JP2008053529A - 光半導体素子用封止剤及び光半導体装置 - Google Patents

光半導体素子用封止剤及び光半導体装置 Download PDF

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Publication number
JP2008053529A
JP2008053529A JP2006229141A JP2006229141A JP2008053529A JP 2008053529 A JP2008053529 A JP 2008053529A JP 2006229141 A JP2006229141 A JP 2006229141A JP 2006229141 A JP2006229141 A JP 2006229141A JP 2008053529 A JP2008053529 A JP 2008053529A
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optical semiconductor
group
semiconductor elements
epoxy
sealing agent
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Japanese (ja)
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JP2008053529A5 (https=
Inventor
Mitsuru Tanigawa
満 谷川
Takashi Watanabe
貴志 渡邉
Takashi Nishimura
貴史 西村
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP2006229141A priority Critical patent/JP2008053529A/ja
Publication of JP2008053529A publication Critical patent/JP2008053529A/ja
Publication of JP2008053529A5 publication Critical patent/JP2008053529A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Led Device Packages (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2006229141A 2006-08-25 2006-08-25 光半導体素子用封止剤及び光半導体装置 Withdrawn JP2008053529A (ja)

Priority Applications (1)

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JP2006229141A JP2008053529A (ja) 2006-08-25 2006-08-25 光半導体素子用封止剤及び光半導体装置

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JP2006229141A JP2008053529A (ja) 2006-08-25 2006-08-25 光半導体素子用封止剤及び光半導体装置

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JP2008053529A true JP2008053529A (ja) 2008-03-06
JP2008053529A5 JP2008053529A5 (https=) 2009-08-20

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008153125A1 (ja) * 2007-06-15 2008-12-18 Sekisui Chemical Co., Ltd. 光半導体素子用封止剤及び光半導体素子
JP2012193232A (ja) * 2011-03-15 2012-10-11 Jsr Corp 硬化性組成物、トレンチ埋め込み方法、硬化膜および半導体発光素子
JP2013018921A (ja) * 2011-07-13 2013-01-31 Daicel Corp 硬化性エポキシ樹脂組成物
CN103779486A (zh) * 2012-10-18 2014-05-07 展晶科技(深圳)有限公司 发光二极管封装方法
JP2014095053A (ja) * 2012-11-12 2014-05-22 Nippon Kayaku Co Ltd 硬化性樹脂組成物およびその硬化物
JP2014133807A (ja) * 2013-01-09 2014-07-24 Daicel Corp 硬化性エポキシ樹脂組成物
JP2015088514A (ja) * 2013-10-28 2015-05-07 日東電工株式会社 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法
JP2018030999A (ja) * 2017-08-04 2018-03-01 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
TWI863933B (zh) * 2018-10-15 2024-12-01 日商信越化學工業股份有限公司 感光性樹脂組成物、感光性乾薄膜及圖型形成方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008153125A1 (ja) * 2007-06-15 2008-12-18 Sekisui Chemical Co., Ltd. 光半導体素子用封止剤及び光半導体素子
JP4452755B2 (ja) * 2007-06-15 2010-04-21 積水化学工業株式会社 光半導体素子用封止剤及び光半導体素子
JPWO2008153125A1 (ja) * 2007-06-15 2010-08-26 積水化学工業株式会社 光半導体素子用封止剤及び光半導体素子
US8084530B2 (en) 2007-06-15 2011-12-27 Sekisui Chemical Co., Ltd. Sealing agent for optical semiconductor element, and optical semiconductor element
JP2012193232A (ja) * 2011-03-15 2012-10-11 Jsr Corp 硬化性組成物、トレンチ埋め込み方法、硬化膜および半導体発光素子
JP2013018921A (ja) * 2011-07-13 2013-01-31 Daicel Corp 硬化性エポキシ樹脂組成物
CN103779486A (zh) * 2012-10-18 2014-05-07 展晶科技(深圳)有限公司 发光二极管封装方法
JP2014095053A (ja) * 2012-11-12 2014-05-22 Nippon Kayaku Co Ltd 硬化性樹脂組成物およびその硬化物
JP2014133807A (ja) * 2013-01-09 2014-07-24 Daicel Corp 硬化性エポキシ樹脂組成物
JP2015088514A (ja) * 2013-10-28 2015-05-07 日東電工株式会社 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法
US10297470B2 (en) 2013-10-28 2019-05-21 Nitto Denko Corporation Resin sheet for sealing electronic device and method for manufacturing electronic-device package
JP2018030999A (ja) * 2017-08-04 2018-03-01 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
TWI863933B (zh) * 2018-10-15 2024-12-01 日商信越化學工業股份有限公司 感光性樹脂組成物、感光性乾薄膜及圖型形成方法

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