JP2008033284A5 - - Google Patents
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- JP2008033284A5 JP2008033284A5 JP2007168757A JP2007168757A JP2008033284A5 JP 2008033284 A5 JP2008033284 A5 JP 2008033284A5 JP 2007168757 A JP2007168757 A JP 2007168757A JP 2007168757 A JP2007168757 A JP 2007168757A JP 2008033284 A5 JP2008033284 A5 JP 2008033284A5
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- Prior art keywords
- conductive layer
- conductive
- layer
- display device
- conductive material
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- 239000004020 conductor Substances 0.000 claims 16
- 238000007599 discharging Methods 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- 230000001568 sexual effect Effects 0.000 claims 2
Claims (12)
前記第1の導電層で囲まれた領域に、第2の導電性材料を含む組成物を吐出し前記第1の導電層の枠内に第2の導電層を形成することを特徴とする表示装置の作製方法。 A frame-shaped first conductive layer is formed by discharging a composition containing a first conductive material over a substrate having an insulating surface;
In a region surrounded by the front Symbol first conductive layer, and forming a second conductive layer on the second conductive material discharging a composition including a first conductive layer within the frame A method for manufacturing a display device.
前記第1の導電層で囲まれた領域に、第2の導電性材料を含む組成物を吐出し前記第1の導電層の枠内に第2の導電層を形成し、
前記第1の導電性材料を含む組成物の粘度は前記第2の導電性材料を含む組成物の粘度より高いことを特徴とする表示装置の作製方法。 A frame-shaped first conductive layer is formed by discharging a composition containing a first conductive material over a substrate having an insulating surface;
In a region surrounded by the front Symbol first conductive layer, the second conductive layer is formed on the second conductive material discharging a composition including a first conductive layer within the frame,
A method for manufacturing a display device, characterized in that the viscosity of the composition containing the first conductive material is higher than the viscosity of the composition containing the second conductive material.
前記第1の導電層で囲まれた領域に、第2の導電性材料を含む組成物を吐出し前記第1の導電層の枠内に第2の導電層を形成し、
前記第1の導電性材料を含む組成物が吐出される領域に対する前記第1の導電性材料を含む組成物のぬれ性は、前記第2の導電性材料を含む組成物が吐出される領域に対する前記第2の導電性材料を含む組成物のぬれ性より低いことを特徴とする表示装置の作製方法。 A frame-shaped first conductive layer is formed by discharging a composition containing a first conductive material over a substrate having an insulating surface;
In a region surrounded by the front Symbol first conductive layer, the second conductive layer is formed on the second conductive material discharging a composition including a first conductive layer within the frame,
The first unexpected Re sexual composition composition comprising said first conductive material to a region to be discharged containing an electrically conductive material, a region where the composition comprising the second conductive material is discharged the method for manufacturing a display device, characterized in that below the unexpected Re sexual composition comprising said second conductive material to.
前記第1の導電層及び前記第2の導電層は、配線層、ゲート電極層、ソース電極層、ドレイン電極層、または画素電極層であることを特徴とする表示装置。The display device, wherein the first conductive layer and the second conductive layer are a wiring layer, a gate electrode layer, a source electrode layer, a drain electrode layer, or a pixel electrode layer.
前記第1の導電層と前記第2の導電層とは接しており、The first conductive layer and the second conductive layer are in contact with each other;
前記第1の導電層及び前記第2の導電層は、配線層、ゲート電極層、ソース電極層、ドレイン電極層、または画素電極層であることを特徴とする表示装置。The display device, wherein the first conductive layer and the second conductive layer are a wiring layer, a gate electrode layer, a source electrode layer, a drain electrode layer, or a pixel electrode layer.
前記第1の導電層は第1の導電性材料を含み、The first conductive layer includes a first conductive material;
前記第2の導電層は第2の導電性材料を含み、The second conductive layer includes a second conductive material;
前記第1の導電層及び前記第2の導電層は、配線層、ゲート電極層、ソース電極層、ドレイン電極層、または画素電極層であることを特徴とする表示装置。The display device, wherein the first conductive layer and the second conductive layer are a wiring layer, a gate electrode layer, a source electrode layer, a drain electrode layer, or a pixel electrode layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007168757A JP2008033284A (en) | 2006-07-04 | 2007-06-27 | Manufacturing method of display device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006184719 | 2006-07-04 | ||
JP2007168757A JP2008033284A (en) | 2006-07-04 | 2007-06-27 | Manufacturing method of display device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008033284A JP2008033284A (en) | 2008-02-14 |
JP2008033284A5 true JP2008033284A5 (en) | 2010-07-29 |
Family
ID=39122708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007168757A Withdrawn JP2008033284A (en) | 2006-07-04 | 2007-06-27 | Manufacturing method of display device |
Country Status (1)
Country | Link |
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JP (1) | JP2008033284A (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011027676A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
JP5676863B2 (en) * | 2009-09-15 | 2015-02-25 | 株式会社Screenホールディングス | Pattern forming method and pattern forming apparatus |
JP5835217B2 (en) * | 2010-07-02 | 2015-12-24 | コニカミノルタ株式会社 | Organic electroluminescence device |
JP5600662B2 (en) * | 2010-12-15 | 2014-10-01 | 日本特殊陶業株式会社 | Method for forming conductor pattern |
KR20140024931A (en) * | 2011-07-15 | 2014-03-03 | 스미도모쥬기가이고교 가부시키가이샤 | Thin film forming method and thin film forming apparatus |
US9363899B2 (en) * | 2012-01-02 | 2016-06-07 | Mutracx International B.V. | Inkjet system for printing a printed circuit board |
JP5726829B2 (en) * | 2012-09-21 | 2015-06-03 | 株式会社東芝 | Film forming method and liquid crystal display device |
JP2014178456A (en) * | 2013-03-14 | 2014-09-25 | Pixtronix Inc | Display device and method of manufacturing the same |
KR102131118B1 (en) * | 2013-07-04 | 2020-07-08 | 삼성디스플레이 주식회사 | Mask for forming semiconductor pattern and apparatus for forming semiconductor pattern having the same and method for manufacturing semiconductor device using the same |
JP6248749B2 (en) * | 2014-03-28 | 2017-12-20 | 富士通株式会社 | Method for forming multilayer wiring structure and wiring board |
TWI554338B (en) * | 2014-06-25 | 2016-10-21 | 柯尼卡美能達股份有限公司 | Pattern forming method, substrate having transparent conductive film, image display device and electronic equipment for image displaying |
CN108141954A (en) * | 2015-12-24 | 2018-06-08 | 株式会社藤仓 | The manufacturing method and wiring substrate of wiring substrate |
KR102601451B1 (en) * | 2016-09-30 | 2023-11-13 | 엘지디스플레이 주식회사 | Electrode, And Organic Light Emitting Diode, Liquid Crystal Display Device, And Organic Light Emitting Display Device Of The Same |
WO2018179264A1 (en) * | 2017-03-30 | 2018-10-04 | シャープ株式会社 | Film forming instrument, film forming method, electronic device, and production instrument for electronic device |
CN113659076A (en) * | 2021-07-27 | 2021-11-16 | 光华临港工程应用技术研发(上海)有限公司 | Method for producing domain wall memory and domain wall memory |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2373095A (en) * | 2001-03-09 | 2002-09-11 | Seiko Epson Corp | Patterning substrates with evaporation residues |
JP4042460B2 (en) * | 2002-04-22 | 2008-02-06 | セイコーエプソン株式会社 | Film forming method, device, electronic apparatus, and device manufacturing method |
JP4245329B2 (en) * | 2002-10-31 | 2009-03-25 | 大日本印刷株式会社 | Method for producing functional element |
JP3687663B2 (en) * | 2003-07-11 | 2005-08-24 | セイコーエプソン株式会社 | Film forming method, device manufacturing method, electro-optical device manufacturing method, and electronic device manufacturing method |
JP4877868B2 (en) * | 2003-12-02 | 2012-02-15 | 株式会社半導体エネルギー研究所 | Method for manufacturing display device |
JP5093985B2 (en) * | 2004-01-16 | 2012-12-12 | 株式会社半導体エネルギー研究所 | Method for forming a film pattern |
JP4879496B2 (en) * | 2004-02-17 | 2012-02-22 | 株式会社半導体エネルギー研究所 | Pattern formation method |
-
2007
- 2007-06-27 JP JP2007168757A patent/JP2008033284A/en not_active Withdrawn
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