JP2008061048A5 - - Google Patents

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Publication number
JP2008061048A5
JP2008061048A5 JP2006237061A JP2006237061A JP2008061048A5 JP 2008061048 A5 JP2008061048 A5 JP 2008061048A5 JP 2006237061 A JP2006237061 A JP 2006237061A JP 2006237061 A JP2006237061 A JP 2006237061A JP 2008061048 A5 JP2008061048 A5 JP 2008061048A5
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JP
Japan
Prior art keywords
crystal resonator
metal film
lid
base substrate
resonator element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2006237061A
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English (en)
Japanese (ja)
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JP2008061048A (ja
JP4986545B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2006237061A priority Critical patent/JP4986545B2/ja
Priority claimed from JP2006237061A external-priority patent/JP4986545B2/ja
Publication of JP2008061048A publication Critical patent/JP2008061048A/ja
Publication of JP2008061048A5 publication Critical patent/JP2008061048A5/ja
Application granted granted Critical
Publication of JP4986545B2 publication Critical patent/JP4986545B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2006237061A 2006-08-31 2006-08-31 水晶振動子 Expired - Fee Related JP4986545B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006237061A JP4986545B2 (ja) 2006-08-31 2006-08-31 水晶振動子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006237061A JP4986545B2 (ja) 2006-08-31 2006-08-31 水晶振動子

Publications (3)

Publication Number Publication Date
JP2008061048A JP2008061048A (ja) 2008-03-13
JP2008061048A5 true JP2008061048A5 (enExample) 2009-10-15
JP4986545B2 JP4986545B2 (ja) 2012-07-25

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ID=39243275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006237061A Expired - Fee Related JP4986545B2 (ja) 2006-08-31 2006-08-31 水晶振動子

Country Status (1)

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JP (1) JP4986545B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI527280B (zh) 2009-04-03 2016-03-21 大真空股份有限公司 A manufacturing method of a package body assembly, a package body assembly, a package member, and a method of manufacturing a piezoelectric vibration element using a package member
JP5554092B2 (ja) * 2010-03-05 2014-07-23 セイコーインスツル株式会社 電子デバイスパッケージの製造方法
CN106170854A (zh) * 2014-03-31 2016-11-30 长濑化成株式会社 具有中空部的电路部件及安装构造体、以及安装构造体的制造方法
CN108735890A (zh) * 2018-05-25 2018-11-02 张琴 准气密性声表面波元件封装结构及制作方法
CN114731148A (zh) * 2019-12-09 2022-07-08 株式会社村田制作所 谐振装置及其制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3472474B2 (ja) * 1998-03-30 2003-12-02 京セラ株式会社 薄型圧電共振子及びその実装構造
JP2006080380A (ja) * 2004-09-10 2006-03-23 Seiko Epson Corp 電子部品用パッケージの封止方法

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