JP2008060354A - Electronic parts and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic parts capable of ensuring a high performance to a quality function since a cap can be manufactured at a low cost as compared with former metal caps, and additively various functionalities can be given to the cap; and to provide a method of manufacturing the electronic parts. <P>SOLUTION: In electronic parts 100 in which a circuit element 2 packaged on a substrate 1 is sealed with a cap 10, a mounting portion 10a for fixing the cap 10 on the substrate 1 in outer peripheries and a concave 10b for wrapping the circuit element 2 in almost center section of the mounting portion 10a are formed by a film 4. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  According to the present invention, an electronic component that requires a space (hereinafter referred to as a hollow region) above a circuit element due to recent technological innovation or an electronic component that does not need to be sealed with a resin by electrode bonding or the like by a bump process. The present invention relates to an electronic component and a method for manufacturing an electronic component in which a hollow region is provided by a cap to protect a circuit element, a connection portion and a connection portion with an electrode, and to prevent disturbance, and in particular, the cap is highly airtight and inexpensive. The present invention relates to an electronic component that can be created and a method for manufacturing the electronic component.

A conventional surface acoustic wave device is a device in which a cap is placed on a stem on which a surface acoustic wave element chip is placed and sealed, and the inner and outer surfaces of the cap are covered with a thin film of a resin material (for example, Patent Document 1). reference).
Japanese Patent Laid-Open No. 7-58580 (page 2 to page 3, FIG. 1)

  Conventional surface acoustic wave devices are usually manufactured as caps by drawing or punching a metal plate, so it is difficult to manufacture caps with multiple types of functionality. In addition, there is a problem that the cost of the metal cap becomes high.

  Further, in order to make the inside of the cap vacuum, it is necessary to cover the stem on which the surface acoustic wave element chip is placed and seal it in a vacuum atmosphere, which causes a problem that the facility becomes large. there were.

  The present invention has been made in order to solve the above-described problems. The first object of the present invention is that the cap can be manufactured at a lower cost than the conventional metal cap, and various caps can be used. The present invention provides an electronic component and a method for manufacturing the electronic component that can ensure high performance with respect to the quality function by having functionality.

  In addition, the second purpose is that the inside of the cap can be evacuated even after the circuit element mounted on the substrate is sealed with the cap, and the reaction rate of electrons is increased compared with that under normal pressure. It is an object of the present invention to provide an electronic component and a method for manufacturing the electronic component that can significantly improve performance.

  In the electronic component according to the present invention, in the electronic component in which the circuit element mounted on the substrate is sealed with a cap, the cap is fixed to the outer peripheral portion on the substrate, and the abbreviation of the mounting portion. A concave portion for enclosing the circuit element is formed in the central portion with a film.

In the electronic component according to the present invention, the inside of the cap is under negative pressure or vacuum as necessary.
Moreover, in the electronic component according to the present invention, the cap has a laminated structure in which a plurality of films are superimposed as necessary.

  Furthermore, in the electronic component according to the present invention, if necessary, the characteristics of the film are electromagnetic shielding, antistatic, moistureproof, insulating, dustproof, selective gas permeability or unidirectional air permeability, Has at least one characteristic.

Moreover, in the electronic component which concerns on this invention, the gel-like body is filled into a part between the laminated | stacked films as needed.
Further, in the electronic component according to the present invention, if necessary, a pattern having a honeycomb structure is printed on the surface of at least one of the laminated films, and another film is in contact with the pattern. Yes.

  Furthermore, in the method for manufacturing an electronic component according to the present invention, in the method for manufacturing an electronic component in which a circuit element mounted on a substrate is sealed with a cap, a film is brought into contact with a mold, and pressure forming, vacuum forming, press forming or Forming a cap having a recess and a mounting portion by hydraulic molding.

  Moreover, in the method of manufacturing an electronic component according to the present invention, if necessary, a step of applying light or a thermosetting resin to the mounting portion of the cap, and a cap applied with the light or thermosetting resin, Applying light or heat to the light or thermosetting resin applied to the mounting portion of the cap placed on the substrate and the step of placing on the substrate via the light or thermosetting resin, Curing a light or thermosetting resin.

  Furthermore, in the method for manufacturing an electronic component according to the present invention, if necessary, the cap has a laminated structure in which a plurality of films are superposed, and a gel-like body is formed between a part of the laminated films. A step of inserting a suction nozzle into the cap so as to penetrate the gel-like body with respect to the cap which is filled and sealed with the circuit element on the substrate, and a gas in the cap by the suction nozzle By suctioning the inside of the cap, and a step of pulling out the suction nozzle from the inside of the cap.

  In the electronic component according to the present invention, in the electronic component in which the circuit element mounted on the substrate is sealed with a cap, the cap is fixed to the outer peripheral portion on the substrate, and the abbreviation of the mounting portion. By forming the concave portion for enclosing the circuit element in the central portion with a film, the circuit element can be protected with an inexpensive cap as compared with a conventional metal cap, potting or resin molding. In addition, necessary information such as product information can be printed on the surface of the film before the cap is molded, and there is no need to perform laser marking or the like unlike a conventional metal cap.

  Further, in the electronic component according to the present invention, if necessary, the inside of the cap is under a negative pressure or a vacuum, so that the reaction speed of electrons is faster than that under normal pressure, and the performance of the electronic component is greatly increased. There is a possibility that can be raised.

  Moreover, in the electronic component according to the present invention, if necessary, the cap has a laminated structure in which a plurality of films are superposed so that the cap can have various characteristics. High performance can be ensured for the quality function.

  Furthermore, in the electronic component according to the present invention, if necessary, the characteristics of the film are electromagnetic shielding, antistatic, moistureproof, insulating, dustproof, selective gas permeability or unidirectional air permeability, By having at least one characteristic, a cap that matches the characteristic of the electronic component can be supplied.

  Moreover, in the electronic component according to the present invention, the circuit element mounted on the substrate is sealed with a cap by filling a part between the laminated films as necessary. Even later, the inside of the cap can be evacuated or negative pressure, and the reaction rate of electrons becomes faster than that under normal pressure, and the performance of the electronic component can be greatly improved. Moreover, the strength of the film can be increased in the portion where the gel-like body is disposed.

  Further, in the electronic component according to the present invention, if necessary, a pattern having a honeycomb structure is printed on the surface of at least one of the laminated films, and another film is in contact with the pattern. Therefore, even when an impact is applied to the cap from the outside or when pressure is applied to the cap from the outside due to vacuum or negative pressure inside the cap, the cap is strong against crushing.

  Furthermore, in the method for manufacturing an electronic component according to the present invention, in the method for manufacturing an electronic component in which a circuit element mounted on a substrate is sealed with a cap, a film is brought into contact with a mold, and pressure forming, vacuum forming, press forming or The step of molding the cap having the recess and the mounting portion by hydraulic molding, thereby providing an electronic device that protects the circuit element with an inexpensive cap as compared with a conventional metal cap, potting, or resin molding. Parts can be manufactured. In addition, necessary information such as product information can be printed on the surface of the film before the cap is molded, and there is no need to perform laser marking or the like unlike a conventional metal cap.

  Moreover, in the method of manufacturing an electronic component according to the present invention, if necessary, a step of applying light or a thermosetting resin to the mounting portion of the cap, and a cap applied with the light or thermosetting resin, Applying light or heat to the light or thermosetting resin applied to the mounting portion of the cap placed on the substrate and the step of placing on the substrate via the light or thermosetting resin, And the step of curing the light or thermosetting resin, the hermeticity in the cap is maintained by the light or thermosetting resin. Further, since the resin is cured by light or heat, outgas from the resin is not generated during molding, and the circuit elements in the cap are not contaminated. Further, not only solid but also gas and liquid can be prevented from entering the cap.

  Furthermore, in the method for manufacturing an electronic component according to the present invention, if necessary, the cap has a laminated structure in which a plurality of films are superposed, and a gel-like body is formed between a part of the laminated films. A step of inserting a suction nozzle into the cap so as to penetrate the gel-like body with respect to the cap which is filled and sealed with the circuit element on the substrate, and a gas in the cap by the suction nozzle A circuit mounted on a substrate in a vacuum atmosphere by providing a step of making the inside of the cap negative pressure or vacuum by sucking the cap, and a step of pulling out the suction nozzle from the cap. There is no need to seal the element with a cap, and even after circuit elements mounted on a substrate are sealed with a cap, the inside of the cap can be evacuated or negative pressure. Kill. In addition, the strength of the cap can be increased at the portion where the gel-like body is disposed, and the cap can be prevented from being crushed even if the suction nozzle is inserted and removed.

(First embodiment of the present invention)
FIG. 1A is a plan view showing an electronic component in the first embodiment for carrying out the present invention, and FIG. 1B is a cross-sectional view taken along line AA of the electronic component shown in FIG. FIG. 2 is a cross-sectional view, FIG. 2 is an explanatory view for explaining a cap manufacturing method in the first embodiment for carrying out the present invention, and FIG. 3 is a cap manufacturing in the first embodiment for carrying out the present invention. FIG. 4 is an explanatory diagram for explaining the continuation of the method, FIG. 4 is an explanatory diagram for explaining a circuit element packaging method in the first embodiment for carrying out the present invention, and FIG. FIG. 5B is a plan view showing an example in which a pattern having a honeycomb structure is printed on a sheet having a laminated structure, which is a material of a cap in the first embodiment, and FIG. 5B is a laminated structure shown in FIG. It is sectional drawing of the arrow BB line of the sheet | seat of this.

  1 to 5, an electronic component 100 has a circuit element 2 mounted on a substrate 1 made of resin, ceramic, or the like sealed with a cap 10 via light or a thermosetting resin 3. Examples of the circuit element 2 include a semiconductor element and a surface acoustic wave (SAW).

  The cap 10 has a mounting portion 10a for fixing the outer peripheral portion on the substrate 1 and a concave portion 10b for enclosing the circuit element 2 in a substantially central portion of a region surrounded by the mounting portion 10a. .

  The cap 10 is molded by using a sheet 40 made of resin, metal, ceramic, or the like as a thin film (the portion to be cut and used for the cap 10 is referred to as a film 4) by a manufacturing process described later. By using the mold 5, the concave portion 10b is formed by the ceiling portion 10c of the cap 10 and the support portion 10d supporting the ceiling portion 10c.

Next, a method for manufacturing the cap 10 will be described with reference to FIGS.
First, the sheet 40 having a uniform film thickness is brought into close contact with the convex mold 5 (FIG. 2A). In the first embodiment, a wood mold, an artificial wood mold, or a resin mold can be used as a mold, but the temperature can be controlled and the cap 10 with less warping and twisting is formed. It is preferable to use a mold 5 suitable for mass production.

  In addition, although a concave mold can be used as a mold, the inner dimension of the cap 10 can be accurately obtained, the entire thickness of the cap 10 can be made as uniform as possible, and a composite multilayer material can be used. A convex mold suitable for molding the cap 10 is preferably used as the mold.

  Moreover, in this 1st Embodiment, although the convex part uses the metal mold | die 5 of a substantially quadrangular prism so that it may become the shape of the cap 10 as shown in FIG. The shape of the mold 5 is appropriately selected depending on the shape, position, and number of circuit elements 2 included in the cap 10.

  Next, the mold 5 with the sheet 40 adhered thereto is inserted into the hydraulic chamber 6 and the cap 10 is molded by the pressure P of the liquid filled in the hydraulic chamber 6 (FIG. 2B). The liquid filled in the hydraulic chamber 6 may be any liquid that does not dissolve the sheet 40 such as water or oil, but by using oil, the pressure P is applied almost evenly to the details of the film 4, and the film is removed. It is preferable because the constituent particles can be stabilized and highly accurate molding can be performed. However, when using the oil, an oil that matches the characteristics of the sheet 40 to be molded is selected. Further, it is preferable to use pure water as the liquid filled in the hydraulic pressure chamber 6 because the step of cleaning the liquid attached to the sheet 40 can be eliminated. Further, the magnitude of the pressure P of the liquid is appropriately selected according to the desired shape, size and thickness of the cap 10.

  Although the cap 10 can be molded by pressure molding, vacuum molding, or press molding, the pressure P can be uniformly applied to the entire film 4 by molding the cap 10 by hydraulic molding. This is preferable because the film 4 does not stretch and can be molded with high accuracy. In particular, a dimensional accuracy of 5 μm or less is preferable at the bent portion where the ceiling portion 10c and the support portion 10d of the cap 10 are connected. According to hydraulic molding, the height of the cap 10 is 1 mm or less and the area of the ceiling portion 10c is small. Precision molding to 1 mm square or less is also possible.

  Next, a portion of the sheet 40 that is not used for the cap 10 and outside the portion that becomes the mounting portion 10a is cut with a blade 7 of a cutting machine (not shown) (FIG. 3A).

  Next, a resin hardness reinforcing material 8 (for example, acrylic resin, organic or inorganic material) is printed on the entire surface of the film 4 by a curved surface printing method (for example, a gravure printing method, a squeegee printing method, a pad printing method, or the like). Alternatively, it is applied by dipping (for example, dipping in a resin surface curing agent) (FIG. 3B). Thereby, even if it is a case where the intensity | strength of the film 4 increases and the nozzle of the mounting machine in a manufacturing process contacts the cap 10, damage to the cap 10 can be suppressed.

  The cap 10 is completed by the above manufacturing process. The manufacturer of the cap 10 may assemble the desired electronic component 100 by sealing the circuit element 2 mounted on the substrate 1 using the completed cap 10, but the completed cap 10 is an assembly manufacturer. In this case, the completed cap 10 is packed in a tray or the like and transported.

  In the first embodiment, when the cap 10 is manufactured, a fixed notation other than the lot number such as the product name of the cap 10 is printed on the surface of the sheet 40 in advance by the film manufacturer. The printing speed is fast and the printing cost can be reduced. In addition, a unique notation such as an assembly factory name, a manufacturing date or a manufacturing machine number, or a lot number enclosing alphabetic characters is printed on the side of the cap 10 at the end. The presence / absence, timing and position of printing are appropriately selected by 100 assembly manufacturers.

Next, a packaging method for sealing the circuit element 2 mounted on the substrate 1 using the completed cap 10 at the manufacturer or assembly manufacturer will be described with reference to FIG.
First, the suction nozzle 9 sucks the ceiling portion 10 c of the cap 10 and supports the cap 10. And the light or the thermosetting resin 3 is apply | coated to the attaching part 10a of the cap 10 (FIG. 4 (a)). In the first embodiment, an ultraviolet curable resin is used as the light or thermosetting resin 3, but a resin curable by visible light, high temperature, normal temperature, or the like may be used. In addition, the film thickness of the light or thermosetting resin 3 is controlled on the micro order by a transfer method. In addition, about the application | coating method of light or the thermosetting resin 3, it is also possible to use a dip, screen printing, or dispensing.

Next, the cap 10 is transferred using the suction nozzle 9 so that the circuit element 2 is included and the light or thermosetting resin 3 comes into contact with the substrate 1. Then, the ultraviolet curable resin that is the light or thermosetting resin 3 is irradiated with ultraviolet rays (UV), thereby curing the ultraviolet curable resin and bonding the substrate 1 and the cap 10 (FIG. 4B). In addition, if the light or thermosetting resin 3 applied to the mounting portion 10a of the cap 10 is a thermosetting resin, the thermosetting resin is cured by applying heat to the thermosetting resin, and the substrate 1 and the cap 10 are then cured. And join. In the first embodiment, the height of the hollow region from the circuit element 2 to the ceiling 10a of the cap 10 can be 1 mm or less.
Through the above manufacturing process, the electronic component 100 in which the circuit element 2 is sealed with the cap 10 is completed.

  In the first embodiment, the pressure state in the cap 10 is not particularly specified, but the cap 10 is mounted on the substrate 1 in a vacuum atmosphere in the vacuum chamber, and the cap 10 is evacuated. By doing so, the reaction speed of electrons becomes faster than that under normal pressure, and there is a possibility that the performance of the circuit element 2 can be greatly improved. In particular, when a sensor, a micro electro mechanical system (MEMS), or a nano electro mechanical system (NEMS) is mounted on the substrate 1 as the circuit element 2, the sensor is operated. In order to do so, the inside of the cap 10 needs to be in a vacuum state. In addition, when making the inside of the cap 10 into a vacuum, it is preferable to make the shape of the film 4 into a structure that can withstand the internal vacuum pressure.

  Further, the cap 10 is mounted on the substrate 1 in an atmosphere of an inert gas (for example, nitrogen gas), and the inside of the cap 10 is deactivated, whereby the circuit element 1, the connection portion, and the substrate 1 in the cap 10. Oxidation and deterioration of the connection portion with the electrode can be prevented.

  In the first embodiment, the film 4, which is a component of the cap 10, is a metal thin film, so that the film 4 has an electromagnetic shielding characteristic for shielding a magnetic field generated from the circuit element 2 or the like. However, the film 4 is not limited to a metal thin film. For example, electromagnetic shielding, antistatic, moisture proof (adsorbs humidity), insulation, dust proof, selective gas permeability or unidirectional ventilation ( By appropriately selecting and molding a functional sheet having characteristics such as gas permeation only from one side, it is possible to provide the cap 10 that matches the characteristics of the electronic component.

  In the first embodiment, the cap 10 having one film layer is formed using one sheet 40, but a plurality of sheets 40 (for example, a sheet having a film thickness of about 5 μm). May be superimposed to form the cap 10 having a laminated structure of the film layer. In this case, by combining and molding appropriately functional sheets each having characteristics such as electromagnetic shielding, antistatic, moisture proof, insulating, dustproof, selective gas permeability or unidirectional breathability, The cap 10 can be provided in accordance with the characteristics of the component.

  Further, as shown in FIG. 5, a pattern 11 having a honeycomb structure on the surface of at least one of the stacked sheets 40 (first sheet 40a in FIG. 5) (in FIG. 5, continuous six Square pattern) is printed, and another sheet (second sheet 40b in FIG. 5) is brought into contact with and bonded to the pattern 11 to form a laminated structure, so that the pattern 11 and the first sheet 40a are connected to the first sheet 40a. The first sheet 40a, the second sheet 40b, and the pattern 11 form a honeycomb structure that serves as an ink column connecting the two sheets 40b.

  Thereby, it can be set as the cap 10 which gives the side surface strength in the support part 10d of the cap 10, and is hard to be crushed. In particular, it is effective as a structure that can withstand a positive pressure outside the cap 10 when the inside of the cap 10 is set to a negative pressure or a vacuum. The pattern 11 is not limited to a continuous hexagon, but includes an octagon in a broad sense as a honeycomb structure. In addition, the first sheet 40a, the second sheet 40b, and the pattern 11 are not limited to the honeycomb structure as long as the side surface strength in the support portion 10d of the cap 10 can be given.

  FIG. 5 shows an example in which the pattern 11 is printed on the entire surface of the first sheet 40a, but the surface of the first sheet 40a corresponding to a portion of the cap 10 that needs to have strength. What is necessary is just to select a part suitably and to print the pattern 11, for example, if only the support part 10d of the cap 10 has intensity | strength, only the surface part of the 1st sheet | seat 40a equivalent to the support part of the cap 10 will be mentioned. The pattern 11 is printed.

  In particular, the pattern 11 is not printed on the surface portion of the first sheet 40a corresponding to the bent portion where the ceiling portion 10c and the support portion 10d of the cap 10 are connected and the bent portion where the support portion 10d and the mounting portion 10a are connected. This is preferable because there is no resistance to bending and the cap 10 can be easily molded.

(Second embodiment of the present invention)
FIG. 6A is a plan view showing an example in which a sheet having a laminated structure, which is a material of a cap according to the second embodiment for carrying out the present invention, is filled with a gel-like body, and FIG. FIG. 7A is a cross-sectional view taken along line CC of the laminated structure sheet shown in FIG. 7A, FIG. 7A is a plan view showing an electronic component in the second embodiment for carrying out the present invention, and FIG. b) is a cross-sectional view taken along line DD of the electronic component shown in FIG. 7A, and FIG. 8 is a drawing step of the electronic component packaging method according to the second embodiment for carrying out the present invention. It is explanatory drawing for demonstrating. 6 to 8, the same reference numerals as those in FIGS. 1 to 5 denote the same or corresponding parts, and the description thereof is omitted.

  The second embodiment is different from the first embodiment only in that the gel-like body 12 is interposed between a part of the laminated films 4, and the action by the gel-like body 12 described later. Except for the effects, the same effects as those of the first embodiment are obtained.

  As shown in FIG. 6, the laminated sheet 40 serving as the material of the cap 10 in the second embodiment has a gel-like body 12 such as a gel-like resin or rubber on the surface of the first sheet 40 a. The gel-like body 12 is applied between the first sheet 40a and the second sheet 40b by bringing the second sheet 40b into contact with the surface of the first sheet 40a to which the gel-like body 12 is applied. Is configured.

  The cap 10 is molded from the laminated structure sheet 40 by the same manufacturing process as that of the first embodiment described above, thereby forming a laminated structure comprising a plurality of films 4 as shown in FIG. A gel-like body 12 is interposed in a part of the space. In the second embodiment, in the cap 10, the gel-like body 12 is sandwiched between the inner film 4a located on the inner side and the outer film 4b located on the outer side. However, the inner film 4a and the outer film 4b are arranged. Each is not limited to a single layer, and may be composed of a plurality of layers. Moreover, it is preferable to arrange | position the gel-like body 12 in the ceiling part 10c in the part in which the gel-like body 12 in the cap 10 is interposed in consideration of the intensity | strength of the cap 10 and workability | operativity in the suction process mentioned later.

Next, a suction process for creating a negative pressure or a vacuum in the cap 10 will be described with reference to FIG.
First, the suction nozzle 13 is inserted into the cap 10 so as to penetrate the gel-like body 12 (FIG. 8A). When the suction nozzle 13 is inserted, the gel-like body 12 filled in the region closed by the film 4 is in close contact with the suction nozzle 13, thereby preventing gas from entering the cap 10 from the outside.

  Next, the suction nozzle 13 sucks the gas in the cap 10 and exhausts the gas to the outside of the cap 10, thereby making the inside of the cap 10 have a negative pressure or a vacuum. At the time of suction by the suction nozzle 13, the entire cap 10 or the ceiling portion 10 c is sucked and held by the vacuum mold 14 or the base having the suction holes 14 a, so that the cap 10 is crushed by the suction by the suction nozzle 13. To prevent that.

  Then, the suction nozzle 13 is pulled out from the cap 10 (FIG. 8B). When the suction nozzle 13 is pulled out, the gel-like body 12 filled in the region closed by the film 4 follows the tip of the suction nozzle 13 by the restoring force, and the region between the films 4 where the suction nozzle 13 is present. Occupy. Thereby, the penetration | invasion of the gas into the cap 10 from the outside can be prevented. In addition, in order to block the scar by the suction nozzle 13 formed in the ceiling part 10c of the cap 10, resin may be printed or potted on the entire cap 10 or the periphery including the scar.

  As described above, in the second embodiment, there is no need to mount the cap 10 on the substrate 1 in a vacuum atmosphere, and the inside of the cap 10 can be easily set to a negative pressure or a vacuum by the suction nozzle 13. Can do. Moreover, the thickness of the cap 10 can be increased in the portion where the gel-like body 12 is disposed, and the strength of the cap 10 can be increased.

(Third embodiment of the present invention)
FIG. 9 is an explanatory diagram for explaining a circuit element packaging method according to the third embodiment for carrying out the present invention. FIG. 10 is a circuit element package according to the third embodiment for carrying out the present invention. FIG. 11 is a cross-sectional view showing another vacuum mold in the third embodiment for carrying out the present invention. 9 to 10, the same reference numerals as those in FIGS. 1 to 8 denote the same or corresponding parts, and the description thereof is omitted.

  The third embodiment is different from the first embodiment and the second embodiment only in that a plurality of circuit elements are packaged at the same time in the production line. Except for the functions and effects, the same functions and effects as those of the first and second embodiments are achieved.

Hereinafter, a packaging method for sealing the circuit elements 2 respectively mounted on the plurality of substrates 1 will be described with reference to FIG.
First, the substrate 1 on which the circuit element 2 is mounted is positioned by vacuum suction from the suction holes 15 a of the substrate holding jig 15, and a recess corresponding to each substrate 1 is formed above the substrate holding jig 15. The sheet | seat 40 which has is arrange | positioned (FIG. 9 (a)).

  Next, the first vacuum mold 16 is brought into contact with the sheet 40 from the side opposite to the substrate 1, and the sheet 40 is molded into the shape of the cap 10 corresponding to each substrate 1 by vacuum molding (FIG. 9B). )).

  Next, the light or thermosetting resin 3 is applied to the portion of the sheet 40 that becomes the attachment portion 10 a of each cap 10. In the third embodiment, an ultraviolet curable resin is used as the light or thermosetting resin 3. In addition, before the sheet 40 having the concave portion corresponding to each substrate 1 is disposed above the substrate holding jig 15, the portion of the sheet 40 that becomes the mounting portion 10 a of each cap 10 is previously light or thermosetting. The resin 3 may be applied.

  Next, the circuit element 2 is included, and the sheet 40 is moved downward so that the light or thermosetting resin 3 contacts the substrate 1. Then, the ultraviolet curable resin that is the light or thermosetting resin 3 is irradiated with ultraviolet rays (UV), thereby curing the ultraviolet curable resin and joining the substrates 1 and the sheet 40 (FIG. 10A). .

Next, a portion of the sheet 40 that is not used for the cap 10 and that is outside the portion that becomes the mounting portion 10a is cut with a blade 7 of a cutting machine (not shown) (FIG. 10B).
Finally, by printing the resin hardness reinforcing material 8 on the surface of each cap 10, the electronic component 100 in which the circuit element 2 is sealed with the cap 10 is completed, and a plurality of circuit elements 2 are simultaneously connected on the production line. Each can be packaged.

  In the third embodiment, the cap 10 can be mounted on the substrate 1 in a vacuum atmosphere, and the inside of the cap 10 can be evacuated. However, as in the second embodiment, It is also possible to evacuate the inside of the cap 10 by the suction nozzle 13 using the sheet 40 having a laminated structure in which the gel-like body 12 is interposed between the first sheet 40a and the second sheet 40b. In this case, instead of the first vacuum mold 16 in FIG. 9B, for example, a second vacuum mold having a through hole 17b into which the suction nozzle 13 can be inserted and removed as shown in FIG. 17 is used.

It is the figure which showed the electronic component in 1st Embodiment for implementing this invention, (a) is a top view, (b) is the arrow AA line | wire of the electronic component shown to Fig.1 (a). It is sectional drawing. It is explanatory drawing for demonstrating the manufacturing method of the cap in 1st Embodiment for implementing this invention. It is explanatory drawing for demonstrating the continuation of the manufacturing method of the cap in 1st Embodiment for implementing this invention. It is explanatory drawing for demonstrating the packaging method of the circuit element in 1st Embodiment for implementing this invention. It is the figure which showed an example which printed the pattern used as a honeycomb structure on the sheet | seat of the laminated structure which is the material of the cap in 1st Embodiment for implementing this invention, (a) is a top view, (b) is a top view It is sectional drawing of the arrow BB line of the sheet | seat of the laminated structure shown to Fig.5 (a). These are the figures which showed the example which filled the sheet | seat of the laminated structure which is the material of the cap in 2nd Embodiment for implementing this invention with the gel-like body, (a) is a top view, (b) is a figure. It is sectional drawing of the arrow CC line of the sheet | seat of the laminated structure shown to 6 (a). It is the figure which showed the electronic component in 2nd Embodiment for implementing this invention, (a) is a top view, (b) is the arrow DD line | wire of the electronic component shown to Fig.7 (a). It is sectional drawing. FIG. 8 is an explanatory view for explaining a suction step in the electronic component packaging method according to the second embodiment for carrying out the present invention. It is explanatory drawing for demonstrating the packaging method of the circuit element in 3rd Embodiment for implementing this invention. It is explanatory drawing for demonstrating the continuation of the packaging method of the circuit element in 3rd Embodiment for implementing this invention. It is sectional drawing which showed the other vacuum metal mold | die in 3rd Embodiment for implementing this invention.

Explanation of symbols

1 Substrate
2 Circuit elements
3 Light or thermosetting resin
4 films
4a Inner film
4b Outer film
5 Mold
6 Hydraulic chamber
7 blades
8 Resin hardness reinforcement
DESCRIPTION OF SYMBOLS 9 Adsorption nozzle 10 Cap 10a Mounting part 10b Recessed part 10c Ceiling part 10d Support part 11 Pattern 12 Gel body 13 Suction nozzle 14 Vacuum die 14a, 16a, 17a, 15a Suction hole 15 Substrate holding jig 16 First vacuum die 17 Second vacuum mold 17b Through hole 40 Sheet 40a First sheet 40b Second sheet 100 Electronic component

Claims (9)

In an electronic component in which a circuit element mounted on a substrate is sealed with a cap,
An electronic device, wherein the cap is formed of a film with a mounting portion for fixing the outer peripheral portion on the substrate and a concave portion for containing the circuit element at a substantially central portion of the mounting portion. parts. The electronic component according to claim 1,
An electronic component characterized in that the inside of the cap is under negative pressure or vacuum. In the electronic component according to claim 1 or 2,
An electronic component, wherein the cap has a laminated structure in which a plurality of films are superposed. In the electronic component according to any one of claims 1 to 3,
An electronic component characterized in that the film has at least one characteristic among electromagnetic shielding, antistatic, moistureproof, insulating, dustproof, selective gas permeability or unidirectional air permeability. In the electronic component according to claim 3 or 4,
An electronic component, wherein a gel-like body is filled in a portion between the laminated films. In the electronic component according to any one of claims 3 to 5,
A pattern having a honeycomb structure is printed on the surface of at least one of the laminated films, and another film is in contact with the pattern. In a method for manufacturing an electronic component in which a circuit element mounted on a substrate is sealed with a cap,
A step of contacting the film with the mold, and molding the cap having the concave portion and the mounting portion by pressure molding, vacuum molding, press molding or hydraulic molding;
An electronic component manufacturing method comprising: In the manufacturing method of the electronic component according to claim 7,
Applying a light or thermosetting resin to the cap mounting portion;
Placing the cap coated with the light or thermosetting resin on the substrate via the light or thermosetting resin;
A step of applying light or heat to the light or thermosetting resin applied to the mounting portion of the cap placed on the substrate, and curing the light or thermosetting resin;
An electronic component manufacturing method comprising: In the manufacturing method of the electronic component according to claim 7 or 8,
The cap is a laminated structure in which a plurality of films are superposed, and a gel-like body is filled in a part between the laminated films,
Inserting a suction nozzle into the cap so as to penetrate the gel-like body with respect to the cap sealing the circuit element on the substrate;
Suctioning the gas in the cap with the suction nozzle, thereby creating a negative pressure or vacuum in the cap;
Extracting the suction nozzle from the cap;
An electronic component manufacturing method comprising:

Images