JP2008034452A - Packaging structure of electronic part, and its packaging method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packaging structure of an electronic part in which processability and productivity are good without air bubbles (void) in an under fill, and to provide its packaging method. <P>SOLUTION: In the packaging structure of the electronic part, an insulating film 3 is provided with a first film removal part 4 that is formed along the arrangement of terminals 2a where a terminal 2a is avoided, and a second film removal part 5 that is connected with the first film removal part 4 and is extended toward the central side of a main part 9. Therefore, the filling rate of an under fill 11 is made lower in the second film removal part 5, so that the under fill 11 is put in the central side at late timing. As a result, the under fill 11 having no air bubble (void) in its inside can be obtained. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a mounting structure of an electronic component suitable for use in various electric devices, electronic circuit units, and the like, and a mounting method thereof.

  A conventional electronic component mounting structure and a drawing related to the mounting method will be described. FIG. 12 is an explanatory diagram showing a conventional electronic component mounting structure and a mounting method thereof, and then a conventional electronic component mounting. The structure of the structure will be described with reference to FIG. 12. An electronic component 52 is attached to an insulating substrate 51 having a through hole 51 so as to face the through hole 51 a. Is provided with an underfill 53 made of resin (see, for example, Patent Document 1).

In addition, as shown in FIG. 12, the conventional electronic component mounting method includes disposing a dispenser 54 on the periphery of the electronic component 52 attached to the insulating substrate 51 and disposing a suction device 55 below the through hole 51a. First, the liquid underfill 53 is injected into the entire circumference of the electronic component 52 by the dispenser 54, and then the underfill 53 is sucked from the through hole 51a toward the central portion of the electronic component 53 by the suction device 55. (For example, refer to Patent Document 1).
Japanese Patent Laid-Open No. 10-261661

  However, in the conventional electronic component mounting structure, since the through hole 51a is provided in the insulating substrate 51, the insulating substrate 51 needs to be perforated, and the through hole 51a is a dead space. In addition, in the mounting method, the liquid underfill 53 is injected into the entire circumference of the electronic component 52 by the dispenser 54, and then the suction device 55 removes the underfill from the through hole 51a. Since the fill 53 is sucked toward the center of the electronic component 53, it is necessary to inject the underfill 53 around the entire circumference of the electronic component 52 and suck the underfill 53 by the suction device 55. There is a problem that the work is troublesome and the productivity is deteriorated.

  SUMMARY OF THE INVENTION The present invention has been made in view of such a state of the art, and the object thereof is a mounting structure for an electronic component having good workability and productivity, and no bubbles in the underfill, and a mounting method thereof. Is to provide.

  To achieve the above object, the present invention provides an insulating substrate provided with a plurality of terminals, an insulating film provided on the insulating substrate while avoiding the terminals, and an electrode provided on the lower surface of the main body. And an underfill made of a resin provided between the insulating film and the electronic component and between the insulating substrate and the electronic component, the insulating film is formed on the outer peripheral portion of the main body. A first film removing portion provided along the arrangement of the terminals in a state avoiding the terminals located in the vicinity of the first, and the second film connected to the first film removing portion and extending toward the center side of the main body portion It has a film removal part.

  The present invention configured as described above does not require a through-hole for suction in an insulating substrate provided with a plurality of terminals, so that a drilling process is not required and a dead space due to the through-hole is eliminated. Thus, the insulating substrate can be reduced in size, and the insulating film is connected to the first film removing portion provided along the terminal arrangement in a state where the terminals are avoided, and the first film removing portion. Since the second film removing portion extending toward the center side of the main body portion is provided, the underfill filling speed is reduced in the second film removing portion, and as a result, the timing at which the underfill is filled in the center side is obtained. The underfill without bubbles (voids) is obtained on the inside, and a product with good productivity can be obtained without using a suction device.

  The present invention is characterized in that, in the above-mentioned invention, the insulating film is formed thicker than the terminal.

  The present invention configured as described above has a capillary phenomenon between the insulating substrate and the main part of the electronic component (second film removing part) rather than a liquid underfill that flows between the insulating film and the main part of the electronic part by a capillary phenomenon. As a result, the liquid underfill that flows is delayed, so that the air present on the center side of the main body can be reliably pushed out toward the first film removal portion, and an underfill free of bubbles (voids) can be obtained. .

  Further, the present invention is characterized in that, in the above invention, the first and second film removal portions are formed in a band shape.

  In the present invention configured as described above, the first and second film removal portions can be easily formed, and the timing at which the underfill is filled can be easily adjusted by the strip-shaped second film removal portion.

  Further, according to the present invention, in the above invention, the terminal includes a first terminal located near the outer peripheral portion of the main body and a second terminal located closer to the center of the main body than the first terminal. And the 2nd film removal part was formed ranging over the 2nd terminal, It is characterized by the above-mentioned.

  In the present invention configured as described above, the air at the position of the second terminal can be surely pushed out to the first film removal unit side through the second film removal unit, and there is no bubble (void). Fill is obtained.

  Further, according to the present invention, in the above invention, the first terminals are arranged in a square shape along the square line, and the first film removal portions are located on the first lines parallel to each other. A deletion unit and a second deletion unit connected to the first deletion unit and positioned on a second line parallel to each other are provided.

  In the present invention configured as described above, the first and second deletion portions are connected to each other, so that the first terminal arranged in a square shape (b-shaped) has a bubble. An underfill without any is obtained.

  Moreover, the present invention is characterized in that, in the above-mentioned invention, the second film removal portion is connected to the second deletion portion and extends toward the center side of the main body portion.

  According to the present invention configured as described above, air in the second film removal portion can escape through the second deletion portion, and an underfill without bubbles (voids) can be obtained.

  Further, the present invention is characterized in that, in the above-described invention, a third film removal portion connected to the first film removal portion is provided, and the third film removal portion extends toward the periphery of the main body portion. .

  In the present invention configured as described above, the air existing on the lower surface side of the main body part or the first film removing part can be reliably discharged out of the main body part by the third film removing part, and there is no bubble (void). Fill is obtained.

  Moreover, the present invention is characterized in that, in the above-mentioned invention, the third film removing portion is formed to extend outward from the peripheral edge of the main body portion.

  According to the present invention configured as described above, the air existing on the lower surface side of the main body can be reliably discharged out of the main body by the third film removing unit, and an underfill free of bubbles (voids) can be obtained.

  Further, the present invention is characterized in that, in the above-mentioned invention, the third film removal portion is formed extending in a direction perpendicular to the second deletion portion.

  According to the present invention configured as described above, the flow of the liquid underfill on the peripheral side of the main body can be controlled (slow) by the presence of the third film removal portion extending in the direction perpendicular to the second deletion portion. The flow balance between the liquid underfill on the center side of the main body can be adjusted.

  Moreover, the present invention is characterized in that, in the above invention, the third film removal portion is formed to extend outward from the periphery of the main body portion in a state of being connected to the vicinity of one center of the first deletion portion. Yes.

  The present invention configured as described above can discharge the last air existing in the first film removing unit to the outside of the main body by providing the third film removing unit in the vicinity of the center of the one first deleting unit. Thus, an underfill free of bubbles (voids) can be obtained.

  In order to achieve the above object, the present invention comprises a mounting structure for an electronic component according to any one of claims 1 to 4, and a dispenser for injecting underfill disposed on the periphery of the electronic component. The dispenser is characterized in that the underfill is injected in a state where the dispenser is disposed at a position orthogonal to the first film removing portion.

  The present invention thus configured eliminates the need to inject the underfill around the electronic component by the dispenser or to suck the underfill by the suction device, so that the workability is good and the productivity is good. In addition, since the dispenser injects the underfill in a state where the dispenser is disposed at a position orthogonal to the first film removal unit, the air present in the second film removal unit is directed to the first film removal unit side. It can be reliably extruded and an underfill free of bubbles (voids) can be obtained.

  In order to achieve the above object, the present invention comprises a mounting structure for an electronic component according to claim 5 or 6, and has a dispenser for injecting underfill disposed on the periphery of the electronic component. The dispenser is characterized in that an underfill is injected in a state where the dispenser is disposed at a position orthogonal to the first deletion portion.

  The present invention thus configured eliminates the need to inject the underfill around the electronic component by the dispenser or to suck the underfill by the suction device, so that the workability is good and the productivity is good. In addition, since the second film removal portion is in a state orthogonal to the dispenser, the underfill filling speed is reduced at the second film removal portion, so that the underfill is filled in the center side. The timing is delayed, and an underfill without bubbles (voids) inside is obtained.

  To achieve the above object, the present invention comprises a mounting structure for an electronic component according to any one of claims 7 to 9, and a dispenser disposed on the periphery of the electronic component for injecting underfill. The dispenser is characterized in that the underfill is injected in a state where the dispenser is disposed at a position orthogonal to the first deletion portion.

  The present invention thus configured eliminates the need to inject the underfill around the electronic component by the dispenser or to suck the underfill by the suction device, so that the workability is good and the productivity is good. In addition, in order to inject the underfill in a state where the dispenser is disposed at a position orthogonal to the first deletion portion, the air present in the first film removal portion is reliably transferred to the third film removal portion side. It can be extruded and an underfill free of bubbles (voids) can be obtained.

  In order to achieve the above object, the present invention comprises a mounting structure for an electronic component according to claim 10, and has a dispenser for injecting underfill disposed on the periphery of the electronic component. So as to inject the underfill in a state of being arranged at a position orthogonal to the other first first deletion portion facing the first first deletion portion provided with the third film removal portion. It is characterized by that.

  The present invention thus configured eliminates the need to inject the underfill around the electronic component by the dispenser or to suck the underfill by the suction device, so that the workability is good and the productivity is good. In addition, the dispenser is arranged in a state in which the third film removing unit is disposed at a position orthogonal to the other first deleting unit facing the first deleting unit provided in the vicinity of the center. In order to inject the underfill, the last air existing in the first film removal unit can be discharged to the outside of the main body through the third film removal unit, and an underfill free of bubbles (voids) can be obtained.

  The present invention provides a first film removing portion provided along the arrangement of the terminals in a state where the insulating film avoids the terminals, and the first film removing portion connected to the first film removing portion and extending toward the center side of the main body portion. As a result of having the film removal part 2, the filling speed of the underfill is slow at the second film removal part, resulting in a slow timing of filling the underfill on the center side and no air bubbles (voids) inside. Underfill is obtained.

  An embodiment of the invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of an essential part relating to the electronic component mounting structure of the present invention, and FIG. 3 is an enlarged view of a portion A in FIG. 1, FIG. 4 is a front view showing the electronic component mounting method of the present invention, FIG. 5 is a plan view showing the electronic component mounting method of the present invention, and FIG. It is explanatory drawing which shows the 1st flow state of a liquid underfill regarding the mounting method of this electronic component.

  7 is an explanatory view showing a second flow state of the liquid underfill according to the electronic component mounting method of the present invention, and FIG. 8 is related to the electronic component mounting method of the present invention according to the method of mounting the liquid underfill. FIG. 9 is an explanatory view showing a third flow state, FIG. 9 is an explanatory view showing a fourth flow state of a liquid underfill according to the electronic component mounting method of the present invention, and FIG. 10 is an electronic component mounting method of the present invention. FIG. 11 is an explanatory diagram showing a sixth flow state of the liquid underfill according to the electronic component mounting method of the present invention.

  Next, the configuration of the electronic component mounting structure of the present invention will be described with reference to FIGS. 1 to 3. On the insulating substrate 1 made of a laminated substrate or the like, a plurality of first and first wiring patterns that are part of a wiring pattern are provided. The second terminals 2a and 2b are provided, and the first terminals 2a are arranged in, for example, a line (square shape) along the square line, for example, in a row. Arranged on the center side of the terminal 2a group.

  On this insulating substrate 1, an insulating film 3 such as a solder resist made of an epoxy resin is provided in a state where the first and second terminals 2a and 2b are avoided. A strip-shaped first film removing section 4 is provided along the arrangement of the terminals 2a. The first film removing section 4 has a square shape (b-shaped) and is formed in a rectangular shape parallel to each other. The first deletion unit 4a is positioned on the first line, and the second deletion unit 4b is connected to the first deletion unit 4a and is positioned on a second line parallel to each other.

  Moreover, the insulating film 3 has an island-shaped portion provided at a position surrounded by the first film removing portion 4, and the insulating film 3 positioned at the island-shaped portion has a second deleted portion. A plurality of second film removal portions 5 connected to 4 and extending in a substantially right-angle direction so as to straddle the second terminals 2b are provided.

  Furthermore, the insulating coating 3 is formed by a third film removal portion 6 extending from the end of the first removal portion 4a in a straight line with the first removal portion 4a (perpendicular to the second removal portion 4b). The third film removal unit 6 extending outward from the central portion of the first deletion unit 4a at a right angle and the third film removal unit 6 extending outward from the second deletion unit 4b at a right angle. An annular fourth film removing unit 7 connected to the film removing unit 6.

  The insulating film 3 has a thickness of about 25 μm and is thicker than the thickness of the terminal 2 (10 μm). The widths of the first, second, and third film removing portions 4, 5, and 6 are as follows. It is formed with 10 μm or more.

  A rectangular parallelepiped electronic component 8 made of a semiconductor chip or the like has a main body portion 9 and first and second electrodes 10a and 10b provided on the lower surface of the main body portion 9. The first electrode 10a is a main body portion. The second electrode 10b is arranged closer to the center of the main body 9 than the first electrode 10a, and the electronic component 8 is The first and second electrodes 10a and 10b are connected and attached to the first and second terminals 2a and 2b by solder, a ball grid array or the like.

  At this time, the island-shaped portion of the insulating coating 3 is located at the center of the main body 9, and the first and second film removal portions 4, 5 are positioned below the main body 9. The third film removal unit 6 protrudes outward from the peripheral edge of the main body 9, and the fourth film removal unit 7 is disposed so as to surround the vicinity of the main body 9, and between the insulating substrate 1 and the main body 9. The space between the lower surfaces is about 50 to 80 μm.

  The underfill 11 made of epoxy resin is provided between the insulating film 3 and the lower surface of the main body 9, between the insulating substrate 1 and the lower surface of the main body 9, and at the peripheral edge of the main body 9. The underfill 11 that protrudes from and protrudes from the peripheral edge of the main body 9 is suppressed from spreading at the edge by the fourth film removal portion 7 for suppressing spread. As shown in FIG. 3, the liquid underfill 11 at the edge of the fourth film removal portion 7 has a contact angle formed by the insulating film 3 and the underfill 11 in the range of 90 to 135 degrees. Yes.

  When the contact angle of the liquid underfill 11 is less than 90 degrees, the fluidity of the underfill 11 becomes high and the underfill 11 flows out widely, and the contact angle of the liquid underfill 11 increases to 135 degrees. If it exceeds, the fluidity of the underfill 11 becomes low, the flow of the underfill 11 becomes poor, and when the contact angle is in the range of 90 to 135 degrees, the insulating film 3 and the underfill 11 are not easily wetted. It becomes.

  Next, the electronic component mounting method of the present invention will be described with reference to FIGS. 4 to 11. First, as shown in FIGS. 4 and 5, the dispenser 12 for injecting the liquid underfill 11 is an electronic component. 7 is disposed at a position orthogonal to the other first deletion portion 4a opposite to the first deletion portion 4a provided with the third film removal portion 6 in the vicinity of the center.

  At this time, the dispenser 12 is in a state of being substantially orthogonal to the second film removal unit 5, and in this state, when the liquid underfill 11 is injected by the dispenser 12, as shown in FIG. Since the gap between the insulating film 3 and the main body 9 is small, it flows in between them by capillary action, and then the underfill 11 overflowing between the insulating film 3 and the main body 9 is a first deletion close to the dispenser 12 It flows into the portion 4a by capillary action.

  And the underfill 11 overflowing from the 1st deletion part 4a flows into between the island-shaped part of the insulating coating 3 with a small gap, and the main-body part 9, and it is in the edge of the 3rd film removal part 6 Since the amount of the underfill 11 positioned is small, it stops at the edge of the third film removal unit 6 due to the viscosity of the underfill 11 and does not flow into the third film removal unit 6.

  Further, when the liquid underfill 11 is injected, the inflow of the underfill 11 precedes between the island-like portion of the insulating film 3 having a small gap and the main body 9 as shown in FIG. When the position 5 is reached, the underfill 11 temporarily stops at the edge of the second film removal portion 5, and the filling (flowing) speed of the underfill 11 becomes slow. The underfill 11 is filled with the underfill 11, and the underfill 11 gets over the third film removal unit 6 located near the dispenser 12 and faces the peripheral edge of the main body 9. Between the main body 9 and the main body 9.

  Further, when the liquid underfill 11 is injected, as shown in FIG. 8, the underfill 11 that has flowed into the first second film removal portion 5 overflows in the center of the main body 9, and the underfill 11 11 flows between the insulating coating 3 and the main body 9 and stays at the edge of the second second coating removal section 5. In the meantime, the air located in the second coating removal section 5 Is pushed out to the first film removal unit 4.

  On the peripheral side of the main body 9, the underfill 11 temporarily stops at the edge of the third film removal portion 6 provided at the substantially central portion of the second deletion portion 4 b to fill the underfill 11 (flow). ) The speed is reduced, and the underfill 11 that has flowed into the third film removal portion 6 overflows, and the underfill 11 flows between the insulating film 3 and the periphery of the main body portion 9. However, in the meantime, the air located in the 1st film removal part 4 will be extruded by the 3rd film removal part 6. FIG.

  Further, when the liquid underfill 11 is injected, as shown in FIG. 9, the underfill 11 that has flowed into the second second film removing portion 5 overflows in the central portion of the main body 9, and the underfill 11 11 flows between the insulating coating 3 and the main body 9 and stays at the edge of the first deletion portion 4a far from the dispenser 12, but in the meantime, the second second coating removal portion 5 The air located at the position 1 is pushed out to the first film removal unit 4.

  In addition, on the peripheral side of the main body 9, the underfill 11 temporarily stops at the edge of the third film removing unit 6 far from the dispenser 12, and the filling (flow) speed of the underfill 11 becomes slow. On the lower surface of 9, since the width of the third film removal unit 6 is smaller than that of the first deletion unit 4 a, a part of the underfill 11 flows into the third film removal unit 6. The air located in the first film removal unit 4 is pushed out to the third film removal unit 6.

  Further, when the liquid underfill 11 is injected, as shown in FIG. 10, a part of the first deleted portion 4a located far from the dispenser 12 and the third deleted portion 4a connected at right angles to the first deleted portion 4a. When the film removal unit 6 is left, and then the liquid underfill 11 is injected, the air present in a part of the first deletion unit 4a located far from the dispenser 12 removes the third film. It will be discharged from the part 6 and will be in a state as shown in FIG.

  In the state of FIG. 11, the underfill 11 overflowing from the lower surface of the main body 9 fills the periphery of the main body 9 and partly flows out to the fourth film removal portion 7 side. The film removal portion 7 becomes a weir of the underfill 11, has a contact angle as shown in FIG. 3, and further underflow 11 is prevented from flowing out, and the mounting of the electronic component of the present invention is completed.

  Thus, in the case where the wettability of the underfill 11 is good (the fluidity is good) due to the presence of the second film removal unit 5 connected to the second deletion unit 4 b, By controlling (delaying) the flow of the underfill 11, it is possible to reliably discharge air at the center of the lower surface of the main body 9.

It is principal part sectional drawing which concerns on the mounting structure of the electronic component of this invention. It is a top view of the insulated substrate which concerns on the mounting structure of the electronic component of this invention. It is an enlarged view of the A part of FIG. It is a front view which shows the mounting method of the electronic component of this invention. It is a top view which shows the mounting method of the electronic component of this invention. It is explanatory drawing which shows the 1st flow state of a liquid underfill regarding the mounting method of the electronic component of this invention. It is explanatory drawing which shows the 2nd flow state of a liquid underfill regarding the mounting method of the electronic component of this invention. It is explanatory drawing which shows the 3rd flow state of a liquid underfill regarding the mounting method of the electronic component of this invention. It is explanatory drawing which shows the 4th flow state of a liquid underfill regarding the mounting method of the electronic component of this invention. It is explanatory drawing which shows the 5th flow state of a liquid underfill regarding the mounting method of the electronic component of this invention. It is explanatory drawing which concerns on the mounting method of the electronic component of this invention, and shows the 6th flow state of a liquid underfill. It is explanatory drawing which shows the mounting structure of the conventional electronic component, and its mounting method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insulation board | substrate 2a 1st terminal 2b 2nd terminal 3 Insulation film 4 1st film removal part 4a 1st deletion part 4b 2nd deletion part 5 2nd film removal part 6 3rd film removal part 7 4th film removal part 8 Electronic component 9 Main-body part 10a 1st electrode 10b 2nd electrode 11 Underfill 12 Dispenser

Claims (14)

An insulating substrate provided with a plurality of terminals, an insulating film provided on the insulating substrate in a state avoiding the terminals, an electronic component in which an electrode provided on the lower surface of the main body is connected to the terminals, An underfill made of a resin provided between the insulating film and the electronic component and between the insulating substrate and the electronic component, and the insulating film is positioned in the vicinity of the outer peripheral portion of the main body. A first film removing portion provided along the arrangement of the terminals in a state avoiding the terminal, and a second film connected to the first film removing portion and extending toward the center side of the main body portion An electronic component mounting structure characterized by having a removal portion. The electronic component mounting structure according to claim 1, wherein the insulating film is formed thicker than the terminal. The electronic component mounting structure according to claim 1, wherein the first and second film removal portions are formed in a band shape. The terminal includes a first terminal located in the vicinity of the outer peripheral portion of the main body, and a second terminal located closer to the center of the main body than the first terminal, and the second coating 4. The electronic component mounting structure according to claim 1, wherein a removal portion is formed across the second terminal. 5. The first terminal is disposed in a square shape along a square line, and the first film removal unit includes the first deletion unit positioned on a first line parallel to each other, and the first removal unit. 5. The electronic component mounting structure according to claim 4, wherein the second deletion unit is connected to the deletion unit and located on a second line parallel to each other. The electronic component mounting structure according to claim 5, wherein the second film removal portion is connected to the second deletion portion and extends toward the center of the main body portion. The third film removal portion connected to the first film removal portion, and the third film removal portion extends toward the peripheral edge of the main body portion. Electronic component mounting structure. The electronic component mounting structure according to claim 7, wherein the third film removing portion is formed to extend outward from a peripheral edge of the main body portion. 9. The electronic component mounting structure according to claim 7, wherein the third film removal portion is formed to extend in a direction perpendicular to the second deletion portion. The third film removal portion is formed to extend outward from the peripheral edge of the main body portion in a state of being connected to the vicinity of one center of the first deletion portion. Mounting structure of the electronic component described. 5. The electronic component mounting structure according to claim 1, further comprising a dispenser that is disposed on a peripheral edge of the electronic component and injects the underfill. An electronic component mounting method, wherein the underfill is injected in a state of being arranged at a position orthogonal to the film removal portion. The electronic component mounting structure according to claim 5 or 6, further comprising a dispenser disposed on a periphery of the electronic component for injecting the underfill, wherein the dispenser includes the first deletion unit. A method for mounting an electronic component, wherein the underfill is injected in a state where the underfill is disposed at a position perpendicular to the electronic component. The electronic component mounting structure according to any one of claims 7 to 9, further comprising a dispenser disposed on a peripheral edge of the electronic component and injecting the underfill, wherein the dispenser includes the first component. An electronic component mounting method, wherein the underfill is injected in a state of being arranged at a position orthogonal to the deletion portion. 11. The electronic component mounting structure according to claim 10, further comprising a dispenser disposed on a periphery of the electronic component for injecting the underfill, wherein the dispenser is provided with the third film removing unit. The underfill is injected in a state of being arranged at a position orthogonal to the other one of the first deletion portions facing the one first deletion portion. Component mounting method.

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