name of DuPont)) and twisting the wire in which the hair is sandwiched. By twisting this wire to form the brush part 61, the brush bristles formed on the brush part 61 can be spiraled, and the polishing liquid is formed in the opening 12 at the center of the inserted laminated workpiece. (Slurry) can be allowed to flow in the axial direction, and the polishing liquid (slurry) can be transported well at this location. Further, by providing the blocking portions 62b at both ends of the brush portion 61, it is possible to suppress the flow of the polishing liquid (slurry) to the end portions.

  In the brush 60 having such a configuration, the core of the brush portion 61 of the brush 60 has flexibility. In this embodiment, the “flexibility” refers to flexibility that allows a person to bend lightly by holding both ends, and flexibility that allows a person to touch and bend both ends. As an example, for example, with a brush 60 formed by twisting four wires sandwiching the bristles of a brush with a soft steel wire (SWRM) having a diameter of about 0.2 mm, both ends of the brush shaft are held with free end support, Deflection was seen when the central part of the brush 60 was pressed at about 100 gf. This value varies depending on the thickness, type, twisting method and the like of the wire. As this flexibility, for example, both ends of the brush shaft may be held with free end support, and the flexibility may be such that the center portion of the brush 60 bends while being pressed at about several hundred gf.

Further, in the brush 60 shown in FIG. 8, the axial length of the brush portion 61 is determined in consideration of the relative reciprocation in the axial direction with the disk-shaped substrate 10 which is a laminated workpiece inserted into the substrate holder 50. Has been. That is, as will be described later, when the substrate holder 50, that is, the disc-like substrate 10 that is a laminated workpiece is reciprocated left and right, if the disc-like substrate 10 is detached from the brush portion 61, the polishing cannot be performed satisfactorily. Therefore, even when the stacked disk-shaped substrate 10 is reciprocated left and right, the length of the brush part 61 is set to such a length that the disk-shaped substrate 10 at the end of the stacked workpiece does not come off from the brush unit 61. It is preferable to set.
That is, assuming that the length of the brush portion 61 in the axial direction is L, the length of the laminated workpiece is L0, and the reciprocating distance is L1,
L> L0 + L1
There is a relationship.

Next, a state where the polishing liquid (slurry) 100 is supplied to the liquid tank 73 of the polishing apparatus 70 shown in FIG. 2 will be described with reference to FIG. Here, a pump (not shown) is driven to supply the polishing liquid (slurry) 100 to the liquid tank 73 of the polishing apparatus 70. In the liquid tank 73, the polishing liquid (slurry) 100 is stored up to almost the center of the horizontally set substrate holder 50. That is, a part, not all, of the substrate holder 50 is dipped in the polishing liquid (slurry) 100.
In the present embodiment, a first support shaft 74 and a second support shaft 75 are provided outside the liquid tank 73, and the first support shaft 74, the second support shaft 75, the brush motor 81 (see FIG. 3), and various drive mechanisms such as a coupling mechanism are also separated from the liquid tank 73. As a result, various drive mechanisms are not immersed in the polishing liquid (slurry) 100, and the problem that mechanical parts such as bearings are worn by the abrasive contained in the polishing liquid (slurry) 100 can be solved. In a state where the polishing liquid (slurry) 100 is supplied, both ends of the brush 60 to which a tensile force is applied are moved in the first direction (D in FIG. 9) using the first rotating shaft 71 and the second rotating shaft 72. Direction). On the other hand, the substrate holder 50 rotates in the second direction (direction E in FIG. 9).

The “state in which a part but not all of the substrate holder 50 is dipped in the polishing liquid (slurry) 100” means that the substrate holder 50 is completely immersed in the horizontal surface 100a of the polishing liquid (slurry) 100 filled in the liquid tank 73. In other words, a state in which a part of the substrate holder 50 (the stacked disk-shaped substrate 10) is in a position protruding from the horizontal surface 100a. When the actual polishing operation is performed, the entire substrate holder 50 (laminated disc-shaped substrate 10) is covered with the polishing liquid (slurry) 100 by the rotation of the substrate holder 50, but the substrate holder 50 ( There is no change that a part of the laminated disk-shaped substrate 10) is located at a position (height) protruding from the horizontal surface 100a.
Note that the position of the horizontal surface 100a is usually about the same as the height at which the notch 73a of the liquid tank 73 is formed, but the flow rate and viscosity of the supplied polishing liquid (slurry) 100, the shape of the notch 73a, The position (height) moves up and down slightly depending on the size.

Here, conventionally, when polishing a disk substrate with a predetermined brush, the polishing liquid is dropped on the inner peripheral surface, which is the surface to be polished, or the entire disk substrate and brush are immersed in a tank of the polishing liquid. . For example, when a structure as shown in FIGS. 11A and 11B is employed, if a mechanism for rotating the brush shaft is provided in the lower shaft direction of the brush shaft, the mechanical parts are quickly eroded by the polishing liquid. There was a problem. For this reason, in the arrangement shown in FIGS. 11A and 11B, it is difficult to support both shafts of the brush and to drive both shafts in rotation.
In the present embodiment, the substrate holder 50 is held in a horizontal state, and a part of the disk-shaped substrate 10 (laminated workpiece) is dipped in the polishing liquid (slurry) 100. Then, by rotating the substrate holder 50 and the brush 60 in this state, it is possible to sufficiently supply the polishing liquid (slurry) 100 to the opening 12 at the center of the stacked disk-shaped substrate 10 (laminated workpiece). It became. At this time, in the present embodiment, the first rotary shaft 71 and the second rotary shaft 72 and various drive mechanisms for driving them are separated from the liquid tank 73 in which the polishing liquid (slurry) 100 is stored. Are arranged. This makes it possible to operate the apparatus in a state where various mechanical components are not affected by the polishing liquid (slurry) 100, and for example, it is possible to prevent bearing wear due to the abrasive.

The processing flow of the inner circumference polishing step shown in FIG. 1-2E executed by the polishing apparatus 70 as described above will be described in detail.
FIG. 10 is a flowchart showing the flow of the inner circumference polishing step. In the inner periphery polishing process, first, the disk-shaped substrate (workpiece) 10 is set on an attachment jig (jig 44) (step 101). That is, the elements shown in FIGS. 5A to 5D are set on the jig 44 as shown in FIG. Next, the disk-shaped substrate 10 (laminated workpiece) stacked on the attachment jig (jig 44) as shown in FIG. 6 is set on the substrate holder 50 shown in FIG. 7 (step 102). That is, in a state where the nut 57 is fastened to one screw portion 58 of the substrate holder 50 shown in FIG. 7, the laminated work shown in FIG. 6 is inserted into the mounting hole 51 having the other screw portion 58. Thereafter, the laminated work is fixed to the substrate holder 50 by tightening the nut 57 to the other screw portion 58. Thereafter, the jig 44 is pulled out from the nut opening 57a (see FIG. 2).

  Thereafter, the first brush (brush 60) is inserted from the nut opening 57a into the opening in the center of the laminated work set in the substrate holder 50 (step 103). In the present embodiment, as the brush 60, two types of a first brush and a second brush are prepared. The first brush is a brush with soft and long bristles, and the second brush is a brush with hard and short bristles compared to the first brush. In this step 103, the chamfered portion 12b (see FIG. 5B) of the disc-like substrate 10 is polished well by using the first brush with soft and long hair. On the other hand, in step 114 (described later), the inner peripheral surface 12a (see FIG. 5B) of the disc-like substrate 10 can be satisfactorily polished by using the second brush with hard and short hair. Thus, a plurality of surfaces can be satisfactorily polished by using a plurality of brushes 60 having different hair states.

  Next, the substrate holder 50 on which the laminated work is set and the first brush is inserted is set horizontally in the polishing apparatus 70 (step 104). That is, the two contact ring members 55 of the substrate holder 50 are brought into contact with the ring members 74a, 74c, 75a, 75c of the two support shafts (74, 75) of the polishing apparatus 70, so that the laminated work and the brush The substrate holder 50 provided with 60 is disposed in the polishing apparatus 70. With this simple arrangement, the meshing between the gear 56 of the substrate holder 50 and the driving gear 76 of the polishing apparatus 70 is ensured.

Thereafter, one end of the brush 60 protruding from the end of the substrate holder 50 is fixed to the first rotating shaft 71 of the polishing apparatus 70, and the other end of the brush is fixed to the second rotating shaft 72 of the polishing apparatus (step). 105). More specifically, as shown in FIG. 2, when the substrate holder 50 is placed on the polishing apparatus 70 with the split member 71 b of the first rotary shaft 71 and the split member 72 b of the second rotary shaft 72 removed. The both ends of the shaft 63 of the brush 60 protruding from the nut opening 57a of the nut 57 attached to the substrate holder 50 are connected to the integrated member 71a of the first rotating shaft 71 and the integrated member 72a of the second rotating shaft 72. Fits in the center. Thereafter, the split members 71 b and 72 b are attached to the integrated members 71 a and 72 a with set screws, so that one end of the shaft 63 can be fixed to the first rotating shaft 71 and the other end can be fixed to the second rotating shaft 72.
In the above-described series of work steps, the attachment of the work to the polishing apparatus 70 is completed in a state where the positional relationship of the isosceles triangle JKL having the center J shown in FIG. .

  After the work is attached, for example, a pump (not shown) is driven to supply the polishing liquid (slurry) 100 to the liquid tank 73 of the polishing apparatus 70 (step 106). In the region of the liquid tank 73 of the polishing apparatus 70, the substrate holder 50 is set in a horizontal state, and in this state, about half of the horizontal direction of the substrate holder 50 is immersed in the polishing liquid (slurry) 100 (see FIG. 9).

  Before and after the supply of the polishing liquid (slurry) 100, the core of the brush 60 is pulled in the axial direction by the polishing apparatus 70, and the pulled state is maintained (step 107). More specifically, the air cylinder 91 shown in FIG. 3 is operated to apply a pulling force to the shaft 63 of the brush 60. The tensile force is preferably about 5 to 50 kgf, more preferably about 10 to 20 kgf. 1 kgf is about 9.8 N. In the present embodiment, eccentric rotation as shown in FIGS. 11A and 11B is suppressed by supporting the shaft 63 of the brush 60 at both ends and applying tension. For this reason, the lower limit value of the pulling force is an experimentally determined value that suppresses eccentric rotation in consideration of the rigidity of the brush, the rotation speed of the brush, and the like. On the other hand, as described with reference to FIG. 8, the shaft core of the brush portion 61 of the brush 60 is formed by twisting a wire. Therefore, the upper limit value of the pulling force is determined according to the characteristics of the brush 60 as a value that does not overstretch the axis of the brush portion 61 and does not disturb the properties of the brush tips.

  In this state, while supplying the polishing liquid, the brush is rotated in the first direction, and the holder is rotated in the second direction which is the rotation direction opposite to the first direction to perform polishing ( Step 108). That is, as described with reference to FIG. 9, the first rotating shaft 71 and the second rotating shaft 72 are used at both ends of the brush 60 to which a tensile force is applied in a state where the polishing liquid (slurry) 100 is supplied. And rotate in the first direction (D direction in FIG. 9). As a rotation speed of the brush 60, about 1500-2000 rpm is preferable, for example. At the same time, the holder drive motor 77 shown in FIG. 3 is activated to rotate the substrate holder 50 in the second direction (direction E in FIG. 9). As the rotation speed of the substrate holder 50, 20 rpm, 40 rpm, 60 rpm, or the like is selected.

  When the substrate holder 50 is rotated in the E direction in the state shown in FIG. 9, the polishing liquid (slurry) 100 is scraped up by the fins 54, and the polishing liquid (slurry) 100 is introduced into the substrate holder 50 from the inflow opening 53. Flows in. Then, the polishing liquid (slurry) 100 supplied from the inflow opening 53 wraps the polishing liquid introduction spacer 41 shown in FIG. 6 inside the substrate holder 50, and the axial surface 41b shown in FIG. The space between the inner peripheral surface of the substrate holder 50 is filled with the polishing liquid (slurry) 100. Then, the polishing liquid (slurry) 100 is supplied to the central opening 12 of the stacked disk-shaped substrate 10 (laminated workpiece) through the circulation supply hole 41 c of the polishing liquid introducing spacer 41. The polishing liquid (slurry) 100 supplied to the central aperture 12 is moved in the axial direction by a brush 60 in which the bristles are spirally arranged as shown in FIG. Due to these actions, even if polishing is started from a state in which a part of the substrate holder 50 is dipped in the polishing liquid (slurry) 100, the opening 12 at the center of the disk-shaped substrate 10 (laminated workpiece) is axially formed. Is sufficiently filled with the polishing liquid (slurry) 100.

  The polishing liquid (slurry) 100 also flows from the nut opening 57a of the nut 57 attached to the substrate holder 50 (see FIG. 9). The flowing polishing liquid (slurry) 100 is moved in the axial direction by the brush 60 in which the hair ends are arranged in a spiral shape. The polishing liquid (slurry) 100 moved in the axial direction is discharged from the nut opening 57a of the nut 57 at the other end different from one end of the substrate holder 50 into which the polishing liquid (slurry) 100 has flowed, and returned to the liquid tank 73. It is. In this manner, polishing can be performed by flowing the polishing liquid (slurry) 100 from the end of the substrate holder 50, and the polished polishing liquid (slurry) 100 can be easily circulated. .

  On the other hand, during the polishing operation in step 108, the drive motor 95 shown in FIG. 3 is operated to reciprocate the substrate holder 50 in the axial direction (directions B and C in FIG. 3) (step 109). By reciprocating, the substrate holder 50 and the brush 60 can move relative to each other to shift the position of the brush 60 in contact with the workpiece, and polishing by polishing the same portion with the same brush 60. Unevenness can be prevented and more uniform polishing can be achieved.

  Here, when the substrate holder 50 is reciprocated, the first support shaft 74 and the second support shaft 75 shown in FIG. 2 are reciprocated in the axial direction. By the reciprocating motion of the first support shaft 74 and the second support shaft 75, the side surfaces of the ring edges (collars) of the flanges 74b, 74d, 75b, 75d push the contact ring member 55 of the substrate holder 50, Thereby, the substrate holder 50 can be reciprocated. That is, when the first support shaft 74 and the second support shaft 75 are moved in the direction B in FIG. 3, the flange 74 d and the flange 75 d press one of the contact ring members 55 of the substrate holder 50, whereby the substrate holder 50 moves in the B direction. On the other hand, when the first support shaft 74 and the second support shaft 75 move in the direction C in FIG. 3, the flange 74 b and the flange 75 b push the other abutting ring member 55 of the substrate holder 50, whereby the substrate holder 50 moves in the C direction. For the movement in the B direction and the C direction, a driving mechanism (a driving motor 95, an eccentric cam 96, a link 97, a moving body 98, etc.) is used.

  In order to relatively move the brush 60 and the substrate holder 50 in the axial direction, a method of reciprocating the brush 60 is also conceivable. However, in the brush 60, both ends of the shaft 63 are fixed, tension is applied to the shaft 63, and both the shafts rotate in synchronization. Therefore, it is difficult to form a simple mechanism for reciprocating the brush 60 with both ends fixed and the tension kept constant. That is, in order to reciprocate the brush 60 in a state where both ends are fixed and the tension is kept constant, the brush 60 is rotated from the brush motor 81 and all the constituent members of the series of mechanisms for applying the tension are reciprocated. It is necessary to make it large, and it is large-scale and considerably expensive. In addition, since the shaft core of the brush 60 in this embodiment is thin and highly flexible, it is not preferable to move the brush 60 in the axial direction while the brush 60 is rotating in order to stabilize the properties of the brush 60. Therefore, in the present embodiment, instead of reciprocating the shaft 63 of the brush 60 applying a tensile force in the axial direction, the substrate holder 50 is reciprocated, and the stacked disc-shaped substrate 10 (laminated workpiece) is moved. By reciprocating, relative movement in the axial direction between the brush 60 and the disk-shaped substrate 10 (laminated workpiece) laminated is realized.

  Returning to FIG. 10, the process flow will be described. In this inner periphery polishing step, the above polishing operation is performed for a predetermined polishing time (step 110). That is, the control unit (not shown) of the polishing apparatus 70 determines whether or not a predetermined time has elapsed as the time required for polishing (polishing time) obtained from empirical rules, and the polishing time has elapsed. If not, the processing from step 108 is repeated, and when the polishing time has elapsed, the polishing apparatus 70 is stopped (step 111).

  Thereafter, the polishing apparatus 70 is operated to release the pull to the brush 60, and one end and the other end of the brush 60 are removed from the rotation shaft (the first rotation shaft 71 and the second rotation shaft 72) (step 112). Then, one end and the other end of the substrate holder 50 are reversed (repeated), the substrate holder 50 is placed on the polishing apparatus 70, and the processes shown in the above-described steps 104 to 112 are repeated (step 113). In this way, by performing the same processing by reversing the substrate holder 50, it is possible to change the polishing conditions such as reversal of the rotation direction without reversing the mechanism, and the polishing conditions are unique. Uneven polishing can be suppressed.

  After the polishing after the reversal is completed, the first brush is removed from the substrate holder 50, and the second brush having a higher hardness than the first brush is placed at the center of the laminated work set on the substrate holder 50. Insert into the opening 12 (step 114). As described above, the second brush with high hardness is for polishing the inner peripheral surface of the disk-shaped substrate 10, and the length of the hair is shorter than that of the first brush. Thereafter, in the processes shown in steps 104 to 113, the polishing process is performed in the same manner as the polishing process performed using the first brush (step 115). In the disk substrate as a product, since the dimensional accuracy of the inner peripheral surface 12a is required more, it is preferable to use a brush 60 that is good for polishing the inner peripheral surface 12a as the second brush that is a subsequent process.

  In the polishing with the second brush, according to the present embodiment, the opening 12 at the center of the disk-shaped substrate 10 is remarkably compared with the conventional one without performing the polishing by reversing the substrate holder 50 shown in step 113. Although polishing can be performed with high accuracy, in order to satisfy even more stringent required accuracy (surface roughness accuracy, dimensional accuracy, geometric accuracy, etc.), as shown in step 115, polishing by reversal (step 113) is also performed. It is more preferable. Note that the polishing conditions such as the polishing time and the number of rotations in step 110 can be made different depending on whether the first brush is used or the second brush is used. After the polishing process is completed, the brush 60 and the work are taken out from the substrate holder 50 (step 116), the inner peripheral polishing process is completed, and the process proceeds to the next process.

  As described above in detail, according to the present embodiment, the set for rotating the substrate holder 50 includes the contact ring members (55, 55) of the substrate holder 50 and a plurality of circles of the polishing apparatus 70. The ring member (74a, 74c, 75a, 75c) need only be placed in contact with the ring member (74a, 74c, 75a, 75c), and the gear 56 of the substrate holder 50 can be engaged with the drive side gear 76 of the polishing apparatus 70 only by this operation. This meshing uses the weight of the substrate holder 50 that can provide sufficient resistance against the sum of various acting forces in the direction away from the drive side gear 76, and is extremely Good engagement can be realized with a simple structure.

  Further, two gears 56 (first gear and second gear) are provided at positions that are mutually targeted with respect to the axial direction of the substrate holder 50. Thereby, for example, even when it is necessary to invert the substrate holder 50 and make the polishing uniform in the axial direction of the laminated workpiece, the substrate holder 50 can be easily arranged. At that time, centering and fixing are easy, and the manufacturing cost can be greatly reduced. In addition, in a state where the substrate holder 50 is set for rotation, both ends of the shaft 63 of the brush 60 are fixed, and a pulling force is applied to the shaft 63, so that the shaft core can be prevented from shaking. . In particular, when the opening 12 at the center of the disk-shaped substrate 10 is small, the brush 60 is thin, and the rigidity is low, the effect is great.

  Further, by providing the inflow opening 53 in the substrate holder 50 and the polishing liquid introduction spacer 41, the substrate holder 50 is polished by the rotation of the substrate holder 50 in the opening 12 at the center of the stacked disk-shaped substrate 10 (laminated workpiece). The liquid (slurry) 100 can be supplied. By adopting such a configuration, stable inner peripheral polishing can be realized without forcibly supplying the opening 12 by a pump or the like.

(A)-(d) is the figure which showed the manufacturing process of the disk shaped board | substrate (disk board | substrate) to which this Embodiment is applied. (E)-(h) is the figure which showed the manufacturing process of the disk shaped board | substrate (disk board | substrate) to which this Embodiment is applied. It is an external view which shows the whole structure of the grinding | polishing apparatus of the disk shaped board | substrate with which this Embodiment is applied. It is explanatory drawing which showed the drive system of the grinding | polishing apparatus. It is explanatory drawing which showed the drive system for rotating a substrate holder. (A)-(d) is a figure for demonstrating the element with which a board | substrate holder is mounted | worn. It is the perspective view which showed the state which attached each element shown to Fig.5 (a)-(d) to the jig | tool. It is the figure which showed the board | substrate holder for setting the laminated workpiece as shown in FIG. It is an external view which shows the brush inserted in the opening of the center of the disk shaped board | substrate set to the board | substrate holder. It is a perspective view for demonstrating the state which supplied polishing liquid (slurry) to the liquid tank. It is a flowchart which shows the flow of an inner periphery grinding | polishing process. (A), (b) is a figure for demonstrating the inner periphery grinding | polishing method of the disk shaped board | substrate conventionally performed.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Disk-shaped board | substrate, 12 ... Opening hole, 41 ... Polishing liquid introduction | transduction spacer, 50 ... Substrate holder, 53 ... Inflow opening, 54 ... Fin, 55 ... Contact ring member, 56 ... Gear, 57 ... Nut, 60 DESCRIPTION OF SYMBOLS ... Brush, 70 ... Polishing apparatus, 71 ... First rotating shaft, 72 ... Second rotating shaft, 74 ... First supporting shaft, 75 ... Second supporting shaft, 74a, 74c, 75a, 75c ... Ring Member, 76... Drive side gear

Claims (10)

A substrate that includes a mounting hole in which a plurality of disc-shaped substrates having an opening in the center are mounted along the axial direction and a gear provided on the outer periphery, and is removed from the apparatus when the disc-shaped substrate is mounted individually A holder,
A brush that is inserted into the opening of the disk-shaped substrate and polishes the opening;
A drive side gear meshing with the gear provided on the substrate holder;
A disk-shaped substrate polishing apparatus comprising: a driving unit that rotationally drives the driving side gear.   2. The disk-like shape according to claim 1, wherein the gear provided on the substrate holder is provided at a position that meshes with the drive-side gear even when the substrate holder is used while being inverted in the axial direction. Substrate polishing equipment.   A plurality of gears provided on the substrate holder are provided at substantially target positions with respect to the axial direction of the substrate holder so as to mesh with the driving gear even when the substrate holder is inverted in the axial direction. The apparatus for polishing a disk-shaped substrate according to claim 2. The substrate holder further includes a contact ring member provided on the outer peripheral portion,
The meshing relationship between the gear and the driving gear that applies driving force to the gear is determined by the abutting annular member coming into contact with the annular member attached to the rotating shaft provided with the driving gear. The disk-shaped substrate polishing apparatus according to claim 1.   A plurality of the contact ring members are provided in the axial direction of the substrate holder, and a plurality of the ring members are provided corresponding to each of the contact ring members, and each of the contact ring members is provided by a plurality of the ring members. The disk-shaped substrate polishing apparatus according to claim 4, wherein the substrate holder is supported in a horizontal direction by supporting a contact ring member.   The disk-shaped substrate polishing apparatus according to claim 4, further comprising a flange provided on the annular member or the abutting annular member to reciprocate the substrate holder in the axial direction. A mounting hole in which a plurality of disc-shaped substrates having an opening in the center are mounted;
A polishing liquid inflow opening communicating with the outer periphery from the mounting hole;
A substrate holder comprising: a fin provided in the vicinity of the opening and on the outer peripheral surface for guiding a polishing liquid to the opening.   The substrate holder according to claim 7, further comprising a gear provided on the outer peripheral portion. A substrate holder to be removed from the polishing apparatus when mounting the disk-shaped substrate,
A mounting hole in which a plurality of disc-shaped substrates having an opening in the center are mounted along the axial direction;
A substrate holder comprising: a gear provided on an outer peripheral portion for rotating the disk-shaped substrate separately with respect to a brush which is inserted into the holes of the disk-shaped substrate and polishes the holes.   The substrate holder according to claim 9, further comprising a contact ring member that is provided on the outer peripheral portion and defines a meshing relationship between the gear and a driving gear that applies a driving force to the gear.

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