JP2008039487A - Manufacturing method of laminated structure, and manufacturing apparatus of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated structure for manufacturing the laminated structure at a high profile irregularity, and to provide its manufacturing apparatus. <P>SOLUTION: When the laminated structure is manufactured by bonding one structure 1 and the other structure 5 with an adhesive, one structure is sucked to a jig 6 having the high profile irregularity by suction means 7, 8, to overlie the other structure in a state where one structure is corrected. After one structure and the other structure are bonded, the adhesive is cured and immobilized, in a state where the high planar precision is obtained by the jig. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a bonded structure and an apparatus for manufacturing the same, and more particularly to a method for manufacturing a bonded structure such as an optical element or an encoder wheel and an apparatus for manufacturing the same.

Conventionally, in the production of optical components, etc., which are bonded structures, there are known devices for bonding bonded structures with a pressure device and methods using jigs when bonding so as not to deteriorate the surface accuracy of the surface. It has been.
For example, Patent Document 1 discloses an optical disk component bonding apparatus configured to be pressure-bonded by the following pressing apparatus.
In this apparatus, the press apparatus includes a fixed base, a pressure plate, a pressure cylinder, a valve mechanism, a vacuum pump, and the like.
The bonding apparatus has an upper mold and a lower mold, and a disk holding mechanism is configured on the lower mold.
In a state where the pressure plate of the press apparatus is raised, the upper die and the lower die provided on the fixed base are opened, and the first disk is set on the upper surface of the lower die. A double-sided adhesive tape is previously attached to the upper surface of the disk.
Next, another second disk is placed on the disk holding mechanism, the press device is operated, the pressure plate is lowered to contact the upper mold, and the upper mold is lowered. As a result, pressure is applied between the first and second discs to bond them together.
JP-A-4-259935

  However, the above-described conventional apparatus or one using a jig is expensive because it requires high surface accuracy and is difficult to manufacture. In addition, the desired surface accuracy is not obtained with these devices. For example, the pulse code wheel of an encoder that performs rotation detection manufactured by a conventional method has poor surface flatness. It was difficult to perform accurate rotation detection. Therefore, there has been a problem that the positioning and rotation accuracy of the motor does not increase.

  In view of the above problems, an object of the present invention is to provide a method for manufacturing a bonded structure and an apparatus for manufacturing the bonded structure that can manufacture a bonded structure having high surface accuracy.

In order to solve the above problems, the present invention provides a method for manufacturing a bonded structure and a manufacturing apparatus therefor, which are configured as follows.
The method for producing a bonded structure according to the present invention is a method for producing a bonded structure in which one component and the other component are bonded together with an adhesive.
In the state where the one component is corrected by adsorbing to a jig having high surface accuracy, the other component and the step of bonding with an adhesive;
After bonding the one component and the other component, the step of curing and fixing the adhesive in a state where the surface accuracy by the jig is obtained;
It is characterized by having.
Moreover, the method for manufacturing a bonded structure according to the present invention is characterized in that, in the bonding step, a groove formed in the one structure is used for adsorbing to the jig.
Moreover, the method for manufacturing a bonded structure according to the present invention is characterized in that an optical pattern formed in an optical element is used as the groove formed in the one structure.
Moreover, the method for producing a bonded structure according to the present invention is characterized in that, in the fixing step, a pressing force is further applied and fixed between the jig and the other component. .
Moreover, the manufacturing method of the bonding structure of the present invention is characterized in that an optical element or a pulse code wheel for detecting rotation is manufactured as the bonding structure.
In addition, the bonded structure manufacturing apparatus of the present invention is a bonded structure manufacturing apparatus that is manufactured by bonding one structural body and the other structural body with an adhesive.
It has a high surface accuracy and is equipped with a jig connected to a suction mechanism that performs suction operation by decompression through a suction hole.
The one structure is configured to be able to be held in a state where the one structure is corrected by adsorbing the one structure to the jig by the operation of the suction mechanism. In addition, the bonded structure manufacturing apparatus of the present invention is characterized by further including a pressurizing unit that applies a pressing force between the jig and the other component.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method and its manufacturing apparatus of the bonding structure which can manufacture the bonding structure which has high surface precision are realizable.

Next, an embodiment of the present invention will be described.
FIG. 1 is a cross-sectional view illustrating the basic configuration of a bonded structure manufacturing apparatus according to this embodiment to which the present invention is applied.
In FIG. 1, 1 is a wheel, 2 is a groove, 3 is a bonded structure, 4 is an adhesive, 5 is a fixture, 6 is a jig, 7 is a suction hole, and 8 is a suction mechanism.
The wheel 1 is typified by, for example, a pulse code wheel or a diffraction grating, but is not limited thereto.
Further, a thin wheel member called a pulse code wheel used for an encoder or an optical element such as a diffraction grating has a shape in which grooves are provided at predetermined intervals, and the groove 2 corresponds to these grooves. Is.

The bonding structure 3 in the present embodiment is configured by a structure in which the wheel 1 is fixed to the fixture 5 with an adhesive 4.
The jig 6 is formed with an extremely high flatness A, and has a flatness with which the surface accuracy desired by the wheel 1 can be obtained.
Further, the jig 6 is provided with a suction hole 7 as a means for sucking the wheel 1, and the suction hole 7 is connected to a suction mechanism 8 that performs a suction operation by decompression. The decompression pressure, suction conditions, and bonding conditions are such that the surface accuracy desired according to the material and hardness of the wheel 1 that is the suction target, the thickness, the shape of the groove 2 formed on the surface, and the adhesive 4 to be used. Set to obtain.
As the adhesive 4, those having low viscosity, those having little curing shrinkage, those having a short curing time, and the like are suitable.

Next, the principle of manufacturing the bonded structure of the present invention will be described using the present embodiment.
2 to 4 show the principle of manufacturing a bonded structure according to the present invention.
2 to 4, the same reference numerals are used for the same components as those in FIG.
FIG. 2 shows a state in which the wheel 1 is sucked with the jig 6 according to the present embodiment, and a sectional view of the fixture 5 before bonding.
In the present embodiment, as a means for sucking an object to be sucked such as a wheel, a method of sucking the wheel 1 using the atmospheric pressure by the suction mechanism 8 is adopted.
At that time, if the object to be sucked is an optical element, the entire surface of the object to be sucked is attracted to the jig with uniform pressure using the unevenness formed on the surface from the Pascal principle by decompression. It becomes possible to correct the object to be sucked with desired high surface accuracy.
When the object to be attracted has a magnetic material such as a nickel layer as means for attracting the object to be attracted such as a wheel, magnetic force can also be used as the means for attracting. However, when an electromagnet is used, there is a problem such as heat generation, and even the slightest heat generation is particularly affected as it becomes highly accurate.
In addition, when a permanent magnet is used, it is difficult to attach and detach an object to be attracted and workability is poor.
For this reason, it is desirable to use means based on the atmospheric pressure employed in the present embodiment described above, from the viewpoint of workability at the time of manufacture without generating heat.

Next, when the wheel 1 and the fixture 5 are bonded together, the bonded structure 3 absorbs unevenness in the thickness of the wheel 1 and the trace of cutting of the fixture 5, and the principle that is achieved with high flatness is further illustrated. 2 will be described.
The wheel 1 that is a sucked object is often a thin plate having a thickness of several micrometers to several millimeters, and has a certain thickness unevenness.
In addition, the thin plate shape has low rigidity and the surface is likely to be distorted or bent.
Therefore, the wheel 1 is sucked by the jig 6 having high rigidity and high flatness within the allowable tolerance, and is corrected and held on the surface of flatness A. And it fixes to the fixture 5 with an adhesive agent in this corrected state.
However, the bonding surface 9 of the wheel 1 corrected to a high surface accuracy does not become flat because all the thickness unevenness and distortion of the wheel 1 come out on the bonding surface 9.
The adhesive surface 10 of the fixture 5 is also uneven, such as when there is a trace of cutting.
In FIG. 3, sectional drawing which shows a mode that the wheel and the fixture are adhere | attached is shown.
In the present embodiment, after being bonded to the fixture 5, the adhesive is cured and fixed in a state where the surface accuracy by the jig is obtained, whereby the thickness unevenness of the wheel 1 and the fixture 5 are fixed. Absorbs traces of cutting, etc., so that high flatness can be obtained.

FIG. 4 is a cross-sectional view showing the bonded structure after bonding.
After bonding, suction of the jig 6 is stopped, and the completed bonded structure 3 is opened.
As described above, the bonded structure 3 in which the wheel 1 and the fixture 5 are bonded together by correcting the wheel 1 with the surface of the flatness A of the jig 6 has the uneven thickness of the wheel 1 and the fixture 5. Cutting marks and the like are absorbed and finished with high flatness B.

According to the present embodiment, it is possible to realize a bonded structure with high surface accuracy desired by a simple manufacturing apparatus.
In addition, a desired bonded structure with high surface accuracy can be realized without using components with high surface accuracy.
Furthermore, according to the present embodiment, when manufacturing an encoder or the like, it is possible to realize an encoder having a smaller pitch error or cumulative angle error than a conventional one, thereby enabling position detection and the like with high accuracy. A control system or the like with high position accuracy can be realized.

Examples of the present invention will be described below.
[Example 1]
In Example 1, a method for manufacturing a wheel which is a bonded structure to which the present invention is applied will be described.
5 and 6 are diagrams for explaining the configuration of this embodiment.
5 and 6, common reference numerals are used for the same components.
FIG. 5 is a perspective view showing the bonded structure and jig in a pre-bonding state in the present embodiment.
In FIG. 5, 11 is a wheel. The wheel 11 is provided with a groove 12.
The wheel structure 13 which is a bonded structure is a structure in which the wheel 11 is fixed to the wheel fixture 15 with an adhesive 14 (not shown in FIG. 5, see FIG. 6).
A suction hole 17 and a suction groove 18 are formed in the jig 16, and a suction mechanism 19 is connected as a means for reducing pressure.

FIG. 6 is a cross-sectional view showing a state in which the bonded structure shown in FIG. 5 is bonded.
The suction groove 18 formed in the jig 16 is disposed so as to be hooked on the groove 12 of the wheel 11, and transmits the pressure reduced by the suction mechanism 19 to the entire groove 12 of the wheel 11, thereby sucking the wheel 11 to the jig 16. Fulfill.
The jig 16 is formed with a flatness C, and the sucked wheel 11 is corrected with the high flatness of the jig 16 and bonded to the wheel fixture 15 with an adhesive 14.
After the adhesive is cured, the suction of the suction mechanism 19 is stopped, and the wheel structure 13 in which the wheel 11 and the wheel fixture 15 are integrated is released from the jig 16.

[Example 2]
In Embodiment 2, a method for manufacturing a pulse code wheel used in an encoder to which the present invention is applied will be described.
FIG. 7 is a cross-sectional view for explaining the configuration of this embodiment.
In FIG. 7, 21 is a pulse code wheel used for an encoder. The surface of the pulse code wheel 21 has a shape provided with a groove (not shown) of an optical pattern.
In order to manufacture the pulse code wheel structure 20 which is a bonded structure, first, the pulse code wheel mounting tool 22 is placed on the base 24 and the adhesive 23 is applied.

Next, a suction hole 26 and a suction groove 27 are formed, and the pulse code wheel 21 is placed on the jig 25 to which the suction mechanism 28 is connected while the pulse code wheel 21 is sucked. The adhesive 23 is cured in a state where the pressure is pressed.
After the adhesive 23 is cured, the suction of the suction mechanism 28 is stopped, and the completed pulse code wheel structure 20 is opened.
The diameter of the pulse code wheel 21 is larger than that of the pulse code wheel fixture 22.
In the second embodiment shown in FIG. 7, the jig 25 is placed on the upper side, and the jig 16 shown in FIG.
As described above, due to the shape and arrangement of the jig and each element, no trouble occurs even if the adhesive 23 protrudes.

[Example 3]
In the third embodiment, a method of manufacturing a pulse code wheel having a different form from the second embodiment to which the present invention is applied will be described.
8 and 9 are diagrams for explaining the configuration of this embodiment.
FIG. 8 is a schematic diagram showing the entire pulse code wheel according to the third embodiment of the present invention.
In FIG. 8, 29 is a pulse code wheel used for the encoder, and grooves of the pattern 30 are provided over the entire circumference at a predetermined interval, but FIG. 8 shows only a part of the three patterns 30.

FIG. 9 is an enlarged view of the pattern portion 31 in the pulse code wheel shown in FIG.
The groove of the pattern 30 provided on the pulse code wheel 29 is a pattern for forming a reflective part and a non-reflective part originally, but here, a pattern example in which a groove is formed as in a single stroke is shown. This is an example in which the groove for optics is a groove for sucking with a uniform pressure.

  This is a groundbreaking technology that uses a jig with a simple structure to fix the factors that deteriorate the accuracy of parts, such as bending and distortion of parts, unevenness of thickness, and traces of cutting. In addition to the shape, various applications such as making a desired cylindrical surface or curved surface are possible.

Sectional drawing explaining the basic composition of the manufacturing apparatus of the bonding structure body in embodiment of this invention. Sectional drawing which shows a mode that the wheel was attracted | sucked with the jig | tool in embodiment of this invention, and the fixture before adhesion | attachment. Sectional drawing which shows a mode that the wheel and fixture in embodiment of this invention are adhere | attached. Sectional drawing which shows the bonding structure after the adhesion | attachment in embodiment of this invention. The perspective view which shows the bonding structure body and jig | tool of the state before adhesion | attachment in Example 1 of this invention. Sectional drawing which shows a mode that the bonding structure shown by FIG. 5 is adhere | attached. Sectional drawing which shows the structure of the pulse code wheel in Example 2 of this invention. Schematic which shows the whole pulse code wheel in Example 3 of this invention. The enlarged view of the pattern part in the pulse code wheel shown by FIG.

Explanation of symbols

1, 11: Wheel 2, 12: Groove 3: Bonded structure 4, 14, 23: Adhesive 5: Fixtures 6, 16, 25: Jigs 7, 17, 26: Suction holes 8, 19, 28: Suction mechanism 9, 10: Adhesion surface 13: Wheel structure 15: Wheel fixture 18, 27: Suction groove 20: Pulse code wheel structure 21, 29: Pulse code wheel 22: Pulse code wheel fixture 24: Base 30: Pattern 31: Pattern part

Claims (7)

In the method for producing a bonded structure in which one component and the other component are bonded together with an adhesive,
In the state where the one component is corrected by adsorbing to a jig having high surface accuracy, the other component and the step of bonding with an adhesive;
After bonding the one component and the other component, the step of curing and fixing the adhesive in a state where the surface accuracy by the jig is obtained;
A method for manufacturing a bonded structure including the following.   The method for manufacturing a bonded structure according to claim 1, wherein, in the bonding step, a groove formed in the one component is used for adsorbing to the jig.   The method for producing a bonded structure according to claim 2, wherein an optical pattern formed on an optical element is used as the groove formed on the one component.   In the fixing step, further pressing force is applied between the jig and the other component, and the adhesive is cured and fixed in a state where the surface accuracy by the jig is obtained. A method for manufacturing a bonded structure according to any one of claims 1 to 3.   The method for manufacturing a bonded structure according to any one of claims 1 to 4, wherein an optical element or a pulse code wheel for detecting rotation is manufactured as the bonded structure. In the manufacturing apparatus for a bonded structure in which one component and the other component are bonded together using an adhesive,
It has a high surface accuracy and is equipped with a jig connected to a suction mechanism that performs suction operation by decompression through a suction hole.
An apparatus for producing a bonded structure, wherein the one structure is configured to be held in a state where the structure is corrected by adsorbing the one structure to the jig by the operation of the suction mechanism.   The bonded structure manufacturing apparatus according to claim 6, further comprising a pressing unit that applies a pressing force between the jig and the other component.

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